JP3373420B2 - Carrier tape, its manufacturing method, its manufacturing apparatus, and carrier tape body - Google Patents

Carrier tape, its manufacturing method, its manufacturing apparatus, and carrier tape body

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Publication number
JP3373420B2
JP3373420B2 JP02845598A JP2845598A JP3373420B2 JP 3373420 B2 JP3373420 B2 JP 3373420B2 JP 02845598 A JP02845598 A JP 02845598A JP 2845598 A JP2845598 A JP 2845598A JP 3373420 B2 JP3373420 B2 JP 3373420B2
Authority
JP
Japan
Prior art keywords
carrier tape
recess
base material
hole
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP02845598A
Other languages
Japanese (ja)
Other versions
JPH11227870A (en
Inventor
川 文 広 平
藤 晃 斉
Original Assignee
株式会社 東京ウエルズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 東京ウエルズ filed Critical 株式会社 東京ウエルズ
Priority to JP02845598A priority Critical patent/JP3373420B2/en
Priority to TW088100416A priority patent/TW400301B/en
Priority to KR1019990001398A priority patent/KR19990072280A/en
Publication of JPH11227870A publication Critical patent/JPH11227870A/en
Application granted granted Critical
Publication of JP3373420B2 publication Critical patent/JP3373420B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は電子部品を収納して
搬送するキャリアテープ、その製造方法、その製造装置
および電子部品とキャリアとからなるキャリアテープ体
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape for accommodating and carrying electronic components, a method for producing the same, an apparatus for producing the same, and a carrier tape body comprising electronic components and a carrier.

【０００２】[0002]

【従来の技術】従来、電子部品を収納して搬送するキャ
リアテープとして、プラスチック製基材に凹部を成形
し、この凹部内に電子部品を収納するものが知られてい
る。2. Description of the Related Art Conventionally, as a carrier tape for accommodating and carrying electronic components, there is known a carrier tape in which a recess is formed in a plastic base material and the electronic component is accommodated in the recess.

【０００３】また他のキャリアテープとして厚紙製の基
材に貫通穴を成形し、この貫通孔内に電子部品を収納し
た状態で基材の両面に蓋材を取付けたものが知られてい
る。As another carrier tape, there is known one in which a through hole is formed in a base material made of cardboard, and a lid material is attached to both surfaces of the base material while the electronic parts are accommodated in the through hole.

【０００４】[0004]

【発明が解決しようとする課題】上述のように厚紙製基
材からキャリアテープを作製したものが知られている。
この場合、基材の両面に蓋材を取付けているが、基材の
両面に蓋材を取付けることは煩雑となる。It is known that a carrier tape is produced from a cardboard base material as described above.
In this case, although the lid material is attached to both sides of the base material, attaching the lid material to both sides of the base material becomes complicated.

【０００５】本発明はこのような点を考慮してなされた
ものであり、基材の片面だけ蓋材を取付ける構造が簡単
なキャリアテープ、その製造方法、その製造装置および
キャリアテープを提供することを目的とする。The present invention has been made in view of the above points, and provides a carrier tape having a simple structure for attaching a lid member on only one side of a base material, a manufacturing method thereof, an apparatus for manufacturing the same, and a carrier tape. With the goal.

【０００６】[0006]

【課題を解決するための手段】本発明は、一方の型と、
一方の型との間で基材を圧縮挾持する他方の型とを備
え、一方の型または他方の型のいずれかに、基材に対し
て内容物収納用の凹部を成形するパンチを当該型に対し
て進退自在に設け、このパンチはその先端に凹部内の内
容物よりも小さな形状の貫通孔を凹部に形成する突起を
有することを特徴とするキャリアテープ製造装置、およ
び一方の型と他方の型との間で基材を挾持する工程と、
一方の型または他方の型のいずれかからパンチを進行さ
せて、基材に対して内容物よりも小さな形状の貫通孔を
有する内容物収納用の凹部を成形する工程と、を備えた
ことを特徴とするキャリアテープ製造方法である。SUMMARY OF THE INVENTION The present invention comprises one mold,
A mold for holding a base material between one mold and the other mold, and a punch for molding a concave portion for storing contents in the base material is formed in the one mold or the other mold. The carrier tape manufacturing apparatus is characterized in that the punch has a projection for forming a through hole having a shape smaller than the content in the recess in the recess at the tip thereof, and one die and the other. Holding the base material between the mold and
Advancing a punch from either one of the molds and the other mold to form a concave portion for storing the content having a through hole having a shape smaller than the content with respect to the base material. It is a characteristic carrier tape manufacturing method.

