JP3377735B2 - Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method - Google Patents

Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method

Info

Publication number
JP3377735B2
JP3377735B2 JP28591297A JP28591297A JP3377735B2 JP 3377735 B2 JP3377735 B2 JP 3377735B2 JP 28591297 A JP28591297 A JP 28591297A JP 28591297 A JP28591297 A JP 28591297A JP 3377735 B2 JP3377735 B2 JP 3377735B2
Authority
JP
Japan
Prior art keywords
cutting
thin film
coating liquid
blade
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28591297A
Other languages
Japanese (ja)
Other versions
JPH1144946A (en
Inventor
稔 藤田
洋行 倉田
正浩 近藤
広秋 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26473550&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3377735(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to JP28591297A priority Critical patent/JP3377735B2/en
Priority to DE69739840T priority patent/DE69739840D1/en
Priority to TW086118957A priority patent/TW366438B/en
Priority to PCT/JP1997/004640 priority patent/WO1998027460A1/en
Priority to MYPI97006049A priority patent/MY132704A/en
Priority to EP97947962A priority patent/EP0945761B1/en
Priority to KR1019990704789A priority patent/KR20000057324A/en
Priority to US09/331,015 priority patent/US6335126B1/en
Priority to CA002274972A priority patent/CA2274972A1/en
Publication of JPH1144946A publication Critical patent/JPH1144946A/en
Publication of JP3377735B2 publication Critical patent/JP3377735B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明が属する技術分野】本発明は、集積回路の製造工
程におけるフォトリソグラフィ工程で用いられるマスク
やレチクル(以下「マスク」という)上に塵埃等が付着
するのを防止する目的で用いられ、マスクパターンを囲
う大きさのペリクル枠と、該枠の一側端面に張設される
透明な薄膜とよりなるマスク保護装置の製造方法におい
て、ペリクル枠の一側端面に薄膜を接着後、該枠のエッ
ジよりはみ出る薄膜を切断する方法と、該方法で用いる
切断治具に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for the purpose of preventing dust and the like from adhering to a mask or reticle (hereinafter referred to as "mask") used in a photolithography process in a manufacturing process of an integrated circuit. In a method of manufacturing a mask protection device comprising a pellicle frame having a size enclosing a pattern and a transparent thin film stretched on one end surface of the frame, after bonding the thin film to the one end surface of the pellicle frame, The present invention relates to a method of cutting a thin film protruding from an edge and a cutting jig used in the method.

【0002】[0002]

【従来技術】マスク保護装置は通常、スピンコート法、
溶液中に浸漬させて引き上げる引上げ法等によってガラ
ス基盤上に製膜したニトロセルロースやエチルセルロー
ス等の有機質の薄膜を図1に示すように、ペリクル枠1
よりサイズが大きな仮枠2に一旦取り、ついで接着剤を
塗布したペリクル枠1の一側端面に仮枠2を降下させる
ことによって押し当てゝ接着したのち、ペリクル枠1の
エッジよりはみ出る薄膜3を切断することによって得ら
れる。
2. Description of the Related Art A mask protection device is usually a spin coating method,
An organic thin film such as nitrocellulose or ethyl cellulose formed on a glass substrate by a pulling method such as immersing in a solution and pulling it up, as shown in FIG.
The thin film 3 protruding from the edge of the pellicle frame 1 is first attached to a temporary frame 2 having a larger size, and then the temporary frame 2 is pushed down to one end surface of the pellicle frame 1 to which an adhesive has been applied so that the thin film 3 protrudes from the edge of the pellicle frame 1. Obtained by cutting.

【0003】薄膜3の切断方法には、切断刃によって切
断する方法、レーザ光によって切断する方法、熱によっ
て切断する方法等があるが、多くは有機溶媒によって切
断する方法、すなわち図示するように、注射針状の治具
5の先端を薄膜3に突き刺し、枠外側のエッジに添わせ
て移動させながら治具先端より有機質の薄膜3を溶解す
る有機溶媒を放出することにより行う方法が用いられて
いるが(特公平7−57528号)、薄膜を溶解するこ
とができる有機溶剤に薄膜との相溶性のあるポリマーを
溶解して薄膜の溶解性を制御した溶液をディスペンサー
を用いて滴下することにより、不用膜を溶解切断する方
法や切断刃で切断したのち切断面を上記溶液で溶解して
切断面をなめらかにする方法も提案されている(特開平
7−281421号)。
The thin film 3 can be cut by a cutting blade, a laser beam, a heat, or the like, but most of them are cut by an organic solvent, that is, as shown in the figure. A method is used in which the tip of an injection needle-shaped jig 5 is pierced into the thin film 3 and the organic solvent that dissolves the organic thin film 3 is released from the jig tip while moving along the outer edge of the frame. (Japanese Patent Publication No. 7-57528), however, by dissolving a polymer compatible with the thin film in an organic solvent capable of dissolving the thin film, a solution in which the solubility of the thin film is controlled is dropped by using a dispenser. A method of dissolving and cutting an unnecessary film and a method of cutting the surface with a cutting blade and then dissolving the cut surface with the above solution to smooth the cut surface have been proposed (JP-A-7-281421). ).

