JP3453631B2 - Connector and its manufacturing and mounting method - Google Patents
Connector and its manufacturing and mounting methodInfo
- Publication number
- JP3453631B2 JP3453631B2 JP34413799A JP34413799A JP3453631B2 JP 3453631 B2 JP3453631 B2 JP 3453631B2 JP 34413799 A JP34413799 A JP 34413799A JP 34413799 A JP34413799 A JP 34413799A JP 3453631 B2 JP3453631 B2 JP 3453631B2
- Authority
- JP
- Japan
- Prior art keywords
- contacts
- contact
- substrate
- connection
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明はコネクタ及びその製
造・実装方法に関し、特に第1の基板表面の複数の電極
と第2の基板の複数の電極とを電気的に接続するコネク
タ及びその製造・実装方法に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector and a method for manufacturing and mounting the same, and more particularly to a connector for electrically connecting a plurality of electrodes on a surface of a first board and a plurality of electrodes on a second board and a method for manufacturing the same. Belongs to the implementation method.
【0002】[0002]
【従来の技術】第1の基板表面に配列形成された複数の
電極と、第2の基板に配列形成された複数の電極との間
を電気的に接続するコネクタの従来の代表的な一例を図
6に示す。この例は、基板110xの表面に複数のパタ
ーン電極120xが配列形成されたプリント基板100
xの複数のパターン電極120xと、基板210xに複
数のパターン電極(図示省略)が配列形成されたプリン
ト基板200xの複数のパターン電極とを電気的に接続
する場合の一般的なコネクタ80である。2. Description of the Related Art A typical conventional example of a conventional connector for electrically connecting a plurality of electrodes arranged on a surface of a first substrate and a plurality of electrodes arranged on a second substrate. As shown in FIG. This example is a printed circuit board 100 in which a plurality of pattern electrodes 120x are formed on the surface of a substrate 110x.
This is a general connector 80 when electrically connecting a plurality of pattern electrodes 120x of x and a plurality of pattern electrodes of a printed circuit board 200x in which a plurality of pattern electrodes (not shown) are formed on a substrate 210x.
【0003】このコネクタ80は、プリント基板100
xの複数のパターン電極120xと対応接続するための
複数のコンタクト10xと、これら複数のコンタクト1
0xを支持固定する一方、プリント基板200xの複数
のパターン電極形成部分が挿入されてこれを保持し、そ
の複数のコンタクトと複数のコンタクト10xとを対応
接触させるインシュレータ70とを備えて構成され、そ
の複数のコンタクト10xをプリント基板100xの複
数のパターン電極120xにはんだ付け接続(50x)
してプリント基板100x,200x間の電気的接続が
可能となる。The connector 80 is a printed circuit board 100.
x, the plurality of contacts 10x for corresponding connection with the plurality of pattern electrodes 120x, and the plurality of contacts 1
While supporting and fixing 0x, a plurality of pattern electrode forming portions of the printed circuit board 200x are inserted and held, and an insulator 70 that makes the plurality of contacts and the plurality of contacts 10x correspond to each other is configured. Solder connection of the plurality of contacts 10x to the plurality of pattern electrodes 120x of the printed circuit board 100x (50x).
Then, electrical connection between the printed circuit boards 100x and 200x becomes possible.
【0004】このような構成のコネクタ80をプリント
基板100xに搭載、実装する際に、他の表面実装型の
電子部品と同様に行う場合や、コネクタ80の数が多く
なると、これらコネクタ80のプリント基板100xへ
の搭載も、自動部品搭載装置を使用して行うことにな
る。従って、コネクタ80には、自動部品搭載装置の吸
着ノズルで吸着が可能な平面部71がインシュレータ7
0の上面に設けられている。When the connector 80 having such a structure is mounted and mounted on the printed circuit board 100x in the same manner as other surface mount type electronic components, or when the number of connectors 80 increases, the connector 80 is printed. The mounting on the board 100x is also performed by using the automatic component mounting apparatus. Therefore, the connector 80 has the flat surface portion 71 capable of being sucked by the suction nozzle of the automatic component mounting apparatus.
0 is provided on the upper surface.
【0005】なお、コネクタ80の複数のコンタクト1
0xの、プリント基板100xの複数のパターン電極1
20xへのはんだ付け接続は、表面実装型の電子部品の
はんだ付け接続技術を用いて行うことができる。また、
コネクタ80は、複数のコンタクト10xを金属板等か
ら製造した後、これら複数のコンタクト10xを、イン
シュレータ70をモールド形成する際に、このインシュ
レータ70内に配列、固定することにより製造すること
ができる。The plurality of contacts 1 of the connector 80
0x, a plurality of pattern electrodes 1 on the printed circuit board 100x
The soldering connection to 20x can be performed using the soldering connection technique of surface mount type electronic components. Also,
The connector 80 can be manufactured by manufacturing the plurality of contacts 10x from a metal plate or the like and then arranging and fixing the plurality of contacts 10x in the insulator 70 when the insulator 70 is molded.
【0006】[0006]
【発明が解決しようとする課題】上述した従来のコネク
タ80及びその製造・実装方法は、コネクタ80が、複
数のコンタクト10xと、上面に平面部71が設けられ
て、これら複数のコンタクト10xを配列、固定するイ
ンシュレータ70とを含む構成となっており、その製造
・実装方法は、複数のコンタクト10xを金属板等から
製造した後、これらコンタクト10xを、インシュレー
タ70をモールド形成する際に、その内部に配列、固定
してコネクタ80を製造し、このコネクタ80のインシ
ュレータ70の平面部71を自動部品搭載装置の吸着ノ
ズルに吸着させてプリント基板100xに搭載し、この
プリント基板100xの複数のパターン電極120xと
コネクタ80の複数のコンタクト10xとをはんだ付け
接続する方法となっているので、コネクタ80が、複数
のコンタクト10xを配列固定するインシュレータ70
を必要とするために、大型化するという問題点や、製造
工程が多く、かつ部材費が増大してコスト高になるとい
う問題点があり、また、複数のコンタクト10xを、モ
ールド形成等によりインシュレータ70に配列、固定す
るようになっているので、コンタクト数が変わると、そ
の都度、モールド形成用の型を変える必要があり、コン
タクト数が異なる場合の対応が困難になるという問題点
がある。In the above-described conventional connector 80 and the manufacturing / mounting method thereof, the connector 80 is provided with the plurality of contacts 10x and the flat portion 71 on the upper surface, and the plurality of contacts 10x are arranged. , And the insulator 70 to be fixed. The manufacturing / mounting method is such that after the plurality of contacts 10x are manufactured from a metal plate or the like, these contacts 10x are formed inside when the insulator 70 is molded. The connector 80 is manufactured by arranging and fixing to the printed circuit board 100x, and the flat portion 71 of the insulator 70 of the connector 80 is sucked by the suction nozzle of the automatic component mounting apparatus and mounted on the printed circuit board 100x. 120x and a plurality of contacts 10x of the connector 80 are connected by soldering. Since it is, the connector 80 is arranged fixing a plurality of contacts 10x insulator 70
Therefore, there is a problem in that the size is increased, there are many manufacturing processes, and the cost of members increases, resulting in high cost. In addition, a plurality of contacts 10x are formed by an insulator or the like by molding. Since they are arranged and fixed in 70, when the number of contacts changes, it is necessary to change the mold for forming the mold each time, and there is a problem that it is difficult to cope with the case where the number of contacts is different.
