JP3468669B2 - Imaging device - Google Patents

Imaging device

Info

Publication number
JP3468669B2
JP3468669B2 JP24105597A JP24105597A JP3468669B2 JP 3468669 B2 JP3468669 B2 JP 3468669B2 JP 24105597 A JP24105597 A JP 24105597A JP 24105597 A JP24105597 A JP 24105597A JP 3468669 B2 JP3468669 B2 JP 3468669B2
Authority
JP
Japan
Prior art keywords
illumination
light
read
small
reflection mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24105597A
Other languages
Japanese (ja)
Other versions
JPH1183436A (en
Inventor
晴樹 大江
秀邦 新山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Copal Corp
Original Assignee
Nidec Copal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Copal Corp filed Critical Nidec Copal Corp
Priority to JP24105597A priority Critical patent/JP3468669B2/en
Publication of JPH1183436A publication Critical patent/JPH1183436A/en
Application granted granted Critical
Publication of JP3468669B2 publication Critical patent/JP3468669B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、撮像装置に係り、
特に、電子部品実装装置において電子部品の位置や欠損
等を確認するために利用される撮像装置に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device,
In particular, the present invention relates to an image pickup device used for confirming the position, loss, etc. of an electronic component in an electronic component mounting device.

【0002】[0002]

【従来の技術】従来、このような分野の技術として、特
開平8−205004号公報がある。この公報に記載さ
れた撮像装置は、吸着ノズルで吸着した電子部品を、プ
リント基板上に搬送する途中に設置されるものであり、
電子部品が吸着ノズルに吸着された際に起こる位置ずれ
を画像処理により検査している。具体的には、電子部品
の底面やリードをLEDで照らし、反射した光をCCD
に入射させ、CCDから出力する信号に基づいて画像処
理を行うことで、電子部品の底面やリードの状態を検査
している。
2. Description of the Related Art Conventionally, as a technique in such a field, there is JP-A-8-205004. The image pickup device described in this publication is installed during the transportation of an electronic component sucked by a suction nozzle onto a printed circuit board.
The positional deviation that occurs when the electronic component is sucked by the suction nozzle is inspected by image processing. Specifically, the bottom surface and leads of electronic components are illuminated by LEDs, and the reflected light is CCD.
The state of the bottom surface of the electronic component and the state of the leads are inspected by performing image processing based on the signal output from the CCD and output from the CCD.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、従来の
撮像装置は、上述したように構成されているため、次の
ような課題が存在していた。近年、電子部品のコストダ
ウンを図るため、電子部品に対して、バリ取りのための
ホーニング処理が行われない場合がある。このような状
態の電子部品は、その表面が鏡面状態に近くなってい
る。そこで、従来の撮像装置でこのような電子部品を撮
像する場合、45度近くの小仰角をもって、斜め下方か
ら電子部品の底面に照明を当てる。その結果、底面やリ
ードで反射した光が、真下に位置する観察窓内に入射し
難く、CCDでの撮像に際して光量不足が生じていた。
特に、小さな電子部品、例えば10mm角以下の大きさ
をもつコンデンサ等では、誤認識が顕著に現れ、場合に
よっては認識不能になることもあった。また、前述した
ような電子部品でも不都合なく撮像するために、電子部
品と照明との距離を長くすることも考えられるが、装置
自体が大型化するといった問題点がある。
However, since the conventional image pickup apparatus is configured as described above, there are the following problems. In recent years, in order to reduce the cost of electronic components, the electronic components may not be subjected to honing processing for deburring. The surface of the electronic component in such a state is close to a mirror surface state. Therefore, when such an electronic component is imaged by the conventional imaging device, the bottom surface of the electronic component is illuminated from diagonally below with a small elevation angle of nearly 45 degrees. As a result, the light reflected by the bottom surface and the leads is difficult to enter into the observation window located right below, and the light amount is insufficient when the image is captured by the CCD.
In particular, small electronic parts, such as capacitors having a size of 10 mm square or less, are prominently erroneously recognized, and sometimes cannot be recognized. Further, it is possible to increase the distance between the electronic component and the illumination in order to image the electronic component as described above without any inconvenience, but there is a problem that the device itself becomes large.

【0004】本発明は、上述の課題を解決するためにな
されたもので、特に、装置自体の小型化を可能にし、読
取り対象物の認識精度を向上させることを目的とする。
The present invention has been made in order to solve the above-mentioned problems, and in particular, an object thereof is to enable downsizing of the apparatus itself and to improve the recognition accuracy of an object to be read.

