JP3387557B2 - How to remove blanks - Google Patents

How to remove blanks

Info

Publication number
JP3387557B2
JP3387557B2 JP17120493A JP17120493A JP3387557B2 JP 3387557 B2 JP3387557 B2 JP 3387557B2 JP 17120493 A JP17120493 A JP 17120493A JP 17120493 A JP17120493 A JP 17120493A JP 3387557 B2 JP3387557 B2 JP 3387557B2
Authority
JP
Japan
Prior art keywords
wiring pattern
pattern portion
carrier tape
adhesive layer
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17120493A
Other languages
Japanese (ja)
Other versions
JPH076640A (en
Inventor
昌吾 丹野
寿幸 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP17120493A priority Critical patent/JP3387557B2/en
Publication of JPH076640A publication Critical patent/JPH076640A/en
Application granted granted Critical
Publication of JP3387557B2 publication Critical patent/JP3387557B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Description

【発明の詳細な説明】 【０００１】 【産業上の利用分野】本発明は、フラット配線体の製造
等に於て使用される打抜残材の除去方法に関する。 【０００２】 【従来の技術】近年、自動車等においては、電子自動制
御化が進み、ドア等に多数の電線を配線する必要が生じ
てきた。 【０００３】ところが、使用される電線としては、銅線
等の断面略円形の導体に塩化ビニル等の絶縁層を被覆し
たものであり、使用する際には、多数の電線を束ねてい
た。そして、この多数の電線を束ねる作業は手作業で行
なわねばならず、極めて面倒でかつ非能率的であった。 【０００４】そこで、多数の電線を効率良く配線するた
めに、導体箔からなる配線パターンを一対の絶縁層にて
サンドウィッチ状に被覆したフラット配線体が、提案さ
れた。 【０００５】このフラット配線体は、キャリアテープの
表面に粘着層を介して導体箔を積層し、かつ、該導体箔
を打抜きにて配線パターン部と除去すべき非配線パター
ン部とに区画し、導体箔の非配線パターン部のみを剥離
・除去して、残った配線パターン部を上記絶縁層に転写
及びラミネートして製造される。 【０００６】 【発明が解決しようとする課題】しかし、従来、非配線
パターン部の除去に於て、粘着層の粘着力は比較的強い
ために、打抜残材である導体箔の非配線パターン部を剥
離させにくく、しかも、キャリアテープ側が曲がった状
態で、非配線パターン部を剥離してしまうと、配線パタ
ーン部も一緒に剥がれてしまうという問題があった。 【０００７】また、非配線パターンに対応する粘着層上
に離型紙等のマスキング層を設け、非配線パターン部の
剥離を容易にすることも考えられるが、マスキング層の
形成という余分な工程を必要とすると共に、その分製品
のコストアップを招くという問題がある。 【０００８】そこで、本発明では、フラット配線体の製
造等に於て、容易かつ確実に、非配線パターン部である
打抜残材のみを除去できる方法を提供することを目的と
する。 【０００９】 【課題を解決するための手段】上述の目的を達成するた
めに、本発明の打抜残材の除去方法は、キャリアテープ
の表面に粘着層を介して導体箔を積層し、かつ、該導体
箔を打抜きにて配線パターン部と除去すべき非配線パタ
ーン部とに区画してなる帯状素材に、長手方向へ間欠的
に送りを与えて、多孔吸着平板へ上記キャリアテープの
裏面を吸着すると共に該裏面側から加熱して上記粘着層
を軟化させ、上記導体箔の非配線パターン部を、剥離開
始時の剥離角度を鋭角にして、上記帯状素材から剥離す
るものである。 【００１０】 【作用】多孔吸着平板へキャリアテープの裏面を吸着さ
せることにより、キャリアテープ及びその表面上の配線
パターン部は強固に平面状に維持された状態となる。す
なわち、剥離が行われる帯状素材が、従来のように遊動
し得る状態ではなく、平面状に固着されている状態であ
り、加えて加熱により粘着層を一時的に軟化させて粘着
力を低下させているので、非配線パターン部を帯状素材
から、配線パターン部を抱き込むことなく容易かつ確実
に剥離して除去できる。 【００１１】 【実施例】以下、実施例を示す図面に基づいて本発明を
詳説する。 【００１２】図１は、本発明に係る打抜残材の除去方法
に用いられる残材除去装置１を示しており、この残材除
去装置１及び打抜残材の除去方法は、フラット配線体２
（図13参照）の製造装置等に於て使用される。 【００１３】このフラット配線体製造装置では、図５と
図６に示すように、ドラム３から供給した長尺のキャリ
アテープ４に、矢印Ａ方向に所定ピッチで間欠的に送り
が与えられ、キャリアテープ４の表面４ａに、粘着層形
成機５にて粘着剤を塗布して、粘着層６を形成する。 【００１４】次に、図５と図７に示すように、ドラム11
から銅箔等の導電性導体箔12を供給して、キャリアテー
プ４の粘着層６に粘着する。 【００１５】なお、キャリアテープ４は、導体箔12より
も幅広となっている（図８参照）。 【００１６】そして、導体箔12を粘着したキャリアテー
プ４を、打抜刃を備えたハーフカットプレス機13に供給
して、図８に示すように、導体箔12を、（キャリアテー
プ４を貫通することなく）幅狭の複数本の導線14…から
なる配線パターン部15に応じて打抜く。 【００１７】これにより、キャリアテープ４に粘着層６
を介して導体箔12を積層し、かつ、配線パターン部15と
除去すべき非配線パターン部16とに区画してなる帯状素
材17が形成される。 【００１８】次に、図５と図９に示すように、残材除去
装置１にて、配線パターン部15を帯状素材17に残して、
打抜残材である非配線パターン部16のみを剥離する。 【００１９】具体的には、図１〜図４に示すように、残
材除去装置１は、帯状素材17を吸着する真空吸引機18
と、真空吸引機18を介して帯状素材17を加熱するヒータ
19と、帯状素材17の段付状エッジ部20，20を真空吸引機
18に押圧する押圧機構21，21と、真空吸引機18の上流及
び下流に配設されたクランプ機構22，22と、真空吸引機
18の上方の所定の固定位置に設けられた棒状のプーリ23
と、剥離された非配線パターン部16を挟持して所定方向
に引取るべく回転駆動される一対の引取ローラ24，24
と、を備えている。 【００２０】真空吸引機18は、熱伝導良好な材質からな
る吸引機本体25及び多孔吸着平板26と、図示省略の吸引
ブロワと、からなる。 【００２１】この吸引機本体25の表面27側には、格子状
として互いに連通する多数本の吸引溝28ａ…，28ｂ…が
凹設されており、その表面27に、多孔吸着平板26が密着
固定される。さらに、多孔吸着平板26には、吸引溝28ａ
…，28ｂ…に連通する多数の小貫孔29…が形成される。 【００２２】なお、多孔吸着平板26としては、熱伝導良
好で通気性を有する焼結金属板（例えばステンレスペレ
ットを圧縮成型したもの等）を使用するも好ましく、帯
状素材17を吸着する面積、即ち吸着力が大となる利点が
ある。 【００２３】また、吸引機本体25の中央部には、吸引溝
28ａ…，28ｂ…と連通する吸引孔30が設けられ、この吸
引孔30から吸引溝28ａ…，28ｂ…内の空気が吸引され、
真空引きが行われる。 【００２４】この吸引機本体25の裏面31に、ヒータ19が
