JP3472042B2 - Inkjet recording head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head for ejecting ink onto a recording surface of a recording medium to obtain a recorded image.

[0002]

2. Description of the Related Art An ink jet recording apparatus for selectively ejecting ink from a plurality of ink ejection ports to a recording surface of a recording medium based on recording data and attaching the ink to the recording surface to form an image is practical. Has been offered to. In such an ink jet recording apparatus, an ink jet recording head is provided which is selectively opposed to a recording surface of a recording medium and which is selectively mounted on a carriage portion which is scanned in a direction orthogonal to a conveying direction of the recording medium. ing.

An ink jet recording head of a side shooter type is, for example, as shown in FIG. 25, electrically connected to an ink supply section 2B in which an ink tank IT is mounted and a carriage section (not shown). A main body portion 2 including an input terminal portion 2A to which a drive control signal group from the carriage portion is input; a printing element substrate 6 bonded to a surface to be bonded of the ink supply portion 2B of the main body portion 2; And a printed wiring board 4 that is electrically connected to the input terminal 2A and supplies a drive control signal group from the input terminal unit 2A.

As shown in FIG. 26A, the ink supply section 2B of the main body 2 is formed by integrally forming a block piece 8 made of an aluminum alloy with a resin. The ink supply section 2B is provided with an ink supply path 2a for introducing ink from the ink tank IT. One opening end of the ink supply path 2a is open to the surface 2b to be joined including a portion of the block piece 8 exposed to the outside.

As shown in FIGS. 26B and 29, the recording element substrate 6 has an ink supply opening 10c communicating with the opening end of the ink supply passage 2a in the ink supply section 2B. 10, a partition member 12 that forms a plurality of ink branch supply paths 12 a that are respectively provided corresponding to heaters 10 a as an ink heating unit in the substrate 10, and a plurality of ink that is provided to face each heater 10 a in the substrate 10. The arrangement of the discharge ports 14a is 2 in parallel.
And an orifice plate 14 formed in a row.

On the substrate 10 of the recording element substrate 6, a thin film is formed of, for example, a silicon material having a thickness of 0.5 to 1.0 mm. As shown in FIGS. 27A and 26B, the surface of the substrate 10 adhered to the joined surface 2b of the ink supply unit 2B with the adhesive faces the orifice plate 14. An ink supply opening 10c extending in the direction in which the ink ejection ports 14a are arranged is provided.

Further, heaters 10a are arranged on both sides of the substrate 10 across the ink supply opening 10c with a predetermined mutual interval. Partition member 12
The one end of the ink branch supply path 12a communicates with the ink supply opening 10c, and each ink branch supply path 12a guides the ink supplied through the ink supply opening 10c to the corresponding heater 10a. It is said.

[0008] As shown in FIG. 29, a printed wiring board 4 is electrically connected to each electrode 10b of the substrate 10 in the recording element substrate 6. Printed wiring board 4
Is a recording element substrate housing 4 in which the recording element substrate 6 is disposed.
B and a terminal part 4A arranged on the input terminal part 2A of the main body part 2.

With this configuration, the printed wiring board 4
Each heater 1 of the substrate 10 in the printing element substrate 6 through
When the drive control signal is supplied to the heater 10a and the heater 10a generates heat, the ink introduced through the ink branch supply path 12a is heated to generate bubbles due to a film boiling phenomenon, and the ink is discharged from the ink ejection port with the expansion of the bubbles. The ink is ejected from 14a toward the recording surface of the recording medium.

[0010]

As described above, the main body 2
When the recording element substrate 6 in the printed circuit board 4 is fixed to the surface to be joined 2b of the main body 2 with an adhesive as described above, The temperature of the recording element substrate 6 rises, and the temperature of the block pieces 8 on the surface 2b to be joined in the main body 2 rises. As a result, the recording element substrate 6 and the block piece 8 thermally expand, respectively, but the difference between the expansion coefficient of the recording element substrate 6 made of silicon and the expansion coefficient of the block piece made of an aluminum alloy is increased. Therefore, as shown in FIG. 28, the recording element substrate 6 is deformed or broken such that the arrangement of the ink ejection ports near the center is not straight but curved so as to be close to each other. There are cases. In particular, when a thermosetting adhesive is used, it may be deformed or damaged.

In such a case, it is conceivable to increase the thickness or increase the surface area of the recording element substrate 6 in order to increase the rigidity of the recording element substrate 6, but the manufacturing cost of the recording element substrate 6 increases. Not so good.

In consideration of the above problems, the present invention relates to an ink jet recording head for ejecting ink to a recording surface of a recording medium to obtain a recorded image. It is an object of the present invention to provide an ink jet recording head which does not damage the recording element substrate due to a change in the temperature of the recording element substrate, and can avoid increasing the production cost of the recording element substrate.

[0013]

Means for Solving the Problems] To achieve the above object, an ink jet recording head according to the present invention, in
An ink heating unit that heats the ink
Discharges ink heated by the provided ink heating unit
An ink discharge port forming section in which the ink discharge ports are formed.
Electrically connected to the recording element substrate
Printed circuit board and an ink reservoir for holding ink.
Supply ink to the recording element substrate by communicating with the recording element substrate
And the printing element substrate on the joint surface
First support member for supporting the recording element, and a recording element of the first support member.
A second portion joined to the joining surface of the daughter board and having an opening;
And a supporting element, wherein the printing element substrate has a first supporting member.
A wiring board disposed in the opening of the second support member on the member;
Is electrically connected to the recording element substrate while being supported by the second support member.
It is configured to be connected pneumatically .

[0014]

[0015]

[0016]

FIG. 1 schematically shows a main part of a first embodiment of an ink jet recording head according to the present invention.

In FIG. 1, an ink jet recording head 16 of a side shooter type has, for example, an ink supply section 18B to which an ink tank IT is mounted, and a carriage section electrically connected to a carriage section (not shown). Unit 18 comprising an input terminal 18A to which a drive control signal group from the main unit 18 is input, and an ink supply unit 18 of the main unit 18.
B, a support member 20 joined to the joined surface 18b of the recess 18BG, a recording element substrate 24 adhered to the upper surface of the support member 20 as a second joining surface, and electrically connected to the recording element substrate 24. And a printed wiring board 22 for supplying a drive control signal group from the input terminal section 18A.

