JP3391440B2 - Semiconductor device manufacturing method and semiconductor device manufacturing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method.
Semiconductor device manufacturing apparatus and semiconductor in which a mounting portion of a semiconductor chip on a substrate is surrounded by a cylindrical side wall, and a resin lid is formed to be supported on the top of the cylindrical side wall to seal the inside of the cylindrical side wall The present invention relates to a method of manufacturing a device.

[0002]

2. Description of the Related Art A transfer molding method is generally used as a method for producing a resin-sealed semiconductor device. However, since the sealing resin is filled around the semiconductor chip without a gap, the semiconductor stress is applied to the semiconductor. The chip may be chipped or the characteristics of the semiconductor element may deteriorate due to the dielectric constant of the resin.

Therefore, there is a demand for a semiconductor device in which a resin is hollow-sealed so that the resin does not come into contact with the surface of the semiconductor element.

10 (a) to 10 (c) and FIG. 11 are cross-sectional views showing a conventional method for manufacturing a resin-molded hollow semiconductor device.

First, as shown in FIG. 10 (a), the lower mold 4
Then, resin is injected into the molding die including the upper die 5 to form the main body 101 of the package. The main body 101 includes a disk-shaped base body 1, a cylindrical side wall 3 formed around the central portion in the peripheral portion of the base body 1, and two external leads 2a and 2b protruding from the base body 1 in the radial direction. Become. Cylindrical side wall 3
On the surface of the base 1 surrounded by
And the external lead terminals 2 on both sides of the chip mounting portion 2c.
a and 2b are formed of a metal plate or the like.

Next, as shown in FIG. 10 (b), resin is injected into a molding die consisting of a lower mold 7 and an upper mold 8,
A disc-shaped cap 6 is formed.

Next, as shown in FIG. 10C, the semiconductor chip 9 is welded to the chip mounting portion 2c of the main body by a brazing material, and the semiconductor chip 9 and the two external lead terminals 2 are also welded.
a and 2b are connected by internal leads 10a and 10b, respectively.

Then, a sealing resin or a sealing tape 11 is placed on the top of the cylindrical side wall 3, and the cap 6 is placed thereon.
Is placed and adhered to seal the inside of the cylindrical side wall 3. As a result, the resin-sealed semiconductor device is completed. This state is shown in FIG.

[0009]

By the way, in the above-mentioned conventional example, molds 7 and 8 for forming the cap 6 matched to the size and shape of the package are required, and the sealing resin and the sealing tape 11 are also used. I need. Therefore, it is difficult to swiftly or flexibly deal with the external shape change.

The present invention was created in view of the above-mentioned problems of the conventional example, and the semiconductor chip has a hollow portion around it, and can respond to a change in outer shape quickly or flexibly. Provided is a resin-encapsulated semiconductor device manufacturing apparatus and a semiconductor device manufacturing method.

[0011]

In order to solve the above problems, the present invention relates to a semiconductor device manufacturing apparatus, including a container for storing a liquid resin for forming a resin lid and a semiconductor housing before the resin lid is formed. A holder for holding the container, a moving means for moving the holder up or down, a means for detecting the position of the surface of the liquid resin contained in the container, and the liquid resin detected by the detecting means. And a control means for adjusting the moving distance of the moving means up or down based on the position of the surface of the.

A second aspect of the present invention relates to a semiconductor device manufacturing apparatus, wherein a container for containing a liquid resin for forming a resin lid, a means for heating the liquid resin in the container, and a liquid resin contained in the container are provided. And a control unit that adjusts the intensity of heating by the heating unit based on the temperature of the liquid resin detected by the detecting unit.

A third aspect of the present invention relates to a method of manufacturing a semiconductor device, in which a mounting portion of a semiconductor chip on a base is surrounded by a cylindrical side wall, and a top portion of the cylindrical side wall serves as a supporting portion of a resin lid. Preparing a semiconductor storage container before the resin lid is formed, the top of the cylindrical side wall of the semiconductor storage container is immersed in a liquid resin adjusted to a predetermined viscosity, and by pulling up, the inside of the cylindrical side wall It is characterized in that the resin lid is formed so as to be hermetically sealed and supported by the supporting portion of the resin lid.

The invention of claim 4 relates to the method of manufacturing a semiconductor device according to claim 3, wherein the material of the liquid resin is a thermoplastic resin or a thermosetting resin.

