JP3456636B2 - Shot peening method - Google Patents
Shot peening methodInfo
- Publication number
- JP3456636B2 JP3456636B2 JP13219999A JP13219999A JP3456636B2 JP 3456636 B2 JP3456636 B2 JP 3456636B2 JP 13219999 A JP13219999 A JP 13219999A JP 13219999 A JP13219999 A JP 13219999A JP 3456636 B2 JP3456636 B2 JP 3456636B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- shot
- diameter
- medium
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、歯車等の浸炭製品
を効果的にショットピ−ニング加工処理する方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for effectively subjecting carburized products such as gears to shot pinning.
【０００２】[0002]
【従来の技術】従来、歯車等の浸炭製品に対し応力集中
を受ける部分の表面に粒状投射材を投射して圧縮残留応
力を高めて疲労強度を向上させるショットピ−ニング加
工は、一般に知られているところである。このショット
ピ−ニング加工の効果を高めるために複数回のショット
ピ−ニング加工処理を行うことが特開昭６１−２６５２
７１号公報及び特開昭６０−１５０９６６号公報等によ
り公知になっている。すなわち複数回のショットピ−ニ
ングは、第１段階において大径粒体によるショットピ−
ニング加工により製品に深い（厚い）圧縮残留応力の影
響層を形成させ（図２破線）、第２段階以降においてそ
の投射材よりも小径の粒体によるショットピ−ニング加
工により製品の最表面層に高い圧縮残留応力が得られる
ようにしている（図２太実線および二点鎖線）。このよ
うな複数回のショットピ−ニング加工を施すことにより
図１破線のような圧縮残留応力が得られるというもので
ある。一方、最表面に圧縮残留応力のピ−ク値を生成す
る方法として特開昭６０−９６７１７号公報が公知にな
っている。この方法は、初回のピ−ニング加工後にホ−
ニングまたはブラスト加工により表面層を削り取って表
面粗さを改善して、ばねの疲労強度を向上させるもので
ある。2. Description of the Related Art Conventionally, a shot peening process has been generally known in which a granular projection material is projected on the surface of a carburized product such as a gear to be subjected to stress concentration to increase the compressive residual stress and improve the fatigue strength. I am here. In order to enhance the effect of this shot pinning process, it is possible to perform the shot pinning process a plurality of times.
No. 71 and Japanese Patent Laid-Open No. 60-150966. That is, a plurality of times of shot peening is performed by the shot peening with large-diameter particles in the first stage.
A deep (thick) influential layer of compressive residual stress is formed on the product by the spinning process (broken line in Fig. 2), and after the second stage, it is formed on the outermost surface layer of the product by the shot peening process using the particles with a diameter smaller than the shot material High compressive residual stress is obtained (Fig. 2, thick solid line and two-dot chain line). By performing such shot-peening processing a plurality of times, a compressive residual stress as shown by the broken line in FIG. 1 can be obtained. On the other hand, JP-A-60-96717 is known as a method for generating a peak value of compressive residual stress on the outermost surface. This method is used after the first pinning process.
The surface layer is scraped off by polishing or blasting to improve the surface roughness and improve the fatigue strength of the spring.