【0005】[0005]

【課題を解決するための手段】請求項1に係る本発明の
撮像装置は、読取り領域に配置される読取り対象物を照
明光により照らすためのLEDによる光源をもった二つ
照明系と、照明系により照らされた際に生じる読取り
対象物からの反射光を受光して読取り対象物を撮像する
撮像系と、撮像系と照明系との間に配置されて反射光を
撮像系上に結像させるレンズ系とを有する撮像装置にお
いて、読取り対象物とレンズ系との間の光路上には、こ
の光路を略90度曲げる全反射ミラーが配置され、照明
系は、全反射ミラーとレンズ系との間に配置し、全反射
ミラーに向けて光を出射し、全反射ミラーで反射した間
接的な光が読取り対象物の底面に入射する際に、底面に
対して大仰角をなす小視野照明と、読取り対象物と全反
射ミラーとの間に配置し、読取り対象物の底面に向けて
光を出射し、出射された直接的な光が読取り対象物の底
面に入射する際に、底面に対して小仰角をなす大視野照
明とを備えたことを特徴とする。
According to a first aspect of the present invention, there is provided an image pickup device having two LED light sources for illuminating an object to be read arranged in a reading area with illumination light.
An illumination system, an imaging system for imaging the read object by receiving reflected light from reading object occurring when illuminated by the illumination system, an arrangement has been reflected light between the imaging system and the illumination system In an imaging device having a lens system for forming an image on the imaging system, a total reflection mirror that bends the optical path by approximately 90 degrees is arranged on the optical path between the object to be read and the lens system. It is placed between the reflection mirror and the lens system, emits light toward the total reflection mirror, and when the indirect light reflected by the total reflection mirror is incident on the bottom surface of the object to be read, it is larger than the bottom surface. and small field illumination forming the elevation, reading object and Zenhan
Place it between the shooting mirror and the bottom of the object to be read.
Light is emitted, and the emitted direct light is the bottom of the read object.
Large field illumination that makes a small elevation angle to the bottom surface when entering the surface
It is characterized by having a light .

【0006】この撮像装置において、読取り領域に配置
された読取り対象物は、LEDから出射される光により
照らされる。そこで、コンデンサ等の小さな読取り対象
物を撮像する場合、小視野照明により読取り対象物の底
面を照らす。この小視野照明は、全反射ミラーで一旦反
射させる間接的な光であるから、小視野照射と読取り対
象物との間の光路を稼ぐことができ、その結果、読取り
対象物の底面に対する光の仰角(入射角)を大きくする
ことができる。よって、読取り対象物の底面で反射し
て、全反射ミラーに向かう反射光量を十二分に確保する
ことができ、撮像系でクリアーな像を写し出すことがで
きる。そして、この場合、照明系は、読取り対象物と全
反射ミラーとの間に配置し、読取り対象物の底面に向け
て光を出射し、出射された直接的な光が読取り対象物の
底面に入射する際に、底面に対して小仰角をなす大視野
照明を更に備えているので、30mm角のQFP(Quad
Flat Package)等の大型な読取り対象物の撮像を可能
にし、大視野照明と小視野照明との組合わせにより、広
範囲な読取り領域を可能とし、大小様々な読取り対象物
を撮像系で確実に撮像することができる。
In this image pickup device, the reading object arranged in the reading area is illuminated by the light emitted from the LED . Therefore, when imaging a small object to be read such as a condenser, the bottom surface of the object to be read is illuminated by small-field illumination. Since this small-field illumination is indirect light that is once reflected by the total reflection mirror, it is possible to gain an optical path between the small-field irradiation and the object to be read. The elevation angle (incident angle) can be increased. Therefore, the amount of light reflected by the bottom surface of the object to be read and traveling toward the total reflection mirror can be sufficiently secured, and a clear image can be displayed by the image pickup system. And in this case, the illumination system and
Place it between the reflection mirror and face the bottom of the object to be read.
To emit light, and the emitted direct light
Large field of view that makes a small elevation angle to the bottom when entering the bottom
Since it is further equipped with lighting, a 30 mm square QFP (Quad
Capable of imaging large read objects such as Flat Package)
And the combination of large-field illumination and small-field illumination
It enables a wide range of reading areas, and it can read objects of various sizes.
Can be reliably imaged by the imaging system.

