JP3442904B2 - Electroforming equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming apparatus for supplying a plating solution to the upper surface of a substrate to plate the surface thereof.

[0002]

2. Description of the Related Art As is well known, in a CD mastering process, data created by premastering is recorded on a magnetic tape, a premastered CD or the like, and is first applied to the surface of a glass master disk based on the data. Laser light is applied to the photosensitizer to expose it to create a glass master,
In the development process, pits are formed on the resist surface, then a metal master is created from this glass master by electroless plating, and then a metal mother is created by electroplating from this metal master, and finally by electroplating from this metal mother. Creating a stamper.

In the above-mentioned mastering process, as a conventional technique for electrolytic plating, there is provided a main body having a cathode electrode having a recess on the upper end surface for supporting the substrate, and a main body provided in the recess of the cathode electrode. There is known an electroforming apparatus that includes a cathode electrode and a clamper that holds the peripheral edge of the substrate via a contact ring, and supplies a plating solution onto the substrate to plate the surface of the substrate.

[0004]

By the way, in the above electroforming apparatus, since the twist lock mechanism is provided between the clamper and the main body and the substrates to be plated are clamped by mechanically tightening them, the temperature change is caused. As a result, the clamping force changed and uniform clamping force could not be obtained. In addition, a strong clamping force could not be obtained because friction loss occurs when the substrate is clamped with a clamper.

Then, due to such changes in the clamping force,
The plating solution penetrates into the gap between the cathode electrode or contact ring and the substrate, and the components of this plating solution are deposited on the cathode electrode, etc., and in extreme cases, not only the substrate but also the cathode electrode or contact ring is plated. It was If the deposit derived from the plating solution or the growth of the plating on the cathode electrode or the contact ring is left as it is, the current density becomes nonuniform and the thickness of the plating becomes uneven. In addition, the total resistance increases due to a partial contact failure, and the output voltage of the constant current power supply connected to the electroforming equipment rises, so the safety circuit operates and the electroforming equipment stops and work is stopped. Sometimes it was interrupted. Furthermore, the local current concentration may cause partial burnout of the substrate, the cathode electrode, or the contact ring.

Therefore, so far, the above-mentioned precipitation unevenness,
In order to prevent work interruption and burnout of the substrate, etc., it is necessary to wipe off the deposits and plating derived from the plating solution grown on the cathode electrode or contact ring every time the substrate is replaced, which makes maintenance work at the time of substrate replacement complicated. Was becoming.

An object of the present invention is to provide an electroforming apparatus which does not require complicated maintenance work at the time of exchanging a substrate and can stably perform plating processing on the substrate.

[0008]

Means for Solving the Problems The invention described in claim 1 of the present invention, and the bearing to Luke source <br/> over de electrode substrate to be vertically fixed non, below the said cathode electrode A main body disposed so as to be vertically movable relative to the cathode electrode,
An electroforming apparatus comprising: a clamper attached to the main body and holding the peripheral edge of the substrate together with the cathode electrode, wherein a chamber is provided on the lower surface of the cathode electrode and the chamber is connected to the inside of the main body. An air supply pipe for supplying compressed air into the chamber through the air supply pipe and moving the main body and the clamper downward with respect to the cathode electrode to clamp the substrate. The above object is achieved by providing an electroforming apparatus characterized in that

According to a second aspect of the present invention, the cathode electrode supporting the substrate, the main body disposed below the cathode electrode so as to be vertically movable relative to the cathode electrode, and the main body. An electroforming apparatus equipped with a clamper that is attached to the cathode electrode and holds the peripheral edge of the substrate together with the cathode electrode, and a cylinder that opens to face the lower surface of the cathode electrode inside the main body,
A first air supply line communicating with the cylinder is provided, and a piston is arranged in the cylinder. Compressed air is supplied into the cylinder through the first air supply line to raise the piston to raise the cathode. Provided is an electroforming apparatus characterized in that it is brought into contact with the lower surface of an electrode, and the reaction force causes the main body and the clamper to move downward with respect to the cathode electrode to clamp the substrate. By doing so, the above object is achieved.