密着固定され、ヒータ19の熱は、吸引機本体25を通じて
多孔吸着平板26に伝達されるようになっている。 【００２５】また、押圧機構21は、帯状素材17のエッジ
部20に沿って配設された保持杆32と、保持杆32に所定ピ
ッチで固定された複数枚の板バネ33…と、保持杆32をそ
の軸心Ｃ廻りに回動させると共に帯状素材17の幅方向
（矢印Ｄ方向）に往復動させる図示省略の流体シリンダ
等の駆動機と、からなる。 【００２６】そして、クランプ機構22は、固定の受部材
34と、図示省略の駆動機にて上下駆動される押部材35
と、からなる。 【００２７】また、真空吸引機18上を跨ぐようにして、
上流寄りに、検知アーム37が設けられる。この検知アー
ム37は、多孔吸着平板26上を横切って帯状素材17に接触
する検知バー39を有し、軸心Ｆ廻りに揺動可能となって
おり、検知アーム37の上方への揺動によりセンサー40が
作動するように構成される。 【００２８】なお、検知アーム37は、帯状素材17の送り
ピッチに合わせて、帯状素材17の長手方向に、移動及び
固定可能に構成される。 【００２９】しかして、図１〜図３に示すように、帯状
素材17が所定ピッチだけ、矢印Ａ方向に送られて、（図
１の実線で図示する如く）プーリ23に剥離済の非配線パ
ターン部16を引掛けた状態でもって、真空吸引機18に位
置決めされると、該真空吸引機18にて真空引きし、多孔
吸着平板26の表面41にキャリアテープ４の裏面４ｂを吸
着して、帯状素材17を平面状に維持する。 【００３０】また、キャリアテープ４と多孔吸着平板26
の吸着力の方が、粘着層６による非配線パターン部16と
キャリアテープ４の粘着力よりも、大となるように設定
される。 【００３１】この状態で、キャリアテープ４の裏面４ｂ
側から、ヒータ19で帯状素材17を加熱して、粘着層６を
軟化させ、一時的に粘着力を低下させる。このとき、キ
ャリアテープ４は多孔吸着平板26に吸着（密着）されて
いるので両者の間の熱伝導は迅速かつ良好となる。 【００３２】さらに、真空吸引機18の下流側の受部材34
と押部材35で、非配線パターン部16の剥離前の帯状素材
17をクランプすると共に、上流側の受部材34と押部材35
で非配線パターン部16剥離済の帯状素材17（即ち、配線
パターン部15を粘着したキャリアテープ４）をクランプ
する。 【００３３】かつ、保持杆32を、帯状素材17のエッジ部
20近傍へ移動させて、板バネ33…を下方へ揺動させ、両
サイドのエッジ部20，20を弾発的に押圧する。 【００３４】これにより、キャリアテープ４の浮きによ
る真空破壊を防止して、非配線パターン部16の剥離を一
層確実なものとすることができる。 【００３５】なお、帯状素材17に送りが与えられている
ときには、剥離済の非配線パターン部16が板バネ33…に
引っ掛かるのを防止するために、板バネ33…を上方へ揺
動させた状態でもって保持杆32を、帯状素材17よりも外
側へ逃がしておく。 【００３６】次に、プーリ23に引掛けられた剥離済の非
配線パターン部16を引取ローラ24，24にて矢印Ｂ方向に
引取って、下流方向へ向かって、非配線パターン部16
を、帯状素材17（キャリアテープ４）から剥離してい
く。 【００３７】この非配線パターン部16の剥離開始時に
は、比較的力を要するので、非配線パターン部16を剥離
しやすいように、剥離角度θを鋭角にすることは好まし
く、剥離開始時におけるキャリアテープ４の浮きによる
真空破壊を確実に防止できる。 【００３８】非配線パターン部16を所定部位まで剥離す
ると、剥離した非配線パターン部16によって、検知アー
ム37の検知バー39が上方へ揺動して、センサー40が作動
する。 【００３９】これにより、引取ローラ24，24の回転が停
止して、所定長さの非配線パターン部16の剥離が終了
し、キャリアテープ４の表面４ａ側に粘着された配線パ
ターン部15が残る。なお、引取ローラ24，24にて引取ら
れた剥離済の非配線パターン部16は、順次ボックス42に
収納される。 【００４０】剥離が終了すると、クランプ機構22，22及
び押圧機構21，21によるクランプが解除され、かつ、真
空吸引機18の真空引きが止まって、キャリアテープ４が
非吸着状態となり、上述の如く所定ピッチだけ帯状素材
17が送られて位置決めされる。 【００４１】このようにして、配線パターン部15が残っ
たキャリアテープ４に、図５と図10に示すように、供給
ロール43から、接着剤層44を有する第１絶縁テープ45を
供給し、配線パターン部15を接着剤層44と粘着層６で挟
むようにして、重ね合わせる。 【００４２】この状態で、第１ラミネート装置46の上下
ローラ47ａ，47ａ，47ｂ，47ｂを通過させて、キャリア
テープ４と第１絶縁テープ45を加熱しつつ貼り合わせ
て、配線パターン部15を第１絶縁テープ45の接着剤層44
に接着する。 【００４３】これにより、配線パターン部15に対する粘
着層６の粘着力より接着剤層44の接着力の方が勝るよう
になる。 【００４４】次に、図５と図11に示すように、キャリア
テープ４を巻取ドラム48に巻取って、第１絶縁テープ45
からキャリアテープ４を分離することにより、配線パタ
ーン部15を第１絶縁テープ45側に転写する。 【００４５】この配線パターン部15が転写された第１絶
縁テープ45に、図５と図12に示すように、供給ロール49
から接着剤層50を有する第２絶縁テープ51を供給し、配
線パターン部15を両接着剤層44，50で挟むようにして、
重ね合わせる。 【００４６】この状態で、第２ラミネート装置52の上下
ローラ53ａ，53ａ，53ｂ，53ｂを通過させて、第２絶縁
テープ51と第１絶縁テープ45を加熱しつつ貼り合わせ
て、配線パターン部15を両接着剤層44，50に接着する。 【００４７】これにより、図13に示すように、内部に配
線パターン部15を有する中間積層体54が形成される。な
お、図例では、１個の配線パターン部15のみを描いてい
るが、実際は複数の配線パターン部15が隣設される。 【００４８】そして、図５と図13に示すように、外形打
抜き機55にて、中間積層体54は所定の外形形状に打抜か
れて、フラット配線体２が形成される。 【００４９】 【発明の効果】本発明は上述の如く構成されているの
で、次に記載する効果を奏する。 【００５０】多孔吸着平板26へ帯状素材17を平面状に維
持でき、加熱により粘着層６の粘着力を低下させること
ができるので、帯状素材17から非配線パターン部16のみ
を、容易かつ確実に剥離して除去し得る。剥離角度θを
鋭角にするので、非配線パターン部16を剥離しやすく、
剥離開始時におけるキャリアテープ４の浮きによる真空
破壊を確実に防止できる。 【００５１】従って、配線パターン部15を常に安定して
キャリアテープ４に粘着させた状態で次工程に送ること
ができ、製造効率を格段に向上させることができる。ま
た、キャリアテープ４の粘着層６上にマスキング層を設
けずとも非配線パターン部16の確実な剥離が行い得るの
で、製造工程の簡略化も図ることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing blanks used in manufacturing flat wiring bodies. 