JP3375478B2 - Optical information medium and method for manufacturing optical information medium - Google Patents

Optical information medium and method for manufacturing optical information medium

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Publication number
JP3375478B2
JP3375478B2 JP02709896A JP2709896A JP3375478B2 JP 3375478 B2 JP3375478 B2 JP 3375478B2 JP 02709896 A JP02709896 A JP 02709896A JP 2709896 A JP2709896 A JP 2709896A JP 3375478 B2 JP3375478 B2 JP 3375478B2
Authority
JP
Japan
Prior art keywords
substrate
curable resin
radiation
resin
optical information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP02709896A
Other languages
Japanese (ja)
Other versions
JPH08321074A (en
Inventor
道芳 永島
寿樹 宮本
清 井上
栄 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP02709896A priority Critical patent/JP3375478B2/en
Publication of JPH08321074A publication Critical patent/JPH08321074A/en
Application granted granted Critical
Publication of JP3375478B2 publication Critical patent/JP3375478B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1445Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface heating both sides of the joint
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1464Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
    • B29C65/1467Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/32Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322Providing cavities in the joined article to collect the burr
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、2枚の光情報基板
を貼合わせた光情報媒体、その製造方法、および製造装
置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical information medium having two optical information substrates attached to each other, a manufacturing method thereof, and a manufacturing apparatus.

【0002】[0002]

【従来の技術】光ディスクの高密度化には再生レーザー
の波長を短くし、かつ、対物レンズの開口数(NA)を
高くする必要がある。しかし、高NA対物レンズでは許
容できるディスク傾き(チルト)が非常に小さい。例え
ば、CDと同じ1.2mmの厚さの基板を用いれば、N
A0.6の対物レンズに許容できるチルトは約0.25
度であり、これは、光ヘッドをプレーヤに取り付ける誤
差に匹敵し、光ディスクの形状変化によるチルトは許容
できなくなり実用性がない。
2. Description of the Related Art In order to increase the density of optical discs, it is necessary to shorten the wavelength of the reproducing laser and increase the numerical aperture (NA) of the objective lens. However, with a high NA objective lens, the allowable disc tilt is very small. For example, if the same 1.2 mm thick substrate as the CD is used, N
The tilt that can be allowed for an A0.6 objective lens is about 0.25.
This is equivalent to an error in mounting the optical head on the player, and tilt due to the change in shape of the optical disc becomes unacceptable, which is not practical.

【0003】基板の厚みを薄くする事で、ディスクのチ
ルトに対する許容範囲が拡がり、高NA対物レンズを用
いた実用的な光ディスクの高密度化が達成できる。例え
ば、基板の厚さをCDの半分の0.6mmにすれば、N
A0.6の対物レンズに許容できるチルトは約0.75
度に拡大し、光ヘッドの取り付け誤差を0.25度とし
ても、実際のディスク形状変化によるチルトは0.5度
まで余裕がある。
By reducing the thickness of the substrate, the allowable range for the tilt of the disk is widened, and a high density of a practical optical disk using a high NA objective lens can be achieved. For example, if the thickness of the substrate is 0.6 mm, which is half of CD, N
The allowable tilt for an A0.6 objective lens is about 0.75
Even if the optical head mounting error is set to 0.25 degree, the tilt due to the actual disc shape change has a margin of up to 0.5 degree.

【0004】薄型基板の光ディスクでは、単板では自重
で垂れてしまうので2枚の基板を貼合わる。機械的強度
を高めるだけではなく両面を用いる事で容量が倍増す
る。
In the case of an optical disk having a thin substrate, a single plate hangs down by its own weight, and therefore two substrates are bonded together. The capacity is doubled not only by increasing the mechanical strength, but also by using both sides.

【0005】図1に放射線硬化樹脂を用いて貼合わせた
ディスクの一般的な断面図を示す。1は第1の基板で、
その片面に情報信号面2が設けられている。その情報信
号面2上にアルミを主成分とする金属などの反射膜3が
形成されている。また、4は第2の基板で、その片面に
情報信号面5が設けられている。その情報信号面5上に
同様に反射膜6が形成されている。互いに対向する反射
膜3と反射膜6の間に放射線硬化樹脂層7が設けられて
第1と第2の基板を一体に貼合わせている。
FIG. 1 shows a general cross-sectional view of a disk laminated with a radiation curable resin. 1 is the first substrate,
The information signal surface 2 is provided on one surface thereof. On the information signal surface 2, a reflective film 3 such as a metal containing aluminum as a main component is formed. Further, 4 is a second substrate, on one side of which an information signal surface 5 is provided. A reflective film 6 is similarly formed on the information signal surface 5. A radiation curable resin layer 7 is provided between the reflective film 3 and the reflective film 6 facing each other to integrally bond the first and second substrates.

【0006】このディスクの従来の製造方法を図2を用
いて説明する(特願平6−238846号公報)。ポリ
カーボネート等の透明樹脂を用いて片面に第1の情報信
号面を設けた基板1を射出成形法などにより作製する。
その情報信号面の上に反射膜をスパッタリング法や真空
蒸着法で形成する。また、片面に第2の情報信号面を設
けた基板4を射出成形法などにより作り、その上に反射
膜をスパッタリング法や真空蒸着法で形成する。これら
の反射膜はアルミを主成分とする金属を用いる。基板1
を低速回転させながら放射線硬化樹脂7をドーナツ状に
塗布する(図2(A))。その上に第2の基板4を情報
信号面上の反射膜が放射線硬化樹脂7の方に向けて重ね
る(図2(B))。基板1と4を一体に高速回転させて
放射線硬化樹脂が基板1と基板4の間を拡散してから
(図2(C))、基板4とその上の反射膜を経て放射線
(図2では紫外線UVを使用)を照射して放射線硬化樹
脂を硬化させて、2つの基板を一体に固めて貼合わせる
(図2(D))。
A conventional method of manufacturing this disk will be described with reference to FIG. 2 (Japanese Patent Application No. 6-238846). A substrate 1 having a first information signal surface provided on one surface thereof using a transparent resin such as polycarbonate is manufactured by an injection molding method or the like.
A reflective film is formed on the information signal surface by a sputtering method or a vacuum evaporation method. Further, the substrate 4 having the second information signal surface provided on one surface is formed by injection molding or the like, and the reflection film is formed thereon by the sputtering method or the vacuum evaporation method. For these reflective films, a metal whose main component is aluminum is used. Board 1
While rotating at a low speed, the radiation curable resin 7 is applied in a donut shape (FIG. 2 (A)). The second substrate 4 is placed on top of this so that the reflection film on the information signal surface faces the radiation curable resin 7 (FIG. 2 (B)). The substrates 1 and 4 are integrally rotated at a high speed so that the radiation curable resin diffuses between the substrates 1 and 4 (FIG. 2C), and then the radiation (in FIG. 2) passes through the substrate 4 and the reflective film thereon. UV radiation is used) to cure the radiation-curable resin, and the two substrates are solidified and bonded together (FIG. 2D).

【0007】この従来例では、重ね合わせる2枚の基板
共に情報信号が設けられ、各々の情報信号上に反射膜が
形成されているが、この反射膜を僅かに透過する放射線
で放射線硬化樹脂を硬化させることはできる。例えば、
反射膜にアルミを用い、放射線として紫外線を用いれ
ば、紫外線のアルミ膜の透過率は1%以下であるが、樹
脂を十分硬化させることができる。
In this conventional example, an information signal is provided on each of the two superposed substrates, and a reflective film is formed on each of the information signals. It can be cured. For example,
When aluminum is used for the reflection film and ultraviolet rays are used as radiation, the transmittance of the aluminum film for ultraviolet rays is 1% or less, but the resin can be sufficiently cured.

【0008】薄型基板の貼合わせディスクは非常に容量
が大きいので、ほとんどのソフト内容は片面で十分であ
り、重ね合わせる一方の基板は単なるダミーの透明板で
よい。この場合は透明板を透過する放射線で迅速に容易
に放射線硬化樹脂を硬化させることができる(特願平5
−63668号公報、特願平5−195011号公
報)。
Since the laminated disk of the thin substrate has a very large capacity, most of the soft contents are sufficient on one side, and one of the substrates to be superposed may be a mere dummy transparent plate. In this case, the radiation-curable resin can be quickly and easily cured with the radiation that passes through the transparent plate (Japanese Patent Application No. 5-58200).
-63668, Japanese Patent Application No. 5-195011).

【0009】また、2枚の基板の一方には半透明膜を形
成して、ディスクの片側から2つ共の情報面を再生する
事もできるが、この2層ディスクの作製も片面が半透明
膜であるから、紫外線による硬化は迅速で容易である。
It is also possible to form a semi-transparent film on one of the two substrates to reproduce both information surfaces from one side of the disc. In the production of this two-layer disc, one side is semi-transparent. Since it is a film, it is quick and easy to cure by ultraviolet rays.

【0010】[0010]

【発明が解決しようとする課題】基板を低速回転させな
がら放射線硬化樹脂をドーナツ状に塗布し、その上に貼
合わせる基板を重ね、2枚の基板を一体に高速回転させ
て放射線硬化樹脂を基板の間に拡散させるときに、基板
の内周側に拡がる前に高速回転すれば、ディスク内周に
は十分樹脂が充填せず強度の弱い貼合わせディスクがで
きてしまう。また、2枚の基板の間を十分に樹脂が拡散
するのを待つと、樹脂が基板の中心穴よりはみ出す事を
防ぐのは困難であり、ディスクをプレーヤのターンテー
ブルに固定する際に偏心などの支障が生じる。
The radiation curable resin is applied in a donut shape while the substrate is rotated at a low speed, and the substrates to be laminated are stacked on top of each other, and the two substrates are integrally rotated at a high speed to apply the radiation curable resin to the substrate. If the substrate is rotated at a high speed before being spread to the inner peripheral side of the substrate when diffusing between the two, the inner periphery of the disc will not be sufficiently filled with the resin and a bonded disc with weak strength will be formed. Further, if the resin is sufficiently diffused between the two substrates, it is difficult to prevent the resin from sticking out of the center hole of the substrates, such as eccentricity when fixing the disc to the turntable of the player. Trouble occurs.

【0011】本発明は、上記課題を解決するためになさ
れたものであり、その目的とするところは、基板の中心
穴に放射線硬化樹脂がはみ出すことなく、機械的強度の
高い、美観に優れた薄型の光情報媒体、光情報媒体製造
方法および光情報媒体製造装置を提供することである。
The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to prevent radiation-curable resin from squeezing out into a central hole of a substrate and to have high mechanical strength and excellent aesthetics. An object is to provide a thin optical information medium, an optical information medium manufacturing method, and an optical information medium manufacturing apparatus.

【0012】[0012]