[0010] The invention described in claim 3 of the present invention, in the electroforming apparatus according to 請 Motomeko 2, causes interposed the packings in the gap between the body and the clamper, the one end portion within the body electroforming apparatus but wherein the second supply duct facing the packings provided, by pressing the packings through the second supply duct are no to seal the main body and the clamper Is provided.

[0011]

In the electroforming apparatus according to the first aspect of the present invention, compressed air is supplied into the chamber through the air supply pipe, and the main body and the clamper are moved downward with respect to the cathode electrode. Since the substrate is clamped, a uniform clamping force can be obtained regardless of temperature change.

In the electroforming apparatus according to the second aspect of the present invention, compressed air is supplied into the cylinder through the first air supply line, and the piston is raised to abut against the lower surface of the cathode electrode. Since the reaction force causes the main body and the clamper to move downward with respect to the cathode electrode to clamp the substrate, a uniform clamping force can be obtained regardless of temperature change.

[0013] In the electroforming apparatus according to claim 3 of the present invention, in addition to the operation of the electroforming apparatus according to claim 2, by supplying compressed air through the second supply duct, the packing Since the gap between the main body and the clamper is pressed by pressing, the airtightness between the main body and the clamper can be improved without being affected by the temperature change.

[0014]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 shows an electroforming apparatus which constitutes a part of a CD mastering apparatus which is a first embodiment of the electroforming apparatus according to the present invention. In the figure, reference numeral 1 is an electroforming device, 2 is a substrate to be plated, C is a contact ring, and P is a substrate.
Indicates packing.

As shown in FIG. 1, the electroforming apparatus 1 is
A cathode electrode 3 that supports the substrate 2, a main body 4 that is vertically movable relative to the cathode electrode 3 and is disposed below the cathode electrode 3, and a peripheral portion of the substrate 2 that is mounted on the main body 4 together with the cathode electrode 3. And a clamper 5 for sandwiching the substrate 2 between them, and a plating liquid is supplied onto the substrate 2 to plate the surface of the substrate 2.

A chamber 30 is provided on the lower surface of the cathode electrode 3, and a first air supply conduit 40 communicating with the chamber 30 is provided inside the main body 4. Then, pressurized air is supplied into the chamber 30 through the air supply conduit 40, and the main body 4 and the clamper 5 are moved downward with respect to the cathode electrode 3 to sandwich the substrate 2. .

Explaining the electroforming apparatus 1 in more detail, the cathode electrode 3 has a circular shape in plan view, and a hanging wall portion 3a hanging downward is formed in the central portion of the lower surface thereof. Has been done. In addition, a lower surface of the cathode electrode 3 is formed with a hanging wall portion 3b surrounding the hanging wall portion 3a. The chamber 30 is provided in a ring shape by the hanging wall portions 3a and 3b.

A standing wall portion 3c standing upward is formed on the peripheral portion of the upper surface of the cathode electrode 3. A step portion 3d is formed on an upper end portion of the standing wall portion 3c. A peripheral portion of the substrate 2 is placed below the step portion 3d, and a contact ring C described later is placed above the step portion 3d. It is designed to work. The cathode electrode 3
Is fixed to the upper end of the shaft 6 so as not to move vertically. Further, the cathode electrode 3 has a vertical insertion hole 3 into which an air cylinder 41 and a guide 44 described later are inserted.
e and 3f are provided.

At the center of the cathode electrode 3, a carrier plate 7 which is raised by an air cylinder 41 described later is arranged. The carrier plate 7 is raised above the standing wall portion 3c of the cathode electrode 3 before the clamper 5 is attached to the main body 4, and when the substrate 2 is placed, the carrier plate 7 is then attached. Board 2
Is stably placed on the standing wall portion 3c of the cathode electrode 3.

The main body 4 has a circular shape in plan view, and an insertion hole 4a is provided in the center thereof. A recess 4b is provided at the opening edge of the insertion hole 4a on the upper surface of the main body 4, and the hanging wall 3a of the cathode electrode 3 is inserted into the insertion hole 4a and the inner surface of the recess 4b is inserted. Further, the outer circumference of the hanging wall portion 3b is in sliding contact. Further, a step portion 4c is provided on the outer peripheral portion of the main body 4, and a plurality of engaging pins 4d protruding laterally are incorporated in the upper step side surface portion of the step portion 4c. Then, the engagement pin 4d is engaged with an engagement groove 5c of the clamper 5 described later so that the clamper 5 can be integrally mounted on the main body 4.