The main body 18 has an input terminal 18A and an ink supply 18B integrally formed of, for example, resin. The upper surface of the main body portion 18 opposite to the portion where the ink tank IT is mounted in the ink supply portion 18B has a structure shown in FIG.
And a substantially rectangular recess 18BG as shown in FIG.
Is provided. The bottom of the recess 18BG is
0 is the bonded surface 18b to be bonded. Surface 18 to be joined
A part of b is formed by the surface of the block piece 26 made of, for example, an aluminum alloy. Block piece 2
Numeral 6 denotes a member arranged in a mold and surrounded by a resin when the main body 18 is molded. An elongated opening end of an ink supply path 18a for introducing ink from the ink tank IT is opened at a substantially central portion of the joined surface 18b.

Since the recording element substrate 24 has the same structure as the recording element substrate 6 shown in FIG. 26B, a detailed description of its internal structure will be omitted.

On the substrate of the recording element substrate 24, for example, a thin film is formed of a silicon material having a thickness of 0.5 to 1.0 mm. Also, the ink supply unit 18B on the substrate
As shown in FIG. 2A, an ink supply opening 24c that faces the orifice plate and extends in the arrangement direction of the ink discharge ports 24a is provided on the surface of the concave portion 18BG that is bonded to the surface 18b to be bonded by the adhesive. Is provided.
Further, heaters (not shown) are arranged at predetermined mutual intervals on both sides of the substrate with the ink supply opening 24c interposed therebetween. One end of the ink branch supply path in the partition member is the ink supply opening 2.
4c, each ink branch supply path guides ink supplied through the ink supply opening 24c to each heater.

As shown in FIGS. 1 and 2, a printed wiring board 22 is electrically connected to each electrode of the recording element substrate 24. Printed wiring board 2
Reference numeral 2 has a printing element substrate housing portion 24B in which the printing element substrate 24 is arranged, and a terminal portion 24A arranged on the input terminal portion 18A in the main body portion 18. In bonding the printed wiring board 22 and the recording element board 24, they are connected by, for example, a TAB (tape automated bonding) method.

The support member 20 disposed between the recording element substrate 24 and the surface 18b to be joined of the concave portion 18BG of the ink supply section 18B is formed in a rectangular plate shape as shown in FIGS. ing. The support member 20 is made of, for example, the same silicon as the material of the recording element substrate 24.
In addition, the material of the support member 20 is not limited to silicon, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate 24, and is equal to the thermal conductivity of the material of the recording element substrate 24. Alternatively, it may be made of a material having the same or higher thermal conductivity. The material of the support member 20 is, for example, alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon carbide (SiC), trisilicon tetranitride (Si ₃ N ₄ ), molybdenum (Mo), or tungsten (W). Any of them may be used.

As shown in FIG. 2A, the support member 20 is provided with the ink supply opening 2 in the recording element substrate 24.
Bonding surface 20sa adhered to the surface on which 4c is provided
And the joined surface 18 of the concave portion 18BG of the ink supply portion 18B
b and a first bonding surface 20sb bonded to the first bonding surface 20b.
Further, the support member 20 is provided between the ink supply opening 24c of the recording element substrate 24 and the concave portion 18B of the ink supply portion 18B.
A communication passage 20 extending in the longitudinal direction at a position corresponding to the ink supply passage 18a provided on the joined surface 18b of G.
a is provided. Further, the length of the short side and the length of the long side of the support member 20 are the same as the length of the short side and the long side of the recording element substrate 24, respectively. 24 is approximately the same thickness.

In arranging the recording element substrate 24 to which the printed wiring board 22 is connected in the ink supply section 18B, first, the first bonding surface 20sb of the support member 20 is placed in a predetermined position on the surface 18b to be bonded by an adhesive. It is adhered by. Subsequently, as shown in FIG. 2B, the second bonding surface 20sa of the support member 20 is bonded to the surface of the recording element substrate 24 where the ink supply opening 24c is provided by an adhesive. For example, the adhesive desirably has a low viscosity, a thin adhesive layer formed on the contact surface, and a relatively high hardness after curing.

The communication path 20a in the support member 20
Need not be limited to one as in the above example. The communication path may be divided into a plurality of sections, for example, as shown in FIGS. FIGS. 3A and 3B show support members 28 and 30 which are other examples of the support member 20, respectively. The support members 28 and 30
The support member 28 is made of the same material as the support member 20, and has slit-shaped communication passages 28a and 28b extending in the longitudinal direction provided on the same straight line. In the support member 30, slit-shaped communication paths 30a, 30b, and 30c extending in the longitudinal direction are provided on the same straight line, respectively. (C) of FIG.
9 shows a support member 32 which is still another example of the support member 20. The support member 32 is also made of the same material as that of the support member 20 described above. The support member 32 is provided with a circular through hole 32a at a substantially central position. This allows
In the support members 28 and 30, the portion excluding the communication path is connected at one or two locations in the substantially central portion, so that the mechanical strength or rigidity is the mechanical strength of the support member 20, or It will be improved compared to the rigidity. Further, in the support member 32, the mechanical strength is further improved as compared with the support members 20, 28 and 30.

Under such a configuration, the printed wiring board 2
When a drive control signal is supplied to each heater of the substrate in the printing element substrate 24 through 2 and each heater generates heat, ink is introduced through the ink supply path 18a through the ink branch supply path of the isolation member. The ink is heated by the respective heaters to generate bubbles due to the film boiling phenomenon, and the ink is discharged from the ink discharge ports 24a toward the recording surface of the recording medium as the bubbles expand. At this time, even if the recording element substrate 24 expands due to the heat generated by the heater, the support member 20 expands integrally with the recording element substrate 24, so that the substantial cross-sectional area of the recording element substrate 24 increases. Thus, damage due to temperature change is avoided.

FIG. 4 schematically shows a main part of a second embodiment of the ink jet recording head according to the present invention.

