JP3391927B2 - Method of manufacturing ink jet recording head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a manufacturing method of the ink jet recording heads.

[0002]

2. Description of the Related Art FIG. 4 is an exploded schematic view showing an example of the configuration of a conventional ink jet recording head.

An example of an ink jet recording head, I
The inkjet unit IJU equipped with JH is a bubble jet type unit that performs recording using an electrothermal converter that generates thermal energy for causing film boiling to the ink in response to an electrical signal.

In FIG. 4, reference numeral 100 denotes an electrothermal converter (discharge heater) arranged in a plurality of rows on a Si substrate, and electric wiring such as aluminum for supplying electric power to the electrothermal converter, which is formed by a film forming technique. It is a heater board consisting of. Reference numeral 200 denotes a wiring board for the heater board 100, and wiring (corresponding to, for example, wire bonding) corresponding to the wiring of the heater board 100, and a pad 201 located at an end of this wiring and receiving an electric signal from the main body device. have.

Reference numeral 1300 is a grooved top plate provided with a partition wall for partitioning a plurality of ink flow paths and a common liquid chamber for accommodating ink to each ink flow path.
An ink receiving port 1500 that receives the ink supplied from the ink tank IT and is introduced into the common liquid chamber described above, and an orifice plate 400 that has a plurality of ejection ports corresponding to the respective ink flow paths are integrally molded. Polysulfone is preferable as the integral molding material, but other molding resin materials may be used.

Reference numeral 300 denotes a support member made of, for example, a metal that supports the back surface of the wiring board 200 on a flat surface and serves as a bottom plate of the ink jet unit. Reference numeral 500 denotes a presser spring, which is M-shaped and presses the common liquid chamber with a light pressure at the center of the M-shape, and the front droop portion 501 concentrates a part of the liquid passage, preferably a region near the discharge port, with a linear pressure. Press.

By pressing the heater board 100 and the top plate 1300 through the holes 3121 of the supporting body 300 and engaging with the back side of the supporting body 300 through the holes 3121 of the supporting body 300, they are sandwiched and engaged with each other. Thus, the heater board 100 and the top plate 1300 are pressure-bonded to each other by the concentrated urging force of the presser spring 500 and its front slant portion 501. Also support 30
0 indicates two positioning protrusions 1012 of the ink tank IT.
And protrusions 1800 and 1801 for positioning and holding heat fusion
In addition to having positioning holes 312, 1900, 2000 for engaging with, the projections 2500, 2600 for positioning the apparatus main body IJRA with respect to the carriage HC are provided on the back surface side. In addition, the support 300 also has a hole 320 that allows the ink supply pipe 2200 that allows ink to be supplied from the ink tank to pass therethrough. The wiring board 200 is attached to the support 300 by adhering it with an adhesive or the like.
The recesses 2400 and 2400 of the support 300 are provided near the positioning protrusions 2500 and 2600, respectively, and the assembled ink jet cartridge IJ.
In C, the three parallel sides are parallel grooves 3000, 300
At the extension point of the head tip region formed by a plurality of 1,
It is positioned so that unnecessary substances such as dust and ink do not reach the protrusions 2500 and 2600.

As shown in FIG. 4, the lid member 800 in which the parallel groove 3000 is formed forms the outer wall of the ink jet cartridge IJC and also forms a space for accommodating the ink jet unit IJU together with the ink tank. There is. In addition, the ink supply member 600 in which the parallel groove 3001 is formed is the same as the ink supply tube 220 described above.
An ink conduit 1600 continuous to 0 is formed as a fixed cantilever on the supply pipe 2200 side, and a sealing pin 602 is inserted to secure a capillary phenomenon between the fixed side of the ink conduit and the ink supply pipe 2200. Incidentally, 601 is a packing for connecting and sealing the ink tank IT and the supply pipe 2200, and 700 is a filter provided at the end of the supply pipe on the tank side.