【０００３】[0003]
【発明が解決しようとする課題】しかし上記のような複
数回のショットピ−ニング加工は、加工工程が複雑にな
ることから処理時間が掛かり、ピ−ニング加工の処理効
率が悪くなる問題があると共に装置的には大径粒体によ
るピ−ニング設備とそれ以下の粒径の粒体によるピ−ニ
ング設備からなる複数の設備が必要になり設備費が高く
なる問題もあった。本発明は上記の問題に鑑みて成され
たものであって、複数回のショットピ−ニング加工によ
る効果と同様のピ−ニング効果、すなわち最表面から深
く圧縮残留応力の影響層を生成し、かつ最表面に圧縮残
留応力のピ−ク値を生成することを維持させながらピ−
ニング加工の処理効率を高めると共にランニングコスト
及び設備費を低減できるショットピ−ニング加工方法を
提供することを目的とする。However, the above-described shot pinning process of a plurality of times requires a long processing time because the processing process is complicated, and there is a problem that the processing efficiency of the pinning process deteriorates. In terms of equipment, there is a problem that a plurality of equipments including a pinning equipment using large-diameter particles and a pinning equipment using particles having a particle diameter smaller than that are required, resulting in high equipment cost. The present invention has been made in view of the above problems, the same pinning effect as the effect by a plurality of shot pinning processes, that is, to generate an influential layer of deep compressive residual stress from the outermost surface, and The peak value of the compressive residual stress is generated on the outermost surface while maintaining the peak value.
An object of the present invention is to provide a shot-peening processing method capable of improving the processing efficiency of the processing and reducing the running cost and the equipment cost.
【０００４】[0004]
【課題を解決するための手段】上記の目的を達成するた
めに発明者達は、上記の複数回のショットピ−ニング加
工を一工程で行うことを検討する中で大径粒体と中径粒
体と小径粒体とを混合した混合投射材を使用することを
思い立ち種々実験を繰り返す中で本発明を創出した。本
発明におけるショットピ−ニング加工方法は、大径粒体
及び中径粒体の平均粒径比と、中径粒体及び小径粒体の
平均粒径比とをそれぞれ１／２〜１／１５の範囲にした
直径５００〜１０００μｍの大径粒体と、直径１００〜
５００μｍの中径粒体と、直径２０〜１００μｍの小径
粒体とを重量混合比が同一投射時間内でそれぞれカバレ
−ジが１００％以上になるように混合した投射材を被ピ
−ニング製品に対して投射し、該被ピ−ニング製品に圧
縮残留応力の影響層を生成することを特徴とするもので
ある。In order to achieve the above-mentioned object, the inventors of the present invention are considering conducting the above-mentioned multiple shot pinning processes in one step. The present invention has been created by repeating various experiments with the intention of using a mixed shot material in which a body and small-diameter particles are mixed. In the shot-peening processing method of the present invention, the average particle size ratio of the large-diameter particles and the medium-sized particles and the average particle size ratio of the medium-sized particles and the small-sized particles are respectively 1/2 to 1/15. Large diameter particles with a diameter of 500-1000 μm and a diameter of 100-
A shot material prepared by mixing medium-diameter particles of 500 μm and small-diameter particles of 20 to 100 μm in diameter so that the coverage ratio is 100% or more within the same projection time is used as the product to be pinned. Projected against and pressed against the product to be pinned.
It is characterized in that an influence layer of shrinkage residual stress is generated .
【０００５】[0005]
【発明の実施の形態】一般にショットピ−ニング加工強
度を判定する方法としてエリアカバレ−ジ（以下カバレ
−ジという）測定方法が利用されている。このカバレ−
ジ測定とは、加工面積に対する投射材の投射痕面積の総
和の比より求められるもので標準測定法と簡易測定法が
あり、本実験では簡易測定法で判定した。これは標準測
定法により予めカバレ−ジがわかっている標準写真と試
験片の加工後の表面とを対比してカバレ−ジを決めるも
のである。図３にカバレ−ジの測定例が示されており、
図３の実線は大径粒体、破線は小径粒体のカバレ−ジ特
性を示す。なお１回のピ−ニングのカバレ−ジがＣ1で
ある時、Ｃn＝１−（１−Ｃ1）nの式で表され、その算
出値は９８％程度になり、これをフルカバレ−ジとみな
し１００％とする。またカバレ−ジ３００％とはカバレ
−ジが１００％に達する時間を３倍にした状態をいう。DESCRIPTION OF THE PREFERRED EMBODIMENTS Generally, an area coverage (hereinafter referred to as "coverage") measuring method is used as a method for determining the shot-peening working strength. This cover
Ji measurement is obtained from the ratio of the total of the projection area of the shot material to the processing area, and there are standard measurement method and simple measurement method. In this experiment, the simple measurement method was used for the judgment. This is to determine the coverage by comparing a standard photograph whose coverage is known in advance by the standard measurement method with the processed surface of the test piece. Fig. 3 shows an example of coverage measurement.
