JP3420429B2 - Two-dimensional input module element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component made of an optical semiconductor capable of reading information such as a character and a figure written on a manuscript in a two-dimensional manner. It is a two-dimensional input module element that can be easily mounted on equipment.

[0002]

2. Description of the Related Art A photoelectric converter in which light receiving elements are arranged one-dimensionally and which receives light from a light source applied to an original, and an electric device obtained by moving a relative position between the photoelectric converter and the original in a direction orthogonal to each other A device including a data processing unit that sends a signal as a read signal of information is well known as a facsimile or a copying machine.

A device in which light receiving elements are arranged one-dimensionally and which is connected to a personal computer, a word processor or the like to read a part of an original or a sentence is well known as a hand scanner.

An image input / output device described in Japanese Patent Publication No. 5-40927, for example, is known as an input / output device for image information such as characters and figures, which is being studied for practical use as an input / output device for a computer. There is. The information input section of such an apparatus is composed of a panel in which light receiving elements are formed in a two-dimensional matrix, and such a panel is disclosed, for example, in JP-A-60-262236 and JP-B-4-52485. And the applicant of the present application has also disclosed in JP-A-60-1135.
No. 87 has been proposed, and a panel in which a plurality of photovoltaic cells are arranged in a two-dimensional matrix is further proposed.
-130152 is proposed.

[0005]

However, in the above conventional techniques, the two-dimensional sensor panel is combined with the display screen of the information device or integrated with the display screen. No consideration is given to making the signal processing unit into a module component integrated by a mounting technique. In other words, since no consideration is given to using such a module component as a sensor component for inputting small information such as a portable information device, how to use a sensor panel, a sensor panel drive circuit, a light source, If the light source drive circuit and the like are modularized, it is not considered whether the size can be reduced while keeping the signal detection in the best state.

Further, although the module is made smaller, there is a problem in that the problem of noise occurring at that time, measures against heat of the light source, the shape of parts for easy use, and the reliability are not taken into consideration.

In order to solve the above problems, an object of the present invention is to provide a two-dimensional input module element which is small and thin, resistant to external noise, and highly reliable as a module component integrated with a light source section and peripheral circuit section. To provide.

Another object of the present invention is to provide a two-dimensional input module element which can be easily mounted as a module component on a printed circuit board or a socket and which allows a user to change the gain of an output signal and the light quantity of a light source. To do.

Still another object of the present invention is to provide a two-dimensional input module element in which the heat generated by the light source does not adversely affect the peripheral portion when integrated as a module component in a package.

[0010]

A two-dimensional input module element according to a first aspect of the present invention comprises a sensor panel comprising a plurality of photocells formed in a two-dimensional matrix, and a surface emitting light source for emitting light to an original. Section, and a signal processing section for processing an output signal obtained by sequentially scanning the plurality of photocells with reflected light obtained by irradiating the original with light from the light source section,
It is mounted inside an envelope made of a metal material, and the opening of the envelope is closed by the sensor panel, and the signal line of the light source unit and the signal line of the signal processing unit are surrounded by the envelope. It is characterized in that it is connected to the electrode pin provided on the inside of the envelope.

According to the first aspect of the present invention, the package having the flat package structure can be packaged in one package, and the input and output of signals can be performed through the electrode pins provided in the package. It can be inserted into a printed circuit board, an IC socket, or the like. Further, by closing the opening with the sensor panel, it is possible to input information by placing the document on the opening so as not to be affected by external light. Also,
By using the metal material as the shield material as the envelope, noise from the outside of the envelope can be blocked. In addition, it is preferable to keep the envelope at the ground potential.

A two-dimensional input module element according to a second aspect is the two-dimensional input module element according to the first aspect, wherein the electrode pins are arranged at a positive multiple of a predetermined interval. .

According to the second aspect of the invention, the electrodes can be directly inserted into an IC socket, a printed circuit board or the like having an electrode pin interval of 2.54 mm or 1.27 mm.

A two-dimensional input module element according to a third aspect is the two-dimensional input module element according to the first aspect, characterized in that the opening is covered with a protective film.