【0007】[0007]

【0008】また、読取り対象物の近傍に位置する観察
窓に光透過性の防塵板を設けた場合、読取り対象物の大
視野認識時に、大視野照明を点灯させ、小視野照明を消
灯させると好ましい。従って、読取り対象物の大視野認
識時において、撮像系の視野の中に、防塵板で反射した
小視野照明の輝点が移り込むことがなく、撮像系による
確実な認識を可能にする。
Further, when a light-transmissive dustproof plate is provided in the observation window located near the object to be read, when the large field of view of the object to be read is recognized, the large field illumination is turned on and the small field illumination is turned off. preferable. Therefore, when recognizing the large field of view of the object to be read, the bright spot of the small field illumination reflected by the dustproof plate does not move into the field of view of the image pickup system, and the image recognition system can surely recognize it.

【0009】また、小視野照明を半値角20度以下の照
明光源で構成すると好ましい。このような照明光源を採
用した場合、光源の光量をアップさせることができ、読
取り対象物で反射して全反射ミラーに向かう反射光量の
更なるアップを可能にし、撮像系での認識アップに寄与
する。
Further, it is preferable that the small visual field illumination is constituted by an illumination light source having a half value angle of 20 degrees or less. When such an illumination light source is used, the amount of light from the light source can be increased, and the amount of reflected light that is reflected by the object to be read and directed toward the total reflection mirror can be further increased, contributing to increased recognition in the imaging system. To do.

【0010】また、光源を、赤色LEDの照明で構成す
ると好ましい。このようなLEDを採用した場合、反射
光量が多くなり、撮像系で明るい像を写し出すことがで
きる。また、LEDを採用することにより、点灯/消灯
の繰り返し応答速度を向上させることができ、読取り対
象物の認識速度向上に効果的である。
Further, it is preferable that the light source is constituted by illumination of a red LED. When such an LED is used, the amount of reflected light increases, and a bright image can be displayed by the image pickup system. Further, by adopting the LED, it is possible to improve the response speed of repeated lighting / extinction, which is effective in improving the recognition speed of the read object.

【0011】また、光源を、青色LEDの照明で構成す
ると好ましい。このようなLEDを採用した場合、読取
り対象物の背景にある物体の写り込みを減らすことがで
き、読取り対象物の像の誤認識を防止することができ
る。また、LEDを採用することにより、点灯/消灯の
繰り返し応答速度を向上させることができ、読取り対象
物の認識速度向上に効果的である。
Further, it is preferable that the light source is constituted by illumination of a blue LED. When such an LED is used, it is possible to reduce the reflection of an object in the background of the read object and prevent erroneous recognition of the image of the read object. Further, by adopting the LED, it is possible to improve the response speed of repeated lighting / extinction, which is effective in improving the recognition speed of the read object.

【0012】[0012]

【発明の実施の形態】以下、図面と共に本発明による撮
像装置の好適な実施形態について詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of an image pickup apparatus according to the present invention will be described in detail below with reference to the drawings.

【0013】図1は、本発明に係る撮像装置を示す断面
図である。同図に示す撮像装置1は、小型化、薄型化、
多機能化の要求に基づいて開発されたパッケージをもつ
電子部品(読取り対象物)2の撮像を可能とし、図示し
ない電子部品実装装置の一部として組み込まれて利用さ
れる。パッケージとしては、QFP,SOP,SOJ,
QFJ等があるが、近年、電子部品2のコストダウンの
ため、電子部品2に対して、バリ取りのためのホーニン
グ処理が行われない場合がある。このような状態の電子
部品2は、その表面が鏡面状態に近くなっており、電子
部品2を単に照明しただけでは、撮像時の光量不足を招
来する。そこで、このような電子部品2の撮像をも可能
にした撮像装置1について説明する。
FIG. 1 is a sectional view showing an image pickup apparatus according to the present invention. The imaging device 1 shown in FIG.
The electronic component (reading target) 2 having a package developed based on the demand for multi-functionality can be imaged, and is incorporated and used as a part of an electronic component mounting device (not shown). The packages include QFP, SOP, SOJ,
Although there are QFJs and the like, in recent years, honing processing for deburring may not be performed on the electronic component 2 due to cost reduction of the electronic component 2. The surface of the electronic component 2 in such a state is close to a mirror surface state, and simply illuminating the electronic component 2 causes a shortage of light amount at the time of imaging. Therefore, the image pickup apparatus 1 that enables the image pickup of the electronic component 2 will be described.