【課題を解決するための手段】本発明の光情報媒体は、
中心穴を有する第1の基板と、中心穴を有する第2の基
板と、該第1の基板と該第2の基板との間に形成され、
該第1の基板と該第2の基板とを貼り合わせる放射線硬
化樹脂とを備えた円盤状の光情報媒体であって、該放射
線硬化樹脂が該基板の穴からはみ出すことを防止するス
トッパーを更に備えており、しかも、該第1の基板と該
第2の基板との間において、該光情報媒体をクランプす
るためのクランプ領域の少なくとも半分の領域は、樹脂
で充填されており、該ストッパーはシール剤層から形成
されており、該シール剤層は印刷された放射線硬化樹脂
によって形成されており、そのことにより上記目的が達
成される。本発明の他の光情報媒体は、中心穴を有する
第1の基板と、中心穴を有する第2の基板と、該第1の
基板と該第2の基板との間に形成され、該第1の基板と
該第2の基板とを貼り合わせる放射線硬化樹脂とを備え
た円盤状の光情報媒体であって、該放射線硬化樹脂が該
基板の穴からはみ出すことを防止するストッパーを更に
備えており、しかも、該第1の基板と該第2の基板との
間において、該光情報媒体をクランプするためのクラン
プ領域の少なくとも半分の領域は、樹脂で充填されてお
り、該ストッパーはシール剤層から形成されており、該
シール剤層はホットメルト剤から形成されており、その
ことにより上記目的が達成される。 本発明の光情報媒体
製造方法は、中心穴を有する第1の基板と第2の基板の
間に、放射線硬化樹脂を形成して第1と第2の基板を一
体とした光情報媒体製造方法であって、基板内周部に未
硬化時の粘度が、基板外周部に形成される放射線硬化樹
脂のものより高い放射線硬化樹脂を用いてシール剤層を
形成し、該第1の基板または該第2の基板を透過する放
射線により該放射線硬化樹脂を硬化させて、該第1の基
板と該第2の基板を貼り合わせ、そのことにより上記目
的が達成される。 本発明の他の光情報媒体製造方法は、
中心穴を有する第1の基板と第2の基板の間に放射線硬
化樹脂を形成して該第1の基板と該第2の基板とを貼り
合わせる光情報媒体製造方法であって、該基板の内周部
に放射線硬化樹脂を印刷すること によってシール剤層を
形成し、第1または第2の基板を透過する放射線により
放射線硬化樹脂を硬化させて、該第1の基板と該第2の
基板とを貼り合わせ、そのことにより上記目的が達成さ
れる。 本発明の他の光情報媒体製造方法は、中心穴を有
する第1の基板と第2の基板の間に、放射線硬化樹脂を
形成して該第1の基板と該第2の基板とを貼り合わせる
光情報媒体製造方法であって、ホットメルト剤を用いて
該基板の内周部にシール剤層を形成し、該放射線硬化樹
脂と該シール剤層を挟んで該第1の基板と該第2の基板
を押圧した後、該第1の基板または該第2の基板を透過
する放射線によって該放射線硬化樹脂を硬化させて、該
第1の基板と該第2の基板とを貼り合わせ、そのことに
より上記目的が達成される。
The optical information medium of the present invention comprises:
A first substrate having a central hole, a second substrate having a central hole, and formed between the first substrate and the second substrate,
What is claimed is: 1. A disk-shaped optical information medium comprising a radiation curable resin for bonding the first substrate and the second substrate, further comprising a stopper for preventing the radiation curable resin from protruding from a hole of the substrate. In addition, at least half of the clamp area for clamping the optical information medium is filled with resin between the first substrate and the second substrate , and the stopper is Formed from sealant layer
The sealant layer is a printed radiation curable resin.
The above-mentioned object is achieved thereby. Another optical information medium of the present invention has a central hole
A first substrate, a second substrate having a central hole, and the first substrate
A first substrate and a substrate formed between the substrate and the second substrate;
A radiation-curable resin that is bonded to the second substrate
A disk-shaped optical information medium, wherein the radiation-curable resin is
Further stopper to prevent it from protruding from the hole in the board
Of the first substrate and the second substrate
Clamp for clamping the optical information medium between
At least half of the area is filled with resin.
The stopper is formed of a sealant layer,
The sealant layer is formed from a hot melt agent,
By doing so, the above object is achieved. Optical information medium of the present invention
The manufacturing method includes a first substrate having a central hole and a second substrate having a central hole.
A radiation curable resin is formed between the first and second substrates to form a single layer.
A method for manufacturing an optical information medium as a body, wherein
Radiation-cured resin formed on the outer periphery of the substrate
Use a radiation-curable resin that is higher than that of fat to form a sealant layer
A transparent substrate formed through the first substrate or the second substrate.
The radiation curable resin is cured by a ray of radiation to form the first group.
The plate and the second substrate are attached to each other, so that
Target is achieved. Another optical information medium manufacturing method of the present invention is
Radiation hardening between a first substrate and a second substrate having a central hole
Forming a resin and bonding the first substrate and the second substrate together
A method for manufacturing an optical information medium, comprising: an inner peripheral portion of the substrate
Applying a radiation-curable resin to the sealant layer
By forming and transmitting radiation through the first or second substrate
The radiation-curable resin is cured so that the first substrate and the second substrate are cured.
It is bonded to the substrate, which achieves the above objectives.
Be done. Another optical information medium manufacturing method of the present invention has a center hole.
Radiation curable resin is placed between the first and second substrates.
Form and bond the first substrate and the second substrate together
A method for producing an optical information medium, comprising using a hot melt agent
A sealant layer is formed on the inner periphery of the substrate, and the radiation-cured resin is
The first substrate and the second substrate sandwiching an oil and the sealing agent layer.
After pressing, pass through the first substrate or the second substrate
Curing the radiation curable resin by the radiation
Bonding the first substrate and the second substrate together
The above object is further achieved.

【0013】[0013]

【0014】[0014]

【0015】[0015]

【0016】[0016]

【0017】[0017]

【0018】[0018]

【0019】[0019]

【0020】[0020]

【0021】[0021]

【0022】[0022]

【0023】[0023]

【0024】[0024]

【0025】[0025]

【0026】[0026]

【0027】[0027]

【0028】[0028]

【0029】[0029]

【0030】[0030]

【0031】[0031]

【0032】[0032]

【0033】[0033]

【0034】[0034]

【0035】[0035]

【0036】[0036]

【0037】[0037]

【0038】[0038]

【0039】[0039]

【0040】[0040]

【0041】[0041]

【0042】[0042]

【0043】[0043]

【0044】[0044]

【0045】[0045]

【0046】[0046]

【0047】[0047]

【0048】[0048]

【0049】[0049]

【0050】[0050]

【0051】[0051]

【0052】[0052]

【0053】[0053]

【0054】[0054]

【0055】[0055]

【0056】[0056]

【発明の実施の形態】本発明の光情報媒体(光ディス
ク)は、中心穴を有する一対の基板が放射線硬化樹脂に
よって接着されたものであり、放射線硬化樹脂が基板の
中心穴からはみ出すことを防止するストッパーを更に備
えている。また、一対の基板の間において、光ディスク
をターンテーブルに固定するクランプ領域の少なくとも
半分の領域は、樹脂で充填されている。上記ストッパと
しては、基板に形成された凹部や凸部が好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION The optical information medium (optical disk) of the present invention comprises a pair of substrates having a central hole bonded by a radiation curable resin, and prevents the radiation curable resin from protruding from the central hole of the substrate. It is further equipped with a stopper that Further, between the pair of substrates, at least half of the clamp area for fixing the optical disc to the turntable is filled with resin. As the stopper, a concave portion or a convex portion formed on the substrate is preferable.

【0057】中心穴とほぼ同心の溝がストッパとして基
板に形成された場合において、この溝がクランプ領域よ
り内周側にある時の貼合わせ方法は、次の通りである。
すなわち、基板を低速で回転させながら溝より外側に放
射線硬化樹脂をドーナツ状に塗布し、その上に貼合わせ
る基板を重ねる。2枚の基板を一体に高速回転させて2
枚の基板の間で、かつ、溝より外側に放射線硬化樹脂を
ほぼ均一に拡散させ、放射線を照射して放射線硬化樹脂
を硬化させて2つの基板を一体に固めて貼合わせる。
When a groove substantially concentric with the center hole is formed on the substrate as a stopper, the bonding method when this groove is on the inner peripheral side of the clamp region is as follows.
That is, while rotating the substrate at a low speed, the radiation curable resin is applied in a donut shape on the outer side of the groove, and the substrate to be bonded is superposed thereon. Rotate two substrates together at high speed to
The radiation curable resin is diffused substantially uniformly between the substrates and outside the groove, and the radiation curable resin is cured by irradiating the radiation to solidify and bond the two substrates together.

【0058】溝がクランプ領域より外周側にある場合の
貼合わせ方法は、基板を低速回転させながら溝より外側
に放射線硬化樹脂をドーナツ状に塗布し、別途に溝より
内周側には放射線硬化樹脂層を中心穴には接しない様に
形成し、その上に貼合わせる基板を重ねる。2枚の基板
を一体に高速回転させて2枚の基板の間で、かつ、溝よ
り外側と溝より内周側で中心穴に接しない範囲で放射線
硬化樹脂をほぼ均一に拡散させ、放射線を照射して放射
線硬化樹脂を硬化させて2つの基板を一体に固めて貼合
わせる。
When the groove is located on the outer peripheral side of the clamp area, the bonding method is as follows. While the substrate is rotated at a low speed, the radiation curable resin is applied in a donut shape on the outer side of the groove, and the radiation hardened resin is separately on the inner peripheral side of the groove. The resin layer is formed so as not to come into contact with the central hole, and the substrate to be laminated is stacked on it. The two substrates are rotated together at a high speed so that the radiation-curable resin is almost evenly diffused between the two substrates and outside the groove and on the inner circumference side of the groove in a range not in contact with the central hole, and the radiation is cured. Irradiation is performed to cure the radiation curable resin, and the two substrates are solidified and bonded together.

【0059】溝がクランプ領域より内周側にある場合
は、2枚の基板の重ね合わせ後に樹脂が基板間を拡散さ
せる時、溝が余分の樹脂の溜り場となって、溝より内周
には樹脂が拡がることがなく、基板の中心穴より樹脂が
はみ出す事を防いでくれる。また、クランプ領域には樹
脂が拡散し、十分充填するので高い強度のディスクがで
きる。
When the groove is located on the inner side of the clamp area, when the resin diffuses between the substrates after the two substrates are superposed, the groove serves as a reservoir for extra resin, and the inner side of the groove is located. The resin does not spread and prevents the resin from protruding from the center hole of the substrate. In addition, since the resin diffuses into the clamp area and is sufficiently filled, a disk having high strength can be formed.

【0060】また、溝がクランプ領域より外周側にある
場合は、溝より外側に放射線硬化樹脂をドーナツ状に塗
布するのと別途に、溝の内周側に薄い放射線硬化樹脂層
を予め設けた後に2枚の基板を重ね合わせるので、クラ
ンプ領域にも十分に樹脂が硬化する様にできる。この内
周側の樹脂層は初めから薄く、かつ、基板の中心穴に接
しない様に塗布するので中心穴からはみ出すことはな
い。
When the groove is on the outer peripheral side of the clamp region, a thin radiation curable resin layer is previously provided on the inner peripheral side of the groove, separately from applying the radiation curable resin on the outer side of the groove in a donut shape. Since the two substrates are overlaid later, the resin can be sufficiently cured in the clamp area. Since the resin layer on the inner peripheral side is thin from the beginning and is applied so as not to come into contact with the central hole of the substrate, it does not protrude from the central hole.

【0061】以下に、図面を参照しながら、本発明の実
施例を詳細に説明する。
Embodiments of the present invention will be described in detail below with reference to the drawings.

【0062】(実施例1)本発明による光情報媒体の第
1の実施例を説明する。
(Embodiment 1) A first embodiment of the optical information medium according to the present invention will be described.

【0063】図3は、本実施例の光ディスクを示す。こ
の光ディスクは、円盤状の基板(厚さ:0.6mm)1
及び基板(厚さ:0.6mm)4が、放射線硬化樹脂7
を介して、一体的に貼り合わされたものである。第1の
基板1の片面には、情報信号面2が設けられている。情
報信号面2の上にはアルミを主成分とする反射膜(厚
さ:0.03μmから0.2μm)3が形成されてい
る。また、第2の基板4の片面には情報信号面5が設け
られ、その情報信号面5の上に反射膜6が形成されてい
る。放射線硬化樹脂7を介して、これらの情報信号面2
及び5が対向するように両基板1及び4は貼り合わされ
ている。
FIG. 3 shows an optical disk of this embodiment. This optical disc is a disc-shaped substrate (thickness: 0.6 mm) 1
And the substrate (thickness: 0.6 mm) 4 is a radiation curable resin 7
It is integrally bonded via. An information signal surface 2 is provided on one surface of the first substrate 1. A reflection film 3 (thickness: 0.03 μm to 0.2 μm) 3 containing aluminum as a main component is formed on the information signal surface 2. An information signal surface 5 is provided on one surface of the second substrate 4, and a reflective film 6 is formed on the information signal surface 5. These information signal surfaces 2 are exposed through the radiation curable resin 7.
The two substrates 1 and 4 are bonded so that the substrates 5 and 5 face each other.

【0064】基板1及び4の情報信号面2及び5にはグ
ルーブやピットが形成されている。書き換え可能型光デ
ィスクの場合は、少なくとも一方の基板1又は4の情報
信号面2又は5の上に記録膜(不図示)等が堆積され
る。
Grooves and pits are formed on the information signal surfaces 2 and 5 of the substrates 1 and 4, respectively. In the case of a rewritable optical disc, a recording film (not shown) or the like is deposited on the information signal surface 2 or 5 of at least one substrate 1 or 4.

【0065】一般に、光デイスクには、記録再生装置の
ターンテーブル上に光ディスクを固定するためのクラン
プ領域(図3の矢印付近)が設けられている。クランプ
領域は、ドーナツ状の形状を持つ領域であり、その領域
は、DVDの場合、ディスク中心から計測して11mm
から16.5mmまでの範囲を占めている。すなわち、
DVDの場合、クランプ領域は、内径22mmで外径3
3mmのリング状領域である。
Generally, the optical disc is provided with a clamp area (near the arrow in FIG. 3) for fixing the optical disc on the turntable of the recording / reproducing apparatus. The clamp area is an area having a donut shape, and in the case of a DVD, the area is 11 mm measured from the center of the disk.
To 16.5 mm. That is,
In the case of DVD, the clamping area is 22 mm inside diameter and 3 outside diameter.
It is a ring-shaped area of 3 mm.