According to the third aspect of the invention, the sensor panel surface can be protected by covering the opening in the upper part of the sensor panel with the glass plate, and can be protected from scratches, stains, etc. due to contact with the document. .

A two-dimensional input module element according to a fourth aspect is the two-dimensional input module element according to the first aspect, wherein the light amount of the light source unit is adjusted to adjust an output signal from the sensor panel. The light quantity adjusting means is provided in the envelope.

According to the invention described in claim 4, the amount of light is changed so as to maintain the level of the output signal in accordance with the individual characteristics of the sensor panel or with respect to the aging of the sensor panel and the light source section. Can be adjusted.

The two-dimensional input module element according to a fifth aspect is the two-dimensional input module element according to the first aspect, wherein a current signal which is an output signal from the sensor panel is converted into a current-voltage signal by the signal processing unit. A gain adjusting unit for adjusting an output signal from the sensor panel is provided in the envelope.

According to the fifth aspect of the present invention, the signal converting / amplifying section for converting the output signal from the sensor panel is mounted inside the envelope, so that it is easier to carry out without requiring external parts. Will be able to use. In addition, a stable signal can be obtained by amplifying a minute signal from the sensor panel inside the envelope having a shielding effect and outputting the amplified signal to the outside of the envelope. Further, the output signal can be output in the best state by the gain adjusting means, and it can be adjusted when the output signal from the envelope changes due to the aging of the sensor panel or the light source.

A two-dimensional input module element according to a sixth aspect is the two-dimensional input module element according to the first aspect, wherein a current signal which is an output signal from the sensor panel is converted into a current-voltage signal by the signal processing unit. The light source unit and the signal conversion amplification unit are thermally separated, the opening of the envelope is hermetically sealed, and the inside of the envelope is vacuumed. It was held in.

According to the sixth aspect of the present invention, the heat generated by the light emission of the light source unit is prevented from being thermally coupled by the contact between the sensor panel or the signal conversion / amplification unit and the light source unit. Since the inside of the envelope is held in vacuum, thermal connection can be prevented more effectively.
Further, since the inside is a vacuum, deterioration of the sensor panel due to moisture is prevented, and the reliability of the element is improved.

A two-dimensional input module element according to a seventh aspect is the two-dimensional input module element according to the first aspect, wherein the envelope has a radiator structure, and the light source section is inside the envelope. Characterized by being in contact with the bottom surface.

According to the seventh aspect of the present invention, the light source unit of the heat generating source is brought into close contact with the inner bottom surface of the envelope made of a metal material having high thermal conductivity, and the heat of the light source unit is transferred to the envelope. The heat can be dissipated by being thermally coupled to the heat exchanger, and the heat can be dissipated more effectively by providing the radiator with a radiator structure.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION A two-dimensional input module element according to the present invention will be described in detail below with reference to the drawings of FIGS. In the following description, the same members are designated by the same reference numerals.

First, the two-dimensional sensor device used in the two-dimensional input module element of the present invention is a two-dimensional sensor panel for inputting information by reflection of light, which is filed by the present applicant in Japanese Patent Application No. 7-130152. The detailed description will be given with reference to FIGS. 1 to 3. As the two-dimensional sensor panel, a panel having another conventional structure can be used. 1 is a plan view of the two-dimensional sensor panel, FIG. 2 is a sectional view taken along the line AB of FIG. 1, and FIG. 3 is a sectional view taken along the line CD of FIG.

In FIG. 1, 1 is a transparent substrate, for which glass or the like is used. Reference numeral 2 denotes a stripe-shaped first electrode formed of a material having a high optical transmittance on the transparent substrate 1, and a material such as ITO is used. On the transparent substrate 1 on which the first electrode 2 is formed, the amorphous silicon layer 3 stacked in a stripe shape in a direction orthogonal to the first electrode 2 and the amorphous silicon layer 3 are optically transparent to nickel or the like. There is a stripe-shaped second electrode 4 formed of a material having a low rate. Further, at the end of the transparent substrate 1, there is a terminal portion 5 which is a region necessary for connecting a scanning signal.