【0007】本発明の目的は、上述した従来技術の問題
点に鑑みて、小型化することができると同時に、基板へ
の自動搭載もできてコストを低減することができ、ま
た、コンタクト数が異なる場合の対応が容易にできるコ
ネクタ及びその製造・実装方法を提供することにある。In view of the above-mentioned problems of the prior art, an object of the present invention is that the size can be reduced, at the same time the cost can be reduced by automatic mounting on the substrate, and the number of contacts can be reduced. It is an object of the present invention to provide a connector and a manufacturing / mounting method thereof that can easily handle different cases.
【0008】[0008]
【課題を解決するための手段】本発明のコネクタは、第
1の基板表面に配列形成された複数の電極と、第2の基
板に配列形成された複数の電極との間を電気的に接続す
るコネクタであって、上記の目的を達成するために次の
各構成を有することを特徴とする。
(イ)それぞれが、弾性導電性板材により、前記第1の
基板表面の電極に接続される接続部と、この接続部の一
方の端につながって延びて、予め定められた長さのとこ
ろで上方側に折り返され、その先端が、前記接続部に対
し予め定められた相対位置まで延びて弾性変位するばね
部と、このばね部の先端部分につながり前記第2の基板
の電極を接触させる接触部と、前記接続部の他方の端に
つながって上方に突出し、前記接触部に前記第2の基板
の電極が予め定められた接触圧力範囲内で接触するとき
にはその先端と第2の基板との間に隙間が生じ、前記接
触圧力範囲を越える力が加わるとその先端に前記第2の
基板が突き当って、前記第1の基板と前記第2の基板と
の間の間隔が予め設定された寸法より狭くならないよう
にするストッパと、を備えて形成された複数のコンタク
ト
(ロ)前記複数のコンタクトそれぞれの接続部を、前記
第1の基板表面の複数の電極にはんだ付け対応接続し
て、これら複数のコンタクトを前記第1の基板に配列、
固定するコンタクト接続・配列固定手段
(ハ)前記複数のコンタクトそれぞれの接触部と前記第
2の基板の電極とが前記予め定められた接触圧力範囲内
で接触するように、前記第1の基板と前記第2の基板と
保持する加圧接触保持手段The connector of the present invention electrically connects a plurality of electrodes arrayed and formed on the surface of a first substrate and a plurality of electrodes arrayed and formed on a second substrate. In order to achieve the above object, the connector has the following respective configurations. (A) Each of them is connected to an electrode on the surface of the first substrate by an elastic conductive plate material, and is connected to one end of this connection part and extends to a position above a predetermined length. And a contact portion that is connected to the tip portion of the spring portion and has a tip that extends toward a predetermined relative position with respect to the connection portion and is elastically displaced and that contacts the electrode of the second substrate. And at the other end of the connection
The second substrate is connected to the second substrate and protrudes upward.
When the electrodes of contact with each other within a predetermined contact pressure range
Has a gap between its tip and the second substrate.
When a force exceeding the contact pressure range is applied, the second
Substrates come into contact with each other, and the first substrate and the second substrate
So that the space between them does not become smaller than the preset dimension
And a plurality of contacts formed with a stopper (b). The connection portions of the plurality of contacts are soldered to the plurality of electrodes on the surface of the first substrate, and the plurality of contacts are connected. Arranged on the first substrate,
Fixing contact connection / arrangement fixing means (c) The first substrate and the contact portion of each of the plurality of contacts and the electrode of the second substrate are brought into contact with each other within the predetermined contact pressure range. Pressure contact holding means for holding the second substrate
【0009】[0009]
【0010】また、本発明のコネクタの製造・実装方法
は、前記コネクタの製造・実装方法であって、次の各工
程を含むことを特徴とする。
(イ)一枚の弾性導電性板材を加工して、第1の基板表
面の複数の電極の配列に合わせて配列形成された複数の
コンタクトと、これら複数のコンタクトを、そのそれぞ
れの接続部のストッパ形成部分につながる連結部で互い
に連結して前記複数のコンタクトの配列方向に延び、そ
の上面に自動部品搭載装置の吸着ノズルによる吸着が可
能な平面を持つ連結吸着搭載用部材と、を含む吸着搭載
用部材付き連結コンタクトを製造する連結コンタクト製
造工程
(ロ)前記吸着搭載用部材付き連結コンタクトを、その
連結吸着搭載用部材の上面を自動部品搭載装置の吸着ノ
ズルに吸着させて搬送し、前記第1の基板表面の複数の
電極上に前記吸着搭載用部材付き連結コンタクトの複数
のコンタクトそれぞれの接続部を位置合せして配置、搭
載する連結コンタクト配置搭載工程
(ハ)前記第1の基板表面の複数の電極と前記吸着搭載
用部材付き連結コンタクトの複数のコンタクトとをはん
だ付け接続してこれら複数のコンタクトを前記第1の基
板に固定するはんだ付け接続工程
(ニ)前記はんだ付け接続工程後、前記吸着搭載用部材
付き連結コンタクトの連結吸着搭載用部材を、その複数
のコンタクトとの連結部で屈曲させて切り離す吸着搭載
用部材切除工程The connector manufacturing / mounting method of the present invention is the connector manufacturing / mounting method, and is characterized by including the following steps. (A) A plurality of contacts formed by processing one elastic conductive plate material in accordance with the arrangement of the plurality of electrodes on the surface of the first substrate, and the plurality of contacts at the respective connection portions. A suction device including a connecting and suction mounting member that is connected to each other at a connecting portion connected to the stopper forming portion and extends in the arrangement direction of the plurality of contacts, and has a flat surface on the upper surface thereof that can be sucked by a suction nozzle of an automatic component mounting apparatus. Connecting contact manufacturing step for manufacturing a connecting contact with a mounting member (b) The connecting contact with a suction mounting member is conveyed by adsorbing the upper surface of the connecting suction mounting member to a suction nozzle of an automatic component mounting apparatus, Connection for arranging and mounting connection parts of the plurality of contacts of the suction-mounting member-attached connection contact on the plurality of electrodes on the surface of the first substrate. Ntakuto disposed mounting step (c) said first plurality of electrodes and a plurality of contacts and the soldering connection to the first base a plurality of contacts of the member-provided connecting contacts for the adsorption loading of the substrate surface
Soldering connection step for fixing to plate (d) After the soldering connection step, for the adsorption mounting in which the connection adsorption mounting member of the connection contact with the adsorption mounting member is bent and separated at the connecting portion with the plurality of contacts Part cutting process
【0011】また、前記吸着搭載用部材付き連結コンタ
クトが、コネクタ複数個分の多数のコンタクトを連結し
て形成された吸着搭載用部材付き多数連結コンタクトか
らコネクタ1個分に切断されて形成されたものであるこ
とを特徴とする。Further, the connection contact with the suction mounting member is formed by cutting one connection connector from the multi-connection contact with the suction mounting member formed by connecting a plurality of contacts for a plurality of connectors. It is characterized by being a thing.