【０００７】本発明によれば、厚紙製基板の一面を平坦
状に保ち他面に凹部を形成するとともに、凹部の底面に
内容物より小さな形状の貫通孔を設けることによりキャ
リアテープを作製し、このキャリアテープの凹部内に内
容物を収納する。この場合、凹部の底面に貫通孔を設け
たので、内容物を凹部内に収納する際、凹部内の空気が
貫通孔から外部へ流出するため、内容物の収納作業が容
易となる。次に基材の他面に凹部開口を覆う蓋材を設け
る。このようにしてキャリアテープ体が得られる。According to the present invention, a carrier tape is manufactured by keeping one surface of a cardboard substrate flat and forming a recess on the other surface, and providing a through hole having a shape smaller than the content on the bottom surface of the recess. Contents are stored in the recesses of the carrier tape. In this case, since the through hole is provided in the bottom surface of the recess, when the contents are stored in the recess, the air in the recess flows out from the through hole to the outside, which facilitates the storage work of the contents. Next, a lid member that covers the opening of the recess is provided on the other surface of the base material. In this way, a carrier tape body is obtained.

【０００８】[0008]

【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図１乃至図３、および図６
乃至図７は本発明の一実施の形態を示す図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 and 6
7 to 7 are diagrams showing an embodiment of the present invention.

【０００９】まず図２および図３によりキャリアテープ
体全体について説明する。図２および図３に示すよう
に、キャリアテープ体２０は厚紙製の基材１０ａからな
り凹部１４が形成されたキャリアテープ１０と、凹部１
４内に収納された例えば実装部品等の電子部品１５と、
凹部１４開口を覆う蓋材２１とを備えている。First, the entire carrier tape body will be described with reference to FIGS. As shown in FIGS. 2 and 3, the carrier tape body 20 includes a carrier tape 10 formed of a base material 10 a made of cardboard and having a concave portion 14, and a concave portion 1.
An electronic component 15 such as a mounted component housed in
A lid member 21 that covers the opening of the recess 14 is provided.

【００１０】このうちキャリアテープ１０は、例えば厚
さ０．４３mmの厚紙製基材１０ａからなっている。また
キャリアテープ１０は基材１０ａの一面１６が平坦状に
保たれており、凹部１４は基材１０ａの他面１７に、他
面１７から基材１０ａの内部まで達するように形成され
ている。Of these, the carrier tape 10 comprises a cardboard base material 10a having a thickness of 0.43 mm, for example. Further, one surface 16 of the base material 10a of the carrier tape 10 is kept flat, and the concave portion 14 is formed on the other surface 17 of the base material 10a so as to reach from the other surface 17 to the inside of the base material 10a.

【００１１】また基材１０ａの底面１４ａに、電子部品
１５よりも小さな形状の貫通孔１８が形成されている。
この貫通孔１８は凹部１４から基材１０ａの一面１６ま
で達しており、後述のように凹部１４内に電子部品１５
を収納する際、凹部１４内の空気が貫通孔１８から外部
へ流出するため電子部品１５の収納作業が容易となって
いる。A through hole 18 having a shape smaller than that of the electronic component 15 is formed on the bottom surface 14a of the base material 10a.
The through hole 18 extends from the recess 14 to the one surface 16 of the substrate 10a, and the electronic component 15 is provided in the recess 14 as described later.
When storing the electronic component 15, the air in the recess 14 flows out from the through hole 18 to the outside, so that the electronic component 15 can be easily stored.

【００１２】さらに蓋材２１は基材１０ａの他面１７側
に取付けられており、電子部品１５が収納された凹部１
４の開口を覆っている。この蓋材２１は例えばプラスチ
ック製または紙製となっており、基材１０ａの他面１７
に熱圧着のような方法により貼着されている。Further, the lid member 21 is attached to the other surface 17 side of the base material 10a, and the concave portion 1 in which the electronic component 15 is housed.
It covers the opening of No. 4. The lid member 21 is made of, for example, plastic or paper, and the other surface 17 of the base material 10a.
It is attached by a method such as thermocompression bonding.

【００１３】なお、図２においてキャリアテープ１０の
基材１０ａのうち凹部１４以外の部分に、搬送用開口孔
２２が設けられている。In FIG. 2, a carrier opening 10 is provided in a portion of the base material 10a of the carrier tape 10 other than the concave portion 14.