【0004】[0004]

【発明が解決しようとする課題】上記の有機溶媒によっ
て切断する方法は、膜溶解時間を必要とするため膜切断
スピードを上げることができないし、薄膜が有機溶媒に
溶けないか、有機溶媒との溶解度が非常に低い場合、使
用することができない。この点例えば切断刃等の物理的
切断手段による切断は、溶媒による切断のように、膜溶
解時間を不要とするため膜切断スピードを上げ、作業能
率を向上させることができ、また有機溶媒に不溶な膜で
も切断することができるが、切断刃による切断も他の切
断方法と同様、切断端面に付着した切屑がマスクへの装
着時に脱落して発塵の原因となることがある。この問題
に対処するため切断端面を溶媒で拭き取って仕上げた
り、両面粘着テープを用いて切屑を除去することも試み
られているが、切断後に切断端面の仕上工程や切屑の除
去工程が必要で、切屑を完全に除去するのも困難であっ
た。
The above-mentioned method of cutting with an organic solvent requires a film-dissolving time, so that the film-cutting speed cannot be increased, and the thin film is not soluble in the organic solvent or is not compatible with the organic solvent. If the solubility is very low, it cannot be used. In this respect, for example, cutting with a physical cutting means such as a cutting blade does not require a film dissolving time like cutting with a solvent, so that the film cutting speed can be increased, work efficiency can be improved, and insoluble in an organic solvent. However, like other cutting methods, the chips attached to the cutting end surface may fall off when attached to the mask, which may cause dust generation. In order to deal with this problem, the cutting end face is wiped with a solvent for finishing, and it has been attempted to remove chips using a double-sided adhesive tape, but after cutting, a finishing process of the cutting end face and a chip removing process are required, It was also difficult to completely remove the chips.

【0005】本発明は、発塵の原因となる切屑を生ずる
ことがない薄膜の切断方法と、該方法で用いる切断治具
を提供することを目的とする。
An object of the present invention is to provide a method for cutting a thin film that does not generate chips that cause dust generation, and a cutting jig used in the method.

【0006】[0006]

【課題の解決手段】本発明はそのため、ペリクル枠の一
側端面に薄膜を接着後、該枠外側のエッジよりはみ出る
薄膜を物理的切断手段によって切断する薄膜の切断方法
において、物理的切断手段により切断するのに先行して
物理的切断手段に添設若しくは内臓した塗布器よりコー
ト液を切断箇所に直接放出して塗布することを特徴とす
る。
SUMMARY OF THE INVENTION Therefore, according to the present invention, in a thin film cutting method of bonding a thin film to one end face of a pellicle frame and then cutting the thin film protruding from the outer edge of the frame by a physical cutting device, the physical cutting device is used. It is characterized in that the coating liquid is directly discharged to the cutting portion from an applicator attached to or incorporated in the physical cutting means prior to the cutting so as to apply the coating liquid.

【0007】上記発明で用いるコート液は、薄膜の切断
端面を完全に被い、物理的切断手段による切断時の発塵
を押さえると共に、薄膜から剥離しないものである必要
がある。こうしたものとしては樹脂を有機溶媒に溶解さ
せたものが例示される。ここで樹脂としては例えば、セ
ルロース誘導体、シリコン系樹脂、エポキシ系樹脂、ア
クリル系樹脂、フッ素含有樹脂等を例示することがで
き、セルロース誘導体としては、ニトロセルロース、プ
ロピオン酸セルロース等を例示することができる。フッ
素含有樹脂としては具体的には、旭硝子株式会社製のC
YTOP(商品名)、テフロンAF(商品名)を例示す
ることができる。いづれにしてもコート材(樹脂)は薄
膜の膜材と同じか、或いは類似のものを用いるのがよ
い。
The coating liquid used in the above invention must completely cover the cut end face of the thin film, suppress dust generation during cutting by the physical cutting means, and do not separate from the thin film. An example of such a material is a resin dissolved in an organic solvent. Examples of the resin include cellulose derivatives, silicone resins, epoxy resins, acrylic resins, fluorine-containing resins, and the like, and examples of the cellulose derivatives include nitrocellulose and cellulose propionate. it can. Specific examples of the fluorine-containing resin include C manufactured by Asahi Glass Co., Ltd.
Examples are YTOP (trade name) and Teflon AF (trade name). In any case, the coating material (resin) is preferably the same as or similar to the thin film material.