Air supply line 4 provided inside the main body 4
0 has one end opening below the chamber 30 and the other end (not shown) communicating with a pressure source (not shown) such as a compressor through the inside of the shaft 6. In addition, an air cylinder 41 is arranged in the main body 4 so as to be inserted into the insertion hole 3e of the cathode electrode 3. This air cylinder 41 is connected to the air supply line 40.
It is operated by compressed air supplied through a branch pipe line 42 branched from the above, and the carrier plate 7 is raised at the tip thereof. A lifter ring 43 is fixed to the air cylinder 41 so that when the clamper 5 is mounted on the main body 4, the air cylinder 41 can be lowered by a pressing pin 5d described later to lower the carrier plate 7. Yes. The air cylinder 41 is provided with a leak mechanism so that the pressure inside the air cylinder 41 can be lowered when the clamper 5 is removed after the plating process. Further, in the body 4, the insertion hole 3
A guide 44, which is inserted into the inside of f and regulates the rotation of the cathode electrode 3, is incorporated. In the electroforming apparatus 1 of this embodiment, the air cylinder 41 and the guide 44 are
There are 3 units each.

The clamper 5 has a ring-like appearance, and has a projecting wall 5a extending toward the center at the inner upper end thereof. Then, together with the standing wall portion 3c of the cathode electrode 3, the contact ring C
The substrate 2 is sandwiched via the. A step portion 5b corresponding to the step portion 4c of the main body 4 is provided on the lower surface of the clamper 5. An engagement groove 5c with which the engagement pin 4d is engaged is formed on the inner surface of the step portion 5b of the clamper 5. The engagement groove 5c is a so-called twist lock type engagement groove in which the engagement pin 4d is locked when the clamper 5 is rotated by a predetermined angle. Further, on the lower surface of the step portion 5b, a pressing pin 5d protruding downward is provided.
When the clamper 5 is installed,
The lifter ring 43 is pushed down. In the present embodiment, the clamper 5 is composed of an inner clamp 50 and an outer clamp 51.

In the electroforming apparatus 1 of this embodiment, the contact ring C is interposed between the electrode plate 3 and the substrate 2. The contact ring C is not necessarily essential, but is interposed to make the contact between the cathode electrode 3 and the substrate 2 good and to stabilize the conduction. Therefore, when the cathode electrode 3 and the clamper 5 are obtained with high accuracy and the contact between the cathode electrode 3 and the substrate 2 is good, it can be omitted.

Next, the operation of the electroforming apparatus 1 of the above embodiment will be described.
It will be described together with its usage.

First, the air cylinder 41 is operated to raise the carrier plate 7 above the cathode electrode 3. At this time, the clamper 5 is retracted to the inside position of the obstacle. Then, the substrate 2 is placed on the carrier plate 7 with the surface to be plated facing upward. Next, the contact ring C is arranged above the substrate 2.

Then, the retracted clamper 5 is placed above the carrier plate 7 and gradually lowered. At this time, the supply of compressed air to the air cylinder 41 is stopped, and the carrier plate 7 is also lowered as the clamper 5 is lowered. Then, the substrate 2 is placed with the lower surface of the peripheral portion 2a thereof being positioned below the step portion 3d of the standing wall portion 3c of the cathode electrode 3.
Then, the engaging pin 4d of the main body 4 and the engaging groove 5c of the clamper 5 are engaged with each other, and the clamper 5 is further rotated by a predetermined angle to securely mount the clamper 5 on the main body 4. At this time, the substrate 2 has the clamper 5
It is sandwiched between the lower end surface of the protruding wall portion 5a and the standing wall portion 3c of the cathode electrode 3 via a contact ring C. In addition, the carrier plate 7 includes a lifter ring 43.
Is pressed by the pressing pin 5d, and its rise is restricted.

Then, the pressure source (not shown) is operated to supply compressed air into the chamber 30 through the air supply line 40. Then, the main body 4 and the clamper 5 are moved downward with respect to the cathode electrode 3 to securely clamp the peripheral edge portion 2a of the substrate 2.