Further, as shown in FIG. 2, in the AB cross section of FIG. 1, the first electrode 2, the amorphous silicon layer 3, and the second electrode 4 are laminated from the transparent substrate 1 side.
In this way, the photovoltaic cells 6 are formed in a two-dimensional matrix at the intersections of the first electrode 2 and the second electrode 4.

Further, as shown in FIG. 3, in the CD cross section of FIG. 1, only the first electrode 2 is laminated on the transparent substrate 1.
In the CD cross section of FIG. 1, only the transparent substrate 1 and the first electrode 2 are present, so that the optical transmittance of this portion is higher than that of the AB cross section of FIG. When the first electrode 2 is made of a transparent material such as ITO, the light transmittance can be about 80%.
When a glass substrate is used as the transparent substrate 1, the light transmittance is about 95%, so that the light transmittance in FIG.
It can be about%. Therefore, light incident on the transparent substrate 1 like the incident light X in FIG. 3 passes through the transparent substrate 1 and the first electrode 2 and is formed into a stripe-shaped amorphous silicon layer 3 shown by b in FIG. And passes through the gap of the second electrode 4 formed in a stripe shape and is transmitted to the back surface. On the contrary, the light incident as the incident light Y in FIG. 3 passes through the gap between the second electrode 4 and the amorphous silicon layer 3 formed in the stripe shape shown in FIG. Then, the light passes through the transparent substrate 1 and is transmitted to the back surface.

On the other hand, the light incident on a in FIG. 1 (the portion where the first electrode 2, the amorphous silicon layer 3 and the second electrode 4 overlap) is Y even if it is incident from the X direction in FIG. Even if it is incident from one direction, it does not penetrate to the opposite surface. This is because it is shielded by the second electrode 4 having an optically low transmittance. In this way, the photovoltaic cells 6 are formed in a two-dimensional matrix at the intersections of the first electrode 2 and the second electrode 4, and there is a difference in light transmittance between the first electrode 2 and the second electrode 4, The photocell does not respond to the light from the light source incident from the side where the second electrode 4 having the low light transmittance exists, while the light incident from the surface 7 where the first electrode 2 having the high light transmittance exists. The photovoltaic cell 6 responds only to the generation of photoelectromotive force. The sensor panel 12 is configured in this way.

Further, the amorphous silicon layer 3 has an extremely low electric conductivity in the lateral direction. Therefore, even if the amorphous silicon layer 3 is connected in a stripe shape, the photovoltaic cell 6 is formed only near the intersection of the first electrode 2 and the second electrode 4.
Is not formed, and the leakage between the photovoltaic cells in the lateral direction through the amorphous silicon is extremely low. Although the amorphous silicon layer 3 has a stripe-shaped structure in the present embodiment, the photovoltaic cells 6 may be photovoltaic cells that are completely separated from each other.

As a method of forming each electrode and the amorphous silicon layer on the transparent substrate 1, a thin film may be formed by using a CVD apparatus or the like and then etching may be performed by an appropriate method. The amorphous silicon layer 3 is formed on the first electrode in the order of the p-type semiconductor, the intrinsic layer, and the n-type semiconductor, or in the order of the n-type semiconductor, the intrinsic layer, and the p-type semiconductor. Form on top. There is no functional difference between them, and in short, the photovoltaic cell may be formed at the intersection of the first electrode 2 and the second electrode 4. The sensor panel shown in FIG. 1 does not depend on the number of photovoltaic cells formed in a matrix. That is, as long as it is a plurality, it may be four as used in the explanatory diagram, or a large number of 10,000 or more.

Now, with reference to FIG. 4, description will be given of how the information written on the original is input using the sensor panel of FIG.
4 is an EF cross section of the sensor panel of FIG. 1 (in FIG. 4,
The EF cross section is turned over), and a cross-sectional view of the two-dimensional input module device when mounted on the envelope 10 is shown.

