JP3427578B2 - Manufacturing method of microwave integrated circuit device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic microwave integrated circuit device, for example, in which a matching adjustment operation is performed together with evaluation of an active element mounted therein .
Regarding the manufacturing method .

[0002]

2. Description of the Related Art An active element such as an FET used in a microwave integrated circuit (MIC) basically has a high operating frequency, and as the operating frequency becomes higher, variations in its characteristics dramatically increase. To do. And
This variation in the characteristics of the active elements is a major factor that deteriorates the yield of this type of microwave integrated circuit, and therefore some adjustment work is required to improve the yield.

However, especially in a monolithic microwave integrated circuit (MMIC), an active element is integrally formed with a signal transmission line and a passive element on one semiconductor substrate, and only the active element is formed. It cannot be evaluated and adjusted to suppress variations in its characteristics.

Further, an active element whose characteristics are known in advance,
Alternatively, even in a hybrid microwave integrated circuit in which an active element chip that can be individually measured and evaluated in advance is mounted on a semiconductor substrate, the active element is connected to the wiring section using a bonding wire. Due to the influence of the bonding wire, the characteristics of the active element on the circuit board often change as compared with those before mounting.

In order to deal with such a problem, conventionally, while evaluating the characteristics of the entire circuit, it is installed in the vicinity of the active element as shown in, for example, Japanese Patent Laid-Open No. 62-210701. By adjusting the length of the matching stub, the circuit as a whole is adjusted.

In such an adjusting method, the work for measuring and adjusting the circuit is repeatedly executed until a desired characteristic is obtained, which requires a great deal of labor and labor, and the circuit. In a circuit device in which a plurality of active elements are mounted on a substrate, it is very difficult to specify the active element to be adjusted. All of these problems result from the fact that it is impossible to evaluate and adjust the active element alone.

[0007]

OBJECTS OF THE INVENTION It is an object of this invention, during the assembling process of the microwave integrated circuit, are performed sequentially evaluation and adjustment of the active devices in the circuit, the final adjustment operation is to be omitted Te, for example, even in a monolithic microwave integrated circuit, a method for manufacturing a microwave integrated circuit device evaluation and adjustment of a plurality of active elements is so tied to smoothly conducted with improved yield Hisage Kyosu in shall be incorporated is there.

[0008]

SUMMARY OF THE INVENTION The present invention is an active element which is placed on the circuit board, is formed on the circuit board
The line to which the active element is connected and both sides of the line.
Located on the circuit board and located on the circuit board.
Port for measurement with a pad and a ground conductor, and the circuit board
Formed on top and with a discontinuity to the line
Of the microwave integrated circuit device with the formed main line
A method of manufacturing, wherein the device is connected to the main line
Set the length of the matching stub formed on the circuit board to
When the main line and the line are in the discontinuous state,
Through the probe pad, the characteristics of the active device alone can be
Measure to ensure that the characteristics of the active element are optimal.
Select the length of the result obtained by simulation in
The main line and the line forming the discontinuity are electrically connected to each other.
They are connected to each other.

That is, in this microwave integrated circuit device, it is possible to measure a single active element mounted on the circuit board during the manufacturing process, and further evaluate the measurement result. Since the matching means adjusts so as to obtain the optimum active element characteristics, it is possible to suppress variations in the characteristics of the mounted active elements.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a monolithic microwave integrated circuit, which includes a circuit board 11 made of a semiconductor composed of GaAs, InP, etc., on which an active element 12 composed of a diode, FET, HEMT, etc. is provided. It is arranged. Measurement ports 131 and 132 are arranged on both sides of the active element 12 on the circuit board 11, and the main lines are arranged outside the measurement ports 131 and 132, respectively. 141 and 142 are located.

Matching stubs 151 and 152 are connected to the main lines 141 and 142, respectively. Although one matching stub 151 and 152 is arranged for each of the main lines 141 and 142 in this drawing, a plurality of matching stubs 151 and 152 may be provided.

The measurement ports 131 and 132 are similarly configured and include lines 201 and 202 connected to the active element 12, respectively, and are located outside the lines 201 and 202, respectively, and are connected to the surface ground conductor 211. And 212, and 213 and 214 are arranged and formed. The lines 201 and 202 and the ground conductors 211 to 214 are connected to the probe pads 221 and 222, respectively, and 231 to 234, respectively.
Are formed so as to be electrically connected.

Here, the line 201 connected to the active element 12
And 202 respectively have main lines 141 and 142
Are formed so as to face the respective tips at small intervals. Also, the ground conductors 211 to 214 are via holes, respectively.
241 to 244 electrically connect to a ground conductor formed on the back surface of the circuit board 11, for example.

FIG. 1B shows an enlarged sectional structure of a portion corresponding to one of the measurement ports 131 and corresponding to the line bb in FIG. 1. One surface of the circuit board 11 is shown in FIG. line
Surface ground conductors 211 and 222 are formed together with 201. Then, on the other surface of this circuit board 11, a backside ground conductor is formed.
25 are formed, and via holes 241 and 242
The back side ground conductor 25 and the front side ground conductors 211 and 212 are electrically connected.

Next, the operation of adjusting the characteristics of the active element 12 in the microwave integrated circuit thus configured will be described. FIG. 2 shows the flow of this adjustment work. First, in the manufacturing process for realizing the monolithic microwave integrated circuit, in step 301, both sides of the active element 12 mounted on the circuit board 11 are measured. Port 13
Form 1 and 132. At this point, the lines 201 and 202 of the active element 12 are not connected to the main lines 141 and 142, respectively, so that the microwave integrated circuit including the active element 12 does not operate.

