JP3366167B2 - Optical semiconductor module - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to, for example used in optical communication, directed to an optical semiconductor module comprising an optical fiber optically coupled to the semiconductor light emitting and receiving elements.

[0002]

2. Description of the Related Art Conventionally, the following techniques are related to this type of optical semiconductor module. In this known technique, a V groove having a predetermined width and depth is formed by anisotropic etching on an optical fiber supporting substrate made of a silicon substrate, and then the optical fiber incident end of this V groove is formed. A cut perpendicular to the V groove is formed on the side by a dicing saw or anisotropic etching. Then, after that, the optical fiber is installed in the V groove so that the optical fiber incident end face abuts on the substrate, and is fixed to the V groove with an adhesive while being pressed by a jig, and a lens previously formed on the optical fiber supporting substrate is provided. It is optically coupled to the LD, which is a semiconductor light emitting element, via the interposition.

In this known technique, a lead frame on which a photoelectric conversion element is mounted is inserted into a space inside a housing and adhered / fixed with a transparent resin body, and further provided inside the housing. An optical semiconductor module configured by connecting an optical connector provided at one end of an optical fiber to a connector joint portion.

[0004]

However, the above-mentioned known techniques have the following problems. That is,
The known technique is a module structure in which an LD, a lens, and an optical fiber are hybrid-mounted on an optical fiber support substrate, but there is no description of an electrical external connection means for driving and controlling the LD, and the hybrid mounting is still performed. In the exposed state, it is inconvenient for an operator to handle the module during mounting on an external circuit board or during assembly work. Further, in the known technique, a lead frame is used as an electrical external connection means for driving and controlling the LD, and the lead frame is fixed in the housing. Therefore, a module of an operator at the time of mounting on an external circuit board or assembling work. The inconvenience of handling does not occur. However, the lead frame has a four-division structure, and after positioning each of these four lead frames at a predetermined position and then holding that position, resin is injected into the space inside the housing to fix the lead frame. Is very difficult to position and fix. In addition, when considering mounting on an external circuit board, the four external frames that are substantially parallel to the lead frame are set upright on the external circuit board, so that the stability after mounting is reduced.

On the other hand, the known technique is also (A) a method of forming a V groove for fixing an optical fiber on an optical fiber supporting substrate by anisotropic etching, so that a process step and a working time are significantly required, It is difficult to reduce the manufacturing cost, and (B) the optical fiber having a small diameter of 0.125 mm, for example, is directly fixed to the optical fiber support substrate, so that the optical fiber can be connected to the V groove. It is difficult to improve handleability and positioning workability when installing. Here, as a known technology example for solving (A),
For example, there is JP-A-3-11308. According to this known technique, an optical fiber cutting groove (square groove) having a predetermined depth which is orthogonal to the optical fiber and cuts the optical fiber is formed on a supporting substrate for fixing the optical fiber by dicing. As a result, it is possible to shorten the process steps and working time when forming the groove. On the other hand, as an example of a known technique for solving the problem (B), there is, for example, Japanese Patent Laid-Open No. 4-128812. In this known technique, the optical fiber is held by a large-diameter support member, so that when the optical fiber is installed, the positioning work can be performed via the large-diameter support member. And positioning workability can be improved.

Therefore, in order to solve (A) and (B) at the same time, the above-mentioned two known techniques are combined, a large-diameter optical fiber supporting member is used, and a groove for fixing the supporting member is diced. It is conceivable that it is formed by. However, in this case, the following new problems arise. That is, when forming a groove for fixing the optical fiber supporting member by dicing on the substrate, an R shape is inevitably produced in processing at the groove end positions at the beginning and end of transfer. If the optical fiber support member has a relatively small diameter, it becomes a narrow groove, so this R
The influence of the shape does not matter so much, but the larger the diameter of the optical fiber supporting member, the greater the influence thereof, and the distance between the light emitting element / light receiving element and the optical fiber tip must be increased by the amount of the R shape. And the optical coupling efficiency is reduced.

A first object of the present invention is to perform positioning and fixing with high precision easily, improve the convenience of the operator in handling the module at the time of mounting on an external circuit board and assembling work, and to externally can provide electrical external connecting means without impairing the stability of the case of mounting on a circuit board, it is to provide an optical semiconductor module.

A second object of the present invention is to improve the handling property and the positioning workability when installing the optical fiber without lowering the optical coupling efficiency, and the process for forming the groove for fixing the optical fiber supporting member. It can be reduced step and the working time is to provide an optical semiconductor module.

[0009]

To achieve the above Symbol first object SUMMARY OF THE INVENTION According to the present invention, a semiconductor light emitting element and a semiconductor light receiving element is optically coupled to these semiconductor light emitting device and a semiconductor light-receiving element In an optical semiconductor module having an optical fiber for optical transmission and an element mounting board member for mounting at least a semiconductor light emitting element among the semiconductor light emitting element and the semiconductor light receiving element, a frame substrate, the semiconductor light emitting element and the semiconductor light receiving element A lead terminal that is electrically connected to the semiconductor light emitting element and the semiconductor light receiving element and electrically connects the outside to the outside; an optical fiber supporting member that internally holds and fixes the optical fiber; and the optical fiber supporting member. An optical fiber supporting member fixing connecting member connected to the frame substrate, and the element mounting substrate member is a mounted semiconductor device. Connect the child to the frame substrate,
A plurality of the lead terminals are provided near both ends in the plane direction of the frame substrate, and each of the lead terminals has a root portion projecting outward in the plane direction of the frame substrate and a tip side from the root portion. The frame substrate, the element mounting substrate member, the optical fiber supporting member fixing connecting member, and the optical fiber supporting member are provided, each of which has a substantially L-shape having a tip portion provided in a direction substantially perpendicular to the surface direction of the frame substrate. At least a part and at least a part of the root portion of each lead terminal are covered with the first resin and packaged except for the periphery of the optical coupling part between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber. And
The element mounting substrate member is fixed to the frame substrate, and is provided with a step portion for joining and fixing the optical fiber supporting member fixing substrate member, the optical fiber fixing substrate member, Provided is an optical semiconductor module, which is arranged and fixed on the element mounting substrate member such that the end surface is in close contact with the end surface of the step portion. In the present invention, a plurality of lead terminals are used to
Electrical connection between the light emitting element and the semiconductor light receiving element and the outside
Being exposed to the outside through these lead terminals.
The semiconductor light emitting device can be drive-controlled from the section. So
At this time, the substantially L-shaped lead terminals are
By providing a plurality of plates near both ends in the plane direction of the plate,
Of the frame board when installed upright on the external circuit board.
A tip portion of the multiple lead terminals of the surface direction near one end, frame
Of the lead terminals near the other end of the board in the plane direction
It will be fixed in minutes and minutes. That is, the optical semiconductor module
The entire tool is rigid with multiple legs on each side of the frame board.
It will be firmly supported, so follow the lead frame
Standing on the external circuit board with four parallel external frames
The stability after mounting is improved as compared with the conventional structure. Also,
Almost all of the modules are packaged with the first resin
That is, a semiconductor light emitting element and a semiconductor light receiving element
Except for the area around the optical coupling between the child and the optical fiber.
Plate, element mounting board member, optical fiber support member fixing contact
Connection member, at least a part of the optical fiber support member, and each
At least a part of the root of the lead terminal is made of the first resin.
By being covered, these are exposed and hybrid.
The external circuit board
Handling of modules by workers during mounting and assembly work
The convenience can be improved. And at this time,
Related to semiconductor light emitting devices, semiconductor light receiving devices, and optical fibers
After all positioning and fixing is completed, finally the first tree
Packaging with oil is enough, and the first resin is simply
Since it is a protection measure and does not participate in positioning or fixing,
Align the four leadframes in place
Positioning with higher accuracy than the conventional structure in which resin is fixed in the ring
It can be easily determined and fixed. Semiconductor
Optical coupling part between light emitting element and semiconductor light receiving element and optical fiber
Can be shut off from the outside and can be hermetically sealed. Also light
The fiber is fixedly held in the optical fiber support member.
Allows the optical fiber to be bonded and fixed without exposing it to the outside.
It is possible to set the optical fiber strand directly to silicon.
Compared to the structure that is fixed to the substrate, it prevents the optical fiber from breaking.
There is also an action. And in the present invention, at the time of assembly,
It is sufficient to install on the frame board a semiconductor light emitting element and a semiconductor light receiving element on the element mounting board member where the optical coupling between the optical fiber and the semiconductor light emitting element has been completed, so position adjustment and fixing on the frame board is simple. And can be easily implemented. Further, since the semiconductor light emitting element, the semiconductor light receiving element, and the optical fiber can both be mounted with the surface of the element mounting substrate member as a reference, optical coupling can be stably maintained. In order to achieve the first object, according to the present invention, a semiconductor light emitting element and a semiconductor light receiving element, an optical fiber optically coupled to the semiconductor light emitting element and the semiconductor light receiving element for optical transmission, An optical semiconductor module having at least an element mounting substrate member for mounting a semiconductor light emitting element among a semiconductor light emitting element and a semiconductor light receiving element, the frame substrate being electrically connected to the semiconductor light emitting element and the semiconductor light receiving element, and the semiconductor Lead terminals for electrically connecting the light emitting element and the semiconductor light receiving element to the outside, an optical fiber support member for internally holding and fixing the optical fiber, and an optical fiber support for connecting the optical fiber support member to the frame substrate. And a connection member for fixing a member, wherein the element mounting substrate member has the mounted semiconductor element on the frame substrate. It continued, and the lead terminals, as well as provided by a plurality in the surface direction near both ends of the frame substrate, each of the lead terminals,
The frame substrate has a substantially L-shaped shape including a root portion protruding outward in a substantially plane direction, and a tip portion provided on a tip side from the root portion in a direction substantially orthogonal to a plane direction of the frame substrate, A frame substrate, a device mounting substrate member, an optical fiber supporting member fixing connection member, at least a part of the optical fiber supporting member, and at least a part of a root portion of each lead terminal are the semiconductor light emitting device and the semiconductor light receiving device and the semiconductor light receiving device. Except for the periphery of the optical coupling portion with the optical fiber, the optical fiber supporting member fixing substrate member is covered with the first resin and packaged, the optical fiber supporting member fixing substrate member is fixed to the frame substrate, and the element mounting is performed. The device mounting board member is provided with a step portion for joining and fixing the optical board member, and the optical fiber is arranged so that the end surface of the element mounting board member is closely attached to the end surface of the step portion. The optical semiconductor module, characterized by being arranged and fixed on a fixing substrate member. In the present invention, at the time of assembly, it is sufficient to install a semiconductor light emitting element and a semiconductor light receiving element on the optical fiber supporting member fixing substrate member in a state where optical coupling with the optical fiber is completed, on the frame substrate. Position adjustment and fixing on the frame substrate can be simplified, and further mounting can be facilitated. Further, since the semiconductor light emitting element, the semiconductor light receiving element, and the optical fiber can both be mounted with the surface of the substrate member for fixing the optical fiber supporting member as a reference, the optical coupling can be stably maintained.