【0066】本実施例では、基板1及び4のそれぞれの
上に、中心円とほぼ同心の溝8及び9が形成されてい
る。この溝の8及び9の機能については、のちに詳細を
説明する。本実施例の光ディスクでは、溝8及び9は、
深さが0.3mm以下で、幅が3mm以下のサイズを持
ち、クランプ領域の外縁よりも内側(ディスク中心に近
い側)に形成されている。基板の強度を充分なレベルに
維持するには、溝の深さを基板の厚さの半分以下にする
ことが好ましい。
In this embodiment, grooves 8 and 9 which are substantially concentric with the central circle are formed on the substrates 1 and 4, respectively. The function of the grooves 8 and 9 will be described in detail later. In the optical disc of this embodiment, the grooves 8 and 9 are
It has a depth of 0.3 mm or less and a width of 3 mm or less, and is formed on the inner side (side closer to the disc center) than the outer edge of the clamp region. In order to maintain the strength of the substrate at a sufficient level, it is preferable that the depth of the groove is less than half the thickness of the substrate.

【0067】もし、溝8及び9がクランプ領域の外縁よ
りも外側(基板の外周側)に形成されていると、クラン
プ領域には樹脂が充分に充填されない。本実施例の場
合、基板の張り合わせに放射線硬化樹脂を用いているた
め、基板間隔(約50μm)はホットメルト接着剤を用
いた場合の基板間隔(約10μm)に比べて5倍程度に
拡大している。クランプ領域に放射線硬化樹脂が充分に
充填されていないと、基板間隔が広がったために、光デ
ィスクをターンテーブルに安定して固定することができ
なくなることが本願発明者らの実験から明らかとなっ
た。
If the grooves 8 and 9 are formed outside the outer edge of the clamp region (outer peripheral side of the substrate), the clamp region is not sufficiently filled with resin. In the case of the present embodiment, since the radiation curable resin is used for bonding the substrates, the substrate interval (about 50 μm) is expanded about 5 times as compared with the substrate interval (about 10 μm) when the hot melt adhesive is used. ing. From the experiments conducted by the inventors of the present application, it was revealed that if the clamp region is not sufficiently filled with the radiation curable resin, the space between the substrates is widened and the optical disc cannot be stably fixed to the turntable.

【0068】安定なクランプを達成するには、クランプ
領域の少なくとも半分の領域に放射線硬化樹脂を充填す
る必要があることがわかった。すなわち、DVDの場
合、溝8及び9は、この中心(溝中心)とディスク中心
との距離が13.75(=11/2+16.5/2)m
m以下になるように配置される必要がある。幅3mmの
溝8及び9を、ディスク中心から12.5mm以下の領
域内に溝中心が位置するように形成した場合、放射線硬
化樹脂はクランプ領域のほぼすべてを実質的に充填する
ことができる。従って、溝8及び9は、その中心がディ
スク中心から約12.5mm以下の範囲内になるように
設けられることが好ましい。
It has been found that to achieve a stable clamp, at least half of the clamp area must be filled with radiation curable resin. That is, in the case of a DVD, in the grooves 8 and 9, the distance between the center (groove center) and the disk center is 13.75 (= 11/2 + 16.5 / 2) m.
It must be arranged so that it is less than or equal to m. When the grooves 8 and 9 having a width of 3 mm are formed such that the groove centers are located within a region of 12.5 mm or less from the center of the disc, the radiation curable resin can substantially fill the entire clamp region. Therefore, it is preferable that the grooves 8 and 9 are provided so that the center thereof is within a range of about 12.5 mm or less from the center of the disk.

【0069】放射線硬化樹脂層7は、溝8及び9の内部
を完全に充填するとは限らないので、放射線硬化樹脂層
7は、溝8及び9の外縁より外側、または溝を含んで溝
の内縁より外側に位置することとなる。図3は、一例と
して、溝の内縁より外側に樹脂が充填している場合を示
している。
Since the radiation curable resin layer 7 does not always completely fill the insides of the grooves 8 and 9, the radiation curable resin layer 7 is outside the outer edges of the grooves 8 and 9 or the inner edge of the groove including the grooves. It will be located outside. FIG. 3 shows, as an example, a case where resin is filled outside the inner edge of the groove.

【0070】溝8及び9は、情報信号の設けられたスタ
ンパを用いて基板1及び4を射出成形で形成する場合
に、そのスタンパの取付治具により形成することができ
る。取付治具の形状やサイズを調整することによって、
溝8及び9の形状及びサイズを制御できる。なお、溝8
及び9の形状は、図示されているものに限定されない。
また、溝8及び9の両方ではなく一つの溝だけが、基板
1または基板4の一方に形成されていても良い。また、
一つの基板上に複数の溝が近接して形成されていても良
い。
When the substrates 1 and 4 are formed by injection molding using a stamper provided with an information signal, the grooves 8 and 9 can be formed by a jig for attaching the stamper. By adjusting the shape and size of the mounting jig,
The shape and size of the grooves 8 and 9 can be controlled. The groove 8
The shapes of 9 and 9 are not limited to those shown.
Also, only one groove, not both grooves 8 and 9, may be formed in one of the substrate 1 or the substrate 4. Also,
A plurality of grooves may be formed close to each other on one substrate.

【0071】図4は、基板の射出成形の様子を示す。中
央部に孔を持つドーナツ状のスタンパ12は、円筒状の
可動側金型11の片面に取付治具13によって固定され
ている。取付治具13の端部には、リング状の凸部13
aが設けられており、その凸部13aがスタンパ12を
可動側金具11に対して押さえつけている。基板1また
は基板4は、可動側金型11と固定側金型14との間の
形成されたキャビティー15内に樹脂を図中右側から射
出し、冷却することによって作製される。この時、スタ
ンパ12の取付治具13の凸部13aによって、基板1
または基板4に溝8または9が形成される。従って、溝
8及び9の形状やサイズは、この取付治具13の凸部1
3aによって調整される。
FIG. 4 shows a state of injection molding of the substrate. A doughnut-shaped stamper 12 having a hole in the center is fixed to one surface of a cylindrical movable mold 11 by a mounting jig 13. At the end of the mounting jig 13, a ring-shaped convex portion 13
a is provided, and the convex portion 13 a presses the stamper 12 against the movable-side metal fitting 11. The substrate 1 or the substrate 4 is manufactured by injecting resin from the right side in the drawing into the cavity 15 formed between the movable side mold 11 and the fixed side mold 14 and cooling. At this time, the protrusion 1a of the mounting jig 13 of the stamper 12 causes the substrate 1
Alternatively, the groove 8 or 9 is formed in the substrate 4. Therefore, the shapes and sizes of the grooves 8 and 9 are the same as those of the convex portion 1 of the mounting jig 13.
3a.

【0072】次に、図5(A)から(D)を参照しなが
ら、本発明による光ディスク製造方法の一例を説明す
る。
Next, an example of the optical disk manufacturing method according to the present invention will be described with reference to FIGS.

【0073】まず、ポリカーボネート等の透明樹脂を用
いて、片面に第1の情報信号面2を設けた基板1を射出
成形法などにより作製する。その情報信号面の上に反射
膜をスパッタリング法や真空蒸着法で形成する。また、
片面に第2の情報信号面を設けた基板4を射出成形法な
どにより作り、その上に反射膜をスパッタリング法や真
空蒸着法で形成する。これらの反射膜はアルミを主成分
とする金属を用いる。
First, a substrate 1 having a first information signal surface 2 provided on one surface thereof is manufactured by injection molding using a transparent resin such as polycarbonate. A reflective film is formed on the information signal surface by a sputtering method or a vacuum evaporation method. Also,
The substrate 4 having the second information signal surface provided on one surface is formed by the injection molding method or the like, and the reflection film is formed thereon by the sputtering method or the vacuum evaporation method. For these reflective films, a metal whose main component is aluminum is used.

【0074】基板1を低速(20〜120rpm)で回
転させながら、基板1の溝8より外側の領域に放射線硬
化樹脂7をドーナツ状に塗布する(図5(A))。その
上に第2の基板4を情報信号面上の反射膜が放射線硬化
樹脂7の方に向けて重ねる(図5(B))。放射線硬化
樹脂が基板1と基板4の間を拡散するが、溝8や9が余
分の樹脂の溜り場となって、溝より内周には樹脂が拡が
ることがなく、基板の中心穴より樹脂がはみ出すことを
防いでくれる。連続したリング状の溝を設ける代わり
に、複数の凹部をディスク中心から等距離の位置に相互
に近接するように配列してもよい。
While rotating the substrate 1 at a low speed (20 to 120 rpm), the radiation curable resin 7 is applied in a donut shape to the region outside the groove 8 of the substrate 1 (FIG. 5A). The second substrate 4 is laid on top of it so that the reflection film on the information signal surface faces the radiation curable resin 7 (FIG. 5 (B)). The radiation-curable resin diffuses between the substrate 1 and the substrate 4, but the grooves 8 and 9 serve as reservoirs for the extra resin, and the resin does not spread to the inner circumference of the groove. It prevents it from protruding. Instead of providing a continuous ring-shaped groove, a plurality of recesses may be arranged so as to be close to each other at positions equidistant from the center of the disc.

【0075】基板1と4を一体的に高速(300〜50
00rpm)で回転させ、それによって2枚の基板の間
で、かつ、溝より外周側に放射線硬化樹脂をほぼ均一に
拡散させる(図5(C))。本実施例では、この工程
を、図6に示す製造装置を用いて行う。図6の装置は、
光ディスクを回転させるためのテーブル111と、吸引
口113を持つボス112と、吸引口13につながれた
吸引ポンプ114とを備えている。紫外線硬化樹脂は硬
化前において流動性を持つので、テーブル111上のボ
ス112に設けた吸引口113を通して吸引ポンプ11
4で放射線硬化樹脂を吸引すれば、基板間に放射線硬化
樹脂を均一に広げることができる。本実施例の吸引口1
13のサイズは内径が1mm以上で、その個数は2個以
上である。吸引力は、放射線硬化樹脂の粘度やテーブル
111の回転速度や回転時間等に応じて実験的に最適化
される。
The substrates 1 and 4 are integrally and at high speed (300 to 50).
(00 rpm), whereby the radiation curable resin is diffused substantially uniformly between the two substrates and on the outer peripheral side of the groove (FIG. 5 (C)). In this embodiment, this step is performed using the manufacturing apparatus shown in FIG. The device of FIG.
A table 111 for rotating the optical disk, a boss 112 having a suction port 113, and a suction pump 114 connected to the suction port 13 are provided. Since the ultraviolet curable resin has fluidity before being cured, the suction pump 11 is passed through the suction port 113 provided in the boss 112 on the table 111.
If the radiation curable resin is sucked in step 4, the radiation curable resin can be spread evenly between the substrates. Suction port 1 of this embodiment
The size of 13 has an inner diameter of 1 mm or more, and the number thereof is 2 or more. The suction force is experimentally optimized according to the viscosity of the radiation curable resin, the rotation speed and rotation time of the table 111, and the like.

【0076】テーブル111は、第1の基板1と第2の
基板4よりも僅かに外径を小さくすることが好ましい。
回転する2枚の基板の外周端から外側へはみ出した放射
線硬化樹脂の一部がテーブル11上にまで拡散すること
を防止するためである。本実施例では、ターンテーブル
14の半径Rtは、59mm以下に設定されており、基
板の半径Rs(=60mm)よりも1mm以上短くなっ
ている。ターンテーブル114の半径Rtを小さくしす
ぎると、光ディスクを安定に支持できなくなるので、テ
ーブル111の半径Rtは光ディスクの半径Rsの約7
0%以上の大きさを持つことが好ましい。
It is preferable that the table 111 has a slightly smaller outer diameter than the first substrate 1 and the second substrate 4.
This is to prevent a part of the radiation curable resin protruding from the outer peripheral ends of the two rotating substrates from spreading to the table 11. In this embodiment, the radius Rt of the turntable 14 is set to 59 mm or less, which is 1 mm or more shorter than the radius Rs (= 60 mm) of the substrate. If the radius Rt of the turntable 114 is too small, the optical disc cannot be stably supported. Therefore, the radius Rt of the table 111 is about 7 times the radius Rs of the optical disc.
It preferably has a size of 0% or more.

【0077】このように本実施例では、基板回転時に放
射線硬化樹脂を吸引することによって向心力を与える。
その結果、樹脂が光ディスクの外縁部に多量に移動する
ことを防止している。また、光ディスクの外縁部にはみ
出た樹脂についても、テーブルのサイズを光ディスクよ
りも小さくすることによって、テーブルに付着してディ
スクを汚すことを防止している。
As described above, in this embodiment, the centripetal force is applied by sucking the radiation curable resin when the substrate is rotated.
As a result, a large amount of resin is prevented from moving to the outer edge of the optical disc. Further, regarding the resin protruding to the outer edge portion of the optical disc, the size of the table is made smaller than that of the optical disc to prevent the resin from adhering to the table and soiling the disc.

【0078】更に、光ディスクの中心穴から樹脂を吸引
することによって、高速回転時においても、クランプ領
域内に樹脂を確実にとどめておくことができ、樹脂を均
一に拡散させることができる。また、光ディスクの中心
孔の端面からはみ出た余分の樹脂が吸引口113から吸
い出され、きれいに取り除かれるため、美観に優れた光
ディスクが提供される。
Further, by sucking the resin from the center hole of the optical disk, the resin can be surely retained in the clamp area even at the time of high speed rotation, and the resin can be uniformly diffused. Further, since the excess resin protruding from the end face of the center hole of the optical disc is sucked out from the suction port 113 and is removed cleanly, an optical disc having an excellent appearance is provided.