【0008】有機溶媒としては、例えばフルオロカーボ
ンである旭硝子株式会社製のCT−100(商品名)、
CT−130(商品名)、CT−160(商品名)、C
T−180(商品名)、トーケムプロダクツ社製のEF
−L102(商品名)、EF−L155(商品名)、E
F−L174(商品名)、EF−L215(商品名)、
トクヤマ株式会社製のIL−260(商品名)、IL−
263(商品名)等を例示することができる。
Examples of the organic solvent include fluorocarbon CT-100 (trade name) manufactured by Asahi Glass Co., Ltd.,
CT-130 (trade name), CT-160 (trade name), C
T-180 (trade name), EF manufactured by Tochem Products
-L102 (product name), EF-L155 (product name), E
F-L174 (trade name), EF-L215 (trade name),
IL-260 (trade name) manufactured by Tokuyama Corporation, IL-
263 (trade name) and the like can be illustrated.

【0009】有機溶媒としてはまた、メチルエチルケト
ン、メチルイソブチルケトン、アセトン等のケトン系溶
媒、酢酸ブチル、酢酸イソブチル等の低級脂肪酸エステ
ルを例示することができ、またケトン又はエステルとイ
ソプロピルアコールの混合溶媒を使用することもでき
る。有機溶媒に対するコート材の使用割合は、有機溶媒
100重量部に対してコート材は通常1重量部以上であ
る。
Examples of the organic solvent include ketone type solvents such as methyl ethyl ketone, methyl isobutyl ketone and acetone, and lower fatty acid esters such as butyl acetate and isobutyl acetate, and a mixed solvent of ketone or ester and isopropyl alkole. It can also be used. The use ratio of the coating material to the organic solvent is usually 1 part by weight or more based on 100 parts by weight of the organic solvent.

【0010】本発明で使用される好ましいコート液とし
ては、上記有機溶媒に上記樹脂を飽和して溶解させた飽
和溶液が用いられる。この飽和溶液の調製法としては、
例えば上記樹脂を通常、20〜25℃で上記溶媒に通常
12時間以上浸漬して行われる。浸漬時間は長い方がよ
いが、経済的な理由から樹脂にもよるが、5〜6時間で
あれば、ほぼ飽和溶液とみなしてもよい。こうしたコー
ト液を用いた場合、薄膜の切断は、切断刃等の物理的切
断手段によってのみ切断され、溶媒による薄膜の切断は
行われず、薄膜切断のスピードを上げてもコート液に溶
解される樹脂による被覆が確実にでき、仕上がりもきれ
いで発塵することもない。
The preferred coating liquid used in the present invention is a saturated solution in which the above resin is saturated and dissolved in the above organic solvent. As a method for preparing this saturated solution,
For example, the resin is usually immersed in the solvent at 20 to 25 ° C. for 12 hours or more. The longer the immersion time, the better, but for economic reasons it depends on the resin, but if it is 5 to 6 hours, it may be regarded as a substantially saturated solution. When such a coating liquid is used, the thin film is cut only by a physical cutting means such as a cutting blade, the thin film is not cut by a solvent, and the resin is dissolved in the coating liquid even if the thin film cutting speed is increased. Can be surely covered, and the finish is clean and no dust is generated.

【0011】上記発明で用いる塗布器としては、切断に
先行してコート液を塗布できるようなものであればよ
く、どのようなものであってもよいが、好ましくはパイ
プ状でコート液供給装置から供給されたコート液がパイ
プ端から放出するようにされる。パイプ状とすることに
より構成が簡単で嵩張らず、切断刃への添設が容易とな
る。しかも上記塗布器は、物理滴切断手段に添設し、物
理的切断手段と一体をなして動作するようにされるか、
切断刃等の物理的手段が塗布器と一体形成される。塗布
器を物理的切断手段に添設することにより塗布器を移動
させるための装置、例えばロボットを不要にし、物理的
切断手段を移動させる一つの装置で済むようになり、ま
た切断刃等の物理的手段を塗布器に一体形成することに
より構成が更に簡単なものとなる。
The applicator used in the above invention may be any applicator capable of applying the coating liquid prior to cutting, and may be any device, but preferably a pipe-shaped coating liquid supply device. The coating liquid supplied from is discharged from the end of the pipe. The pipe-like structure has a simple structure and is not bulky, and can be easily attached to the cutting blade. Moreover, the applicator is attached to the physical droplet cutting means, and is operated integrally with the physical cutting means,
Physical means such as a cutting blade are integrally formed with the applicator. By adding the applicator to the physical cutting means, a device for moving the applicator, for example, a robot is not required , and only one device for moving the physical cutting means is sufficient. The structure is further simplified by integrally forming the objective means with the applicator.