Preferably, in the optical semiconductor module, at least one of the element mounting substrate member and the optical fiber supporting member fixing connecting member is mounted on a frame substrate having the lead terminal. A featured optical semiconductor module is provided.

Preferably, in the optical semiconductor module, the periphery of the optical coupling portion between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber is covered with a transparent second resin. An optical semiconductor module is provided.

Further, in the optical semiconductor module, preferably, a space is formed around the optical coupling portion between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber by not being filled with the first resin. An optical semiconductor module characterized by the above is provided. As a result, it is possible to improve the convenience of the operator's handling of the module at the time of mounting on the external circuit board or assembling work without disturbing the optical coupling between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber.

Further preferably, in order to achieve the first and second objects, in the optical semiconductor module,
The optical fiber support member has an outer diameter of 0.8 mm or more.2.
The optical fiber support member fixing connecting member has a substantially cylindrical shape of 5 mm or less,
By forming at least one groove by dicing which rotates the grindstone and grinds it to transfer the cross-sectional shape of the grindstone, the base material in which this groove is formed is cut and divided into at least a plurality of pieces in a direction perpendicular to the groove. An optical semiconductor module is provided in which the optical fiber support member is bonded and fixed to a groove formed in the optical fiber support member fixing connection member. That is,
The outer diameter of the substantially cylindrical optical fiber support member is 0.8 mm.
With a relatively large diameter of 2.5 mm or less, when the optical fiber is installed, positioning work can be performed via the large-diameter support member, so that the handling property and the positioning workability at the time of installation are improved. be able to. Further, by forming a groove for joining and fixing the optical fiber supporting member on the connecting member for fixing the optical fiber supporting member by dicing, the process steps and working time for forming the groove are greater than those in the case of forming the groove by anisotropic etching. Can be shortened.
Therefore, the productivity can be improved and the manufacturing cost can be reduced. At this time, the connecting member for fixing the optical fiber supporting member is configured by cutting and dividing the base material in which at least one groove is formed by dicing into a plurality of pieces in the direction perpendicular to the groove, The cross-sectional shape can be made the same over the entire length of the groove, and unlike the case of forming the groove by dicing for each member, the R shape does not occur at the groove end position at the beginning of transfer and the end of transfer. Therefore, the R shape prevents the distance between the semiconductor light emitting element and the tip of the optical fiber from becoming large, so that it is possible to prevent the optical coupling efficiency from decreasing.

More preferably, in the optical semiconductor module, the groove formed in the connecting member for fixing the optical fiber supporting member is a U-shaped groove having a U-shaped cross section and a recessed cross section. An optical semiconductor module is provided which is one of the concave grooves. As a result, there is no need to use an optical fiber fixing substrate member that is thicker than necessary, as compared with the case where the V-shaped groove is formed.

More preferably, in the optical semiconductor module, the cross-sectional shape of the one groove is such that an internal angle formed by both inclined surfaces forming a groove side surface is 40 ° or more and 100 ° or less. A semiconductor module is provided. More preferably, in the optical semiconductor module, there is provided an optical semiconductor module, wherein an inner angle formed by the inclined surfaces is 60 degrees. With these, the optical fiber support member can be stably held without rattling to the optical fiber member fixing connection member.

Further, in order to achieve the first object, preferably, in the optical semiconductor module, the connecting member for fixing the optical fiber supporting member is fixed to the optical fiber supporting member on which the optical fiber supporting member is mounted. An optical semiconductor module is provided, comprising: a substrate member for use and a pressing substrate that presses the optical fiber supporting member from above to fix and hold the optical fiber supporting member.

[0017]

[0018]

[0019]

Further preferably, in the optical semiconductor module, the connecting member for fixing the optical fiber supporting member is
A pressing substrate that presses the optical fiber supporting member from above and holds the optical fiber supporting member in a fixed manner, wherein the element mounting substrate member is
An optical semiconductor module is provided, which is fixed to the frame substrate and includes a step portion for directly bonding and fixing the optical fiber supporting member.
Thus, it suffices to install a semiconductor light emitting element and a semiconductor light receiving element on the element mounting substrate member in a state where the optical coupling between the optical fiber and the optical fiber is complete, on the frame substrate, and the optical fiber supporting member fixing substrate member. Since the optical fiber support member is directly joined and fixed to the element mounting substrate member without the intervention of the above, position adjustment and fixing can be further simplified by that amount. Further, since the semiconductor light emitting element, the semiconductor light receiving element, and the optical fiber can both be mounted with the surface of the element mounting substrate member as a reference, optical coupling can be stably maintained.

Further, preferably, in the optical semiconductor module, an optical connector provided with a facing end face arranged to face a connecting direction end face of the optical fiber and a connecting optical fiber extending in an extension direction from the facing end face is provided at a predetermined position. The optical fiber support member further has a guide means for guiding in a relationship and a connection fixing means for performing connection and fixing, and a part of the optical fiber except the end face in the connecting direction. An optical semiconductor module is provided which is covered with the first resin and packaged. That is, since optical transmission to the outside is performed via the optical connector, compared to a structure in which the optical fiber support member and the optical fiber are taken out from the optical semiconductor module,
Excellent handling and mountability. In other words, when inspecting the optical characteristics during or after assembling the optical semiconductor module, a laser beam from the optical semiconductor module is directly measured by installing a measuring device in front of the end face in the connecting direction of the optical fiber exposed on the end face of the optical semiconductor module connecting side. Therefore, it is not necessary to repeatedly attach and detach the optical fiber as in the structure in which the optical fiber support member and the optical fiber are taken out from the optical semiconductor module, and the time of the inspection process can be greatly shortened. Further, since the optical connector can be connected after mounting the optical semiconductor module on the external circuit board, mounting of the optical semiconductor module on the external circuit board can be automated. Furthermore, there is an effect that the optical connector can be commonly used even when the optical semiconductor module or the external circuit board is replaced.

Preferably, in the optical semiconductor module, the element mounting substrate member and the optical fiber supporting member fixing connecting member are made of at least one material of silicon, glass, alumina ceramics, zirconia ceramics, and aluminum nitride. An optical semiconductor module is provided which is characterized in that

Further preferably, in the optical semiconductor module, the optical fiber supporting member is made of at least one material of glass, zirconia ceramics, plastic, and resin. To be done.

