JP3428267B2 - Manufacturing method of laminated coil parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil component such as an inductor and a laminated LC composite component, and more particularly to a laminated coil component in which a laminated coil is arranged in an element.

[0002]

2. Description of the Related Art Conventional laminated coil components are roughly classified into the following two types according to the method of forming the coil. (1) One is to have a laminated coil formed by a so-called via hole method, and in this laminated coil component, a green sheet on which a coil pattern is printed is laminated, and a coil pattern of each layer is formed by a via hole. To form a laminated coil. (2) The other one is that a laminated coil is formed by a so-called print stacking method in which ceramic paste and coil patterns are alternately half-printed and stacked while being dried by printing.

FIG. 5 shows a method of forming a coil by the via hole method described in (1) above. In this way,
The first green sheet 52a of the first coil pattern 51a of the half-turn has been formed (FIG. 5 (a), (c) ,
and (e)), also of half-turn second coil pattern 51b (FIG. 5 (b), laminating the second green sheet 52b, which is formed (d)), the via hole 53, the first and A laminated coil is formed by connecting the end portions of the second coil patterns 51a and 51b. The uppermost first coil pattern 51a (FIG. 5 (a)) and the lowermost coil pattern 51a (FIG. 5 (e)) are
The green sheet 52a, 52b, etc. are laminated, pressure-bonded, and then fired to obtain an extraction electrode portion 5 for connection with an external electrode formed on the outer peripheral surface of the element.
The sheet 1c is pulled out to the end of the green sheet 52a.

FIG. 6 is a diagram showing a method of manufacturing a laminated coil component by the print stacking method of (2) above.
In this method, (1) the extraction electrode (electrode pattern) 61a is arranged on the green sheet 62a (FIG. 6 (a)), and (2) the green sheet 62b is arranged on the extraction electrode 6a.
1a are stacked so that the upper part is exposed (FIG. 6 (b)), (3) Next, a 1/2 turn coil pattern 61b is arranged on the green sheet 62b so as to be electrically connected to the extraction electrode 61a. (FIG. 6 (c)), (4) further, stacking a green sheet 62c thereon, as the lower portion of the coil pattern 61b is exposed (FIG. 6
(d)), (5) 1/2 turn coil pattern 61c
Is arranged so as to be electrically connected to the end of the coil pattern 61b (FIG. 6 (e)), and (6) a green sheet 62d is further stacked thereon so that the upper part of the coil pattern 61c is exposed (see FIG. 6
(f)), (7) 1/2 turn coil pattern 61d
Are arranged so as to be electrically connected to the ends of the coil pattern 61c (FIG. 6 (g)), and (8) Furthermore, the green sheet 62e is stacked thereon so that the lower part of the coil pattern 61d is exposed (see FIG. 6
(h)), (9) The extraction electrode 61e is provided on the coil pattern 6
The laminated coil is arranged so as to be electrically connected to the end of 1d (FIG. 6 (i)), and an outer layer green sheet (not shown) having no electrode pattern formed thereon is further laminated to form a laminated coil. Is forming.

By the way, conventionally, in forming a coil pattern, a method of printing an electrode paste such as a silver paste or a copper paste has been used. However, in the method of forming a coil pattern by printing, the line width of the coil pattern is changed. It is difficult to reduce the size, and there is a problem in that it is necessary to increase the number of stacked layers in order to increase the acquisition inductance. In the normal printing method, the line width of the coil pattern is limited to about 60 μm, and when the bleeding of the print pattern is taken into consideration, the limit is about 100 μm.

Further, in the conventional laminated coil component, the coil pattern is formed of a sintered metal containing frit such as glass, and the resistance value of this sintered metal is higher than that of pure metal. Therefore, there is a problem that the high frequency characteristic is deteriorated (the Q characteristic is deteriorated).

Further, in the case of the conventional via-hole method, it is necessary to form a via-hole for each sheet and fill the via-hole with electrodes to connect the coil patterns of each layer, which increases the number of work steps. However, there is a problem that the cost is increased.

The present invention solves the above problems and provides a method for manufacturing a laminated coil component which is small in size and can obtain the required characteristics without increasing the number of working steps. To aim.

