JP3374835B2 - Electronic component mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for picking up electronic components of a parts feeder by using a plurality of nozzles provided on a transfer head, and transferring and mounting the electronic components on a substrate. It is about. 2. Description of the Related Art As an electronic component mounting apparatus for transferring and mounting electronic components (hereinafter referred to as "chips") on a substrate, a parts feeder is horizontally moved in a X direction or a Y direction by a moving table. The chip provided in the transfer head is vacuum-adsorbed to the lower end of the nozzle of the transfer head, picked up, and transferred and mounted at a predetermined coordinate position on the substrate. [0003] Further, as this kind of electronic component mounting apparatus, chips of a plurality of parts feeders arranged in parallel at a pitch are provided in a horizontal line at a pitch on a transfer head.
Japanese Patent Application Publication No. 3-70920 discloses a method in which a plurality of nozzles simultaneously suction a vacuum, pick up the wafer, and transfer the substrate to a substrate. The electronic component mounting apparatus of this type has the advantage that the mounting efficiency is greatly improved because a plurality of electronic components are simultaneously picked up simultaneously by three or more nozzles. [0004] By the way, bad nozzles are likely to occur in the nozzles of the transfer head. A bad nozzle is a defective nozzle that cannot normally vacuum-suck a chip due to clogging or bending of the nozzle.
Conventionally, when such a bad nozzle occurs, the use of the bad nozzle is stopped, and the chip is mounted (transferred) on the substrate using only the remaining normal nozzles. Conventionally, however, when a bad nozzle is generated, all the scheduled programs are changed, and all chips are individually picked up by other normal nozzles and transferred to a substrate. The number of pickup operations and the number of times the transfer head reciprocates between the parts feeder and the board are much larger than the planned program, and the mounting efficiency is inferior, so the transfer with three or more nozzles There was a problem that the advantages of the head could not be used. Accordingly, the present invention avoids a reduction in mounting efficiency when a bad nozzle is generated in an electronic component mounting apparatus in which chips of a plurality of parts feeders are picked up by three or more nozzles, thereby improving workability. It is an object of the present invention to provide an electronic component mounting method that can often mount a chip on a substrate. According to the electronic component mounting method of the present invention, parts feeders are arranged side by side at a pitch, and three or more parts feeders are arranged at a pitch of an integral multiple of the pitch on a transfer head. The electronic component mounting method of picking up electronic components of a plurality of parts feeders by these nozzles and mounting them on a substrate positioned at a positioning unit while moving the transfer head in a horizontal direction by a moving table. If any one of the nozzles frequently makes a pick-up mistake during mounting and the control unit determines that the nozzle is a bad nozzle, mounting of the electronic component by the bad nozzle is stopped and the normal operation is stopped. Other nozzles
After performing simultaneous pick-up and distributed pick-up of electronic components as planned in the program, mount the electronic components, and after mounting as scheduled in this program
With the recovery of the mounting that was scheduled for the bad nozzle
Dispersion pickup was performed with a normal nozzle . According to the present invention having the above-described structure, when a bad nozzle is generated, the realization of electronic components by the bad nozzle is performed.
Stop reloading and program with another normal nozzle
Simultaneous pickup and distribution of electronic components as was done
After picking up and mounting electronic components, this professional
After performing the planned implementation in grams, the bad nozzle
The recovery of the implementation scheduled at
Since the pick-up operation is performed by picking up chips, minimizing the increase in the number of pickup operations and the number of times the transfer head reciprocates between the parts feeder and the substrate is minimized, and the chip is used while taking advantage of the transfer head having a plurality of nozzles. Can be efficiently mounted on a substrate. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a front view of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. Block diagram of a control system of the component mounting apparatus,
FIG. 4 is a front view of a nozzle and a parts feeder of the electronic component mounting apparatus according to one embodiment of the present invention, FIG. 5 is a sequence diagram of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 7 is an explanatory diagram of a method of picking up a chip when the electronic component mounting apparatus according to the embodiment is normal, and FIG. 7 is an explanatory diagram of a chip picking method when a bad nozzle is generated in the electronic component mounting device of the embodiment of the present invention. FIG. 8 is an explanatory diagram of another pickup method of a chip when a bad nozzle is generated in the electronic component mounting apparatus according to one embodiment of the present invention. First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. Two guide rails 2 are provided at the center of the upper surface of the base 1. The substrate 3 is transported along the guide rail 2 and is positioned at a predetermined position by the guide rail 2. That is, the guide rail 2 serves as a positioning portion for the substrate 3. On both sides of the guide rail 2, a large number of parts feeders 4 are arranged side by side in a row. Each part feeder 4 is provided with various types of chips (electronic components). Further, a first camera 5 is provided between the guide rail 2 and the parts feeder 4. The first camera 5 observes the nozzle of the transfer head and detects its position. In FIG. 1, Y tables 6A and 6B are provided on both sides of the base 1, and Y tables 6A and 6B are provided.
An X table 7 is installed on B. X table 7
Is mounted with a transfer head 8. The transfer head 8 includes a plurality of (three in this example) heads (first head 8A, second head 8A).
