JP3370365B2 - Shape observation device - Google Patents
Shape observation deviceInfo
- Publication number
- JP3370365B2 JP3370365B2 JP00356393A JP356393A JP3370365B2 JP 3370365 B2 JP3370365 B2 JP 3370365B2 JP 00356393 A JP00356393 A JP 00356393A JP 356393 A JP356393 A JP 356393A JP 3370365 B2 JP3370365 B2 JP 3370365B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- shape
- processing
- edge
- observation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】電子顕微鏡、レーザー顕微鏡など
の走査型微小形状観察装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scanning microscopic shape observation apparatus such as an electron microscope and a laser microscope.
【０００２】[0002]
【従来の技術】形状観察装置の試料装着装置に装着され
た試料の外形のエッジ位置を、形状観察装置により得ら
れた２次電子画像等から自動認識する場合に、従来は外
形のエッジ部下に延在する平板状の試料装着装置の上に
装着していた。エッジ部分は試料外部よりも明るい画像
として得られる。従って十分高いしきい値を用いて２値
化画像を得れば、エッジ部分のみがリング状になった画
像が得られる。このリング形状の点列をトレース方法で
取得して、エッジ位置座標を求めることにより、試料外
形を自動認識する。2. Description of the Related Art When automatically recognizing the edge position of the outer shape of a sample mounted on a sample mounting device of a shape observing device from a secondary electronic image obtained by the shape observing device, conventionally, the position of the outer edge of the sample is below the edge part of the outer shape. It was mounted on the extending plate-shaped sample mounting device. The edge portion is obtained as a brighter image than the outside of the sample. Therefore, if a binarized image is obtained using a sufficiently high threshold value, an image in which only the edge portion has a ring shape can be obtained. By obtaining this ring-shaped point sequence by the tracing method and obtaining the edge position coordinates, the outer shape of the sample is automatically recognized.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、試料外
部の画像のノイズ成分が大きくて、その一部がエッジ部
分の明るさに近くなると、自動認識時に複数のエッジが
存在すると判断し、エッジ部分の正確な認識が出来なく
なる場合が発生する。However, when the noise component of the image outside the sample is large and a part of it is close to the brightness of the edge portion, it is judged that there are a plurality of edges during automatic recognition, and the edge portion In some cases, accurate recognition may not be possible.
【０００４】またエッジ部分が充分明るくないと、なめ
らかなリング状の画像が得られず、認識精度が低下す
る。などの課題が発生するので、これらを解決すること
を目的とする。If the edge portion is not sufficiently bright, a smooth ring-shaped image cannot be obtained, and the recognition accuracy is degraded. Problems such as the above occur, and the purpose is to solve these.
【０００５】[0005]
【課題を解決するため手段】本発明は試料装着装置の改
良により、取得画像の試料外部部分に対してエッジ部分
が明るくなるようにして、しきい値の選択に大きく依存
しないなめらかなリング状の２値化画像を安定的に取得
可能にする事により、エッジ認識率と認識精度を向上し
た形状観察装置を提供するものである。According to the present invention, by improving a sample mounting device, an edge portion of an acquired image is brighter than an external portion of the sample, and a smooth ring-like shape which does not largely depend on selection of a threshold value is formed. (EN) A shape observation device having an improved edge recognition rate and recognition accuracy by making it possible to stably acquire a binarized image.
【０００６】[0006]
【作用】エッジを含む試料内部は、画像を得るために照
射する電子線または光が焦点付近で当たるので、試料か
ら発生する検出対象になる電子または反射光等が多い。
特にエッジはエッジ効果により発生数が多い。また発生
した電子または反射光等が検出されやすいように検出器
を配置しているので検出効率が良い。この結果エッジ部
分を含む試料内部は明るく見える。In the inside of the sample including the edge, the electron beam or light for irradiating to obtain an image hits in the vicinity of the focal point, and therefore, there are many electrons or reflected light or the like generated from the sample to be detected.
In particular, edges are frequently generated due to the edge effect. Further, since the detector is arranged so that the generated electrons or reflected light can be easily detected, the detection efficiency is good. As a result, the inside of the sample including the edge portion looks bright.
【０００７】以下の４つの実施例は、観察対象になる試
料外部を上記の明るい画像になる原理の逆になるように
することで、試料外部の画像を暗くして、エッジ認識率
と認識精度を向上する形状観察装置である。
（１）照射電子、照射光を試料面より充分離れた装置下
面まで到達させるためにエッジ観察場所で試料外部にな
る部分に穴を開けた。In the following four embodiments, the outside of the sample to be observed is made to be the reverse of the above-described principle of forming a bright image, so that the image outside the sample is darkened, and the edge recognition rate and the recognition accuracy are improved. It is a shape observation device that improves (1) In order to allow the irradiated electrons and the irradiated light to reach the lower surface of the apparatus, which is sufficiently distant from the sample surface, a hole was made in the portion outside the sample at the edge observation location.