【００１４】次にキャリアテープの製造装置について図
１により述べる。図１に示すように、キャリアテープの
製造装置は上型１１と、上型１１との間で厚紙基板１０
ａを挾持する下型１２とを備えている。このうち上型１
１には、基材１０ａを圧縮して基材１０ａに凹部１４を
成形するパンチ１３が上下方向に進退自在に設けられて
いる。このパンチ１３は下端に突起１３ａを有し、パン
チ１３の突起１３ａが下型１２の溝部１２ａ内に進入す
ることによりパンチ１３が凹部１４を成形する際、同時
に突起１３ａによって貫通孔１８が形成される。Next, a carrier tape manufacturing apparatus will be described with reference to FIG. As shown in FIG. 1, the carrier tape manufacturing apparatus includes an upper mold 11 and a cardboard substrate 10 between the upper mold 11.
and a lower mold 12 that holds a. Upper mold 1
1, a punch 13 for compressing the base material 10a to form a recess 14 in the base material 10a is provided so as to be vertically movable. The punch 13 has a protrusion 13a at the lower end, and when the punch 13 forms a recess 14 by the protrusion 13a of the punch 13 entering into the groove 12a of the lower die 12, a through hole 18 is simultaneously formed by the protrusion 13a. It

【００１５】図１において、まず下型１２上に基材１０
ａが載置され、この基材１０ａに対して上型１１が押し
付けられる。このようにして上型１１と下型１２との間
で基材１０ａが挾持される。その後、上型１１に設けら
れたパンチ１３が降下し、このパンチ１３によって基材
１０ａが約０．０６mmまで圧縮されて底面１４ａを有す
る凹部１４が成形される。同時にパンチ１３の突起１３
ａが下型１２の溝部１２ａ内に進入して突起１３ａによ
って貫通孔１８が形成され、このようにして凹部１４を
有するキャリアテープ１０が作製される。In FIG. 1, first, a substrate 10 is placed on a lower mold 12.
a is placed, and the upper mold 11 is pressed against the base material 10a. In this way, the base material 10a is held between the upper mold 11 and the lower mold 12. After that, the punch 13 provided on the upper die 11 descends, the base material 10a is compressed by the punch 13 to about 0.06 mm, and the concave portion 14 having the bottom surface 14a is formed. At the same time, the protrusion 13 of the punch 13
a enters into the groove 12a of the lower die 12 to form the through hole 18 by the protrusion 13a, and thus the carrier tape 10 having the recess 14 is manufactured.

【００１６】次にキャリアテープ１０の凹部１４内に電
子部品１５が収納される。ここで図６により、キャリア
テープ１０の凹部１４内に電子部品１５を収納する作業
について説明する。図６に示すように、まずキャリアテ
ープ１０が連通孔２６ａを有する載置台２６上に載置さ
れる。このとき、キャリアテープ１０は凹部１４の貫通
孔１８が貫通孔２６ａの直上に来るよう載置台２６上に
載置される。Next, the electronic component 15 is housed in the recess 14 of the carrier tape 10. Here, the operation of housing the electronic component 15 in the concave portion 14 of the carrier tape 10 will be described with reference to FIG. As shown in FIG. 6, first, the carrier tape 10 is mounted on the mounting table 26 having the communication holes 26a. At this time, the carrier tape 10 is mounted on the mounting table 26 so that the through hole 18 of the recess 14 is directly above the through hole 26a.

【００１７】この状態で電子部品１５が装着装置２５に
吸着されながらキャリアテープ１０の凹部１４上に達
し、この装着装置２５が降下して電子部品１５を凹部１
４内に収納する。このとき凹部１４内の空気が貫通孔１
８および連通孔２６ａを介して外部へ放出されるため、
凹部１４内への電子部品１５の収納作業をスムースに行
なうことができる。In this state, the electronic component 15 reaches the recess 14 of the carrier tape 10 while being adsorbed by the mounting device 25, and the mounting device 25 descends to mount the electronic component 15 in the recess 1.
Store in 4 At this time, the air inside the recess 14 is
8 and the communication hole 26a, it is released to the outside,
The work of housing the electronic component 15 in the recess 14 can be smoothly performed.