【0012】また、連結コンタクト製造工程における吸
着搭載用部材付き連結コンタクトは、その連結吸着用部
材が、前記複数のコンタクトそれぞれのストッパの先端
につながる連結部でこれら複数のコンタクトを互いに連
結するようにした構造であることを特徴とする。[0012] The connecting contact fabrication member-provided connecting contacts for the adsorption mounted in step, the consolidated adsorption member, to couple together the plurality of contacts at the connecting portion connected to the distal end of the plurality of contacts each stopper It is characterized by the structure.
【0013】[0013]
【発明の実施の形態】本発明のコネクタの一実施の形態
は、第1の基板表面に配列形成された複数の電極と、第
2の基板に配列形成された複数の電極との間を電気的に
接続するコネクタであって、それぞれが、弾性導電性板
材により、上記第1の基板表面の電極に接続される接続
部と、この接続部の一方の端につながって延びて、予め
定められた長さのところで上方側に折り返され、その先
端が、上記接続部に対し予め定められた相対位置まで延
びて弾性変位するばね部と、このばね部の先端部分につ
ながり上記第2の基板の電極を接触させる接触部と、上
記接続部の他方の端につながって上方に突出し、上記接
触部に上記第2の基板の電極が予め定められた接触圧力
範囲内で接触するときにはその先端と第2の基板との間
に隙間が生じ、上記接触圧力範囲を越える力が加わると
その先端に上記第2の基板が突き当って、上記第1の基
板と上記第2の基板との間の間隔が予め設定された寸法
より狭くならないようにするストッパと、を備えて形成
された複数のコンタクトと、これら複数のコンタクトそ
れぞれの接続部を、上記第1の基板表面の複数の電極に
はんだ付け対応接続して、これら複数のコンタクトを上
記第1の基板に配列、固定するコンタクト接続・配列固
定手段と、上記複数のコンタクトそれぞれの接触部と上
記第2の基板の電極とが上記予め定められた接触圧力範
囲内で接触するように、上記第1の基板と上記第2の基
板と保持する加圧接触保持手段と、を有する構成となっ
ている。BEST MODE FOR CARRYING OUT THE INVENTION One embodiment of a connector of the present invention is that a plurality of electrodes arranged on a surface of a first substrate and a plurality of electrodes arranged on a second substrate are electrically connected. Connectors that are connected to each other by an elastic conductive plate member, and are connected to one end of the connection part and extend at one end of the connection part, and are predetermined. Of the second substrate, the spring portion being folded back upward at a certain length, the tip of which extends to a predetermined relative position with respect to the connection portion and is elastically displaced, and the tip portion of the spring portion. a contact portion contacting the electrodes, above
Connect to the other end of the connecting part and project upward,
The contact pressure of the electrode of the second substrate is predetermined on the touch portion.
When contacting within the range, between the tip and the second substrate
If a force is applied that exceeds the above contact pressure range,
The second substrate hits the tip of the first substrate,
Dimension where the distance between the plate and the second substrate is preset
A plurality of contacts formed by including stoppers that prevent the contacts from becoming narrower and connecting portions of the plurality of contacts are provided on the plurality of electrodes on the surface of the first substrate.
The contact connection / arrangement fixing means for arranging and fixing the plurality of contacts on the first board by soldering- compatible connection, the contact portion of each of the plurality of contacts and the electrode of the second board are provided in advance. The pressure contact holding means for holding the first substrate and the second substrate so as to contact each other within a predetermined contact pressure range.
【0014】[0014]
【0015】このような構成、構造とすることにより、
第1の基板そのものが、複数のコンタクトの配列、保持
固定用部材となるので、従来のインシュレータが不要と
なって、コネクタの小型化、及び低コスト化をはかるこ
とができる。With such a structure and structure,
Since the first substrate itself serves as an array of a plurality of contacts and a holding and fixing member, the conventional insulator is not necessary, and the connector can be downsized and the cost can be reduced.
【0016】また、このコネクタの製造・実装方法を、
一枚の弾性導電性板材を加工して、第1の基板表面の複
数の電極の配列に合わせて配列形成された複数のコンタ
クトと、これら複数のコンタクトを、そのそれぞれの接
続部のストッパ形成部分につながる連結部で互いに連結
して上記複数のコンタクトの配列方向に延び、その上面
に自動部品搭載装置の吸着ノズルによる吸着が可能な平
面を持つ連結吸着搭載用部材と、を含む吸着搭載用部材
付き連結コンタクトを製造する連結コンタクト製造工程
と、上記吸着搭載用部材付き連結コンタクトを、その連
結吸着搭載用部材の上面を自動部品搭載装置の吸着ノズ
ルに吸着させて搬送し、上記第1の基板表面の複数の電
極上に上記吸着搭載用部材付き連結コンタクトの複数の
コンタクトそれぞれの接続部を位置合せして配置、搭載
する連結コンタクト配置搭載工程と、上記第1の基板表
面の複数の電極と上記吸着搭載用部材付き連結コンタク
トの複数のコンタクトとをはんだ付け接続してこれら複
数のコンタクトを前記第1の基板に固定するはんだ付け
接続工程と、この後の、上記吸着搭載用部材付き連結コ
ンタクトの連結吸着搭載用部材を、その複数のコンタク
トとの連結部で屈曲させて切り離す吸着搭載用部材切除
工程と、を含む方法とすることにより、従来例のような
インシュレータが無くても自動部品装置により第1の基
板への複数のコンタクトの搭載、実装が可能、かつ容易
であり、しかもこれらを含む他の工程も単純、容易なも
のであるので、低コスト化につながる。In addition, a method for manufacturing and mounting this connector will be described.