The invention of claim 5 relates to the method of manufacturing a semiconductor device according to claim 3 or 4, characterized in that the liquid resin is heated and the viscosity of the liquid resin is adjusted by the temperature of the liquid resin. There is.

A sixth aspect of the present invention relates to the method for manufacturing a semiconductor device according to any one of the third to fifth aspects, characterized in that unevenness is formed on the top of the cylindrical side wall.

The invention of claim 7 relates to the method of manufacturing a semiconductor device according to any one of claims 3 to 6, wherein the thickness of the tubular side wall is inside the tubular side wall toward the top. The feature is that a step or an inclination is provided so that the thickness becomes thin.

In the apparatus for manufacturing a semiconductor device of the present invention, a holder for holding the semiconductor storage container before forming the resin lid, a moving means for moving the holder up or down, and a surface of the liquid resin contained in the container. And a control means for adjusting the moving distance of the moving means up or down based on the position of the surface of the liquid resin detected by the detecting means.

Accordingly, the position of the surface of the liquid resin is monitored by the liquid level sensor (means for detecting the position of the surface of the liquid resin), and the semiconductor container before the resin lid is formed, for example, the chip mounting portion is a cylinder. The moving distance of the moving means is adjusted by the control means so that the top of the cylindrical side wall of the package body surrounded by the shaped side wall is immersed to an appropriate depth, and the holder is positioned at an appropriate position from the surface of the liquid resin. It can be moved to and held. Therefore, it is possible to form the resin lid while preventing liquid resin from adhering to the inner leads and the semiconductor chip inside the cylindrical side wall of the package body.

Furthermore, heating by means for heating the liquid resin in the container, means for detecting the temperature of the liquid resin contained in the container, and means for heating based on the temperature of the liquid resin detected by the detecting means Control means for adjusting the strength of the.

In this case, if a liquid resin whose viscosity changes with the temperature of the liquid resin is used, the temperature of the liquid resin is monitored by a temperature sensor (means for detecting the temperature of the liquid resin), and the liquid resin has an appropriate viscosity. As described above, the heating temperature of the liquid resin can be adjusted by adjusting the electric power supplied from the power supply to the heating means by the control means. Therefore, it is possible to form a resin lid made of a continuous resin film according to the width of the opening of the semiconductor container and the immersion depth.

Further, in the method for manufacturing a semiconductor device of the present invention, the top of the cylindrical side wall of the package main body in which the semiconductor storage container before the resin lid is formed, for example, the chip mounting portion is surrounded by the cylindrical side wall is predetermined. By immersing in a liquid resin whose viscosity is adjusted to a predetermined depth and pulling it up, the inside of the cylindrical side wall is sealed and the resin lid supported by the support portion of the resin lid is formed.

That is, even if the planar shape of the opening of the cylindrical side wall is circular or any other shape, the viscosity of the liquid resin and the immersion depth of the cylindrical side wall are adjusted according to the opening width of the cylindrical side wall. By doing so, it becomes possible to form a resin lid made of a continuous resin film.

Therefore, it is possible to form a resin-sealed semiconductor device in which the periphery of the semiconductor chip is hollow.
Further, it is possible to quickly or flexibly respond to a change in outer shape.

Further, irregularities are formed on the top of the tubular side wall, or a step or an inclination is provided inside the tubular side wall such that the thickness of the tubular side wall decreases toward the top.

As a result, when immersed in the liquid resin, the contact area between the liquid resin and the cylindrical side wall increases due to the unevenness, steps, and inclination, and the adhesion is improved, and the resin cover on the cylindrical side wall increases due to the increased contact area. The amount of liquid resin adhering to the supporting portion increases and it becomes easy to form a continuous resin film.
Further, the step or the inclination suppresses the sagging of the liquid resin below the cylindrical side wall.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view showing the structure of a cap forming apparatus for a resin-sealed semiconductor device according to the first embodiment of the present invention.

As shown in FIG. 1, the cap forming apparatus holds a container 21 for containing a liquid resin 26 for forming a cap (resin lid) and a package main body (semiconductor container) 102 before the cap is formed. Tool 24 and holder 2
4 for moving up or down, a liquid level sensor 22 for detecting the position of the surface of the liquid resin 26 contained in the container 21, and a liquid resin 26 detected by the liquid level sensor 22.
The control means 23 adjusts the moving distance of the moving means 25 up or down based on the position of the surface of the.