【0012】いづれにしても上述する塗布器は、切断刃
等の物理的切断手段による切断に先行して切断個所にコ
ート液を塗布する。これにより切断の後から行うよりも
発塵を抑制し、切断速度も上げられるなどの利点があ
る。本発明で用いる物理的切断刃手段としては、例えば
切断刃が好ましい例として挙げられるが、これ以外に図
5に示すようにパイプの先端部を絞って刃を備えた針状
部を形成し、刃の真上と、その左右に3ヵ所、コート液
の放出口を形成した切断治具、図に示すようにパイプ
の先端部を針状に形成し、その真上の前後左右に4ヵ
所、コート液の放出口を形成した切断治具を用いること
ができる。図5に示す切断刃は、枠のエッジに沿って薄
膜を切断する際、枠のコーナに達する都度、刃先を90
°方向転換する必要があるのに対し、図に示すように
切断刃を針状とし、コート液の放出口を前後左右に4ヵ
所設けた場合、枠のコーナに達しても方向転換する必要
がなく、切断治具を回転させる必要がない。
In any case, the above-mentioned applicator applies the coating liquid to the cutting point prior to the cutting by the physical cutting means such as a cutting blade. This has the advantages of suppressing dust generation and increasing the cutting speed as compared to after cutting. As the physical cutting blade means used in the present invention, for example, a cutting blade can be mentioned as a preferable example, but in addition to this, as shown in FIG. 5, the tip portion of the pipe is squeezed to form a needle-shaped portion having a blade, Directly above the blade, three places to the left and right of it, a cutting jig with a coating liquid discharge port, and the tip of the pipe is formed into a needle shape as shown in Fig. 7, and there are four places just above and behind it. It is possible to use a cutting jig having a coating liquid discharge port formed therein. The cutting blade shown in FIG. 5 cuts the thin film along the edge of the frame by cutting the cutting edge 90 times each time it reaches the corner of the frame.
° Whereas it is necessary to change the direction, when the cutting blade is needle-shaped and the coating solution discharge ports are provided at four positions in the front, rear, left and right as shown in Fig. 7 , it is necessary to change the direction even when the corner of the frame is reached. There is no need to rotate the cutting jig.

【0013】切断刃や刃を備えた針状部などの切断治具
のように、刃のある物理的切断手段を使用する場合、良
好な切断が可能で、切断速度を上げても切断できる利点
がある。切断刃を使用する場合、該切断刃としては、枠
のエッジに沿って薄膜を切断できるようなものであれば
よく、その種類を問わないが、切れ味のよい薄刃のもの
が望ましい。こうしたものとしては、例えばオルファ社
の片刃(商品名「マットカッター」)、オルファ社の両
刃(商品名「デザインナイフ」、「円形刃」)、フェザ
ー社の両刃(商品名「サージカルブラディーズ」)等を
例示することができる。
When a physical cutting means having a blade is used like a cutting jig such as a cutting blade or a needle-shaped part having a blade, good cutting is possible, and it is possible to cut even if the cutting speed is increased. There is. When a cutting blade is used, the cutting blade may be of any type as long as it can cut a thin film along the edge of the frame, and regardless of its type, a thin blade with good sharpness is preferable. These include, for example, Olfa's single-edged (brand name "Matt Cutter"), Orfa's double-edged (brand name "Design Knife", "Circular Blade"), Feather's double-edged (brand name "Surgical Bloodies") Etc. can be illustrated.

【0014】[0014]

【発明の実施の形態】図3及び図4において、切断刃1
1には図示省略したコート液の供給装置に接続される小
径のパイプ12が添設され、その下端のコート液放出口
12aは、切断刃11でペリクル枠13のエッジよりは
み出る薄膜14を切断するときに薄膜上部に位置し、切
断刃による切断に先行して放出口12aからコート液を
一定量づゝ放出し、枠際にエッジに沿ってコート液16
を塗布しながら切断刃11を矢印方向に一定速度で移動
させて切断するようになっている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 3 and 4, a cutting blade 1
1, a small-diameter pipe 12 connected to a coating liquid supply device (not shown) is attached, and the coating liquid discharge port 12a at the lower end cuts the thin film 14 protruding from the edge of the pellicle frame 13 by the cutting blade 11. Sometimes the coating liquid is located on the upper portion of the thin film, and the coating liquid is discharged from the discharge port 12a in a constant amount prior to the cutting by the cutting blade, and the coating liquid 16 is applied along the edge of the frame.
While applying, the cutting blade 11 is moved in the direction of the arrow at a constant speed for cutting.

【0015】図5及び図6に示す切断治具21は、パイ
プ22の先端部を図示するように二段、或いは複数段な
いし彎曲状に絞って刃を備えた針状部23を形成したも
ので、ペリクル枠13よりはみ出る薄膜14を切断する
ときには、図6に示すように切断治具21を一定量降下
させて刃23を薄膜14に突き刺し、水平方向に枠13
のエッジに沿い、手前に向かって一定速度で移動させる
ことによって切断を行うが、このときペリクル枠上端面
と同一レベル上にあって、刃先端より手前側に位置する
放出口24より刃23によって切断される直前の切断箇
所にコート液16が放出されるようにしてある。
The cutting jig 21 shown in FIGS. 5 and 6 is formed by forming the needle-like portion 23 having a blade by squeezing the tip of the pipe 22 into two steps, or a plurality of steps or a curved shape as shown in the drawing. Then, when cutting the thin film 14 protruding from the pellicle frame 13, the cutting jig 21 is lowered by a certain amount to pierce the thin film 14 with the blade 23 as shown in FIG.
Cutting is performed by moving it toward the front at a constant speed along the edge of, but at this time, it is on the same level as the upper surface of the pellicle frame and is cut by the blade 23 from the discharge port 24 located on the front side of the blade tip. The coating liquid 16 is discharged to the cutting position immediately before the cutting.

