JP3378214B2 - Component mounting method and device - Google Patents

Component mounting method and device

Info

Publication number
JP3378214B2
JP3378214B2 JP11976799A JP11976799A JP3378214B2 JP 3378214 B2 JP3378214 B2 JP 3378214B2 JP 11976799 A JP11976799 A JP 11976799A JP 11976799 A JP11976799 A JP 11976799A JP 3378214 B2 JP3378214 B2 JP 3378214B2
Authority
JP
Japan
Prior art keywords
component
light
background
mounting
background member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11976799A
Other languages
Japanese (ja)
Other versions
JP2000312099A (en
Inventor
実 山本
邦男 桜井
庫秦 濱崎
洋一 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP11976799A priority Critical patent/JP3378214B2/en
Publication of JP2000312099A publication Critical patent/JP2000312099A/en
Application granted granted Critical
Publication of JP3378214B2 publication Critical patent/JP3378214B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品などの部
品を装着ヘッドで吸着して基板の所定位置に装着する部
品装着方法及び装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for sucking components such as electronic components by a mounting head and mounting them on a predetermined position of a substrate.

【0002】[0002]

【従来の技術】近年、電子部品装着装置には、高速で信
頼性の高い部品装着性能が求められている。従来の電子
部品装着装置においては、電子部品を収容した部品供給
部から装着ヘッドに設けられたノズルにて電子部品を吸
着して保持し、この電子部品を部品認識カメラで撮像し
て電子部品の吸着姿勢を計測し、所定の装着位置で計測
結果に基づいて補正して基板に装着するように構成され
ている。
2. Description of the Related Art In recent years, electronic component mounting apparatuses have been required to have high-speed and highly reliable component mounting performance. In a conventional electronic component mounting apparatus, a nozzle provided on a mounting head sucks and holds an electronic component from a component supply unit that stores the electronic component, and the electronic component is imaged by a component recognition camera to detect the electronic component. It is configured to measure the suction posture, correct it based on the measurement result at a predetermined mounting position, and mount it on the substrate.

【0003】以上の構成による電子部品の装着方法を説
明すると、まず部品供給部において指定された電子部品
を部品供給位置に移動させ、装着ヘッドのノズルで部品
を吸着する。電子部品を吸着した装着ヘッドは部品認識
カメラの位置へ移動する。
Explaining the mounting method of the electronic component having the above configuration, first, the electronic component designated by the component supply unit is moved to the component supply position, and the component is sucked by the nozzle of the mounting head. The mounting head that picks up the electronic component moves to the position of the component recognition camera.

【0004】装着ヘッド21には、図6に示すように、
ノズル22の上部に上方の複数の発光素子24からの照
射光を拡散する拡散板23が配設されており、拡散板2
3の全面が一様に拡散発光し、吸着した電子部品25の
背景を形成するように構成されている。若しくは、図7
に示すように、ノズル22の上部に拡散素子26が配設
され、この拡散素子26に向けて指向性のある光源27
にて側面より光照射し、拡散素子26を間接的に発光さ
せることにより背景を形成するように構成されている。
The mounting head 21, as shown in FIG.
A diffuser plate 23 for diffusing the light emitted from the plurality of light emitting elements 24 above is disposed above the nozzle 22.
The entire surface of 3 uniformly diffuses and emits light to form the background of the adsorbed electronic component 25. Alternatively, FIG.
As shown in FIG. 3, a diffusing element 26 is arranged above the nozzle 22, and a light source 27 having a directivity toward the diffusing element 26.
The background is formed by irradiating the side surface with light and indirectly causing the diffusion element 26 to emit light.