2. Description of the Related Art In recent years, automatic control of automobiles and the like has advanced, and it has become necessary to wire a large number of electric wires to doors and the like. [0003] However, the electric wire used is a conductor having a substantially circular cross section such as a copper wire coated with an insulating layer such as vinyl chloride. When used, a large number of electric wires are bundled. The work of bundling a large number of electric wires has to be performed manually, which is extremely troublesome and inefficient. In order to efficiently wire a large number of electric wires, a flat wiring body in which a wiring pattern made of a conductive foil is covered with a pair of insulating layers in a sandwich shape has been proposed. In this flat wiring body, a conductor foil is laminated on the surface of a carrier tape via an adhesive layer, and the conductor foil is sectioned by punching into a wiring pattern portion and a non-wiring pattern portion to be removed. It is manufactured by peeling and removing only the non-wiring pattern portion of the conductive foil, and transferring and laminating the remaining wiring pattern portion to the insulating layer. However, conventionally, in removing the non-wiring pattern portion, the adhesive strength of the adhesive layer is relatively strong. When the non-wiring pattern portion is peeled off in a state where the portion is difficult to peel off and the carrier tape side is bent, there is a problem that the wiring pattern portion also comes off together. It is also conceivable to provide a masking layer such as release paper on the adhesive layer corresponding to the non-wiring pattern to facilitate peeling of the non-wiring pattern portion, but an extra step of forming the masking layer is required. In addition, there is a problem that the cost of the product increases. Accordingly, an object of the present invention is to provide a method capable of easily and reliably removing only the uncut material which is a non-wiring pattern portion in the manufacture of a flat wiring body or the like. [0009] In order to achieve the above-mentioned object, a method for removing a punching residual material according to the present invention comprises: laminating a conductor foil on the surface of a carrier tape via an adhesive layer; A band-shaped material partitioned into a wiring pattern portion and a non-wiring pattern portion to be removed by punching the conductive foil is intermittently fed in the longitudinal direction, and the back surface of the carrier tape is applied to a porous adsorption flat plate. The non-wiring pattern portion of the conductive foil is peeled open by absorbing and heating from the back side to soften the adhesive layer.
The initial peeling angle is set to an acute angle, and peeling is performed from the strip-shaped material. By adsorbing the back surface of the carrier tape to the porous adsorption flat plate, the carrier tape and the wiring pattern portion on its surface are firmly maintained in a planar state. In other words, the strip-shaped material to be peeled is not in a state in which it can float as in the conventional case, but in a state in which it is fixed in a plane, and in addition, the adhesive layer is temporarily softened by heating to reduce the adhesive strength. Therefore, the non-wiring pattern portion can be easily and reliably peeled off and removed from the belt-shaped material without holding the wiring pattern portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing embodiments. FIG. 1 shows a residual material removing apparatus 1 used in a method for removing a punched residual material according to the present invention. 2
(See FIG. 13). In this flat wiring body manufacturing apparatus, as shown in FIGS. 5 and 6, the long carrier tape 4 supplied from the drum 3 is intermittently fed at a predetermined pitch in the direction of arrow A, and An adhesive is applied to the surface 4 a of the tape 4 by an adhesive layer forming machine 5 to form an adhesive layer 6. Next, as shown in FIG. 5 and FIG.
