JP3384264B2 - Heat conduction control device and resin molding die device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling heat conduction between objects having a temperature difference such as electronic equipment and production equipment, and more particularly, a heat conduction control device and a resin molding die for efficiently controlling heat transmission and heat quantity. It relates to a mold device.

[0002]

2. Description of the Related Art When a temperature is transmitted by heat conduction from one side of an object having a temperature difference such as a heating source and a material to be heated to the other side, heat transfer is turned on by bringing these objects into contact with each other or separating them from each other. -It was controlled OFF. Also,
As another method, while the objects having a temperature difference are in contact with each other, one of them is provided with a heating means such as a heater or a cooling means such as cooling water, and the temperature is controlled by controlling the heating means and the cooling means. It was

A conventional resin molding die apparatus using such heat conduction control will be described with reference to FIGS. 6 and 7. In FIG. 6, an upper die 35 is fixed to a mounting plate 34, and the die is composed of an upper die 35 and a lower die 36. The upper mold 35 is fitted with a sprue bush 38 having a sprue 37.
Serves as an injection port for injecting resin into the mold and filling high-pressure gas 39. Further, 40 is a molding machine nozzle for injecting resin into the mold and filling high-pressure gas through the sprue 37. On the other hand, the lower mold 36 is provided with a movable insert 41 which constitutes a part of the lower mold 36. The movable insert 41 moves backward after being filled with the high-pressure gas 39, and a molded product 42.
Form a hollow part inside.

In this mold apparatus, a heat source (not shown) having a heater or the like is brought into contact with or separated from the upper mold 35 to turn on heat transfer to the upper mold 35.
-It was controlled OFF.

Next, a molding method using this mold device will be described. First, a mold is formed by the upper mold 35, the lower mold 36, and the movable insert 41. Then, the upper mold 35 is preheated by a heating source (not shown) such as a heater.

Next, resin is injected from the molding machine nozzle 40 through the sprue 37 into the mold. After the resin is injected, the mold is filled with high-pressure gas from the molding machine nozzle 40 through the sprue 37.

Next, the movable insert 41 is retracted to a predetermined position to form a hollow portion inside the molded product 42, and the high pressure gas 39
The molded product 42 is cooled by cooling the upper mold 35 with a cooling block (not shown) such as water cooling while maintaining the pressure of 1.

Thereafter, the molding machine nozzle 40 is replaced with the sprue 37.
After releasing the high pressure gas 39 into the atmosphere, the lower mold 36 is retracted and the molded product 42 is taken out.

FIG. 7 shows the structure of a mold having another mechanism.
Shown in. In the figure, the same parts as those in FIG. 6 are designated by the same reference numerals and the description thereof will be omitted. The difference from FIG. 6 is that the movable insert 41
That is, the resin is introduced into a hollow region existing between the upper die 35 and the lower die 36 to mold the resin. Heating and cooling are performed by a heating source 43 and a cooling source 44 provided in the lower mold 36.

[0010]

However, in the conventional method of bringing the heating source 43 into contact with or away from the heating source 43, the heat conduction state changes depending on the state of the contact surface, and the temperature cannot be stably transmitted. This is because the precision of the contact surfaces of the upper mold 35, the lower mold 36 and the heating source 43 is rough,
This is because an air layer is formed between the upper die 35 and the lower die 36 and the heating source 43, so that the adhesion between the die and the heating source is poor and heat is not uniformly transmitted.

Further, in the above-mentioned apparatus for controlling the temperature by controlling the heating / cooling means, in order to improve the responsiveness of the temperature control, the auxiliary equipment such as the heating / cooling means becomes large, so that the apparatus becomes large or the apparatus becomes large. Since the heat capacity of the battery becomes large, it is difficult to control the temperature efficiently.

[0012]

In order to achieve the above object, a heat conduction control device of the present invention is a graphite sheet disposed between a heating source and a material to be heated, the heating source and the material to be heated. Means for pressurizing the graphite sheet from one of the two, and a control means for controlling the temperature of the heating source.
It consists of steps .

Further, the resin molding die device of the present invention comprises a die composed of an upper die and a lower die, an injection port provided in the upper die, and a metal via the injection port. A nozzle for injecting the molding material into the mold, and a graphite sheet provided on the opposite side of the lower mold from the injection port side .
A heating source and a control means for controlling the temperature of the heating source;
The graph from either one of the heating source and the lower mold
And a means for pressing the weight sheet.
A resin molding die device is used.

Further, the resin molding die device of the present invention includes a die composed of an upper die and a lower die, an injection port provided in the upper die, and a metal via the injection port. A nozzle for injecting a molding material into the mold and a heat supply means are provided on the side opposite to the injection port side of the lower mold via a graphite sheet.