The solid line in FIG. 3 shows the coverage characteristics of large-diameter particles and the broken line shows the coverage characteristics of small-diameter particles. When the coverage of one pinning is C1, it is expressed by the formula of Cn = 1- (1-C1) n, and the calculated value is about 98%, which is regarded as full coverage. 100% Further, the coverage of 300% means a state in which the time for coverage to reach 100% is tripled.
【０００６】[0006]
【実験例】以下本発明（比較例として３段階のショット
ピ−ニング加工を含む）について表１及び図１により説
明する。本実験は被ピ−ニング製品として機械構造用合
金鋼（ＳＣｒ４２０鋼）の実用歯車で浸炭熱処理をした
もの、この歯車の外形は直径１３０ｍｍ、幅１５ｍｍの
寸法で浸炭後の歯車の硬さがＨＶ７２０〜８５０であ
る。この歯車に対するピ−ニング加工条件が表１に示さ
れていて、投射材としては大径粒体Ａ（直径８００μ
ｍ）と中径粒体Ｂ（直径２５０μｍ）と小径粒体Ｃ（直
径４０μｍ）を使用し、投射速度７０ｍ／ｓｅｃで４０
秒間（ただし３段階のショットピ−ニングの場合はＡを
２０秒、Ｂを１２秒、Ｃを８秒）投射した。EXPERIMENTAL EXAMPLE The present invention (including a three-step shot pinning process as a comparative example) will be described below with reference to Table 1 and FIG. In this experiment, a practical gear of alloy steel for machine structure (SCr420 steel) was carburized and heat-treated as a pinned product. The outer shape of this gear was 130 mm in diameter and 15 mm in width, and the hardness of the carburized gear was HV720. ~ 850. The pinning processing conditions for this gear are shown in Table 1. As the shot material, large-diameter particles A (diameter 800 μm) are used.
m), medium-sized particles B (diameter 250 μm), and small-sized particles C (diameter 40 μm), and a projection speed of 70 m / sec
For a second (however, in the case of three-stage shot pinning, A was 20 seconds, B was 12 seconds, and C was 8 seconds).
【０００７】[0007]
【表１】 [Table 1]
【０００８】なお本実験に使用する大径粒体Ａと中径粒
体Ｂと小径粒体Ｃの混合割合は、３段階のショットピニ
ングの加工時に与えられる投射エネルギ−と同じにする
ため全体を１００とするとＡが５０、Ｂが３０、Ｃが２
０でピ−ニング加工を行った。したがって投射時間合計
を１とすると、それぞれ投射される投射材の混合の割合
がＡが０．５、Ｂが０．３、Ｃが０．２になる。この場
合カバレ−ジを３００％で設定して各条件を比較できる
ようにした。The mixing ratio of the large-diameter particles A, the medium-diameter particles B, and the small-diameter particles C used in this experiment is the same as the projection energy applied during the three-step shot pinning process. When set to 100, A is 50, B is 30, and C is 2.
A pinning process was performed at 0. Therefore, assuming that the total of the projection times is 1, the mixing ratio of the projected materials to be projected is 0.5 for A, 0.3 for B, and 0.2 for C. In this case, the coverage was set at 300% so that each condition could be compared.
