JP3396124B2 - Substrate cleaning brush - Google Patents

Substrate cleaning brush

Info

Publication number
JP3396124B2
JP3396124B2 JP35497595A JP35497595A JP3396124B2 JP 3396124 B2 JP3396124 B2 JP 3396124B2 JP 35497595 A JP35497595 A JP 35497595A JP 35497595 A JP35497595 A JP 35497595A JP 3396124 B2 JP3396124 B2 JP 3396124B2
Authority
JP
Japan
Prior art keywords
brush
substrate
cleaning
main body
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP35497595A
Other languages
Japanese (ja)
Other versions
JPH09181025A (en
Inventor
讓一 西村
伸康 平岡
忠司 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP35497595A priority Critical patent/JP3396124B2/en
Publication of JPH09181025A publication Critical patent/JPH09181025A/en
Application granted granted Critical
Publication of JP3396124B2 publication Critical patent/JP3396124B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cleaning In General (AREA)
  • Brushes (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、半導体ウエハ、
液晶表示装置用或いはフォトマスク用のガラス基板、光
ディスク用の基板等の各種基板を水平姿勢に保持して鉛
直軸回りに回転させながら基板上へ洗浄液を供給して基
板をブラシ洗浄する基板洗浄装置において使用される基
板洗浄用ブラシに関する。
TECHNICAL FIELD The present invention relates to a semiconductor wafer,
A substrate cleaning device that holds various substrates such as a glass substrate for a liquid crystal display device or a photomask and a substrate for an optical disk in a horizontal posture and supplies a cleaning liquid onto the substrate while rotating the substrate around a vertical axis to brush-clean the substrate. The present invention relates to a substrate cleaning brush used in.

【0002】[0002]

【従来の技術】洗浄用ブラシによって基板を洗浄する基
板洗浄装置の構成及び動作の1例を簡単に説明すると、
基板、例えば半導体ウエハをスピンチャックの上面側に
真空吸着によって水平姿勢に保持し、スピンチャックに
保持された基板を鉛直軸回りに回転させながら、その基
板上に純水等の洗浄液を供給し、ブラシ保持アームのブ
ラシ回転軸を回転させ、その回転軸に固着されブラシ保
持アームによって懸吊状態に保持された洗浄用ブラシを
自転させながら上方位置から下降させて、洗浄用ブラシ
の下端を基板表面に接近させ、洗浄用ブラシ下端を基板
表面に接触させ或いは近接させた状態で、自転している
洗浄用ブラシを回転している基板の表面に沿って基板上
を、例えば中心部から周縁部に向かって移動させること
により、基板の洗浄を行なうようにする。このような基
板洗浄装置においては、使用により劣化した洗浄用ブラ
シを交換したり、基板の種類や洗浄の目的などに応じて
洗浄用ブラシの種類を変えたりしている。このため、洗
浄用ブラシは、ブラシ保持アームのブラシ回転軸への取
付け及びブラシ回転軸からの取外しができるようになっ
ている。
2. Description of the Related Art An example of the structure and operation of a substrate cleaning apparatus for cleaning a substrate with a cleaning brush will be briefly described.
A substrate, for example, a semiconductor wafer is held in a horizontal posture on the upper surface side of a spin chuck by vacuum suction, and a cleaning liquid such as pure water is supplied onto the substrate while rotating the substrate held by the spin chuck about a vertical axis. The brush rotating shaft of the brush holding arm is rotated, and the cleaning brush fixed to the rotating shaft and held in a suspended state by the brush holding arm is rotated and lowered from the upper position, and the lower end of the cleaning brush is placed on the substrate surface. And the lower end of the cleaning brush is brought into contact with or close to the surface of the substrate, the rotating cleaning brush is moved along the surface of the rotating substrate onto the substrate, for example, from the central portion to the peripheral portion. The substrate is cleaned by moving it toward. In such a substrate cleaning apparatus, the cleaning brush that has deteriorated due to use is replaced, or the type of cleaning brush is changed according to the type of substrate and the purpose of cleaning. Therefore, the cleaning brush can be attached to and detached from the brush rotation shaft of the brush holding arm.