【0014】この撮像装置1は、暗箱を構成するケーシ
ング3を有し、このケーシング3内には、吸着ノズル4
によって読取り領域Sまで搬送してきた電子部品2の底
面2aを照らし出すための照明系5が収容されている。
更に、撮像装置1は、電子部品2で反射した光を像情報
として受け入れて、電子部品2の像として映し出すため
の撮像系6と、照明系5と撮像系6との間に配置されて
反射光を撮像系6上に結像させるレンズ系7とを備えて
いる。
The image pickup apparatus 1 has a casing 3 which constitutes a dark box, and the suction nozzle 4 is provided in the casing 3.
An illumination system 5 for illuminating the bottom surface 2a of the electronic component 2 conveyed to the reading area S is accommodated.
Further, the imaging device 1 is arranged between the illumination system 5 and the imaging system 6 for receiving the light reflected by the electronic component 2 as image information and projecting it as an image of the electronic component 2, and reflecting the light. And a lens system 7 for focusing light on the image pickup system 6.

【0015】この撮像装置1は、読取り領域S内で様々
な大きさの電子部品2を撮像させる構成を有している
が、読取り領域S内で、電子部品2の底面2aの位置が
常に一定になるように、吸着ノズル4の移動経路は制御
されている。その結果、電子部品2の底面2aは常に一
定のワークディスタンスWを保つことになる。具体的
に、本実施形態の撮像装置1は、10mm角以下の小さ
な電子部品(例えばコンデンサ)を撮像する小視野態様
と、10mm角〜40mm角程度の大きな電子部品(例
えば30mm角のQFP)を撮像する大視野態様との二
態様に分かれている。すなわち、ケーシング3の横胴3
a内にハーフミラー8を配置し、このハーフミラー8に
よって、電子部品2の底面2a及びリード2bで反射し
た光を2方向に振り分けている。そして、その一方の反
射光は、小視野用の縦胴3bに入射し、他方の反射光
は、光路Lを90度変えるための反射板12を介して大
視野用の縦胴3c内に入射する。
The image pickup device 1 has a structure for picking up images of electronic components 2 of various sizes in the reading area S, but the position of the bottom surface 2a of the electronic component 2 is always constant in the reading area S. The movement path of the suction nozzle 4 is controlled so that As a result, the bottom surface 2a of the electronic component 2 always maintains a constant work distance W. Specifically, the image pickup apparatus 1 according to the present embodiment includes a small visual field mode for imaging a small electronic component (for example, a capacitor) of 10 mm square or less and a large electronic component of about 10 mm square to 40 mm square (for example, a QFP of 30 mm square). It is divided into two modes, a large field of view for imaging. That is, the lateral body 3 of the casing 3
A half mirror 8 is arranged inside a, and the half mirror 8 distributes the light reflected by the bottom surface 2a of the electronic component 2 and the leads 2b in two directions. Then, one of the reflected lights enters the small-view vertical barrel 3b, and the other reflected light enters the large-view vertical barrel 3c via the reflecting plate 12 for changing the optical path L by 90 degrees. To do.

【0016】更に、小視野用の縦胴3b内の反射光は、
レンズ系7の一方を構成する小視野用レンズ部9を通過
した後、撮像系6の一方を構成する小視野用CCD10
で結像する。また、大視野用の縦胴3c内の反射光は、
レンズ系7の他方を構成する大視野用レンズ部11を通
過した後、撮像系6の他方を構成する大視野用CCD1
2で結像する。
Further, the reflected light in the vertical barrel 3b for a small field of view is
After passing through the small-field lens unit 9 that constitutes one of the lens systems 7, the small-field CCD 10 that constitutes one of the imaging systems 6
To form an image. Further, the reflected light in the vertical body 3c for a large field of view is
After passing through the large-field lens unit 11 forming the other side of the lens system 7, the large-field CCD 1 forming the other side of the imaging system 6
Image at 2.

【0017】ここで、照明系5も、前述したCCD1
0,12と同様に大視野態様と小視野態様との二態様に
分かれている。
The illumination system 5 is also the CCD 1 described above.
Like 0 and 12, it is divided into two modes, a large field mode and a small field mode.

