JP3439638B2 - Plasma addressed liquid crystal display - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a flat display device and a manufacturing method thereof, and more particularly to a structure of a plasma addressed liquid crystal display device and a manufacturing method thereof.

[0002]

2. Description of the Related Art The structure of a conventional plasma addressed liquid crystal display device (PALC) will be described with reference to FIG. Hereinafter, the plasma addressed liquid crystal display device is basically a PAL.
Called C.

The PALC shown in FIG. 18 has an anode electrode 121, a cathode electrode 122 and a plasma substrate 12.
3, the partition wall 124, the dielectric layer 125, and the liquid crystal 132.
A signal electrode 134, a substrate 136, and a conductor 142.

Information from a backlight (not shown) installed on the side of the plasma substrate is displayed on the PALC by the dimming action of the liquid crystal. For this reason, the dielectric layer interposed between the backlight and the liquid crystal must transmit visible light well. In addition, the induced plasma channel rows must be insulated from each other in order to prevent problems such as crosstalk in the plasma scanning direction. Glass was the most suitable material for satisfying those conditions.

Japanese Unexamined Patent Publication No. 4-313788 discloses a method shown in FIG.
Discloses the PALC shown in FIG.

In the PALC disclosed in Japanese Unexamined Patent Publication No. 4-313788, a conductor 142 is embedded in a dielectric layer 125 so as to correspond to a pixel, and the surface of the dielectric layer 125, which is in contact with the liquid crystal 132, is transparent for each pixel. Form a pattern of electrodes.

[0007]

[Patent Document 1] Japanese Patent Application Laid-Open No. 4-31378
The PALC disclosed in Japanese Patent No. 8 has the following problems 1 to 4.

1. The charge distribution in the plasma chamber during surface discharge plasma discharge of the virtual electrode is spatially non-uniform. Therefore, the charge distribution on the lower surface (inside the room) of the dielectric layer 125 becomes uneven. Similarly, the charge distribution of the virtual electrode becomes unstable in terms of area.

2. The position of the conductor 142 embedded in the aperture ratio dielectric layer 125 is
Since it corresponds to a pixel, the aperture ratio of the pixel is reduced by the cross-sectional area of the conductor 142.

3. The voltage V _LC applied to the liquid crystal 132 is the voltage applied between the anode electrode 121 and the signal electrode 134 on the color filter unit side via the dielectric layer 125 on the plasma side. . When the voltage V _LC applied to the liquid crystal is expressed by a capacitive coupling model,
It looks like this:

[0011] _{V LC = V · ε G ·} d LC / (ε G · d LC + ε LC · d G) However, the signal voltage is V, the dielectric constant of the liquid crystal and epsilon _LC,
The thickness is d _LC , the dielectric constant of the dielectric layer is ε _G , and the thickness is d _G.

Dielectric constant ε _LC of general liquid crystal = 6.7, thickness d _LC = 6 μm of liquid crystal thereof, dielectric constant ε _G = 5.8 of general thin glass plate, thickness d _G = 50 μm of thin glass plate Is substituted into the above equation, the voltage V _LC applied to the liquid crystal is V _LC = 0.09.
It becomes 4V.

However, since the dielectric constant of the liquid crystal changes depending on the voltage applied to the liquid crystal, the voltage V _LC applied to the liquid crystal does not become 0.094V.

4. Data Driver Normally, a voltage of about 5V is required to drive the liquid crystal. In the model shown in the above 3, a voltage of 53V is required as the data voltage applied to the signal electrode. Therefore, the power consumption of the driver increases. Further, in order to manufacture such a driver, a semiconductor process having a high breakdown voltage is required.

In view of the above problems, it is an object of the present invention to provide a PALC having a dielectric layer having sufficient strength without lowering the aperture ratio, and a method for manufacturing the dielectric layer.