【0003】洗浄用ブラシは、ブラシホルダとブラシ本
体とから構成され、ブラシ本体としては、下面側に多数
のナイロン製の毛を植設して形成されたものやモヘアで
形成されたものなどが使用されている。また、最近で
は、例えばポリビニルアルコール(PVA)を原料とし
て製造され親水性を有するスポンジ状の多孔質素材によ
って形成されたブラシ本体も使用されている。特に、P
VAを原料として製造されたスポンジ状多孔質素材から
なるブラシ本体は、洗浄効果が高く、その下面を回転す
る基板の表面に所定の圧力で押し付けた状態で基板の洗
浄を行なうようにするときには、さらに洗浄効果が高く
なる。
The cleaning brush is composed of a brush holder and a brush main body. As the brush main body, one formed by implanting a large number of nylon bristles on the lower surface side or one formed by mohair is used. It is used. In addition, recently, a brush body made of, for example, polyvinyl alcohol (PVA) as a raw material and made of a hydrophilic sponge-like porous material is also used. In particular, P
The brush body made of a sponge-like porous material produced from VA as a raw material has a high cleaning effect, and when the lower surface of the brush main body is pressed against the surface of the rotating substrate with a predetermined pressure, the substrate is cleaned. Further, the cleaning effect is enhanced.

【0004】[0004]

【発明が解決しようとする課題】ところで、親水性を有
するスポンジ状の多孔質素材で形成されたブラシ本体
は、乾燥状態において成形加工され、乾燥した状態でブ
ラシホルダに組み込まれる。そして、組み立てられた洗
浄用ブラシは、容器内に収納されて保管及び輸送され、
半導体製造工場等のユーザにおいて、洗浄用ブラシを使
用する前にブラシ本体に純水等の洗浄液を十分に含浸さ
せて、ブラシ本体を一旦湿潤状態にしてから使用され
る。このように、親水性を有するスポンジ状の多孔質素
材からなるブラシ本体は、乾いた状態では全く弾力性が
無く硬質物化しているため、これに純水等を含浸させて
使用可能な状態にまで軟らかくしているが、この際、ブ
ラシ本体が吸水によって膨潤する。このため、乾燥状態
においてブラシ本体を成形加工してブラシホルダに組み
込んだときには、ブラシホルダ内にブラシ本体がきちん
と収まってブラシ本体下面が平面状となっていても、
に示すように、ブラシ本体1の膨張がブラシホルダ2
によって局部的に規制されることにより、ブラシホルダ
2による規制を受けていないブラシ本体下面3が湾曲す
るなどして変形することがある。
By the way, a brush main body formed of a hydrophilic sponge-like porous material is molded in a dry state and incorporated in a brush holder in a dry state. Then, the assembled cleaning brush is stored in a container, stored and transported,
A user in a semiconductor manufacturing factory or the like uses a cleaning brush such that pure water or the like is sufficiently impregnated in the cleaning brush body before the cleaning brush is used, so that the cleaning brush body is temporarily wet. As described above, since the brush body made of the hydrophilic sponge-like porous material has no elasticity in the dry state and is hardened, it is impregnated with pure water or the like to be ready for use. However, at this time, the brush body swells due to water absorption. Thus, when incorporated into the brush holder by molding the brush body in a dry state, be made brush body underside a planar falls brush body neatly into the brush holder, Fig.
As shown in FIG. 3 , the expansion of the brush main body 1 causes the brush holder 2 to
By being locally regulated by the brush holder 2, the lower surface 3 of the brush main body, which is not regulated by the brush holder 2, may be bent or deformed.

【0005】また、図4に示したブラシ本体4のよう
に、水平姿勢に保持された基板の表面に接触するブラシ
本体下面5が水平面6に対して傾斜している場合があ
る。
In some cases, like the brush body 4 shown in FIG. 4 , the lower surface 5 of the brush body, which comes into contact with the surface of the substrate held horizontally, is inclined with respect to the horizontal plane 6.

【0006】図3や図4に示したように、使用状態にお
いてブラシ本体の下面が湾曲するなど変形していたり水
平面に対し傾斜していたりすると、回転する基板の表面
にブラシ本体の下面を所定の圧力で押し付けて基板の洗
浄を行なうようにした場合に、基板の表面に形成された
膜種によっては、基板の膜面にダメージを与えてしまう
ことがある。すなわち、ブラシ本体の下面が変形したり
水平面に対し傾斜したりしていると、洗浄用ブラシが下
降して回転中の基板の表面に当接する際に、ブラシ本体
の下面全体ではなくて先ずその一部が基板表面に当接す
ることになるため、基板の表面に対してスポット的に比
較的大きな荷重がかかることになり、基板の表面にアル
ミ膜等の柔らかい被膜が形成されているようなときに、
ブラシ本体の下面が基板の表面に当接する時点で基板の
膜面にダメージが発生する。また、このダメージは、特
に基板の中心部のように周速度が小さい部分において発
生し易くなる。
As shown in FIGS. 3 and 4, when the lower surface of the brush main body is deformed such as curved or inclined with respect to the horizontal plane in the use state, the lower surface of the brush main body is predetermined on the surface of the rotating substrate. When the substrate is cleaned by pressing with the pressure of 1, the film surface of the substrate may be damaged depending on the film type formed on the surface of the substrate. That is, when the lower surface of the brush body is deformed or inclined with respect to the horizontal plane, when the cleaning brush descends and comes into contact with the surface of the rotating substrate, first, not the entire lower surface of the brush body, Since a part of it comes into contact with the surface of the substrate, a relatively large load is applied to the surface of the substrate in spots, and when a soft coating such as an aluminum film is formed on the surface of the substrate. To
When the lower surface of the brush body comes into contact with the surface of the substrate, the film surface of the substrate is damaged. Further, this damage is likely to occur particularly in a portion having a low peripheral speed, such as the central portion of the substrate.