【0005】このような背景のもとで電子部品25の下
方に配設された部品認識カメラ28にて電子部品25を
撮像する。そして、図4に示すように、電子部品の吸着
姿勢を電子部品の外形位置より認識し、その計測データ
に基づいて基板を設置したテーブルを水平2方向に移動
させて基板の位置を補正し、回転方向は装着ヘッド21
のノズル22を回転させて補正し、装着ヘッド21のノ
ズル22にて基板の所定の装着位置に電子部品25を実
装する。以上の動作を繰り返すことにより、基板に対す
る電子部品25の一連の装着を行っている。
Under such a background, the electronic component 25 is imaged by the component recognition camera 28 arranged below the electronic component 25. Then, as shown in FIG. 4, the suction posture of the electronic component is recognized from the external position of the electronic component, and the table on which the substrate is installed is moved in two horizontal directions based on the measurement data to correct the position of the substrate. The rotation direction is the mounting head 21.
The nozzle 22 is rotated for correction, and the electronic component 25 is mounted at a predetermined mounting position on the substrate by the nozzle 22 of the mounting head 21. By repeating the above operation, a series of mounting of the electronic component 25 on the substrate is performed.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記従
来の構成では、図6の例では装着ヘッド21毎に電源等
の配線を伴う多数の発光素子24を持たなければなら
ず、移動する装着ヘッド21の構成を複雑にし、その断
線による発光不良も起こり、電子部品装着装置のコスト
を上昇させ、信頼性を低くするという問題がある。
However, in the above-described conventional configuration, in the example of FIG. 6, each mounting head 21 must have a large number of light emitting elements 24 accompanied by wiring such as a power source, and the mounting head 21 that moves. However, there is a problem in that the structure is complicated, light emission failure occurs due to the disconnection, the cost of the electronic component mounting apparatus increases, and the reliability decreases.

【0007】また、図7の例においても、部品認識カメ
ラ28に照射光が入らないようにするためや、電子部品
25の下面に照射光が回り込まないようにするために、
指向性を持った特殊な光源27を設けるか、複雑な遮蔽
板を設ける必要がある。また、拡散素子26を一様に拡
散するために複雑にしたり、認識する電子部品25の形
状により選択されるノズル22の形状により個々に設計
しなければならず、拡散の不均一による認識の信頼性を
低くし、電子部品装着装置のコストを上げるという問題
がある。
Also in the example of FIG. 7, in order to prevent the irradiation light from entering the component recognition camera 28 and to prevent the irradiation light from going around the lower surface of the electronic component 25,
It is necessary to provide a special light source 27 having directivity or a complicated shield plate. Further, the diffusing element 26 must be complicated in order to uniformly diffuse it, or must be individually designed according to the shape of the nozzle 22 selected according to the shape of the electronic component 25 to be recognized. Therefore, there is a problem that the cost is lowered and the cost of the electronic component mounting apparatus is increased.

【0008】本発明は、上記従来の問題点に鑑み、信頼
性の高い安価な部品装着方法及び装置を提供することを
目的としている。
In view of the above conventional problems, it is an object of the present invention to provide a highly reliable and inexpensive component mounting method and device.

【0009】[0009]

【課題を解決するための手段】本発明の部品装着方法
は、供給部から供給された部品を装着ヘッドにより吸着
するステップと、蓄光材料からなる背景部材に対し光を
照射するステップと、前記光の照射が前記背景部材にな
されない状態で背景部材自体の発光を背景にして部品認
識カメラにて吸着された部品を撮像するステップと、撮
像した画像から前記部品の位置を計測し、その計測デー
に基づいて部品の位置を相対的に補正して基板に実装
するものであり、部品認識カメラによる部品認識前に蓄
光材料からなる背景部材に光を照射し、部品認識時には
背景部材自体の発光を背景として部品認識を行うことに
より、装着ヘッドを光源のない背景部材を設けた簡単で
安価な構成にできるとともに、認識時に外来光による外
乱の恐れがなくて信頼性の高い部品認識ができ、安価な
構成で信頼性の高い部品装着を実現できる。
According to the component mounting method of the present invention, the component supplied from the supply unit is sucked by the mounting head.
And the light to the background member made of phosphorescent material.
The step of irradiating and the irradiation of the light to the background member.
A step of imaging the component sucked by the component recognition camera in a state that is not in the background luminescence of the background member itself is, shooting
The position of the part is measured from the image and the measurement data
The component position is relatively corrected based on the sensor and mounted on the board.Before component recognition by the component recognition camera, the background member made of the phosphorescent material is irradiated with light, and at the time of component recognition, the background member itself emits light. By performing the component recognition against the background, the mounting head can have a simple and inexpensive structure provided with a background member without a light source, and at the time of recognition, highly reliable component recognition can be performed without the risk of external light disturbance. It is possible to realize highly reliable component mounting with an inexpensive configuration.