[0009]

In order to achieve the above object, the method for producing a laminated coil component of the present invention comprises: (a) forming a coil pattern made of a conductive material on the surface of a film-shaped substrate, A green sheet having a coil pattern is formed on the surface of the green sheet by coating the slurry of the material forming the element from the above with a pattern such that connection openings for connecting the coil patterns of the respective layers are formed. (B) After the surface of the green sheet held by the film-shaped substrate on which the coil pattern is not formed is bonded to another bonding target such as another green sheet, the film-shaped substrate is removed. Exposing the surface on which the coil pattern is formed, and (c) further forming by the method of (a) above,
The green sheet of (b) above , which is held on a film substrate.
And the connection opening is formed at a position different from the
The stacked green sheets are stacked using the surface on which the coil pattern is not formed as a joining surface, and then the film-shaped substrate is removed. (D) After that, it is necessary to form a predetermined laminated coil. The green sheets are stacked by the same method as in (c) above until the number of stacked layers is reached, and (e) the coil patterns of each layer are arranged at different positions in plan view.
It is characterized in that to form a laminated coil by connecting through the connecting opening that is set.

Further, the coil pattern is formed by forming a metal thin film on the surface of the film-shaped substrate and then trimming the metal thin film by photolithography.

Further, the coil pattern is formed by applying a conductive paste.

[0012]

In the method for manufacturing a laminated coil component of the present invention, a coil pattern made of a conductive material is formed on the surface of a film-shaped substrate, and a slurry of a material forming the element is applied onto the coil pattern. to form a rig lean sheet,
A green sheet coil pad held on a film substrate
The other side of the green sheet on the side without the turn
After joining to the joining object such as
Except the surface where the coil pattern is formed,
Similarly, on the surface of the film-like substrate
Form a coil pattern consisting of
Formed by applying a slurry of the material
One with no coil pattern on the lean sheet
After stacking the surfaces of the
Required to form the desired laminated coil.
Green sheets are formed and greed until the required number of layers is reached.
Stacking sheets and removing the film substrate.
Since the laminated coil is returned to form the laminated coil, it is possible to efficiently laminate the green sheets to reliably manufacture the laminated coil component. Further, by connecting the coil patterns of the respective layers through the respective connection openings arranged at different positions in a plan view , the respective coil patterns are surely conducted and connected without separately forming a via hole or the like. It is possible to form a highly reliable laminated coil, and it is possible to reduce the number of work steps and the manufacturing cost.

Further, by trimming the metal thin film using photolithography to form the coil pattern, it is possible to process the coil pattern more precisely and to make it thinner, and thus the thickness is small and the metal content ratio is small. It is possible to efficiently form a laminated coil component having high electrodes, and it is possible to reduce the size and performance of the product.

The coil pattern may be formed by applying a conductive paste.
In that case, although the effect of thinning is inferior to the case of trimming the metal thin film by photolithography, a sufficient effect can be obtained in terms of improvement of productivity and connection reliability, or reduction of man-hours.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be shown below, and the characteristic features thereof will be described in more detail. In the following embodiments of the invention, a case of manufacturing a high frequency laminated coil component in which a coil is arranged in a dielectric ceramic will be described as an example.

[Embodiment 1] First, a metal thin film is formed on the surface of a resin film (base material) made of polyethylene terephthalate by a dry thin film forming method such as sputtering or vapor deposition or a wet thin film forming method such as wet plating. Form. In addition, FIG. 1 and FIG.
It shows the pattern of the electrodes as seen from the resin film side (back surface side), and shows the state in which the resin film has been removed.

Then, as shown in FIG. 1, the metal thin film is trimmed by photolithography to form coil patterns 2a (FIG. 1 (b)), 2b (FIG. 1 (c)), 2c.
(Figure 1 (d) is formed. Then, on the surface of the resin film on which the coil patterns 2a, 2b, 2c are formed,
A slurry (here, a ceramic raw material slurry) in which a material forming an element is dispersed in a dispersion medium in such a manner that a connection opening 3 for connecting the coil patterns (2a, 2b, 2c, etc.) of each layer is formed. ) 1 is printed and green sheets (ceramic green sheets) 4a, 4
b, 4c are formed.