【0007】この発明は、以上のような事情に鑑みてな
されたものであり、基板を水平姿勢に保持して鉛直軸回
りに回転させながら基板上へ洗浄液を供給して基板をブ
ラシ洗浄する場合において、基板の表面に柔らかい被膜
が形成されているようなときでも、基板の膜面に対して
ダメージを与えることなく基板の洗浄を行なうことがで
きる基板洗浄用ブラシを提供することを目的とする。
The present invention has been made in view of the above circumstances, and in the case where the substrate is held in a horizontal posture and rotated around a vertical axis to supply a cleaning liquid onto the substrate to brush-clean the substrate. In order to provide a substrate cleaning brush capable of cleaning the substrate without damaging the film surface of the substrate even when a soft coating is formed on the surface of the substrate. .

【0008】[0008]

【課題を解決するための手段】請求項1に係る発明は、
基板を水平姿勢に保持して回転させながら基板上へ洗浄
液を供給するとともにブラシを自転させつつ基板の中心
部と周縁部との間で移動させて基板を洗浄する基板洗浄
装置に取り付けられ、上面側に基板洗浄装置のブラシ回
転軸に係止される係止部が形設されたブラシホルダと、
このブラシホルダに取着され、水平姿勢に保持された基
板の表面に下面が接触して基板を洗浄するブラシ本体
を備えた基板洗浄用ブラシにおいて、前記ブラシ本体
を、親水性を有するスポンジ状の多孔質素材によって形
成し、そのブラシ本体の下面を、前記ブラシホルダにブ
ラシ本体を取着して湿潤させた状態において基板の表面
と平行になるように平面状に形成するとともに、ブラシ
本体の下面の中央部を周縁部より凹ませて基板表面と接
触する凹面としたことを特徴とする
The invention according to claim 1 is
Cleaning the substrate while holding it horizontally and rotating it
Center of substrate while supplying liquid and rotating brush
The substrate by moving it between the edge and the edge to clean the substrate
A brush holder attached to the apparatus and having an engaging portion formed on the upper surface side to be engaged with the brush rotating shaft of the substrate cleaning apparatus ;
A brush main body that is attached to this brush holder and has its lower surface contacting the surface of the substrate held in a horizontal position to wash the substrate.
A brush for cleaning a substrate, comprising:
Is formed by a hydrophilic sponge-like porous material.
The bottom of the brush body to the brush holder.
When the brush body is attached and moistened, it is formed into a flat surface so that it is parallel to the surface of the substrate.
Make sure that the center of the bottom surface of the main unit
It is characterized by having a concave surface to be touched .

【0008】また、請求項2に係る発明は、請求項1記
載の基板洗浄用ブラシにおいて、上記ブラシ本体の下面
の中央部を周縁部より凹ませたことを特徴とする。
The invention according to claim 2 is the brush for cleaning a substrate according to claim 1, characterized in that the central portion of the lower surface of the brush body is recessed from the peripheral portion.

【0009】請求項2に係る発明は、請求項1記載の基
板洗浄用ブラシにおいて、上記ブラシ本体が、PVAを
原料として製造されたものであることを特徴とする。
[0009] The invention according to claim 2 is the substrate cleaning brush of claim 1 Symbol placement, the brush body, characterized in that one prepared PVA as raw material.