In FIG. 4, in the example shown in FIG.
The length of the short side and the length of the long side of the support member 20 are the same as the length of the short side and the length of the long side of the recording element substrate 24, respectively. The thickness is substantially the same, but instead the support members 34
Is shorter than the length of the shorter side of the recording element substrate 24, and the surface 1 to be joined of the concave portion 18BG of the ink supply portion 18B is
The length is set to be substantially the same as the width dimension of 8b.

In FIG. 4, the same components as those in the example shown in FIG. 1 are denoted by the same reference numerals, and the description thereof will not be repeated.

The support member 34 is formed in a rectangular plate shape. The support member 34 is made of, for example, the same silicon as the material of the recording element substrate 24. In addition, the material of the support member 20 is not limited to silicon, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate 24, and is equal to the thermal conductivity of the material of the recording element substrate 24. Alternatively, it may be made of a material having the same or higher thermal conductivity. The material of the support member 20 is, for example, alumina (Al
₂ O ₃ ), aluminum nitride (AlN), silicon carbide (Si
C) trisilicon tetranitride (Si ₃ N ₄ ), molybdenum (M
o) or tungsten (W).

As shown in FIGS. 5A and 5B, the support member 34 is bonded to the second surface of the recording element substrate 24 where the ink supply opening 24c is provided.
Of the ink supply unit 18B and the joint surface 34sa of the ink supply unit 18B
The first bonding surface 34sb bonded to the surface 18b to be bonded of G
And The support member 34 is provided between the ink supply opening 24 c of the recording element substrate 24 and the ink supply section 1.
At a position corresponding to the ink supply path 18a provided on the joined surface 18b of the concave portion 18BG of the 8B, a communication path 34a that is elongated in the longitudinal direction is provided. The communication passage 3
4a may have a shape divided into a plurality of parts as shown in FIG.

Under such a configuration, the printed wiring board 2
When a drive control signal is supplied to each heater of the substrate in the printing element substrate 24 through 2 and each heater generates heat, ink is introduced through the ink supply path 18a through the ink branch supply path of the isolation member. The ink is heated by the respective heaters to generate bubbles due to the film boiling phenomenon, and the ink is discharged from the ink discharge ports 24a toward the recording surface of the recording medium as the bubbles expand.

At this time, even when the recording element substrate 24 expands due to the heat generated by the heater, the support member 34 expands integrally with the recording element substrate 24 in the same manner as in the above-described example. Is increased, and damage due to temperature changes is avoided. Moreover, the short side of the support member 34 is
Since the length is longer than the short side of the support member 20 in the example shown in FIG. 1, the mechanical strength and the rigidity are further improved.

FIGS. 6A and 6B schematically show the main parts of a third embodiment of the ink jet recording head according to the present invention.

In FIGS. 6A and 6B, in the example shown in FIG. 1, the length of the short side and the length of the long side of the support member 20 are respectively equal to the short side of the recording element substrate 24, And, it is the same as the length of the long side, and the thickness of the support member 20 is
The thickness of the recording element substrate 24 is substantially the same as that of the recording element substrate 24. Instead, the length of the short side of the support member 36 is set longer than the length of the short side of the recording element substrate 24, and 36
Is thicker than the thickness of the recording element substrate 24. In FIGS. 6A and 6B, the same components as those in the example shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

The support member 36 is formed in a rectangular plate shape. The support member 36 is made of, for example, the same silicon as the material of the recording element substrate 24. In addition, the material of the support member 36 is not limited to silicon, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate 24, and is equal to the thermal conductivity of the material of the recording element substrate 24. Alternatively, it may be made of a material having the same or higher thermal conductivity. The material of the support member 36 is, for example, alumina (Al
₂ O ₃ ), aluminum nitride (AlN), silicon carbide (Si
C) trisilicon tetranitride (Si ₃ N ₄ ), molybdenum (M
o) or tungsten (W).

As shown in FIGS. 6A and 6B, the support member 36 is adhered to the surface of the recording element substrate 24 where the ink supply opening 24c is provided.
36sa and the concave portion 18B of the ink supply portion 18B.
G first bonding surface 36sb bonded to the bonded surface 18b of G
And The support member 36 is provided between the ink supply opening 24 c of the recording element substrate 24 and the ink supply section 1.
At a position corresponding to the ink supply path 18a provided on the joined surface 18b of the concave portion 18BG of the 8B, a communication path 36a that is elongated in the longitudinal direction is provided. The communication passage 3
As shown in FIG. 3, 6a may have a shape divided into a plurality.

Under such a configuration, the printed wiring board 2
When a drive control signal is supplied to each heater of the substrate in the printing element substrate 24 through 2 and the heater generates heat, ink is introduced through the ink supply path 18a through the ink branch supply path of the isolation member. The ink is heated by the respective heaters to generate bubbles due to the film boiling phenomenon, and the ink is discharged from the ink discharge ports 24a toward the recording surface of the recording medium as the bubbles expand. At this time, even when the printing element substrate 24 expands due to the heat generated by the heater, the support member 36 is connected to the printing element substrate 2 similarly to the above-described example.
Since the recording element substrate 24 expands integrally, the substantial cross-sectional area of the recording element substrate 24 increases, and damage due to a temperature change is avoided. Moreover, the short side and the thickness of the support member 36 are longer and thicker than the short side of the support member 20 in the example shown in FIG. 1, respectively, so that the mechanical strength and the rigidity are further improved.

FIG. 7 schematically shows a main part of a fourth embodiment of the ink jet recording head according to the present invention.

In FIG. 7, in the example shown in FIG.
The length of the short side of the support member 34 to which the recording element substrate 24 is adhered is longer than the length of the short side of the recording element substrate 24, and the width dimension of the joining surface 18b of the concave portion 18BG of the ink supply unit 18B The printed wiring board 22 which is set to have substantially the same length and is connected to the recording element board 24 is adhered to the peripheral portion of the concave portion 18BG of the ink supply section 18B. The printed wiring board 22 connected to the recording element substrate 24 is disposed on the periphery of the concave portion 18BG of the ink supply section 18B via the frame member 38 with the frame member 38 provided.