A plurality of contacts formed by processing one elastic conductive plate material in accordance with the arrangement of a plurality of electrodes on the surface of the first substrate, and a stopper forming portion of each of these contacts. A suction mounting member including a connecting suction mounting member that is connected to each other at a connecting portion that extends in the arrangement direction of the plurality of contacts, and has a flat surface on the upper surface of which a flat surface that can be sucked by a suction nozzle of an automatic component mounting apparatus. And a step of manufacturing the connecting contact with the suction mounting member, wherein the upper surface of the connecting suction mounting member is sucked by the suction nozzle of the automatic component mounting apparatus and conveyed, A connection contact for arranging and mounting the connection parts of the respective contacts of the connection contact with the adsorption mounting member on a plurality of electrodes on the surface in alignment with each other. These double and arranged mounting process, and a plurality of contacts of the first connection contact with the plurality of electrodes and the suction mounting member of the substrate surface is soldered connection
A soldering connection step of fixing a number of contacts to the first substrate, and thereafter bending the connection suction mounting member of the connection contact with the suction mounting member at the connection portion with the plurality of contacts. By adopting a method including a step of cutting off the suction mounting member, it is possible and easy to mount and mount a plurality of contacts on the first substrate by an automatic component device without an insulator as in the conventional example. In addition, other steps including these are simple and easy, which leads to cost reduction.
【0017】また、上記吸着搭載用部材付き連結コンタ
クトが、コネクタ複数個分の多数のコンタクトを連結し
て形成された吸着搭載用部材付き多数連結コンタクトか
らコネクタ1個分を切断して得られるようにすることに
より、コンタクト数が変わったときにも容易に対応する
ことができる。Further, the connecting contact with the suction mounting member may be obtained by cutting one connector from a large number of connecting contacts with the suction mounting member formed by connecting a plurality of contacts for a plurality of connectors. By doing so, it is possible to easily deal with the case where the number of contacts changes.
【0018】また、連結コンタクト製造工程における吸
着搭載用部材付き連結コンタクトは、その連結吸着用部
材が、上記複数のコンタクトそれぞれのストッパの先端
につながる連結部でこれら複数のコンタクトを互いに連
結するようにした構造とすることにより、複数のコンタ
クトの配列間隔を狭くすることができ、更に狭ピッチ
化、小型化が可能となる。[0018] The connecting contacts adsorption mounting member with connection contacts in the manufacturing process, the consolidated adsorption member, to couple together the plurality of contacts at the connecting portion connected to the distal end of the plurality of contacts each stopper With this structure, the arrangement interval of the plurality of contacts can be narrowed, and the pitch can be further narrowed and the size can be reduced.
【0019】[0019]
【実施例】次に本発明の実施例について図面を参照して
説明する。図1(a)〜(c)は本発明のコネクタの一
実施例を示す斜視図、並びにそのコンタクトの接触部に
電極が接触する前、及び接触後に更に強い力で押し込ま
れたときの状態を示す側面図である。Embodiments of the present invention will now be described with reference to the drawings. 1 (a) to 1 (c) are perspective views showing an embodiment of a connector of the present invention and a state before the electrode is brought into contact with the contact portion of the contact and when the electrode is pushed by a stronger force. It is a side view shown.
【0020】この実施例のコネクタは、基板110の表
面に複数のパターン電極120が配列形成された(第1
の)プリント基板100の複数のパターン電極120
と、基板210の表面に複数のパターン電極220が配
列形成された(第2の)プリント基板200の複数のパ
ターン電極220とを電気的に接続するコネクタであっ
て、複数のコンタクト10と、これら複数のコンタクト
10をプリント基板100の複数のパターン電極120
に接続してプリント基板100に配列、固定するコンタ
クト接続・配列固定手段のはんだ付け部50と、図1に
は表示されていないが、複数のコンタクト10の接触部
(13)とプリント基板200の複数のパターン電極2
20とが予め定められた接触圧力範囲内で接触するよう
に、プリント基板100及びプリント基板200を保持
する加圧接触保持手段とを有した構成、構造となってお
り、その複数のコンタクト10それぞれの詳細は次のと
おりである。In the connector of this embodiment, a plurality of pattern electrodes 120 are arranged and formed on the surface of the substrate 110 (first
A plurality of patterned electrodes 120 of the printed circuit board 100.
And a plurality of pattern electrodes 220 arranged on the surface of the substrate 210 and electrically connected to the plurality of pattern electrodes 220 of the (second) printed circuit board 200. The plurality of contacts 10 are connected to the plurality of pattern electrodes 120 of the printed circuit board 100.
The soldering part 50 of the contact connecting / arranging and fixing means for connecting and arranging and fixing to the printed circuit board 100, and the contact parts (13) of the plurality of contacts 10 and the printed circuit board 200, which are not shown in FIG. Multiple pattern electrodes 2
20 has a structure and a structure having a pressure contact holding means for holding the printed circuit board 100 and the printed circuit board 200 so as to make contact with each other within a predetermined contact pressure range. The details of are as follows.
【0021】すなわち、コンタクト10は、金属板等の
弾性導電性板材により、プリント基板100のパターン
電極にはんだ付け接続される接続部11と、この接続部
11の一方の端につながって延びて、予め定められた長
さのところで上方側に折り返され、その先端が、接続部
11に対し予め定められた相対位置まで延びて弾性変位
するばね部12と、このばね部12の先端部分につなが
りプリント基板200のパターン電極を接触させる接触
部13と、接続部11の他方の端につながって上方に突
出し、接触部13にプリント基板200のパターン電極
220が予め定められた適正な接触圧力範囲内で接触す
るときにはその先端とプリント基板200との間に隙間
が生じ、適正な接触圧力範囲を越える力(F)が加わる
と、図1(c)に示すようにその先端にプリント基板2
00が突き当たって、プリント基板100とプリント基
板200との間が予め設定された寸法より狭くならない
ようにするストッパ14と、接続部11の他方の端とつ
ながり、後述するコンタクト10の製造工程における複
数のコンタクト10を連結するための連結部15と、を
備えた構造となっている。That is, the contact 10 is connected to one end of the connection portion 11 and the connection portion 11 to be soldered to the pattern electrode of the printed circuit board 100 by an elastic conductive plate material such as a metal plate, and extends. A spring portion 12 which is folded back upward at a predetermined length and whose tip extends to a predetermined relative position with respect to the connecting portion 11 and is elastically displaced, and a print connected to the tip portion of the spring portion 12. The contact portion 13 for contacting the pattern electrode of the substrate 200 and the other end of the connecting portion 11 are connected to the contact portion 13 and protrude upward, and the pattern electrode 220 of the printed circuit board 200 is contacted with the contact portion 13 within a predetermined appropriate contact pressure range. When a contact is made, a gap is created between the tip and the printed circuit board 200, and when a force (F) exceeding the appropriate contact pressure range is applied, the result becomes as shown in FIG. 1 (c). PCB at its tip Suyo 2
00 and the printed circuit board 100 and the printed circuit board 200 are prevented from becoming narrower than a preset size by connecting with 00 and the other end of the connecting portion 11 and are connected to each other. And a connecting portion 15 for connecting the contact 10 of FIG.