【0010】請求項1に係る発明の基板洗浄用ブラシで
は、ブラシホルダにブラシ本体を取着して湿潤させた状
においてブラシ本体の下面が基板の表面と平行になる
ように平面状に形成されているため、ブラシ本体の下面
が基板の表面に当接する際に、ブラシ本体の下面全体で
基板表面に接触し、基板の表面に対してスポット的に大
きな荷重がかかることがない。従って、基板の膜面に対
して与えられるダメージが低減される。また、基板の表
面へのブラシ本体の当接を先ず基板の中心部において行
なう場合においては、基板の中心部は周速度が小さいた
めに基板の膜面にダメージが発生し易いが、基板の中心
部に対応する、ブラシ本体下面の中央部が凹んでいるこ
とにより、基板の中心部へのブラシ本体の当接時におけ
る膜面のダメージが低減される。
In the substrate cleaning brush according to the first aspect of the present invention , the brush main body is attached to the brush holder and wetted.
In this state , since the lower surface of the brush main body is formed to be parallel to the surface of the substrate, when the lower surface of the brush main body contacts the surface of the substrate, the entire lower surface of the brush main body contacts the substrate surface. A large load is not applied to the surface of the substrate in a spot. Therefore, the damage given to the film surface of the substrate is reduced. Also, the board table
The contact of the brush body to the surface is first performed in the center of the board.
In this case, the peripheral speed of the central part of the substrate is small.
Therefore, the film surface of the substrate is likely to be damaged, but the center of the substrate
The bottom part of the brush body that corresponds to the
To prevent the brush body from touching the center of the board.
Damage on the film surface is reduced.

【0011】[0011]

【0012】請求項2に係る発明の基板洗浄用ブラシで
は、PVAを原料として製造されたブラシ本体は、乾燥
した状態と湿潤状態とでは外形が変化するが、使用状態
においてブラシ本体の下面が基板の表面と平行になるよ
うに平面状に形成されていることにより、ブラシ本体の
下面全体で基板表面に当接することになる。
[0012] In the substrate cleaning brush of the invention according to claim 2, brush body manufactured PVA as raw material, although the outer shape is changed in a dry state and a wet state, the lower surface of the brush body in the usage state By being formed in a plane shape so as to be parallel to the surface of the substrate, the entire lower surface of the brush main body comes into contact with the surface of the substrate.

【0013】[0013]

【発明の実施の形態】以下、この発明の最良の実施形態
について図面を参照しながら説明する。
BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below with reference to the drawings.

【0014】図1ないし図2は、この発明の実施形態の
1例を示し、図1は、基板洗浄用ブラシを分解した状態
を示す斜視図、図2は、基板洗浄用ブラシを組み立てた
状態を示す縦断面図である。
1 and 2 show an example of an embodiment of the present invention. FIG. 1 is a perspective view showing a state in which a substrate cleaning brush is disassembled, and FIG. 2 is a state in which a substrate cleaning brush is assembled. FIG.

【0015】この基板洗浄用ブラシは、上部取着部10
と下部保持部12とからなるブラシホルダにブラシ本体
14を保持して構成されている。ブラシ本体14は、上
半部が大径に形成され、下半部が大径部16より小径の
小径部18となっており、下面の中央部が周縁部より凹
んで凹面20となっている。このブラシ本体14は、親
水性を有するスポンジ状の多孔質素材、例えばPVAを
原料とした多孔質素材により形成されている。多孔質素
材は、例えば、PVAに酸を触媒としてホルムアルデヒ
ドを結合させるホルマール化反応によりポリビニルホル
マールを生成し、その際、気孔生成剤を加えて気孔形成
を行ない、不溶性の多孔質基質が完成した後、気泡生成
剤を抽出することにより製造される。この素材により形
成されたブラシ本体14は、連続的な気孔が形成され、
親水性を有し、湿潤時には良好な柔軟性、弾力性を呈
し、乾燥時には全く弾力性が無くなって硬質物化する。
This substrate cleaning brush has an upper mounting portion 10.
The brush main body 14 is held by a brush holder composed of the lower holding section 12 and the lower holding section 12. The brush main body 14 has an upper half portion having a large diameter, a lower half portion having a smaller diameter portion 18 having a smaller diameter than the large diameter portion 16, and a central portion of the lower surface having a concave surface 20 recessed from the peripheral portion. . The brush body 14 is formed of a hydrophilic sponge-like porous material, for example, a porous material made of PVA as a raw material. The porous material is, for example, polyvinyl formal is produced by a formalization reaction in which formaldehyde is bound to PVA using an acid as a catalyst, and at that time, a pore-forming agent is added to perform pore formation, and an insoluble porous substrate is completed. , Produced by extracting the bubble-generating agent. The brush body 14 made of this material has continuous pores,
It has hydrophilicity, exhibits good flexibility and elasticity when wet, and loses elasticity at all when dried to become a hard material.