In FIG. 7, components that are the same as the components in the example shown in FIG. 4 are denoted by the same reference numerals, and redundant description is omitted.

In the example shown in FIG. 7, the main body section 42 includes an ink supply section 42B in which the ink tank IT is mounted, and a drive control signal group from the carriage section which is electrically connected to a carriage section (not shown). Input terminal 42 to which is input
A.

In the main body 42, an input terminal 42A and an ink supply section 42B are integrally formed of, for example, resin. The upper surface of the ink supply section 42B of the main body section 42 opposite to the portion where the ink tank IT is mounted is provided with FIG.
And as shown in FIG. 8, a substantially rectangular concave portion 42BG
Is provided. The bottom of the concave portion 42BG has a surface 42b to which the support member 40 as the first support member is bonded.
It is said. The flat surface at the peripheral edge of the concave portion 42BG is the joined surface 42c to which the frame member 38 as the second support member is adhered.

An elongated opening end of an ink supply path 42a for introducing ink from the ink tank IT is opened at a substantially central portion of the surface 42b to be joined.

The support member 40 is formed in a rectangular plate shape with a thickness substantially equal to the thickness of the recording element substrate 24. The support member 40 is made of, for example, the same silicon as the material of the recording element substrate 24. In addition, the material of the support member 40 is not limited to silicon, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate 24, and is equal to the thermal conductivity of the material of the recording element substrate 24. Alternatively, it may be made of a material having the same or higher thermal conductivity. Support member 40
Is made of, for example, any of alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon carbide (SiC), trisilicon tetranitride (Si ₃ N ₄ ), molybdenum (Mo), and tungsten (W). It may be.

As shown in FIGS. 8A and 8B, the support member 40 is provided with the concave portion 4 of the ink supply portion 42B.
2BG having a thickness substantially equal to the depth of the recess 42B.
G has substantially the same width and length as the width and length of G. The support member 40 has a surface on which the ink supply opening 24 c of the recording element substrate 24 is provided, and a second bonding surface 40 s bonded to one of the bonding surfaces of the frame member 38.
a and the surface 4 to be joined of the concave portion 42BG of the ink supply portion 42B
2b and a first bonding surface 40sb bonded to the second bonding surface 2s. The support member 40 is provided between the ink supply opening 24c of the recording element substrate 24 and the recess 4 of the ink supply section 42B.
Ink supply path 42 provided on 2BG bonded surface 42b
A communication passage 40a is provided at a position corresponding to a. Note that the communication passage 40a is shown in FIG.
As shown in the above, the shape may be divided into a plurality.

The frame member 38 is made of, for example, an aluminum alloy in a plate shape with a predetermined thickness. The material of the frame member 38 is not limited to an aluminum alloy, and a material having a relatively large thermal conductivity may be appropriately selected. The frame member 38 has a thickness substantially the same as the thickness of the recording element substrate 24, and is formed with a width and a length substantially the same as the width and the length of the joined surface 42c of the ink supply section 42B.
An opening 38 a surrounding the bonded recording element substrate 24 is provided in the center of the frame member 38.

In arranging the recording element substrate 24 to which the printed wiring board 22 is connected in the ink supply section 18B, first, as shown in FIG.
After the first first bonding surface 20sb is disposed to face the surface 18b to be bonded, the first bonding surface 20sb is bonded to a predetermined position of the surface 42b to be bonded with an adhesive. It is desirable that the adhesive has, for example, a high viscosity and a relatively low hardness after being cured and has elasticity.

Subsequently, as shown in FIG. 8B,
The frame member 38 is connected to the surface 42c to be bonded in the ink supply section 42B and the second bonding surface 40s of the support member 40.
a is positioned at a predetermined position by an adhesive, and is adhered and adhered without any gap. The adhesive preferably has a relatively high thermal conductivity after curing, for example.

Then, as shown in FIG. 8B,
The second bonding surface 40sa of the support member 40 is
4 is bonded by an adhesive to the surface on which the ink supply opening 24c is provided. The adhesive has, for example, a low viscosity, a thin adhesive layer formed on the contact surface, and after curing,
Those having relatively high hardness are desirable. At this time, it is desirable that the gap between the printed wiring board 22 and the connected recording element substrate 24 be sealed with an elastic adhesive after curing.

Thus, the recording element substrate 24 to which the printed wiring board 22 is connected is arranged in the ink supply section 18B.

Under such a configuration, the printed wiring board 2
When a drive control signal is supplied to each heater of the substrate in the printing element substrate 24 through 2 and each heater generates heat, ink is introduced through the ink supply path 18a through the ink branch supply path of the isolation member. The ink is heated by the respective heaters to generate bubbles due to the film boiling phenomenon, and the ink is discharged from the ink discharge ports 24a toward the recording surface of the recording medium as the bubbles expand. At this time, even when the printing element substrate 24 expands due to the heat generated by the heater, the support member 40 expands integrally with the printing element substrate 24, and the substantial cross-sectional area of the printing element substrate 24 increases. Thus, damage due to temperature change is avoided.

The second joint surface 40s of the support member 40
a is an ink supply opening 24c in the printing element substrate 24;
After being hardened on the surface on which the recording element substrate is provided, the recording element substrate 24 is further bonded with an adhesive having relatively high hardness to further increase the mechanical strength and rigidity of the recording element substrate 24. Support member 4
After the first bonding surface 20sb is hardened at a predetermined position on the surface 42b to be bonded, the linear expansion coefficient of the support member 40 and the ink supply portion 42B are bonded by bonding with a relatively low-hardness and elastic adhesive. The deformation of the recording element substrate 24 based on the thermal stress caused by the difference from the linear expansion coefficient is avoided. Further, heat from the recording element substrate 24 is radiated by the frame member 38 via the support member 40.

FIGS. 9A and 9B show another example of the frame member 38 in the example shown in FIG. Note that components that are the same as the components in the example shown in FIG. 7 are denoted by the same reference numerals, and redundant description thereof will be omitted.