[0016]

A plasma address according to the present invention.
The liquid crystal display device is formed on a substrate and the substrate.
A plurality of anode electrodes and a plurality of cathode electrodes;
One of the plurality of cathode electrodes is connected to an adjacent cathode electrode.
A plurality of electrodes formed on the substrate to isolate the poles.
Partition wall, first surface, and second surface opposite to the first surface
And a conductor between the first surface and the second surface.
And the substrate, the plurality of partition walls, and the second surface are vacant.
And a dielectric forming an inter-region.
A first region having conductivity is formed on the first surface, and
The first region is the area between the first surface and the second surface.
At least one of the plurality of partition walls is electrically connected to a conductor.
One has a notch, and the first surface and the second surface
The conductor between is located above the notch, and
By doing so, the above object is achieved.

[0017]

[0018]

The notch may be ground by sandblasting while masking predetermined portions of the plurality of partition walls.

The plasma addressed liquid crystal display device and / or the other plasma addressed liquid crystal display device may further include a color filter substrate and a liquid crystal layer, and the liquid crystal layer may be sandwiched between the dielectric and the color filter substrate. .

The plasma addressed liquid crystal display device and / or the other plasma addressed liquid crystal display device further comprises first and second polarizing plates, and the color filter substrate and the substrate are the first and second polarized lights. It may be sandwiched between plates.

The plasma addressed liquid crystal display device and / or the other plasma addressed liquid crystal display device may be arranged between the first polarizing plate and the color filter substrate or between the second polarizing plate and the substrate. A retardation plate may be installed.

The plasma addressed liquid crystal display device and / or the other plasma addressed liquid crystal display device may further include a backlight.

A step of heating a glass plate to a temperature above its melting temperature by a dielectric of the plasma addressed liquid crystal display device; and a step of penetrating a plurality of regularly arranged metal wires in the thickness direction of the glass plate. It may be manufactured by a method including a step of cutting the plurality of metal wires and a step of polishing the surface of the glass plate to smooth the surface of the glass plate.

The dielectric of the plasma addressed liquid crystal display device comprises a step of regularly arranging a plurality of metal particles, a step of filling a space between the plurality of metal particles with glass powder, and a step of bringing the glass powder to a melting temperature or higher. Heating and applying pressure.

According to a method, the dielectric of the plasma addressed liquid crystal display device includes the steps of heating a glass plate to a temperature above its melting temperature and regularly implanting a plurality of metal particles into the glass plate in a line. It may be manufactured.

The dielectric of the plasma addressed liquid crystal display device heats the glass plate to its melting temperature or higher, the step of installing a linear metal electrode on the first surface of the glass plate, and the linear electrode. Is installed on a second surface of the glass plate opposite to the first surface, and a positive high voltage is applied to the metal electrode to cause migration of the metal in the thickness direction of the glass plate. May be applied.

The operation will be described below.

A plate-shaped or rod-shaped dielectric having a structure in which a region having conductivity in the thickness direction, a region having conductivity in the direction perpendicular to the thickness direction, and a region having insulation properties are regularly arranged, and the conductive portion has a resistance value of Must be low. As a material for the conductive portion, a metal material having no light transmissivity is usually selected. The conductive portion is located so as to correspond to the partition wall and is connected to the transparent electrode corresponding to the pixel. That is, this conductive portion is arranged in the non-opening portion.
Therefore, the aperture ratio does not decrease. As a dielectric,
Anisotropic conductive glass can be used. When the plasma addressed liquid crystal display device is of a reflective type, the electrodes of the pixel portion may not be transparent.

A notch may be formed in a corresponding portion of the partition wall so as to expose the conductive portion in the thickness direction of the dielectric to the inside of the plasma chamber.

Further, it is a plate-like or rod-like dielectric having a structure having conductivity in the thickness direction, and regularly arranging a region having conductivity and a region having insulation in a direction perpendicular to the direction, The electrodes can also be patterned to correspond to areas where the electrodes are conductive on both sides of the dielectric. For this reason, the charge distribution of the virtual electrodes becomes uniform, and a planarly uniform data voltage is applied to the liquid crystals corresponding to the pixels. The uneven distribution of the brightness of PALC is eliminated, and the contrast becomes sufficient.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
It is a figure which shows the cross section of PALC10 in embodiment.
The PALC 10 has a plasma switch unit 20 and a color filter unit 30. 2 is a diagram showing a cross section of the plasma switch unit 20 of the PALC 10 of FIG.
[Fig. 3] is a view of a part of the plasma switch unit 20 of Fig. 2 seen from above. The plasma switch unit 20 includes the anode electrode 2
1, a cathode electrode 22, a plasma substrate 23, a partition wall 24, and a dielectric substrate 25.