【０００８】（２）エッジ観察場所で試料外部になる部
分に、試料面より離れた場所になるように、深い溝を設
けた。
（３）エッジ観察場所で試料外部になる部分を斜面にし
た。
（４）エッジ観察場所で試料外部になる部分に照射電子
線や照射光を吸収する素材を付着した。(2) A deep groove is provided in a portion outside the sample at the edge observation location so as to be away from the sample surface. (3) The portion outside the sample at the edge observation location was made a slope. (4) A material that absorbs the irradiation electron beam and irradiation light was attached to the portion outside the sample at the edge observation location.
【０００９】[0009]
【実施例】以下本発明を図示の実施例に基づき説明す
る。図１は本発明の形状観察装置のブロック図を示した
ものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to illustrated embodiments. FIG. 1 shows a block diagram of the shape observation apparatus of the present invention.
【００１０】電子銃１から発生する電子線ａは偏向器２
ｘによりｘ方向に偏向され偏向器２ｙによりｙ方向に偏
向される。偏向量はＣＰＵ６からｘ方向のＤＡ変換器４
とｙ方向のＤＡ変換器５に与えられる。このＤＡ変換器
４、５の出力は偏向器２ｘと２ｙに、接続されている。The electron beam a generated from the electron gun 1 is deflector 2
It is deflected in the x direction by x and is deflected in the y direction by the deflector 2y. The amount of deflection is from the CPU 6 to the DA converter 4 in the x direction.
And to the DA converter 5 in the y direction. The outputs of the DA converters 4 and 5 are connected to the deflectors 2x and 2y.
【００１１】ＣＰＵ６がＡＤ変換器７に対して読み込み
動作をすると、試料３から発生する電子ｂが検出器８に
検出されて変換された電気信号ｃの値がデジタル量に変
換されてＣＰＵ６に取り込まれる。ＣＰＵ６はＡＤ変換
器７から読み込んだ値を画像メモリ９に書き込む。画像
メモリ９の内容は表示器１０に表示される。When the CPU 6 performs a reading operation to the AD converter 7, the electron b generated from the sample 3 is detected by the detector 8 and the converted value of the electric signal c is converted into a digital amount and taken into the CPU 6. Be done. The CPU 6 writes the value read from the AD converter 7 in the image memory 9. The contents of the image memory 9 are displayed on the display 10.
【００１２】試料３は試料装着装置１３に装着されステ
ージ駆動装置１２を介して観察位置が制御される。ステ
ージ移動量はＣＰＵ６からステージ制御装置１１に与え
られる。このステージ制御装置１１の出力はステージ駆
動装置１２に接続されている。The sample 3 is mounted on the sample mounting device 13 and the observation position is controlled via the stage driving device 12. The stage movement amount is given from the CPU 6 to the stage control device 11. The output of the stage control device 11 is connected to the stage drive device 12.
【００１３】（実施例１）図２は試料装着装置２１３の
改良点を表している。エッジ観察場所で試料外部になる
部分には穴２１があり、画像取得時に電子線ａが照射さ
れた場合は、充分離れた装置下面２２まで到達する。こ
こは焦点より充分離れていて電子線ａが大きく広がって
いるので試料外部から発生する電子数が少なく、かつ検
出器２８まで遠いので電子が検出されにくい。この実施
例は外形の一部を観察する場合に用いることが可能であ
る。(Embodiment 1) FIG. 2 shows an improvement of the sample mounting device 213. There is a hole 21 in the portion outside the sample at the edge observation location, and when the electron beam a is irradiated at the time of image acquisition, it reaches the lower surface 22 of the apparatus sufficiently far away. Since the electron beam a is sufficiently far away from the focal point and the electron beam a spreads widely, the number of electrons generated from the outside of the sample is small, and it is far from the detector 28, so that it is difficult to detect electrons. This embodiment can be used when observing a part of the outer shape.
【００１４】（実施例２）
図３は試料装着装置３１３の改良点を表している。原理
は実施例１と同じである。この実施例は実施例１に比べ
明るさの差がつきにくいが、穴２１による試料装着装置
の強度低下の問題が避けられる。(Embodiment 2) FIG. 3 shows an improvement of the sample mounting device 313. The principle is the same as that of the first embodiment. In this embodiment, the difference in brightness is less likely to occur than in Embodiment 1, but the problem of the strength of the sample mounting device due to the hole 21 is avoided.
【００１５】（実施例３）図４は試料装着装置４１３の
改良点を表している。エッジ観察場所で試料４３の外部
になる部分は斜面４１になっており、画像取得時に電子
線が照射された場合は、試料外部から発生した電子が検
出器４８方向に飛行しにくいので、検出されにくい。(Embodiment 3) FIG. 4 shows an improvement of the sample mounting device 413. The portion outside the sample 43 at the edge observation location is the slope 41, and when the electron beam is irradiated at the time of image acquisition, the electrons generated from outside the sample are difficult to fly toward the detector 48, and thus are detected. Hateful.