【0079】なお、吸引口113のかわりに、ボス11
2の吸引口113の位置に、放射線硬化樹脂5を吸い取
るスポンジを取り付けても、光ディスクの中心孔端面か
らはみ出た余分の樹脂をきれいに取り除くことができ
る。
In place of the suction port 113, the boss 11
Even if a sponge for absorbing the radiation curable resin 5 is attached to the position of the second suction port 113, the extra resin protruding from the end face of the center hole of the optical disc can be removed cleanly.

【0080】次に、基板4とその上の反射膜を経て放射
線を照射して放射線硬化樹脂を硬化させて、2つの基板
を一体に固めて貼合わせる(図5(D))。
Next, radiation is applied through the substrate 4 and the reflection film on the substrate 4 to cure the radiation curable resin, and the two substrates are integrally fixed and bonded (FIG. 5D).

【0081】放射線として、紫外線(UV)を用い、樹
脂には紫外線硬化樹脂を用いればよい。アルミを主成分
とする金属反射膜は、その厚さが0.1μm以下であれ
ば紫外線を少し透過(透過率は1%以下)させ、2つの
反射膜の間の紫外線硬化樹脂を硬化させることができ
る。
Ultraviolet rays (UV) may be used as the radiation, and an ultraviolet curable resin may be used as the resin. If the thickness of the metal reflective film containing aluminum as the main component is 0.1 μm or less, it transmits a small amount of ultraviolet rays (transmittance is 1% or less) to cure the ultraviolet curable resin between the two reflective films. You can

【0082】第1または第2の基板の反射膜上に予め放
射線硬化樹脂で保護膜を形成してから、貼合わせ用の放
射線硬化樹脂の塗布、重ね合わせ、放射線照射してもよ
い。
A protective film made of a radiation curable resin may be previously formed on the reflective film of the first or second substrate, and then a radiation curable resin for bonding may be applied, superposed, and irradiated with radiation.

【0083】また、放射線照射により放射線硬化樹脂が
硬化する時、一般には発熱を伴い、その熱で基板が若干
そる場合がある。そこで、放射線照射の間は第2の基板
の上から透明板で押さえて、この透明板、第2の基板、
第2の反射膜を透過する放射線で樹脂を硬化させると、
基板がそる事もなくディスク傾き(チルト)の殆ど無視
できる貼合わせディスクが作製できる。図7に、この実
施例を示すが、透明板10で一体となった第1と第2の
基板を押さえている。この透明板はガラス板でよい。
When the radiation curable resin is cured by irradiation with radiation, heat is generally generated, and the heat may cause the substrate to warp slightly. Therefore, while irradiating with radiation, the transparent plate is pressed from above the second substrate by the transparent plate, the second substrate,
When the resin is cured by the radiation that passes through the second reflective film,
It is possible to fabricate a bonded disc in which the tilt of the disc can be almost ignored without warping the substrate. FIG. 7 shows this embodiment, in which the transparent plate 10 holds the integrated first and second substrates. The transparent plate may be a glass plate.

【0084】ここでは、2枚の情報信号を記録した基板
どうしの貼り合わせの例で説明したが、一方の基板が情
報信号の記録されていないダミー基板であっても、同様
に貼り合わせることができる。
Here, an example in which two substrates on which information signals are recorded is bonded to each other has been described. However, even if one substrate is a dummy substrate on which no information signal is recorded, bonding can be performed in the same manner. it can.

【0085】また、基板4の情報信号面に半透明膜が形
成された2層ディスクの場合でも、半透明膜を持つ基板
4を介して放射線を放射線硬化樹脂に照射することがで
きるので、容易に張り合わせることができる。
Further, even in the case of a two-layer disc in which a semitransparent film is formed on the information signal surface of the substrate 4, the radiation curable resin can be irradiated with the radiation through the substrate 4 having the semitransparent film, so that it is easy. Can be stuck to.

【0086】なお、基板の溝8及び9は余分の樹脂が溝
より内周側に拡散する事を防ぐが、溝8及び9の中に樹
脂が均一に溜る保証はない。溝8及び9の中の樹脂が不
均一になり、空気の部分と樹脂の部分が混在すると、美
観を損ねる。そこで、溝8及び9の上にも反射膜3、6
を形成しておけば、溝8及び9の中の様子は外部からは
見えなくなり、美観を保つことができる。図3はこの構
造のディスク断面を示している。
Although the grooves 8 and 9 of the substrate prevent the excess resin from diffusing toward the inner peripheral side of the groove, there is no guarantee that the resin is uniformly accumulated in the grooves 8 and 9. If the resin in the grooves 8 and 9 becomes non-uniform and the air portion and the resin portion are mixed, the appearance is spoiled. Therefore, the reflective films 3, 6 are also formed on the grooves 8 and 9.
By forming the above, the inside of the grooves 8 and 9 cannot be seen from the outside and the appearance can be maintained. FIG. 3 shows a disk cross section of this structure.

【0087】(実施例2)次に、図8及び図9を参照し
ながら、基板上の溝がクランプ領域の外縁よりも外側に
形成された光ディスクについて説明する。
(Embodiment 2) Next, with reference to FIG. 8 and FIG. 9, an optical disk in which the groove on the substrate is formed outside the outer edge of the clamp area will be described.

【0088】樹脂が基板の中心穴よりはみ出さないため
には、樹脂は溝の外縁よりも外側に塗布しなければなら
ない。しかし、この場合にはクランプ領域には樹脂がな
いことになり、十分にターンテーブル上にディスクを固
定できない。そこで、溝8の外側に放射線硬化樹脂をド
ーナツ状に塗布する前に、溝の内周側には別途に放射線
硬化樹脂層16を形成する手段を用いる。このために
は、図8に示すように、幅5〜10mm程度のローラ1
7で、樹脂層を形成する方法がある。この時も基板の中
心穴に樹脂がはみ出さないように、中心穴には接しない
位置に樹脂層16を形成することが望ましい。
In order to prevent the resin from protruding from the central hole of the substrate, the resin must be applied to the outside of the outer edge of the groove. However, in this case, there is no resin in the clamp area, and the disc cannot be sufficiently fixed on the turntable. Therefore, before applying the radiation curable resin in a donut shape on the outside of the groove 8, a means for separately forming the radiation curable resin layer 16 on the inner peripheral side of the groove is used. For this purpose, as shown in FIG. 8, the roller 1 having a width of about 5 to 10 mm is used.
7, there is a method of forming a resin layer. Also at this time, it is desirable to form the resin layer 16 at a position not in contact with the center hole so that the resin does not overflow into the center hole of the substrate.

【0089】図9に本実施例の貼合わせディスクを示
す。各部分の名称は図3の実施例と同じである。本実施
例の光ディスクの溝は、クランプ領域(図9の矢印付
近)の外縁よりも外側に形成され、放射線硬化樹脂7
は、溝の外周側と内周側とで別々に塗布される。その結
果、樹脂は若干不均一に充填される可能性があるが、ク
ランプ領域には樹脂を十分充填し硬化させることができ
る。
FIG. 9 shows the laminated disk of this embodiment. The names of the respective parts are the same as in the embodiment of FIG. The groove of the optical disk of the present embodiment is formed outside the outer edge of the clamp area (near the arrow in FIG. 9) and is made of the radiation curable resin 7
Is separately applied on the outer peripheral side and the inner peripheral side of the groove. As a result, the resin may be slightly unevenly filled, but the clamp region can be sufficiently filled with the resin and cured.

【0090】上記実施例1及び2は何れも両面再生型の
光ディスクである。片面再生型の場合、基板4は、反射
膜や情報信号面を持たない透明な板(ダミー板)でもよ
い。基板4がダミー板であれば、透明な基板4を介して
放射線を放射線硬化樹脂に照射することができるので、
前述の両面再生の場合よりも短時間で放射線硬化樹脂を
硬化させることができ、生産タクトを短くできる。
The above-mentioned first and second embodiments are both double-sided reproduction type optical disks. In the case of a single-sided reproduction type, the substrate 4 may be a transparent plate (dummy plate) having no reflective film or information signal surface. If the substrate 4 is a dummy plate, the radiation curable resin can be irradiated with radiation through the transparent substrate 4,
The radiation-curable resin can be cured in a shorter time than in the case of double-sided reproduction described above, and the production tact can be shortened.

【0091】また、基板4の情報信号面に半透明膜が形
成された2層ディスクの場合でも、半透明膜を持つ基板
4を介して放射線を放射線効果樹脂に照射することがで
きるので、容易に張り合わせることができる。
Further, even in the case of a two-layer disc in which a semitransparent film is formed on the information signal surface of the substrate 4, the radiation effect resin can be irradiated with the radiation through the substrate 4 having the semitransparent film, which is easy. Can be stuck to.

【0092】(実施例3)図10、図11、図12及び
図13(A)から(D)を参照しながら、本発明による
光情報媒体の第3の実施例を説明する。
(Embodiment 3) A third embodiment of the optical information medium according to the present invention will be described with reference to FIGS. 10, 11, 12 and 13A to 13D.

【0093】本実施例の光ディスクにおいては、図10
に示されるように、第1の基板1の片面に情報信号面2
が設けられている。その情報信号面2の上にアルミを主
成分とする金属などの反射膜3が形成されている。ま
た、第2の基板4の片面に情報信号面5が設けられ、そ
の情報信号面5の上に反射膜6が形成されている。基板
1及び4には、それぞれ、突起(高さ:0.01〜0.
2mm、幅:0.1〜2mm)40及び溝(深さ:0.
05〜0.3mm、幅:0.3〜3mm)50が設けら
れている。基板1と基板4の間で、かつ、突起40と溝
50の外縁より外側、または、突起40と溝50を含ん
で突起と溝の内縁より外側に、放射線硬化樹脂層7が設
けられている。図10は、突起と溝の内縁より外側に樹
脂が充填している例を示している。
In the optical disc of the present embodiment, FIG.
As shown in FIG. 1, the information signal surface 2 is provided on one surface of the first substrate 1.
Is provided. On the information signal surface 2, a reflective film 3 such as a metal containing aluminum as a main component is formed. Further, the information signal surface 5 is provided on one surface of the second substrate 4, and the reflective film 6 is formed on the information signal surface 5. Protrusions (height: 0.01 to 0.
2 mm, width: 0.1 to 2 mm) 40 and grooves (depth: 0.
05-0.3 mm, width: 0.3-3 mm) 50. The radiation curable resin layer 7 is provided between the substrate 1 and the substrate 4 and outside the outer edges of the protrusions 40 and the grooves 50, or outside the inner edges of the protrusions and the grooves including the protrusions 40 and the grooves 50. . FIG. 10 shows an example in which resin is filled outside the inner edges of the protrusions and the grooves.

【0094】図10の矢印部分の領域は、再生装置のタ
ーンテーブルに光ディスクを固定するクランプ領域であ
り、そこでは十分に放射線硬化樹脂が硬化している必要
がある。その為には、突起40と溝50がクランプ領域
の中央よりも中心穴に近い側に形成されている必要があ
る。また、2枚の基板は、偏心の発生がないように、中
心穴のセンターで位置決めされて、十分に硬化されてい
る必要がある。
The area indicated by the arrow in FIG. 10 is a clamp area for fixing the optical disk to the turntable of the reproducing apparatus, and it is necessary that the radiation curable resin is sufficiently hardened there. For that purpose, the protrusion 40 and the groove 50 need to be formed closer to the central hole than the center of the clamp region. Further, the two substrates need to be positioned at the center of the center hole and sufficiently cured so that eccentricity does not occur.

【0095】本実施例の突起40と溝50は、図3の光
ディスクの溝8及び9と同様に、放射線硬化樹脂が中心
穴からはみ出さないようにするためのストッパとして機
能する。基板4に溝50を設けず、基板1に突起40を
設けてもよい。その場合、突起40だけで放射線硬化樹
脂のストッパとして機能する。溝50の代わりに突起を
基板4に設けても良い。その場合、基板4の突起は、基
板1の突起40とぶつかり合わない位置に設ける必要が
ある。本実施例の突起40及び溝50は、基板の中心穴
をとりまく連続したリング状である。しかし、突起40
及び溝50は必ずしも連続している必要はない。例え
ば、複数の突起をディスク中心から等距離の位置に近接
するように配置してもよい。あるいは、一方の基板に配
列した複数の突起と他方の基板に配列した複数の突起が
互いにかみ合うように2枚の基板を張り合わせても良
い。
The protrusion 40 and the groove 50 of this embodiment function as stoppers for preventing the radiation curable resin from protruding from the central hole, like the grooves 8 and 9 of the optical disk of FIG. The protrusions 40 may be provided on the substrate 1 without providing the grooves 50 on the substrate 4. In that case, only the protrusion 40 functions as a stopper for the radiation curable resin. A protrusion may be provided on the substrate 4 instead of the groove 50. In that case, the protrusion of the substrate 4 needs to be provided at a position where it does not collide with the protrusion 40 of the substrate 1. The protrusion 40 and the groove 50 of this embodiment are in the shape of a continuous ring surrounding the central hole of the substrate. However, the protrusion 40
The groove 50 does not necessarily have to be continuous. For example, the plurality of protrusions may be arranged close to positions equidistant from the center of the disc. Alternatively, two substrates may be attached so that the plurality of protrusions arranged on one substrate and the plurality of protrusions arranged on the other substrate are engaged with each other.