【００１８】すなわち電子部品１５はきわめて軽量とな
っているため、凹部１４の底面１４ａが密閉されている
と、凹部１４内の空気が抵抗となって電子部品１５の収
納に手間どることも考えられる。これに対して本発明に
よれば、凹部１４内の空気を貫通孔１８および連通孔２
６ａを介して外部へ放出することにより凹部１４内から
の抵抗も少なくなり、電子部品１５の収納が容易とな
る。That is, since the electronic component 15 is extremely light weight, if the bottom surface 14a of the recess 14 is sealed, the air in the recess 14 may become a resistance and it may be troublesome to store the electronic component 15. . On the other hand, according to the present invention, the air in the concave portion 14 is made to flow through the through hole 18 and the communication hole
By releasing it via the 6a to the outside, the resistance from inside the recess 14 is also reduced, and the electronic component 15 can be stored easily.

【００１９】次にキャリアテープ１０の基材１０ａの他
面１７に蓋材２１が貼着され、このようにして図３に示
すように、電子部品１５を収納したキャリアテープ１０
と、蓋材２１とからキャリアテープ体２０が得られる。Next, the lid member 21 is adhered to the other surface 17 of the base material 10a of the carrier tape 10, and thus, as shown in FIG.
Then, the carrier tape body 20 is obtained from the lid member 21.

【００２０】なお、図６において電子部品１５を凹部１
４内に収納する際、凹部１４内の空気をキャリアテープ
１０の貫通孔１８および載置台２６の連通孔２６ａを介
して外方へ放出した例について説明したが、これに限ら
ず図７に示すように載置台２６の連通孔２６ａに吸引ラ
イン２７を介して吸引装置（図示せず）を連結し、この
吸引装置によって貫通孔１８および連通孔２６ａを介し
て凹部１４内を吸引してもよい。凹部１４内を吸引した
場合は、凹部１４内に電子部品１５をより安定して収納
し保持することができる。Incidentally, in FIG.
An example in which the air in the recess 14 is discharged outward through the through hole 18 of the carrier tape 10 and the communication hole 26a of the mounting table 26 when stored in the housing 4 is described above, but the present invention is not limited to this and is shown in FIG. As described above, a suction device (not shown) may be connected to the communication hole 26a of the mounting table 26 via the suction line 27, and the inside of the recess 14 may be suctioned by this suction device via the through hole 18 and the communication hole 26a. . When the inside of the recess 14 is sucked, the electronic component 15 can be more stably stored and held in the recess 14.

【００２１】以上のように、本発明の実施の形態によれ
ば、凹部１４は底面１４ａを有するので、基材１０ａの
他面１７のみに蓋材２１を貼着すれば良い。このため基
材１０ａの両面１６，１７に蓋材２１を貼着する必要は
なく、容易かつ簡単にキャリアテープ体２０を製造する
ことができる。また凹部１４の底面１４ａに貫通孔１８
を設けたので、電子部品１５を凹部１４内に収納する場
合、凹部１４内の空気が貫通孔１８から外部へ流出する
ため凹部１４内の空気が抵抗となることはなく、電子部
品１４の収納作業が容易となる。As described above, according to the embodiment of the present invention, since the concave portion 14 has the bottom surface 14a, the lid member 21 may be attached only to the other surface 17 of the base material 10a. Therefore, it is not necessary to attach the lid member 21 to both surfaces 16 and 17 of the base material 10a, and the carrier tape body 20 can be easily and easily manufactured. Further, the bottom surface 14a of the recess 14 has a through hole 18
Therefore, when the electronic component 15 is stored in the recess 14, the air in the recess 14 does not become a resistance because the air in the recess 14 flows out to the outside from the through hole 18, and the electronic component 14 is stored. Work becomes easy.

【００２２】さらにまた、キャリアテープ１０から蓋材
２１を剥離してキャリアテープ１０の凹部１４から電子
部品１５を取出し実装作業を行なった後は、このキャリ
アテープ１０は不要となる。この場合、キャリアテープ
１０は厚紙製基材からなっているため、プラスチック材
料を用いた場合と比較してキャリアテープ１０の再生が
容易となる。Furthermore, after the lid member 21 is peeled from the carrier tape 10 and the electronic component 15 is taken out from the recess 14 of the carrier tape 10 and the mounting work is performed, the carrier tape 10 becomes unnecessary. In this case, since the carrier tape 10 is made of a cardboard base material, the carrier tape 10 can be easily reproduced as compared with the case where a plastic material is used.