Anode electrodes 21 and cathode electrodes 22 are arranged in stripes on the plasma substrate 23. A partition wall 24 is arranged on the anode electrode 21. The cathode electrode 22 is separated from the adjacent cathode electrode 22 by the partition wall 24. In a region surrounded by the dielectric substrate 25, the plasma substrate 23 and the partition wall 24,
A plasma generation region 26 is formed. The plasma generation region 26 is evacuated and then filled with a rare gas. This is for causing plasma discharge in the plasma generation region 26.
The plasma substrate 23 has at least one exhaust hole for making the air in the plasma generation region a vacuum. In addition,
The plasma switch unit 20 may further include a polarizing plate 27 and a backlight 28 that emits surface light.

The structure of the dielectric substrate 25 will be described below.

The dielectric substrate 25 has a first surface and a second surface facing the first surface. A conductor 42 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 25. The conductor 42 corresponds to each pixel.

A transparent electrode 41 is formed on the second surface of the dielectric substrate 25. The electrode 41 is formed on the second surface by depositing ITO on the second surface and patterning the deposited ITO. The electrode 41 formed on the second surface corresponds to each pixel. The electrode 41 formed on the second surface is electrically connected to the conductor 42. An alignment film is formed on the first surface of the dielectric substrate 40, as will be described later.

In this embodiment, the plasma substrate 23 is a glass substrate and its thickness is about 2 mm. The dielectric substrate 25 is a glass substrate. Dielectric substrate 25
Is preferably anisotropic conductive glass.

The color filter section 30 includes a liquid crystal 32, a signal electrode 34, a color filter 35, a substrate 36, and a polarizing plate 37.

A black matrix (not shown) and a color filter 35 are arranged on the substrate 36. The signal electrode 34 is disposed on the color filter 35. The signal electrode 34 is made of ITO. Liquid crystal 32
Are filled between the signal electrode 34 and the dielectric substrate 25 of the plasma switch section 20.

A method of manufacturing the plasma switch section 20 will be described below.

An anode electrode 21 and a cathode electrode 22 are formed on the plasma substrate 23. The anode electrode 21 and the cathode electrode 22 are formed by applying the Ni paste to the plasma substrate 23 and then firing the applied paste. Screen printing may be used as a method of applying the Ni paste.

The partition wall 24 is formed by screen-printing a glass paste on the anode electrode several times and firing it. The height of the partition wall 24 is about 200 μm.

In order to make the height of the formed partition walls 2 uniform, the partition walls 24 are polished.

In order to connect the partition wall 24 and the dielectric substrate 25, glass frit is linearly applied to the peripheral portion of the dielectric substrate 25. The conductor 4 which becomes the light shielding portion of the dielectric substrate 25
The partition wall 24 and the dielectric substrate 25 are connected so that the partition wall 2 is located above the partition wall 24. The connected ones are fired, air is exhausted to about 10 ⁻⁶ Torr from the exhaust port, and a rare gas is filled up to several tens Torr. afterwards,
The exhaust port is closed.

The method of manufacturing the color filter section 30 will be described below.

A black matrix (not shown) and a color filter 35 are formed on a substrate 36, and a stripe-shaped signal electrode 34 corresponding to each pixel of RGB is formed on the color filter 35. It The direction in which the signal electrode 34 is formed depends on the plasma switch unit 20.
This is a direction substantially orthogonal to the direction in which the partition wall 24 is formed when the and the color filter section 30 are combined.