【0022】この実施例のコネクタでは、複数のコンタ
クト10をプリント基板100の複数のパターン電極1
20にはんだ付け接続することにより(図1のはんだ付
け部50)、これら複数のコンタクト10が配列、保持
固定され(従来例の、プリント基板100xへの接続前
のインシュレータ70に相当する)、かつ同時に、プリ
ント基板100に対しても、その状態で固定される(従
来例の、プリント基板100xへの接続後の状態)。す
なわち、従来例のインシュレータ70に相当する部分は
プリント基板100そのものであり、従来例のように、
複数のコンタクトを一旦、(インシュレータに)配列、
保持固定した後、プリント基板に接続、固定する、とい
う2段構成とする必要はなく、プリント基板100に直
接、複数のコンタクト10を接続固定するという1段構
成で済み、インシュレータ70のような中間的な部材
や、中間的な作業工程が不要となる。In the connector of this embodiment, the contacts 10 are connected to the pattern electrodes 1 of the printed circuit board 100.
By soldering to 20 (soldering portion 50 in FIG. 1), the plurality of contacts 10 are arranged, held and fixed (corresponding to the insulator 70 before connection to the printed board 100x in the conventional example), and At the same time, the printed circuit board 100 is also fixed in that state (the state after connection to the printed circuit board 100x in the conventional example). That is, the portion corresponding to the insulator 70 of the conventional example is the printed circuit board 100 itself, and as in the conventional example,
Arrange multiple contacts once (in insulator),
It is not necessary to have a two-stage configuration of connecting and fixing to the printed circuit board after holding and fixing, and a one-stage configuration of directly connecting and fixing a plurality of contacts 10 to the printed circuit board 100 is sufficient. No special members or intermediate work steps are required.
【0023】従って、コネクタ全体のコストを低減する
ことができ、また、コネクタ全体を小型化することがで
きる。Therefore, the cost of the entire connector can be reduced, and the entire connector can be downsized.
【0024】また、この実施例のコネクタでは、図1に
は示されていない加圧接触保持手段によって、コンタク
ト10の接触部13とプリント基板200のパターン電
極220とが適正な接触圧力範囲内で接触するように、
プリント基板100及びプリント基板200が保持され
るようになっているが、予期しない力(F)が加わって
プリント基板200を押し込むと、プリント基板200
がコンタクト10のストッパ14に突き当り、それ以上
に押し込まれることはないので、コンタクト等が破損す
るのを防止することができる。Further, in the connector of this embodiment, the contact portion 13 of the contact 10 and the pattern electrode 220 of the printed circuit board 200 are kept within an appropriate contact pressure range by the pressure contact holding means not shown in FIG. To make contact
The printed circuit board 100 and the printed circuit board 200 are held, but when an unexpected force (F) is applied and the printed circuit board 200 is pushed in, the printed circuit board 200 is pressed.
Since it does not hit the stopper 14 of the contact 10 and is pushed further than that, it is possible to prevent the contact or the like from being damaged.
【0025】次に、本発明のコネクタの製造・実装方法
の一実施例について、図2(a)〜(c)及び図3
(a),(b)を参照しながら説明する。この実施例
は、前述のコネクタの製造・実装方法であって、一枚の
金属板等の弾性導電性板材をプレス加工、曲げ加工等に
より、プリント基板100のパターン電極120の配列
に合わせて配列形成された複数のコンタクト10と、こ
れら複数のコンタクト10を、そのそれぞれの接続部1
1の端部につながりストッパ14の両側から延びる連結
部15を、連結部21で互いに連結して、複数のコンタ
クト10の配列方向に延び、その上面に、自動部品搭載
装置の吸着ノズルで吸着可能な平面部22を持つ連結吸
着搭載用部材20と、を含む吸着搭載用部材付き連結コ
ンタクト30を、キャリア40付きで製造する連結コン
タクト製造工程と(図2参照)、この後キャリア40を
切り離して、吸着搭載用部材付き連結コンタクト30
を、その連結吸着搭載用部材20の平面部を自動部品搭
載装置の吸着ノズルに吸着させて搬送し、プリント基板
100の複数のパターン電極上に、吸着搭載用部材付き
連結コンタクト30の複数のコンタクト10それぞれの
接続部11を位置合せして配置、搭載する連結コンタク
ト配置搭載工程と(図3(a))、プリント基板100の
複数のパターン電極120と吸着搭載用部材付き連結コ
ンタクト30の複数のコンタクト10とを、リフローは
んだ付け処理等によりはんだ付け接続するはんだ付け接
続工程と、この後、吸着搭載用部材付き連結コンタクト
30の連結吸着搭載用部材20を、その複数のコンタク
ト10との連結部21で屈曲させて、その部分で切り離
す吸着搭載用部材切除工程と(図3(b))、を含んで構
成される。Next, an embodiment of the method for manufacturing and mounting the connector of the present invention will be described with reference to FIGS.
A description will be given with reference to (a) and (b). This embodiment is a method for manufacturing and mounting the above-described connector, in which an elastic conductive plate material such as a single metal plate is arranged according to the arrangement of the pattern electrodes 120 of the printed circuit board 100 by pressing, bending, or the like. The formed plurality of contacts 10 and the plurality of contacts 10 are connected to the respective connection portions 1
The connecting portions 15 that are connected to one end portion of the stopper 14 and extend from both sides of the stopper 14 are connected to each other by the connecting portions 21 and extend in the arrangement direction of the plurality of contacts 10, and the upper surface thereof can be sucked by the suction nozzle of the automatic component mounting apparatus. A connecting contact manufacturing step of manufacturing a connecting contact 30 with a suction mounting member including a connecting suction mounting member 20 having a flat surface portion 22 with a carrier 40 (see FIG. 2), and then separating the carrier 40. , Connection contact with suction mounting member 30
Of the connection contact 30 with the suction mounting member on the plurality of pattern electrodes of the printed circuit board 100 by adsorbing the flat portion of the connection suction mounting member 20 to the suction nozzle of the automatic component mounting apparatus. 10. A connecting contact arrangement mounting step of aligning and mounting the respective connecting portions 11 and mounting (FIG. 3A), a plurality of pattern electrodes 120 of the printed circuit board 100 and a plurality of connecting contacts 30 with a suction mounting member. A soldering connection step of connecting the contact 10 to the contact 10 by a reflow soldering process or the like, and then a connecting portion of the connecting suction mounting member 20 of the connecting contact 30 with the suction mounting member to the plurality of contacts 10. It is configured to include a suction mounting member cutting step of bending at 21 and separating at that portion (FIG. 3B).