【0018】具体的に、電子部品2とレンズ系7との間
(この実施形態では電子部品2とハーフミラー8との
間)の光路L上には、その光路Lを90度曲げるための
全反射ミラー15が、横胴3aの内壁面に固定されてい
る。この場合、全反射ミラー15の反射面15aは、全
反射ミラー15とハーフミラー8との間の光路Lを基準
にすると、略45度の傾き角γ(図2参照)をもって横
胴3a内に配置されている。そして、全反射ミラー15
とレンズ系7との間(この実施形態では全反射ミラー1
5とハーフミラー8との間)には、全反射ミラー15に
向けて光を出射する小視野照明16が設けられている。
この小視野照明16は、10mm角以下の小さな電子部
品(例えばコンデンサ)を照明するための複数のLED
(光源)16aからなり、各LED16aは、光路Lを
取り囲むように配列させた状態で、横胴3aの内壁面に
固定されている。
Specifically, on the optical path L between the electronic component 2 and the lens system 7 (between the electronic component 2 and the half mirror 8 in this embodiment), the entire optical path L for bending the optical path L by 90 degrees. The reflection mirror 15 is fixed to the inner wall surface of the horizontal body 3a. In this case, the reflection surface 15a of the total reflection mirror 15 has a tilt angle γ (see FIG. 2) of about 45 degrees in the horizontal barrel 3a with reference to the optical path L between the total reflection mirror 15 and the half mirror 8. It is arranged. And the total reflection mirror 15
And the lens system 7 (in this embodiment, the total reflection mirror 1
A small-field illumination 16 that emits light toward the total reflection mirror 15 is provided between 5 and the half mirror 8.
This small-field illumination 16 is a plurality of LEDs for illuminating a small electronic component (for example, a capacitor) of 10 mm square or less.
Each LED 16a is fixed to the inner wall surface of the horizontal barrel 3a in a state of being arranged so as to surround the optical path L.

【0019】このような小視野照明16は、小さな視野
をカバーする照明であり、図2に示すように、各LED
16aは、全反射ミラー15に向けて光を出射し、全反
射ミラー15で反射した間接的な光を電子部品2の底面
2aに入射させている。この場合、全反射ミラー15で
反射した光の反射光軸K1が、電子部品2の底面2aに
沿った基準線Aに対して大きな仰角(入射角)αとなる
ように、LED16aの出射光軸Kの向きは調整され
る。なお、LED16aの出射光軸Kが、全反射ミラー
15の反射面15aに入射する角度を適宜に変えること
で、前述した仰角αは当然に変化するが、ここで、底面
2a及びリード2bで反射した光を全反射ミラー15に
確実に戻すために、様々な実験の結果、仰角αは、70
度〜90度が適切であると判断した。
The small visual field illumination 16 as described above is an illumination that covers a small visual field, and as shown in FIG.
16 a emits light toward the total reflection mirror 15, and causes indirect light reflected by the total reflection mirror 15 to enter the bottom surface 2 a of the electronic component 2. In this case, the emission optical axis K1 of the light reflected by the total reflection mirror 15 has a large elevation angle (incident angle) α with respect to the reference line A along the bottom surface 2a of the electronic component 2 so that the emission optical axis K1 is emitted. The direction of K is adjusted. The elevation angle α is naturally changed by appropriately changing the angle at which the output optical axis K of the LED 16a is incident on the reflection surface 15a of the total reflection mirror 15, but here, the elevation angle α is reflected by the bottom surface 2a and the lead 2b. As a result of various experiments, the elevation angle α is 70% in order to surely return the reflected light to the total reflection mirror 15.
It was judged that a degree of 90 degrees is appropriate.

【0020】このように、小視野照明16は、全反射ミ
ラー15で一旦反射させる間接的な光であるから、小視
野照射16と電子部品2との間の光路Lを稼ぐことがで
き、その結果、電子部品2の底面2aに対する光の仰角
(入射角)を大きくすることができる。よって、電子部
品2の底面2aで反射して、全反射ミラー15に向かう
反射光量を十二分に確保することができ、ハーフミラー
8を通過させた光でも、小視野用CCD10でクリアー
な像として結像させることができる。
As described above, the small-field illumination 16 is an indirect light which is once reflected by the total reflection mirror 15, so that the optical path L between the small-field irradiation 16 and the electronic component 2 can be gained. As a result, the elevation angle (incident angle) of light with respect to the bottom surface 2a of the electronic component 2 can be increased. Therefore, the amount of light reflected by the bottom surface 2a of the electronic component 2 and heading for the total reflection mirror 15 can be sufficiently secured, and even the light that has passed through the half mirror 8 is clear in the small-field CCD 10 to provide a clear image. Can be imaged as.