The head 8B and the third head 8C) are assembled in a horizontal row, and the first nozzle 9a and the second nozzle 9
b, a third nozzle 9c. Although not shown, each of the nozzles 9a, 9b, and 9c is configured so that a suction tool can be exchanged according to the size of a component or the like. Further, a second camera 10 is integrally mounted on the transfer head 8 (FIG. 2). The Y tables 6A and 6B and the X table 7 are moving tables for horizontally moving the transfer head 8 in the X direction and the Y direction. The second camera 10 horizontally moves integrally with the transfer head 8 and observes a chip provided in the parts feeder 4 to detect a pickup position of the chip. In the present invention, the direction in which the substrate is transported by the guide rail 2 is defined as the X direction. In FIG. 3, reference numeral 11 denotes a control unit to which the following elements are connected. Reference numeral 12 denotes a first recognition unit, which is connected to the first camera 5. The first recognition unit 12 performs data processing of image data of nozzles and chips obtained by the first camera 5. And control unit 1
1 is obtained by calculating the position of the nozzle or chip based on this. Reference numeral 13 denotes a second recognition unit, which is connected to the second camera 10. The second recognition unit 13 performs data processing of the position mark of the board obtained by the second camera 10 and the image data of the chip at the pickup position of the parts feeder 4. Then, the control unit 11 calculates and obtains the position of the substrate 3 and the pickup position based on this.
Reference numeral 14 denotes a transfer head driving unit, which includes a first head 8A and a second head 8A.
The head 8B is connected to the third head 8C. The transfer head drive unit 14 includes a first nozzle 9a, a second nozzle 9b,
Driving of the up / down operation of the third nozzle 9c is performed. The NC data storage unit 15 registers program data such as the mounting order and mounting position of chips. The pickup position storage unit 16 stores the parts feeder 4
Is stored. The nozzle position storage unit 17 stores the first nozzle 9 detected by the first camera 5.
a, the positions of the second nozzle 9b and the third nozzle 9c are stored. The pickup operation storage unit 18 has three nozzles 9a.
In step 9c, whether or not to pick up at the same time is stored.
The bad nozzle information storage unit 19 stores bad nozzles. The control unit 11 performs various other calculations and determinations, and controls each element. This electronic component mounting apparatus is configured as described above, and the operation will be described next. In FIG. 4, A to G
Are electronic components provided in each of the parts feeders 4a to 4g. In FIG. 4, subscripts a to g are added to the reference numeral 4 in order to distinguish a large number of parts feeders 4. In the present embodiment, the pitch P1 of each of the nozzles 9a to 9c is twice as large as the pitch P2 of the parts feeders 4a to 4g, so that the three nozzles 9a to 9c are connected to the chips of every other parts feeder. Can be picked up at the same time. In this manner, the pitch P1 of each of the nozzles 9a to 9c is an integral multiple of the pitch P2 of each of the parts feeders 4a to 4g so that the chips of the parts feeder 4 can be simultaneously picked up by the plurality of nozzles 9a to 9c. FIG. 5 is a sequence diagram in which components A to G are mounted on the board 3 in the order shown. FIG. 6 shows a normal pickup method. The number of movements is the number of times the nozzles 9a, 9b, 9c reciprocate between the parts feeder 4 and the substrate 3. In a normal state, three chips A, B, and C of sequences 1, 2, and 3 are simultaneously picked up by three nozzles 9a, 9b, and 9c at the first time, and transferred and mounted on the substrate 3. Similarly, in the second time, the chips DEF of the sequences 4, 5, and 6 are used.
Are simultaneously picked up and transferred and mounted on the substrate 3, and the chips DEF of the sequences 7, 8 and 9 are simultaneously picked up and transferred and mounted on the substrate 3 at the third time. As described above, the nine chips in the sequences 1 to 9 are mounted on the board 3 by three mounting operations. Since the pitches of the three chips B, E, and G of sequence numbers 10 to 12 are different from the pitch P1 of the nozzles 9a to 9c, as is apparent from FIG. You cannot pick it up. Therefore, these chips B, E, and G are not picked up by three nozzles 9a to 9c at the same time,
The pickups are individually picked up at a to 9c and transferred and mounted on the substrate 3. Instead of picking up a plurality of chips with a plurality of nozzles at the same time as in the above sequences 1 to 9, the sequence 10
In the present invention, picking up individually as in 〜12 is referred to as a distributed pickup. As described above, at normal time, 12 chips of sequence numbers 1 to 12 are
The substrate 3 is picked up by a total of six pickup operations of three simultaneous pickups and three dispersion pickups.