Further, similarly, the drawing pattern 5a is formed.
(FIG. 1 (a))及 beauty and opening 3 (FIG. 1 (a)) green sheets 4d disposed, lead pattern 5b (FIG. 1
(e)) is provided to form the green sheet 4e.

Then, the surface of the green sheet 4e held on the film-shaped substrate on which the coil pattern is not formed is bonded to the outer layer green sheet (not shown) on which the electrode pattern is not formed. was followed by removing the film-shaped substrate, exposing the formed surface of the lead pattern 5 b, further thereon, is formed of the coil pattern 2 c of the green sheet 4 c held in the film-form substrate After stacking the non-coated surfaces by joining, the film-shaped substrate is removed to expose the surface on which the coil pattern 2 c is formed, and the green sheets 4 b, 4 a and 4 d are further processed by the same method as above. After stacking in sequence (however, the green sheets 4a, 4b, 4c can be stacked repeatedly), and if necessary, coil patterns and drawers A laminated block is formed by laminating outer layer green sheets (not shown) on which no pattern or the like is formed.

Here, each coil pattern (2a, 2b,
2c) and between the coil patterns 2a, 2c and the drawing patterns 5a, 5b are connected to each green sheet (4
a, 4b ...) And an outer layer sheet (not shown) are stacked, and the whole laminated block obtained by pressing is performed. This connection method will be described with reference to FIG. As shown in FIG. 2A, each green sheet 4 (4
a, 4b, etc.) are simply stacked,
Although the coil patterns 2 (2a, 2b, ...) Are not connected to each other, when the laminated block 11 is pressed, the green sheet 4 is deformed as shown in FIG. The coil patterns 2 are connected to each other within 3. Therefore, unlike the conventional case, it is possible to reliably connect the coil pattern without separately forming a via hole for conducting the coil pattern or filling the via hole with an electrode paste.

That is, according to the method of the above embodiment,
The following effects can be obtained. (1) Since a metal electrode formed by a dry thin film forming method such as sputtering or vacuum evaporation or a wet thin film forming method such as a wet plating method is trimmed into a coil pattern,
It is possible to increase the conductivity as compared with a sintered electrode formed by printing and baking a conventional electrode paste, and it is possible to make the wire finer and downsize. (2) When the coil pattern is formed with the same line width as before,
Since the resistance of the wire becomes small, a coil having excellent high frequency characteristics can be formed. (3) On the contrary, since it is possible to reduce the thickness of the coil pattern while ensuring high frequency characteristics equivalent to those of the conventional coil, it is possible to reduce the height of the product. (4) In addition, since the thin metal film is trimmed by photolithography to form the coil pattern, high trimming accuracy can be obtained, and a coil having a smaller line width than the conventional coil can be reliably formed. It becomes possible to do.

[Second Embodiment] As shown in FIG. 3, by the same method as in the first embodiment, the first coil pattern 12a, which turns from the outside to the inside and has a turn number of 1 turn or more, and for connection. Opening 1
The first green sheet 14a on which 3 is arranged, the second coil pattern 12b having the same winding direction as the first coil pattern 12a and rotating from the inner side to the outer side and having the number of turns of 1 turn or more, and the connection. The second green sheet 14b having the opening 13 for connection, the first coil pattern 12c which also circulates from the outside to the inside, and the first green sheet 14c having the opening 13 for connection, and The second coil pattern 12d, which has the same winding direction as the first coil pattern 12c and turns from the inner side to the outer side.
To form the second green sheet 14d.
The end portions of the first coil pattern 12a of the first green sheet 14a and the second coil pattern 12d of the second green sheet 14d are pulled out to the end portions of the green sheets 14a, 14d by the pull-out pattern 15. There is.

Then, each green sheet 14a, 14b, 14c, 14d is processed by the same method as in the first embodiment.
Are sequentially laminated, and the obtained laminated block is pressed to form the coil patterns 12a, 1 in the connection opening portion 13.
2b, 12c and 12d are connected. This makes it possible to reliably connect the coil patterns and form a laminated coil without separately forming via holes or filling the via holes with electrode paste in order to conduct the coil patterns. .