【0010】また、背景部材への光の照射時間を部品の
種類に応じて可変することにより、背景照度を部品の種
類に応じて適正に可変して適正な部品認識を確保するこ
とができる。
Further, by changing the irradiation time of the light to the background member according to the type of the component, the background illuminance can be appropriately changed according to the type of the component, and proper component recognition can be ensured.

【0011】また、背景部材への光の照射を部品認識カ
メラに光が入射しない位置で行うことにより、光照射の
電源の入り切りや複雑な遮蔽部材の設置が不要となり、
さらに安価に構成することができる。
Further, by irradiating the background member with light at a position where the light does not enter the component recognition camera, it is not necessary to turn on / off the power of the light irradiation or to install a complicated shielding member.
Further, the cost can be reduced.

【0012】また、本発明の部品装着装置は、所望の部
品を供給する供給部と、供給部から供給された部品を吸
着して基板の所定位置に搬送して装着する装着ヘッド
と、装着ヘッドにより吸着された部品撮像して部品位
置を計測する部品認識カメラと、蓄光材料からなる部品
撮像用の背景部材と、背景部材に光を照射する光照射手
段とからなり、前記光照射手段による光の照射が前記背
景部材になされない状態で背景部材自体の発光を背景と
して部品の撮像を行うものであり、上記装着方法を実施
してその作用効果を奏することができる。
Further, the component mounting apparatus of the present invention comprises a supply unit for supplying a desired component, a mounting head for sucking the component supplied from the supply unit and transporting it to a predetermined position on the substrate for mounting, and a mounting head. a component recognition camera to measure the part position by imaging the component sucked by the component made of a phosphorescent material
A background member for imaging and a light emitting hand that illuminates the background member with light.
The step of irradiating light by the light irradiating means is
The background member itself emits light as
Then, the component is imaged , and the above-described mounting method can be performed to obtain the operation effect.

【0013】また、光照射手段による光照射時間を可変
する手段を設けることにより、また光照射手段をその照
射光が部品認識カメラに入射しない位置に配設すること
により、それぞれ上記作用を奏することができる。
By providing means for varying the light irradiation time by the light irradiating means, and by disposing the light irradiating means at a position where the irradiating light does not enter the component recognition camera, the above-mentioned effects can be achieved respectively. You can

【0014】[0014]

【発明の実施の形態】以下、本発明の部品装着方法及び
装置の一実施形態について、図1〜図5を参照して説明
する。
BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a component mounting method and device of the present invention will be described below with reference to FIGS.

【0015】本実施形態の電子部品装着装置の全体構成
を示す図1において、1は装着部で、間欠回転する回転
体2の外周部に複数の装着ヘッド3が間欠回転ピッチで
配設されている。4は装着ヘッド3に設けられたノズル
で、電子部品5を吸着保持する。
In FIG. 1 showing the overall structure of the electronic component mounting apparatus of the present embodiment, 1 is a mounting portion, and a plurality of mounting heads 3 are arranged at an intermittent rotation pitch on an outer peripheral portion of a rotating body 2 which rotates intermittently. There is. Reference numeral 4 denotes a nozzle provided on the mounting head 3, which sucks and holds the electronic component 5.

【0016】6は部品供給部で、電子部品5を収容した
複数の部品供給ユニット7が搭載されており、装着ヘッ
ド3のノズル4にて吸着できる所定の部品供給位置に任
意の電子部品5を供給するように構成されている。
Reference numeral 6 denotes a component supply unit, on which a plurality of component supply units 7 accommodating the electronic components 5 are mounted, and an arbitrary electronic component 5 is placed at a predetermined component supply position where the nozzles 4 of the mounting head 3 can suck the components. Is configured to supply.

