JP3442906B2 - Electroforming equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming apparatus for supplying a plating solution to the upper surface of a substrate to plate the surface thereof.

[0002]

2. Description of the Related Art As is well known, in a CD mastering process, data created by premastering is recorded on a magnetic tape, a premastered CD or the like, and is first applied to the surface of a glass master disk based on the data. Laser light is applied to the photosensitizer to expose it to create a glass master,
In the development process, pits are formed on the resist surface, then a metal master is created from this glass master by electroless plating, and then a metal mother is created by electroplating from this metal master, and finally by electroplating from this metal mother. Creating a stamper.

As a conventional technique for electroplating in the mastering step, there is a main body having a cathode electrode for supporting a substrate having a recess on the upper end surface thereof, and the cathode provided in the recess of the cathode electrode. There is known an electroforming apparatus which includes an electrode and a clamper that holds the peripheral edge of the substrate via a contact ring, and supplies a plating solution onto the substrate to plate the surface of the substrate.

[0004]

By the way, in the above electroforming apparatus, since the twist lock mechanism is provided between the clamper and the main body and the substrates to be plated are clamped by mechanically tightening them, the temperature Clamping force changed due to the change, and uniform clamping force could not be obtained. Also,
A strong clamping force could not be obtained because friction loss occurs when the substrate is clamped with the clamper.

Then, due to such changes in the clamping force,
The plating solution penetrates into the gap between the cathode electrode or contact ring and the substrate, and the components of this plating solution are deposited on the cathode electrode, etc., and in extreme cases, not only the substrate but also the cathode electrode or contact ring is plated. It was If the deposit derived from the plating solution or the growth of the plating on the cathode electrode or the contact ring is left as it is, the current density becomes nonuniform and the thickness of the plating becomes uneven. In addition, the total resistance increases due to a partial contact failure, and the output voltage of the constant current power supply connected to the electroforming equipment rises, so the safety circuit operates and the electroforming equipment stops and work is stopped. Sometimes it was interrupted. Furthermore, the local current concentration may cause partial burnout of the substrate, the cathode electrode, or the contact ring.

Therefore, so far, the above-mentioned precipitation unevenness,
In order to prevent work interruption and burnout of the substrate, etc., it is necessary to wipe off the deposits and plating derived from the plating solution grown on the cathode electrode or contact ring every time the substrate is replaced, which makes maintenance work at the time of substrate replacement complicated. Was becoming.

An object of the present invention is to provide an electroforming apparatus which does not require complicated maintenance work at the time of exchanging a substrate and can stably perform plating processing on the substrate.

[0008]

According to a first aspect of the present invention, there is provided a cathode electrode for supporting a substrate, a main body disposed below the cathode electrode, and movable up and down with respect to the main body. And a clamper that is mounted on the main body via the engaging jig to clamp the peripheral edge of the substrate together with the cathode electrode, and in the main body, An air supply conduit is provided, one end of which opens toward the engaging jig, compressed air is supplied through the air supplying conduit, and the engaging jig is pressed downward to attach the clamper to the cathode electrode. The above object is achieved by providing an electroforming apparatus characterized in that the substrate is sandwiched by moving it downward.

According to a second aspect of the present invention, in the electroforming apparatus according to the first aspect, a cylinder chamber is provided at the one end of the air supply line, and a piston is provided in the cylinder chamber. And, there is provided an electroforming apparatus characterized in that compressed air is supplied into the cylinder chamber through the air supply line, and the engaging jig is pressed downward through the piston. is there.

[0010]

In the electroforming apparatus according to the first aspect of the present invention, compressed air is supplied through the air supply line and the engaging jig is pressed downward to move the clamper downward with respect to the cathode electrode. , To clamp the substrate,
Uniform clamping force can be obtained regardless of temperature change.

In the electroforming apparatus according to the second aspect of the present invention, a cylinder chamber is provided at the one end of the air supply line, and a piston is provided in the cylinder chamber, and the cylinder chamber is provided through the air supply line. Compressed air is supplied to press the engaging jig downward through the piston. Therefore, in addition to the function of the electroforming apparatus according to claim 1, the engaging jig is securely operated. It can be pressed downward and the shape of the engaging jig is not complicated.

[0012]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 shows an electroforming apparatus which constitutes a part of a CD mastering apparatus which is an embodiment of the electroforming apparatus according to the present invention. In the figure, reference numeral 1 is an electroforming device, 2 is a substrate to be plated, C is a contact ring, and P is a substrate.
Indicates packing.