In FIG. 4, the original 8 is placed on the surface 7 of the transparent substrate 1 when reading information. Information is written on the original 8 with ink 9, for example. When the light a and the light b of the light source are incident from the surface opposite to the surface on which the original 8 is placed, the incident light is transmitted through the portion b of the sensor panel, and the transmitted light a and the light b are further reflected by the original 8. Is reflected. At this time, the light B entering the original 8 where the character or graphic information is written in the ink 9 like the light B
Since it is absorbed by, the reflection is weak and almost no reflected light is emitted. On the other hand, conversely, the light which is incident on the unwritten portion of the original 8 such as the light b is a light c of strong reflection. Therefore, if the intensity of this light is detected as the intensity of the current generated by the photocell, the information written on the original 8 can be read.

The two-dimensional input module element of the present invention has a structure that can be inserted into a printed circuit board or an IC socket by using the two-dimensional sensor panel for inputting information by light reflection described in FIGS. 1 to 4. Thus, anyone can easily use it as a module element of an electronic component.

Therefore, the two-dimensional input module element of the present invention will be described with reference to FIGS. 5 is a perspective view of the overall structure of a two-dimensional input module element as a module component, and FIG. 6 is a cross-sectional view of the two-dimensional input module element of FIG.

In FIG. 5, there are a plurality of metal electrode pins 11 protruding from the inside of the envelope 10 having a flat package structure. The electrode pins 11 can be easily inserted into a printed circuit board, an IC socket or the like. The shape is possible. Further, the electrode pin 11 projects so as to surround the side surface 13 of the envelope 10 having the flat package structure. The number of electrode pins 11 may be the required number of pins,
Only the necessary portion of the side surface 13 needs to be projected. Envelope 1
0 The sensor panel 12 is arranged in the upper opening 14 so that the sensor panel 12 can be seen. In the opening 14, the photocells 6 as the light receiving parts are arranged in a matrix. You can read the information by placing the manuscript you want to input. That is, the light source of the light for reflecting the document surface is inside the envelope 10, and the light 16 emitted from the inside passes through the sensor panel 12, and the light reflected by hitting the document surface is received by a plurality of light receiving portions. Photovoltaic 6
Are sequentially scanned and detected.

Here, in order to improve the SN of the signal, the scanning section and the like mounted inside the envelope 10 handles extremely minute signals (for example, the output signal of the photocell 6 is of the nA order). Noise measures are essential. In the present invention, the envelope 10 is made of a metal material having a high shielding effect for shielding external noise from the outside. The material is preferably aluminum or copper in terms of cost. The envelope 10 made of a metal material is provided with an insulating material 17 in order to insulate the envelope 10 from the electrode pin 11. The envelope 10 is made of a metal material except for the place where the opening 10 and the electrode pin 11 project, and is connected to the ground.

As for the reading range of the document information, when the document is placed so as to close the opening 14, the range corresponding to the area of the opening 14 can be read. Since it is a shape as an electronic part, it can be input in a narrow range, but by taking advantage of the small size and flat structure shape and taking advantage of a part that can be mounted anywhere, a 2D input module element
A wide information range can be read by inputting while being mounted on the Y mechanism means while moving along the original, or while moving the original along the two-dimensional input module element.

Next, the arrangement of the electrode pins will be described. In order to use it as an electronic component, it must be easily attached to a printed circuit board or an IC socket. Especially the DI of the IC package which is now popular
It is desirable to unify the pin intervals called P type. DIP type pins have a pin spacing of 2.54 mm
(0.1 inch), the electrode pin 11 of FIG.
Has a pin spacing of 2.54 mm (0.1 inch). Further, since the two-dimensional input module element of the present invention scans a plurality of photocells, the number of signal lines is very large, and the pin spacing of 2.54 mm pitch around the envelope 10 may be insufficient. Accordingly, it may be 1.27 mm. Further, in some cases, the gap between the electrode pins may fly. In any case, the interval is set to an integral multiple of 1.27 mm so that it can be easily inserted into a printed circuit board or an IC socket.

Next, the internal structure of the two-dimensional input module element shown in FIG. 5 will be described with reference to FIG.