In the cap forming apparatus, a thermosetting resin such as a thermoplastic resin or an epoxy resin can be used as the liquid resin 26.

By the way, when the package main body 102 before forming the cap is immersed in the liquid resin 26 to form the cap supported by the supporting portion, the liquid level of the liquid resin 26 changes considerably due to consumption of the liquid resin 26. . In such a case, if the immersion depth of the cylindrical side wall 33 of the package body 102 is not appropriate, the amount of resin adhering to the support portion of the cylindrical side wall 33 is insufficient and a continuous resin film is not formed, or the immersion depth is reduced. The inner lead 37 inside the cylindrical side wall 33 is too deep.
The liquid resin 26 may adhere to a, 37b and the semiconductor chip 36.

When the cap forming apparatus for the resin-sealed semiconductor device according to the first embodiment of the present invention is used, the position of the surface of the liquid resin 26 is monitored by the liquid level sensor 22, and before the resin sealing. Cylindrical side wall 33 of the package body 102
The moving distance of the moving means 25 is adjusted by the control means 23 so that the liquid is soaked from the top to an appropriate depth, and the holder 24 is moved from the surface of the liquid resin 26 to an appropriate position and held. To

As a result, it is possible to prevent the liquid resin 26 from adhering to the internal leads 37a and 37b inside the cylindrical side wall 33 of the package body 102 and the semiconductor chip 36. (Second Embodiment) FIG. 2 is a sectional view showing the structure of a cap forming apparatus for a resin-sealed semiconductor device according to a second embodiment of the present invention.

As shown in FIG. 2, the cap forming apparatus includes a container 21 for containing a liquid resin 26 for forming a cap (resin lid), a heater 28 for heating the liquid resin 26 in the container 21, and a container 21. A temperature sensor 27 for detecting the temperature of the liquid resin 26 stored in the temperature sensor 27, and a temperature sensor 27 based on the temperature of the liquid resin 26 detected by the temperature sensor 27.
And a control means 30 for adjusting the heating intensity.

Also in this case, a thermoplastic resin or a thermosetting resin can be used as the liquid resin 26.

By the way, when the package main body (semiconductor container) 102 before the cap is formed is dipped in the liquid resin 26 to form the cap supported by the supporting portion, the viscosity of the liquid resin 26 is equivalent to the consumption of the liquid resin 26. It will change. In such a case, if the liquid resin 26 does not have an appropriate viscosity, a continuous resin film may not be formed depending on the width of the opening of the package body 102 and the immersion depth.

When the cap forming apparatus for the resin-sealed semiconductor device according to the second embodiment of the present invention is used, the liquid resin 26 whose viscosity changes with the temperature of the liquid resin 26 is used. Then, the temperature of the liquid resin 26 is monitored by the temperature sensor 27, and the electric power supplied from the power supply 29 to the heater (heating means) 28 is adjusted by the control means 30 so that the liquid resin 26 has an appropriate viscosity. The heating temperature of the liquid resin 26 is adjusted.

As a result, it becomes possible to form a cap made of a continuous resin film according to the width of the opening of the package body 102.

Incidentally, in the cap forming apparatus of the first and second embodiments, the liquid level sensor 22 and the control means 23.
Although a device in which the temperature sensor 27 and the control means 30 are separately provided has been described, a cap forming device that includes both of them is also possible. In this case, the liquid resin 26 is prevented from adhering to the internal leads 37a, 37b inside the cylindrical side wall 33 of the package body 102 and the semiconductor chip 36, and the package body 102 is prevented.
It is possible to form a cap made of a continuous resin film according to the width of the opening. (Third Embodiment) FIGS. 3 to 6 are views showing a method of manufacturing a hollow resin-sealed semiconductor device according to a third embodiment of the present invention. 3 (a), 3 (b), 5 (a)
(C) and FIG. 6 are sectional views. FIG. 4 is a perspective view of the package body 102 before the cap (resin lid) is formed, and FIG. 3B corresponds to a cross section taken along the line AA of FIG.