【０００９】このようにしてショットピ−ニング加工さ
れたものは、本発明（混合投射材使用）では図１実線で
示すように被ピ−ニング製品のほぼ最表面の位置に圧縮
残留応力値のピ−クが見られる。また表面から２５０〜
３００μｍまで圧縮残留応力が発生していることが確認
でき、３段階のショットピ−ニング加工（図１破線）の
特性とほとんど同じ特性になっていることが確認でき
た。なお種々の実験結果から小径粒体として直径２０μ
ｍ以下の投射材はピ−ニング加工の効果が少なく、大径
粒体として直径１０００μｍ以上のものは被ピ−ニング
製品の表面粗さが大きくなりはじめ疲労強度の低下が顕
著になるため本発明の投射材の適用範囲は、直径２０〜
１０００μｍが好ましい。In the present invention (using a mixed shot material), the shot-peened product thus obtained has a compressive residual stress value at the position of almost the outermost surface of the product to be pinned as shown by the solid line in FIG. -Ku is seen. 250 ~ from the surface
It was confirmed that the compressive residual stress was generated up to 300 μm, and it was confirmed that the characteristics were almost the same as the characteristics of the three-stage shot pinning processing (broken line in FIG. 1). In addition, from various experimental results, the diameter is 20μ
In the present invention, a shot material having a diameter of m or less has little effect of the pinning process, and a large-diameter particle having a diameter of 1000 μm or more causes the surface roughness of the product to be pinned to increase and the fatigue strength to decrease remarkably. The applicable range of the blast material is 20 ~
1000 μm is preferable.
【００１０】つぎに本発明方法を実施するための装置に
ついて、図４に示すショットピ−ニング加工装置の構成
を説明する。天井部に投射機１を取付けたピ−ニング室
２、分級機３、回収箱４Ａ、４Ｂ、４Ｃが構成されてい
て、分級機３では回収した投射材を大径粒体、中径粒
体、小径粒体に分級することに加えて使用によって摩耗
あるいは破損した各々の中間粒体（大粒と中粒との中間
粒体、中粒と小粒との中間粒体及び小粒よりも小さな微
粉体）が分級されて回収箱４Ａ、４Ｂ、４Ｃに回収除去
されるようにされている。また前記分級機３で分級され
た大径粒体は排出口５Ａと、中径粒体は排出口５Ｂと、
小径粒体は排出口５Ｃとにそれぞれスクリュ−コンベヤ
あるいはバケットコンベヤ等で構成される投射材移送手
段６Ａ、６Ｂ、６Ｃに連通され、それぞれの投射材移送
手段６Ａ、６Ｂ、６Ｃの先端は、それぞれ投射材の流量
調整弁７Ａ、７Ｂ、７Ｃおよび投射材供給管８Ａ、８
Ｂ、８Ｃを介して前記投射機１に連通されている。Next, regarding the apparatus for carrying out the method of the present invention, the structure of the shot pinning processing apparatus shown in FIG. 4 will be described. The ceiling part comprises a pinning chamber 2 with a projector 1 attached, a classifier 3, and collection boxes 4A, 4B, and 4C. The classifier 3 collects the projected material into large-diameter particles and medium-diameter particles. , Intermediate particles that are worn or damaged by use in addition to classification into small-diameter particles (intermediate particles between large particles and medium particles, intermediate particles between medium particles and small particles, and fine powder smaller than small particles) Are classified and are collected and removed in the collection boxes 4A, 4B, and 4C. Further, the large-sized particles classified by the classifier 3 have an outlet 5A, and the medium-sized particles have an outlet 5B.
The small-diameter particles are communicated with the discharge port 5C by projectile material transfer means 6A, 6B, 6C, which are each composed of a screw conveyor, a bucket conveyor, etc., and the tip ends of the projectile material transfer means 6A, 6B, 6C are respectively Flow rate adjusting valves 7A, 7B, 7C for shot material and shot material supply pipes 8A, 8
It is communicated with the projector 1 through B and 8C.