In the interior 40 surrounded by the envelope 10, the sensor panel 12 and the light source section 25 are laminated in close contact with each other, and the upper part of the sensor panel 12 is laminated in close contact with the glass plate 20. These are attached so as to close the opening 14 of the envelope 10, and the sensor panel 12 and the envelope 10 are hermetically sealed by bonding. In addition, the scanning unit 22 that sequentially scans the plurality of photovoltaic cells of the sensor panel 12,
The flexible substrate 21 that can be easily folded is placed on the flexible substrate 21 and connected to the signal lines forming the flexible substrate 21 and the signal lines forming the photocells of the sensor panel 12. To guide the output signal line of the flexible substrate 21 to the outside of the envelope 10, the electrode pin 11b is used.
Connect to. Further, in order to guide the drive signal of the light source unit 25 from the outside, it is input from the electrode pin 11a. The input terminal of the light source unit 25 and the electrode pin 11a are connected by the wire lead 23. As described above, each input / output signal line is connected to the electrode pin 11
By connecting to a and 11b, it is possible to construct a flat package that is guided to the outside of the envelope 10 and can input / output each signal.

Next, how the device is mounted will be described with reference to FIGS. 7 and 8. FIG. 7 shows a state of the element before being mounted on the envelope 10. Here, the scanning unit 22 (22 which sequentially scans the plurality of photovoltaic cells 6 of the sensor panel 12
a, 22b) is placed on a flexible substrate 21 that can be easily bent, and a plurality of signal lines of the flexible substrate 21 and a plurality of signal lines forming a plurality of photocells of the sensor panel 12 are connected to each other.

That is, in FIG. 7, the sensor panel 1
The plurality of signal lines forming the plurality of two photocells 6 are connected to the signal line of the scanning unit 22a that sequentially scans the plurality of photocells of the sensor panel 12 fixed to the flexible substrate 21 in the X direction at the connection point 32. By doing so, the signal line 30 for taking out the output is formed. Similarly, a plurality of signal lines forming the photocell 13 and a signal line of the scanning unit 22b that sequentially scans the plurality of photocells of the sensor panel 12 fixed to the flexible substrate 21 in the Y direction are connected at a connection point 33. By doing so, the signal line 31 for taking out the output is formed. Signal line 3
0 and 31 are connected to the electrode pins 11b and 11c (the electrode pin 11c is not shown because the side surface of the envelope 10 is not visible) attached to the envelope 10 of FIG.
I can input and output to the outside of 0.

Further, FIG. 8 shows a state in which the flexible substrate 21 is bent when it is mounted. In FIG.
A scanning unit 22a that sequentially scans the plurality of photovoltaic cells 6 in the X direction.
Since the flexible substrate 21 on which the scanning portion 22b for sequentially scanning the photocells in the Y direction is mounted is bent so as to be below the sensor panel 12, the flexible substrate 21 can be housed inside the envelope. Further, when bent as shown in FIG. 8, the light source unit 25 is provided between the sensor panel 12 and the flexible substrate 21.
Can be sandwiched.

Next, the upper structure of the sensor panel of the two-dimensional input module element of the present invention will be described with reference to FIG. FIG. 9A shows a state in which the glass plate 20 is provided (see FIG.
9B shows the state of only the sensor panel 12. For two-dimensional input that requires clear information input, it is better not to have the glass plate 20 in terms of light transmittance as shown in FIG. 9B, but normally, as shown in FIG. 9A, A glass plate 20 is provided. The purpose of blocking with the glass plate 20 is to protect the sensor panel 12. The sensor panel 12 is very thin, and it may be cracked by the pressure when pressing the original so that the sensor panel 12 is in close contact with the sensor panel 12.
It is also for protecting the surface of the sensor panel 12 from dirt and scratches and preventing the light transmittance of the sensor panel 12 itself from being lowered due to dirt and scratches. However,
If the glass plate 20 is made thick, the light transmittance is also lowered. Therefore, the glass plate 20 should be made as thin as possible so that it can be replaced when it becomes dirty. Further, by closing the opening with the glass plate 20, the airtightness of the inside of the envelope 10 is further enhanced, and it is less affected by humidity and temperature changes from the outside, and there is also an effect of preventing deterioration of the sensor panel 12. In addition, in FIG.
It is necessary to make the envelope 10 and the member that closes the opening of the envelope 10 flat so that the movement of the original that comes to the upper part of the opening is not obstructed when the original is brought into close contact with the original. is there.