[0024]

[0025]

[0026]

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In order to avoid complication, a part of electric wiring and electric connection wiring such as wire bonding leads are not shown.

A first embodiment of the present invention will be described with reference to FIGS. Optical semiconductor module 10 according to the present embodiment
FIG. 1 is a vertical sectional view showing the entire structure of No. 0. In FIG. 1, the optical semiconductor module 100 is roughly described. The laser diode 1 is a semiconductor light emitting element, the photodiode 2 is a semiconductor light receiving element, and the laser diode 1 is optically coupled to perform optical transmission. An optical fiber 3 which is a single mode fiber, an optical fiber support member 9 which inserts the optical fiber 3 therein to support and fix it, and a stem 4 which is a device mounting substrate member on which the laser diode 1 and the photodiode 2 are mounted. An optical fiber fixing substrate 6 in which a concave groove 6A for installing the optical fiber supporting member 9 is formed, and a concave groove 7A for pressing down the optical fiber supporting member 9 are formed. The pressing substrate 7 which is pressed and fixed from the lead terminal 19 where the stem 4 and the optical fiber fixing substrate 6 are joined and fixed
And a frame substrate 5 provided with an optical fiber, and the optical coupling portion of the laser diode 1 and the photodiode 2 and the optical fiber 3 is covered with a transparent resin 11, and the whole is packaged with a mold resin 12 similarly to the LSI package. Has been done.

On the upper surface of the frame substrate 5, the stem 4 and the optical fiber fixing substrate 6 are joined and fixed so that their end faces abut. Electrical wiring (not shown) is previously formed on the upper surface of the stem 4 by sputtering vapor deposition, and the laser diode 1 and the photodiode 2 are bonded and fixed on the electrical wiring, and the wire bonding leads 20 (see later-described drawings) are formed. 8 (b)). The stem 4 on which the laser diode 1 is mounted is positionally adjusted so that the laser emission position of the laser diode 1 is aligned with the center extension line of the width of the concave groove 6A formed in the optical fiber fixing substrate 6, and the frame substrate 5 Fixed on top. Further, the laser diode 1 has a stem 4
The laser emitting portion of the laser diode 1 is disposed and mounted on the upper surface side of the stem 4 so as to reduce the variation in the height of the laser emitting position when it is bonded and fixed to the upper surface. Like the stem 4, the optical fiber fixing substrate 6 is adjusted in position so that the laser emitting position of the laser diode 1 is aligned with the center extension line of the width of the concave groove 6A formed in the optical fiber fixing substrate 6. It is fixed on the frame substrate 5. Further, a concave groove 6A is formed on the upper surface of the optical fiber fixing substrate 6 by dicing processing (described later) in which the ring-shaped grindstone 14 is rotated and ground to transfer the cross-sectional shape of the ring-shaped grindstone 14 to be processed. As shown in FIG. 1, an optical fiber support member 9 in which the optical fiber 3 is inserted, held and fixed is installed in the groove 6A.

Here, the details of the shape of the concave groove 6A formed in the optical fiber fixing substrate 6 will be described with reference to FIGS.
2A is a perspective view showing the structure of the ring-shaped grindstone 14 for dicing, and FIG. 2B is the optical fiber fixing substrate 6.
3 is a perspective view showing the structure of FIG. 3, FIG. 3 is a perspective view including a partial cross-sectional structure of the ring-shaped grindstone 14 shown in FIG. 2 (a), and FIG. 4 is the ring-shaped grindstone shown in FIG. 2 (a). 5 is a cross-sectional view of the grindstone 14, FIG. 5 is a cross-sectional view showing a cross-sectional structure of the optical fiber fixing substrate 6 shown in FIG. 2B, and FIG. It is a perspective view showing the structure which joined and fixed member 9.

2A and 2B and FIG. 3, the groove 6A is processed by dicing by rotating and grinding the ring-shaped grindstone 14 having a polygonal cross section to transfer the cross-sectional shape of the ring-shaped grindstone 14. Therefore, the ring-shaped grindstone 1 is formed.
The outermost peripheral surface 15 having a polygonal cross section of No. 4 and both inclined surfaces 16a and 16b in contact with the outer peripheral surface 15 have the shapes of the optical fiber fixing substrate 6
And is formed to have a predetermined width and depth. At this time, in FIGS. 4 and 5, the internal angle θ ₁ formed by the two inclined surfaces 16 a and 16 b of the ring-shaped grindstone 14 is 40 ° to 100 °.
It is preferably within the range of 60 °, and preferably 60 °. Therefore, in other words, the interior angle θ ₂ formed by both inclined surfaces in contact with the bottom surface of the concave groove 6A formed in the optical fiber fixing substrate 6 by the ring-shaped grindstone 14 is also preferably in the range of 40 ° to 100 °,
It is preferably 60 degrees. Accordingly, when the optical fiber support member 9 is installed in the groove 6A, it can be stably held, joined and fixed without rattling. Also, the groove 6
A is formed with a predetermined width and depth such that the upper surface of the optical fiber fixing substrate 6 and the central axis of the optical fiber 3 are flush with each other when the optical fiber support member 9 is installed. That is, as shown in FIG. 6, the optical fiber support member 9 is provided with the concave groove 6A.
When it is installed in the optical fiber fixing substrate 6, the upper surface of the optical fiber fixing substrate 6 and the laser incident portion of the optical fiber 3 which is the center of the optical fiber supporting member 9 are flush with each other. For example, the groove 6
The internal angle θ formed by both inclined surfaces of A is 60 °, and the outer diameter of the optical fiber support member 9 installed in the groove 6A is φ1.25 m.
When m is set, the width of the concave groove 6A is set to 1.4 in order to match the upper surface of the optical fiber fixing substrate 6 with the center position of the optical fiber 3.
It will be good if it is set to 43 mm.

Silicon is used as a material for forming the optical fiber fixing substrate 6, the pressing substrate 7, and the stem 4. Of these, the optical fiber fixing substrate 6 and the stem 4 are the same silicon wafer. It is configured by dividing and cutting 17 and taking out, and a groove 6A is formed in advance on the silicon wafer in a portion where the optical fiber fixing substrate 6 is taken out (see FIG. 7 which will be described later).
(See (a) to (d)). And at this time, the inventors
In order to examine the processing accuracy of the recessed groove 6A by the dicing process, as a result of an experiment in which several tens of recessed grooves 6A were formed on the silicon wafer 17 under the same setting conditions, the optical fiber support member 9 was formed in the recessed groove 6A. It is confirmed that the amount of positional deviation between the upper surface of the optical fiber fixing substrate 6 and the central axis of the optical fiber 3 when the is installed is within ± 1 μm, that is, the concave groove 6A can be formed by dicing with high accuracy. ing.

Further, as shown in FIG. 6, the optical fiber supporting member 9 has a substantially cylindrical shape, and its outer diameter is φ1.
It is 25 mm. And again, the optical fiber support member 9 is
The optical fiber 3 is inserted into the through hole provided in the vicinity of the axial center position so that the resin coating 10 is internally provided, and an adhesive (not shown) is filled and fixed by bonding. The material forming the optical fiber support member 9 is zirconia ceramics which is ceramics. It is joined and fixed so that it can be pressed from above by a pressing substrate 7 having a groove 7A on the lower surface.

In the member structure as described above, the periphery of the laser diode 1 and the photodiode 2 and the optical coupling portion of the optical fiber 3 is covered with a transparent resin 11 having high transparency to the laser light emitted from the laser diode 1. Is
As a result, the light coupling is not hindered.
Further, almost the entire portion including the frame substrate 5 (excluding the end portion of the optical fiber supporting member 9 and the coating 10) is covered with the molding resin 12 and packaged like the LSI package.

Next, the procedure for assembling the optical semiconductor module 100 according to the present embodiment will be described with reference to FIGS.
This will be described with reference to (a) and (b) and FIG. 9. Here, a case where a silicon wafer 17 having an outer diameter of 4 inches is used will be described as an example. First, a silicon wafer 17 having a thickness of 1.0 mm is prepared, and marking on a portion of the upper surface of the silicon wafer 17 where a plurality of concave grooves 17A to be the concave grooves 6A of the optical fiber fixing substrate 6 is formed ( (Not shown) and electrical wiring to the part that will be the stem 4 (not shown)
Are formed by sputter deposition (FIG. 7A).

Next, a plurality of concave grooves 17A are formed by dicing with the marking portion on the upper surface of the silicon wafer 17 as a mark (FIG. 7B). Although three grooves are formed in the figure, the number of grooves is not limited to this, and more grooves may be formed according to the size of the silicon wafer 17.

Thereafter, the silicon wafer 17 having the grooves 17A formed therein is cut into a predetermined length and width (dotted line in FIG. 7 (c)) to form a plurality of optical fiber fixing substrates 6 having the grooves 6A. , And stem 4 (FIG. 7D).