【００１１】このように構成されたものは、各流量調整
弁７Ａ、７Ｂ、７Ｃを介して大径粒体と中径粒体と小径
粒体が所定量送り出され、投射材供給管８Ａ、８Ｂ、８
Ｃを介して混合され投射機１に供給され、ピ−ニング室
２内で回転されている被ピ−ニング製品Ｗに向けて投射
材が投射されてピ−ニング加工を施す。この際投射材は
分級機３に導かれて摩耗あるいは破損した各々の中間粒
体（大粒と中粒との中間粒体、中粒と小粒との中間粒体
及び小粒よりも小さな微粉体）を分級して回収箱４Ａ、
４Ｂ、４Ｃに回収除去する一方所定範囲内の大径粒体と
中径粒体及び小径粒体にそれぞれ分離されて、それぞれ
の投射材移送手段６Ａ、６Ｂ、６Ｃに供給され、流量調
整弁７Ａ、７Ｂ、７Ｃにおいて投射機１への混合供給量
を所定量に制御して投射材供給管８Ａ、８Ｂ、８Ｃを介
して供給される。したがって投射機１への投射材の供給
は、大径粒体と中径粒体及び小径粒体の混合割合が常に
設定された状態で供給されることになる。With the above-mentioned structure, the large-diameter particles, the medium-diameter particles, and the small-diameter particles are sent out through the flow rate adjusting valves 7A, 7B, and 7C by a predetermined amount, and the projection material supply pipes 8A and 8B are supplied. , 8
It is mixed through C and supplied to the projector 1, and the projection material is projected toward the product W to be pinned which is rotated in the pinning chamber 2 to perform the pinning process. At this time, the blast material is introduced into the classifier 3 to wear or damage the respective intermediate particles (intermediate particles between large particles and medium particles, intermediate particles between medium particles and small particles, and fine powder smaller than small particles). Classification and collection box 4A,
4B and 4C are separated and separated into large-diameter particles, medium-diameter particles, and small-diameter particles within a predetermined range, which are supplied to the respective projection material transfer means 6A, 6B, 6C, and the flow rate adjusting valve 7A. , 7B, 7C, the mixed supply amount to the projector 1 is controlled to a predetermined amount, and the mixture is supplied through the projection material supply pipes 8A, 8B, 8C. Therefore, the projection material is supplied to the projector 1 in a state where the mixing ratio of the large-diameter particles, the medium-diameter particles, and the small-diameter particles is always set.
【００１２】次に図５に示す別のショットピ−ニング加
工装置の構成を説明する。天井部に投射機１を取り付け
たピ−ニング室２、分級機３、回収箱４Ａ、４Ｂ、４Ｃ
については前記図４のものと同じ構成にされていて、該
分級機３で分級された大径粒体の排出口５Ａと、中径粒
体の排出口５Ｂと、小径粒体の排出口５Ｃとはスクリュ
−コンベヤあるいはバケットコンベヤ等で構成される一
列の投射材移送手段６に連通されている。また投射材移
送手段６の先端は、前記ピ−ニング室２の上方に配置さ
れた投射材タンク９の上部に臨んで設けられ、該投射材
タンク９の内部には投射材を均一に撹拌するための撹拌
混合器１０が設置されていると共に該投射材タンク９の
下端は前記ピ−ニング室２の投射機１に連通されてい
る。Next, the structure of another shot pinning processing apparatus shown in FIG. 5 will be described. A pinning chamber 2 with a projector 1 mounted on the ceiling, a classifier 3, and recovery boxes 4A, 4B, 4C
4 has the same structure as that shown in FIG. 4, and has an outlet 5A for large-diameter particles classified by the classifier 3, an outlet 5B for medium-sized particles, and an outlet 5C for small-diameter particles. And are communicated with a row of projection material transfer means 6 composed of a screw conveyor, a bucket conveyor, or the like. The tip of the blast material transfer means 6 is provided so as to face the upper part of the blast material tank 9 arranged above the pinning chamber 2, and the blast material is uniformly agitated inside the blast material tank 9. And a lower end of the shot material tank 9 communicates with the projector 1 in the pinning chamber 2.