As shown in FIG. 1, the electroforming apparatus 1 is
The cathode electrode 3 supporting the substrate 2, the main body 4 arranged below the cathode electrode 3, the engaging jig 5 arranged vertically movable with respect to the main body 4, and the engaging jig 5 are provided. Through the body 4
And a clamper 6 that clamps the peripheral portion 2a of the substrate 2 together with the cathode electrode 3, and supplies a plating solution onto the substrate 2 to plate the surface of the substrate 2.

Inside the main body 4, there is provided an air supply conduit 40, one end of which opens so as to face the engaging jig 5, and the cylinder chamber 41 is provided at one end of the air supply conduit 40. Is provided. Further, a piston 42 is arranged in the cylinder chamber 41. Then, compressed air is supplied into the cylinder chamber 41 through the air supply conduit 40, the engaging jig 5 is lowered by the piston 42, and the clamper 6 is moved downward with respect to the cathode electrode 3. The substrate 2 is sandwiched.

Explaining the electroforming apparatus 1 in more detail, the cathode electrode 3 has a circular shape in a plan view, and a hanging wall portion 3a hanging downward is formed in the central portion of the lower surface thereof. Has been done. The cathode electrode 3 is fixed to the shaft 7 via the hanging wall portion 3a.

At the peripheral portion of the upper surface of the cathode electrode 3, there is formed a standing wall portion 3b which stands upward. A step portion 3c is formed on an upper end portion of the standing wall portion 3b, and a peripheral portion of the substrate 2 is placed below the step portion 3c, and a contact ring C described later is placed above the step portion 3c. It is designed to work. The cathode electrode 3 is provided with a vertical insertion hole 3d so that a carrier lifter 44 described later can be inserted therein.

At the center of the cathode electrode 3, there is arranged a carrier plate 8 for transferring the substrate 2 in tandem with a lifter plate 9 which is raised by the urging force of a spring 45 described later. This carrier plate 8
Has risen above the standing wall portion 3b of the cathode electrode 3 before the clamper 6 is attached to the main body 4, and when the substrate 2 is placed, the substrate 2 is then removed as the clamper 6 is attached. The cathode electrode 3 is stably placed on the standing wall portion 3b.

The main body 4 has a circular shape in plan view, and an insertion hole is provided in the center thereof. The main body 4 is composed of a main base 4a and a sub-base 4b fixed thereon. Main base 4a and sub-base 4b
A ring-shaped movement space S for vertically moving an engaging jig 5 to be described later is provided between and. The cylinder chamber 41 is formed in a ring shape at one end of the air supply pipe 40 and below the sub-base 4b, and its opening is provided so as to face the engaging jig 5. An air supply conduit 43 for supplying compressed air to the outside of a stopper 44b, which will be described later, is provided above the cylinder chamber 41. The piston 42 is a cylinder chamber 41.
It has a ring shape corresponding to the above, and is adapted to press the engaging jig 5 described later downward by the supply of compressed air through the air supply conduit 40. In addition, a step portion 4c is provided on the peripheral portion of the main body 4 by making the peripheral portion of the sub-base 4b higher than that of the main base 4a.

Air supply line 4 provided inside the main body 4
In 0, one end is the cylinder chamber 41, and the other end (not shown) communicates with a pressure source (not shown) such as a compressor through the inside of the shaft 7. Also,
A carrier lifter 44, which is inserted into the insertion hole 3d of the cathode electrode 3 and whose front end is fixed to the carrier plate 8, is arranged in the main body 4. The lower end of the carrier lifter 44 is fixed to the lower surface of the lifter plate 9 together with the ring-shaped lifter ring 44a. A pin-shaped stopper 44b is provided outside the lifter ring 44a, and the cylinder chamber 41
The compressed air supplied through the air supply line 43 from the outside is supplied to the outside of the stopper 44b, and the lifter ring 44
By pressing a with the stopper 44b, the rise of the carrier plate 8 is regulated.
In the electroforming apparatus 1 of this embodiment, three carrier lifters 44, three stoppers 44b, and three springs 45 are provided.

The engaging jig 5 is provided in the cylinder chamber 41.
And a plurality of engagement pins 5b fixed to the clamp ring 5. The engaging portion 5c of the engaging pin 5b is the sub-base 4 described above.
It is provided so as to project outward from the side surface of the peripheral edge portion of b. The engaging portion 5c of the engaging pin 5b is engaged with the engaging groove 6c of the clamper 6 described later so that the clamper 6 can be integrally mounted on the main body 4.