【0021】図1及び図2に示すように、電子部品2と
全反射ミラー15との間には、電子部品2の底面2aに
向けて光を出射する大視野照明17が設けられている。
この大視野照明17は、ケーシング3の横胴3aの一端
に形成して読取り領域Sの真下に位置する観察窓13の
近傍に設けられている。具体的に、大視野照明17は、
10mm角〜40mm角程度の大きな電子部品(例えば
30mm角のQFP)を照明するための複数のLED
(光源)17aからなり、各LED17aは、光路Lを
取り囲むように配列させた状態で、横胴3aの内壁面に
固定されている。
As shown in FIGS. 1 and 2, a large-field illumination 17 is provided between the electronic component 2 and the total reflection mirror 15 to emit light toward the bottom surface 2a of the electronic component 2.
The large-field illumination 17 is formed at one end of the lateral body 3a of the casing 3 and is provided in the vicinity of the observation window 13 located directly below the reading area S. Specifically, the large-field illumination 17
A plurality of LEDs for illuminating large electronic components (for example, 30 mm square QFP) of about 10 mm square to 40 mm square
Each LED 17a is fixed to the inner wall surface of the horizontal barrel 3a in a state of being arranged so as to surround the optical path L.

【0022】このような大視野照明17は、大きな視野
をカバーする照明であり、図2に示すように、各LED
17aは、電子部品2の底面2aに直接的な光りとして
入射させている。この場合、LED17aの出射光軸H
が、電子部品2の底面2aの基準線Aに対して小さな仰
角(入射角)βとなるように、LED17aの向きは調
整される。ここで、底面2a及びリード2bで反射した
光を、全反射ミラー15に確実に戻すために、様々な実
験の結果、仰角βは、40度〜50度が適切であった。
The large-field illumination 17 as described above is an illumination that covers a large field of view, and as shown in FIG.
The light 17a is directly incident on the bottom surface 2a of the electronic component 2 as light. In this case, the emission optical axis H of the LED 17a
However, the direction of the LED 17a is adjusted so that the elevation angle (incident angle) β becomes small with respect to the reference line A of the bottom surface 2a of the electronic component 2. Here, in order to surely return the light reflected by the bottom surface 2a and the leads 2b to the total reflection mirror 15, as a result of various experiments, an elevation angle β of 40 ° to 50 ° was appropriate.

【0023】このような大視野照明17は、電子部品2
に近い位置にあるので、読取り領域Sを広範囲に照らし
ても、電子部品2での反射光量を十分に確保することが
でき、大視野用CCD12でクリアーな像として結像さ
せることができる。
Such a large-field illumination 17 is used in the electronic component 2
Since the read area S is illuminated in a wide range, a sufficient amount of light reflected by the electronic component 2 can be secured, and a clear image can be formed by the large-field CCD 12.

【0024】ここで、図1に示すように、ケーシング3
の横胴3aの一端には観察窓13が形成され、この観察
窓13は、読取り領域Sの真下に位置し、この観察窓1
3には、光透過性のガラス製防塵板14が嵌め込まれて
いる。この場合、小視野照明16を点灯させて、大視野
用CCD12で大視野認識を行うと、その視野の中に防
塵板14で反射した小視野照明16の輝点が写り込み、
認識の妨げとなる。そこで、大視野認識時は、大視野照
明17を点灯させて、小視野照明16を消灯させる。ま
た、小視野用CCD10で小視野認識を行う場合、大視
野照明17と小視野照明16とを同時に点灯させる。な
お、観察窓13が防塵板14をもたない場合、大視野認
識時と小視野認識時との何れの場合でも、大視野照明1
7と小視野照明16との両方を同時に点灯させる。
Here, as shown in FIG. 1, the casing 3
An observation window 13 is formed at one end of the horizontal body 3a of the device, and the observation window 13 is located directly below the reading area S.
A light-transmissive glass dustproof plate 14 is fitted in the plate 3. In this case, by turning the small field illumination 16, a large in-field for CCD12 performed a large field recognition, glare bright spots of the small field illumination 16 which is reflected by dust-proof plate 14 in its field of view,
It interferes with recognition. Therefore, when recognizing the large visual field, the large visual field illumination 17 is turned on and the small visual field illumination 16 is turned off. When the small-field CCD 10 performs small-field recognition, the large-field illumination 17 and the small-field illumination 16 are turned on at the same time. When the observation window 13 does not have the dustproof plate 14, the large-field illumination 1 is used for both large-field recognition and small-field recognition.
Both 7 and the small-field illumination 16 are turned on at the same time.

【0025】前述した大視野照明17及び小視野照明1
6は、ハロゲン光源を利用してもよいが、小視野照明1
6を半値角20度以下のLEDにすることで、光源の光
量アップに寄与し、電子部品2の底面2a及びリード2
bで反射した後に、全反射ミラー15に向かう反射光量
が、更にアップすることになり、結果的に小視野用CC
D10での認識アップに寄与する。
Large-field illumination 17 and small-field illumination 1 described above
6 may use a halogen light source, but small field illumination 1
By making 6 an LED having a half-value angle of 20 degrees or less, it contributes to increasing the light amount of the light source, and the bottom surface 2a of the electronic component 2 and the lead
After being reflected by b, the amount of light reflected toward the total reflection mirror 15 is further increased.
It contributes to the recognition up in D10.