【００１３】このように構成されたものは、撹拌混合器
１０を作動させて投射材タンク９内で比重偏積されてい
る投射材を撹拌混合して均一に混合された状態にして投
射機１に供給し、図４のピ−ニング装置と同様のピ−ニ
ング加工及び投射材の分級がなされ、各々の中間粒体が
回収箱４Ａ、４Ｂ、４Ｃに回収除去される。次に分級さ
れた所定範囲内の大、中、小径粒体は、各排出口５Ａ、
５Ｂ、５Ｃを介して一列の投射材移送手段６に供給混合
されて投射材タンク９に戻される。この際投射材タンク
９内の投射材は比重偏積されるが撹拌混合器１０の作動
により偏積が解消されて均一に混合された状態にされ
る。したがって投射機１への投射材の供給は、大径粒体
と中径粒体及び小径粒体の混合割合が常に設定された状
態で供給されることになる。In the thus constructed apparatus, the agitator / mixer 10 is operated to agitate and mix the projectile material having a specific gravity in the projectile material tank 9 so as to be uniformly mixed. And the same classification as in the pinning device of FIG. 4 and classification of the shot material are carried out, and the respective intermediate particles are recovered and removed in the recovery boxes 4A, 4B, 4C. Next, the classified large, medium, and small-diameter particles within a predetermined range are discharged from each discharge port 5A,
It is supplied to and mixed with one row of the projection material transfer means 6 through 5B and 5C and returned to the projection material tank 9. At this time, the blast material in the blast material tank 9 is unevenly accumulated in specific gravity, but due to the operation of the stirring mixer 10, the unevenness is eliminated and the blast material is uniformly mixed. Therefore, the projection material is supplied to the projector 1 in a state where the mixing ratio of the large-diameter particles, the medium-diameter particles, and the small-diameter particles is always set.
【００１４】[0014]
【発明の効果】本発明は上記の説明から明らかなよう
に、大径粒体及び中径粒体の平均粒径比と、中径粒体及
び小径粒体の平均粒径比とをそれぞれ１／２〜１／１５
の範囲にした直径５００〜１０００μｍの大径粒体と、
直径１００〜５００μｍの中径粒体と、直径２０〜１０
０μｍの小径粒体とを重量混合比が同一投射時間内でそ
れぞれカバレ−ジが１００％以上になるように混合した
投射材を被ピ−ニング製品に対して投射し、該被ピ−ニ
ング製品に圧縮残留応力の影響層を生成するものである
から、複数回のピ−ニング加工による効果と同等のピ−
ニング効果、すなわち最表面から深く圧縮残留応力の影
響層を生成し、かつ最表面に圧縮残留応力のピ−ク値を
生成することを維持させながらピ−ニング工程を一工程
で済ませることができるようになり処理効率を大幅に高
めることができる。またピ−ニング加工処理設備が一工
程ピ−ニングを行う設備でよくなり設備費を大幅に低減
できるようになる。As is apparent from the above description, the present invention sets the average particle size ratio of large-diameter particles and medium-sized particles to the average particle size ratio of medium-sized particles and small-sized particles to 1 respectively. / 2-1 / 15
A large diameter particle having a diameter of 500 to 1000 μm in the range of
Medium-sized particles having a diameter of 100 to 500 μm and a diameter of 20 to 10
Small particles with a diameter of 0 μm were mixed such that the weight mixing ratio was 100% or more within the same projection time, and the projection material was projected onto the product to be pinned .
Since it produces an influential layer of compressive residual stress on the molded product, it is possible to achieve the same effect as the effect of multiple pinning operations.
It is possible to complete the pinning step in one step while maintaining the effect of the pinning effect, that is, forming a deep layer of the compressive residual stress from the outermost surface and generating the peak value of the compressive residual stress on the outermost surface. As a result, the processing efficiency can be significantly improved. Further, the equipment for the pinning processing can be improved to the equipment for performing the one-step pinning, and the equipment cost can be significantly reduced.