Then, in this state, a plating solution is supplied onto the substrate 2, an anode (not shown) is further arranged, and the surface of the substrate 2 is plated with the plating solution.

After performing the desired plating treatment, the surface of the substrate 2 is washed. Then, the supply of compressed air from the pressure source is stopped, and the clamper 5 is removed from the main body 4. At this time, the inside of the air cylinder 41 is decompressed by operating a leak mechanism (not shown) so that the carrier plate 7 does not rise carelessly.

After removing the clamper 5 and retracting it to a fixed position, the pressure source is activated again to raise the carrier plate by the air cylinder 41, and the contact ring C
Then, the substrate 2 after the plating process is taken out, and the work is completed.

As described above, according to the electroforming apparatus 1 of this embodiment, the chamber 30 is supplied through the air supply conduit 40.
Since the compressed air is supplied into the inside of the substrate 2 and the main body 4 and the clamper 5 are moved downward with respect to the cathode electrode 3 so as to sandwich the substrate 2, the substrate 2 is different from the conventional one regardless of temperature change. Can be securely clamped with a uniform clamping force. Therefore, the invasion of the plating solution into the gap between the cathode electrode 3 or the clamper 5 and the peripheral edge portion 2a of the substrate 2 can be surely suppressed, and the conventional complicated maintenance work at the time of substrate replacement is unnecessary, The substrate 2 can be stably plated.

FIG. 2 shows a second embodiment of the electroforming apparatus according to the present invention. In the figure, reference numeral 10 is an electroforming device, 2 is a substrate, C is a contact ring, and P is a packing.

The electroforming apparatus 10 has a cathode electrode 13 for supporting the substrate 2, a main body 14 arranged below the cathode electrode 13 so as to be vertically movable relative to the cathode electrode 13, and mounted on the main body 14. The cathode electrode 13 and the clamper 15 that holds the peripheral edge portion 2a of the substrate 2 are provided.

A cylinder 140 is provided inside the main body 14 so as to face the lower surface of the cathode electrode 13, and an air supply pipe 141 communicating with the cylinder 140 is provided inside the main body 4. Cylinder 14
A piston 142 is arranged in the zero position. Then, compressed air is supplied into the cylinder 140 through the air supply line 141, and the piston 142 is raised to abut against the lower surface of the cathode electrode 13, and the reaction force causes the main body 14 and the clamper 15 to contact the cathode electrode. The substrate 2 is clamped by moving the substrate 2 downward with respect to 13.

Further, the main body 14 and the clamper 15 are
An endless ring-shaped packing P0 is provided in the gap between the air supply conduit 143 and the main body 14 and an air supply conduit (second air supply conduit) 143 whose one end faces the packing P0 is provided. Through the packing P0 through the main body 1
4 and the clamper 15 are sealed.

Explaining the electroforming apparatus 10 in more detail, the cathode electrode 13 has a circular shape in a plan view, and a hanging wall portion 13a that hangs downward is formed in the central portion of the lower surface thereof. Has been done. And the cathode electrode 1
3 is fixed to the shaft 16 via the hanging wall portion 13a.

A standing wall portion 13b is formed on the peripheral portion of the upper surface of the cathode electrode 13 so as to stand upward. A step portion 13c is formed at an upper end portion of the standing wall portion 13b, and a peripheral edge portion of the substrate 2 is provided below the step portion 13c, and a contact ring C described later is provided above the step portion 13c.
Are to be placed respectively. The cathode electrode 13 is provided with vertical insertion holes 13d, 13e, and 13f, and a spring 14 to be described later is provided.
4, the carrier lifter 145, and the guide 146 can be inserted.

At the center of the cathode electrode 13, a carrier plate 17 which is raised by the urging force of the spring 144 is arranged. Before the clamper 15 is attached to the main body 14, it rises above the standing wall portion 13b of the cathode electrode 13, and when the substrate 2 is placed, the substrate 2 is then attached as the clamper 15 is attached.
Is stably placed on the standing wall portion 13b of the cathode electrode 13.