【0026】こうして、図1(a)に示された、プリン
ト基板100の複数のパターン電極120に複数のコン
タクト10がはんだ付け接続された部分が完成する。こ
の後、前述の加圧接触保持手段により、プリント基板1
00とプリント基板200とを保持すればよい。In this way, the portion shown in FIG. 1A where the plurality of contacts 10 are soldered to the plurality of pattern electrodes 120 of the printed circuit board 100 is completed. After that, the printed circuit board 1 is pressed by the pressure contact holding means described above.
00 and the printed circuit board 200 may be held.
【0027】このような製造・実装方法とすることによ
り、従来例のインシュレータ70がなくても自動部品搭
載装置によるプリント基板100への複数のコンタクト
10の搭載が可能、かつ容易になり、また、実装等の他
の工程も単純、容易であるので、コネクタ全体のコスト
を安くすることができる。By adopting such a manufacturing / mounting method, it becomes possible and easy to mount the plurality of contacts 10 on the printed circuit board 100 by the automatic component mounting apparatus without the insulator 70 of the conventional example. Since other steps such as mounting are simple and easy, the cost of the entire connector can be reduced.
【0028】なお、この実施例において、吸着搭載用部
材付き連結コンタクト30が、コネクタ複数個分の多数
のコンタクト10を連結して形成された吸着搭載用部材
付き多数連結コンタクトを製造しておいて、これからコ
ネクタ1個分を切り離して得られるようにすれば、コン
タクト数の異なるコネクタに対しても、またコンタクト
数が変化した場合にも容易に対応することができるよう
になる。In this embodiment, the suction-mounting member-equipped connecting contact 30 is formed by connecting a large number of contacts 10 for a plurality of connectors, and the suction-mounting member-equipped connecting contact 30 is manufactured in advance. However, if one connector is separated from the connector, it is possible to easily cope with a connector having a different number of contacts and a change in the number of contacts.
【0029】図4(a),(b)は本発明のコネクタの
製造・実装方法の他の実施例の、連結コンタクト製造工
程における吸着搭載用部材付き連結コンタクトの各方向
から見た側面図、及び斜視図、図5(a),(b)はそ
の吸着搭載用部材切除工程後の斜視図及び平面図であ
る。前述の実施例では、ストッパ14の両わきに連結部
15,21が設けられていてその分、コンタクト10の
配列方向の幅が広くなり、コンタクト配列間隔が広くな
るが、この実施例においては、連結吸着搭載用部材20
aの連結部21aが直接、コンタクト10aのストッパ
14aの先端につながり、複数のコンタクト10aを連
結している。FIGS. 4 (a) and 4 (b) are side views of another embodiment of the connector manufacturing / mounting method of the present invention when viewed from each direction of the connecting contact with the suction mounting member in the connecting contact manufacturing process, 5A and 5B are a perspective view and a plan view after the suction mounting member cutting process. In the above-described embodiment, the connecting portions 15 and 21 are provided on both sides of the stopper 14, and the width in the arrangement direction of the contacts 10 is widened by that much, and the contact arrangement interval is widened. However, in this embodiment, Connection suction mounting member 20
The connecting portion 21a of "a" is directly connected to the tip of the stopper 14a of the contact 10a to connect the plurality of contacts 10a.
【0030】従って、連結のためのスペースが不要とな
り、コンタクト10aの配列方向の幅を前述の実施例に
比べて狭くすることができ、図5に示すように、その配
列ピッチpを狭くすることができる。すなわち、更なる
狭ピッチ化、小型化が可能となる。Therefore, a space for connection is not required, and the width of the contacts 10a in the arrangement direction can be made narrower than that in the above-described embodiment. As shown in FIG. 5, the arrangement pitch p can be made narrower. You can That is, the pitch can be further reduced and the size can be further reduced.
【0031】[0031]
【発明の効果】以上説明したように本発明のコネクタ
は、それぞれが、規定の接触圧力範囲を越えるような力
が接触部に加わると、その先端が第2の基板に当って接
触部等を保護するストッパを備えた複数のコンタクト
を、第1の基板の複数の電極に直接、接続固定し、第2
の基板の複数の電極と複数のコンタクトの接触部とが規
定の接触圧力範囲内で接触するように第1の基板と第2
の基板とを保持する構成、構造とすることにより、第1
の基板そのものが、複数のコンタクトの配列、保持固定
用部材となるので、従来例のインシュレータが不要にな
り、コネクタ全体を小型化することができ、かつ、中間
的な作業工程もなくなって、コネクタ全体のコストを安
くできるという効果があり、このコネクタの製造・実装
方法を、複数のコネクタを連結し、かつ上面に自動部品
搭載装置の吸着ノズルで吸着可能な平面を有する連結吸
着搭載用部材を含む吸着搭載用部材付き連結コンタクト
を製造し、この吸着搭載用部材付き連結コンタクトを、
その連結吸着搭載用部材の平面を自動部品搭載装置の吸
着ノズルに吸着させて第1の基板の複数の電極上に搭載
し、これら複数の電極と吸着搭載用部材付き連結コンタ
クトの複数のコンタクトとを接続したのち、その連結吸
着搭載用部材を切除する方法とすることにより、従来例
のようなインシュレータが無くても自動部品搭載装置に
より第1の基板への複数のコンタクトの搭載及び実装が
可能で容易かつ単純となるので、やはり、コネクタ全体
のコストを安くすることができるという効果があり、更
に、吸着搭載用部材付き連結コンタクトを、コネクタ複
数個分の多数のコンタクトが連結されて形成された吸着
搭載用部材付き多数連結コンタクトを製造しておいて、
これからコネクタ1個分を切り離して得る構成とするこ
とにより、コンタクト数の異なるコネクタや、コンタク
ト数が変化しても容易に対応できるという効果があり、
また、コンタクトをそのストッパの先端で連結して製造
することにより、更に狭ピッチ化、小型化が可能になる
という効果がある。As described above, in the connector of the present invention, when a force exceeding the specified contact pressure range is applied to the contact portion, the tip of the connector contacts the second substrate and the contact portion or the like is removed. A plurality of contacts having stoppers for protection are directly connected and fixed to a plurality of electrodes of the first substrate,
The first substrate and the second substrate so that the plurality of electrodes of the first substrate and the contact portions of the plurality of contacts come into contact with each other within a specified contact pressure range.