In FIGS. 9A and 9B, the frame member 44 is, for example, similar to the example shown in FIG.
It is made of an aluminum alloy by pressing into a plate with a predetermined thickness. The frame member 44 is connected to the recording element substrate 2.
4 has a uniform thickness substantially equal to the thickness of the ink supply unit 4.
The width and the length are substantially the same as the width and the length of the bonded surface 42c of 2B. Also, the frame member 44 is
Each end has a bent portion 44a. Further, the frame member 44 has an opening 44b surrounding the recording element substrate 24 adhered at the center thereof.

On the other hand, the ink supply section 42B is provided with an elongated groove 46 with which the bent section 44a of the frame member 44 is engaged, along the longitudinal direction of the concave section 42BG.

In arranging the recording element substrate 24 to which the printed wiring board 22 is connected by using such a frame member 44 in the ink supply section 18B, first, as shown in FIG. After the first joint surface 20sb of the support member 40 is disposed to face the joint surface 18b, the first joint surface 20sb is bonded to a predetermined position of the joint surface 42b with an adhesive. This adhesive has, for example, a high viscosity and after curing,
Those having relatively low hardness and elasticity are desirable.

Subsequently, as shown in FIG. 9B,
Each of the bent portions 44a of the frame member 44 is engaged with the groove 46 with a predetermined gap.
Is positioned at a predetermined position by an adhesive on the surface 42c to be bonded in the ink supply unit 42B and the second bonding surface 40sa of the support member 40, and is adhered without any gap. The adhesive preferably has a relatively high thermal conductivity after curing, for example.

Then, as shown in FIG. 9B,
The recording element substrate 2 is provided on the second joint surface 40sa of the support member 40.
The surface provided with the ink supply opening 24c in No. 4 is bonded with an adhesive. The adhesive has, for example, a low viscosity, a thin adhesive layer formed on the contact surface, and after curing,
Those having relatively high hardness are desirable. Therefore, the heat dissipation area of the frame member 44 is larger than the heat dissipation area of the frame member 38 described above, and the cooling effect by the heat dissipation of the frame member 44 is improved.

Further, FIGS. 10A and 10B show
9 shows still another example of the frame member 38. The above-mentioned frame member 44 is formed of a plate having a uniform thickness, but the frame member 48 shown in FIG. 10A has bent portions 48a at both ends. Also,
At the center of the frame member 48, an opening 48b in which the bonded recording element substrate 24 is disposed is provided. The bent portion 48a is formed by being folded back by a hemming bending process or the like, and thus has a greater thickness than other portions. As a result, the heat radiation area of the frame member 48 is increased as compared with the frame member 44.

The frame member 5 shown in FIG.
0 is formed by extrusion molding. The frame member 50 has bent portions 50a at both ends. Further, an opening 50b in which the bonded recording element substrate 24 is disposed is provided at the center of the frame member 50. The bent portion 50a is formed thicker than other portions. Thus, the heat radiation area of the frame member 50 is increased as compared with the frame member 44 as in the above-described example.

FIG. 11 schematically shows a main part of a fifth embodiment of the ink jet recording head according to the present invention.

In FIG. 11, in the example shown in FIG. 7, the printed wiring board 22 connected to the recording element substrate 24 is connected to the frame member 38 under the provision of the frame member 38 as the second support member. And a groove 54 for holding the applied adhesive is provided at the bottom of the concave portion 52BG of the ink supply portion 52B through the peripheral portion of the concave portion 18BG of the ink supply portion 18B. It is.

In FIG. 11, the same components as those in the example shown in FIG. 7 are denoted by the same reference numerals, and redundant description will be omitted.

In the example shown in FIG. 11, the main body 52 has an ink supply section 52B in which the ink tank IT is mounted, and a drive control signal group from the carriage electrically connected to a carriage (not shown). Input terminal section 5 to which is input
2A. In the main body section 52, the input terminal section 52A and the ink supply section 52B are integrally formed of, for example, resin. Ink supply section 52B of main body section 52
As shown in FIGS. 11 and 12, a substantially rectangular concave portion 52BG is provided on the upper surface facing the portion where the ink tank IT is mounted. The bottom of the concave portion 52BG is a joined surface 52b to which the support member 40 as the first support member is adhered. The flat surface at the peripheral edge of the concave portion 52BG is the joined surface 52c to which the frame member 38 as the second support member is adhered.

An elongated opening end of an ink supply path 52a for introducing ink from the ink tank IT is opened at a substantially central portion of the surface 52b to be joined. Also, the surface to be joined 52b
In the periphery of the elongated opening end of the ink supply path 52a, a groove 54 having a V-shaped cross section is provided so as to surround the periphery of the opening end. The cross-sectional shape of the groove 54 is not limited to the V-shape, but may be a U-shape or a U-shape.

In arranging the recording element substrate 24 to which the printed wiring board 22 is connected by using the frame member 38 in the ink supply section 52B, first, as shown in FIG. First joint surface 40
After the sb is disposed to face the surface 52b to be joined, the sb is adhered by an adhesive applied to a predetermined position on the surface 52b to be joined. This adhesive has, for example, a high viscosity and after curing,
Those having relatively low hardness and elasticity are desirable. At this time, the applied adhesive Pa is held in the groove 54 as shown in FIG. As a result, an adhesive layer having a predetermined thickness corresponding to the depth of the groove 54 is obtained. As a result, undesired leakage of the ink is avoided, and the flatness of the support member 40 with respect to the surface 52b to be joined is precisely adjusted. It will be well secured.

Subsequently, as shown in FIG. 12B, the frame member 38 is connected to the surface 52c to be bonded in the ink supply section 52B and the second bonding surface 4 of the support member 40.
At 0sa, the adhesive is positioned at a predetermined position by an adhesive and closely adhered without any gap. The adhesive preferably has a relatively high thermal conductivity after curing, for example.

Then, as shown in FIG. 12B, the second bonding surface 40sa of the support member 40 is bonded to the surface of the recording element substrate 24 where the ink supply opening 24c is provided by an adhesive. For example, the adhesive desirably has a low viscosity, a thin adhesive layer formed on the contact surface, and a relatively high hardness after curing. that time,
After the curing, the gap between the printed wiring board 22 and the connected recording element board 24 is desirably sealed with an elastic adhesive.