An alignment film is applied to the signal electrode 34 and the dielectric substrate 25 of the plasma switch section 20, and the alignment film is baked. Then, the baked alignment film is rubbed. At least two holes are formed in the substrate 36 to exhaust air when injecting the liquid crystal. A hole for injecting liquid crystal is formed in a portion which is a non-display portion of the CF substrate. The plasma switch unit 20 and the color filter unit 30 are arranged so that the rubbing directions are orthogonal to each other.
A spacer is provided between the signal electrode 34 and the dielectric substrate 2 so that a constant gap is maintained between the signal electrode 34 of the color filter unit 30 and the dielectric substrate 25 of the plasma switch unit 20.
It is arranged between 5 and 5. After that, the liquid crystal 32 is filled between the signal electrode 34 and the dielectric substrate 25 of the plasma switch section 20. Then, the liquid crystal 32 is sealed by the sealing material, and the liquid crystal 32 is heated in order to realign the liquid crystal.

The dielectric substrate 25 has a first surface and a second surface facing the first surface. The alignment film described above is formed on the first surface, and the transparent electrode 41 is formed on the second surface.
Is formed. The electrode 41 is formed on the second surface by depositing ITO on the second surface and patterning the deposited ITO. Electrode 41 formed on the second surface
Corresponds to each pixel. The dielectric substrate 25 further has a conductor 42. The conductor 42 is electrically connected to the electrode 41 formed on the second surface.

In the following, a comparative experiment was conducted on the data voltage and the transmittance between the PALC10 and PALC-100 of the first embodiment.

Below, P prepared for conducting a comparative experiment was prepared.
The configuration of ALC-100 will be described.

The plasma substrate is a substrate having a thickness of about 2 mm in which a hole for exhaust is formed.

The anode electrode and the cathode electrode are applied by screen printing and then fired. By such a method, the anode electrode and the cathode electrode are formed in a slip shape. The glass paste is screen printed several times on the anode electrode and then fired. By such a method, a partition wall having a height of about 200 μm is formed. In order to make the height of the partition uniform, the partition is polished.
A glass frit is linearly applied to the peripheral portion of a thin glass sheet having a thickness of 50 μm, and the thin glass sheet is bonded onto the partition wall. After that, the bonded ones are fired, and the air is exhausted to about 10 ⁻⁶ Torr from the exhaust port, and the air is exhausted for several tens of To.
A rare gas is filled up to rr, an alignment film is applied to the thin glass plate, baked, and rubbed.

The structure of the color filter unit of the PALC-100 is the same as the structure of the color filter unit 30 of the first embodiment, and the description thereof will be omitted.

PALC 10 and PALC of the first embodiment
With respect to −100, the saturation voltage of brightness and the threshold voltage were measured using a measuring instrument LCD-5100 manufactured by Otsuka Electronics. The results are shown below.

[0056]

[Table 1]

The PALC-100 was newly designed and newly created by the inventor in order to carry out the comparative experiment.

Since the dielectric substrate 25 having conductivity only in the thickness direction is used at the boundary between the liquid crystal part and the part where plasma is generated, one end of the liquid crystal layer becomes the ground potential, so that the data voltage is directly applied to the liquid crystal layer. Is applied. As a result, the liquid crystal can be driven at several volts. Therefore, the PALC 10 of the first embodiment can reduce power consumption as compared with the PALC-100. For this reason,
The driver that applies a voltage to the signal electrode 34 may withstand a voltage of several volts. In the first embodiment, a driver having a low breakdown voltage can be used. Such a driver does not require a special high breakdown voltage semiconductor process.

The dielectric substrate 25 includes the conductor 42 and the electrode 41.
Therefore, it is not necessary to thin the dielectric substrate 25.
Therefore, the dielectric substrate 25 can have a sufficient thickness so that the dielectric substrate 25 does not bend. Therefore, there is no deviation from the designed values of the cell thickness and the retardation. Further, the alignment failure of the liquid crystal due to the bending of the dielectric substrate 25 is eliminated. The conductor of the dielectric substrate is
Since it is located on the partition wall, the aperture ratio does not decrease.