The structure and structure for holding the substrate of
Since the substrate itself becomes the arrangement of a plurality of contacts and the holding and fixing member, the insulator of the conventional example is not required, the connector can be downsized, and the intermediate working process can be eliminated. There is an effect that the overall cost can be reduced, and this connector manufacturing / mounting method is a method for connecting a plurality of connectors and connecting and mounting members with a flat surface on the upper surface that can be sucked by the suction nozzle of the automatic component mounting device. We manufacture a connecting contact with a suction mounting member including this connecting contact with a suction mounting member,
The flat surface of the connecting suction mounting member is sucked by the suction nozzle of the automatic component mounting apparatus and mounted on the plurality of electrodes of the first substrate, and the plurality of electrodes and the plurality of connecting contacts with the suction mounting member are connected. It is possible to mount and mount multiple contacts on the first board by the automatic component mounting device by removing the connecting suction mounting member after connecting Since it is easy and simple, there is still an effect that the cost of the entire connector can be reduced. Furthermore, the connecting contact with the suction mounting member is formed by connecting a large number of contacts for a plurality of connectors. We have manufactured multiple connection contacts with suction mounting members,
By arranging one connector to be separated from this, there is an effect that it is possible to easily cope with a connector having a different number of contacts and a change in the number of contacts.
Further, by connecting the contacts at the ends of the stoppers to manufacture the contacts, there is an effect that the pitch can be further narrowed and the size can be further reduced.
【図1】本発明のコネクタの一実施例を示す斜視図、並
びにそのコンタクト接触部に電極が接触する前及び接触
後、更に強い力で押し込まれたときの状態を示す側面図
である。FIG. 1 is a perspective view showing an embodiment of a connector of the present invention and a side view showing a state in which an electrode is pushed in with a stronger force before and after contact with a contact contact portion thereof.
【図2】本発明のコネクタの製造・実装方法の一実施例
の、連結コンタクト製造工程を説明するための吸着搭載
用部材付き連結コンタクトの斜視図、側面図、及び上面
図である。FIG. 2 is a perspective view, a side view, and a top view of a connecting contact with a suction mounting member for explaining a connecting contact manufacturing process of an embodiment of a method for manufacturing and mounting a connector of the present invention.
【図3】本発明のコネクタの製造・実装方法の一実施例
の、連結コンタクト配置搭載工程及びその後の工程を説
明するための斜視図である。FIG. 3 is a perspective view for explaining a connecting contact placement mounting step and subsequent steps of an embodiment of the connector manufacturing / mounting method of the present invention.
【図4】本発明のコネクタの製造・実装方法の他の実施
例の、連結コンタクト製造工程における吸着搭載用部材
付き連結コンタクトの各方向から見た側面図、及び斜視
図である4A and 4B are a side view and a perspective view of another embodiment of the connector manufacturing / mounting method of the present invention when viewed from each direction of the connecting contact with the suction mounting member in the connecting contact manufacturing process.
【図5】図4に示された実施例の吸着搭載用部材切除工
程後のコネクタの斜視図及び平面図である。5A and 5B are a perspective view and a plan view of the connector after the suction mounting member cutting step of the embodiment shown in FIG.
【図6】従来のコネクタの一例を示す斜視図である。FIG. 6 is a perspective view showing an example of a conventional connector.
10,10a,10x コンタクト 11,11a 接続部 12,12a ばね部 13,13a 接触部 14,14a ストッパ 15 連結部 20,20a 連結吸着搭載用部材 21,21a 連結部 22,22a 平面部 30,30a 吸着搭載用部材付き連結コンタクト 40 キャリア 50,50a,50x はんだ付け部 70 インシュレータ 71 平面部 80 コネクタ 100,100a,100x プリント基板 110,110a,110x 基板 120,120a,120x パターン電極 200,200a,200x プリント基板 210,210x 基板 220,220x パターン電極 10,10a, 10x contact 11,11a connection part 12, 12a Spring part 13, 13a Contact part 14,14a Stopper 15 Connection 20, 20a Connection suction mounting member 21,21a connection part 22,22a Plane part 30,30a Connection contact with suction mounting member 40 carriers 50,50a, 50x Soldering part 70 insulator 71 Plane 80 connector 100,100a, 100x printed circuit boards 110, 110a, 110x substrates 120, 120a, 120x pattern electrodes 200,200a, 200x PCB 210, 210x substrate 220, 220x pattern electrode
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01R 12/16 H01R 12/32 H01R 13/24 H01R 43/16 H05K 1/14 H05K 3/36 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01R 12/16 H01R 12/32 H01R 13/24 H01R 43/16 H05K 1/14 H05K 3/36
Claims (4)
電極と、第2の基板に配列形成された複数の電極との間
を電気的に接続するコネクタであって、次の各構成を有
することを特徴とするコネクタ。 (イ)それぞれが、弾性導電性板材により、前記第1の
基板表面の電極に接続される接続部と、この接続部の一
方の端につながって延びて、予め定められた長さのとこ
ろで上方側に折り返され、その先端が、前記接続部に対
し予め定められた相対位置まで延びて弾性変位するばね
部と、このばね部の先端部分につながり前記第2の基板
の電極を接触させる接触部と、前記接続部の他方の端に
つながって上方に突出し、前記接触部に前記第2の基板
の電極が予め定められた接触圧力範囲内で接触するとき
にはその先端と第2の基板との間に隙間が生じ、前記接
触圧力範囲を越える力が加わるとその先端に前記第2の
基板が突き当って、前記第1の基板と前記第2の基板と
の間の間隔が予め設定された寸法より狭くならないよう
にするストッパと、を備えて形成された複数のコンタク
ト (ロ)前記複数のコンタクトそれぞれの接続部を、前記
第1の基板表面の複数の電極にはんだ付け対応接続し
て、これら複数のコンタクトを前記第1の基板に配列、
固定するコンタクト接続・配列固定手段 (ハ)前記複数のコンタクトそれぞれの接触部と前記第
2の基板の電極とが前記予め定められた接触圧力範囲内
で接触するように、前記第1の基板と前記第2の基板と
保持する加圧接触保持手段1. A connector for electrically connecting a plurality of electrodes arrayed and formed on a surface of a first substrate and a plurality of electrodes arrayed and formed on a second substrate, each of the following configurations: A connector characterized by having. (A) Each of them is connected to an electrode on the surface of the first substrate by an elastic conductive plate material, and is connected to one end of this connection part and extends to a position above a predetermined length. And a contact portion that is connected to the tip portion of the spring portion and has a tip that extends toward a predetermined relative position with respect to the connection portion and is elastically displaced and that contacts the electrode of the second substrate. And at the other end of the connection
The second substrate is connected to the second substrate and protrudes upward.