Then, the laser diode 1 and the photodiode 2 are respectively bonded and fixed to predetermined positions on the upper surface of the stem 4 cut out from the silicon wafer 17, and
The stem 4 and the optical fiber fixing substrate 6 are placed on the frame substrate 5 with the lead terminals 19 so that their end faces are in contact with each other.

On the other hand, the optical fiber strand 3 and the optical fiber 3
The optical fiber supporting member 9 fixed by inserting the resin coating 10 is installed in the groove 6A formed in the optical fiber fixing substrate 6, and the optical fiber supporting member 9 is pressed by the pressing substrate 7 from above. As shown in FIG. 8A, the groove 6
A resin 8 (see FIG. 1) is filled in A and bonded and fixed.

Then, the laser diode 1 and the photodiode 2 are connected to the lead terminals 19 of the frame substrate 5 by wire bonding leads 20 so as to be electrically externally connected via the stem 4 (FIG. 8).
(B)).

The position adjustment for optically coupling the laser diode 1 and the photodiode 2 with the optical fiber 3 is performed by adjusting the height from the same silicon wafer 17 to the stem 4 and the optical fiber fixing substrate 6. By taking them out, the stem 4 and the optical fiber fixing substrate 6 have the same height. That is, by forming the concave groove 6A of the optical fiber fixing substrate 6 with a predetermined width and depth, the laser incident portion of the optical fiber 3 provided in the optical fiber supporting member 9 is located on the upper surface of the optical fiber fixing substrate 6. By making them coincide with each other, the heights of the laser diode 1 and the photodiode 2 and the optical fiber 3 arranged on the upper surface side of the stem 4 can be adjusted without adjustment. Further, the adjustment in the optical axis direction is performed so that the laser diode 1 is bonded and fixed to a position near the end face of the stem 4 and the end face of the optical fiber support member 9 is brought into contact with the end face of the stem 4 so that a predetermined distance is obtained. . Further, for the adjustment in the direction perpendicular to the optical axis, the stem 4 and the optical fiber fixing substrate 6 are slid on the frame substrate 5 so that the laser emitting portion of the laser diode 1 and the laser receiving portion of the optical fiber 3 coincide with each other. To adjust the optical axis. That is,
The stem 4 and the optical fiber fixing substrate 6 are adjusted in position so that the laser emitting position of the laser diode 1 coincides with the center extension line of the width of the concave groove 6A formed in the optical fiber fixing substrate 6, and the frame substrate 5 Fixed on top.

After the adjustment of the optical coupling between the laser diode 1 and the photodiode 2 and the optical fiber 3 and the wire bonding are completed as described above, the optical coupling portion between the laser diode 1 and the optical fiber 3 is made of the transparent resin 11. The entire package including the frame substrate 5 is covered with the molding resin 12 in the same manner as the LSI package (see FIG. 1).

After packaging, the frame portion connecting the lead terminals 19 to each other is cut, each lead terminal 19 is further bent, and the base portion 19a in a substantially horizontal direction and the tip thereof in a substantially vertical direction are hung down. Tip part 19
b, the optical semiconductor module 100 is completed (FIG. 9).

In the optical semiconductor module 100 of the present embodiment configured as described above, a plurality of lead terminals 19 are provided.
Since the laser diode 1 and the photodiode 2 are electrically connected to the outside, the drive control of the laser diode 1 can be performed from the outside via the lead terminals 19. At this time, a plurality of substantially L-shaped lead terminals 19 are provided near both ends of the frame substrate 5 in the surface direction, so that when it is erected on the external circuit board, it is near one end of the frame substrate 5 in the surface direction. Of the lead terminals 19 and the frame substrate 5
End portions 1 of the plurality of lead terminals 19 near the other end in the plane direction of the
It will be fixed with 9b. That is, the entire optical semiconductor module 100 is firmly supported by the plurality of legs on both sides of the frame substrate 5, so that four external frames that are substantially parallel to the lead frame stand upright on the external circuit board. The stability after mounting is improved rather than the structure. Further, almost all of the optical semiconductor module 100 is packaged with the mold resin 12, that is,
The frame substrate 5, the stem 4, the optical fiber fixing substrate 6, and the optical fiber support member 9 except for the periphery of the optical coupling portion between the laser diode 1 and the photodiode 2 and the optical fiber 3.
Since the majority of the lead terminals except the end portions and a part of the root portion 19a of each lead terminal 19 are covered with the mold resin 12, the external circuit is compared with the conventional structure in which these are exposed and hybrid-mounted. It is possible to improve the convenience of the operator's handling of the module during mounting on the board or assembling work. At this time, after all the positioning and fixing of the laser diode 1, the photodiode 2, and the optical fiber 3 are completed, it is sufficient to finally package with the molding resin 12, which is merely a protection means. Since it does not participate in positioning and fixing, the four lead frames positioned at predetermined positions are fixed with resin in the housing, compared to the conventional structure.
Highly accurate positioning and fixing can be easily performed.
Therefore, the optical semiconductor module 100 excellent in mass productivity can be obtained. Further, the optical coupling part between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber can be shielded from the outside and hermetically sealed.

Further, since the optical fiber 3 is fixed and held in the optical fiber supporting member 9, the optical fiber 3 can be bonded and fixed without being exposed to the outside. Compared with the structure in which it is fixed to the substrate, it also has an effect of preventing the optical fiber from being broken by an external force.

Further, the optical fiber support member 9 having a substantially cylindrical shape
Has a relatively large outer diameter of 1.25 mm, and therefore, when the optical fiber 3 is installed, the positioning work can be performed through the large-diameter optical fiber support member 9, so that the handling property at the time of installation is improved. And the positioning workability can be improved. Further, by forming the recessed groove 6A for joining and fixing the optical fiber supporting member 9 on the optical fiber fixing substrate 6 by dicing, the process steps and operations for forming the groove are performed more than when the groove is formed by anisotropic etching. The time can be shortened. Therefore, the productivity can be improved and the manufacturing cost can be reduced. There is also the effect of higher precision. Then, at this time, the optical fiber fixing substrate 6 is formed by cutting the silicon wafer 17 having at least one groove 17A formed by dicing into a plurality of pieces by cutting the silicon wafer 17 in a direction perpendicular to the groove 17A and in a direction parallel to the groove 17A. By doing so, it is possible to make the cross-sectional shape of the concave groove 17A the same over the entire groove length, and at the groove end position at the beginning and end of transfer as in the case of forming the groove by dicing for each member. No R shape occurs. Therefore, since the distance between the laser diode 1 and the tip of the optical fiber 3 is not separated due to the R shape, it is possible to prevent the optical coupling efficiency from decreasing. Needless to say, the above-described operational effects relating to the large diameter of the optical fiber support member 9 are not limited to the case where the outer diameter is 1.25 mm as in the present embodiment. The inventors of the present application
Among known optical fiber support members, those having a relatively large diameter have an outer diameter of about 1.0 mm, and those having a relatively small diameter have an outer diameter of 0.25 mm and 0.5 m.
Since it is about m, the range of the outer diameter d to which the present invention is applied was determined to be 0.8 mm ≦ d ≦ 2.5 mm. Here, the upper limit of 2.5 mm is due to the restriction on the standard.

Further, the groove formed in the optical fiber fixing substrate 6 is a non-V-shaped groove having a bottom surface, so that the groove is formed more than necessary as compared with the case of the V-shaped groove. It is not necessary to use the thick optical fiber fixing substrate 6, and the optical fiber fixing substrate 6 can be composed of the thin substrate member 6.

In the first embodiment, the periphery of the optical coupling portion between the laser diode 1 and the photodiode 2 and the optical fiber 3 is covered with the transparent resin 11. However, the present invention is not limited to this. A space may be formed without filling the resin in this portion, and the same effect can be obtained in this case as well.