Supplies a conductive conductive foil 12 such as a copper foil to adhere to the adhesive layer 6 of the carrier tape 4. The carrier tape 4 is wider than the conductor foil 12 (see FIG. 8). Then, the carrier tape 4 to which the conductor foil 12 is adhered is supplied to a half-cut press machine 13 having a punching blade, and the conductor foil 12 is passed through the carrier tape 4 as shown in FIG. Punching is performed according to the wiring pattern portion 15 including a plurality of narrow conductive wires 14. Thus, the adhesive layer 6 is applied to the carrier tape 4.
A strip-shaped material 17 is formed by laminating the conductor foils 12 through the intervening portions and partitioning the wiring pattern portion 15 and the non-wiring pattern portion 16 to be removed. Next, as shown in FIG. 5 and FIG. 9, the wiring pattern portion 15 is left on the strip material 17 by the residual material removing device 1.
Only the non-wiring pattern portion 16 which is the blank material is peeled off. Specifically, as shown in FIGS. 1 to 4, the residual material removing device 1 includes a vacuum suction device 18 for adsorbing a strip-shaped material 17.
And a heater for heating the strip-shaped material 17 via a vacuum suction machine 18
Vacuum suction machine 19 and stepped edge portions 20 and 20 of strip-shaped material 17
A pressure mechanism 21, 21 for pressing against the vacuum suction device 18, clamp mechanisms 22, 22 disposed upstream and downstream of the vacuum suction device 18, and a vacuum suction device.
A bar-shaped pulley 23 provided at a predetermined fixed position above 18
And a pair of take-off rollers 24, 24 which are rotatably driven to hold the peeled non-wiring pattern portion 16 and take in a predetermined direction.
And The vacuum suction device 18 comprises a suction device main body 25 and a porous suction plate 26 made of a material having good heat conductivity, and a suction blower (not shown). A plurality of suction grooves 28a,..., 28b... Communicating with each other are formed in a lattice shape on the surface 27 side of the suction device main body 25. Is done. Further, a suction groove 28a is formed in the porous adsorption flat plate 26.
, 28b are formed with a large number of small through holes 29. As the porous adsorption plate 26, a sintered metal plate having good heat conductivity and air permeability (for example, compression molded stainless steel pellets) is preferably used. There is an advantage that the suction power is large. A suction groove is provided at the center of the suction device main body 25.
A suction hole 30 communicating with 28a, 28b is provided, and the air in the suction grooves 28a, 28b is sucked from the suction hole 30,
An evacuation is performed. The heater 19 is closely fixed to the back surface 31 of the suction machine main body 25, and the heat of the heater 19 is transmitted to the porous adsorption flat plate 26 through the suction machine main body 25. The pressing mechanism 21 includes a holding rod 32 disposed along the edge 20 of the strip-shaped material 17, a plurality of leaf springs 33 fixed to the holding rod 32 at a predetermined pitch, and a holding rod. And a driving device such as a fluid cylinder (not shown) that rotates the rotary shaft 32 around its axis C and reciprocates in the width direction (arrow D direction) of the band-shaped material 17. The clamp mechanism 22 includes a fixed receiving member.
34 and a push member 35 driven up and down by a drive unit (not shown)