When the electrodes of contact with each other within a predetermined contact pressure range
Has a gap between its tip and the second substrate.
When a force exceeding the contact pressure range is applied, the second
Substrates come into contact with each other, and the first substrate and the second substrate
So that the space between them does not become smaller than the preset dimension
And a plurality of contacts formed with a stopper (b). The connection portions of the plurality of contacts are soldered to the plurality of electrodes on the surface of the first substrate, and the plurality of contacts are connected. Arranged on the first substrate,
Fixing contact connection / arrangement fixing means (c) The first substrate and the contact portion of each of the plurality of contacts and the electrode of the second substrate are brought into contact with each other within the predetermined contact pressure range. Pressure contact holding means for holding the second substrate
法であって、次の各工程を含むことを特徴とするコネク
タの製造・実装方法。 (イ)一枚の弾性導電性板材を加工して、第1の基板表
面の複数の電極の配列に合わせて配列形成された複数の
コンタクトと、これら複数のコンタクトを、そのそれぞ
れの接続部のストッパ形成部分につながる連結部で互い
に連結して前記複数のコンタクトの配列方向に延び、そ
の上面に自動部品搭載装置の吸着ノズルによる吸着が可
能な平面を持つ連結吸着搭載用部材と、を含む吸着搭載
用部材付き連結コンタクトを製造する連結コンタクト製
造工程 (ロ)前記吸着搭載用部材付き連結コンタクトを、その
連結吸着搭載用部材の 上面を自動部品搭載装置の吸着ノ
ズルに吸着させて搬送し、前記第1の基板表面の複数の
電極上に前記吸着搭載用部材付き連結コンタクトの複数
のコンタクトそれぞれの接続部を位置合せして配置、搭
載する連結コンタクト配置搭載工程 (ハ)前記第1の基板表面の複数の電極と前記吸着搭載
用部材付き連結コンタクトの複数のコンタクトとをはん
だ付け接続してこれら複数のコンタクトを前記第1の基
板に固定するはんだ付け接続工程 (ニ)前記はんだ付け接続工程後、前記吸着搭載用部材
付き連結コンタクトの連結吸着搭載用部材を、その複数
のコンタクトとの連結部で屈曲させて切り離す吸着搭載
用部材切除工程 2. A method of manufacturing and mounting a connector according to claim 1.
A method characterized by including the following steps:
Manufacturing and mounting method. (A) The first substrate surface is processed by processing one elastic conductive plate material.
A plurality of electrodes arranged to match the arrangement of the electrodes on the surface
A contact and each of these multiple contacts
The connection part that connects to the stopper forming part of these connection parts
And extending in the arrangement direction of the plurality of contacts,
Can be picked up by the suction nozzle of the automatic component mounting device on the upper surface of the
Adsorption mounting that includes a connected adsorption mounting member that has an effective flat surface
Manufactured connecting contacts with parts for products
Manufacturing process (b) The connection contact with the suction mounting member is
Attach the upper surface of the connecting suction mounting member to the suction unit of the automatic component mounting device.
It is adsorbed on a cheat and conveyed, and a plurality of the surfaces of the first substrate are conveyed.
Plural connecting contacts with the adsorption mounting member on the electrode
The contacts of each of the contacts are aligned and arranged.
Mounting and mounting of connecting contacts to be mounted (c) Mounting of a plurality of electrodes on the surface of the first substrate and the suction mounting
For connecting multiple contacts with connecting members
A plurality of contacts are attached to the first base by brazing and connecting.
Soldering connection step for fixing to a plate (d) After the soldering connection step, the suction mounting member
A plurality of parts for connecting and mounting the connected contact of
Adsorption mounting that bends and disconnects at the connection part with the contact of
Member cutting process
が、コネクタ複数個分の多数のコンタクトを連結して形
成された吸着搭載用部材付き多数連結コンタクトからコ
ネクタ1個分に切断されて形成されたものである請求項
2記載のコネクタの製造・実装方法。 3. A connection contact with the suction mounting member.
Is formed by connecting multiple contacts for multiple connectors.
From the multiple connection contacts with suction mounting members
It is formed by cutting into one nectar.
2. Manufacturing and mounting method of the connector described in 2.
載用部材付き連結コンタクトは、その連結吸着用部材
が、前記複数のコンタクトそれぞれのストッパの先端に
つながる連結部でこれら複数のコンタクトを互いに連結
するようにした構造である請求項2記載のコネクタの製
造・実装方法。 4. A suction tower in a manufacturing process of a connection contact.
A connecting contact with a mounting member
At the tips of the stoppers of the contacts.
Connect these multiple contacts to each other with connecting parts
The structure of the connector according to claim 2, wherein
Manufacturing and mounting method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34413799A JP3453631B2 (en) | 1999-12-03 | 1999-12-03 | Connector and its manufacturing and mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34413799A JP3453631B2 (en) | 1999-12-03 | 1999-12-03 | Connector and its manufacturing and mounting method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001160442A JP2001160442A (en) | 2001-06-12 |
JP3453631B2 true JP3453631B2 (en) | 2003-10-06 |
Family
ID=18366935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34413799A Expired - Fee Related JP3453631B2 (en) | 1999-12-03 | 1999-12-03 | Connector and its manufacturing and mounting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3453631B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008117695A (en) * | 2006-11-07 | 2008-05-22 | Nippon Telegr & Teleph Corp <Ntt> | Substrate connection device |
JP4452304B2 (en) | 2007-12-20 | 2010-04-21 | 日本航空電子工業株式会社 | Electrical connection member |
JP2009157988A (en) | 2007-12-26 | 2009-07-16 | Hitachi Global Storage Technologies Netherlands Bv | Manufacturing method of hermetic connection terminal used in disk drive device having hermetically sealed enclosure and disk drive device |
JP5500870B2 (en) * | 2009-05-28 | 2014-05-21 | 新光電気工業株式会社 | Substrate with connection terminal and socket for electronic parts |
JP5462732B2 (en) * | 2010-06-29 | 2014-04-02 | モレックス インコーポレイテド | Sheet-like connector and manufacturing method thereof |
JP5129372B1 (en) * | 2011-08-01 | 2013-01-30 | イリソ電子工業株式会社 | Electrical connection terminal and mounting method thereof |
JP6247596B2 (en) | 2014-05-23 | 2017-12-13 | 日本航空電子工業株式会社 | Connector assembly |
JP6227481B2 (en) | 2014-05-23 | 2017-11-08 | 日本航空電子工業株式会社 | Connector assembly |
KR20230094438A (en) | 2021-12-21 | 2023-06-28 | 삼성전기주식회사 | Camera Module |
-
1999
- 1999-12-03 JP JP34413799A patent/JP3453631B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2001160442A (en) | 2001-06-12 |
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