【0017】8は、装着ヘッド3のノズル4で吸着され
た電子部品5の吸着位置を認識する部品認識カメラで、
装着ヘッド3の移動経路における部品供給位置と部品装
着位置との間に配設されている。この部品認識カメラ8
にて装着ヘッド3に吸着された電子部品5を撮像し、そ
の吸着位置を計測する。
Reference numeral 8 denotes a component recognition camera for recognizing the suction position of the electronic component 5 sucked by the nozzle 4 of the mounting head 3.
It is arranged between the component supply position and the component mounting position in the movement path of the mounting head 3. This parts recognition camera 8
The electronic component 5 sucked by the mounting head 3 is imaged and the suction position is measured.

【0018】9はXYテーブルで、電子部品5を装着す
る基板10が設置され、基板10上の電子部品5を装着
すべき位置が装着ヘッド3による部品装着位置に位置す
るように位置決めする。
Reference numeral 9 denotes an XY table, on which a substrate 10 on which the electronic component 5 is mounted is set, and the electronic head 5 is positioned so that the position where the electronic component 5 is to be mounted is located at the component mounting position by the mounting head 3.

【0019】11は回転部で、吸着された電子部品5の
姿勢を任意の方向に回転させるため、装着ヘッド3のノ
ズル4を回転させる。
Reference numeral 11 denotes a rotating portion, which rotates the nozzle 4 of the mounting head 3 in order to rotate the posture of the sucked electronic component 5 in an arbitrary direction.

【0020】また、部品認識カメラ8の配置位置には、
図2に示すように、装着ヘッド3のノズル4の上部に配
設された蓄光材料から成る背景部材12に向けて光を照
射する光照射手段13が配設されている。
Further, at the arrangement position of the component recognition camera 8,
As shown in FIG. 2, a light irradiating means 13 for irradiating light toward a background member 12 made of a phosphorescent material, which is arranged above the nozzle 4 of the mounting head 3, is arranged.

【0021】次に、以上の構成による電子部品装着方法
について説明する。まず、部品供給部6において指定さ
れた電子部品5を部品供給位置へ移動させ、実装ヘッド
3のノズル4で吸着する。そして、装着ヘッド3が部品
認識カメラ8の位置に来たとき、図2に示すように、光
照射手段13から背景部材12に向けて光照射を行う。
その後、図3に示すように、光照射手段13の電源を切
るか、図示しないシャッタで遮光することにより光照射
を中断する。光照射を中断しても蓄光材料からなる背景
部材12は継続して発光し、図3に示すように、背景部
材12が発光した状態で電子部品5の外形を部品認識カ
メラ8により撮像する。その際に、光照射手段13から
の光照射が遮断されているので、部品認識カメラ8や電
子部品5の下面側に光が回り込むことがなく、信頼性の
高い画像認識を確保できる。
Next, an electronic component mounting method having the above configuration will be described. First, the electronic component 5 designated by the component supply unit 6 is moved to the component supply position and picked up by the nozzle 4 of the mounting head 3. Then, when the mounting head 3 comes to the position of the component recognition camera 8, as shown in FIG. 2, light irradiation is performed from the light irradiation means 13 toward the background member 12.
After that, as shown in FIG. 3, the light irradiation means 13 is turned off, or the light irradiation is interrupted by blocking the light with a shutter (not shown). Even if the light irradiation is interrupted, the background member 12 made of the phosphorescent material continues to emit light, and as shown in FIG. 3, the outer shape of the electronic component 5 is imaged by the component recognition camera 8 in the state where the background member 12 emits light. At this time, since the light irradiation from the light irradiation means 13 is blocked, the light does not go around to the lower surface side of the component recognition camera 8 or the electronic component 5, and highly reliable image recognition can be secured.