(Second Embodiment) The PALC structure according to the second embodiment of the present invention is the same as that of the first embodiment except for the structure of the dielectric substrate 50 of the plasma switch section 20.
The configuration is the same as that of the ALC 10.

The structure of the dielectric substrate 50 will be described below. FIG. 4 is a view showing a cross section of the plasma switch part 20 of the PALC in the second embodiment, and FIG. 5 is a view of a part of the dielectric substrate 50 of FIG. 4 seen from above. The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The dielectric substrate 50 has a first surface and a second surface facing the first surface. A conductor 52 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 50. The conductor 52 has a rod shape,
The conductors 52 are scattered in the cathode direction so as to correspond to the pixels.

A transparent electrode 51 is formed on the second surface of the dielectric substrate 50. The electrode 51 is formed on the second surface by depositing ITO on the second surface and patterning the deposited ITO. The electrode 51 formed on the second surface corresponds to each pixel. The electrode 51 formed on the second surface is electrically connected to the conductor 52. An alignment film is formed on the first surface of the dielectric substrate 50, as in the first embodiment.

The second embodiment has the above-mentioned configuration.
It has the same effect as that of the first embodiment.

(Third Embodiment) The PALC structure according to the third embodiment of the present invention is the same as the PLC structure according to the first embodiment except for the structure of the dielectric substrate 60 of the plasma switch section 20.
The configuration is the same as that of the ALC 10.

The structure of the dielectric substrate 60 will be described below. FIG. 6 is a view showing a cross section of the plasma switch unit 20 of the PALC in the third embodiment, and FIG. 7 is a view of a part of the dielectric substrate 60 of FIG. 6 seen from above. The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The dielectric substrate 60 has a first surface and a second surface facing the first surface. A conductor 62 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 60. The conductor 62 corresponds to each pixel.

Transparent electrodes 63 and 61 are formed on the first and second surfaces of the dielectric substrate 60. Electrode 63
And 61 are formed on the first surface and the second surface by depositing ITO on the first surface and the second surface and patterning the deposited ITO. The electrodes 63 and 61 formed on the first surface and the second surface correspond to each pixel. The electrode 63 formed on the first surface is
Are electrically connected to each other via an electrode 61 and a conductor 62 formed on the surface. An alignment film is formed on the dielectric substrate 60 having the electrodes 63, as in the first embodiment. Further, the patterning may be performed by photolithography.

The third embodiment has the above structure.
It has the same effect as that of the first embodiment.

(Fourth Embodiment) The PALC structure according to the fourth embodiment of the present invention is the same as that of the first embodiment except for the structure of the dielectric substrate 70 of the plasma switch section 20.
The configuration is the same as that of the ALC 10.

The structure of the dielectric substrate 70 will be described below. FIG. 8 is a view showing a cross section of the plasma switch unit 20 of the PALC in the fourth embodiment, and FIG. 9 is a view of a part of the dielectric substrate 70 of FIG. 8 seen from above. The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The dielectric substrate 70 has a first surface and a second surface facing the first surface. A conductor 72 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 70. The conductor 72 has a rod shape,
The conductors 72 are scattered in the cathode direction so as to correspond to the pixels.

Transparent electrodes 73 and 71 are formed on the first surface and the second surface of the dielectric substrate 70. Electrode 73
And 71 are formed on the first surface and the second surface by depositing ITO on the first surface and the second surface and patterning the deposited ITO. The electrodes 73 and 71 formed on the first surface and the second surface correspond to each pixel. The electrode 73 formed on the first surface is
Are electrically connected to each other via an electrode 71 and a conductor 72 formed on the surface. An alignment film is formed on the dielectric substrate 70 having the electrodes 73, as in the first embodiment. Further, the patterning may be performed by photolithography.

The fourth embodiment has the above-mentioned configuration.
It has the same effect as that of the first embodiment.

(Fifth Embodiment) The structure of the PALC in the fifth embodiment of the present invention is the same as the structure of the PALC 10 in the first embodiment except the structures of the dielectric substrate 80 and the partition wall 84 of the plasma switch section 20. Is.