According to the method of the second embodiment, the following effects can be obtained. (1) Since it is possible to form a coil pattern of one turn or more on one green sheet, a larger number of turns can be secured when the number of stacked sheets is the same as in the conventional method. , A large inductance can be obtained. For example, in the case of the conventional method of stacking green sheets on which coil patterns are printed by 1/2 turn,
In order to secure the number of turns of 3 turns, it is necessary to stack 6 green sheets, but according to the method of the second embodiment, the number of turns of 3 turns is secured by stacking 2 sheets. It becomes possible to do. Further, when the same number of green sheets are stacked, it is possible to obtain the inductance three times that of the conventional one. (2) Since it is possible to reduce the number of laminated green sheets required to secure the same inductance, the amount of green sheets used is reduced and the man-hours required for lamination are reduced. Further, when the required number of green sheets decreases, the number of via holes to be formed also decreases. Therefore, the manufacturing process can be simplified and the cost can be significantly reduced. Further, the number of via holes is reduced, so that the number of interlayer connection points is reduced and the connection reliability is improved.

(3) Further , in order to increase the inductance by the conventional method, it is necessary to increase the number of stacked sheets, and it is necessary to reduce the thickness of the green sheet as much as possible. Therefore, it is necessary to maintain high working accuracy in each process, which leads to an increase in cost. However, according to the method of the present invention, the number of stacked green sheets required to obtain the same inductance is increased. Therefore, it is not necessary to reduce the thickness of the green sheet even at the sacrifice of workability, and the handling in the manufacturing process can be facilitated.

In the second embodiment, the case where a plurality of green sheets on which a coil pattern of one turn or more is formed is laminated has been described. However, one green sheet has two or more turns. It is also possible to arrange the patterns and to arrange only the drawing patterns on the other green sheets.

[0027] In the method of manufacturing the laminated coil component of the present invention, after pressing the mother laminate block as to obtain a large number of laminated coil component at a time, when cutting out elements from now, first, in FIG. 4 As shown in the drawing, it is preferable that the unfired laminated block 31 after pressing is half-cut by the blade 32, and this is fired as it is, and then broken into a stick shape to obtain each element. In this way, the laminated block 31 is fired in a state of being half-cut by the blade 32 and then broken to keep the directionality constant until it is divided into individual elements. It becomes possible to eliminate the need to sort before and after,
The cost can be reduced accordingly.

When the laminated block 31 is half-cut by the blade 32, the electrodes constituting the coil are not damaged in the step of breaking the laminated block 31 later, and the internal electrodes can be reliably pulled out to the end faces. In addition, it is preferable that the blade 32 penetrates to a position deeper than the coil pattern forming sheet 34 during the half cut.

In the embodiment of the invention described above, the case of manufacturing a high frequency laminated coil component in which a coil is arranged in a dielectric ceramic has been described as an example. However, the present invention is not limited to this. The present invention can be applied to other laminated coil components such as ferrite-based laminated coil components as well as the system laminated coil components.

In the above embodiment, the case where the coil pattern is formed by the method of trimming the metal thin film has been described, but in the present invention, the coil pattern may be formed by the method of applying and baking the conductive paste. ,
In this case, although the effect of thinning is inferior to the case where the metal thin film is trimmed by photolithography, it is significant and effective in improving productivity and connection reliability, or reducing man-hours. .

The present invention is not limited to the above-described embodiment, and a specific method of using a metal thin film forming method for forming a coil pattern, a metal thin film trimming method, and photolithography as a trimming method. With respect to the conditions, the specific shape and material of each coil pattern, the number of stacked green sheets, and the like, various applications and modifications can be made within the scope of the invention.