【0022】こうして、部品認識カメラ8により撮像さ
れた画像から装着ヘッド3に吸着された電子部品5の位
置を計測し、その計測データに基づいてXYテーブル9
上の基板10の位置を補正し、また回転方向については
装着ヘッド3のノズル4を回転部11により回転補正
し、装着ヘッド3にて基板10の所定の実装位置に電子
部品5を実装する。以上の動作を繰り返し、基板10に
対する電子部品5の一連の装着を行う。
In this way, the position of the electronic component 5 attracted to the mounting head 3 is measured from the image taken by the component recognition camera 8, and the XY table 9 is based on the measured data.
The position of the upper substrate 10 is corrected, and the nozzle 4 of the mounting head 3 is rotationally corrected by the rotating unit 11 with respect to the rotation direction, and the electronic component 5 is mounted on the predetermined mounting position of the substrate 10 by the mounting head 3. The above operation is repeated to perform a series of mounting of the electronic component 5 on the substrate 10.

【0023】また、図示しないが、背景部材12に光照
射する光照射手段13の位置は、部品認識カメラ8と同
じ位置にある必要はなく、部品認識カメラ8より前の位
置で照射してもよいことは言うまでもない。その場合、
部品認識カメラ8の視野以外に配置すれば、撮像の度に
光照射手段13の入り切りが必要でないため、光照射手
段13の入り切りによるその発光素子の寿命が短くなる
のを防止したり、若しくはシャッタなどを駆動する手段
が必要でないため、構造を簡単にできる。
Although not shown, the position of the light irradiating means 13 for irradiating the background member 12 with light does not have to be the same as the position of the component recognition camera 8, and even if the light is irradiated at a position in front of the component recognition camera 8. It goes without saying that it is good. In that case,
If it is arranged outside the field of view of the component recognition camera 8, it is not necessary to turn on / off the light irradiating means 13 each time an image is picked up. Therefore, it is possible to prevent the life of the light emitting element from being shortened due to turning on / off of the light irradiating means 13 or to use a shutter. The structure can be simplified because no means for driving the like is required.

【0024】また、電子部品5の外形が大きく単純であ
るときは背景部材12の発光の強さは強い方が、図4に
示すように電子部品5の輪郭がはっきりするが、電子部
品5の外形がより小さくなったり、形状が複雑になった
ときは背景部材12の発光が強ければ、図5に示すよう
に電子部品5の外形輪郭を崩し、正確な形状が撮像でき
ず、位置の計測は勿論、位置計測と同時に行われる部品
形状の確認においても信頼性が低下する。
When the external shape of the electronic component 5 is large and simple, the stronger the light emission of the background member 12 is, the clearer the outline of the electronic component 5 is as shown in FIG. If the background member 12 emits strong light when the outer shape becomes smaller or the shape becomes complicated, the outer contour of the electronic component 5 is disturbed as shown in FIG. 5, and the accurate shape cannot be imaged, and the position is measured. As a matter of course, the reliability is lowered also in the confirmation of the shape of the component which is performed at the same time as the position measurement.

【0025】そこで、電子部品5の外形が大きく単純で
あるときは、光照射手段13の照射時間を長くして蓄光
材料からなる背景部材12の発光を強くし、輪郭をはっ
きりさせ、電子部品5の外形がより小さくなったり、形
状が複雑になった時、光照射手段13のの照射時間を短
くして背景部材12の発光強度を小さくし、電子部品5
の複雑な形状も正確に撮像できるようにするのが好まし
い。このように、光照射手段13の照射時間を電子部品
5の形状毎に適した長さにすることにより、部品認識カ
メラ8にてより高い信頼性で計測ができる。
Therefore, when the outer shape of the electronic component 5 is large and simple, the irradiation time of the light irradiating means 13 is lengthened to increase the light emission of the background member 12 made of a phosphorescent material to make the contour clear and the electronic component 5 When the outer shape becomes smaller or the shape becomes complicated, the irradiation time of the light irradiation means 13 is shortened to reduce the light emission intensity of the background member 12, and the electronic component 5
It is preferable to be able to accurately image even the complicated shape of. In this way, by setting the irradiation time of the light irradiation means 13 to a length suitable for each shape of the electronic component 5, the component recognition camera 8 can perform measurement with higher reliability.

【0026】背景部材12を構成する蓄光材料として
は、半透明の合成樹脂に蛍光体粉末を一様に含有させた
ものが好適に適用できる。
As the phosphorescent material constituting the background member 12, a semitransparent synthetic resin uniformly containing phosphor powder can be suitably applied.