First, as shown in FIG. 3A, the lower mold 34
A thermosetting resin (MP-8000C manufactured by Nitto Denko) is injected into a molding die including the upper die 35 and the upper die 35, and the mounting portion 32c of the semiconductor chip on the base 31 has an outer diameter of 2 to 3 mm and a height of 0.4 to 0.
A package body (semiconductor container) 102 surrounded by a 6 mm circular cylindrical side wall 33 and having a top portion of the cylindrical side wall 33 as a support portion of the cap is formed. The package main body 102 has a chip mounting portion 32c formed in the central portion on the base 31, and on both sides thereof, an external lead 3 made of a Cu alloy plate such as a strip 42 alloy having a thickness of about 0.1 mm.
2a and 32b are formed. External leads 32a, 3
2b projects from the base 31 in the radial direction.

Then, the semiconductor chip 36 having a thickness of about 0.1 mm is placed on the semiconductor chip mounting portion 32c on the base 31 with the brazing material sandwiched therebetween and heated to melt and fix the brazing material. Subsequently, the inner leads 37a, 37b are connected from the surface of the semiconductor chip 36 to the inner terminals of the outer leads 32a, 32b using a wire bonder. At this time, the height of the inner lead is about 0.2 mm from the surface of the mounting portion 32c.

As a result, as shown in FIGS. 3B and 4, the package main body 102 in which the semiconductor chip is housed and before resin sealing is completed.

Next, as shown in FIGS.
Thermosetting epoxy liquid resin (Hisole CB011) 26
Is placed in a container and maintained at a temperature of 50 to 60 ° C. The viscosity of the liquid resin 26 can be adjusted depending on the composition and temperature of the resin, and in the embodiment, it is adjusted to 5000 to 10,000 cps.

The package body 10 is placed in the liquid resin 26.
The top of the cylindrical side wall 33 of No. 2 is immersed to a predetermined depth and then pulled up. At this time, the pulling rate is also an important parameter for forming a continuous resin film, and thus it is necessary to sufficiently consider and determine it.

In this case, the liquid level and viscosity of the liquid resin 26 are adjusted by using the cap forming device shown in FIGS. This prevents the liquid resin 26 from adhering to the internal leads 37a, 37b inside the cylindrical side wall 33 of the package body 102 and the semiconductor chip 36, and prevents the semiconductor container 10 from being stuck.
It is possible to form a continuous resin film according to the width of the opening 2 and the immersion depth.

As described above, as shown in FIG. 6, the inside of the cylindrical side wall 33 is hermetically sealed, and the cap 25a made of the resin film supported by the supporting portion of the cap is formed to complete the resin-sealed semiconductor device.

In the resin-sealed semiconductor device thus formed, sufficient airtightness could be obtained. That is, there was no problem even in the leak test, and the reliability equivalent to that of ordinary potting sealing was obtained.

As described above, according to the method of manufacturing the semiconductor device of the third embodiment, only the top of the cylindrical side wall 33 of the package body 102 is immersed in the liquid resin whose viscosity is adjusted to a predetermined level. By pulling up, the inside of the cylindrical side wall 33 is sealed and the cap 2 supported by the support portion of the cap 2
5a is formed.

As a result, it is possible to form a resin-sealed semiconductor device in which the periphery of the semiconductor chip 36 is hollow.

Moreover, even if the planar shape of the cylindrical side wall 33 is circular or any other shape, the viscosity of the liquid resin and the immersion depth of the cylindrical side wall 33 are adjusted according to the opening width of the cylindrical side wall 33. By doing so, it becomes possible to form a cap made of a continuous resin film. Therefore, it is possible to quickly or flexibly respond to the change in outer shape. (Fourth to Sixth Embodiments) FIG. 7 is a perspective view showing a package body used in a method of manufacturing a resin-sealed semiconductor device according to a fourth embodiment of the present invention.

Further, in FIG. 7, the cross-sectional view in the dotted circular frame corresponds to the cross section taken along the line BB and shows the cross section of the cylindrical side wall 33a. FIG. 7 shows the package body 102a on which the semiconductor chip 36 has already been mounted and before forming a cap (resin lid). In the figure, the same parts as those in FIG. 1 are represented by the same reference numerals as those in FIG.

As shown in FIG. 7, a circular cylindrical side wall 33.
There is a step such that the thickness of the cylindrical side wall 33a decreases toward the top of a.