Thus, the recording element substrate 24 to which the printed wiring board 22 is connected is arranged in the ink supply section 18B.

FIGS. 13 and 14 schematically show the essential parts of a sixth embodiment of the ink jet recording head according to the present invention.

In FIGS. 13 and 14, the ink jet recording head 60 of the side shooter type has, for example, ink tanks INT1, INT2, and IN.
A main unit 72 including an ink supply unit 72B to which T3 is mounted, an input terminal unit 72A electrically connected to a carriage unit (not shown), and receiving a drive control signal group from the carriage unit; Ink supply unit 7 at 72
An ink ejection section 74 is provided at a portion facing 2B and has an ink ejection port for selectively ejecting ink from the ink supply section 72B.

The ink supply section 72B has an ink tank I
The ink tank storage units 78A, 78B, and 78C to which the NT1, INT2, and INT3 are mounted are arranged in the scanning direction of the inkjet recording head 60 along the coordinate axis X shown in FIG. . At the ends of the outer shells forming the ink tank accommodating sections 78A, 78B, and 78C in the direction of the coordinate axis Y shown in FIG. 14, the positioning of the carriage section 80 on which the inkjet recording head 60 is mounted with respect to the mounting section 80a. Are provided. The contact portions 76ay and 76by are opposed to each other in parallel to each other, and position the mounting portion 80a of the carriage portion 80 of the ink jet recording head 60 in the direction of the coordinate axis Y shown in FIG. 14 as shown in FIG. .

A contact portion 76az is provided between the contact portion 76ay and the contact portion 76by. Contact part 76az
As shown in FIG. 16, FIG. 1 shows the mounting portion 80a of the carriage portion 80 of the ink jet recording head 60.
Positioning in the direction of the coordinate axis Z shown in FIG.

The ink tank housings 78A and 78A
B and the coordinate axis X in the shell forming 78C
As shown in FIG. 13 and FIG. 14, the contact portions 76bz and 7
6cz are provided respectively. As shown in FIG. 15, the abutting portions 76bz and 76cz are attached to the mounting portion 8
Positioning is performed in the direction of the coordinate axis Z shown in FIG.

Further, a contact portion 76ax is provided below the contact portion 76bz on the side wall portion where the contact portion 76bz is provided. As shown in FIG. 16, the contact portion 76ax positions the mounting portion 80a of the carriage portion 80 of the inkjet recording head 60 in the direction of the coordinate axis X shown in FIG.

In the mounting section 80a of the carriage section 80, the positioning of the ink jet recording head 60 in the direction of the coordinate axis X shown in FIG.
It is performed in one direction, acting along the direction indicated by x. Further, the positioning of the ink jet recording head 60 in the direction of the coordinate axis Y shown in FIG. 14 is performed by applying a pressing force by, for example, a contact pad (rubber pad) to the contact portions 76ay and 76by in the direction indicated by the arrow Py.
Done in places. Further, the ink jet recording head 6
0 in the direction of the coordinate axis Z shown in FIG.
For example, the contact portions 76az, 76bz, and 76cz are applied in three directions along the direction indicated by the arrow Pz by the urging force of a coil spring.

Therefore, the proper positioning of the ink jet recording head 60 with respect to the mounting section 80a in the carriage section 80 is achieved by the ink jet recording head 60 being mounted on the mounting section 8a.
The mounting is performed automatically and reliably by being attached to 0a.

As shown in FIG. 13, a surface 72S to be joined is formed on the ink ejection section 74 side of the main body section 72. As shown in FIG. 13 and FIG. 17, the ink tank housing portions 78A, 78B,
And ink supply paths 82A and 82 communicating with 78C.
B, 82C, one open end 82a, 82b, and 8
2c is open. Also, FIG.
As shown in FIG. 3, an ink ejection section 79 is provided.

The ink discharge section 79 includes a support member 70 joined to the surface 72S to be joined, and a plurality of recording element substrates 6 adhered to the upper surface of the support member 70 as a second joint surface.
2, 64, and 66, and recording element substrates 62, 64,
And 66, which are electrically connected to the input terminal 7 respectively.
Printed wiring boards 62P, 64P, and 66P for supplying a drive control signal group from 2A, and a plurality of printing element boards 62, 64, and 6 disposed on the upper surface of the support member 70
6, and printed wiring boards 62P, 64P, and
And a frame member 68 for positioning at 66P.

The supporting member 70 as the first supporting member is
The recording element substrates 62 to 66 are formed in a rectangular plate shape with substantially the same thickness as the thickness. As shown in FIG. 19, the width W of the support member 70 along the direction in which the recording element substrates 62 to 66 are arranged is changed from one end of the recording element substrate 62 to the other end of the recording element substrate 66. The length is set equal to or longer than the length L to the portion. The support member 70 is made of, for example, the same silicon as the material of the recording element substrate 24. The material of the support member 70 is not limited to silicon, but may be any of the recording element substrates 62 to 62.
66 has a linear expansion coefficient equivalent to the linear expansion coefficient of the material No. 66, and
It may be made of a material having a thermal conductivity equal to or higher than the thermal conductivity of the material of the recording element substrate 24. The material of the support member 40 is, for example, alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon carbide (SiC), trisilicon tetranitride (Si ₃ N ₄ ), molybdenum (Mo), tungsten (W). Any of them may be used.

The support member 70 has through holes 70a, 70b, and 70c on the same straight line. Support member 70
Is a first joint surface 70sa facing the frame member 68.
And a second joint surface 70sb facing the joined surface 72S of the main body 72. The second joint surface 70sb of the support member 70 is adhered to the joint surface 72S with an adhesive.

At this time, as shown in FIGS. 13 and 17, the through-hole 70a is formed at the opening end 82 of the ink supply path 82A through the ink flow path 86A provided on the surface 72S to be joined.
a. The through hole 70b is formed through an ink supply path 82C through an ink flow path 86C provided on the surface 72S to be joined.
Communicates with the open end 82c. The through hole 70c is formed at the opening end 8 of the ink supply path 82B through an ink flow path 86B which is provided on the surface to be bonded 72S so as to curve toward the ink flow path 86A.
2b.