【0026】また、大視野照明17及び小視野照明16
を、赤色LEDで構成した場合、電子部品2の底面2a
及びリード2bでの反射光量が多くなり、撮像系6で明
るい像を写し出すことができる。これに対して、各照明
16,17を、青色LEDで構成した場合、電子部品2
の背景に位置する吸着ノズル4等の写り込みを減らすこ
とができ、電子部品2の像の誤認識を防止することがで
きる。また、LEDを採用する効果として、点灯/消灯
の繰り返し応答速度を向上させることができ、電子部品
2の認識速度を向上させることができる。
The large-field illumination 17 and the small-field illumination 16
Is composed of a red LED, the bottom surface 2a of the electronic component 2
Also, the amount of light reflected by the leads 2b is increased, and a bright image can be displayed by the image pickup system 6. On the other hand, when each of the lights 16 and 17 is formed of a blue LED, the electronic component 2
It is possible to reduce the reflection of the suction nozzle 4 and the like located on the background of the above, and prevent erroneous recognition of the image of the electronic component 2. Further, as an effect of adopting the LED, it is possible to improve the response speed of repeatedly turning on / off the light, and it is possible to improve the recognition speed of the electronic component 2.

【0027】[0027]

【発明の効果】本発明による撮像装置は、以上のように
構成されているため、次のような効果を得る。すなわ
ち、本発明の撮像装置は、読取り領域に配置される読取
り対象物を照明光により照らすためのLEDによる光源
をもった二つの照明系と、照明系により照らされた際に
生じる読取り対象物からの反射光を受光して読取り対象
物を撮像する撮像系と、撮像系と照明系との間に配置さ
れて反射光を撮像系上に結像させるレンズ系とを有する
撮像装置において、読取り対象物とレンズ系との間の光
路上には、この光路を略90度曲げる全反射ミラーが配
置され、照明系は、全反射ミラーとレンズ系との間に配
置し、全反射ミラーに向けて光を出射し、全反射ミラー
で反射した間接的な光が読取り対象物の底面に入射する
際に、底面に対して大仰角をなす小視野照明と、読取り
対象物と全反射ミラーとの間に配置し、読取り対象物の
底面に向けて光を出射し、出射された直接的な光が読取
り対象物の底面に入射する際に、底面に対して小仰角を
なす大視野照明とを備えたことにより、装置自体の小型
化を可能にし、読取り対象物の認識精度を向上させるこ
とができる。
Since the image pickup apparatus according to the present invention is constructed as described above, the following effects can be obtained. That is, the image pickup apparatus of the present invention includes two illumination systems having a light source by an LED for illuminating a reading object arranged in a reading area with illumination light, and a reading object generated when illuminated by the illumination system. In an imaging device having an imaging system that receives reflected light from the imaging device to image the object to be read, and a lens system that is disposed between the imaging system and the illumination system and forms an image of the reflected light on the imaging system. On the optical path between the object and the lens system, a total reflection mirror that bends this optical path by approximately 90 degrees is arranged. The illumination system is arranged between the total reflection mirror and the lens system, and is directed toward the total reflection mirror. When the indirect light that emits light and is reflected by the total reflection mirror is incident on the bottom surface of the object to be read, small field illumination that makes a large elevation angle with the bottom surface and reading
Place it between the object and the total reflection mirror to
Light is emitted toward the bottom and the emitted direct light is read
When incident on the bottom of the
Since the large-field illumination is provided, the apparatus itself can be downsized and the recognition accuracy of the read object can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る撮像装置の一実施形態を示す断面
図である。
FIG. 1 is a sectional view showing an embodiment of an image pickup apparatus according to the present invention.

【図2】図1に示した撮像装置の要部を示す概略図であ
る。
FIG. 2 is a schematic diagram showing a main part of the image pickup apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

S…読取り領域、α,β…仰角、1…撮像装置、2…電
子部品(読取り対象物)、2a…底面、5…照明系、6
…撮像系、7…レンズ系、13…観察窓、14…防塵
板、15…全反射ミラー、16…小視野照明、17…大
視野照明、16a,17a…LED(光源)。
S ... Reading area, α, β ... Elevation angle, 1 ... Imaging device, 2 ... Electronic component (object to be read), 2a ... Bottom surface, 5 ... Illumination system, 6
... Imaging system, 7 ... Lens system, 13 ... Observation window, 14 ... Dustproof plate, 15 ... Total reflection mirror, 16 ... Small field illumination, 17 ... Large field illumination, 16a, 17a ... LED (light source).