The main body 14 has a circular shape in plan view, and an insertion hole 14a is provided in the center thereof. Further, the cylinder 140 is opened so as to face the lower surface of the cathode electrode 13, and the air supply conduit 141 is communicated with the lower side of the cylinder 140. In addition, an air supply line for supplying compressed air to the outside of the stopper is provided on the side of the cylinder 140, and a step 14b is provided on the outer periphery of the main body 14, and the step 14b is provided. A plurality of engaging pins 14c protruding laterally are incorporated in the upper side surface portion. Then, the engaging pin 14c is provided with an engaging groove 15c of the clamper 15 described later.
The clamper 15 can be integrally attached to the main body 14 by engaging with.

The air supply conduit 141 provided inside the main body 14 has one end opening below the cylinder 140 and the other end (not shown) of the shaft 1
A pressure source (not shown) such as a compressor is communicated through the inside of 6. Further, inside the main body 14, a carrier lifter 145, which is inserted into the insertion hole 13e of the cathode electrode 13 and whose tip is fixed to the carrier plate 17, is provided. This carrier lifter 14
A ring-shaped lifter ring 145a is attached to the lower end of the ring 5, and a ring-shaped stopper 145b is arranged outside the lifter ring 145a.
Then, the compressed air supplied from the cylinder 140 and supplied through the air supply line 147 is supplied to the outside of the stopper 145b to move the lifter ring 145a to the stopper 145b.
By pressing with b, the carrier plate 17
It is designed to regulate the rise of the. Furthermore, the main body 14
A guide 146 that is inserted into the insertion hole 13f and restricts the rotation of the cathode electrode 13 is incorporated therein. In the electroforming apparatus 10 of this embodiment, the cylinder 14
0, pistons 142, carrier lifters 145, springs 144, and guides 146 are provided in groups of three each.

The air supply conduit 143 provided inside the main body 14 has one end communicating with the air supply conduit 142 and the other end facing the outside from the lower surface of the step 14b. There is. The packing P0 is provided in the opening at the other end.
Is provided, and by supplying compressed air through the air supply line 143, the packing P0 abuts the lower surface of the step portion 15b of the clamper 15 described later, and the main body 1
The gap between 4 and the clamper 15 is sealed.

The clamper 15 has a ring-shaped appearance, and a protruding wall portion 15a extending toward the center is formed at the inner upper end portion thereof. Then, the substrate 2 is sandwiched via the contact ring C together with the rising wall portion 13c of the cathode electrode 13.
On the lower surface of the clamper 15, the stepped portion 14 b of the main body 14 is provided.
Is provided with a step portion 15b. An engagement groove 15c with which the engagement pin 14c is engaged is formed on the inner surface of the step portion 15b of the clamper 15. This engagement groove 1
Reference numeral 5c is a so-called twist lock type engagement groove in which the engagement pin 14c is locked when the clamper 15 is rotated by a predetermined angle. Further, a pressing pin 15d protruding downward is incorporated in the lower surface of the step portion 15b, so that the clamper 15 can be easily mounted. In this embodiment, the clamper 15 includes an inner clamp 150 and an outer clamp 151.

In the electroforming apparatus 10 of this embodiment, as in the electroforming apparatus 1 of the first embodiment, the contact ring C is interposed between the electrode plate 13 and the substrate 2. , The cathode electrode 13 and the clamper 15 can be obtained with high precision, and the cathode electrode 13 and the substrate 2 can be omitted if the contact between the cathode electrode 13 and the substrate 2 is good.

Next, the operation of the electroforming apparatus 10 of the above embodiment will be described together with the method of using it.

First, the supply of compressed air from the pressure source (not shown) is stopped, and the carrier plate 17 is moved to the cathode electrode 1 by the urging force of the spring 144.
Raise above 3. Clamper 15 at this time
Keep it in a safe position. And the substrate 2
Is placed on the carrier plate 17 with the surface to be plated facing upward. Then contact ring C
Is placed above the substrate 2 and the contact ring C is placed on the substrate 2 on another place, and the carrier plate 17 is gradually lowered so that the lower surface of the substrate 2 at the peripheral edge 2a is the cathode electrode 13 described above. The standing wall portion 13b is positioned and placed on the lower stage of the step portion 13c. Then, in this state, the pressurizing source is operated to supply compressed air through the air supply line and the line, and the stopper is pressed inward to restrict the lift of the lifter ring 145a of the carrier lifter 145.