【0016】ブラシホルダの上部取着部10の上面中央
部には、この洗浄用ブラシを基板洗浄装置のブラシ回転
軸に取着するために、周面に雄ねじ24が螺刻されると
ともに上端面の中央部に角穴26が軸心線方向に穿設さ
れた係止部22が一体に突設されている。上部取着部1
0の下半部は、上半部に比べて若干細く形成されてお
り、この下半部の嵌合部28に円筒状の下部保持部12
の上端部が嵌着される。図1中の符号30は、上部取着
部10の嵌合部28の外周面に形設された係止小突起で
あり、符号32は、嵌合部28に下部保持部12の上端
部を嵌着したときに係止小突起30と係合する係止小凹
部である。下部保持部12の外径寸法は、上部取着部1
0の上半部の外径と同じにし、また、下部保持部12の
内径寸法は、ブラシ本体14の大径部16の外径より僅
かに大きくされている。また、下部保持部12の下端近
くの内周面には、支持環状部34が一体に形設されてい
る。支持環状部34の内径寸法は、ブラシ本体14の小
径部18の外径より僅かに大きくかつ大径部16の外径
より小さくされている。このブラシホルダは、例えばポ
リプロピレン等のプラスチック材によって形成される。
At the center of the upper surface of the upper attachment portion 10 of the brush holder, a male screw 24 is threaded on the peripheral surface and the upper end surface is attached to attach the cleaning brush to the brush rotating shaft of the substrate cleaning apparatus. A locking portion 22 having a square hole 26 bored in the axial direction is integrally provided at the center of the locking portion 22. Upper mounting part 1
The lower half portion of 0 is formed to be slightly thinner than the upper half portion, and the cylindrical lower holding portion 12 is fitted to the fitting portion 28 of the lower half portion.
The upper end of the is fitted. Reference numeral 30 in FIG. 1 denotes a small locking protrusion formed on the outer peripheral surface of the fitting portion 28 of the upper attachment portion 10, and reference numeral 32 denotes the fitting portion 28 at the upper end portion of the lower holding portion 12. It is a small locking recess that engages with the small locking projection 30 when fitted. The outer diameter of the lower holding part 12 is the same as that of the upper attaching part 1.
0 is the same as the outer diameter of the upper half portion, and the inner diameter of the lower holding portion 12 is slightly larger than the outer diameter of the large diameter portion 16 of the brush body 14. A support annular portion 34 is integrally formed on the inner peripheral surface near the lower end of the lower holding portion 12. The inner diameter of the support annular portion 34 is slightly larger than the outer diameter of the small diameter portion 18 of the brush body 14 and smaller than the outer diameter of the large diameter portion 16. The brush holder is made of a plastic material such as polypropylene.

【0017】ブラシホルダにブラシ本体14を組み込む
には、下部保持部12の支持環状部34の円形孔36に
ブラシ本体14の小径部18を挿入して、下部保持部1
2内にブラシ本体14を収容した後、下部保持部12の
上端部に上部取着部10の嵌合部28を嵌着させるよう
にすればよい。このとき、ブラシ本体14は、下部保持
部12の支持環状部34によって支持されるとともに、
上面が上部取着部10の下面に当接して、ブラシホルダ
に対する上下方向の移動が規制され、また、下部保持部
12の内周面によってブラシホルダに対する横方向の移
動が規制される。そして、ブラシ本体14がブラシホル
ダに保持されたときに、ブラシ本体14の下端面が下部
保持部12の下端より下方へ突き出た状態になる。
In order to assemble the brush main body 14 into the brush holder, the small diameter portion 18 of the brush main body 14 is inserted into the circular hole 36 of the support annular portion 34 of the lower holding portion 12, and the lower holding portion 1 is inserted.
After accommodating the brush main body 14 in 2, the fitting portion 28 of the upper attachment portion 10 may be fitted to the upper end portion of the lower holding portion 12. At this time, the brush body 14 is supported by the support annular portion 34 of the lower holding portion 12, and
The upper surface abuts on the lower surface of the upper attachment portion 10 to restrict vertical movement with respect to the brush holder, and the inner peripheral surface of the lower holding portion 12 restricts lateral movement with respect to the brush holder. Then, when the brush main body 14 is held by the brush holder, the lower end surface of the brush main body 14 projects downward from the lower end of the lower holding portion 12.