Further, it is preferable that the heat supply means includes a device for controlling the temperature.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) In the first embodiment of the present invention, as shown in FIG. 1, a highly oriented graphite sheet 1 is provided between a heating source 3 and a material 2 to be heated.
In particular, the highly oriented graphite sheet 1 is sandwiched between the heating source 3 and the material to be heated 2, and the pressurizing means 4 is provided.
Is pressed by. Further, a control means 5 for controlling the temperature of the heating source 3 is also provided. Here, specifically, the material to be heated 2 is a metal-based material such as copper, aluminum, ceramics, iron, etc., in which a heat generating member is inserted, or a heat pipe, an enclosure, a Peltier element, fins, a cooling fan, or the like. is there. The heating source is an electronic component, a heater unit, or the like.

This highly oriented graphite sheet 1 has a thermal conductivity in the lateral direction of copper or more, and a thermal conductivity anisotropy in the thickness direction which is two orders of magnitude lower than that in the lateral direction. Therefore, the heat of the contact surface between the high temperature portion and the low temperature portion can be dispersed in the in-plane direction, and the heat can be efficiently transmitted from the entire surface to the low temperature portion.

As the highly oriented graphite sheet 1 used in this example, the highly oriented graphite sheet described in JP-A-3-75211 is preferable. This sheet is a highly-oriented graphite sheet in which the orientation directions of the graphite crystals are uniform. Particularly, a graphitized specific polymer compound film has high thermal conductivity in the sheet surface direction, so highly efficient temperature control is possible. It will be possible.

As the specific polymer compound, various polyoxadiazole (POD), polybenzothiazole (PBT), polybenzobisthiazole (PBBT),
Polybenzoxazole (PBO), polybenzobisoxazole (PBBO), various polyimides (PI), various polyamides (PA), polyphenylenebenzimidazole (PBI), polyphenylenebenzobisimidazole (PPBI), polythiazole (PT), polypara Phenylene vinylene (PPV), polyamide imide (PA
At least one selected from the group consisting of I) can be used.

As the above-mentioned various polyoxadiazoles,
There are polyparaphenylene-1,3,4-oxadiazoles and their isomers.

Among the various polyimides mentioned above, there are aromatic polyimides represented by the following general formula (1).

[0022]

[Chemical 1]

[0023]

[Chemical 2]

[0024]

[Chemical 3]

The above various polyamides have the following general formula (2)
There is an aromatic polyamide represented by

[0026]

[Chemical 4]

The polyimide and polyamide used are not limited to those having these structures.

The firing conditions for graphitizing the film of the polymer compound are not particularly limited, but if it is fired so as to reach a temperature range of 2000 ° C. or higher, preferably around 3000 ° C., a more excellent orientation can be obtained. Preferred for. Firing is usually done in an inert gas. When the maximum temperature is less than 2000 ° C., the obtained graphite sheet tends to be hard and brittle. After firing
Further, rolling treatment may be carried out if necessary.

Graphitization of the polymer compound film is carried out by, for example, cutting the polymer compound film into an appropriate size and heating it to 3000 ° C. to graphitize it. After firing, it is further rolled if necessary.

The highly oriented graphite sheet thus obtained is flexible, has no damage in the sandwiched state, and has good adhesion.

Here, the heating state is shown in FIGS. 3 and 4 when the highly oriented graphite sheet is sandwiched between the heating source 3 and the material to be heated 2 (FIG. 1) and when it is bonded (FIG. 2). . 3A and FIG. 4A show the surface temperature distribution of the heated material 2, and FIG. 3B and FIG. 4B show the surface temperature distribution of the heated material 2 at each position. It is shown using the surface temperature of. Comparing the two, it can be seen that the surface temperature distribution of the material to be heated 2 is more uniform when sandwiched as shown in FIG.

The reason for this is as follows.

In FIG. 2, the highly oriented graphite sheet 1 has an air layer 6 inside, and this air layer 6 is a factor that hinders heat conduction. On the other hand,
In the case where the highly-oriented graphite sheet 1 is sandwiched between the heating source 3 and the material 2 to be heated as described above, the highly-oriented graphite sheet 1 is pressed and no air layer is present, and more uniform temperature transfer is possible. Because it will be. That is, the difference between FIG. 1 and FIG. 2 is the difference in the compressibility of the highly oriented graphite sheet 1, and it can be said that by compressing the sheet, the air layer 6 is eliminated and heat transfer is improved. This point will be described in detail below.