【図１】本発明の実施による圧縮残留応力の発生状態と
３段階のピ−ニング加工による圧縮残留応力の発生状態
とを表すグラフである。FIG. 1 is a graph showing a state of generation of compressive residual stress according to an embodiment of the present invention and a state of generation of compressive residual stress due to a three-stage pinning process.
【図２】大径粒体、中径粒体及び小径粒体での各ピ−ニ
ング加工による圧縮残留応力の発生状態を表すグラフで
ある。FIG. 2 is a graph showing the state of generation of compressive residual stress due to each pinning process in large-diameter particles, medium-diameter particles, and small-diameter particles.
【図３】大径粒体と小径粒体によるピ−ニング加工のカ
バレ−ジ測定例を示すグラフである。FIG. 3 is a graph showing an example of coverage measurement of a pinning process using large-diameter particles and small-diameter particles.
【図４】本発明を実施するためのショットピ−ニング加
工装置の構成図である。FIG. 4 is a configuration diagram of a shot pinning processing apparatus for carrying out the present invention.
【図５】本発明を実施するためのショットピ−ニング加
工装置の別の例を示す構成図である。FIG. 5 is a configuration diagram showing another example of a shot pinning processing apparatus for carrying out the present invention.
１ 投射機 ２ ピ−ニング室 ３ 分級機 ４Ａ ４Ｂ ４Ｃ 回収箱 ５Ａ ５Ｂ ５Ｃ 排出口 ６Ａ ６Ｂ ６Ｃ 投射材移送手段 ７Ａ ７Ｂ ７Ｃ 流量調整弁 ８Ａ ８Ｂ ８Ｃ 投射材供給管 Ｗ 被ピ−ニング製品 1 Projector 2 Pining room 3 classifier 4A 4B 4C collection box 5A 5B 5C outlet 6A 6B 6C Projection material transfer means 7A 7B 7C Flow rate adjustment valve 8A 8B 8C Projection material supply pipe W Pinned product
フロントページの続き (56)参考文献 特開 平８−336757（ＪＰ，Ａ) 特開 平４−193479（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B24C 11/00 B24C 1/10 Front page continuation (56) References JP-A-8-336757 (JP, A) JP-A-4-193479 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) B24C 11 / 00 B24C 1/10
Claims (3)
中径粒体及び小径粒体の平均粒径比とをそれぞれ１／２
〜１／１５の範囲にした直径５００〜１０００μｍの大
径粒体と、直径１００〜５００μｍの中径粒体と、直径
２０〜１００μｍの小径粒体とを重量混合比が同一投射
時間内でそれぞれカバレ−ジが１００％以上になるよう
に混合した投射材を被ピ−ニング製品に対して投射し、
該被ピ−ニング製品に圧縮残留応力の影響層を生成する
ことを特徴とするショットピ−ニング方法。1. An average particle size ratio of large-diameter particles and medium-diameter particles,
1/2 the average particle size ratio of medium-sized particles and small-sized particles
The large-diameter particles with a diameter of 500 to 1000 μm in the range of up to 1/15, the medium diameter particles with a diameter of 100 to 500 μm, and the small diameter particles with a diameter of 20 to 100 μm are projected with the same weight mixing ratio.
Coverage should be over 100% in each time
The mixed projection material Hipi to - projected against training products,
A shot-pinning method, characterized in that an influential layer of compressive residual stress is formed on the pinned product .