The clamper 6 has a ring-shaped appearance, and a protruding wall portion 6a extending toward the center is formed at the inner upper end portion thereof. Then, together with the standing wall portion 3c of the cathode electrode 3, the contact ring C
The substrate 2 is sandwiched via the. A step portion 6b corresponding to the step portion 4c of the main body 4 is provided on the lower surface of the clamper 6. Further, an engagement groove 6c with which the engagement portion 5c of the engagement pin 5b is engaged is formed on the inner surface of the stepped portion 6b of the clamper 6. This engaging groove 6c is
It is a so-called twist lock type engagement groove in which the engagement pin 4c is locked when the clamper 6 is rotated by a predetermined angle. Further, a pressing pin 6d protruding downward is incorporated on the lower surface of the stepped portion 6b so that the clamper 6 can be easily mounted. In this embodiment,
The clamper 6 is composed of an inner clamper 60 and an outer clamper.

In the electroforming apparatus 1 of this embodiment,
Similar to the electroforming apparatus 1 of the first embodiment, the cathode electrode 3
Although the contact ring C is interposed between the substrate 2 and the substrate 2, it is omitted when the cathode electrode 3 and the clamper 6 are accurately obtained and the contact between the cathode electrode 3 and the substrate 2 is good. Can be done.

Next, the operation of the electroforming apparatus 1 of the above embodiment will be described.
It will be described together with its usage.

First, the supply of compressed air from a pressure source (not shown) is stopped, and the carrier plate 8 is further raised above the cathode electrode 3 by the urging force of the spring 45. At this time, the clamper 6 is retracted to a position where it does not interfere. Then, the substrate 2 is placed on the carrier plate 8 with the surface to be plated facing up. Next, after the contact ring C is arranged above the substrate 2, the contact ring C is placed on the substrate 2.

The retracted clamper 6 is placed above the carrier plate 8 and gradually lowered, and the step portion 6b of the clamper 6 pushes down the peripheral edge portion of the lifter plate 9 to lower the carrier plate 8. Gradually descend. Then, the substrate 2 is placed with the lower surface of the peripheral edge portion 2a thereof being positioned below the step portion 3c of the standing wall portion 3b of the cathode electrode 3. In this state,
The pressure source is operated to supply compressed air through the air supply lines 40 and 43, and the stopper 44b is pressed inward to restrict the lift of the lifter ring 44a of the carrier lifter 44.

Then, the engaging portion 5c of the engaging pin 5b of the main body 4 and the engaging groove 6c of the clamper 6 are engaged with each other, and the clamper 6 is further rotated by a predetermined angle so that the clamper 6 is attached to the main body 4. Be sure to attach it securely. At this time, the substrate 2 is sandwiched between the lower end surface of the protruding wall portion 6a of the clamper 6 and the standing wall portion 3b of the cathode electrode 3 via the contact ring C.

Next, the supply of compressed air from a pressure source (not shown) is increased to further pressurize, and the piston 42 is lowered below the cylinder chamber 41. Then, the piston 42 is brought into contact with the upper surface of the clamp ring 5 a to press the engaging jig 5 downward, the clamper 6 is moved downward with respect to the cathode electrode 3, and the peripheral portion 2 of the substrate 2 is moved.
Hold a securely.

Then, in this state, a plating solution is supplied onto the substrate 2, an anode (not shown) is further arranged, and the surface of the substrate 2 is plated with the plating solution.

After performing the desired plating treatment, the surface of the substrate 2 is washed. Then, the supply of compressed air by the pressure source is loosened to the extent that the clamper 6 can be removed from the main body 4 so that the carrier plate 8 does not rise carelessly.

Then, after removing the clamper 6 and retreating it to a fixed position, the pressure source is stopped to stop the stopper 44.
The pressing of the lifter ring 44a by b is stopped, the lifter plate 9 is lifted by the urging force of the spring 45, and the carrier plate 8 is lifted up. The contact ring C and the substrate 2 after the plating treatment are taken out, and the work is completed. To do.

As described above, according to the electroforming apparatus 1 of the present embodiment, the cylinder chamber 4 is supplied through the air supply conduit 40.
1, compressed air is supplied, the piston 42 is lowered, the engaging jig 5 is pressed downward, the main body 4 and the clamper 6 are moved downward with respect to the cathode electrode 3, and the substrate 2 is clamped. Therefore, compared to the conventional case, the substrate 2 can be reliably clamped by the uniform clamping force regardless of the temperature change. Therefore, the infiltration of the plating solution into the gap between the cathode electrode 3 or the clamper 6 and the peripheral edge portion 2a of the substrate 2 can be surely suppressed, and the conventional complicated maintenance work at the time of substrate exchange can be dispensed with. The substrate 2 can be stably plated.