[0034]

[Table 1]

Table 1 shows the relationship between the compressibility of the highly oriented graphite sheet 1 and the surface temperature of the heated material 2,
The temperature of the heating source 3 was set to 100 ° C., and the temperature change was measured while changing the compressibility. Here, the material to be heated 2 is an iron material of S45C. It can be seen from Table 1 that the higher the compressibility, the better the temperature transmissibility. That is, FIG.
It is inferred that the compression ratio is close to 70%, and the high orientation graphite sheet 1 is uniformly compressed as a whole, whereas in FIG. 2, the compression ratio is close to 0%.

Further, since the highly oriented graphite sheet 1 is flexible, when it is sandwiched, the adhesion to the heating source 3 and the material to be heated 2 is good and the thermal conductivity is further enhanced.

As described above, in this embodiment, the highly oriented graphite sheet 1 having flexibility and heat conduction anisotropy is sandwiched between the heating source 3 and the material 2 to be heated, and the temperature of the heating source 3 is controlled. A heat conduction control device comprising a control means 5 for controlling,
The thermal conductivity is higher than that of the conventional metal-based material, the thermal conductivity is anisotropic, and the high temperature portion (heating source 3) and the low temperature portion (heated material 2) can be closely connected to each other. Fast, uniform temperature transfer. Therefore, it is possible to reach the heat transfer with high responsiveness to the command from the temperature control means 5 of the heating source 3.

(Embodiment 2) As another embodiment of the present invention, an example in which a highly oriented graphite sheet is used in a mold device will be shown below. Figure 5
The structure of the mold of the present invention is shown in FIG. In the figure, the same parts as those in FIG. 7 is different from FIG. 7 in that a highly oriented graphite sheet 45 is provided between the lower die 36 and the heating source 43 and between the heating source 43 and the cooling source 44. Here, iron material (S45
The one of C) was used.

With this configuration, the heat generated by the heating source 43 is uniformly distributed from the heating source 43 to the material to be heated (lower die 36) through the highly oriented graphite sheet 45 having good thermal conductivity. Can communicate quickly. As a result, the resin molded product can be molded in a short process cycle, and the resin molded product can be efficiently molded.

Since heat is transmitted faster, the response is good,
The responsiveness of temperature control is also improved. As described above, the heat conduction control device of the present embodiment has a good responsiveness and can change the temperature at the time of producing a resin molded product uniformly and quickly, which also improves the quality of the resin molded product.

As described above, the heat conduction control device according to the present embodiment can uniformly and quickly transfer heat, and its controllability and responsiveness are also improved. Further, when used in a resin molding die device, a good quality resin molded product can be obtained efficiently.

[0042]

INDUSTRIAL APPLICABILITY As described above, the present invention is a heat conduction control device having means for controlling the temperature of a heating source by sandwiching a highly oriented graphite sheet between a heating source and a material to be heated. Therefore, it is possible to provide a heat conduction control device which can quickly and evenly transmit the temperature and has high responsiveness. Further, when it is used for temperature control of a resin molding die device, heat can be transferred at a uniform temperature and temperature control with good response can be performed, so that a high quality resin molded product can be efficiently provided.

[Brief description of drawings]

FIG. 1 is a diagram showing a heat conduction control device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a heat conduction control device according to another embodiment of the present invention.

FIG. 3 is a diagram showing the surface temperature distribution of FIG.

FIG. 4 is a diagram showing the surface temperature distribution of FIG.

FIG. 5 is a view showing a mold device according to another embodiment of the present invention.

FIG. 6 is a view showing a conventional mold device.

FIG. 7 is a view showing a conventional mold device.

[Explanation of symbols]

1,7,13,20 Highly oriented graphite sheet 2 Heated material 3 heating source 4 Pressurizing means 5 Temperature control means 6 air layer 8 heater wires 9 thermal insulation 10 panels 11 frames 12 Mica sheet 14 metal body 15 Upper mold 16 Lower mold 17 heater 18 Stamper

─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Takao Inoue 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Yukio Maeda 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-8-250502 (JP, A) JP-A-4-31017 (JP, A) JP-A-63-78710 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 43/00-43/58 B29C 33/00-33/76 B29C 45/00-45/84 F24J 3/00 H05B 3/20 C04B 35/00 C01B 31/00

Claims (2)

(57) [Claims] 1. A graphite sheet disposed between a heating source and a material to be heated, and means for pressurizing the graphite sheet from one of the heating source and the material to be heated.
And a heat conduction control device comprising a control means for controlling the temperature of the heating source . 2. A mold comprising an upper mold and a lower mold, an injection port provided in the upper mold, and a molding material is injected into the mold through the injection port. A nozzle,
A heating source provided on a side of the lower mold opposite to the injection port side via a graphite sheet, and a temperature of the heating source.
Control means for controlling the temperature, the heating source and the lower mold
A hand that pressurizes the graphite sheet from either one.
A resin molding die device comprising a step.