And consisting of [0027] Also, as it straddles over the vacuum suction machine 18,
A detection arm 37 is provided near the upstream. The detection arm 37 has a detection bar 39 that contacts the strip-shaped material 17 across the perforated adsorption plate 26 and can swing around the axis F. When the detection arm 37 swings upward, The sensor 40 is configured to operate. The detection arm 37 is configured to be movable and fixed in the longitudinal direction of the strip 17 in accordance with the feed pitch of the strip 17. As shown in FIGS. 1 to 3, the strip-shaped material 17 is fed at a predetermined pitch in the direction of the arrow A, and the stripped non-wiring (as shown by the solid line in FIG. 1) is applied to the pulley 23. When the pattern portion 16 is hooked and positioned by the vacuum suction device 18, the vacuum suction device 18 evacuates the vacuum suction device 18 to suck the back surface 4 b of the carrier tape 4 on the front surface 41 of the porous suction plate 26. Then, the strip-shaped material 17 is maintained in a flat shape. The carrier tape 4 and the porous adsorption flat plate 26
Is set to be larger than the adhesive force between the non-wiring pattern portion 16 and the carrier tape 4 by the adhesive layer 6. In this state, the back surface 4b of the carrier tape 4
From the side, the strip material 17 is heated by the heater 19 to soften the adhesive layer 6 and temporarily reduce the adhesive strength. At this time, since the carrier tape 4 is adsorbed (closely adhered) to the porous adsorption flat plate 26, heat conduction between the two becomes quick and good. Further, a receiving member 34 on the downstream side of the vacuum suction machine 18 is provided.
And the pressing member 35, the strip-shaped material before peeling of the non-wiring pattern portion 16
17 while clamping the receiving member 34 and the pressing member 35 on the upstream side.
Then, the strip-shaped material 17 from which the non-wiring pattern portion 16 has been peeled off (that is, the carrier tape 4 to which the wiring pattern portion 15 is adhered) is clamped. The holding rod 32 is connected to the edge of the belt-shaped material 17.
20 and swing the plate springs 33 downward to resiliently press the edge portions 20, 20 on both sides. Thus, vacuum breakage due to floating of the carrier tape 4 can be prevented, and peeling of the non-wiring pattern portion 16 can be made more reliable. When the strip 17 is being fed, the leaf springs 33 are swung upward to prevent the peeled non-wiring pattern portions 16 from being caught on the leaf springs 33. In this state, the holding rod 32 is released outside the band-shaped material 17. Next, the peeled non-wiring pattern portion 16 hooked on the pulley 23 is taken up in the direction of arrow B by the take-off rollers 24, 24, and the non-wiring pattern portion 16 is moved downstream.
From the strip-shaped material 17 (carrier tape 4). At the start of the separation of the non-wiring pattern portion 16, a relatively large force is required. Therefore, it is preferable to set the separation angle θ to an acute angle so that the non-wiring pattern portion 16 can be easily separated. Vacuum breakage due to lifting of the carrier tape 4 at the start of peeling can be reliably prevented. When the non-wiring pattern portion 16 is peeled to a predetermined position, the detection bar 39 of the detecting arm 37 swings upward by the peeled non-wiring pattern portion 16 and the sensor 40 operates. As a result, the rotation of the take-off rollers 24, 24 is stopped, the peeling of the non-wiring pattern portion 16 having a predetermined