【0096】以下に、図10に示す光ディスクの製造方
法を図11、図12及び図13(A)から(D)を参照
しながら説明する。
A method of manufacturing the optical disk shown in FIG. 10 will be described below with reference to FIGS. 11, 12 and 13A to 13D.

【0097】ポリカーボネート等の透明樹脂を用いて、
片面に第1の情報信号面を設けた基板1を射出成形など
により作製する。その信号面の上に反射膜をスパッタ法
や真空蒸着法で形成する。また、片面に第2の情報信号
面を設けた基板4を射出成形法などにより作り、その上
に反射膜をスパッタリング法や真空蒸着法で形成する。
これらの反射膜はアルミを主成分とする金属を用いる。
Using a transparent resin such as polycarbonate,
The substrate 1 having the first information signal surface on one side is manufactured by injection molding or the like. A reflective film is formed on the signal surface by sputtering or vacuum evaporation. Further, the substrate 4 having the second information signal surface provided on one surface is formed by injection molding or the like, and the reflection film is formed thereon by the sputtering method or the vacuum evaporation method.
For these reflective films, a metal whose main component is aluminum is used.

【0098】基板1には、中心円とほぼ同等の同心の突
起40が形成され、基板4には、基板1の突起40と相
対するように溝50が形成されている。この突起40と
溝50は情報信号の設けられたスタンパを用いて射出成
形する場合に、そのスタンパの取付治具により形成でき
る。図11、図12にその射出成形の様子を示す。可動
側金型11にスタンパ12を固定し、固定側金型14と
の間のキャビティー15に樹脂を射出し、冷却する事で
基板を作製する。この時、図11に示す治具13に凸部
13aを設けることにより、基板の溝50が作製でき、
また、治具13に凹部13bを設けることにより、基板
の突起40を作製することができる。
The substrate 1 is provided with a concentric protrusion 40 which is substantially equivalent to the central circle, and the substrate 4 is provided with a groove 50 so as to face the protrusion 40 of the substrate 1. When the injection molding is performed using the stamper provided with the information signal, the projection 40 and the groove 50 can be formed by the jig for mounting the stamper. 11 and 12 show the state of the injection molding. The stamper 12 is fixed to the movable mold 11, the resin is injected into the cavity 15 between the fixed mold 14 and the mold, and the substrate is manufactured by cooling. At this time, the groove 50 of the substrate can be produced by providing the jig 13 shown in FIG.
Further, by providing the recess 13b in the jig 13, the protrusion 40 of the substrate can be manufactured.

【0099】図13(A)に示す基板1を低速回転させ
ながら、突起40より外側に放射線硬化樹脂7をドーナ
ツ状もしくは、スパイラル状に塗布する。その後、図1
3(B)に示す基板1の上面に第2の基板4を情報信号
面上の反射膜が放射線硬化樹脂7の方に向けて重ねる。
その後、図13(C)に示すように、放射線硬化樹脂7
が基板1と基板4の間を拡散するが、突起40で放射線
硬化樹脂が止まり、突起より内周には放射線硬化樹脂が
はみ出す事を防いでくれる。
While rotating the substrate 1 shown in FIG. 13A at a low speed, the radiation curing resin 7 is applied to the outside of the protrusion 40 in a donut shape or a spiral shape. Then, Figure 1
The second substrate 4 is placed on the upper surface of the substrate 1 shown in FIG. 3B so that the reflection film on the information signal surface faces the radiation curable resin 7.
Then, as shown in FIG. 13C, the radiation curable resin 7
Will diffuse between the substrate 1 and the substrate 4, but the radiation curable resin will stop at the protrusions 40 and will prevent the radiation curable resin from squeezing out from the protrusions to the inner circumference.

【0100】基板1と基板4を一体に高速回転させて2
枚の基板の間で、かつ、突起40より外周側に放射線硬
化樹脂7をほぼ均一に拡散させる。その後、図13
(D)に示す基板4とその上の反射膜を経て放射線を照
射して放射線硬化樹脂を硬化させて、基板1と基板4を
一体に固めて貼合せる。
The substrate 1 and the substrate 4 are integrally rotated at a high speed for 2
The radiation curable resin 7 is diffused substantially uniformly between the substrates and on the outer peripheral side of the protrusion 40. After that, FIG.
Radiation is irradiated through the substrate 4 shown in (D) and the reflection film on the substrate 4 to cure the radiation curable resin, and the substrate 1 and the substrate 4 are integrally fixed and bonded together.

【0101】放射線として、紫外線(UV)を用い、樹
脂には、紫外線硬化樹脂を用いれば良い。アルミを主成
分とする金属反射膜は、その厚さが0.1μm以下であ
れば紫外線を少し透過(透過率は1%以下)させ、2つ
の反射膜の間の紫外線硬化樹脂を硬化させることができ
る。
Ultraviolet rays (UV) may be used as the radiation, and an ultraviolet curable resin may be used as the resin. If the thickness of the metal reflective film containing aluminum as the main component is 0.1 μm or less, it transmits a small amount of ultraviolet rays (transmittance is 1% or less) to cure the ultraviolet curable resin between the two reflective films. You can

【0102】第1の基板、または、第2の基板の反射膜
上に予め放射線硬化樹脂で保護膜を形成してから、図1
3(A)から(D)に示すように貼合せ用の放射線硬化
樹脂の塗布、重ね合わせ、放射線照射してもよい。
After forming a protective film of a radiation curing resin on the reflective film of the first substrate or the second substrate in advance, as shown in FIG.
As shown in 3 (A) to 3 (D), a radiation curable resin for laminating may be applied, superposed, and irradiated with radiation.

【0103】(実施例4)次に、図14を参照しなが
ら、基板の外周端の放射線硬化樹脂の整形方法について
説明する。
Example 4 Next, with reference to FIG. 14, a method of shaping the radiation curable resin on the outer peripheral edge of the substrate will be described.

【0104】2枚の基板で貼合された光ディスクは、落
下や衝撃など機械的強度にも十分に耐える必要がある。
しかし、2枚の基板を貼合せる放射線硬化樹脂が信号記
録部分のみに拡散されて基板端面まで樹脂が充分に到達
しなかったり、また、樹脂の一部が基板端面に到達する
としても、樹脂の均一な拡散は非常に難しい。樹脂の拡
散が不均一な状態なまま放射線の照射で樹脂を硬化する
と、落下や衝撃により基板端面からの両基板が剥がれや
すくなり、光ディスクの機械的強度が低下する。そこ
で、図14に示す様に、第1の基板1と第2の基板4の
両方の基板の貼合せ面側の外周端の外径φaが、貼合せ
面の反対面側の外周端の外径φbより僅かに小さくし
て、各基板の外周端面にテーパを設け、斜めに向かい合
う傾斜面18、19を形成している。その結果、光ディ
スクの外周に沿う窪みが形成され、その窪みを埋めるよ
うに放射線硬化樹脂が設けられている。この時、基板端
部のテーパ面(傾斜面)は、第1の基板、もしくは、第
2の基板のいずれか一方の基板に形成されてても良い。
又、テーパ面(傾斜面)の形状は、外径φa≦外径φb
の関係を満たすものであれば、いずれの形状でも良い。
An optical disc bonded with two substrates must sufficiently withstand mechanical strength such as dropping and impact.
However, the radiation curable resin for bonding two substrates is diffused only to the signal recording portion and the resin does not reach the substrate end face sufficiently, or even if a part of the resin reaches the substrate end face, the resin Uniform diffusion is very difficult. When the resin is cured by irradiation with radiation while the resin is unevenly diffused, both substrates are likely to be peeled off from the end face of the substrate due to dropping or impact, and the mechanical strength of the optical disk is lowered. Therefore, as shown in FIG. 14, the outer diameter φa of the outer peripheral edge on the bonding surface side of both the first substrate 1 and the second substrate 4 is the outer diameter of the outer peripheral edge on the opposite surface side of the bonding surface. The diameter is set to be slightly smaller than φb, and the outer peripheral end surface of each substrate is tapered to form inclined surfaces 18 and 19 diagonally facing each other. As a result, a recess is formed along the outer circumference of the optical disc, and the radiation curable resin is provided so as to fill the recess. At this time, the tapered surface (inclined surface) of the substrate end may be formed on either one of the first substrate and the second substrate.
Further, the shape of the tapered surface (inclined surface) is such that outer diameter φa ≦ outer diameter φb
Any shape may be used as long as it satisfies the relationship.

【0105】基板端部傾斜面18、19に形成された放
射線硬化樹脂は、図示していないが、基板の下部に設け
た回転テーブルを高速回転することにより放射線硬化樹
脂を振り切り、その余剰の樹脂のみが基板端部傾斜面に
形成されるだけで、均一な状態で形成されるものではな
い。そこで、第1の基板1と第2の基板4を貼合せて形
成される窪み形状と相対形状、もしくは、窪みより僅か
に小さな相対形状とした転写可能な回転転写ローラ20
を設け、基板に当接する様に、図5に示す矢印方向に駆
動させる構成とする。この時、回転テーブルは低速回転
に切り替えて、回転転写ローラ20を当接させ、回転テ
ーブルの回転方向と逆回転する方向に回転させる方が望
ましいが、回転転写ローラ20は、固定されていても良
い。また、回転テーブルは、常時放射線硬化樹脂を補填
させるために、抽出ノズル21から適時に放射線硬化樹
脂を抽出し、回転転写ローラ20を常時転写可能状態を
維持させておくことで、基板端面の整形が維持できると
共に、その状態で放射線照射で硬化させることにより、
機械的強度の高い光ディスクが作製できる。
The radiation curable resin formed on the inclined surfaces 18 and 19 of the substrate ends is not shown, but the radiation curable resin is shaken off by rotating a rotary table provided at the lower part of the substrate at a high speed. Only the edge surface of the substrate is formed, and it is not formed in a uniform state. Therefore, the rotary transfer roller 20 capable of transferring is formed in a relative shape with a recess formed by bonding the first substrate 1 and the second substrate 4, or with a relative shape slightly smaller than the recess.
Is provided and driven in the direction of the arrow shown in FIG. 5 so as to come into contact with the substrate. At this time, it is preferable that the rotary table is switched to low speed rotation, the rotary transfer roller 20 is brought into contact with the rotary table, and the rotary table is rotated in a direction opposite to the rotation direction of the rotary table, but the rotary transfer roller 20 is fixed. good. Further, in order to constantly supplement the radiation-curable resin, the rotary table extracts the radiation-curable resin from the extraction nozzle 21 in a timely manner and keeps the rotation transfer roller 20 always transferable, thereby shaping the substrate end surface. Can be maintained, and by curing by irradiation in that state,
An optical disk with high mechanical strength can be manufactured.

【0106】(実施例5)次に、重ね合わされた2枚の
基板の外周端部の硬化方法について、図15を用いて説
明する。
(Embodiment 5) Next, a method of hardening the outer peripheral end portions of two superposed substrates will be described with reference to FIG.

【0107】放射線は直線性が強く、例えば、基板の端
面部などは、十分に照射されなく所定の照射時間では硬
化されない。そこで、回転テーブル22を低速回転させ
ながら、しかも、基板端面に照射を可能とする反射板2
4を設ける構成とすることで、2枚の基板間、および、
基板端面の放射線硬化樹脂7を均一に、しかも、安定に
硬化させることができる。
Radiation has a strong linearity, and, for example, the end face portion of the substrate is not sufficiently irradiated and is not cured within a predetermined irradiation time. Therefore, while the rotary table 22 is rotated at a low speed, the reflection plate 2 that can irradiate the end face of the substrate
4 is provided between the two substrates, and
The radiation curable resin 7 on the end surface of the substrate can be uniformly and stably cured.

【0108】図15に示す構成とは別に、基板の周囲に
円錐台形状の鏡を設けても良い、この場合、テーブルは
回転させなくてもよい。
Apart from the structure shown in FIG. 15, a truncated cone-shaped mirror may be provided around the substrate. In this case, the table need not be rotated.

【0109】(実施例6)図16に、本発明の光情報媒
体の他の実施例を示す。1及び4は基板、2、5は第1
と第2の情報信号、3、6は反射膜、90はシール剤
層、70は放射線硬化樹脂層である。シール剤層90の
効果により中心穴への樹脂のはみ出しのない情報記録媒
体を得られる。
(Embodiment 6) FIG. 16 shows another embodiment of the optical information medium of the present invention. 1 and 4 are substrates, 2 and 5 are first
And a second information signal, 3 and 6 are reflective films, 90 is a sealant layer, and 70 is a radiation curable resin layer. Due to the effect of the sealing agent layer 90, an information recording medium can be obtained in which the resin does not protrude into the central hole.