In the above specific two-dimensional input module element, the distance between the electrode lines of the mounted sensor panel is 30.
The input range is about 3 cm square because 100 μm matrix of 0 μm was used. The device, which was mounted on the envelope 10 as shown in FIG. 5 and sealed with the glass 20, and finally packaged had an outer shape of about 4 cm square when viewed from above. This embodiment is approximately 4c when viewed from above.
Although it is provided as a component of about m square, in order to use this input element as an electronic component, it is required to have a compact one that can be easily soldered or fixed to the board, but the input range A wide element with a wide opening 14 is required. Therefore, the size of the envelope may be set according to the amount of information input, and the opening 14 of the envelope 10 may be rectangular.

As the light source section 25, in this embodiment,
Although a surface emitting LED (backlight) is used, an EL (backlight) may be used. Although not shown, a light source including a cold cathode fluorescent lamp or a hot cathode fluorescent lamp used as a backlight of a liquid crystal panel may be used. Since the LED can be driven at a voltage of 5V with a low TTL level, it can be used for signal processing from the sensor panel.
Does not affect noise. Moreover, the LED requires almost no peripheral circuit for emitting light, and this time, the VCO was driven by only one. The LEDs used in the surface emitting LED display have uniform light emission in every corner regardless of the illumination area of 3 cm square. This made it possible to reduce the thickness and noise.

Next, the signal processing system of the two-dimensional input module element of the present invention will be described with reference to FIGS.

In FIG. 10, the sensor panel 12, the scanning section 22, the light source section 25, the light source driving section 41 for operating the light source section 25, and the light quantity are provided inside the envelope 40 of the two-dimensional input module element. The adjustment unit 42, the current-voltage conversion amplification unit 45, and the gain adjustment unit 46 are mounted. Here, the signal processing unit includes the scanning unit 22, the current-voltage conversion amplification unit 4
5, the gain adjusting unit 46, and the output current detected by sequentially scanning the plurality of photocells of the sensor panel 12 by the scanning unit 22 is converted by the current-voltage conversion amplification unit 45 and taken out from the electrode pin of the envelope. . If the minute current is taken out as it is, the output current from the scanning unit 22 may be taken directly from the electrode pin of the envelope. In that case, the current-voltage conversion amplification unit 45 and the gain adjustment unit 46 are unnecessary. is there. Further, when the light amount adjustment is not performed, the light amount adjusting unit 42 is unnecessary.

Here, the light source driving section 41 includes a light quantity adjusting section 42 for adjusting the light quantity of the light source section 25 so that the output signal from the sensor panel 12 can be adjusted. Since the light source unit 25 uses LEDs, the light source driving unit 41 is composed of a VCO circuit, and the output signal from the sensor panel 12 can be adjusted by changing the voltage signal of this circuit by the light amount adjusting unit 42. There is. Here, the light quantity adjusting unit 42 is adjusted by a user by an adjusting trimmer 72 from outside the envelope. This state is shown in FIG.
Is an adjusting trimmer 72. By doing this,
The output signal can be adjusted according to the characteristics of the sensor panel 12. The signal input from outside the envelope is
Only the signal 43 of the circuit power supply of the light source driving unit 41 and the scanning signal 44 of the scanning unit 22 are required.