The structures of the dielectric substrate 80 and the partition wall 84 will be described below. FIG. 10 shows PAL in the fifth embodiment.
It is a figure which shows the cross section of the plasma switch part 20 of C, and FIG. 11 is a figure which looked at a part of dielectric substrate 80 of FIG. The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The dielectric substrate 80 has a first surface and a second surface facing the first surface. A conductor 82 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 80. The conductor 82 corresponds to each pixel.

A transparent electrode 83 is formed on the first surface of the dielectric substrate 80. The electrode 83 is formed on the first surface by depositing ITO on the first surface and patterning the deposited ITO. The electrode 83 formed on the first surface corresponds to each pixel. The electrode 83 formed on the first surface is electrically connected to the conductor 82.

Similar to the first embodiment, the plasma substrate 2
An anode electrode 21 and a cathode electrode 22 are arranged in stripes on the upper part of 3. A partition wall 84 is arranged on the anode electrode 21. The cathode electrode 22 is separated from the adjacent cathode electrode 22 by the partition wall 24. The portions a and b on the plasma substrate 23 are masked, and thereafter, the cutout portion is formed by sandblasting. The dielectric substrate 80 is connected to the partition wall 84 so that the conductor 82 of the dielectric substrate 80 is arranged above the cutout portion, and the plasma generation region 26 is formed. After the plasma generation region 26 is evacuated, it is filled with a rare gas.
Since the conductor 82 of the dielectric substrate 80 is arranged on the cutout portion, it is not necessary to provide an electrode on the second surface of the dielectric substrate 80. An alignment film is formed on the first surface of the dielectric substrate 80 having the electrodes 83, as in the first embodiment.

The fifth embodiment has the above-mentioned configuration.
It has the same effect as that of the first embodiment.

(Sixth Embodiment) The structure of the PALC in the sixth embodiment of the present invention is the same as in the fifth embodiment except for the structure of the dielectric substrate 90 of the plasma switch section 20.
The configuration is the same as that of the ALC 10.

The structure of the dielectric substrate 90 will be described below. 12 is a diagram showing a cross section of the plasma switch portion 20 of the PALC in the sixth embodiment, and FIG.
It is the figure which looked at some dielectric substrates 90 from above. The same components as those of the fifth embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The dielectric substrate 90 has a first surface and a second surface facing the first surface. A conductor 92 such as a metal is formed between the first surface and the second surface so as to penetrate the dielectric substrate 90. The conductor 92 has a rod shape,
The conductors 92 are scattered in the cathode direction so as to correspond to the pixels.

A transparent electrode 93 is formed on the first surface of the dielectric substrate 90. The electrode 93 is formed by the same method as the electrode 83 of the fifth embodiment, and the electrode 93 is electrically connected to the conductor 92.

The sixth embodiment has the above-mentioned configuration.
It has the same effect as that of the fifth embodiment.

(Seventh Embodiment) Hereinafter, the dielectric substrate 5 will be described.
An example of the manufacturing method of 0, 70 and 90 will be described with reference to FIG.

FIG. 14A shows a metal wire and a dielectric. When the plasma switch unit 20 is formed,
A plurality of metal wires are arranged at the same intervals as the partition walls so that at least one metal wire corresponds to one partition wall, and are fixed by an appropriate jig. The dielectric is heated to a molten state and the plurality of metal wires and / or the dielectric is moved such that the plurality of fixed metal wires penetrates the heated dielectric. After that, as shown in FIG. 14B, the metal wire protruding from the dielectric is cut. To flatten both sides of the dielectric, both sides of the dielectric are surface polished to produce a dielectric substrate. FIG. 14C is a view of the produced dielectric substrate as seen from above.

(Eighth Embodiment) Hereinafter, the dielectric substrate 2 will be described.
An example of the manufacturing method of 5, 50, 60, 70, 80 and 90 will be described with reference to FIG.