Since the ink supply member 600 is molded, the ink supply member 600 is inexpensive, has high positional accuracy, and eliminates a decrease in accuracy in forming and manufacturing. In addition, the cantilevered conduit 1600 allows the ink supplying member 600 to be used for mass production. The pressure contact state of 1600 to the ink receiving port 1500 can be stabilized. In this example, by simply pouring the sealing adhesive from the ink supply member side under this pressure contact state, a more complete communication state can be surely obtained. The ink supply member 6
00 is fixed to the support 300, the pins (not shown) on the back surface side of the ink supply member 600 with respect to the holes 1901 and 1902 of the support 300 are attached to the holes 1901 and 19 of the support 300.
It is easily carried out by projecting through through 02 and heat-sealing the portion projecting to the back surface side of the support 300. still,
The slightly projected area of the heat-sealed back surface is accommodated in the recess (not shown) on the side wall surface of the ink jet unit IJU mounting surface of the ink tank IT.
The positioning surface of U is accurately obtained.

[0010]

In the above-mentioned conventional example, the process of fitting the pressing spring 500 requires precision, which complicates the process, and the pressing spring 500 also requires precision, which makes the process expensive. Further, there is also a problem that reliability is lowered due to a change in spring pressure over a long period of time because of fixing by the presser spring 500.

Therefore, a grooved top plate 1300 is made of an adhesive or the like.
When the substrate (heater board) 100 is attempted to be bonded, there is a problem that the adhesive flows into the groove or the like and blocks the flow path.

[0012] The present invention has been made to solve the above problems, aims to provide an ink jet recording heads method of manufacturing was joined to the top plate and the substrate easily reliably is there.

[0013]

The present invention has the following technical features.
The above-mentioned object can be achieved by the constitution. (1) A substrate on which an ejection energy generating element that generates ejection energy for ejecting ink is formed, and a concave portion that is joined to the substrate to form an ink flow path corresponding to a portion where the ejection energy generating element is disposed Resin with
And manufacturing of the top plate, in the method for manufacturing an ink jet recording head provided with a, B stay at the junction of the top plate and the substrate
And a step of forming a welding layer composed of an organic member in the state of
Ultrasonic welding with the base plate and the top plate stuck together.
The manufacturing method of the inkjet recording head characterized by including the process of performing .

(2) A substrate on which an ejection energy generating element for generating ejection energy for ejecting ink is formed, and an ink flow path corresponding to a portion where the ejection energy generating element is disposed by joining the substrate. In a method of manufacturing an inkjet recording head, comprising a resin-made top plate having a concave portion to be formed, and an ejection port forming member in which an ejection port for ejecting ink is formed in communication with the ink flow path,
The organic portion in the B stage state at the joint between the substrate and the top plate
A step of forming a welding layer made of a material, the substrate and the
The process of ultrasonic welding with the top plate stuck together,
A method for producing an ink jet recording head, characterized in that it comprises.

[0015]

With the above construction, the substrate and the top plate can be joined easily and inexpensively with high precision by joining the organic members on the respective joining surfaces of the substrate and the top plate by ultrasonic welding. It can be carried out and the welding is stable and the recording performance can be maintained.

[0016]

Embodiments of the present invention relate to an ink jet recording head formed by combining a plurality of members, substrates and the like and integrating them, like the conventional ink jet recording head described above. An inkjet recording head having a characteristic of joining a substrate and a top plate and a method for manufacturing the same.

The characteristic components of the embodiment of the present invention will be described below. 1 to 3 are schematic perspective views showing a manufacturing method according to an embodiment.

FIG. 1 is a perspective view of an orifice plate before welding and a substrate provided with an electrothermal converter (discharge heater) before joining. 1 is an orifice plate integrated grooved top plate, 2 is a liquid supply path, 3 is a grooved top plate, 4 is an orifice, 5 is a substrate with a heater, and a hatched portion 6 is provided with a resin layer for welding. There is. Such a welding layer is preferably made of the same material as the welding surface of the top plate. The plastic welding suitability is shown in Table 1 for reference.

[0019]

[Table 1]

Such a welding layer can be provided on any welding surface, but since the thermoplastic resin cannot be applied along the fine pattern of the welding surface, even a portion such as on the heater where discharge failure occurs. It will be applied. In order to obtain an organic resin layer having a fine pattern, a photosensitive negative resist can be used to provide a welding layer in a B-stage state. For example, Photonice (trade name: Toray Co., Ltd., photosensitive polyimide) is applied onto a substrate. By exposing the welding surface using a mask and developing it, a welding layer in a B-stage state having a fine pattern can be obtained. When the B-stages are bonded to each other and ultrasonic waves are applied, the B-stages are completely hardened and firmly bonded due to thermal energy due to vibration.