In the first embodiment, the concave groove 6A is formed in the optical fiber fixing substrate 6 → The laser diode 1 and the photodiode 2 are fixed to the stem 4 → Stem 4
And the optical fiber fixing substrate 6 are fixed to the frame substrate 5 →
Although the optical fiber support member 9 is fixed in the groove 6A and pressed by the pressing substrate 7, the order is not limited to this. That is, as long as the above-mentioned predetermined optical coupling adjustment is possible, part of the order may be changed, for example, the optical fiber support member 9 may be fixed in the groove 6A and pressed by the pressing substrate 7, and then the optical fiber. The fixing substrate member 6 may be fixed to the frame substrate 5. That is, the optical fiber support member 9 in which the optical fiber 3 is installed and held fixed is installed in the groove 6A formed in the optical fiber fixing substrate 6, and the optical fiber support member 9 is pressed from above by the pressing substrate 7. The optical fiber fixing substrate 6 is joined and fixed to a predetermined position on the frame substrate 5 having the lead terminals 19, and the laser diode 1 and the photodiode 2 are joined and fixed to a predetermined position of the stem 4 and the stem 4 is lead. Terminal 1
It is bonded and fixed to a predetermined position on the frame substrate 5 with 9.
Then, after that, wire bonding leads are respectively made so as to electrically connect the laser diode 1 and the photodiode 2 to the lead terminals 19 of the frame substrate 5, and after the wire bonding is completed, the laser diode 1 and the photodiode 2 and the optical fiber are finished. 3, the periphery of the optical coupling portion with 3 is covered with a transparent resin 11, and finally, the periphery of the transparent resin 11, the frame substrate 5, the stem 4, the optical fiber fixing substrate 6, the pressing substrate 7, and the optical fiber supporting member. 9
It suffices to cover most of them and most of the lead terminals 19 with the mold resin 12 for packaging.

Further, in the above embodiment, the stem 4 and the optical fiber fixing substrate 6 are replaced by the optical fiber fixing substrate 6
By adjusting the position so that the laser emission position of the laser diode 1 coincides with the center extension line of the width of the recessed groove 6A formed on the frame substrate 5 and fixing it on the frame substrate 5, the adjustment in the direction perpendicular to the optical axis is performed. However, the present invention is not limited to this, and there are the following modifications. This will be described with reference to FIG. Figure 10
In forming the electric wiring 44 for joining the laser diode 1 and the photodiode 2 on the upper surface of the stem by sputtering deposition, the same width interval as the width position of the concave groove 6A formed in the optical fiber fixing substrate 6 is formed. The markers 4a and 4b for positioning are simultaneously provided. When the stem 4 and the optical fiber fixing substrate 6 are aligned, the concave grooves 6A (formed on the optical fiber fixing substrate 6 are formed in the markers 4a and b having the same width as the width of the concave groove 6A provided on the upper surface of the stem 4). The stem 4 and the optical fiber fixing substrate 6 are butted against each other so that their groove widths are the same, and are fixed on the frame substrate 5.

A second embodiment of the present invention will be described with reference to FIG. The present embodiment is an embodiment in which an optical connector is directly connected to an optical semiconductor module, which is entirely packaged with a molding resin, to perform optical transmission. The same code | symbol is described in the member equivalent to 1st Embodiment. The optical semiconductor module 200 and the optical connector 2 according to the present embodiment
FIG. 11 is a perspective view showing the connection structure of 26. In FIG. 11, the optical semiconductor module 200 is entirely covered with the mold resin 12 and packaged in the same manner as the LSI package, as in the first embodiment. The main points different from the optical semiconductor module 100 according to the first embodiment are: (1) The optical fiber supporting member 9 and the resin coating 10 are not pulled out from the mold resin 12 on the side surface of the optical semiconductor module 200, and It is arranged so that the end face of 3 is exposed so as to be flush with the side face, and (2) on both sides of this exposed optical fiber 3, at equal intervals with reference to the axial center of the optical fiber 3. At a remote location,
A guide hole 222 for inserting a guide pin 223 for alignment with the optical connector 226 is formed, and (3) an optical connector 226 is connected to the upper and lower surfaces of the optical semiconductor module 200. Stopper guide 225
Is formed, and is engaged with the stopper 224 of the optical connector 226 for connection. Other configurations and assembling procedures of the optical semiconductor module 200 are almost the same as those of the optical semiconductor module 100 of the first embodiment.

The optical transmission connection between the optical semiconductor module 200 and the optical connector 226 is performed by positioning the optical connector 226 and the optical semiconductor module 200 via the guide pin 223, so that the optical fiber 3 exposed on the side surface of the module 200 is positioned. And the optical fiber (not shown) provided in the optical connector 226 so that their axial centers coincide with each other, and the stopper 22
4, the optical fiber 3 of the module 200 and the optical fiber of the optical connector 226 are always in contact with each other to be connected. Further, the resin coating 210 is drawn out in the optical fiber extension direction of the optical connector 226.

In the above structure, the stopper guide 225 constitutes a connection fixing means for connecting and fixing the optical connector 226, and the guide hole 222 and the guide pin 2 are provided.
Reference numeral 23 constitutes guide means for guiding the optical connector 26 so as to have a predetermined positional relationship.

In the present embodiment configured as described above, the end face of the optical fiber 3 is exposed on the side surface of the optical semiconductor module 200 packaged with the mold resin 12, and the optical connector 26 is connected to the optical semiconductor module 200. Since the optical transmission is performed to the outside, the handling and the mountability are superior to the structure in which the optical fiber 3 and the optical fiber supporting member 9 are taken out from the optical semiconductor module 100 as in the first embodiment. There is. That is, in the inspection of the optical characteristics during or after the optical semiconductor module 200 is assembled, a measuring device is installed in front of the optical fiber 3 exposed on the side surface of the optical semiconductor module 200 to directly measure the laser light from the optical semiconductor module 200. Therefore, compared with the structure such as the optical semiconductor module 100 in which the attachment and detachment of the optical fiber 3 needs to be repeated, the time of the inspection process can be significantly shortened.
Further, since the optical connector 26 can be connected after mounting the optical semiconductor module 200 on the external circuit board, the mounting of the optical semiconductor module 200 on the external circuit board can be automated. Furthermore, even when the optical semiconductor module 200 or the external circuit board is replaced, the optical connector 226 is used.
There is also an effect that can be used in common.

In the second embodiment, the optical semiconductor module 200 and the optical connector 226 are connected by the guide pin 223 and the stopper 224. However, the present invention is not limited to this. For example, the optical semiconductor module 200.
A method of integrally forming a guide-shaped portion that takes in the optical connector 226 may be used, and the same effect can be obtained in this case as well. Further, although the stopper guide 225 formed in the optical semiconductor module 200 is provided in the direction perpendicular to the direction in which the lead terminal 19 is taken out, it may be provided in the same direction as the lead terminal 19. Also in this case, the same effect is obtained.

A third embodiment of the present invention will be described with reference to FIGS.
Will be described. The present embodiment is an embodiment in which a stem for mounting a laser diode is joined and fixed to an optical fiber fixing substrate on which an optical fiber supporting member is installed.
The same code | symbol is attached | subjected to the member equivalent to 1st and 2nd embodiment. FIG. 12 is a perspective view showing the structure of a main part of the overall structure of the optical semiconductor module 300 according to the present embodiment, excluding the frame substrate 5, the transparent resin 11, and the molding resin 12.
13 is a vertical sectional view, and FIG. 14 is a horizontal sectional view taken along the line DD in FIG. 12 to 14, the optical semiconductor module 300 of the present embodiment is different from the optical semiconductor module 100 of the first embodiment mainly in that the step surface 304A of the stem 304 on which the laser diode 1 is mounted is arranged.
Then, the optical fiber fixing substrate 6 having the optical fiber supporting member 9 therein is bonded and fixed. That is, stem 3
On the step portion 304A of No. 04, the optical fiber fixing substrate 6 having the concave groove 6A of a predetermined width and depth formed by transferring the cross-sectional formation of the ring-shaped grindstone 14 by dicing processing is arranged. The optical fiber supporting member 9 is installed in the groove 6A of the substrate 6, and the pressing substrate 7 is further pressed from above.
The optical fiber support member 9 is fixed by pressing. At this time, the tip end surface of the optical fiber supporting member 9 is
The stem 304 is fixed so as to come into contact with the step portion end surface 304B (see FIG. 13). In addition, the upper surface 3 of the stem 304
The laser diode 1 and the photodiode 2 are joined and fixed to a predetermined position of 04C so as to be optically coupled with the optical fiber 3.

The other structure is almost the same as that of the optical semiconductor module 100 of the first embodiment. That is, the mounting structure of the stem 304 and its upper part is mounted on the frame substrate 5 with the lead terminals 19, and the whole structure is almost the same. Like the LSI package, it is covered with the mold resin 12 and packaged.

A method of assembling the optical semiconductor module 300 of the third embodiment having the above structure will be described below. First,
Electric wiring (not shown) is provided on the upper surface 304C of the stepped stem 304 having the upper surface 304C and the step surface 304A in advance.
Is patterned, and the laser diode 1 and the photodiode 2 are fixed at predetermined positions on the electric wiring. On the other hand, the optical fiber 3 is inserted into the optical fiber support member 9, and the tip of the optical fiber 3 element wire is the optical fiber support member 9
Of the resin 8 (see FIGS. 13 and 1).
(See 4) and fix. As a result, the element wire of the optical fiber 3 and the resin coating 10 are internally provided and fixed in the optical fiber support member 9.