Then, the clamper 15 that has been saved
Is placed above the carrier plate 17 and gradually lowered. Then, the engaging pin 14c of the main body 14 and the engaging groove 5c of the clamper 15 are engaged with each other, and the clamper 15 is further rotated by a predetermined angle to securely attach the clamper 15 to the main body 14. At this time, the substrate 2
Is sandwiched between the lower end surface of the protruding wall portion 15a of the clamper 15 and the standing wall portion 13b of the cathode electrode 13 via a contact ring C.

Next, the supply of compressed air from a pressure source (not shown) is increased to further pressurize the piston 142.
Raise above the cylinder. And piston 1
42 is brought into contact with the lower surface of the cathode electrode 13, and by the reaction force thereof, the main body 14 and the clamper 15 are moved downward with respect to the cathode electrode 13 and the peripheral portion 2 of the substrate 2 is moved.
Hold a securely.

Then, in this state, a plating solution is supplied onto the substrate 2, an anode (not shown) is further arranged, and the surface of the substrate 2 is plated with this plating solution.

After performing the desired plating treatment, the surface of the substrate 2 is washed. Then, the compressed air supply by the pressure source is loosened to such an extent that the clamper 15 can be removed from the main body 14 so that the carrier plate 17 does not rise carelessly.

Then, after removing the clamper 15 and retreating it to a fixed position, the pressure source is stopped to stop the stopper 1.
Stop pressing the lifter ring 145a by 45b,
The carrier plate 17 is moved upward by the urging force of the spring 144, the contact ring C and the substrate 2 after the plating treatment are taken out, and the operation is completed.

As described above, the electroforming apparatus 10 according to the present embodiment.
According to the above, compressed air is supplied into the cylinder 140 through the air supply line 141, the piston 142 is moved up to abut against the lower surface of the cathode electrode 13, and the reaction force causes the main body 14 and the clamper 15 to move. Since the substrate 2 is sandwiched by moving the substrate 2 downward with respect to the cathode electrode 13, the substrate 2 is not affected by temperature change as compared with the conventional case.
Can be securely clamped with a uniform clamping force. Therefore, it is possible to surely prevent the plating solution from entering the gap between the cathode electrode 13 or the clamper 15 and the peripheral edge portion 2a of the substrate 2, and the complicated maintenance work at the time of replacing the substrate, which is required in the related art, is unnecessary. The substrate 2 can be stably plated.

The compressed air is supplied through the air supply line 143 to press the packing P0 to seal the gap between the main body 14 and the clamper 15. The main body is not affected by temperature change. The tightness between 14 and the clamper 15 is also improved. Therefore, even if the electroforming apparatus 10 is immersed in the plating solution, it is possible to reliably prevent the plating solution from entering through the gap between the main body 14 and the clamper 15.

As the anode (not shown), the plating solution (not shown), the substrate and the like in the electroforming apparatus according to the present invention, known ones which have been conventionally applied to the electroforming apparatus can be applied. .

The electroforming apparatus according to the present invention can be appropriately changed in size, shape and the like without departing from the object of the present invention.

For example, in each of the above embodiments, the air cylinder 41 and the guide 44 (the electroforming apparatus 1 of the first embodiment), the cylinder 140, the piston 142,
The carrier lifters 145, the springs 144, and the guides 146 (the electroforming apparatus 10 of the second embodiment) are arranged in three sets, but the number of these units is not limited to three, and the number of the substrates is not limited to three. It can be appropriately changed depending on the shapes of the clamper and the main body, and the like.

In each of the above embodiments, the packing is a so-called O
Although a ring is used, packing of other shape, for example,
It is also possible to use an X packing having an X-shaped cross section, a U packing having a U-shaped cross section, or the like.

The electroforming apparatus according to the present invention is the C of the above embodiment.
Needless to say, the present invention is not limited to the application to the electroforming device that constitutes the D mastering device.
By appropriately selecting the plating liquid and the substrate, for example, it can be suitably used as an electroforming device that constitutes a device for performing a plating process on a substrate such as a magneto-optical disk.