Thus, the ink supplied through the ink supply path 82C is supplied to the through hole 70b of the support member 70 via the ink flow path 86C, and is supplied to the recording element substrate 64. The ink supplied through the ink supply path 82B is supplied to the through-hole 70c of the support member 70 via the ink flow path 86B, and is supplied to the recording element substrate 62. Further, the ink supplied through the ink supply path 82A is supplied to the through hole 70a of the support member 70 through the ink flow path 86A, and the recording element substrate 66
Will be supplied.

Therefore, when it is necessary to eject ink of the same color on the recording element substrates 62 and 66 and eject ink of different ink colors on the recording element substrate 64, as shown in FIG. Is stored in an ink tank INT3, and inks of the same color are stored in ink tanks INT1 and INT2, respectively.
When the respective inks are supplied while being stored in the ink tank INT3, the ink stored in the ink tank INT3 is supplied to the recording element substrate 64 through the through hole 70b of the support member 70, and stored in the ink tanks INT1 and INT2. The inks that have been used are respectively the recording element substrate 62, and
66, the ink tanks INT1 and IN1
The arrangement of T2 becomes easy. Also, the ink tank INT1
Even if INT2 and INT2 are the same ink tank, ink can be supplied to the recording element substrates 62 and 66, respectively.

Recording element substrates 62, 64 and 66
Have the same structure, so that the recording element substrate 6
Only 2 will be described.

On the substrate 62k of the recording element substrate 62, for example, a thin film is formed from a silicon material having a thickness of 0.5 to 1.0 mm. It is made of a silicon material into a thin film having a thickness of several μm. Further, as shown in FIG. 19, the surface of the substrate 62k, which is bonded to the first bonding surface 70sa of the support member 70 with an adhesive, has the ink extending in the arrangement direction of the ink discharge ports 62Fa facing the orifice plate 62F. A supply opening 62ka is provided. Further, heaters, not shown, are arranged at predetermined mutual intervals on both sides of the orifice plate 62F across the ink supply opening 62ka. The ink supplied through the ink supply opening 62ka is guided to each heater through a flow path formed in the orifice plate 62F.

As shown in FIGS. 13 and 17, a printed wiring board 62P is electrically connected to each electrode of the printing element board 62. In bonding the printed wiring board 62P and the recording element board 62, they are connected by, for example, a TAB (tape automated bonding) method.

The frame member 68 as the second support member
The openings 68a, 68b, 68c for regulating the positions of the printing element substrates 62, 64, 66
2, 64 and 66 are provided.

The printing element substrate 62 to which the printed wiring board 62P is connected, the printing element substrate 64 to which the printed wiring board 64P is connected, and the printing element substrate 66 to which the printed wiring board 66P is connected are respectively framed by a frame member 68 and a supporting member 70. 19 and 20, the second joint surface 70sb of the support member 70 is first adhered to the joint surface 72S with an adhesive, as shown in FIGS. 19 and 20. Is done. Subsequently, the frame member 68 is bonded to the first joint surface 70sa of the support member 70 corresponding to the through holes 70a, 70b, and 70c. Then, the recording element substrate 62 to which the printed wiring board 62P is connected, the recording element substrate 64 to which the printed wiring board 64P is connected, and the recording element substrate 66 to which the printed wiring board 66P is connected are inserted into the openings 68a to 68c. It is adhered to the first joint surface 70sa of the support member 70 by an adhesive. At that time, each orifice plate 62F-6F
For example, the ink ejection ports of the 6F are positioned so as to face the same direction by using an image recognition technique.

Thus, the plurality of recording element substrates 62, 6
4 and 66 are bonded and assembled to one support member 70, so that the assembling accuracy is improved and, consequently, the recording accuracy is also improved. Further, since the support member 70 is made of the above-described material, the recording element substrate 6
Thermal deformation of the print element substrates 62, 64, and 66 due to thermal expansion of the print elements 2, 64, and 66 is avoided.

FIG. 21 shows a case where the flatness of the first joint surface 70sa 'and the second joint surface 70sb' of the support member 70 'with respect to the joined surface 72S is not good. In such a case, the recording element substrates 62, 6
4 and 66 are bonded to the support member 70 '
The respective inks ejected from the recording element substrates 62, 64, and 66 are ejected in different ejection directions indicated by arrows Ia to Ic in FIG.

Therefore, the flatness of the first joint surface of the support member 70 is maintained with high precision, and the formed adhesive layer is thinned. Alternatively, the situation shown in FIG. 21 can be avoided by using a relatively low-viscosity adhesive and applying a predetermined pressure to the adhesive.

In the example shown in FIG. 22, the width W of the support member 90 along the arrangement direction of the recording element substrates 62 to 66 is slightly larger than the dimension K between the through holes 90a and 90c. This is a large dimension. Note that FIG.
The same components as those in the example shown in FIG. 1 are denoted by the same reference numerals, and the description thereof will not be repeated.

Thus, since the support member 90 is a member whose main purpose is positioning accuracy of the plurality of recording element substrates, at least one end of the support member 90 is connected to the inner periphery of the peripheral wall portion 72G on the surface 72S to be joined. It is only necessary to set the dimensions so as to contact the surface. On the other hand, FIG.
As shown in FIG. 7, when both ends of the support member 90 'do not contact the inner peripheral surface of the peripheral wall portion 72G in the joined surface 72S, the ink supply openings 62k to 66k of the recording element substrates 62 to 66 are closed. It may be deformed by the heat of the heater.

FIG. 24 shows concave portions 92GA and 92GB corresponding to the recording element substrates 62 to 66 in the first bonding surface 92sa of the first bonding surface 92sa and the second bonding surface 92sb of the support member 92. 92GC is provided.

In FIG. 24, components that are the same as the components in the example shown in FIG. 20 are denoted by the same reference numerals, and redundant description is omitted.

Recesses 92GA, 92GB and 92G
C has a predetermined depth and is provided at a predetermined interval. Recesses 92GA, 92GB, and 92GC
Is formed, for example, by processing such as sandblasting or anisotropic etching.