【0018】上記のようにブラシホルダにブラシ本体1
4が組み込まれた状態において、ブラシ本体14に純水
等の洗浄液を十分に含浸させたときに、膨潤したブラシ
本体14に対しブラシホルダから局部的な力が作用して
ブラシ本体14の下面が湾曲するなどの変形を生じない
ように、ブラシ本体14の大径部16及び小径部18の
各径寸法や大径部16の高さ寸法とブラシホルダの下部
保持部12の内径寸法及び高さ寸法や支持環状部34の
円形孔36の径寸法との関係が適切に設定される。これ
により、ブラシホルダに湿潤状態で保持されたブラシ本
体14の下面(凹面20)は、水平姿勢に保持される基
板の表面と平行になるように平面状となる。
As described above, the brush main body 1 is attached to the brush holder.
When the brush main body 14 is sufficiently impregnated with a cleaning liquid such as pure water in a state in which No. 4 is incorporated, a local force is applied from the brush holder to the swollen brush main body 14 so that the lower surface of the brush main body 14 is The diameters of the large-diameter portion 16 and the small-diameter portion 18 of the brush main body 14 and the height dimension of the large-diameter portion 16 and the inner diameter dimension and the height of the lower holding portion 12 of the brush holder so as not to cause deformation such as bending. The relationship between the size and the diameter of the circular hole 36 of the support annular portion 34 is appropriately set. As a result, the lower surface (concave surface 20) of the brush main body 14 held in a wet state by the brush holder becomes flat so as to be parallel to the surface of the substrate held in a horizontal posture.

【0019】図1及び図2に示した洗浄用ブラシを基板
洗浄装置のブラシ保持アームのブラシ回転軸に取り付
け、スピンチャックに保持された基板を鉛直軸回りに回
転させながら、基板上に純水等の洗浄液を供給し、洗浄
用ブラシを自転させながら上方位置から下降させ、ブラ
シ本体14の下面を基板表面に接触させた状態で、洗浄
用ブラシを基板の表面に沿って基板上を中心部から周縁
部に向かって移動させることにより、基板の洗浄を行な
うようにした場合、ブラシ本体14の下面が基板の表面
と平行になるように形成されているため、ブラシ本体1
4の下面が基板表面に当接する際に、ブラシ本体14の
下面から基板の表面に対して偏荷重がかかることがな
い。このため、ブラシ本体14の下面が基板表面に当接
する時点における基板の膜面のダメージが低減される。
また、ブラシ本体14の下面の中央部が周縁部より凹ん
で凹面20となっているため、周速度の小さい基板の中
心部に水が存在しやすく、ブラシ本体10が当接した時
点における基板の膜面のダメージも少なくなる。
The cleaning brush shown in FIGS. 1 and 2 is attached to the brush rotating shaft of the brush holding arm of the substrate cleaning apparatus, and the substrate held by the spin chuck is rotated around the vertical axis while pure water is applied onto the substrate. A cleaning liquid is supplied, the cleaning brush is rotated and lowered from the upper position while the lower surface of the brush body 14 is in contact with the substrate surface, and the cleaning brush is centered on the substrate along the surface of the substrate. When the substrate is cleaned by moving the brush main body 1 toward the peripheral portion, the lower surface of the brush body 14 is formed to be parallel to the surface of the substrate.
When the lower surface of 4 contacts the surface of the substrate, an unbalanced load is not applied from the lower surface of the brush body 14 to the surface of the substrate. Therefore, damage to the film surface of the substrate at the time when the lower surface of the brush body 14 contacts the substrate surface is reduced.
Further, since the central portion of the lower surface of the brush body 14 is recessed from the peripheral portion to form the concave surface 20, water is likely to exist in the central portion of the substrate having a low peripheral speed, and the substrate at the time when the brush body 10 abuts on the substrate. Damage to the film surface is also reduced.

【0020】この発明に係る洗浄用ブラシの構成は以上
説明した通りであるが、この発明の範囲は、上記説明並
びに図面の内容によって限定されるものでなく、ブラシ
ホルダの構成やブラシ本体の形状、素材などは、上記説
明のものに限らない
The structure of the cleaning brush according to the present invention is as described above, but the scope of the present invention is not limited by the above description and the contents of the drawings, and the structure of the brush holder and the shape of the brush main body are not limited. The materials are not limited to those described above .