In the electroforming apparatus 1, the piston 42
Since the engaging jig 5 is pressed downward via the
The pressing force can be uniformly applied to the engaging jig 5 to reliably push the engaging jig 5 downward, and the engaging jig 5 does not have a complicated shape.

As the anode (not shown), the plating solution (not shown), the substrate and the like in the electroforming apparatus according to the present invention, those known as those conventionally applied to the electroforming apparatus can be applied. .

The electroforming apparatus according to the present invention can be appropriately changed in size, shape and the like without departing from the object of the present invention.

For example, in the above-mentioned embodiment, the carrier lifters 44 and the springs 45 are provided in the number of three, but the number of these is not limited to three, and the substrate, the clamper and the main body are not limited thereto. It can be appropriately changed according to the shape and the like.

Further, in the above embodiment, the engaging jig 5 is pressed downward by the piston 42 arranged in the cylinder chamber 41 of the main body 4, but the piston 42 is clamped by the clamp ring of the engaging jig 5. 5a or engaging jig 5
And the piston 42 are integrally provided so that the air supply line 40
It is also possible to supply compressed air from the above to press the engaging jig 5 downward, and in this case also, the same effect as in the above embodiment can be obtained.

Further, in the above embodiment, the packing is so-called O.
Although a ring is used, packing of other shape, for example,
It is also possible to use an X packing having an X-shaped cross section, a U packing having a U-shaped cross section, or the like.

The electroforming apparatus according to the present invention is the C of the above embodiment.
Needless to say, the present invention is not limited to the application to the electroforming device that constitutes the D mastering device.
By appropriately selecting the plating liquid and the substrate, for example, it can be suitably used as an electroforming device that constitutes a device for performing a plating process on a substrate such as a magneto-optical disk.

[0040]

According to the electroforming apparatus of the present invention, the following effects can be obtained. According to the electroforming apparatus of claim 1, compressed air is supplied through the air supply line, and the engaging jig is pressed downward to move the clamper downward with respect to the cathode electrode. Since the substrate is clamped, the substrate can be reliably clamped regardless of the temperature change as compared with the conventional case, and the cathode peripheral portion or the clamper can be reliably clamped by the peripheral edge of the substrate as described above. With this, it is possible to surely prevent the plating liquid from entering the gap between the substrate and the peripheral portion. Therefore, complicated maintenance work such as wiping off the plating grown on the cathode base or the like when replacing the substrate is not required.
Then, the plating process can be stably applied to the substrate.

According to the electroforming apparatus of the second aspect, the compressed air is supplied to the cylinder chamber through the air supply line, and the engaging jig is pressed downward through the piston. In addition to the effect of the electroforming apparatus according to the first aspect, the engaging jig can be pressed more reliably downward.

[Brief description of drawings]

FIG. 1 is a front sectional view of an essential part showing an embodiment of an electroforming apparatus according to the present invention.

[Explanation of symbols]

1 Electroforming equipment 2 substrates 3 cathode electrode 4 body 40 air supply line 41 cylinder chamber 42 piston 5 Engaging jig 6 clamper

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 62-272445 (JP, A) JP 8-325777 (JP, A) JP 8-124895 (JP, A) JP 4- 183888 (JP, A) Actual development Sho 61-191467 (JP, U) Patent 2974761 (JP, B2) (58) Fields investigated (Int.Cl. ⁷ , DB name) C25D 1/00 G11B 7/26

Claims (2)

(57) [Claims] 1. Cathode electrode supporting a substrate (2)
And (3), a body (4) disposed below the cathode electrode (3), and engaging the jig which is vertically movable disposed relative to the body (4) (5), the A clamper that is mounted on the main body (4) via an engaging jig (5) and holds the peripheral edge portion (2a) of the substrate (2) together with the cathode electrode (3).
(6) , and an air supply conduit (40) having one end opening toward the engaging jig is provided in the main body (4) , and the air supply conduit (40) is provided through the air supply conduit (40) . Compressed air is supplied and the engaging jig (5) is pressed downward to move the clamper (6) downward with respect to the cathode electrode (3) so that the substrate (2) is clamped. An electroforming device characterized by being made. 2. The cylinder chamber (41) is provided at the one end of the air supply line (40) , and the cylinder chamber (41) is provided.
A piston (42) is arranged in (41) , and the cylinder chamber (4 ) is provided through the air supply line (40).
2. The electroforming apparatus according to claim 1, wherein compressed air is supplied into the inside of 1) and the engaging jig (5) is pressed downward through the piston (42). .