【００２３】次に図４および図５により他の実施の形態
について説明する。Next, another embodiment will be described with reference to FIGS.

【００２４】図４および図５に示すように、基材１０ａ
の凹部１４は、その断面が開口側に向って拡大する逆台
形状となっていてもよい（図４）。As shown in FIGS. 4 and 5, the substrate 10a
The recess 14 may have an inverted trapezoidal shape whose cross section expands toward the opening side (FIG. 4).

【００２５】また基材１０ａの凹部１４は、その開口周
縁が面取りされていても良い（図５）。The opening 14 of the recess 14 of the substrate 10a may be chamfered (FIG. 5).

【００２６】[0026]

【発明の効果】以上のように本発明よれば、厚紙製の基
材からなるキャリアテープの凹部内に内容物を収納し、
基材の他面に凹部開口を覆う蓋材を設けることにより、
キャリアテープ体を容易に得ることができる。この場
合、凹部は底面を有するので、基材の他面に蓋材を設け
る必要はなくなる。このためキャリアテープ体を容易に
製造することができる。また、凹部の底面には貫通孔が
設けられているので、内容物を凹部内に収納する際、凹
部内の空気が貫通孔から外部へ放出されるため、内容物
の収納作業が容易となる。さらにまたキャリアテープか
ら蓋材を剥離して凹部から内容物を取り出した後は、厚
紙製基材からなるキャリアテープの再生が容易となる。As described above, according to the present invention, the contents are stored in the concave portion of the carrier tape made of a cardboard base material,
By providing a lid material that covers the recess opening on the other surface of the base material,
The carrier tape body can be easily obtained. In this case, since the concave portion has the bottom surface, it is not necessary to provide the lid member on the other surface of the base material. Therefore, the carrier tape body can be easily manufactured. Further, since the through hole is provided in the bottom surface of the recess, when the contents are stored in the recess, the air in the recess is released to the outside from the through hole, which facilitates the storage work of the contents. . Furthermore, after the cover material is peeled from the carrier tape and the contents are taken out from the concave portion, the carrier tape made of the cardboard base material can be easily regenerated.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明によるキャリアテープの製造装置を示す
図。FIG. 1 is a diagram showing an apparatus for manufacturing a carrier tape according to the present invention.

【図２】本発明によるキャリアテープ体を示す平面図。FIG. 2 is a plan view showing a carrier tape body according to the present invention.

【図３】本発明によるキャリアテープ体を示す側断面
図。FIG. 3 is a side sectional view showing a carrier tape body according to the present invention.

【図４】本発明によるキャリアテープ体の他の実施の形
態を示す図。FIG. 4 is a diagram showing another embodiment of the carrier tape body according to the present invention.

【図５】本発明によるキャリアテープ体の他の実施の形
態を示す図。FIG. 5 is a view showing another embodiment of the carrier tape body according to the present invention.

【図６】キャリアテープの凹部内へ電子部品を収納する
作業を示す図。FIG. 6 is a diagram showing a work of storing an electronic component in a concave portion of a carrier tape.

【図７】キャリアテープの凹部内へ電子部品を収納する
他の作業を示す図。FIG. 7 is a diagram showing another operation of housing the electronic component in the recess of the carrier tape.

【符号の説明】[Explanation of symbols]

１０ キャリアテープ １０ａ 基材 １１ 上型 １２ 下型 １２ａ 溝部 １３ パンチ １３ａ 突起 １４ 凹部 １５ 電子部品 １６ 一面 １７ 他面 １８ 貫通孔 ２０ キャリアテープ体 ２１ 蓋材 ２５ 装着装置 ２６ 載置台 ２６ａ 連通孔 10 carrier tape 10a base material 11 Upper mold 12 Lower mold 12a groove 13 punches 13a protrusion 14 recess 15 Electronic components 16 One side 17 Other side 18 through holes 20 Carrier tape body 21 lid material 25 Mounting device 26 table 26a communication hole