【0021】[0021]

【発明の効果】請求項1に係る発明の基板洗浄用ブラシ
を使用し、基板を水平姿勢に保持して鉛直軸回りに回転
させながら基板上へ洗浄液を供給し、基板の表面にブラ
シ本体の下面を接触させて基板をブラシ洗浄するように
したときは、基板の表面に柔らかい被膜が形成されてい
るようなときでも、基板の膜面に対してダメージを与え
ることなく基板の洗浄を行なうことができる。また、基
板の表面へのブラシ本体の当接を、周速度が小さくて基
板の膜面にダメージが発生し易い基板の中心部において
行なう場合においても、基板中心部の膜面のダメージを
低減することができる。
The substrate cleaning brush according to the first aspect of the present invention is used, the cleaning liquid is supplied onto the substrate while the substrate is held in a horizontal posture and rotated about the vertical axis, and the brush main body is attached to the surface of the substrate. When cleaning the substrate with the bottom surface in contact with the brush, the substrate should be cleaned without damaging the film surface of the substrate even when a soft coating is formed on the surface of the substrate. You can Also, the basis
Make sure that the brush body does not come in contact with the surface of the plate when the peripheral speed is low.
At the center of the substrate where the film surface of the plate is likely to be damaged
Even when doing so, damage to the film surface in the center of the substrate
It can be reduced.

【0022】[0022]

【0023】請求項2に係る発明の基板洗浄用ブラシで
は、PVAを原料として製造されたブラシ本体の外形が
乾燥した状態と湿潤状態とで変化するが、使用状態にお
いてブラシ本体の下面が基板の表面と平行になるように
平面状に形成されていることにより、基板の膜面に対し
てダメージを与えることなく基板の洗浄を行なうことが
できる。
[0023] In the substrate cleaning brush of the invention according to claim 2, the outer shape of the brush body manufactured PVA as raw material is changed in a state with a wet dry, the lower surface of the brush body in the use state substrate By being formed in a plane shape so as to be parallel to the surface of the substrate, the substrate can be cleaned without damaging the film surface of the substrate.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施形態の1例を示し、基板洗浄用
ブラシを分解した状態を示す斜視図である。
FIG. 1 is a perspective view showing an example of an embodiment of the present invention and showing a state in which a substrate cleaning brush is disassembled.

【図2】図1に示した基板洗浄用ブラシを組み立てた状
態を示す縦断面図である。
FIG. 2 is a vertical cross-sectional view showing an assembled state of the substrate cleaning brush shown in FIG.

【図3】従来の基板洗浄用ブラシにおける問題点を説明
するための図であって、洗浄用ブラシの部分縦断面図
ある。
FIG. 3 illustrates problems with a conventional substrate cleaning brush.
It is a figure for doing and is a partial longitudinal cross-sectional view of a cleaning brush .

【図4】同じく従来の基板洗浄用ブラシにおける問題点
を説明するための図であって、ブラシ本体の概略構成図
である。
FIG. 4 is also a problem in the conventional substrate cleaning brush.
FIG. 4 is a diagram for explaining the above , and is a schematic configuration diagram of a brush main body .

【符号の説明】[Explanation of symbols]

10 ブラシホルダの上部取着部 12 ブラシホルダの下部保持部 14、38 ブラシ本体 20 ブラシ本体下面の凹面 10 Upper part of brush holder 12 Lower part of brush holder 14, 38 Brush body 20 Concave surface on the bottom of the brush body

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐々木 忠司 京都市伏見区羽束師古川町322番地 大 日本スクリーン製造株式会社 洛西事業 所内 (56)参考文献 特開 平9−134896(JP,A) 特開 平5−267259(JP,A) 特開 平3−206615(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01L 21/304 B08B 1/00 - 1/04 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadashi Sasaki, 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Rakusai Plant (56) Reference Japanese Patent Laid-Open No. 9-134896 (JP, A) Kaihei 5-267259 (JP, A) JP-A-3-206615 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/304 B08B 1/00-1/04