Next, the sensor panel 12 and the light source section 25
A case will be described in which the output signal with respect to the change with time is provided outside the envelope so that the user can adjust the output signal as necessary. Here, a current-voltage conversion amplification unit 45 that converts and amplifies an output signal (current signal) obtained by scanning the sensor panel 12 is mounted inside the envelope 40. A gain adjusting unit 46 is provided that is capable of adjusting the gain of the current-voltage converting / amplifying unit 45 that receives the output signal from the sensor panel 12, and the gain adjusting unit 46 is an adjustment trimmer 71 (FIG. 11) from the outside of the envelope. Allows the user to adjust. In this way, the sensor panel 12
By mounting the current-voltage converting / amplifying unit 45 for converting the output signal from the inside of the envelope, it becomes possible to use the current-voltage converting and amplifying unit 45 more easily without the need for external parts. Further, a stable signal can be obtained by amplifying a minute signal from the sensor panel 12 inside the envelope having a shield effect and outputting the amplified signal to the outside after the amplification. As a result, it is possible to provide a module element that outputs a signal in the best state.

Next, a two-dimensional input module element provided with measures against heat from the light source will be described with reference to FIG.

In FIG. 12, the sensor panel 12 and
The light source unit 25 and the current-voltage conversion amplification unit 45 are connected to the envelope 1
It is mounted in the interior 40 of 0, and the opening of the envelope 10 is hermetically sealed by the sensor panel 12. If the light source unit 25 is in direct contact with the sensor panel 12 or the current / voltage conversion / amplification unit 45, the heat generated from the light source unit 25 is thermally coupled, so here, the light source unit 25 is floated and fixed by the spacer 90. I try not to make direct contact. Further, the inside 40 of the envelope 10 is kept in vacuum for heat insulation. In this manner, the sensor panel 12 is hermetically sealed, and the heat generated by the light emission of the light source unit 25 when the sensor panel 12 and the current-voltage conversion amplification unit 45 are in contact with the light source unit 25 is thermal. Sensor device 12 according to the temperature characteristics by being vacuum-insulated by being held in a vacuum so as not to be connected to
It is possible to prevent the change in the characteristics of the above, and the change in the bias current of the FET input OP amplifier of the amplification section used for amplifying the minute signal.

In particular, the circuit configuration of the current-voltage converting / amplifying unit 45 uses a high-precision OP amp because the signal from the sensor panel is very small, and uses a component with a small input bias current of the FET input. There are many. In this case, although it is also described in the OP amplifier data book (for example, OPA111 used this time), the input bias current changes significantly with respect to the temperature change, which greatly affects the amplified signal. In other words, the heat generated by the light emission of the light source affects the temperature characteristics of the high-precision OP amp, so heat generation measures are important.

Further, another two-dimensional input module element provided with measures against heat from the light source section will be described with reference to FIG.

In FIG. 13, the envelope is formed by closely adhering the light source unit 25 to the inner bottom surface of the envelope made of a metal material having thermal conductivity, so that the heat generated by the light emission from the light source unit 25 is removed. It is thermally connected to the enclosure 10. Envelope 10
Is provided with a radiator 91 having a fin structure or a protrusion structure so as to effectively radiate the heat generated by the light emission from the light source unit 25. By thermally connecting the heat of the light source to the envelope 10 in this manner, the heat can be released.

Further, in the present embodiment, the light source section 25 is used from below the sensor panel 12 in a state of full illumination. However, in order to detect a plurality of photocells of the sensor panel 12, a signal synchronized with the synchronization signal is used. The LED may be pulsed. By lighting in this way, heat generation can be prevented.

As described above, it becomes possible to provide a small-sized electronic component capable of two-dimensional input required for a portable information terminal, and it is promising as an opto-device component in the future.

[0059]

According to the first aspect of the present invention, by modularizing, it can be easily attached to a portable information device, a printed circuit board or the like as an electronic component capable of two-dimensional input. Also, since the envelope has a shield effect and the signal line is short,
Since the lead inductance and stray capacity can be made extremely small, it is possible to provide an electronic component that is less susceptible to external noise and that can obtain a signal with a good SN ratio.

According to the second invention, it is possible to provide an electronic component capable of two-dimensional input which can be easily inserted into a printed circuit board by anyone.

According to the third invention, the sensor panel surface can be protected.

According to the fourth aspect of the present invention, adjustment can be made according to the shading of input information, the difference in individual characteristics of the sensor panel, and the change over time of the sensor panel and the light source. You can get a signal.