【0110】図17(A)から(D)を用いて両面再生
の貼り合わせディスクの場合の本発明の製造方法を説明
する。片面に第1の情報信号面2を設けた基板1と片面
に第2の情報信号面5を設けた基板4は、ポリカーボネ
ート等の透明樹脂を用いて射出成形法などにより作製す
る。情報信号面2と情報信号面5の上に反射膜3、6を
スパッタリング法や真空蒸着法で形成する。これらの反
射膜は例えばアルミを主成分とする金属が用いられる。
The manufacturing method of the present invention in the case of a double-sided reproduction bonded disk will be described with reference to FIGS. 17 (A) to 17 (D). The substrate 1 provided with the first information signal surface 2 on one surface and the substrate 4 provided with the second information signal surface 5 on one surface are manufactured by injection molding using a transparent resin such as polycarbonate. The reflection films 3 and 6 are formed on the information signal surface 2 and the information signal surface 5 by a sputtering method or a vacuum evaporation method. For these reflective films, for example, a metal whose main component is aluminum is used.

【0111】基板1を低速回転させながら、ディスク外
周部に接着の主となる放射線硬化樹脂70を、ディスク
内周部に放射線硬化樹脂70より粘性の高い放射線硬化
樹脂90をドーナツ状に塗布する(図17(A))。そ
の上に第2の基板4を情報信号面5を放射線硬化樹脂7
0、90の方に向けて重ねる(図17(B))。
While rotating the substrate 1 at a low speed, the radiation curable resin 70, which is the main adhesive agent, is applied to the outer peripheral portion of the disc, and the radiation curable resin 90 having a higher viscosity than the radiation curable resin 70 is applied to the inner peripheral portion of the disc in a donut shape ( FIG. 17A). On top of that, the second substrate 4 is provided with the information signal surface 5 and the radiation curing resin 7 is provided.
They are piled up toward 0 and 90 (FIG. 17 (B)).

【0112】放射線硬化樹脂90が無い場合は、基板4
を基板1の上に重ねると放射線硬化樹脂70が基板1及
び4の間を拡散し、基板1及び4の中心穴からはみ出し
てしまう。内周まで拡散する前に硬化させるとディスク
内周には十分樹脂が充填せず強度の弱い貼り合わせディ
スクができてしまう。
If there is no radiation curable resin 90, the substrate 4
When the above is stacked on the substrate 1, the radiation curable resin 70 diffuses between the substrates 1 and 4 and protrudes from the center hole of the substrates 1 and 4. If the resin is hardened before spreading to the inner circumference, the inner circumference of the disk will not be sufficiently filled with resin and a bonded disk with weak strength will be formed.

【0113】一方、放射線硬化樹脂90があると、放射
線硬化樹脂90は粘度が高いため拡散が少なく、基板1
及び4の中心穴からはみ出さない。放射線硬化樹脂70
は拡散するが内周に放射線硬化樹脂90があるため、放
射線硬化樹脂90に遮られて基板1及び4の中心穴へは
み出すことはない。
On the other hand, when the radiation-curable resin 90 is present, the radiation-curable resin 90 has a high viscosity, so that the radiation-curable resin 90 diffuses little and the substrate 1
And do not protrude from the center holes of 4. Radiation curable resin 70
Is diffused, but since the radiation curable resin 90 is present on the inner circumference, it is not blocked by the radiation curable resin 90 and does not protrude into the central holes of the substrates 1 and 4.

【0114】基板1と4とを一体に高速回転させて2枚
の基板の間で、放射線硬化樹脂をほぼ均一に拡散させる
(図17(C))。基板4とその上の反射膜を経て放射
線を照射して放射線硬化樹脂を硬化させて、2つの基板
を一体に固めて貼り合わせる(図17(D))。
The substrates 1 and 4 are integrally rotated at a high speed so that the radiation curable resin is substantially uniformly diffused between the two substrates (FIG. 17C). Radiation is radiated through the substrate 4 and the reflection film on the substrate 4 to cure the radiation curable resin, and the two substrates are integrally fixed and bonded (FIG. 17D).

【0115】一般的には放射線として紫外線を用い、樹
脂には紫外線硬化樹脂を用いる。アルミを主成分とする
金属反射膜は、その厚さが0.1μm以下であれば紫外
線を少し透過させるので、2つの反射膜の間の紫外線硬
化樹脂を硬化させることができる。
Generally, ultraviolet rays are used as the radiation and an ultraviolet curable resin is used as the resin. If the thickness of the metal reflection film containing aluminum as a main component is 0.1 μm or less, it allows a small amount of ultraviolet rays to pass therethrough, so that the ultraviolet curable resin between the two reflection films can be cured.

【0116】第1または第2の基板の反射膜上に予め放
射線硬化樹脂で保護膜を形成してから、図17(A)か
ら(D)に示したように貼り合わせ用の放射線硬化樹脂
の塗布、重ね合わせ、放射線照射してもよい。保護膜を
形成する工程が増加する欠点はあるが、保護膜が反射膜
を保護するので、貼り合わせ用の放射線硬化樹脂の選択
の自由度が増し、反射膜の耐候性を高めることができ
る。
After forming a protective film of a radiation-curable resin on the reflective film of the first or second substrate in advance, as shown in FIGS. 17A to 17D, a radiation-curable resin for bonding is formed. You may apply | coat, superimpose, and irradiate with radiation. Although there is a drawback that the number of steps for forming the protective film increases, the protective film protects the reflective film, so that the degree of freedom in selection of the radiation curable resin for bonding is increased and the weather resistance of the reflective film can be enhanced.

【0117】なお、シール剤層90を放射線硬化樹脂を
用いてスピンコート法で形成する方法を説明したが、シ
ール剤層9を印刷によって形成することもできる。ある
程度以上粘度の高い放射線硬化樹脂はスピンコート法よ
り印刷の方が塗布しやす。
Although the method of forming the sealing agent layer 90 by the spin coating method using the radiation curable resin has been described, the sealing agent layer 9 may be formed by printing. A radiation-curable resin having a viscosity higher than a certain level is easier to apply by printing than by spin coating.

【0118】また、シール剤層90として、放射線硬化
樹脂70より粘度の高いホットメルト剤を用いることも
できる。ホットメルト剤は、例えばロールコーターにて
塗布することができる。
As the sealant layer 90, a hot melt agent having a viscosity higher than that of the radiation curable resin 70 can be used. The hot melt agent can be applied by, for example, a roll coater.

【0119】ここでは、2枚の情報信号を記録した基板
どうしの貼り合わせの例で説明したが、一方の基板が情
報信号の記録されていないダミー基板であっても、同様
に貼り合わせることができる。
Here, an example of bonding two substrates on which information signals are recorded has been described. However, even if one of the substrates is a dummy substrate on which no information signal is recorded, the same bonding is possible. it can.

【0120】また、基板4の情報信号面に半透明膜が形
成された2層ディスクの場合でも、半透明膜を持つ基板
4を介して放射線を放射線効果樹脂に照射することがで
きるので、容易に張り合わせることができる。
Further, even in the case of a two-layer disc in which a semitransparent film is formed on the information signal surface of the substrate 4, the radiation effect resin can be easily irradiated with the radiation through the substrate 4 having the semitransparent film. Can be stuck to.

【0121】本発明の光ディスクは、基板内周部にシー
ル剤層を形成してあるので、基板表面上に塗布された放
射線硬化樹脂を内周まで拡散させても中心穴へはみ出す
ことはなく、ディスクをプレーヤのターンテーブルに固
定する際に偏心などの支障が生じることはない。また、
ディスク内周まで十分樹脂が充填されるので貼り合わせ
強度を強くすることができる。
Since the optical disk of the present invention has the sealant layer formed on the inner peripheral portion of the substrate, the radiation curable resin coated on the surface of the substrate does not protrude into the center hole even when diffused to the inner periphery. There is no problem such as eccentricity when fixing the disc to the turntable of the player. Also,
Since the resin is sufficiently filled up to the inner circumference of the disc, the bonding strength can be increased.

【0122】(実施例7)次に本発明による光情報媒体
の更に他の実施例を説明する。
(Embodiment 7) Next, still another embodiment of the optical information medium according to the present invention will be described.

【0123】本実施例の光ディスクは、基板間に形成さ
れる放射線硬化樹脂層に耐候性を有する色素を混入させ
てある。ここでは、放射線の例として紫外線を、放射線
硬化樹脂の例として紫外線硬化樹脂を用いた例で説明す
る。
In the optical disc of this example, a weather-resistant dye is mixed in the radiation curable resin layer formed between the substrates. Here, an example in which ultraviolet rays are used as an example of radiation and an ultraviolet curable resin is used as an example of a radiation curable resin will be described.

【0124】従来の光ディスクでは、紫外線硬化樹脂が
経時変化により脱色していき、貼り合わせられた基板の
美観が経時変化によって損なわれていく。
In the conventional optical disc, the ultraviolet curable resin is decolorized with the passage of time, and the aesthetic appearance of the bonded substrates is deteriorated with the passage of time.

【0125】本実施例の光ディスクは、紫外線硬化樹脂
に耐候性のある色素を混入させてあるので、放射線硬化
樹脂の脱色をめだたなくし、貼り合わせられた基板の美
観が経時変化によって損なわれることを防ぐことができ
る。
Since the optical disc of this embodiment contains a UV-curable resin mixed with a weather-resistant dye, the radiation-curable resin is prevented from being decolorized, and the aesthetic appearance of the bonded substrates is impaired by aging. Can be prevented.

【0126】本発明の実施例における光ディスク製造方
法を説明する。
An optical disc manufacturing method according to the embodiment of the present invention will be described.

【0127】紫外線硬化樹脂として、あらかじめ耐候性
を有する顔料を紫外線硬化樹脂中に均一に混入しておい
たものを用いる。この紫外線硬化樹脂7を用いて図2
(A)から(D)に示した従来の工程と同一の工程によ
り、基板間に形成される放射線硬化樹脂層に耐候性を有
する色素を混入させた光ディスクを製造することができ
る。
As the UV curable resin, a UV curable resin in which a pigment having weather resistance is uniformly mixed in advance is used. Using this UV curable resin 7
By the same steps as the conventional steps shown in (A) to (D), it is possible to manufacture an optical disc in which a radiation-curable resin layer formed between substrates is mixed with a dye having weather resistance.

【0128】ここでは、2枚の情報信号を記録した基板
どうしの貼り合わせの例で説明したが、一方の基板が情
報信号の記録されていないダミー基板であっても、同様
に貼り合わせることができる。
Here, an example is described in which two substrates on which information signals are recorded are bonded to each other. However, even if one of the substrates is a dummy substrate on which no information signal is recorded, the same bonding is possible. it can.

【0129】また、本実施例の製造方法は、他の実施例
の光ディスクの製造にも適用することができる。
The manufacturing method of this embodiment can also be applied to the manufacture of optical disks of other embodiments.

【0130】(実施例8)次に、本発明による光情報媒
体の更に他の実施例を説明する。
(Embodiment 8) Next, still another embodiment of the optical information medium according to the present invention will be described.

【0131】本実施例の光ディスクは、基板間に形成さ
れる放射線硬化樹脂層に硬化度に応じて色の濃度のかわ
る放射線硬化樹脂層を用いている。ここでは、放射線の
例として紫外線を、放射線硬化樹脂の例として紫外線硬
化樹脂を用いた例で説明する。
In the optical disk of this embodiment, the radiation curable resin layer formed between the substrates has a radiation curable resin layer whose color density varies depending on the degree of curing. Here, an example in which ultraviolet rays are used as an example of radiation and an ultraviolet curable resin is used as an example of a radiation curable resin will be described.

【0132】従来紫外線硬化樹脂の硬化度を確認するた
めには、貼り合わせた基板を割り、直接紫外線硬化樹脂
の硬度を計る破壊検査をするしか方法がなく、全数検査
が不可能であり、各ディスクで均一な硬化度を得ること
が困難であった。
Conventionally, in order to confirm the degree of curing of the ultraviolet curable resin, the only method is to break the bonded substrates and directly perform the destructive inspection to measure the hardness of the ultraviolet curable resin. It was difficult to obtain a uniform degree of cure with the disc.

【0133】本実施例の光ディスクは、硬化度に応じて
色の濃度のかわる放射線硬化樹脂層を用いることで、色
の濃さで放射線硬化樹脂層の硬化度を非破壊で検査する
ことができ、一定の濃度で放射線硬化樹脂の硬化を完了
させることで各ディスクの硬化度を均一にすることがで
きる。
The optical disc of this embodiment uses a radiation-curable resin layer whose color density varies depending on the degree of curing, so that the degree of cure of the radiation-curable resin layer can be inspected nondestructively based on the color density. The curing degree of each disk can be made uniform by completing the curing of the radiation curable resin at a constant concentration.