【0016】図及び図に示す切断治具31は、パイ
プ32の先端を針33としたもので、ペリクル枠13の
エッジよりはみ出る薄膜14を切断するときには、図
に示すように、切断治具31を一定量降下させて針33
を薄膜14に突き刺し、水平方向に枠13のエッジに沿
い一定速度で移動させることによって切断を行うが、こ
のときペリクル枠上端面と同一レベルにある前後左右の
4か所の放出口34よりそれぞれコート液16が一定量
づゝ放出されるようにしてある。
The cutting jig 31 shown in FIGS. 7 and 8, the front end of the pipe 32 obtained by a needle 33, when cutting the film 14 which protrude from the edges of the pellicle frame 13, FIG. 8
As shown in FIG.
The thin film 14 is pierced into the thin film 14 and is horizontally moved along the edge of the frame 13 at a constant speed to perform cutting. At this time, the four front, rear, left and right discharge ports 34 at the same level as the upper end surface of the pellicle frame respectively The coating liquid 16 is designed to be discharged in a fixed amount.

【0017】上述する切断治具はいづれもロボットのハ
ンドに把持されて薄膜の切断を行うが、ペリクル枠は一
般に矩形状をなしていることから、図5及びに示す
切断治具では、刃先がペリクル枠のコーナに達したとき
切断治具を90°旋回して向きを変えねばならず、した
がってこうした切断治具を用いるロボットは、ロボット
ハンドを旋回させる機構を必要とする。これに対し図
及び図に示すように、刃先が針状をなし、かつ放出口
34を前後左右に4か所形成した切断治具は、ペリクル
枠のコーナに対しても向きを変える必要がないため、ロ
ボットハンドを旋回させる機構を必要とせず、構造が簡
単で、制御の容易なロボットを使用することができる。
[0017] While being gripped by the hand of even robot Izure cutting jig to above to cut the film, since the pellicle frame being generally rectangular shape, a cutting tool shown in FIGS. 5 and 6, When the cutting edge reaches the corner of the pellicle frame, the cutting jig must be turned by 90 ° to change its direction, and therefore a robot using such a cutting jig needs a mechanism for turning the robot hand. On the other hand, Fig. 7
Further, as shown in FIG. 8 , the cutting jig in which the cutting edge has a needle-like shape and the discharge ports 34 are formed at four positions in the front, rear, left, and right does not need to change its direction with respect to the corners of the pellicle frame. It is possible to use a robot that does not require a mechanism for turning the hand, has a simple structure, and is easy to control.

【0018】[0018]

【実施例】実施例1 塵埃のない環境下のクリーンルーム内で、図3及び図4
に示すように、アルミ製のペリクル枠13に仮枠15に
取ったセルロース製の薄膜14を接着したのち、ペリク
ル枠13のエッジよりはみ出る部分を切断刃11で切断
刃11に添設の金属又は樹脂製のパイプ12よりコート
液を放出しながら切断した。
EXAMPLES Example 1 FIG. 3 and FIG. 4 in a clean room under a dust-free environment.
As shown in FIG. 3, after the cellulose thin film 14 taken on the temporary frame 15 is adhered to the aluminum pellicle frame 13, the portion protruding from the edge of the pellicle frame 13 is cut by the cutting blade 11 with metal attached to the cutting blade 11 or The pipe 12 made of resin was cut while discharging the coating liquid.