【0027】[0027]

【発明の効果】本発明の部品装着方法及び装置によれ
ば、以上の説明から明らかなように、部品認識カメラに
よる部品認識前に蓄光材料からなる背景部材に光を照射
し、部品認識時には背景部材自体の発光を背景として部
品認識を行うようにしているので、装着ヘッドを光源の
ない背景部材を設けた簡単で安価な構成にできるととも
に、認識時に外来光による外乱の恐れがなくて信頼性の
高い部品認識ができ、安価な構成で信頼性の高い部品装
着を実現できる。
According to the component mounting method and device of the present invention, as is apparent from the above description, the background member made of the phosphorescent material is irradiated with light before the component recognition by the component recognition camera, and the background is detected at the time of component recognition. Since the component recognition is performed against the background of the light emission of the member itself, the mounting head can have a simple and inexpensive structure with a background member without a light source, and at the time of recognition there is no risk of external light disturbance and reliability is high. It is possible to realize highly reliable component recognition, and to realize highly reliable component mounting with an inexpensive configuration.

【0028】また、背景部材への光の照射時間を部品の
種類に応じて可変するようにすると、背景照度を部品の
種類に応じて適正に可変して適正な部品認識を確保する
ことができる。
Further, if the irradiation time of the light to the background member is changed according to the type of the component, the background illuminance can be appropriately changed according to the type of the component, and proper component recognition can be secured. .

【0029】また、背景部材への光の照射を部品認識カ
メラに光が入射しない位置で行うようにすると、光照射
の電源の入り切りや複雑な遮蔽部材の設置が不要とな
り、さらに安価に構成することができる。
Further, if the background member is irradiated with light at a position where light does not enter the component recognition camera, it is not necessary to turn on / off the power supply for light irradiation or install a complicated shielding member, and thus the cost is reduced. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施形態の電子部品装着装置の概略
構成を示す斜視図である。
FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus according to an embodiment of the present invention.

【図2】同実施形態の部品認識部における光照射工程の
正面図である。
FIG. 2 is a front view of a light irradiation process in the component recognition unit of the same embodiment.

【図3】同実施形態の部品認識部における部品撮像工程
の正面図である。
FIG. 3 is a front view of a component imaging process in the component recognition unit of the same embodiment.

【図4】同実施形態における適正な撮像画像の説明図で
ある。
FIG. 4 is an explanatory diagram of a proper captured image in the same embodiment.

【図5】同実施形態における不適正な撮像画像の説明図
である。
FIG. 5 is an explanatory diagram of an improper captured image in the same embodiment.

【図6】従来例の電子部品装着装置における電子部品撮
像工程の正面図である。
FIG. 6 is a front view of an electronic component imaging process in a conventional electronic component mounting apparatus.

【図7】従来例の電子部品装着装置における他の電子部
品撮像工程の正面図である。
FIG. 7 is a front view of another electronic component imaging step in the conventional electronic component mounting apparatus.

【符号の説明】[Explanation of symbols]

3 装着ヘッド 5 電子部品 6 部品供給部 8 部品認識カメラ 10 基板 12 背景部材 13 光照射手段 3 mounting head 5 electronic components 6 parts supply department 8 Parts recognition camera 10 substrates 12 background material 13 Light irradiation means

フロントページの続き (72)発明者 牧野 洋一 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平2−58400(JP,A) 特開 平6−85500(JP,A) 特開 平8−5335(JP,A) 実開 平2−19436(JP,U) (58)調査した分野(Int.Cl.7,DB名) H05K 13/04 H05K 13/08 Front page continuation (72) Inventor Yoichi Makino 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-58400 (JP, A) JP-A-6-85500 (JP , A) JP-A-8-5335 (JP, A) Actual development 2-19436 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 13/04 H05K 13/08