Can be implemented. Next, a pickup method in the case where a bad nozzle is generated will be described with reference to FIG. A bad nozzle is a defective nozzle for which a chip cannot be picked up for some reason as described above. As a method of detecting a bad nozzle, a general method is to detect a nozzle that frequently generates a pick-up error and use this nozzle as a bad nozzle. As a method of detecting a pick-up error, for example, first, the first camera 5 observes the lower end of the nozzle to check whether or not the chip is suctioned by vacuum. The second method is to measure the internal pressure of the nozzle with a pressure sensor (if the chip is vacuum-adsorbed at the lower end of the nozzle, the internal pressure of the nozzle becomes a negative pressure below the threshold, and the chip is vacuum-adsorbed. Otherwise, the negative pressure does not fall below the threshold). When the number of consecutive pickup errors by the same nozzle reaches a predetermined number, or when the pickup error rate reaches a predetermined value, this nozzle is regarded as a bad nozzle. The control unit 11 determines whether or not the nozzle is a bad nozzle, and the bad nozzle is stored in the bad nozzle information storage unit 19. FIG. 7 shows a pickup method when the second nozzle 9b is determined to be a bad nozzle. In this case, since the second nozzle 9b cannot be used as a bad nozzle, mounting is performed with the remaining first nozzle 9a and third nozzle 9c. In other words, the first to third simultaneous pickups and the fourth dispersion pickup are performed by the normal first and third nozzles 9a and 9c as scheduled in the program (that is, as in the case of FIG. 6). Do. Therefore, the first to fourth mounting of the chips B, E, E, E scheduled by the second nozzle 9b is not performed, and these chips B, E, E, E are left behind. As described above, after the first to fourth mountings are performed as planned, the recovery of the mounting planned for the second nozzle b is performed by the first nozzle 9a and the third nozzle 9c. I do. That is, the chip B is dispersed and picked up by the first nozzle 9a and the chip E by the third nozzle 9c and mounted on the substrate 3 at the fifth time, and then the chip E is discharged at the sixth time by the first nozzle 9a and the third time. Tip E with nozzle 9c
Are distributed and picked up and mounted on the substrate 3. As described above, according to the method described in FIG. 7, three simultaneous pickups from the first to the third times are convenient, and six distributed pickups from the fourth to the sixth times are convenient, a total of nine times. By the pickup operation, 12 chips can be picked up and mounted on the substrate 3. FIG. 8 shows a conventional pickup method, that is, a pickup method when the method according to the present invention shown in FIG. 7 is not used. In this case, the dispersion pickup is performed in all of the first to sixth times, so that
Two pickup operations are required. Therefore, FIG.
In this case, the pickup operation must be performed three times more than in the case (1), so that the tact time becomes longer and the mounting efficiency decreases. According to the present invention, when a bad nozzle occurs , mounting of the electronic component by the bad nozzle is stopped.
And is programmed by another normal nozzle
Simultaneous pick-up and distributed pick-up of electronic components
To mount electronic components, and use this program
After performing the planned implementation,
Pick up the recovery of the mounted mounting with a normal nozzle
Are performed in up to minimize the increase in the number of times and transfer head of the pick-up operation is reciprocally moved between the parts feeder and the substrate, while taking advantage of the transfer head having a plurality of nozzles, the tip It can be efficiently mounted on a substrate.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a front view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 4 is a front view of a nozzle and a parts feeder of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 6 is a sequence diagram of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is an explanatory diagram of a chip pickup method when the electronic component mounting apparatus according to the embodiment of the present invention is normal. FIG. FIG. 8 is an explanatory view of a method of picking up a chip when a bad nozzle is generated by the component mounting apparatus. FIG. 8 is an explanatory view of another method of picking up a chip when a bad nozzle is generated by the electronic component mounting apparatus according to one embodiment of the present invention. Explanation] 2 Guide rail 3 Board 4 Tsufida 5 first camera 8 transfer head 9a first nozzle 9b third nozzle 10 second camera 18 pickup operation storage unit 19 bad nozzle information storage unit the second nozzle 9c

Continuation of the front page (56) References JP-A-7-297593 (JP, A) JP-A-7-193397 (JP, A) JP-A-3-201600 (JP, A) JP-A-3-160794 (JP) JP-A-62-155599 (JP, A) JP-A-5-145276 (JP, A) JP-A-61-264788 (JP, A) JP-A-3-203296 (JP, A) 3-78300 (JP, A) JP-A-58-191494 (JP, A) JP-A-2-56499 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (1)

(57) [Claims] [Claim 1] Parts feeders are arranged side by side at a pitch,
In addition, the transfer head is provided with three or more nozzles at a pitch of an integral multiple of the pitch, and while the transfer head is moved in the horizontal direction by the moving table, the electronic components of a plurality of parts feeders are moved by these nozzles. An electronic component mounting method for picking up and mounting on a substrate positioned at a positioning unit, wherein one of the nozzles frequently makes a pick-up mistake during mounting, and the control unit determines that the nozzle is a bad nozzle. In this case, the mounting of the electronic component by this bad nozzle is stopped, and the program
The electronic components are mounted by performing simultaneous pickup and distributed pickup of electronic components as scheduled in
After implementing the planned implementation in the program
Normal nozzle recovery for scheduled mounting at the nozzle
An electronic component mounting method characterized in that the electronic components are picked up in a distributed manner.