Next, the optical fiber supporting member 9 is set in the concave groove 6A formed on the upper surface of the optical fiber fixing substrate 6 by dicing, and the end face of the optical fiber supporting member 9 is the optical fiber fixing substrate 6. Adjust to match the end face. After that, the pressing substrate 7 having a groove 7A similar to the groove 6A formed on the lower surface by dicing is installed so as to press the optical fiber supporting member 9, and the resin 8 is filled in the groove 7A to light the substrate. It is fixed on the upper surface of the fiber fixing substrate 6.

Thereafter, the optical fiber fixing substrate 6 having the optical fiber supporting member 9 therein is mounted on the stem 3 as described above.
The optical fiber is installed on the stepped surface 304A of No. 04, and is visually recognized from the outside using, for example, a microscope or a television camera, and the optical fiber 3 is arranged so that the tip of the wire of the optical fiber 3 comes close to the laser emitting portion of the laser diode 1 by a predetermined distance. The position of the support member 9 is adjusted in the optical axis direction. And next, laser diode 1
Of the laser emitting part of the optical fiber 3 and the laser receiving part of the optical fiber 3 are aligned with each other, and the optical fiber fixing substrate 6 is perpendicular to the optical axis while being in contact with the stem 304 so that the optical coupling between them becomes optimal. Direction parallel to the plane of the stem 304. After adjusting the optical axis direction and the optical axis vertical direction as described above, the optical fiber fixing substrate 6 and the stem 304 are bonded and fixed.

Although not particularly shown, the stem 304
Is fixed to the frame substrate 5 with the lead terminal 19, and the laser diode 1 and the photodiode 2 and the frame substrate 5 are fixed.
The lead terminals 19 are connected with wire bonding leads so as to be electrically externally connected via the stem 304. After that, the optical coupling portion between the laser diode 1 and the optical fiber 3 is formed of the transparent resin 1 as in the first embodiment.
1 (see FIG. 1), and further, the whole including the frame substrate 5 is covered with the molding resin 12 (see FIG. 1) for packaging. Then, the frame portion connecting the lead terminals 19 to each other is cut, each lead terminal 19 is further bent (see FIG. 1), and a substantially horizontal root portion 19a and a tip end portion thereof that hangs in a substantially vertical direction. 19b, and the optical semiconductor module 300 is completed.

The same effect as that of the first embodiment can be obtained by the present embodiment having the above-described structure. In addition to this, it suffices to dispose on the frame substrate 5 a device in which the laser diode 1 and the photodiode 2 and the optical fiber 3 are optically coupled on the stem 304, so that the position on the frame substrate 5 is sufficient. Adjustment and fixing can be simplified, and mounting can be facilitated. Further, since the laser diode 1 and the photodiode 2 and the optical fiber 3 can be mounted on the basis of the surface of the stem 304, the optical coupling can be stably maintained.

In the third embodiment, the laser diode 1 and the photodiode 2 are connected to the stem 30.
4 is fixed on the upper surface 304C of the optical fiber → The optical fiber 3 is fixed to the optical fiber supporting member 9 → The optical fiber supporting member 9 is fixed to the concave groove 6A formed in the optical fiber fixing substrate 6 and the pressing substrate 7
Hold down with → Stem 304
In the order of fixing the stepped surface 304A to the stem 304 to the frame substrate 5, as in the first embodiment,
Part of the order may be changed within a range in which predetermined optical coupling adjustment is possible. Also in this case, the same effect is obtained.

A fourth embodiment of the present invention will be described with reference to FIGS.
Will be described. The present embodiment is an embodiment in which a stem provided with a laser diode is joined and fixed on an optical fiber fixing substrate on which an optical fiber supporting member is installed.
The same members as those in the first to third embodiments are designated by the same reference numerals. Of the overall structure of the optical semiconductor module 400 according to the present embodiment, a perspective view showing a structure of a main part excluding the frame substrate 5, the transparent resin 11 and the molding resin 12 is shown in FIG. 16 shows EE in FIG.
A cross-sectional view taken along the line is shown in FIG. 15 to 17, the optical semiconductor module 400 of the present embodiment is different from the optical semiconductor module 100 of the first embodiment mainly in that the step surface of the optical fiber fixing substrate 406 on which the optical fiber supporting member 9 is mounted is different. This is to bond and fix the stem 404 having the laser diode 1 mounted thereon to 406B. That is, on the upper surface 406D of the optical fiber fixing substrate 406, the cross-sectional formation of the ring-shaped grindstone 14 is transferred by dicing processing to form a concave groove 406A having a predetermined width and depth, which is pressed down by the pressing substrate 7 from above. While the optical fiber support member 9 is fixed by the
A stem 404 on which the laser diode 1 is mounted is joined and fixed to the step surface 406B of No. 6. Also at this time,
The front end surface of the stem 404 has an optical fiber fixing substrate 406.
It is fixed so as to contact the end surface 406C of the stepped portion (see FIGS. 15 and 16). The laser diode 1 is joined and fixed to the stem 404 at a predetermined position so as to be optically coupled with the optical fiber 3.

The other structure is almost the same as that of the optical semiconductor module 100 of the first embodiment. That is, the optical fiber fixing substrate 6 and the mounting structure of the upper part thereof are mounted on the frame substrate 5 with the lead terminals 19. , Almost L
Similar to the SI package, it is covered with the molding resin 12 and packaged.

A method of assembling the optical semiconductor module 400 of the fourth embodiment will be described below. First, electrical wiring (not shown) is patterned in advance on the upper surface of the stem 404, and the laser diode 1 is fixed at a predetermined position on this electrical wiring. On the other hand, the optical fiber 3 is inserted into the optical fiber supporting member 9, and the resin 8 is adjusted so that the tip of the optical fiber 3 element wire is aligned with the end face of the optical fiber supporting member 9.
(See FIGS. 16 and 17) and fix. As a result, the element wire of the optical fiber 3 and the resin coating 10 are internally provided and fixed in the optical fiber support member 9.

Next, the optical fiber supporting member 9 is set in the groove 406A formed by the dicing process on the upper surface of the optical fiber fixing substrate 406 having a stepped shape, and the end face of the optical fiber supporting member 9 is placed. Is adjusted to match the end surface 406C of the optical fiber fixing substrate 406. After that, the pressing substrate 7 having a concave groove 7A similar to the concave groove 406A formed on the lower surface by dicing is installed so as to press the optical fiber supporting member 9, and the concave groove 7A is filled with the resin 8 so that light is applied. It is fixed to the upper surface 406D of the fiber fixing substrate 406.

On the other hand, an electric wiring (not shown) is previously patterned on the step surface 406B of the optical fiber fixing substrate 406, and the stem 404 on which the laser diode 1 is mounted is mounted.
Is placed on the formed electric wiring, and while being visually recognized from the outside using, for example, a microscope or a television camera, the laser emitting portion of the laser diode 1 is brought close to the tip of the wire of the optical fiber 3 by a predetermined distance. At the same time as adjusting the position of the stem 404 in the optical axis direction, the stem 404 is fixed to the optical fiber fixing substrate 4 so that the optical axis line of the laser emitting part of the laser diode 1 and the optical axis line of the laser receiving part of the optical fiber 3 coincide with each other.
While being in contact with 06, the adjustment is performed in the direction parallel to the step surface 406B of the optical fiber fixing substrate 406 which is perpendicular to the optical axis.
After adjusting the optical axis direction and the direction perpendicular to the optical axis as described above, the stem 404 is bonded and fixed to the optical fiber fixing substrate 406. The photodiode 2 is also fixed to the optical fiber fixing substrate 406.

Although not shown in particular, the optical fiber fixing substrate 406 is fixed to the frame substrate 5 with the lead terminal 19, and the laser diode 1 and the photodiode 2 and the lead terminal 19 of the frame substrate 5 are connected via the stem 404. Connect with wire bonding leads so that they are electrically connected externally. After that, the optical coupling portion between the laser diode 1 and the optical fiber 3 is covered with the transparent resin 11 (see FIG. 1) as in the first embodiment, and the entire mold resin 12 including the frame substrate 5 (see FIG. 1). ) And package. Then, the frame portion connecting the lead terminals 19 to each other is cut, each lead terminal 19 is further bent (see FIG. 1), and a substantially horizontal root portion 19a and a tip end portion thereof that hangs in a substantially vertical direction. 19b, and the optical semiconductor module 400 is completed.

The same effect as that of the first embodiment can be obtained by the present embodiment having the above-described configuration. Further, in addition to this, it is sufficient to install on the frame substrate 5 a substrate in which the optical coupling between the laser diode 1 and the photodiode 2 and the optical fiber 3 is completed on the optical fiber fixing substrate 406. It is possible to simplify the position adjustment and fixing on the board 5, and to facilitate the mounting. Further, since the laser diode 1 and the photodiode 2 and the optical fiber 3 can be mounted on the surface of the optical fiber fixing substrate 406 as a reference, the optical coupling can be stably maintained.