Claims (8)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 供給部から供給された部品を装着ヘッド
により吸着するステップと、蓄光材料からなる背景部材
に対し光を照射するステップと、前記光の照射が前記背
景部材になされない状態で背景部材自体の発光を背景に
して部品認識カメラにて吸着された部品を撮像するステ
ップと、撮像した画像から前記部品の位置を計測し、
の計測データに基づいて部品の位置を相対的に補正して
基板に実装することを特徴とする部品装着方法。
1. A step of adsorbing a component supplied from a supply section by a mounting head, and a background member made of a phosphorescent material.
Irradiating light to the
Stearyl which the emission of the background member itself in a state that is not made to Jing member background images the component sucked by the component recognition camera
And-up, the position of the part from the captured image is measured, its
A component mounting method characterized in that the position of a component is relatively corrected based on the measurement data of 1. and mounted on a substrate.
【請求項2】 背景部材への光の照射時間を部品の種類
に応じて可変することを特徴とする請求項1記載の部
品装着方法。
2. A component mounting method according to claim 1, wherein the variable in accordance with the type of component the irradiation time of light to the background member.
【請求項3】 背景部材への光の照射を部品認識カメラ
に光が入射しない位置で行うことを特徴とする請求項1
記載の部品装着方法。
3. The background member is irradiated with light at a position where light does not enter the component recognition camera.
How to mount the described parts.
【請求項4】 所望の部品を供給する供給部と、供給部
から供給された部品を吸着して基板の所定位置に搬送し
て装着する装着ヘッドと、装着ヘッドにより吸着された
部品撮像して部品位置を計測する部品認識カメラと、
蓄光材料からなる部品撮像用の背景部材と、背景部材に
光を照射する光照射手段とからなり、前記光照射手段に
よる光の照射が前記背景部材になされない状態で背景部
材自体の発光を背景として部品の撮像を行うことを特徴
とする部品装着装置。
4. A supply unit for supplying a desired component, a mounting head for sucking the component supplied from the supply unit and transporting the component to a predetermined position on the substrate and mounting the component, and imaging the component sucked by the mounting head. Component recognition camera that measures the component position by
A background member for imaging parts made of phosphorescent material and a background member
The light irradiating means for irradiating light,
The background portion is not illuminated by the above-mentioned background member.
A component mounting device that images a component against the background of the light emission of the material itself .
【請求項5】 光照射手段による光照射時間を可変
る手段を設けたことを特徴とする請求項4記載の部品装
着装置。
5. A component mounting apparatus according to claim 4, wherein the light irradiation time by the light irradiating means is provided a variable and to <br/> Ru means.
【請求項6】 光照射手段をその照射光が部品認識カメ
ラに入射しない位置に配設したことを特徴とする請求項
4記載の部品装着装置。
6. The component mounting apparatus according to claim 4, wherein the light irradiating unit is arranged at a position where the irradiating light does not enter the component recognition camera.
【請求項7】 蓄光材料が蛍光材料から構成されること
を特徴とする請求項4記載の部品装着装置。
7. The component mounting apparatus according to claim 4, wherein the light storing material is composed of a fluorescent material.
【請求項8】 蛍光材料が半透明の合成樹脂に蛍光体粉
末を一様に含有させたものであることを特徴とする請求
項7記載の部品装着装置。
8. The component mounting apparatus according to claim 7, wherein the fluorescent material is a semitransparent synthetic resin in which phosphor powder is uniformly contained.
JP11976799A 1999-04-27 1999-04-27 Component mounting method and device Expired - Fee Related JP3378214B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11976799A JP3378214B2 (en) 1999-04-27 1999-04-27 Component mounting method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11976799A JP3378214B2 (en) 1999-04-27 1999-04-27 Component mounting method and device

Publications (2)

Publication Number Publication Date
JP2000312099A JP2000312099A (en) 2000-11-07
JP3378214B2 true JP3378214B2 (en) 2003-02-17

Family

ID=14769697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11976799A Expired - Fee Related JP3378214B2 (en) 1999-04-27 1999-04-27 Component mounting method and device

Country Status (1)

Country Link
JP (1) JP3378214B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5780712B2 (en) * 2009-05-29 2015-09-16 富士機械製造株式会社 Imaging system and electronic circuit component mounting machine

Also Published As

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