Then, after the ceiling grooved top plate 3 and the heater-equipped substrate 5 are aligned and fixed in an ultrasonic welding case 7 as shown in FIG. 2, ultrasonic waves are applied in a direction perpendicular to the bonding surface to form the top plate 3. The substrate 5 can be bonded to the substrate 5 with high precision, and the ink jet recording head of the embodiment is completed as shown in FIG.

At the time of the above-mentioned bonding, the tool horn for transmitting the vibration is shaped to match the top surface of the top plate so that the vibration of ultrasonic waves is evenly transmitted to the bonding surface.

In the above embodiment, the top plate 3 is a PSF.
(Polysulfone) was molded, and the substrate 5 was formed by applying a silane coupling agent and drying it. Then, dissolving PSF (polysulfone) in methylene chloride was applied and dried to form a film. Then, P of the substrate subjected to ultrasonic welding
The SF and the PSF of the top plate are firmly welded together, and the P
For the parts not coated with SF, PS of the top plate 3
F melted and was in close contact with the substrate 5.

A long-term printing durability test was conducted using the thus-formed ink jet recording head and the ink jet recording head prepared by the conventional method. In the embodiment of the present invention, the resulting print did not have any disturbance, but the conventional method was used. The recording head produced the print disturbance.

[0025]

As described above, according to the present invention, it is possible to bond the top plate at low cost without providing complicated steps and without using expensive pressing springs or the like that require precision. In the past, there was a problem that the reliability was lowered because the spring pressure changed over a long period of time because of the fixation by the pressing spring, but this could also be solved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an example of a manufacturing method.

FIG. 2 is a schematic perspective view showing an example of a manufacturing method.

FIG. 3 is a schematic perspective view of an inkjet recording head manufactured in a manufacturing method example.

FIG. 4 is an exploded schematic diagram showing a configuration example of a conventional inkjet recording head.

[Explanation of symbols]

1 Orifice plate integrated grooved top plate 2 liquid supply path 3 Groove top plate 4 orifice 5 Heated substrate 6 Organic film coating film 7 Ultrasonic welding case 100 electrothermal converter 200 wiring board 201 Pads that receive electrical signals 300 wiring board support 312 Positioning hole 320 holes that allow penetration 400 Orifice plate 500 holding spring 501 Pressing spring front slant 600 ink supply member 601 packing 1012 Positioning protrusion 1300 Grooved top plate with orifice plate 1500 ink receptacle 1600 ink conduit 1800 Protrusion for heat fusion retention 1801 Protrusion for heat fusion retention 1900 Positioning hole 1901 Through hole for heat fusion 1902 Through hole for heat fusion 2000 Positioning hole 2200 ink supply pipe 2400 Prevents invasion of dust and ink 2500 Positioning protrusion 2600 Positioning protrusion 3000 Parallel groove to prevent dust and ink from entering 3001 Parallel groove to prevent dust and ink from entering

Claims (2)

(57) [Claims] 1. A substrate on which an ejection energy generating element for generating ejection energy for ejecting ink is formed,
In the manufacturing method of the ink jet recording head provided with a top plate made of resin having a concave portion for forming the ink flow paths corresponding to the disposed position of the discharge energy generating elements by joining a substrate, said substrate and said At the top plate joint
Process for forming a welding layer consisting of an organic member in the B stage
And ultrasonic sound with the board and the top plate attached to each other.
A method for producing an ink jet recording head characterized by comprising a step of performing a wave welding, the. 2. A substrate on which an ejection energy generating element for generating ejection energy for ejecting ink is formed,
A resin top plate having a concave portion that forms an ink flow path corresponding to a portion where the ejection energy generating element is disposed by joining with the substrate, and an ejection port that communicates with the ink flow path and ejects ink. in the manufacturing method of the ink jet recording head having the formed discharge port forming member, wherein
Is the organic member in the B stage state at the joint between the substrate and the top plate?
Forming a welding layer consisting of the above, and ultrasonic welding with the substrate and the top plate bonded together.
A method for producing an ink jet recording head, characterized by comprising the steps of performing.