射材を回収して分級機に掛け、所定粒径範囲以下に摩耗
あるいは破損した各中間粒径投射材を分級除去すると共
に残りの投射材を所定粒径範囲の大径粒体、中径粒体及
び小径粒体に分級してそれぞれ別々に移送し、それぞれ
別々に移送された大径粒体と中径粒体と小径粒体とをそ
れぞれの流量調整弁を通して重量混合比率が同一投射時
間内でそれぞれカバレ−ジが１００％以上になるように
混合して再投射することを特徴とする請求項１記載のシ
ョットピ−ニング方法。2. The shot material that has been shot-peened is collected and subjected to a classifier to classify and remove each intermediate particle size shot material that is worn or damaged within a predetermined particle size range, and the remaining shot material is removed. Classified into large-diameter particles, medium-diameter particles and small-diameter particles in a predetermined particle size range, respectively transferred separately, and respectively transferred large-diameter particles, medium-sized particles and small-diameter particles respectively. 2. The shot pinning method according to claim 1, wherein the weight mixing ratios are mixed so that the coverage ratios are 100% or more within the same projection time and re-projected through the flow rate adjusting valve.
射材を回収して分級機に掛け、所定粒径範囲以下に摩耗
あるいは破損した各中間粒径投射材を分級除去すると共
に残りの所定粒径範囲内にある大径粒体、中径粒体及び
小径粒体とを混合状態にして移送すると共に該移送され
て比重偏積される投射材を撹拌混合して均一混合させて
再投射することを特徴とする請求項１記載のショットピ
−ニング方法。3. The shot material after the shot-peening process is collected and subjected to a classifier to classify and remove each intermediate particle size shot material that is worn or damaged within a predetermined particle size range, and the remaining predetermined particle size. Large-sized particles, medium-sized particles, and small-sized particles within the range are transferred in a mixed state, and the transferred shot materials having specific gravity and unevenly accumulated are stirred and mixed to be uniformly mixed and re-projected. The shot pinning method according to claim 1.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13219999A JP3456636B2 (en) | 1999-05-13 | 1999-05-13 | Shot peening method |
| US09/937,134 US6449998B1 (en) | 1999-03-24 | 2000-03-24 | Shot peening method and device therefor |
| EP00911340A EP1184135A4 (en) | 1999-03-24 | 2000-03-24 | Shot peening method and device therefor |
| PCT/JP2000/001811 WO2000056503A1 (en) | 1999-03-24 | 2000-03-24 | Shot peening method and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13219999A JP3456636B2 (en) | 1999-05-13 | 1999-05-13 | Shot peening method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000317841A JP2000317841A (en) | 2000-11-21 |
| JP3456636B2 true JP3456636B2 (en) | 2003-10-14 |
Family
ID=15075721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13219999A Expired - Fee Related JP3456636B2 (en) | 1999-03-24 | 1999-05-13 | Shot peening method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3456636B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007091430A1 (en) * | 2006-02-10 | 2007-08-16 | Mitsubishi Heavy Industries, Ltd. | Bolt and method for manufacturing bolt |
| DE102007009471A1 (en) * | 2007-02-27 | 2008-08-28 | Mtu Aero Engines Gmbh | Ultrasonic shotblasting process treatment involves using shot of at least two different sizes and/or of at least two different materials |
| US20130160899A1 (en) | 2010-09-09 | 2013-06-27 | Toyota Jidosha Kabushiki Kaisha | Gear |
| US8893538B2 (en) * | 2010-12-08 | 2014-11-25 | Fuji Kihan Co., Ltd. | Instantaneous heat treatment method for metal product |
| FR3035607B1 (en) * | 2015-04-30 | 2017-04-28 | Saint-Gobain Centre De Rech Et D'Etudes Europeen | METHOD FOR MODIFYING THE APPEARANCE OF A SURFACE |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04193479A (en) * | 1990-11-26 | 1992-07-13 | Toyota Motor Corp | Shot peening device |
| JPH08336757A (en) * | 1995-06-08 | 1996-12-24 | Sekisui Chem Co Ltd | Manufacture of embossing roll |
-
1999
- 1999-05-13 JP JP13219999A patent/JP3456636B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000317841A (en) | 2000-11-21 |
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