When the microwave integrated circuit is not operated, the on-wafer measurement probe heads are attached to the probe pads 231 to 234 together with the probe pads 221 and 222 of the measurement ports 131 and 132 as shown in step 302. Contact and measure the transmission / reflection characteristics of the active element 12 alone.

In step 303, using the measurement data thus obtained, the lengths of the matching stubs 151 and 152 for obtaining the optimum characteristics of the active element 12 are obtained by simulation analysis. When performing such a simulation analysis, the influence of the discontinuity caused by connecting the lines 201 and 202 of the measurement ports 131 and 132 and the main lines 141 and 142 in the subsequent process on the characteristics of the active element 12 is examined. It needs to be taken into consideration.

In step 304, the matching stubs 251 and 252 are cut by using a laser processing means or the like based on the analysis result obtained in step 303. That is, the lengths of these matching stubs 251 and 252 are the lengths obtained by the previous simulation analysis. Then, in the final step shown in step 305,
The measurement ports 201 and 202 and the main lines 141 and 142 are connected by forming transmission lines 161 and 162, respectively.

In the embodiment described so far,
Although a microstrip line is used as a transmission line, it can be effectively applied to a monolithic microwave integrated circuit configured by using a cobrena line. FIG. 3 shows a plan view, and ground conductors 261 and 262 are formed on the surface of the circuit board 11 so as to be arranged in parallel. The ground conductors 261 and 262 are connected to each other by air bridges 271 and 272.
, ... are commonly connected.

The active element 12 is arranged so as to be sandwiched between the ground conductors 261 and 262, is mounted on the circuit board 11, and is connected to the active element 11 by the lines 201 and 202.
Are formed so as to extend between the ground conductors 261 and 262. The probe pads 221 and 222 are formed at the tips of the lines 201 and 202, and the probe pads 231 to 234 are formed integrally with the ground conductors 261 and 262. In the monolithic microwave integrated circuit using such a cobler line, the ground conductors 261 and 26 are used.
Since 2 is originally formed on the circuit board 11, front and back connecting means such as a via hole is not required.

FIG. 4 shows an embodiment applied to a hybrid microwave integrated circuit. In this case, the active element 121 mounted on the circuit board 11 is one whose characteristics are known in advance or a single unit is previously prepared. This active element 121 is
282 connects to lines 201 and 202.

In the microwave integrated circuit thus constructed, before mounting on the circuit board 11 due to the influence of the bonding wires 281 and 282 connecting the active element 121 chip to the lines 201 and 202, In many cases, the characteristics of the active element 121 change after the characteristics are measured as a single body) and after mounting. Therefore, particularly in such a hybrid microwave integrated circuit, it is very important to evaluate and adjust the characteristics of the active element after mounting the active element on the circuit board 11.

[0023]

As described above, in the microwave integrated circuit device according to the present invention, the active element on the circuit can be evaluated during the assembly and manufacturing process.
Therefore, a great effect is exerted for suppressing the variation in the characteristics of the mounted active elements, and the yield improvement of this type of microwave integrated circuit can be expected sufficiently.

[Brief description of drawings]

FIG. 1A is a plan configuration diagram of a microwave integrated circuit for explaining an embodiment of the present invention, and FIG. 1B is an enlarged cross-sectional view of a portion corresponding to line bb in FIG.

FIG. 2 is a diagram illustrating a flow of a manufacturing process of the microwave integrated circuit.

FIG. 3 is a plan configuration diagram illustrating a second embodiment of the present invention.

FIG. 4 is a plan configuration diagram illustrating a third embodiment of the present invention.

[Explanation of symbols]

11 ... Circuit board, 12, 121 ... Active element, 131, 132 ... Measurement port, 141, 142 ... Main line, 151, 152 ... Matching stub, 161, 162 ... Transmission line, 201, 202 ... Line, 211
~ 214, 261, 262 ... ground conductor, 221, 222, 231-23
4… Probe pad, 241-244… Via hole, 25…
Backside ground conductor.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junshi Utsu 1-1, Showa-cho, Kariya city, Aichi Japan Denso Co., Ltd. (56) Reference JP-A-3-243871 (JP, A) JP-A-6 -244252 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01P 1/00 H01P 3/08 H01P 5/02 603 G01S 7/03 H01L 21/66

Claims (2)

(57) [Claims] 1. A an active element which is placed on the circuit board, before
Formed on a circuit board and connected to the active element
A line and on both sides of the line and on the circuit board
For measurement with probe pads and ground conductors placed in
A port, formed on the circuit board, and connected to the line.
A main line formed by disposing a discontinuity on the other hand.
A method of manufacturing a microwave integrated circuit device, comprising: forming on a circuit board in a state of being connected to the main line.
The length of the matching stub is set to the main line and the line.
And are in the discontinuous state, the probe pad
The characteristics of the active element alone are measured through the
Simulate child characteristics to obtain optimum characteristics
The step of selecting the length of the result obtained in step 1, and the main line and the line forming the discontinuity
Method for producing a microwave integrated circuit device being characterized in that comprising the step of electrically connecting. 2. The wire arrangement between the active element and the line.
The connection according to claim 1, wherein the lines are connected to each other.
For manufacturing a microwave integrated circuit device .