When immersed in the liquid resin, this step difference increases the contact area between the liquid resin and the cylindrical side wall 33a to improve the adhesiveness, and the amount of the liquid resin increases to facilitate the formation of a continuous resin film.

Further, the step makes it possible to suppress the sagging of the liquid resin below the cylindrical side wall 33a.

FIG. 8 is a perspective view showing the main body of a package used in the method of manufacturing a resin-sealed semiconductor device according to the fifth embodiment of the present invention.

Further, in FIG. 8, the cross-sectional view in the dotted circular frame corresponds to the cross section taken along the line CC, and shows the cross section of the cylindrical side wall 33b. FIG. 8 shows the package body 102b on which the semiconductor chip 36 has already been placed and before resin sealing, and in FIG.
The same parts as those shown in FIG.

As shown in FIG. 8, a circular cylindrical side wall 33.
It has an inclination such that the thickness of the cylindrical side wall 33b decreases toward the top of b.

When immersed in the liquid resin, this inclination increases the contact area between the liquid resin and the cylindrical side wall 33b, thereby improving the adhesion. In addition, a large amount of liquid resin adheres to the inclined portion to facilitate formation of a continuous resin film.

Further, the inclination of such a shape suppresses the sagging of the liquid resin below the cylindrical side wall 33b.

FIG. 9 is a perspective view showing the main body of a package used in the method of manufacturing a resin-sealed semiconductor device according to the sixth embodiment of the present invention.

Further, in FIG. 9, the cross-sectional view in the dotted circular frame corresponds to the cross section taken along the line DD, and shows the cross section of the cylindrical side wall 33c. Note that FIG. 9 shows the package body 102c on which the semiconductor chip 36 has already been mounted and before resin sealing, and in FIG.
1 are denoted by the same reference numerals as those in FIG. 1, and description thereof will be omitted.

As shown in FIG. 9, a circular cylindrical side wall 33.
c has irregularities on its top. When soaked in the liquid resin, the unevenness increases the contact area between the liquid resin and the cylindrical side wall 33c to improve the adhesion, and the amount of the liquid resin increases to facilitate the formation of a continuous resin film. Although the specific embodiments of the present invention have been described with the above embodiments, the present invention is not limited to the above embodiments.
Various modifications of the degree of design change derived from the above embodiment are included in the technical scope of the present invention.

For example, in the above embodiment, the cylindrical side walls 33, 33 of the package bodies 102, 102a to 102c are used.
Although the circular plan shape of a to 33c is used,
A rectangular shape or other shapes may be used.

Although a specific thermosetting resin is used as the liquid resin 26, other types of thermosetting resin may be used, or a thermoplastic resin may be used.

Furthermore, the viscosity of the liquid resin is set to 5000 to 10000 cps.
However, it goes without saying that the proper viscosity varies depending on the type of resin.

[0066]

According to the semiconductor device manufacturing apparatus of the present invention, the holder for holding the semiconductor device before the resin lid is formed, the moving means for moving the holder up or down, and the liquid resin contained in the container. And a control means for adjusting the moving distance of the moving means up or down based on the position of the surface of the liquid resin detected by the detecting means.

As a result, the holder can be moved from the surface of the liquid resin to an appropriate position and held so that the semiconductor device before resin sealing is immersed to an appropriate depth. The resin lid can be formed while preventing liquid resin from adhering to the inner leads and the semiconductor chip inside the tubular side wall of the package body.

Furthermore, heating by means for heating the liquid resin in the container, means for detecting the temperature of the liquid resin contained in the container, and means for heating based on the temperature of the liquid resin detected by the detecting means Control means for adjusting the strength of the.

Therefore, the heating temperature of the liquid resin can be adjusted by adjusting the electric power supplied from the power supply to the heating means by the control means so that the liquid resin whose viscosity changes depending on the liquid temperature has an appropriate viscosity. It is possible to form a resin lid made of a continuous resin film according to the width of the opening of the semiconductor container and the immersion depth.

Further, according to the method of manufacturing a semiconductor device of the present invention, the semiconductor device before the resin cover is formed is immersed in the liquid resin to form the resin cover. Forming a resin lid consisting of a continuous resin film by adjusting the viscosity of the liquid resin and the immersion depth of the cylindrical side wall according to the opening width of the cylindrical side wall even if it is circular or any other shape. Is possible.