【0019】ここで切断刃としては、オルファ社のデザ
インナイフ(商品名)を用い、コート液として旭硝子株
式会社製のフッ素含有樹脂(商品名「サイトップ」)
4.0gをフルオロカーボン系の有機溶媒(旭硝子株式
会社製の商品名「CT−Solv.13C」)46.0gに23
℃で5時間浸漬して得た飽和溶液を用いた。この場合の
該樹脂の含有量は約8wt%であった。そして前者の切断
刃を先端回転機構を持つ直交座標系ロボットのハンドに
取付けたのち、6mm/secの速度でペリクル枠のエッジ
に沿って図4の矢印方向に移動させ、刃による切断に先
行してパイプ12の放出口24よりコート液を放出量4
0μl/minで放出して切断か所を塗布しながら切断を行
ったところ、切断が支障なく良好に行え、コート液の塗
布幅及びペリクル枠外側面の垂れ共1mm以内で枠際コー
トが可能となった。以上の切断作業を三回繰返して行
い、それぞれについて薄膜切断中、切断部周辺の発塵量
をパーティクルカウンターにて測定した。結果を表1に
示す。
Here, a design knife (trade name) manufactured by Olfa Co. is used as a cutting blade, and a fluorine-containing resin (trade name "CYTOP") manufactured by Asahi Glass Co., Ltd. is used as a coating liquid.
4.0 g of fluorocarbon-based organic solvent (trade name "CT-Solv.13C" manufactured by Asahi Glass Co., Ltd.) is added to 46.0 g of 23 g.
A saturated solution obtained by immersing at 5 ° C. for 5 hours was used. The content of the resin in this case was about 8 wt%. Then, after attaching the former cutting blade to the hand of the Cartesian coordinate system robot having a tip rotation mechanism, it is moved at a speed of 6 mm / sec along the edge of the pellicle frame in the direction of the arrow in FIG. 4 to precede the cutting by the blade. The amount of coating liquid discharged from the discharge port 24 of the pipe 12 is 4
When released while releasing at 0 μl / min and cutting while applying the cutting spot, the cutting can be performed smoothly without any problem, and coating at the frame edge is possible within 1 mm of both the coating width of the coating liquid and the dripping of the outer surface of the pellicle frame. It was The above cutting operation was repeated three times, and the amount of dust generated around the cut portion was measured with a particle counter during thin film cutting. The results are shown in Table 1.

【0020】比較例1 コート液の放出を切断刃による切断に続いて行い、切断
直後の切断端面をコート液で塗布する以外は実施例1と
同じ条件で切断を行ったところ、切断は実施例1と同
様、良好に行えた。薄膜切断中、実施例1と同様にして
切断部周辺の発塵量を測定した。結果を以下の表1に示
す。
Comparative Example 1 The cutting was carried out under the same conditions as in Example 1 except that the coating liquid was discharged following the cutting by the cutting blade, and the cut end face immediately after cutting was coated with the coating liquid. Similar to No. 1, it was performed satisfactorily. During the thin film cutting, the amount of dust around the cut portion was measured in the same manner as in Example 1. The results are shown in Table 1 below.

【0021】[0021]

【表1】 表1に示されるようにコート液の塗布を切断面に行う実
施例1の方が、切断後に行う比較例1に比べ発塵量が激
減し、1μm以上の大きな異物発生が皆無となった。
[Table 1] As shown in Table 1, in Example 1 in which the coating liquid was applied to the cut surface, the amount of dust generated was drastically reduced as compared with Comparative Example 1 in which the cut surface was cut, and generation of large foreign matter of 1 μm or more was completely absent.

【0022】実施例2 実施例1において、切断刃による切断速度を10mm/se
cとしても薄膜の切断が良好に行えることに変わりがな
かった。またコート液として3%樹脂溶液を使用しても
良好な切断が行えることに変わりがなかったが、コート
液の塗布幅及びペリクル枠外側面の垂れとも1mmで枠際
コートが可能となった。
Example 2 In Example 1, the cutting speed by the cutting blade was 10 mm / se.
Even if c was used, the thin film could be cut satisfactorily. Even if a 3% resin solution was used as the coating liquid, good cutting could still be achieved, but the coating width of the coating liquid and the sagging of the outer surface of the pellicle frame were 1 mm, which enabled coating at the frame edge.

【0023】比較例2 内径が0.7mmのパイプよりなる図5及び図6に示す切
断治具21を用い、かつコート液として3%樹脂溶液を
使用して切断速度を2mm/sec、6mm/sec、10mm/se
cと変え、切断を行ったところ、2mm/secの切断速度で
は薄膜を切断できたが、6mm/sec以上の切断速度では
切断が行えなかった。以上の結果を以下の表2に示す。
Comparative Example 2 Using a cutting jig 21 shown in FIGS. 5 and 6 consisting of a pipe having an inner diameter of 0.7 mm, and using a 3% resin solution as a coating liquid, the cutting speed was 2 mm / sec, 6 mm / sec, 10 mm / se
When cutting was performed in place of c, the thin film could be cut at a cutting speed of 2 mm / sec, but could not be cut at a cutting speed of 6 mm / sec or more. The above results are shown in Table 2 below.

【0024】[0024]

【表2】 表2に示されるように、薄膜の切断には刃のある切断治
具を用いるのが好ましく、刃のある切断治具ではコート
液として飽和樹脂溶液を使用し、切断速度を上げても切
断が可能であった。
[Table 2] As shown in Table 2, it is preferable to use a cutting jig having a blade for cutting the thin film. In the cutting jig having a blade, a saturated resin solution is used as a coating liquid, and the cutting can be performed even if the cutting speed is increased. It was possible.

【0025】[0025]

【発明の効果】請求項1記載の切断方法によると、薄膜
を物理的切断手段によって切断するため、どのような膜
材の薄膜でも切断できると共に、有機溶媒による切断に
比べ、膜溶解時間が不要であるため、膜切断スピードを
上げることができ、また切断個所が切断に先立ってコー
ト液でコートされるため、切断端面からの発塵を抑制で
き、切断速度を上げることができる。
According to the cutting method of the first aspect, since the thin film is cut by the physical cutting means, it is possible to cut a thin film of any film material, and the film dissolution time is not required as compared with the cutting by the organic solvent. Therefore, the film cutting speed can be increased, and since the cut portion is coated with the coating liquid prior to the cutting, dust generation from the cut end face can be suppressed and the cutting speed can be increased.