In the fourth embodiment, the laser diode 1 is fixed to the upper surface of the stem 404, the optical fiber 3 is fixed to the optical fiber supporting member 9, and the concave groove 406A is formed in the optical fiber fixing substrate 406. The optical fiber support member 9 is fixed to and is pressed by the pressing substrate 7 → the stem 4
04 was fixed to the stepped surface 406B of the optical fiber fixing substrate 406 → the optical fiber fixing substrate 406 was fixed to the frame substrate 5, but as in the third embodiment, a predetermined optical coupling adjustment is possible. Then, you may change a part of order. Also in this case, the same effect is obtained.

A fifth embodiment of the present invention will be described with reference to FIGS.
Will be described. The present embodiment is an embodiment in which an optical fiber supporting member is directly fixed to a stem on which a laser diode is mounted, without using an optical fiber fixing substrate. The same code | symbol is attached | subjected to the member equivalent to 1st-4th embodiment. FIG. 18 is a perspective view showing a structure of a main part of the entire structure of the optical semiconductor module 500 according to the present embodiment, excluding the frame substrate 5, the transparent resin 11, and the molding resin 12.
19 shows a vertical sectional view, and FIG. 20 shows a horizontal sectional view taken along the line FF in FIG. 18 to 20, the main difference between the optical semiconductor module 500 of the present embodiment and the optical semiconductor module 300 of the third embodiment lies in the step surface 304C of the stem 304 on which the laser diode 1 and the photodiode 2 are mounted. That is, the optical fiber support member 9 is directly fixed. That is, the optical fiber supporting member 9 is directly installed on the step surface 1304C provided on the stem 304 without the optical fiber fixing substrate 6, and the concave groove 7A is formed on the lower surface of the optical fiber supporting member 9 by dicing. Press the base plate 7 from above and press the groove 7A
The inside is filled with resin 8 and fixed. The other structure is almost the same as that of the third embodiment.

A method of assembling the optical semiconductor module 500 of the fifth embodiment having the above structure will be described below. First,
Electric wiring (not shown) is provided on the upper surface 304C of the stepped stem 304 having the upper surface 304C and the step surface 304A in advance.
Is patterned, and the laser diode 1 and the photodiode 2 are fixed at predetermined positions on the electric wiring. On the other hand, the optical fiber 3 is inserted into the optical fiber support member 9, and the tip of the optical fiber 3 element wire is the optical fiber support member 9
Of the resin 8 (see FIGS. 13 and 1).
(See 4) and fix. As a result, the element wire of the optical fiber 3 and the resin coating 10 are internally provided and fixed in the optical fiber support member 9. Next, the optical fiber supporting member 9 is installed on the stepped surface 304A of the stem 304, and the pressing substrate 7 having the concave groove 7A formed on the lower surface by dicing in advance is attached to the optical fiber supporting member 9
It is installed on the stem 304 so as to hold down. At this time, the position of the optical fiber support member 9 is adjusted so that the tip of the element wire of the optical fiber 3 approaches the laser emitting portion of the laser diode 1 by a predetermined distance while visually observing from the outside with a microscope, a television camera, or the like. The optical fiber support member 9 is pressed down so that the optical axes of the laser diode 1 and the optical fiber 3 are aligned with each other while adjusting in the optical axis direction.
Along with the contact with the stem 304, the adjustment is performed in the direction parallel to the step surface 304A of the stem 304 which is the direction perpendicular to the optical axis. After adjusting the optical axis direction and the direction perpendicular to the optical axis as described above, the resin 8 is provided between the pressing substrate 7 and the stem 304.
(See FIGS. 19 and 20) to fix the optical fiber support member 9.

Although not particularly shown, the stem 304
Is fixed to the frame substrate 5 with the lead terminal 19, and the laser diode 1 and the photodiode 2 and the frame substrate 5 are fixed.
The lead terminals 19 are connected with wire bonding leads so as to be electrically externally connected via the stem 304. After that, the optical coupling portion between the laser diode 1 and the optical fiber 3 is formed of the transparent resin 1 as in the third embodiment.
1 (see FIG. 1), and further, the whole including the frame substrate 5 is covered with the molding resin 12 (see FIG. 1) for packaging. Then, the frame portion connecting the lead terminals 19 to each other is cut, each lead terminal 19 is further bent (see FIG. 1), and a substantially horizontal root portion 19a and a tip end portion thereof that hangs in a substantially vertical direction. 19b, and the optical semiconductor module 500 is completed.

The same effect as that of the third embodiment can be obtained by the present embodiment configured as described above. In addition to this, since the optical fiber support member 9 is directly joined and fixed to the stem 304 without the interposition of the optical fiber fixing substrate 6, the position adjustment and fixing can be further simplified by that amount.

In the fifth embodiment, the laser diode 1 and the photodiode 2 are connected to the stem 30.
4 is fixed to the upper surface 304C → the stepped surface 304 of the stem 304
The optical fiber support member 9 is arranged at A and pressed by the pressing substrate 7 to fix it → the stem 304 is fixed to the frame substrate 5, but like the third embodiment, within a range in which a predetermined optical coupling adjustment is possible. , Partial order may be exchanged. Also in this case, the same effect is obtained.

Further, in the first to fifth embodiments, the groove for fixing the optical fiber supporting member 9 by bonding is the concave groove 6
Although it is composed of A, 406A, and 7A, it is not limited to this and may be, for example, a U-shaped groove. Also in this case, the same effect is obtained. Further, in the first to fifth embodiments, the optical fiber fixing substrates 6 and 406 and the stems 4 and 30 are provided.
4, 404 and the pressing substrate 7 are made of silicon, but are not limited to this, and may be made of glass, ceramics (eg, alumina ceramics, zirconia ceramics), aluminum nitride, or the like. In the case of, the same effect is obtained. Further, in the first to fifth embodiments, the optical fiber support member 9
Is made of zirconia ceramics, but is not limited to this, and may be made of, for example, transparent glass, transparent plastic, transparent resin, or the like. Similar effects are obtained in these cases. Moreover, in the said 1st-5th embodiment, the optical fiber support member 9, the stems 4, 3 are provided.
04, 404, the optical fiber fixing substrates 6 and 406, and the pressing substrate 7 are fixed with resin. In this case,
It is desirable to use a resin having excellent adhesive strength, moisture resistance and heat resistance, and it is preferable to bond and fix it with, for example, an ultraviolet curable resin, a thermosetting resin or a thermoplastic resin. Similar effects are obtained in these cases.

[0078]

According to the invention of claim 1 or 2, since a plurality of substantially L-shaped lead terminals are provided near both ends in the plane direction of the frame substrate, when they are erected on the external circuit board. In addition, the entire optical semiconductor module is firmly supported by the plurality of legs on both sides of the frame substrate.
Therefore, the stability after mounting is improved as compared with the conventional structure in which four substantially parallel external frames following the lead frame are erected on the external circuit board. Furthermore, since almost all of the module is packaged with the first resin as the protection means, compared with the conventional structure in which the four lead frames positioned at the predetermined positions are fixed with the resin in the housing,
Highly accurate positioning and fixing can be easily performed.
Therefore, it is possible to obtain an optical semiconductor module excellent in mass productivity.

An optical fiber supporting member fixing connecting member for connecting an optical fiber supporting member having an outer diameter of 0.8 mm or more and 2.5 mm or less and having a relatively large diameter is formed by dicing to form at least one groove. Since the material is configured by cutting and dividing into a plurality of pieces in the direction perpendicular to the groove, the cross-sectional shape of the groove can be made the same over the entire length of the groove.
Unlike the case of forming a groove by dicing for each member, the R shape does not occur at the groove end positions at the beginning and the end of transfer. Therefore, due to the R shape, the distance between the semiconductor light emitting element and the tip of the optical fiber is not separated,
It is possible to prevent the optical coupling efficiency from decreasing.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing the overall structure of an optical semiconductor module according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a structure of a ring-shaped grindstone for dicing processing and an optical fiber fixing substrate.

FIG. 3 is a perspective view including a partial cross-sectional structure of the ring-shaped grindstone for dicing processing shown in FIG.

4 is a cross-sectional view of the ring-shaped grindstone for dicing processing shown in FIG.

5 is a transverse cross-sectional view showing a cross-sectional structure of the optical fiber fixing substrate shown in FIG.

FIG. 6 is a perspective view showing a structure in which an optical fiber support member is joined and fixed to an optical fiber fixing substrate.

7A and 7B are a top view and a perspective view showing an assembling procedure of the optical semiconductor module shown in FIG.