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基板を水平姿勢に保持して回転させなが
ら基板上へ洗浄液を供給するとともにブラシを自転させ
つつ基板の中心部と周縁部との間で移動させて基板を洗
浄する基板洗浄装置に取り付けられ、上面側に基板洗浄
装置のブラシ回転軸に係止される係止部が形設されたブ
ラシホルダと、 このブラシホルダに取着され、 水平姿勢に保持された基
板の表面に下面が接触して基板を洗浄するブラシ本体
を備えた基板洗浄用ブラシにおいて、 前記ブラシ本体を、親水性を有するスポンジ状の多孔質
素材によって形成し、そのブラシ本体の下面を、前記ブ
ラシホルダにブラシ本体を取着して湿潤させた状態にお
いて基板の表面と平行になるように平面状に形成すると
ともに、ブラシ本体の下面の中央部を周縁部より凹ませ
て基板表面と接触する凹面としたことを特徴とする基板
洗浄用ブラシ。
1. A substrate is held in a horizontal posture while being rotated.
Supply the cleaning liquid onto the substrate and rotate the brush
While cleaning the substrate, move it between the center and the periphery of the substrate.
A brush holder attached to a substrate cleaning device for cleaning and having an engaging portion formed on the upper surface side to be engaged with the brush rotating shaft of the substrate cleaning device, and the brush holder attached and held in a horizontal posture a brush body for cleaning a substrate lower surface is in contact with the surface of the substrate
In a brush for cleaning a substrate, the brush body is made of a hydrophilic sponge-like porous material.
Formed by the material, the lower surface of the brush body, the blanking
When the brush main body is attached to the rush holder and formed in a wet state, the brush main body is formed to be parallel to the surface of the substrate.
Also, make sure that the center of the bottom surface of the brush body is
A brush for cleaning a substrate, which has a concave surface that comes into contact with the surface of the substrate.
【請求項2】 前記ブラシ本体が、ポリビニルアルコー
ルを原料として製造されたものである請求項1記載の基
板洗浄用ブラシ。
2. The brush body is made of polyvinyl alcohol.
The brush for cleaning a substrate according to claim 1, which is manufactured by using as a raw material .
JP35497595A 1995-12-25 1995-12-25 Substrate cleaning brush Expired - Lifetime JP3396124B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35497595A JP3396124B2 (en) 1995-12-25 1995-12-25 Substrate cleaning brush

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35497595A JP3396124B2 (en) 1995-12-25 1995-12-25 Substrate cleaning brush

Publications (2)

Publication Number Publication Date
JPH09181025A JPH09181025A (en) 1997-07-11
JP3396124B2 true JP3396124B2 (en) 2003-04-14

Family

ID=18441138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35497595A Expired - Lifetime JP3396124B2 (en) 1995-12-25 1995-12-25 Substrate cleaning brush

Country Status (1)

Country Link
JP (1) JP3396124B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101438442B1 (en) * 2013-06-04 2014-09-12 (주)하배런메디엔뷰티 Brush for cleasing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4091187B2 (en) 1998-12-08 2008-05-28 株式会社荏原製作所 Cleaning tool, substrate cleaning apparatus and substrate cleaning method
JP7348623B2 (en) 2019-05-28 2023-09-21 アイオン株式会社 Board cleaning brush

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101438442B1 (en) * 2013-06-04 2014-09-12 (주)하배런메디엔뷰티 Brush for cleasing

Also Published As

Publication number Publication date
JPH09181025A (en) 1997-07-11

Similar Documents

Publication Publication Date Title
KR100874997B1 (en) Substrate Processing Apparatus and Substrate Processing Method
JP4755519B2 (en) Substrate processing apparatus and substrate processing method
KR100412542B1 (en) Method and device for cleaning work
JP4091187B2 (en) Cleaning tool, substrate cleaning apparatus and substrate cleaning method
JP2000173966A5 (en)
JP3396124B2 (en) Substrate cleaning brush
KR102622807B1 (en) Cleaning member, substrate cleaning apparatus, and substrate processing apparatus
US5881876A (en) Method and vessel for storing a substrate cleaning brush
JP3632259B2 (en) Substrate cleaning apparatus and substrate cleaning method
JP2002313767A (en) Substrate processor
JP2736020B2 (en) Vacuum chuck with self-cleaning function
JP7502088B2 (en) Cleaning member attachment mechanism and substrate cleaning device
JP2005144298A (en) Surface washing and modification method and surface washing and modification apparatus
US20210242015A1 (en) Substrate processing apparatus and substrate cleaning method
JP2983189B2 (en) Brush for brush polishing equipment
JP7511466B2 (en) Cleaning device for cleaning member, substrate cleaning device and cleaning member assembly
US6254690B1 (en) Semiconductor wafer cleaning method using a semiconductor wafer cleaning device that supports a lower surface of the wafer
JP2002280344A (en) Substrate processor
KR100775627B1 (en) A substrate cleaning apparatus and cleaning method
WO2020241726A1 (en) Substrate cleaning brush
JP3328490B2 (en) Substrate cleaning brush housing
JPH10154674A (en) Apparatus for processing substrate and scrub cleaning member
JP2001198824A (en) Cleaning method for grinding device and grinding device
JP3804921B2 (en) Cleaning brush unit, substrate cleaning apparatus equipped with the same, and cleaning brush
JP3396123B2 (en) Substrate cleaning brush housing

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080207

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090207

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100207

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100207

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100207

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110207

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110207

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120207

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120207

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130207

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130207

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140207

Year of fee payment: 11

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term