FIG. 15 is a diagram showing a dielectric having metal particles. When the plasma switch unit 20 is formed, a plurality of metal particles are arranged at the same intervals as the partition walls so that at least one metal particle corresponds to one partition wall.
Fixed. Glass powder is filled between the metal particles. The metal particles and the glass powder are pressed at a high temperature to produce a dielectric substrate having a desired thickness.

(Ninth Embodiment) The dielectric substrate 5 will be described below.
An example of the manufacturing method of 0, 70 and 90 will be described with reference to FIG.

FIG. 16A is a diagram showing a mask and a dielectric. Holes that are sufficiently smaller than the pixel size are regularly arranged in the mask. The mask is generated by etching or the like. Align the mask with the dielectric. The dielectric is heated in a molten state. The metal particles are ejected from the cylinder, and the metal particles that have passed through the holes in the mask are driven into the dielectric to form a dielectric substrate. FIG.
FIG. 16B is a cross-sectional view of the produced dielectric material, and FIG.
(C) is a view of the produced dielectric substrate as seen from above.

(Tenth Embodiment) An example of a method of manufacturing the dielectric substrates 25, 60 and 80 will be described below with reference to FIG.

FIG. 17 (a) is a diagram showing a molten dielectric material sandwiched between a metal electrode and an electrode such as carbon.
FIG. 7B is a view of the produced dielectric substrate as seen from above. A high positive voltage is applied to the metal electrode, and a high negative voltage is applied to the carbon electrode. Metal ions are attracted and moved from the positive side metal electrode to the negative electrode, and the dielectric has conductivity in the thickness direction. A dielectric substrate is produced by the method described above.

[0094]

The plasma addressed liquid crystal display device of the present invention has a first surface, a second surface facing the first surface, and a first surface.
And a conductor between the first surface and the second surface, and the substrate, the plurality of partition walls, and the second surface are provided with a dielectric that forms a space region. A first region having conductivity is formed on the second surface of the dielectric in which the space region is formed. The first region is electrically connected to the conductor between the first surface and the second surface. First
And a conductor between the second surface and the second surface is on one of the plurality of partitions.

As a result, the plasma addressed liquid crystal display device of the present invention can have a dielectric having a sufficient strength without lowering the aperture ratio.

Another plasma addressed liquid crystal display device of the present invention comprises a first surface, a second surface facing the first surface, and a conductor between the first surface and the second surface. And a dielectric that forms a space region together with the substrate, the plurality of partition walls, and the second surface. A first region having conductivity is formed on the first surface of the dielectric. The first region is electrically connected to the conductor between the first surface and the second surface. At least one of the plurality of partition walls has a cutout, and the conductor between the first surface and the second surface is located on the cutout.

As a result, the other plasma addressed liquid crystal display device of the present invention does not decrease the aperture ratio,
It can have a dielectric with sufficient strength.

[Brief description of drawings]

FIG. 1 is a diagram showing a cross section of a PALC 10 according to a first embodiment of the present invention.

FIG. 2 is a plasma switch unit 20 of the PALC 10 shown in FIG.
It is a figure which shows the cross section of.

FIG. 3 is a view of a part of the plasma switch unit 20 of FIG. 2 viewed from above.

FIG. 4 is a view showing a cross section of a plasma switch unit 20 of PALC in the second embodiment.

5 is a view of a part of the dielectric substrate 50 of FIG. 4 viewed from above.

FIG. 6 is a view showing a cross section of a plasma switch unit 20 of PALC in a third embodiment.

7 is a view of a part of the dielectric substrate 60 of FIG. 6 viewed from above.

FIG. 8 is a view showing a cross section of a plasma switch unit 20 of PALC in a fourth embodiment.

9 is a view of a part of the dielectric substrate 70 of FIG. 8 viewed from above.

FIG. 10 is a diagram showing a cross section of a plasma switch unit 20 of PALC in a fifth embodiment.

11 is a view of a part of the dielectric substrate 80 of FIG. 10 as seen from above.

FIG. 12 is a view showing a cross section of a plasma switch part 20 of PALC in a sixth embodiment.

FIG. 13 is a view of a part of the dielectric substrate 90 of FIG. 12 viewed from above.