length is completed, and the wiring pattern portion 15 adhered to the surface 4a of the carrier tape 4 remains. . The stripped non-wiring pattern portions 16 taken off by the take-off rollers 24, 24 are sequentially stored in the box 42. When the peeling is completed, the clamping by the clamp mechanisms 22 and 22 and the pressing mechanisms 21 and 21 is released, the evacuation of the vacuum suction device 18 is stopped, and the carrier tape 4 is in a non-adsorbed state, as described above. Band-shaped material only for a specified pitch
17 is sent and positioned. As described above, the first insulating tape 45 having the adhesive layer 44 is supplied from the supply roll 43 to the carrier tape 4 where the wiring pattern portion 15 remains, as shown in FIGS. The wiring pattern portions 15 are overlapped so as to be sandwiched between the adhesive layer 44 and the adhesive layer 6. In this state, the carrier tape 4 and the first insulating tape 45 are bonded together while passing through the upper and lower rollers 47a, 47a, 47b, 47b of the first laminating device 46 while heating, so that the wiring pattern portion 15 is formed by the first laminating device. 1 Adhesive layer 44 of insulating tape 45
Glue to Thus, the adhesive strength of the adhesive layer 44 is superior to the adhesive strength of the adhesive layer 6 with respect to the wiring pattern portion 15. Next, as shown in FIGS. 5 and 11, the carrier tape 4 is wound around a winding drum 48 and the first insulating tape 45 is wound.
The wiring pattern 15 is transferred to the first insulating tape 45 side by separating the carrier tape 4 from the carrier tape 4. As shown in FIGS. 5 and 12, a supply roll 49 is provided on the first insulating tape 45 to which the wiring pattern portion 15 has been transferred.
From the second insulating tape 51 having an adhesive layer 50, and the wiring pattern portion 15 is sandwiched between the two adhesive layers 44 and 50,
Overlap. In this state, the second insulating tape 51 and the first insulating tape 45 are passed through upper and lower rollers 53a, 53a, 53b, 53b of the second laminating apparatus 52 while being heated and bonded to each other. Is bonded to both adhesive layers 44 and 50. As a result, as shown in FIG. 13, an intermediate laminate 54 having the wiring pattern portion 15 therein is formed. Although only one wiring pattern portion 15 is illustrated in the drawing, a plurality of wiring pattern portions 15 are actually provided adjacent to each other. Then, as shown in FIGS. 5 and 13, the intermediate laminate 54 is punched into a predetermined outer shape by the outer shape punching machine 55, and the flat wiring body 2 is formed. Since the present invention is configured as described above, the following effects can be obtained. The strip material 17 can be maintained flat on the porous adsorption plate 26 and the adhesive force of the adhesive layer 6 can be reduced by heating. It can be peeled off and removed. Peel angle θ
Since it is an acute angle, it is easy to peel off the non-wiring pattern part 16,
Vacuum due to floating of carrier tape 4 at the start of peeling
Destruction can be reliably prevented. Therefore, the wiring pattern portion 15 can be sent to the next step in a state where the wiring pattern portion 15 is always stably adhered to the carrier tape 4, and the production efficiency can be remarkably improved. In addition, since the non-wiring pattern portion 16 can be reliably separated without providing a masking layer on the adhesive layer 6 of the carrier tape 4, the manufacturing process can be simplified.