【0026】請求項2記載の切断方法によると、樹脂が
薄膜に融合してコートが確実に行われるようになり、請
求項3記載の切断方法のように、コート液として樹脂の
飽和溶液を用いると、溶媒による薄膜の切断は行われ
ず、切断端面への樹脂の被覆が確実に行われ、仕上がり
がきれいで発塵を防止することができる。また請求項4
記載の切断方法のように、樹脂に膜材と同じか類似のも
のを用いると、樹脂が薄膜により確実に融合してコート
が行えるようになる。請求項5及び8記載の切断方法及
び切断治具によると、コート液が飽和樹脂溶液であって
も切断速度を上げて切断することができる。
According to the cutting method of the second aspect, the resin is fused to the thin film so that the coating is surely performed. As in the cutting method of the third aspect, a saturated solution of the resin is used as the coating liquid. With this, the thin film is not cut by the solvent, the cut end surface is reliably covered with the resin, and the finish is clean and dust can be prevented. Claim 4
When the resin used is the same as or similar to the film material as in the cutting method described above, the resin is more surely fused into the thin film to enable the coating. According to the cutting method and the cutting jig described in claims 5 and 8, even if the coating liquid is a saturated resin solution, it is possible to cut at a high cutting speed.

【0027】請求項6記載の切断治具によると、切断治
具を移動させるための装置と塗布器を移動させるための
装置を個別に設ける必要がなくなる。請求項7記載の切
断治具のように、塗布器がパイプ状であると、構成が簡
単で嵩張らず、切断治具へ添設又は内蔵することが容易
となる。
According to the cutting jig of the sixth aspect, it is not necessary to separately provide a device for moving the cutting jig and a device for moving the applicator. When the applicator is in the shape of a pipe as in the cutting jig described in claim 7, the structure is simple and not bulky, and the applicator can be easily attached to or incorporated in the cutting jig.

【図面の簡単な説明】[Brief description of drawings]

【図1】仮枠に取った薄膜をペリクル枠に張設後、切断
するときの状態を示す概略断面図。
FIG. 1 is a schematic cross-sectional view showing a state when a thin film taken on a temporary frame is stretched on a pellicle frame and then cut.

【図2】従来例の要部拡大断面図。FIG. 2 is an enlarged sectional view of a main part of a conventional example.

【図3】本発明による切断方法を示す断面図。FIG. 3 is a sectional view showing a cutting method according to the present invention.

【図4】同拡大側面図。FIG. 4 is an enlarged side view of the same.

【図5】切断治具の斜視図。FIG. 5 is a perspective view of a cutting jig.

【図6】図5に示す切断治具を用いた切断時における状
態を示す要部拡大断面図。
6 is an enlarged sectional view of an essential part showing a state at the time of cutting using the cutting jig shown in FIG.

【図7】切断治具の更に別の例の斜視図。 FIG. 7 is a perspective view of still another example of the cutting jig.

【図8】図7に示す切断治具を用いた切断時における状
態を示す要部拡大断面図。
FIG. 8 is a view showing a state at the time of cutting using the cutting jig shown in FIG .
FIG.

【符号の説明】 1、13・・ペリクル枠 2、15・・仮枠 3、14・・薄膜 5・・治具 11・・切断刃 12・・パイプ 12a・・放出口 16・・コート液 21・・切断治具 22、32・・パイプ 23・・針状部 24、34・・放出口 33・・針[Explanation of symbols] 1, 13, ... Pellicle frame 2, 15 ... Temporary frame 3, 14 ... Thin film 5 ... Jig 11 ... Cutting blade 12 ... Pipe 12a ... 16 ... Coating liquid 21 ... Cutting jig 22, 32 ... Pipe 23 ... Needle-like parts 24, 34 ... 33 ... Needle

フロントページの続き (72)発明者 中川 広秋 山口県玖珂郡和木町和木六丁目1番2号 三井化学株式会社内 (56)参考文献 特開 平8−292553(JP,A) 特開 平8−95234(JP,A) 特開 平2−145292(JP,A) 特開 平7−281421(JP,A) (58)調査した分野(Int.Cl.7,DB名) G03F 1/14 H01L 21/027 Front page continued (72) Inventor Hiroaki Nakagawa 6-1-2, Waki, Waki-cho, Kuga-gun, Yamaguchi Mitsui Chemicals, Inc. (56) Reference JP-A-8-292553 (JP, A) JP-A-8 -95234 (JP, A) JP-A-2-145292 (JP, A) JP-A-7-281421 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) G03F 1/14 H01L 21/027