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−142153（ＪＰ，Ａ) 特開 平７−88949（ＪＰ，Ａ) 特開 平８−40458（ＪＰ，Ａ) 特開 平９−169386（ＪＰ，Ａ) 特開 平１−316198（ＪＰ，Ａ) 特開 昭59−156713（ＪＰ，Ａ) 特開 平９−216659（ＪＰ，Ａ) 実開 平１−93737（ＪＰ，Ｕ) 実開 昭63−183067（ＪＰ，Ｕ) 実開 昭60−22896（ＪＰ，Ｕ) 実開 平４−38975（ＪＰ，Ｕ) 登録実用新案3028216（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B65D 85/86 B65B 15/04 ＢＥＩＬＳＴＥＩＮ（ＳＴＮ)─────────────────────────────────────────────────── --Continued from the front page (56) References JP 61-142153 (JP, A) JP 7-88949 (JP, A) JP 8-40458 (JP, A) JP 9- 169386 (JP, A) JP-A-1-316198 (JP, A) JP-A-59-156713 (JP, A) JP-A-9-216659 (JP, A) Actual development 1-93737 (JP, U) Actually open 63-183067 (JP, U) Actually open 60-22896 (JP, U) Actually open 4-38975 (JP, U) Registered utility model 3028216 (JP, U) (58) Fields investigated (Int .Cl. 7 , DB name) B65D 85/86 B65B 15/04 BEILSTEIN (STN)

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】一方の型と、 一方の型との間で厚紙製の基材を圧縮挾持する他方の型
とを備え、 一方の型または他方の型のいずれかに、厚紙製の基材に
対して内容物収納用の凹部を成形するパンチを当該型に
対して進退自在に設け、このパンチはその先端に凹部内
の内容物よりも小さな形状の貫通孔を凹部に形成する突
起を有することを特徴とするキャリアテープ製造装置。1. A cardboard base material, comprising one mold and the other mold that holds a cardboard base material between the one mold and the other mold by compression. A punch for forming a recess for storing contents is provided so as to be movable back and forth with respect to the mold, and the punch has a projection at the tip thereof for forming a through hole having a shape smaller than the contents in the recess in the recess. A carrier tape manufacturing apparatus characterized by the above. 【請求項２】一方の型と他方の型との間で厚紙製の基材
を挾持する工程と、 一方の型または他方の型のいずれかから先端に突起を有
するパンチを進行させて、突起を厚紙製基材に貫通させ
て厚紙製の基材に対して内容物よりも小さな形状の貫通
孔を形成するとともに、パンチにより内容物収納用の凹
部を成形する工程と、 を備えたことを特徴とするキャリアテープ製造方法。2. A step of holding a base material made of cardboard between one die and the other die, and a punch having a tip at the tip is advanced from either the one die or the other die to form a protrusion. Through a cardboard base material to form a through-hole having a smaller shape than the content in the cardboard base material, and forming a recess for storing the content with a punch. Characteristic carrier tape manufacturing method.
JP02845598A 1998-02-10 1998-02-10 Carrier tape, its manufacturing method, its manufacturing apparatus, and carrier tape body Expired - Lifetime JP3373420B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP02845598A JP3373420B2 (en) 1998-02-10 1998-02-10 Carrier tape, its manufacturing method, its manufacturing apparatus, and carrier tape body
TW088100416A TW400301B (en) 1998-02-10 1999-01-12 Carrier tape, method and apparatus for manufacturing thereof, and carrier tape body
KR1019990001398A KR19990072280A (en) 1998-02-10 1999-01-19 Carrier tape, a method and an apparatus of manufacturing it, and carrier tape assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02845598A JP3373420B2 (en) 1998-02-10 1998-02-10 Carrier tape, its manufacturing method, its manufacturing apparatus, and carrier tape body

Publications (2)

Publication Number Publication Date
JPH11227870A JPH11227870A (en) 1999-08-24
JP3373420B2 true JP3373420B2 (en) 2003-02-04

Family

ID=12249151

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (3)

Country Link
JP (1) JP3373420B2 (en)
KR (1) KR19990072280A (en)
TW (1) TW400301B (en)

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JP2019147610A (en) * 2018-02-28 2019-09-05 スリーエム イノベイティブ プロパティズ カンパニー Carrier tape, method for manufacturing the carrier tape, tape-shaped packaging body, method for manufacturing the tape-shaped packaging body

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN109335345A (en) * 2018-09-27 2019-02-15 苏州睿达矩自动化设备有限公司 It is a kind of can position lifting the explosion-proof box body of ship communication equipment controller
CN109335344A (en) * 2018-09-27 2019-02-15 苏州睿达矩自动化设备有限公司 A kind of explosion-proof box body of ship communication equipment controller

Also Published As

Publication number Publication date
KR19990072280A (en) 1999-09-27
TW400301B (en) 2000-08-01
JPH11227870A (en) 1999-08-24

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