【図面の簡単な説明】 【図１】本発明に係る打抜残材の除去方法に使用する残
材除去装置の簡略側面図である。 【図２】残材除去装置の要部簡略平面図である。 【図３】真空吸引機の要部断面正面図である。 【図４】吸引機本体の要部平面図である。 【図５】フラット配線体製造装置の全体簡略図である。 【図６】キャリアテープに粘着層を形成した状態の拡大
断面図である。 【図７】キャリアテープと導体箔とを重ね合わせた状態
の拡大断面図である。 【図８】導体箔を打抜いた状態の簡略平面図である。 【図９】非配線パターン部を帯状素材から剥離する状態
の拡大断面図である。 【図10】第１絶縁テープとキャリアテープとを重ね合わ
せた状態の拡大断面図である。 【図11】第１絶縁テープとキャリアテープとを分離して
いる状態の拡大断面図である。 【図12】中間積層体の拡大断面図である。 【図13】中間積層体の外形形状の打抜き状態を示す簡略
平面図である。 【符号の説明】 ４ キャリアテープ ４ａ 表面 ４ｂ 裏面 ６ 粘着層 12 導体箔 15 配線パターン部 16 非配線パターン部 17 帯状素材 26 多孔吸着平板BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a simplified side view of a residual material removing device used in a method for removing a punched residual material according to the present invention. FIG. 2 is a simplified plan view of a main part of the residual material removing device. FIG. 3 is a sectional front view of a main part of the vacuum suction machine. FIG. 4 is a plan view of a main part of a suction machine main body. FIG. 5 is an overall simplified diagram of a flat wiring body manufacturing apparatus. FIG. 6 is an enlarged sectional view showing a state in which an adhesive layer is formed on a carrier tape. FIG. 7 is an enlarged cross-sectional view showing a state in which a carrier tape and a conductive foil are overlaid. FIG. 8 is a simplified plan view showing a state where a conductive foil is punched. FIG. 9 is an enlarged cross-sectional view showing a state where a non-wiring pattern portion is peeled from a belt-shaped material. FIG. 10 is an enlarged sectional view of a state where the first insulating tape and the carrier tape are overlaid. FIG. 11 is an enlarged sectional view of a state where a first insulating tape and a carrier tape are separated. FIG. 12 is an enlarged sectional view of the intermediate laminate. FIG. 13 is a simplified plan view showing a punched state of the outer shape of the intermediate laminate. [Description of Signs] 4 Carrier tape 4a Front surface 4b Back surface 6 Adhesive layer 12 Conductive foil 15 Wiring pattern portion 16 Non-wiring pattern portion 17 Band-shaped material 26 Porous adsorption flat plate