【0134】硬化度に応じて色の濃度の変わる紫外線硬
化樹脂としては、例えば大日本インキ社製紫外線硬化樹
脂SD−1700等を用いることができる。
As the ultraviolet curable resin whose color density changes depending on the degree of curing, for example, ultraviolet curable resin SD-1700 manufactured by Dainippon Ink and Chemicals can be used.

【0135】本実施例の光ディスク製造方法について説
明する。
The optical disc manufacturing method of this embodiment will be described.

【0136】紫外線硬化樹脂として、硬化度に応じて色
の濃度の変わるものを用いる。この紫外線放射樹脂を用
いて図2(A)から(D)に示した従来の工程と同一の
工程により、基板1に紫外線硬化樹脂を塗布し、その上
に第2の基板4を情報信号面上の反射膜が放射線硬化樹
脂の方に向けて重ね、基板1と基板4を一体に高速回転
させて放射線硬化樹脂が基板1と基板4の間を拡散す
る。
As the ultraviolet curable resin, a resin whose color density changes depending on the degree of curing is used. Using this ultraviolet ray emitting resin, the ultraviolet curing resin is applied to the substrate 1 by the same process as the conventional process shown in FIGS. 2 (A) to 2 (D), and the second substrate 4 is provided thereon with the information signal surface. The upper reflection film is laminated toward the radiation curable resin, and the substrate 1 and the substrate 4 are integrally rotated at high speed so that the radiation curable resin diffuses between the substrate 1 and the substrate 4.

【0137】図2(D)に示す従来の工程と異なり、紫
外線硬化樹脂を硬化させる際、図18に示すような、紫
外線照射器35と、紫外線硬化樹脂の色の濃度を測定す
るセンサー36を有する装置を用いる。
Unlike the conventional process shown in FIG. 2D, when curing the ultraviolet curable resin, an ultraviolet irradiator 35 and a sensor 36 for measuring the color density of the ultraviolet curable resin as shown in FIG. 18 are used. Use the device you have.

【0138】紫外線照射器35より紫外線を基板4を通
して紫外線硬化樹脂に照射する際、紫外線硬化樹脂の色
の濃度をセンサー36を用いて測定する。紫外線硬化樹
脂の色の濃度が、事前に測定しておいた紫外線硬化樹脂
の完全硬化時の色の濃度に達した段階で、紫外線の照射
をやめる。この時点で紫外線硬化樹脂は完全に硬化して
いる。なお、センサー36には例えば色差計を用いるこ
とができる。
When the ultraviolet curing resin is irradiated with ultraviolet rays from the ultraviolet irradiation device 35 through the substrate 4, the color density of the ultraviolet curing resin is measured using the sensor 36. When the color density of the UV curable resin reaches the color density of the UV curable resin at the time of complete curing, which has been measured in advance, the irradiation of UV rays is stopped. At this point, the UV curable resin is completely cured. A color difference meter, for example, can be used as the sensor 36.

【0139】これによって、破壊検査をすることなく紫
外線硬化樹脂の完全硬化が確認でき、製造品の全数検査
が可能になり、各ディスクの硬化度を均一にすることが
できる。
As a result, the complete curing of the UV curable resin can be confirmed without performing a destructive inspection, the 100% inspection of manufactured products can be performed, and the curing degree of each disk can be made uniform.

【0140】ここでは、2枚の情報信号を記録した基板
どうしの貼り合わせの例で説明したが、一方の基板が情
報信号の記録されていないダミー基板であっても、同様
に貼り合わせることができる。
Here, an example is described in which two substrates on which information signals are recorded are bonded to each other. However, even if one substrate is a dummy substrate on which no information signal is recorded, the same bonding is possible. it can.

【0141】(実施例9)次に、本発明による光情報媒
体の製造方法の更に他の実施例を説明する。ここでは、
放射線の例として紫外線を、放射線硬化樹脂の例として
紫外線硬化樹脂を用いた例で説明する。
(Embodiment 9) Next, still another embodiment of the method for manufacturing an optical information medium according to the present invention will be described. here,
An example in which ultraviolet rays are used as an example of radiation and an ultraviolet ray curable resin is used as an example of a radiation curable resin will be described.

【0142】紫外線硬化樹脂を硬化させる際、紫外線硬
化樹脂層は光源に近い側から硬化していくため、貼り合
わせ後の基板は外周部が照射光源側に大きく反ってしま
うという問題があった。
When the ultraviolet curable resin is cured, the ultraviolet curable resin layer is cured from the side closer to the light source, so that there is a problem in that the outer peripheral portion of the substrate after bonding is largely warped to the irradiation light source side.

【0143】紫外線放射樹脂を用いて図2(A)から
(D)に示した従来の工程と同一の工程により、基板1
に紫外線硬化樹脂を塗布し、その上に第2の基板4を情
報信号面上の反射膜が放射線硬化樹脂の方に向けて重
ね、基板1と4を一体に高速回転させて放射線硬化樹脂
7が基板1と基板4の間を拡散する。
Substrate 1 is manufactured by the same process as the conventional process shown in FIGS.
UV-curable resin is applied to the second substrate 4, and the second substrate 4 is superposed thereon so that the reflection film on the information signal surface faces the radiation-curable resin, and the substrates 1 and 4 are integrally rotated at a high speed to produce the radiation-curable resin 7 Diffuse between the substrate 1 and the substrate 4.

【0144】図2(D)に示す従来の工程と異なり、紫
外線硬化樹脂7を硬化させる際、図19に示すような2
台の紫外線照射器35、37を有する構成の装置を用い
て行う。紫外線照射器35は基板4を通して紫外線硬化
樹脂7を照射し、紫外線硬化樹脂7の基板4側から、反
対側の紫外線照射器37は紫外線硬化樹脂7の基板1側
から硬化させていく。
Unlike the conventional process shown in FIG. 2D, when the ultraviolet curable resin 7 is cured, as shown in FIG.
This is performed by using an apparatus having a structure including ultraviolet irradiators 35 and 37. The ultraviolet ray irradiator 35 irradiates the ultraviolet ray curable resin 7 through the substrate 4, and the ultraviolet ray irradiator 37 on the opposite side cures the ultraviolet ray curable resin 7 from the substrate 4 side and from the substrate 1 side of the ultraviolet ray curable resin 7.

【0145】紫外線硬化樹脂7を硬化させる際、紫外線
照射器35、37を一定時間づつ交互、もしくは同時に
照射する。これにより、紫外線硬化樹脂7は基板1及び
4両側からほぼ均等に硬化収縮していき、紫外線硬化樹
脂7の不均一な硬化収縮に起因する基板1及び4の反り
がなくなる。
When the ultraviolet curable resin 7 is cured, the ultraviolet irradiators 35 and 37 are alternately or simultaneously irradiated for a fixed period of time. As a result, the ultraviolet curable resin 7 cures and contracts substantially evenly from both sides of the substrates 1 and 4, and the warpage of the substrates 1 and 4 due to the uneven curing contraction of the ultraviolet curable resin 7 is eliminated.

【0146】以上の方法により、紫外線硬化樹脂7によ
って第1の基板1と第2の基板4を一体とし、なおか
つ、反り量の少ない光ディスクが得られる。
By the above method, an optical disk can be obtained in which the first substrate 1 and the second substrate 4 are integrated by the ultraviolet curable resin 7 and the warp amount is small.

【0147】なお、基板1及び4の紫外線の透過率が違
う場合は、紫外線照射器35、37の強度または照射時
間を調節し、紫外線硬化樹脂7の基板1側と基板4側で
照射光量を変える事で同様の効果が得られる。
When the ultraviolet transmittances of the substrates 1 and 4 are different, the intensity or irradiation time of the ultraviolet irradiators 35 and 37 is adjusted so that the irradiation light amount is adjusted between the substrate 1 side and the substrate 4 side of the ultraviolet curing resin 7. The same effect can be obtained by changing it.

【0148】また、紫外線照射器35のみを用いる場合
でも、紫外線硬化樹脂7を間に挟んだ状態で基板1及び
4を反転させるか、もしくは紫外線照射器35を紫外線
照射器37側に移動させる事で同様の効果が得られる。
Even when only the ultraviolet irradiator 35 is used, the substrates 1 and 4 may be inverted with the ultraviolet curable resin 7 sandwiched therebetween, or the ultraviolet irradiator 35 may be moved to the ultraviolet irradiator 37 side. The same effect can be obtained with.

【0149】なお、基板1もしくは基板4に、情報信号
面や反射膜が設けられていないダミーの基板を用いても
同様の効果が得られる。
The same effect can be obtained by using, as the substrate 1 or the substrate 4, a dummy substrate having no information signal surface or a reflective film.

【0150】[0150]

【発明の効果】本発明によれば、基板の中心穴に樹脂が
はみ出す事なく、美観を保った薄型基板の貼合わせディ
スクとその製造方法、製造装置を提供できる。
According to the present invention, it is possible to provide a laminating disk for a thin substrate and a manufacturing method and a manufacturing apparatus therefor, in which the resin does not squeeze out into the center hole of the substrate and the appearance is maintained.

【0151】本発明の光ディスクによれば、放射線硬化
樹脂が基板の中心穴からはみ出すことを防止するストッ
パーを備え、光ディスクのクランプ領域の少なくとも半
分の領域が樹脂で充填されているため、基板の中心穴に
樹脂がはみ出すことがなく、また、クランプ領域の強度
が高く維持され、安定なクランプが達成される。
According to the optical disc of the present invention, since the radiation curable resin is provided with the stopper for preventing the resin from protruding from the central hole of the substrate and at least half of the clamp region of the optical disc is filled with the resin, the center of the substrate is The resin does not squeeze out into the holes, and the strength of the clamp area is maintained high, so that stable clamping is achieved.

【0152】本発明の光ディスクは、ストッパとして、
基板内周部にシール剤層を形成した場合、基板に塗布し
た放射線硬化樹脂を中心穴方向に拡散させても中心穴へ
はみ出すことはなく、光ディスクをプレーヤのターンテ
ーブルに固定する際に偏芯などの支障が生じることはな
い。
The optical disc of the present invention serves as a stopper.
When the sealant layer is formed on the inner circumference of the substrate, the radiation-curable resin applied to the substrate does not protrude into the center hole even if it is diffused in the direction of the center hole. There will be no trouble.

【0153】また、基板の中心穴から硬化前の放射線硬
化樹脂を吸引することにより、基板外周部への樹脂の移
動を抑制でき、また、基板の中心穴からはみ出した樹脂
を除去できる。基板を回転させるテーブルの外径を基板
の外径よりも小さくすることによって、基板の外周端に
はみ出た樹脂がテーブルに付着することか防止される。
はみ出した放射線硬化樹脂を治具等を用いて硬化前に取
り除けば、より偏芯の少ない光ディスクが得られる。
By sucking the radiation-cured resin before curing from the center hole of the substrate, it is possible to suppress the movement of the resin to the outer peripheral portion of the substrate, and it is possible to remove the resin protruding from the center hole of the substrate. By making the outer diameter of the table for rotating the substrate smaller than the outer diameter of the substrate, it is possible to prevent the resin protruding from the outer peripheral edge of the substrate from adhering to the table.
If the protruding radiation curable resin is removed with a jig or the like before curing, an optical disc with less eccentricity can be obtained.

【0154】また、放射線硬化樹脂に耐候性のある色素
を混入させておけば、放射線硬化樹脂の脱色をめだたな
くし、貼り合わせられた基板の美観が経時変化によって
損なわれることを防ぐことができる。
If a weather-resistant dye is mixed in the radiation-curable resin, decolorization of the radiation-curable resin can be prevented, and the aesthetic appearance of the bonded substrates can be prevented from being impaired due to aging.

【0155】放射線硬化樹脂の硬化度に応じて色の濃度
の変わる放射線硬化樹脂を用いれば、色の濃度を測定し
て、貼り合わせられた基板間の放射線硬化樹脂の硬化度
を非破壊で測定でき、ある濃度で硬化を完了させること
で各光ディスクの硬化度を均一にすることができる。
If a radiation-curable resin whose color density changes depending on the degree of cure of the radiation-curable resin is used, the color density is measured and the degree of cure of the radiation-cured resin between the bonded substrates is measured nondestructively. Therefore, the curing degree of each optical disk can be made uniform by completing the curing at a certain concentration.

【0156】また、放射線樹脂を硬化させる際に、放射
線を第1と第2の基板両方を、同時もしくは片方づつ少
なくとも1回以上透過させて放射線硬化樹脂に照射する
ので、放射線硬化樹脂層が第1の基板側と第2の基板側
両方から硬化していき、放射線硬化樹脂の収縮により発
生する貼り合わされた基板の反りを防ぐことができる。
When curing the radiation-curable resin, the radiation-curable resin layer is irradiated with the radiation by transmitting the radiation through both the first and second substrates at least once at the same time or one at a time. It is possible to prevent the warp of the bonded substrates, which is caused by the shrinkage of the radiation curable resin, by curing from both the first substrate side and the second substrate side.