[0059]

According to the electroforming apparatus of the present invention, the following effects can be obtained. According to the electroforming apparatus according to claim 1, compressed air is supplied into the chamber through the air supply line, and the main body and the clamper are moved downward with respect to the cathode electrode to sandwich the substrate. Therefore, compared to the prior art, the substrate can be reliably clamped with a uniform clamping force regardless of temperature changes, and by reliably clamping the substrate in this way, the cathode electrode or clamper and the It is possible to reliably prevent the plating solution from entering the gap with the substrate. Therefore, complicated maintenance work such as wiping off the plating grown on the cathode electrode and the like when replacing the substrate is not required. Then, the plating process can be stably applied to the substrate.

According to the electroforming apparatus according to the second aspect, similar to the electroforming apparatus according to the first aspect, it is possible to obtain a uniform and strong clamping force regardless of the temperature change, and it is possible to replace the substrate. It is possible to perform stable plating on the substrate without the need for complicated maintenance work.

According to the electroforming apparatus of claim 3,
In addition to the effect of the electroforming apparatus according to Item 2 , the intrusion of the plating solution through the gap between the main body and the clamper can be surely suppressed regardless of the temperature change.

[Brief description of drawings]

FIG. 1 is a front sectional view of an essential part showing a first embodiment of an electroforming apparatus according to the present invention.

FIG. 2 is a front sectional view of an essential part showing a second embodiment of the electroforming apparatus according to the present invention.

[Explanation of symbols]

1, 10 Electroforming equipment 2 substrates 3, 13 Cathode electrode 4, 14 body 5,15 Clamper 40, 141 Air supply line (first air supply line) 143 Air supply line (second air supply line) P0 packing

Continuation of the front page (56) Reference JP 62-272445 (JP, A) JP 8-333695 (JP, A) JP 8-124895 (JP, A) JP 4-183888 (JP , A) Actual development Sho 61-191467 (JP, U) Patent 2974761 (JP, B2) (58) Fields investigated (Int.Cl. ⁷ , DB name) C25D 1/00 G11B 7/26

Claims (3)

(57) [Claims] A cathode electrode 1. A is moved vertically fixed non supporting a substrate (2) (3), the relatively movable up and down relative to the cathode electrode (3) at the lower of the cathode electrode (3) and disposed the body (4), the substrate is mounted with the cathode electrode (3) to the body (4)
A electroforming apparatus and a clamper (5) to the peripheral edge portion (2a) for clamping the (2), provided with a chamber (30) to the lower surface of the cathode electrode (3), said body (4) inside and provided feed duct which Ru leading to the chamber (30) to (40), the chamber through the supply duct (40) (30)
Compressed air is supplied into the main body (4) and the clamper (5) is moved downward with respect to the cathode electrode (3 ) to sandwich the substrate (2). And electroforming equipment. 2. A cathode electrode (1 ) supporting a substrate (2).
And 3), the cathode electrode (13) body that is disposed relatively movable up and down relative to (14), is attached to the body (14) with the cathode electrode in the lower of the cathode electrode (13) (13) Along with the peripheral portion of the substrate (2)
An electroforming apparatus comprising a clamper (15 ) for sandwiching (2a) , wherein a cylinder (140) is provided inside the main body (14) , the cylinder (140) facing the lower surface of the cathode electrode (13) and opening. First air supply line leading to the cylinder (140)
(141) is provided, and the piston (142 ) is provided in the cylinder (140) , and the cylinder is provided through the first air supply line (141).
Compressed air is supplied into the (140) , and the piston (14
2) is raised and brought into contact with the lower surface of the cathode electrode (13) , and the reaction force causes the main body (14) and the clamper (15) to move downward with respect to the cathode electrode (13) . An electroforming device, characterized in that the substrate (2) is sandwiched. 3. The body (14) and the clamper (1 )
5) , a packing (P0) is interposed in the gap between the main body (14) and a second air supply conduit (143) whose one end faces the packing ( P0 ) is provided in the main body (14) .
The electroforming apparatus according to claim 2 , wherein the packing (P0) is pressed through the (143) to seal the main body (14) and the clamper (15) .