【００１６】（実施例４）図５は試料装着装置５１３の
改良点を表している。エッジ観察場所で試料外部になる
部分には、電子線の照射による電子の発生数の少ない部
材５１が付着されており、画像取得時に電子線が照射さ
れた場合は、試料外部から電子が発生しにくい。(Embodiment 4) FIG. 5 shows an improvement of the sample mounting device 513. A member 51, which generates a small number of electrons due to electron beam irradiation, is attached to a portion outside the sample at the edge observation place. When the electron beam is irradiated during image acquisition, electrons are generated from the outside of the sample. Hateful.
【００１７】[0017]
【発明の効果】本実施例２から５のいずれか、もしくは
組み合わせた手段を用いれば、試料外形の自動認識時
に、エッジ認識率と認識精度を向上できる。本発明によ
れば、単純な試料装着装置の改良以外に、特別なノイズ
処理方法、エッジ認識方法等が必要で無く、装置コス
ト、計算コストが軽減できる。By using any one of the second to fifth embodiments or a combination thereof, it is possible to improve the edge recognition rate and the recognition accuracy when automatically recognizing the outer shape of the sample. According to the present invention, a special noise processing method, an edge recognition method, etc. are not required in addition to the improvement of a simple sample mounting apparatus, and the apparatus cost and the calculation cost can be reduced.
【図１】本発明が適用される形状観察装置のブロック図
を示している。FIG. 1 shows a block diagram of a shape observation apparatus to which the present invention is applied.
【図２】実施例１の断面図を示している。FIG. 2 shows a sectional view of the first embodiment.
【図３】実施例２の断面図を示している。FIG. 3 shows a sectional view of the second embodiment.
【図４】実施例３の断面図を示している。FIG. 4 shows a sectional view of the third embodiment.
【図５】実施例４の断面図を示している。FIG. 5 shows a sectional view of the fourth embodiment.
３、２３、３３、４３、５３ 試料 ８ ２８、３８、４８、５８ 検出器 １３ ２１３、３１３、４１３、５１３ 試料装着装置 ａ 電子線 ｂ 試料から発生する電子 3,23,33,43,53 sample 8 28, 38, 48, 58 Detector 13 213, 313, 413, 513 Sample mounting device a electron beam b Electrons generated from the sample
Claims (5)
または光を試料上面より走査し、前記試料から発生する
２次電子または反射光等の量を検出器により検出するこ
とにより形状を認識する形状観察装置において、前記試
料装着装置の前記試料外形のエッジ部下の部分に加工を
施すことにより、前記試料外形のエッジ部下の部分から
発生し、かつ、前記検出器により検出される２次電子ま
たは反射光等の量を、前記外形エッジ部下に前記試料装
着装置表面が延在する場合に比べて少なくしたことを特
徴とする形状観察装置。1. A sample mounted on a sample mounting device is scanned with an electron beam or light from the upper surface of the sample to generate the sample.
In recognizing the shape observation device to shape by detecting by the detector the amount of such secondary electrons or reflected light, the trial
Processing on the part under the edge of the sample outer shape of the material mounting device
By applying, from the portion under the edge of the sample outer shape
Occurs, and the amount of such secondary electrons or reflected light detected by the detector, and wherein the small Kushida that as compared with the case where the sample mounting device surface to the outer edge subordinates extending shape Observation device.
する請求項１記載の形状観察装置。The shape observation device according to claim 1.
徴とする請求項１記載の形状観察装置。The shape observation device according to claim 1, which is a characteristic.
とする請求項１記載の形状観察装置。The shape observation device according to claim 1.
次電子または反射光等の発生量が少ない材質を付着するAttach a material that produces a small amount of secondary electrons or reflected light
加工であることを特徴とする請求項１記載の形状観察装The shape observing device according to claim 1, which is processing.
置。Place
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00356393A JP3370365B2 (en) | 1993-01-12 | 1993-01-12 | Shape observation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00356393A JP3370365B2 (en) | 1993-01-12 | 1993-01-12 | Shape observation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06208840A JPH06208840A (en) | 1994-07-26 |
| JP3370365B2 true JP3370365B2 (en) | 2003-01-27 |
Family
ID=11560898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00356393A Expired - Fee Related JP3370365B2 (en) | 1993-01-12 | 1993-01-12 | Shape observation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3370365B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09106777A (en) * | 1995-10-11 | 1997-04-22 | Hamamatsu Photonics Kk | Electron multiplier for use with electron microscope |
| CN102901471B (en) * | 2011-07-26 | 2015-06-03 | 中国科学院物理研究所 | Nano graphical and ultrawide-band electromagnetic property measuring system |
-
1993
- 1993-01-12 JP JP00356393A patent/JP3370365B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06208840A (en) | 1994-07-26 |
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