FIG. 14A is a diagram showing a metal wire and a dielectric,
(B) is a figure which shows the metal wire which protrudes from a dielectric material, (c) is the figure which looked at the produced dielectric substrate from the top.

FIG. 15 is a diagram showing a dielectric having metal particles.

16A is a diagram showing a mask and a dielectric, FIG.
(B) is a sectional view of the produced dielectric, and (c) is a view of the produced dielectric substrate as seen from above.

FIG. 17A is a diagram showing a molten dielectric body sandwiched between a metal electrode and an electrode such as carbon, and FIG. 17B is a diagram of the produced dielectric substrate as viewed from above.

FIG. 18 is a diagram showing a configuration of a conventional PALC.

[Explanation of symbols]

10 PALC 20 Plasma switch 21 Anode electrode 22 Cathode electrode 23 Plasma substrate 24 partitions 25 Dielectric substrate 26 Plasma generation area 27 Polarizer 28 Backlight 30 color filter 32 liquid crystal 34 signal electrode 35 color filter 36 board 37 Polarizer 41 electrodes 42 conductor

Front page continuation (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02F 1/13-1/141

Claims (10)

(57) [Claims] 1. A substrate, a plurality of anode electrodes and a plurality of cathode electrodes formed on the substrate, and the substrate for isolating one of the plurality of cathode electrodes from an adjacent cathode electrode. A plurality of partition walls formed on the first surface, a first surface, a second surface facing the first surface, and the first surface.
A conductor between the first surface and the second surface, the substrate, the plurality of partition walls, and a dielectric that forms a space region together with the second surface. A first region having electrical conductivity is formed on the first surface, the first region is electrically connected to the conductor between the first surface and the second surface, and the plurality of partition walls At least one of which has a cutout, and the conductor between the first surface and the second surface is located on the cutout. 2. The contracted part is a mask that masks predetermined parts of the plurality of partition walls and is sandblasted.
Plasma addressed liquid crystal display device according to Motomeko 1. 3. The plasma addressed liquid crystal display device,
3. The plasma addressed liquid crystal display device according to claim 1 , further comprising a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is sandwiched between the dielectric and the color filter substrate. Wherein said plasma addressed liquid crystal display device,
The plasma addressed liquid crystal display device according to claim 3 , further comprising first and second polarizing plates, wherein the color filter substrate and the substrate are sandwiched between the first and second polarizing plates. 5. A plasma addressed liquid crystal display device according to claim 4, wherein the first between the polarizing plate wherein the color filter substrate or a retardation plate between the substrate and the second polarizing plate, is placed . 6. The method according to claim 1 , further comprising a backlight .
3. A plasma addressed liquid crystal display device according to one of 2 . 7. The dielectric comprises a step of heating a glass plate to a melting temperature or higher thereof, a step of penetrating a plurality of regularly arranged metal wires in a thickness direction of the glass plate, and a plurality of the metal pieces. The process according to claim 1, which is manufactured by a method including a step of cutting a wire and a step of polishing the surface of the glass plate to make the surface of the glass plate smooth.
Plasma address liquid crystal display device . Wherein said dielectric comprises the steps of arranging a plurality of metal particles regularly, and filling the glass powder to the metal particle gap plurality of, heating the glass powder above its melting temperature, the pressure The process according to claim 1, which is manufactured by a method including the step of applying.
Plasma address liquid crystal display device . 9. The dielectric is produced by a method including the steps of heating a glass plate to a temperature above its melting temperature and regularly implanting a plurality of metal particles into the glass plate in a line shape. The process according to claim 1,
Plasma address liquid crystal display device . Wherein said dielectric body includes a step heats the glass sheet above its melting temperature, the steps of the line-shaped metal electrode is placed on a first surface of a glass plate, a line-shaped electrodes, the glass Installing on a second surface of the plate opposite to the first surface, and applying a positive high voltage to the metal electrode to cause migration of the metal in the thickness direction of the glass plate The process according to claim 1, which is manufactured by a method including:
Plasma address liquid crystal display device .