[0032]

As described above, according to the method of manufacturing a laminated coil component of the present invention, a coil pattern made of a conductive material is formed on the surface of a film-shaped base material, and a slurry of a material constituting an element is formed on the coil pattern. the green sheet was formed by coating the green sea held in film-form substrate
Of the coil on which the coil pattern is not formed
After bonding to a target such as a lean sheet, the film
The base material is removed to expose the surface on which the coil pattern is formed.
The surface of the film-shaped substrate
A coil pattern made of conductive material is formed on the
By applying a slurry of the materials that make up these elements
The coil pattern is formed on the formed green sheet.
After stacking the non-open side as the joint side, fill
Remove the strip-shaped base material, and then form the specified laminated coil
Until the required number of layers is reached.
Forming, stacking green sheets, and film substrate
Because of that so as to form a dividing laminated coil Repeat removed by, it is possible to reliably manufacture the laminated coil component was efficiently stacking the green sheets. In addition, the coil patterns of each layer are arranged at different positions in plan view.
By connecting through each connection opening, it becomes possible to reliably conduct each coil pattern without forming a via hole or the like to form a laminated coil with high connection reliability. It becomes possible to reduce the manufacturing cost by reducing the number of work steps.

Further, when the coil pattern is formed by trimming the metal thin film using photolithography, the coil pattern can be processed more finely to form a fine wire, which has a small thickness and contains metal. It becomes possible to efficiently form a laminated coil component provided with an electrode having a high rate, and it becomes possible to reduce the size and performance of the product.

The coil pattern may be formed by applying a conductive paste,
In that case, although the effect of thinning is inferior to the case of trimming the metal thin film by photolithography, a sufficient effect can be obtained in terms of improvement of productivity and connection reliability, or reduction of man-hours.

[Brief description of drawings]

FIG. 1 is a diagram showing a method for manufacturing a laminated coil component according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method of connecting the respective coil patterns in the method of manufacturing the laminated coil component according to the embodiment of the present invention.

FIG. 3 is a diagram showing a method for manufacturing a laminated coil component according to another embodiment of the present invention.

FIG. 4 is a diagram showing a method of cutting out each element from the block after pressing the laminated block in the method for manufacturing a laminated coil component of the present invention.

FIG. 5 is a diagram showing a method of manufacturing a conventional laminated coil component.

FIG. 6 is a diagram showing another method for manufacturing a conventional laminated coil component.

[Explanation of symbols]

1 Slurry 2a, 2b, 2c Coil pattern 3 Connection openings 4a, 4b, 4c, 4d, 4e Green sheets 5a, 5b Drawing pattern 11 Laminated blocks 12a, 12b, 12c, 12d Coil pattern 13 Connection openings 14a, 14b , 14c, 14d, 14e Green sheet 15 Drawing pattern 31 Laminated block 32 Blade 34 Coil pattern forming sheet

Front page continuation (72) Inventor Masatoshi Ariki, 26-10 Tenjin, Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd. (56) References JP-A-7-192955 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01F 41/04

Claims (3)

(57) [Claims] 1. A method for manufacturing a laminated coil component, in which a laminated coil is arranged in an element, wherein (a) a coil pattern made of a conductive material is formed on a surface of a film-shaped substrate, and the element is formed thereon. By applying the slurry of the material forming the above in a pattern such that a connection opening for connecting the coil patterns of the respective layers is formed, a green sheet having a coil pattern is formed on the surface thereof. ) After bonding the surface of the green sheet held by the film-shaped substrate on which the coil pattern is not formed to a bonding target such as another green sheet, the film-shaped substrate is removed, and Exposing the surface on which the coil pattern is formed, (c) further forming by the method of (a),
The green sheet of (b) above , which is held on a film substrate.
And the connection opening is formed at a position different from the
The stacked green sheets are stacked using the surface on which the coil pattern is not formed as a joining surface, and then the film-shaped substrate is removed. (D) After that, it is necessary to form a predetermined laminated coil. The green sheets are stacked by the same method as in (c) above until the number of stacked layers is reached, and (e) the coil patterns of each layer are arranged at different positions in plan view.
A method for manufacturing a laminated coil component, characterized in that a laminated coil is formed by connecting through the connection opening provided . 2. The laminated coil according to claim 1, wherein the coil pattern is formed by forming a metal thin film on the surface of the film-shaped substrate and then trimming the metal thin film by photolithography. Manufacturing method of parts. 3. The coil pattern is formed by applying a conductive paste.
A method for manufacturing the laminated coil component described.