Therefore, it is possible to form a resin-sealed semiconductor device in which the periphery of the semiconductor chip is hollow.
Further, it is possible to quickly or flexibly respond to a change in outer shape.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a cap forming device of a resin-sealed semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a cap forming device of a resin-sealed semiconductor device according to a second embodiment of the present invention.

3A and 3B are cross-sectional views (No. 1) showing a method for forming a resin-encapsulated semiconductor device according to a third embodiment of the present invention.

FIG. 4 is a perspective view (No. 2) showing the method of forming the resin-sealed semiconductor device according to the third embodiment of the invention.

5A to 5C are sectional views (3) showing the method for forming the resin-sealed semiconductor device according to the third embodiment of the present invention.

FIG. 6 is a sectional view (No. 4) showing the method of forming the resin-encapsulated semiconductor device according to the third embodiment of the invention.

FIG. 7 is a perspective view and a cross-sectional view showing a method of forming a resin-sealed semiconductor device according to a fourth embodiment of the present invention.

FIG. 8 is a perspective view and a sectional view showing a method of forming a resin-sealed semiconductor device according to a fifth embodiment of the present invention.

FIG. 9 is a perspective view and a cross-sectional view showing a method of forming a resin-sealed semiconductor device according to a sixth embodiment of the present invention.

10A to 10C are cross-sectional views (No. 1) showing a method for forming a resin-sealed semiconductor device according to a conventional example.

FIG. 11 is a sectional view (No. 2) showing the method for forming the resin-encapsulated semiconductor device according to the conventional example.

[Explanation of symbols]

21 Container 22 Liquid Level Sensor (Means for Detecting Surface Position of Liquid Resin) 23, 30 Control Means 24 Holding Tool 25 Moving Means 25a Cap (Resin Lid) 26 Liquid Resin 27 Temperature Sensor (Means for Detecting Temperature of Liquid Resin) 28 heater (heating means) 29 power supply 31 bases 32a, 32b external leads 32c chip mounting parts 33, 33a to 33c tubular side wall 36 semiconductor chips 37a, 37b internal leads 102, 102a to 102c package body (semiconductor container)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-61-269339 (JP, A) JP-A-2-51260 (JP, A) JP-A-3-239349 (JP, A) JP-A-4- 260358 (JP, A) JP-A-6-69366 (JP, A) JP-A-7-130778 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/28

Claims (7)

(57) [Claims] 1. A container for storing a liquid resin for forming a resin lid, a holder for holding a semiconductor device before the resin lid is formed, a moving means for moving the holder up or down, and a container for putting the container in the container. A means for detecting the position of the surface of the liquid resin, and a control means for adjusting the moving distance of the moving means up or down based on the position of the surface of the liquid resin detected by the detecting means. A semiconductor device manufacturing apparatus characterized by the above. 2. A container for containing a liquid resin for forming a resin lid, a means for heating the liquid resin in the container, a means for detecting the temperature of the liquid resin contained in the container, and a means for detecting the temperature. And a control unit that adjusts the intensity of heating by the heating unit based on the temperature of the liquid resin detected by the semiconductor device manufacturing apparatus. 3. A semiconductor storage container before formation of a resin lid, in which a mounting portion of a semiconductor chip on a base is surrounded by a tubular side wall, and a top portion of the tubular side wall serves as a support portion for the resin lid. Then, by dipping the top of the cylindrical side wall of the semiconductor storage container in a liquid resin adjusted to a predetermined viscosity, by pulling up,
A method of manufacturing a semiconductor device, wherein the inside of the cylindrical side wall is hermetically sealed, and the resin lid supported by a support portion of the resin lid is formed. 4. The method for manufacturing a semiconductor device according to claim 3, wherein the material of the liquid resin is a thermoplastic resin or a thermosetting resin. 5. The method for manufacturing a semiconductor device according to claim 3, wherein the liquid resin is heated to adjust the viscosity of the liquid resin according to the temperature of the liquid resin. 6. The method of manufacturing a semiconductor device according to claim 3, wherein unevenness is formed on the top of the cylindrical side wall. 7. A step or an inclination is provided inside the cylindrical side wall so that the thickness of the cylindrical side wall becomes thinner toward the top portion. 1. A method of manufacturing a semiconductor device according to 1.