Claims (9)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】ペリクル枠の一側端面に薄膜を接着後、該
枠外側のエッジよりはみ出る薄膜を物理的切断手段によ
って切断する薄膜の切断方法において、物理的切断手段
により切断するのに先行して物理的切断手段に添設若し
くは内蔵した塗布器よりコート液を切断箇所に放出して
塗布することを特徴とするマスク保護装置の製造方法に
おける薄膜の切断方法。
1. A method of cutting a thin film in which a thin film protruding from an edge outside the frame is cut by a physical cutting means after a thin film is adhered to one end face of a pellicle frame, and the thin film is cut by the physical cutting means. A method for cutting a thin film in a method for manufacturing a mask protection device, characterized in that a coating liquid is discharged to a cutting position from an applicator attached to or built in a physical cutting means to apply the coating liquid.
【請求項2】コート液として樹脂を有機溶媒に溶解させ
た溶液が使用される請求項1記載のマスク保護装置の製
造方法における薄膜の切断方法。
2. The method of cutting a thin film in the method of manufacturing a mask protection device according to claim 1, wherein a solution in which a resin is dissolved in an organic solvent is used as the coating liquid.
【請求項3】コート液として樹脂を有機溶媒に飽和溶解
させた飽和溶液が使用される請求項1記載のマスク保護
装置の製造方法における薄膜の切断方法。
3. A method of cutting a thin film in a method of manufacturing a mask protection device according to claim 1, wherein a saturated solution in which a resin is saturated and dissolved in an organic solvent is used as the coating liquid.
【請求項4】樹脂には薄膜の膜材と同じか或いは類似の
ものが用いられる請求項2又は3記載のマスク保護装置
の製造方法における薄膜の切断方法。
4. The method of cutting a thin film in a method of manufacturing a mask protection device according to claim 2, wherein the resin is the same as or similar to the material of the thin film.
【請求項5】物理的切断手段は刃よりなる請求項1ない
し4のいづれかの請求項に記載のマスク保護装置の製造
方法における薄膜の切断方法。
5. The method of cutting a thin film in a method of manufacturing a mask protection device according to claim 1, wherein the physical cutting means is a blade.
【請求項6】コート液の塗布器を添設若しくは内臓した
ことを特徴とする請求項1記載の切断方法で物理的手段
として用いられる切断治具。
6. A cutting jig used as a physical means in the cutting method according to claim 1, wherein a coating liquid applicator is additionally provided or incorporated.
【請求項7】塗布器はパイプ状をなす請求項6記載の切
断治具。
7. The cutting jig according to claim 6, wherein the applicator has a pipe shape.
【請求項8】パイプ状の塗布器に形成される請求項7記
載の切断治具。
8. The cutting jig according to claim 7, which is formed in a pipe-shaped applicator.
【請求項9】切断治具は刃よりなる請求項6又は7に記
載の切断治具。
9. The cutting jig according to claim 6, wherein the cutting jig is a blade.
JP28591297A 1996-12-16 1997-10-17 Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method Expired - Lifetime JP3377735B2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP28591297A JP3377735B2 (en) 1997-05-30 1997-10-17 Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method
KR1019990704789A KR20000057324A (en) 1996-12-16 1997-12-16 Method of manufacturing pellicle and pellicle manufacturing jig
TW086118957A TW366438B (en) 1996-12-16 1997-12-16 Process for manufacturing pellicle and jig for manufacturing pellicle
PCT/JP1997/004640 WO1998027460A1 (en) 1996-12-16 1997-12-16 Method of manufacturing pellicle and pellicle manufacturing jig
MYPI97006049A MY132704A (en) 1996-12-16 1997-12-16 A method of manufacturing a pellicle and a jig for manufacturing a pellicle
EP97947962A EP0945761B1 (en) 1996-12-16 1997-12-16 Method of manufacturing a pellicle and pellicle manufacturing trimming jig
DE69739840T DE69739840D1 (en) 1996-12-16 1997-12-16 METHOD FOR PRODUCING A MEMBRANE COVER AND A DEVICE FOR CYCLING THE MEMBRANES USED IN THIS PROCESS
US09/331,015 US6335126B1 (en) 1996-12-16 1997-12-16 Method of manufacturing a pellicle
CA002274972A CA2274972A1 (en) 1996-12-16 1997-12-16 Method of manufacturing pellicle and pellicle manufacturing jig

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-141282 1997-05-30
JP14128297 1997-05-30
JP28591297A JP3377735B2 (en) 1997-05-30 1997-10-17 Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method

Publications (2)

Publication Number Publication Date
JPH1144946A JPH1144946A (en) 1999-02-16
JP3377735B2 true JP3377735B2 (en) 2003-02-17

Family

ID=26473550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28591297A Expired - Lifetime JP3377735B2 (en) 1996-12-16 1997-10-17 Method of cutting thin film in method of manufacturing mask protection device, and cutting jig used in the method

Country Status (1)

Country Link
JP (1) JP3377735B2 (en)

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