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G01B 11/00 - 11/30 G01N 21/84 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) G01B 11/00-11/30 G01N 21/84

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 読取り領域に配置される読取り対象物を
照明光により照らすためのLEDによる光源をもった
つの照明系と、前記照明系により照らされた際に生じる
前記読取り対象物からの反射光を受光して前記読取り対
象物を撮像する撮像系と、前記撮像系と前記照明系との
間に配置されて前記反射光を前記撮像系上に結像させる
レンズ系とを有する撮像装置において、 前記読取り対象物と前記レンズ系との間の光路上には、
この光路を略90度曲げる全反射ミラーが配置され、 前記照明系は、 前記全反射ミラーと前記レンズ系との間に配置し、前記
全反射ミラーに向けて光を出射し、前記全反射ミラーで
反射した間接的な光が前記読取り対象物の前記底面に入
射する際に、前記底面に対して大仰角をなす小視野照明
と、 前記読取り対象物と前記全反射ミラーとの間に配置し、
前記読取り対象物の底面に向けて光を出射し、出射され
た直接的な光が前記読取り対象物の前記底面に入射する
際に、前記底面に対して小仰角をなす大視野照明とを
えたことを特徴とする撮像装置。
1. A two having a light source with a reading object which is placed in the reading area LED for illuminating the illumination light
Disposed between the two illumination systems, an imaging system that receives reflected light from the object to be read that is generated when illuminated by the illumination system and images the object to be read, and the imaging system and the illumination system. In an imaging device having a lens system which is formed into an image of the reflected light on the imaging system, an optical path between the object to be read and the lens system,
A total reflection mirror that bends this optical path by about 90 degrees is arranged, the illumination system is arranged between the total reflection mirror and the lens system, and emits light toward the total reflection mirror, and the total reflection mirror. Small-field illumination that makes a large elevation angle with respect to the bottom surface when indirect light reflected by the light enters the bottom surface of the object to be read.
And arranged between the reading object and the total reflection mirror,
Light is emitted toward the bottom surface of the object to be read and is emitted.
Direct light is incident on the bottom surface of the object to be read.
In this case, the imaging device is provided with a large-field illumination that makes a small elevation angle with respect to the bottom surface .
【請求項2】 前記読取り対象物の近傍に位置する観察
窓に光透過性の防塵板を設けた場合、前記読取り対象物
の大視野認識時に、前記大視野照明を点灯させ、前記小
視野照明を消灯させることを特徴とする請求項記載の
撮像装置。
2. When the observation window located near the object to be read is provided with a light-transmitting dustproof plate, the large field illumination is turned on when the large field of view of the object to be read is recognized, and the small field illumination is provided. imaging device according to claim 1, wherein the turning off the.
【請求項3】 前記小視野照明を半値角20度以下の照
明光源で構成したことを特徴とする請求項1〜のいず
れか一項記載の撮像装置。
Wherein the small field illumination imaging apparatus according to any one of claims 1-2, characterized in that configured in the following illumination light source half angle 20 °.
【請求項4】 前記光源を、赤色LEDの照明で構成し
たことを特徴とする請求項1〜のいずれか一項記載の
撮像装置。
Wherein the light source, the image pickup apparatus of any one of claims 1-3, characterized in that is constituted by illumination of a red LED.
【請求項5】 前記光源を、青色LEDの照明で構成し
たことを特徴とする請求項1〜のいずれか一項記載の
撮像装置。
Wherein the light source, the image pickup apparatus of any one of claims 1-3, characterized in that is constituted by illumination of a blue LED.
JP24105597A 1997-09-05 1997-09-05 Imaging device Expired - Fee Related JP3468669B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24105597A JP3468669B2 (en) 1997-09-05 1997-09-05 Imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24105597A JP3468669B2 (en) 1997-09-05 1997-09-05 Imaging device

Publications (2)

Publication Number Publication Date
JPH1183436A JPH1183436A (en) 1999-03-26
JP3468669B2 true JP3468669B2 (en) 2003-11-17

Family

ID=17068647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24105597A Expired - Fee Related JP3468669B2 (en) 1997-09-05 1997-09-05 Imaging device

Country Status (1)

Country Link
JP (1) JP3468669B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294317A (en) * 2007-05-28 2008-12-04 Nidec Copal Corp Imaging apparatus

Also Published As

Publication number Publication date
JPH1183436A (en) 1999-03-26

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