【図面の簡単な説明】[Brief description of drawings]

【図1】従来の光ディスクの断面図である。FIG. 1 is a cross-sectional view of a conventional optical disc.

【図2】(A)から(D)は、従来の光ディスクの製造
工程を示す斜視図である。
2A to 2D are perspective views showing a manufacturing process of a conventional optical disc.

【図3】本発明による光ディスクの実施例の断面斜視図
である。
FIG. 3 is a sectional perspective view of an embodiment of an optical disc according to the present invention.

【図4】本発明の光ディスクの基板を製造するために用
いられる射出成形装置の部分断面図である。
FIG. 4 is a partial cross-sectional view of an injection molding apparatus used for manufacturing the substrate of the optical disc of the present invention.

【図5】(A)から(D)は、本発明による光ディスク
の製造工程を示す斜視図である。
5A to 5D are perspective views showing a manufacturing process of an optical disc according to the present invention.

【図6】本発明の光ディスクを製造するために用いられ
る装置の部分断面図である。
FIG. 6 is a partial cross-sectional view of an apparatus used to manufacture the optical disc of the present invention.

【図7】本発明による光ディスクの製造工程を示す断面
図である。
FIG. 7 is a cross-sectional view showing a manufacturing process of an optical disc according to the present invention.

【図8】本発明による光ディスクの製造工程を示す斜視
図である。
FIG. 8 is a perspective view showing a manufacturing process of an optical disc according to the present invention.

【図9】本発明による光ディスクの他の実施例の断面斜
視図である。
FIG. 9 is a sectional perspective view of another embodiment of the optical disc according to the present invention.

【図10】本発明による光ディスクの更に他の実施例の
断面斜視図である。
FIG. 10 is a sectional perspective view of still another embodiment of the optical disc according to the present invention.

【図11】本発明の光ディスクの基板を製造するために
用いられる他の射出成形装置の部分断面図である。
FIG. 11 is a partial cross-sectional view of another injection molding apparatus used for manufacturing the substrate of the optical disc of the present invention.

【図12】本発明の光ディスクの基板を製造するために
用いられる更に他の射出成形装置の部分断面図である。
FIG. 12 is a partial cross-sectional view of still another injection molding apparatus used for manufacturing the substrate of the optical disc of the present invention.

【図13】(A)から(D)は、本発明による他の光デ
ィスクの製造工程を示す斜視図である。
13A to 13D are perspective views showing a manufacturing process of another optical disc according to the present invention.

【図14】本発明による光ディスクの製造工程を示す断
面斜視図である。
FIG. 14 is a sectional perspective view showing a manufacturing process of the optical disc according to the present invention.

【図15】本発明による光ディスクの製造工程を示す断
面図である。
FIG. 15 is a cross-sectional view showing the manufacturing process of the optical disc according to the present invention.

【図16】本発明による光ディスクの更に他の実施例の
断面斜視図である。
FIG. 16 is a sectional perspective view of still another embodiment of the optical disc according to the present invention.

【図17】(A)から(D)は、本発明による更に他の
他の光ディスクの製造工程を示す斜視図である。
17A to 17D are perspective views showing a manufacturing process of still another optical disc according to the present invention.

【図18】本発明による光ディスクの製造工程を示す斜
視図である。
FIG. 18 is a perspective view showing a manufacturing process of the optical disc according to the present invention.

【図19】本発明による光ディスクの製造工程を示す斜
視図である。
FIG. 19 is a perspective view showing a manufacturing process of an optical disc according to the present invention.

【符号の説明】[Explanation of symbols]

1 第1の情報信号面が形成された基板 2、5 情報信号面 3、6 反射膜 4 第2の情報信号面が形成された基板 7 放射線硬化樹脂 8及び9 溝 10 透明板 11 可動側金型 12 スタンパ 13 スタンパ取付治具 14 固定側金型 15 キャビティー 16 放射線硬化樹脂層 17 ローラ 1 Substrate on which the first information signal surface is formed 2, 5 Information signal surface 3, 6 reflective film 4 Substrate on which the second information signal surface is formed 7 Radiation curable resin 8 and 9 grooves 10 transparent plate 11 Movable mold 12 stampers 13 Stamper mounting jig 14 Fixed mold 15 cavities 16 Radiation curable resin layer 17 Laura

───────────────────────────────────────────────────── フロントページの続き (72)発明者 野田 栄 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平4−10242(JP,A) 特開 平5−20714(JP,A) 特開 平2−21438(JP,A) 特開 平2−94040(JP,A) 特開 昭62−231436(JP,A) 特開 昭63−63146(JP,A) 特開 昭62−195738(JP,A) 特開 昭63−50929(JP,A) 特開 昭63−239628(JP,A) 特開 昭63−9046(JP,A) 特開 昭63−275052(JP,A) 実開 平1−133227(JP,U) (58)調査した分野(Int.Cl.7,DB名) G11B 7/24 G11B 7/26 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sakae Noda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 4-10242 (JP, A) JP 5- 20714 (JP, A) JP-A-2-21438 (JP, A) JP-A-2-94040 (JP, A) JP-A-62-231436 (JP, A) JP-A-63-63146 (JP, A) JP-A-62-195738 (JP, A) JP-A-63-50929 (JP, A) JP-A-63-239628 (JP, A) JP-A-63-9046 (JP, A) JP-A-63-275052 (JP, A) Actual Kaihei 1-133227 (JP, U) (58) Fields surveyed (Int.Cl. 7 , DB name) G11B 7/24 G11B 7/26

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 中心穴を有する第1の基板と、 中心穴を有する第2の基板と、 該第1の基板と該第2の基板との間に形成され、該第1
の基板と該第2の基板とを貼り合わせる放射線硬化樹脂
と、 を備えた円盤状の光情報媒体であって、 該放射線硬化樹脂が該基板の穴からはみ出すことを防止
するストッパーを更に備えており、しかも、 該第1の基板と該第2の基板との間において、該光情報
媒体をクランプするためのクランプ領域の少なくとも半
分の領域は、樹脂で充填されており、 該ストッパーはシール剤層から形成されており、 該シール剤層は印刷された放射線硬化樹脂によって形成
されている、 光情報媒体。
1. A first substrate having a central hole, a second substrate having a central hole, and a first substrate formed between the first substrate and the second substrate.
A disk-shaped optical information medium, comprising: a radiation-curable resin for bonding the substrate to the second substrate, and a stopper for preventing the radiation-curable resin from protruding from the hole of the substrate. Moreover, between the first substrate and the second substrate, at least half of the clamp region for clamping the optical information medium is filled with resin , and the stopper is a sealant. Formed of a layer, the sealant layer being formed by a printed radiation curable resin
Optical information media that are being used .
【請求項2】 中心穴を有する第1の基板と、 中心穴を有する第2の基板と、 該第1の基板と該第2の基板との間に形成され、該第1
の基板と該第2の基板とを貼り合わせる放射線硬化樹脂
と、 を備えた円盤状の光情報媒体であって、 該放射線硬化樹脂が該基板の穴からはみ出すことを防止
するストッパーを更に備えており、しかも、 該第1の基板と該第2の基板との間において、該光情報
媒体をクランプするためのクランプ領域の少なくとも半
分の領域は、樹脂で充填されており、 該ストッパーはシール剤層から形成されており、 該シール剤層はホットメルト剤から形成されている、
情報媒体。
2. A first substrate having a central hole, a second substrate having a central hole, and a first substrate formed between the first substrate and the second substrate.
A disk-shaped optical information medium, comprising: a radiation-curable resin for bonding the substrate to the second substrate, and a stopper for preventing the radiation-curable resin from protruding from the hole of the substrate. Moreover, between the first substrate and the second substrate, at least half of the clamp region for clamping the optical information medium is filled with resin , and the stopper is a sealant. An optical information medium , which is formed of a layer , and the sealant layer is formed of a hot melt agent .
【請求項3】 中心穴を有する第1の基板と第2の基板
の間に、放射線硬化樹脂を形成して第1と第2の基板を
一体とした光情報媒体製造方法であって、 基板内周部に未硬化時の粘度が、基板外周部に形成され
る放射線硬化樹脂のものより高い放射線硬化樹脂を用い
てシール剤層を形成し、該第1の基板または該第2の基
板を透過する放射線により該放射線硬化樹脂を硬化させ
て、該第1の基板と該第2の基板をり合わせる光情報
媒体製造方法。
3. A method for manufacturing an optical information medium in which a radiation curable resin is formed between a first substrate and a second substrate having a central hole to integrate the first and second substrates, the substrate comprising: A sealant layer is formed on the inner peripheral portion of the substrate by using a radiation curable resin having a viscosity when uncured is higher than that of the radiation curable resin formed on the outer peripheral portion of the substrate, and the first substrate or the second substrate is formed. curing the radiation curable resin by radiation transmitted, an optical information medium manufacturing method to align Ri bonded to said first substrate and the second substrate.
【請求項4】 中心穴を有する第1の基板と第2の基板
の間に放射線硬化樹脂を形成して該第1の基板と該第2
の基板とをり合わせる光情報媒体製造方法であって、 該基板の内周部に放射線硬化樹脂を印刷することによっ
てシール剤層を形成し、第1または第2の基板を透過す
る放射線により放射線硬化樹脂を硬化させて、該第1の
基板と該第2の基板とをり合わせる光情報媒体製造方
法。
4. A radiation curable resin is formed between a first substrate having a center hole and a second substrate to form the first substrate and the second substrate.
A substrate and bonded Ri matching the optical information medium manufacturing method, to form a sealant layer by printing a radiation curable resin to the inner peripheral portion of the substrate, the radiation transmitted through the first or second substrate the radiation curable resin is cured, the optical information medium manufacturing method combining Ri stuck to the substrate of the substrate and the second first.
【請求項5】 中心穴を有する第1の基板と第2の基板
の間に、放射線硬化樹脂を形成して該第1の基板と該第
2の基板とをり合わせる光情報媒体製造方法であっ
て、 ホットメルト剤を用いて該基板の内周部にシール剤層を
形成し、該放射線硬化樹脂と該シール剤層を挟んで該第
1の基板と該第2の基板を押圧した後、該第1の基板ま
たは該第2の基板を透過する放射線によって該放射線硬
化樹脂を硬化させて、該第1の基板と該第2の基板とを
り合わせる光情報媒体製造方法。
Between the first substrate and a second substrate having a 5. A center hole, an optical information medium manufacturing method combining Ri stuck to the substrate of the substrate and the second first forming a radiation-curable resin A sealant layer is formed on the inner peripheral portion of the substrate using a hot melt agent, and the radiation curable resin and the sealant layer are sandwiched between the first substrate and the second substrate. Then, the radiation-curable resin is cured by the radiation that passes through the first substrate or the second substrate to separate the first substrate and the second substrate.
The optical information medium manufacturing method is laminated Ri.
JP02709896A 1995-02-15 1996-02-14 Optical information medium and method for manufacturing optical information medium Expired - Fee Related JP3375478B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02709896A JP3375478B2 (en) 1995-02-15 1996-02-14 Optical information medium and method for manufacturing optical information medium

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2708695 1995-02-15
JP5893495 1995-03-17
JP7-58933 1995-03-17
JP5893395 1995-03-17
JP7-27086 1995-03-17
JP7-58934 1995-03-17
JP02709896A JP3375478B2 (en) 1995-02-15 1996-02-14 Optical information medium and method for manufacturing optical information medium

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2002306289A Division JP2003123319A (en) 1995-02-15 2002-10-21 Optical information medium, method of manufacturing optical information medium and apparatus for manufacturing optical information medium

Publications (2)

Publication Number Publication Date
JPH08321074A JPH08321074A (en) 1996-12-03
JP3375478B2 true JP3375478B2 (en) 2003-02-10

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Country Link
JP (1) JP3375478B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209980A (en) 2000-01-26 2001-08-03 Matsushita Electric Ind Co Ltd Method and device for production of optical information recording medium
TW591654B (en) * 2000-09-12 2004-06-11 Matsushita Electric Ind Co Ltd Manufacturing method of optical information recording medium
JP2002117584A (en) * 2000-10-06 2002-04-19 Sony Corp Optical recording medium and its manufacturing method
KR20040031392A (en) * 2002-10-05 2004-04-13 삼성전자주식회사 Optical disk and manufacturing the same
JP2010244625A (en) * 2009-04-07 2010-10-28 Taiyo Yuden Co Ltd Multilayer optical information recording medium
JP2011222087A (en) * 2010-04-09 2011-11-04 Mitsubishi Kagaku Media Co Ltd Manufacturing method of optical recording medium and manufacturing equipment of the same
JP7092508B2 (en) * 2018-01-26 2022-06-28 株式会社Screenホールディングス Application method
CN112172308B (en) * 2020-10-16 2023-09-19 安徽美高美高分子材料有限公司 Bonding equipment of multilayer acrylic board

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