According to the fifth aspect of the present invention, a stable signal can be obtained, adjustment can be made according to the shading of input information, the difference in individual characteristics of the sensor panel, and the change over time of the sensor panel and the light source. After that, the user can obtain the optimum output signal.

According to the sixth invention, it is possible to improve the reliability of the element, suppress the temperature characteristic change of the sensor panel or the temperature characteristic change of the signal converting / amplifying section, and stably output the output signal.

According to the seventh invention, it is possible to improve the reliability of the element, suppress the temperature characteristic change of the sensor panel or the temperature characteristic change of the signal processing section, and stably take out the output signal.

[Brief description of drawings]

FIG. 1 is a plan view of a sensor panel according to an embodiment of the present invention.

FIG. 2 is an AB sectional view of the sensor panel of FIG.

FIG. 3 is a CD sectional view of the sensor panel of FIG.

FIG. 4 is a diagram showing how information is input to a sensor panel.

FIG. 5 is a perspective view showing a two-dimensional input module element according to an embodiment of the present invention.

FIG. 6 is a sectional view of a two-dimensional input module element according to an embodiment of the present invention.

FIG. 7 is a diagram showing a connection relationship between a sensor panel and a scanning unit according to the embodiment of the present invention.

FIG. 8 is a diagram showing how the two-dimensional module element is mounted on the envelope.

FIG. 9 is a diagram showing a sealed state of the two-dimensional module element according to the embodiment of the present invention.

FIG. 10 is a diagram showing a signal processing unit of the two-dimensional input module element according to the embodiment of the present invention.

FIG. 11 is a perspective view showing a two-dimensional input module device including an adjustment trimmer according to an embodiment of the present invention.

FIG. 12 is a diagram showing heat countermeasure processing of the light source unit according to the embodiment of the present invention.

FIG. 13 is a diagram showing another heat countermeasure process of the light source unit according to the embodiment of the present invention.

[Explanation of symbols]

11 electrode pins 12 sensor panel 14 openings 16 light 20 glass plates 21 Flexible substrate 22 Scanning unit 25 Light source

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H04N 1/04 G06F 3/03 G06K 9/20 G06T 1/00

Claims (7)

(57) [Claims] 1. A sensor panel comprising a plurality of photocells formed in a two-dimensional matrix, a surface emitting light source section for radiating light to an original, and an original obtained by irradiating the original with light from the light source section. And a signal processing unit for processing an output signal obtained by sequentially scanning the plurality of photocells with reflected light, which is mounted inside an envelope made of a metal material, and the opening of the envelope is provided with the sensor panel. A two-dimensional input, characterized in that the signal line of the light source unit and the signal line of the signal processing unit are closed by an electrode pin provided around the envelope inside the envelope. Module element. 2. The two-dimensional input module element according to claim 1, wherein the electrode pins are arranged at a positive multiple of a predetermined interval. 3. The two-dimensional input module element according to claim 1, wherein the opening is covered with a protective film. 4. The two-dimensional input module element according to claim 1, wherein a light amount adjusting means for adjusting the light amount of the light source unit is provided in the envelope in order to adjust an output signal from the sensor panel. A two-dimensional input module device characterized by the above. 5. The two-dimensional input module element according to claim 1, wherein the signal processing section includes a signal conversion amplification section that converts a current signal, which is an output signal from the sensor panel, into a current-voltage signal for amplification. A two-dimensional input module device, wherein the envelope is provided with a gain adjusting means for adjusting an output signal from the sensor panel. 6. The two-dimensional input module element according to claim 1, wherein the signal processing section includes a signal conversion amplification section that converts a current signal, which is an output signal from the sensor panel, into a current-voltage signal for amplification. The light source section and the signal conversion amplification section are thermally separated,
A two-dimensional input module element, wherein the opening of the envelope is hermetically sealed and the inside of the envelope is held in vacuum. 7. The two-dimensional input module element according to claim 1, wherein the envelope has a radiator structure, and the light source unit is in contact with an inner bottom surface of the envelope. Two-dimensional input module device.