Thus, the outer peripheral portions of the recording element substrates 62 to 66 are respectively provided with concave portions 92GA, 92GB, and
The position is accurately determined by the inner peripheral portion of the 92GC.

[0100]

As is apparent from the above description, according to the ink jet recording head of the present invention, the recording head includes the first supporting member and the second supporting member, and the recording element substrate is provided on the first supporting member. Disposed in the opening of the second support member,
The wiring substrate is electrically connected to the recording element substrate while being supported by the second support member, so that the rigidity of the recording element substrate is increased, and the recording element substrate is not damaged by a temperature change of the recording element substrate. It is possible to avoid increasing the manufacturing cost of the recording element substrate. Also, if the recording element substrate is
Wiring board even if thermally expanded by the heat of the ink heating section
Maintain good electrical connection between the substrate and the printing element substrate
It can be further recording element substrate through a second support member
Can effectively dissipate the heat .

[Brief description of the drawings]

FIG. 1 is a first view of an ink jet recording head according to the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG.

FIGS. 2A and 2B are cross-sectional views of the example shown in FIG.

FIGS. 3A, 3B, and 3C are perspective views showing other examples of the support member used in the example shown in FIG.

FIG. 4 shows a second example of the ink jet recording head according to the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG.

FIGS. 5A and 5B are cross-sectional views of the example shown in FIG.

FIGS. 6A and 6B are cross-sectional views showing a third embodiment of the ink jet recording head according to the present invention.

FIG. 7 shows a fourth example of the ink jet recording head according to the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG.

8A and 8B are cross-sectional views of the example shown in FIG.

FIGS. 9A and 9B are cross-sectional views showing another example of the frame member used in the example shown in FIG.

FIGS. 10A and 10B are cross-sectional views showing another example of the frame member used in the example shown in FIG. 7;

FIG. 11 is an exploded perspective view showing a fifth embodiment of the ink jet recording head according to the present invention.

12A and 12B are cross-sectional views of the example shown in FIG.

FIG. 13 is an exploded perspective view showing a sixth embodiment of the ink jet recording head according to the present invention.

FIG. 14 is a perspective view showing a sixth embodiment of the ink jet recording head according to the present invention.

FIG. 15 is a diagram which is used for describing the operation in the example shown in FIG.

FIG. 16 is a diagram provided for an explanation of the operation in the example shown in FIG. 13;

FIG. 17 is a plan view of the ink jet recording head in the example shown in FIG.

FIG. 18 is a diagram which is used for describing the operation in the example shown in FIG.

FIG. 19 is a sectional view showing a main part in the example shown in FIG. 13;

20 is a cross-sectional view showing a main part in the example shown in FIG.

FIG. 21 is a partial cross-sectional view used for describing the operation in the example shown in FIG. 13;

FIG. 22 is a partial cross-sectional view showing another example of the support member used in the example shown in FIG.

FIG. 23 is a partial cross-sectional view used for explaining the operation in the example shown in FIG. 13;

24 is a partial cross-sectional view showing still another example of the support member used in the example shown in FIG.

FIG. 25 is a perspective view showing a conventional device.

26A and 26B are partial cross-sectional views of the example shown in FIG.

FIGS. 27A and 27B are plan views showing recording element substrates in a conventional apparatus.

FIG. 28 is a plan view for explaining the operation of a printing element substrate in a conventional apparatus.

FIG. 29 is a perspective view showing a printed wiring board used in the device shown in FIG. 25;

[Explanation of symbols]

16 Inkjet recording heads 18, 42, 52, 72 Body portions 18b, 42b, 52b, 72S Joined surfaces 20, 28, 30, 32, 34, 36, 40, 70 Support members 20a, 28a, 28b, 30a, 30b, 30c Communication paths 24, 62, 64, 66 Recording element substrates 38, 44, 48, 50, 68 Frame member 54 Groove

Continuation of the front page (72) Inventor: Osamu Morita 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (56) References JP-A-3-182359 (JP, A) JP-A-5-212876 ( JP, A) JP-A-5-147222 (JP, A) JP-A-1-108050 (JP, A) JP-A-60-262649 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , (DB name) B41J 2/05 B41J 2/16

Claims (9)

(57) [Claims] 1. An ink heating section for heating ink, and an ink ejection port forming section provided opposite to the ink heating section and formed with an ink ejection port for ejecting ink heated by the ink heating section. A recording element substrate comprising: a wiring substrate electrically connected to the recording element substrate; an ink reservoir for holding the ink and the recording element substrate communicating with each other to supply ink to the recording element substrate. A first support member having a communication path and supporting the printing element substrate at a bonding surface; and a second supporting member bonded to the bonding surface of the printing element substrate of the first support member and having an opening. A support member, wherein the recording element substrate is disposed in an opening of the second support member on the first support member, and the wiring substrate is the second support member.
An ink jet recording head configured to be electrically connected to the recording element substrate while being supported by the supporting member. 2. A second bonding surface of the first support member is bonded to the second support member with a first adhesive, and the printing element substrate is bonded to the second support member by a second bonding. 2. The ink jet recording head according to claim 1, wherein the surface is adhered with a second adhesive. 3. The ink jet recording head according to claim 1, wherein a gap between the wiring substrate and the recording element substrate is sealed with an adhesive having elasticity. 4. The printing apparatus according to claim 1, wherein the thickness of the second support member is substantially the same as the thickness of the printing element substrate.
The inkjet recording head according to the above. 5. The material of the first support member is silicon,
2. The ink jet recording head according to claim 1, wherein the ink jet recording head is any one of alumina, aluminum nitride, silicon carbide, silicon nitride, molybdenum, and tungsten. 6. The ink jet recording head according to claim 5, wherein the material of the first support member and the material of the recording element substrate have the same thermal properties. 7. The ink jet recording head according to claim 6, wherein heat from said recording element substrate is radiated from said second support member via said first support member. 8. The ink jet recording head according to claim 1, wherein the second support member has a position regulating portion for regulating a position of the recording element substrate. 9. The ink jet recording apparatus according to claim 1, wherein a plurality of communication paths in the first support member are provided, and inks of different ink colors are supplied to the recording element substrate through the respective communication paths. head.