フロントページの続き (56)参考文献 特開 平６−326442（ＪＰ，Ａ) 特開 昭54−103568（ＪＰ，Ａ) 特開 平５−20939（ＪＰ，Ａ) 特開 平５−20938（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 13/00 H05K 3/02 - 3/08 Continuation of the front page (56) References JP-A-6-326442 (JP, A) JP-A-54-103568 (JP, A) JP-A-5-20939 (JP, A) JP-A-5-20938 (JP) , A) (58) Fields investigated (Int. Cl. 7 , DB name) H01B 13/00 H05K 3/02-3/08

Claims (1)

(57)【特許請求の範囲】 【請求項１】 キャリアテープの表面に粘着層を介して
導体箔を積層し、かつ、該導体箔を打抜きにて配線パタ
ーン部と除去すべき非配線パターン部とに区画してなる
帯状素材に、長手方向へ間欠的に送りを与えて、多孔吸
着平板へ上記キャリアテープの裏面を吸着すると共に該
裏面側から加熱して上記粘着層を軟化させ、上記導体箔
の非配線パターン部を、剥離開始時の剥離角度を鋭角に
して、上記帯状素材から剥離することを特徴とする打抜
残材の除去方法。(57) [Claims 1] A conductor foil is laminated on the surface of a carrier tape via an adhesive layer, and the conductor foil is punched out and a wiring pattern portion and a non-wiring pattern portion to be removed. The intermittent feed in the longitudinal direction is given to the strip-shaped material divided into the above, the back surface of the carrier tape is adsorbed to the porous adsorption flat plate, and the adhesive layer is heated from the back side to soften the adhesive layer. Make the peel angle at the start of peeling the non-wiring pattern part of the foil an acute angle.
To, the method of removing the punch抜残material, characterized in that separated from the strip material.
JP17120493A 1993-06-16 1993-06-16 How to remove blanks Expired - Fee Related JP3387557B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17120493A JP3387557B2 (en) 1993-06-16 1993-06-16 How to remove blanks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17120493A JP3387557B2 (en) 1993-06-16 1993-06-16 How to remove blanks

Publications (2)

Publication Number Publication Date
JPH076640A JPH076640A (en) 1995-01-10
JP3387557B2 true JP3387557B2 (en) 2003-03-17

Family

ID=15918958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17120493A Expired - Fee Related JP3387557B2 (en) 1993-06-16 1993-06-16 How to remove blanks

Country Status (1)

Country Link
JP (1) JP3387557B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69507674T2 (en) * 1994-09-30 1999-06-10 Mitsubishi Cable Ind Ltd Method of making a flat wire harness
FI20045235A (en) * 2004-06-22 2005-12-23 Intune Circuits Oy Procedure for treating an electrically conductive pattern
DE102006028536A1 (en) 2006-06-21 2007-12-27 Axel Ahnert Method for producing a circuit part on a substrate
EP2089728B1 (en) * 2006-12-05 2016-05-25 MariCare Oy An electric sensor web, system and a method for its manufacture

Also Published As

Publication number Publication date
JPH076640A (en) 1995-01-10

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