8 is a perspective view showing an assembly procedure of the optical semiconductor module shown in FIG.

9 is a perspective view showing an assembling procedure of the optical semiconductor module shown in FIG.

FIG. 10 is a modification of the adjusting method in the direction perpendicular to the optical axis.

FIG. 11 is a perspective view showing a connection structure between an optical semiconductor module and an optical connector according to a second embodiment of the present invention.

FIG. 12 is a perspective view showing a main part structure of the entire structure of an optical semiconductor module according to a third embodiment of the present invention, excluding a frame substrate, a transparent resin, and a molding resin.

13 is a vertical cross-sectional view showing the structure of the optical semiconductor module shown in FIG.

14 is a cross-sectional view taken along the line DD in FIG.

FIG. 15 is a perspective view showing a structure of a main part of the entire structure of an optical semiconductor module according to a fourth embodiment of the present invention, excluding a frame substrate, a transparent resin, and a molding resin.

16 is a vertical cross-sectional view showing the structure of the optical semiconductor module shown in FIG.

FIG. 17 is a transverse sectional view taken along the line EE in FIG.

FIG. 18 is a perspective view showing the structure of a main part of the overall structure of an optical semiconductor module according to a fifth embodiment of the present invention, excluding a frame substrate, transparent resin, and mold resin.

19 is a vertical cross-sectional view showing the structure of the optical semiconductor module shown in FIG.

20 is a transverse sectional view taken along the line FF in FIG.

[Explanation of symbols]

1 Laser Diode 2 Photodiode 3 Optical Fiber 4 Stem 5 Frame Substrate 6 Optical Fiber Fixing Substrate 6A Recessed Groove 7 Retaining Substrate 7A Recessed Groove 8 Resin 9 Optical Fiber Support Member 10 Resin Coating 11 Transparent Resin 12 Mold Resin 14 Ring Grinding Stone 15 Outermost peripheral surface 16a Side surface 16b Side surface 17 Silicon wafer 17A Recessed groove 19 Lead terminal 19a Root portion 19b Tip portion 20 Wire bonding lead 100 Optical semiconductor module 200 Optical semiconductor module 210 Optical fiber resin coating 222 Guide hole 223 Guide pin 224 Stopper 225 Stopper Guide 226 Optical connector 300 Optical semiconductor module 304 Stem 304A Step surface 304B Step end surface 304C Top surface 400 Optical semiconductor module 404 Stem 406 Optical fiber fixing substrate 406A Recessed groove 406B Step surface 406C Step end surface 406D Upper surface 500 Optical semiconductor module θ ₁ Interior angle formed by inclined surface of ring-shaped grindstone θ ₂ Interior angle formed by inclined surface of recessed groove

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shoichi Takahashi 190 Kashiwagi, Komoro City, Nagano Prefecture, Hitachi, Ltd. Inside the Komoro Plant (56) References JP-A-2-161406 (JP, A) JP-A-3- 11307 (JP, A) JP 4-330788 (JP, A) JP 6-27344 (JP, A) JP 6-160678 (JP, A) JP 7-35958 (JP, A) JP-A-7-56056 (JP, A) JP-A-60-68301 (JP, A) JP-A-63-181489 (JP, A) Actual opening Flat 3-16109 (JP, U) Actual opening Sho-62-35309 (JP, U) (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02B 6/42

Claims (14)

(57) [Claims] 1. A semiconductor light emitting element and a semiconductor light receiving element, an optical fiber optically coupled to the semiconductor light emitting element and the semiconductor light receiving element for optical transmission, and at least a semiconductor light emitting element of the semiconductor light emitting element and the semiconductor light receiving element. In an optical semiconductor module having a device mounting board member for mounting the device, a frame substrate is electrically connected to the semiconductor light emitting device and the semiconductor light receiving device, and the semiconductor light emitting device and the semiconductor light receiving device are electrically connected to the outside. And an optical fiber support member for internally holding and fixing the optical fiber, and an optical fiber support member fixing connection member for connecting the optical fiber support member to the frame substrate, and The element mounting substrate member connects the mounted semiconductor element to the frame substrate, and the lead terminals are connected to the frame. A plurality of lead terminals are provided in the vicinity of both ends of the board in the surface direction, and each of the lead terminals has a root portion protruding outward in the surface direction of the frame board and a surface portion of the frame board on the tip side from the root portion. The frame substrate, the element mounting substrate member, the optical fiber supporting member fixing connecting member, at least a part of the optical fiber supporting member, and each lead. At least a part of the root portion of the terminal is covered and packaged with a first resin except for the periphery of the optical coupling portion between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber. The board member is fixed to the frame board and has a step portion for joining and fixing the board member for fixing the optical fiber supporting member. Optical fiber fixing substrate member, an optical semiconductor module, characterized in that the end face thereof so as to be in close contact with the end face of the stepped portion is arranged fixed to the device mounting board member. 2. A semiconductor light emitting element and a semiconductor light receiving element, an optical fiber optically coupled to the semiconductor light emitting element and the semiconductor light receiving element for optical transmission, and at least a semiconductor light emitting element of the semiconductor light emitting element and the semiconductor light receiving element. In an optical semiconductor module having a device mounting board member for mounting the device, a frame substrate is electrically connected to the semiconductor light emitting device and the semiconductor light receiving device, and the semiconductor light emitting device and the semiconductor light receiving device are electrically connected to the outside. And an optical fiber support member for internally holding and fixing the optical fiber, and an optical fiber support member fixing connection member for connecting the optical fiber support member to the frame substrate, and The element mounting substrate member connects the mounted semiconductor element to the frame substrate, and the lead terminals are connected to the frame. A plurality of lead terminals are provided in the vicinity of both ends of the board in the surface direction, and each of the lead terminals has a root portion protruding outward in the surface direction of the frame board and a surface portion of the frame board on the tip side from the root portion. The frame substrate, the element mounting substrate member, the optical fiber supporting member fixing connecting member, at least a part of the optical fiber supporting member, and each lead. At least a part of the root portion of the terminal is covered and packaged with a first resin except for the periphery of the optical coupling portion between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber. The member fixing board member is fixed to the frame board, and includes a step portion for joining and fixing the element mounting board member. Device mounting board member, an optical semiconductor module, characterized in that the end face thereof so as to be in close contact with the end face of the stepped portion is arranged fixed to the optical fiber fixing substrate member. 3. A optical semiconductor module according to claim 1 or 2, wherein at least one of the packaging board member and the optical fiber supporting member fixing connecting member, mounted on a frame substrate provided with the lead terminal An optical semiconductor module characterized in that 4. A optical semiconductor module according to claim 1 or 2, wherein the periphery of the optical coupling portion between the optical fiber and the semiconductor light emitting device and a semiconductor light receiving element, it is covered by a transparent second resin An optical semiconductor module characterized by: 5. The optical semiconductor module according to claim 1 or 2 , wherein a space is provided around the optical coupling portion between the semiconductor light emitting element and the semiconductor light receiving element and the optical fiber by not being filled with the first resin. An optical semiconductor module characterized by being formed. 6. The optical semiconductor module according to claim 1 or 2, wherein said optical fiber support member has an outer diameter of 0.8m
The connecting member for fixing the optical fiber supporting member has a substantially cylindrical shape of m or more and 2.5 mm or less, and the grinding stone is rotated and ground to the base material having a uniform thickness to transfer the grinding stone cross-sectional shape. After forming at least one groove by dicing,
The optical fiber support member is formed by cutting and dividing the base material in which the groove is formed into at least a plurality of pieces in a direction perpendicular to the groove, and the optical fiber support member is formed on the optical fiber support member fixing connection member. An optical semiconductor module, wherein the optical semiconductor module is bonded and fixed to a groove formed therein. 7. The optical semiconductor module according to claim 6 , wherein the groove formed in the connecting member for fixing the optical fiber supporting member has a U-shaped groove having a U-shaped cross section and a recess having a cross-sectional shape. An optical semiconductor module, which is one of the concave grooves. 8. The optical semiconductor module according to claim 7 , wherein a cross-sectional shape of the one groove is such that an inner angle formed by both inclined surfaces forming a groove side surface is 40 ° or more and 100 ° or less. Optical semiconductor module. 9. The optical semiconductor module according to claim 8 , wherein an interior angle formed by the both inclined surfaces is 60 degrees. 10. The optical semiconductor module according to claim 1 or 2 , wherein the optical fiber supporting member fixing connecting member is an optical fiber supporting member fixing substrate member on which an optical fiber supporting member is mounted. An optical semiconductor module, comprising: a pressing substrate that presses the fiber supporting member from above to fix and hold the fiber supporting member. 11. The optical semiconductor module according to claim 1 , wherein the connecting member for fixing the optical fiber supporting member is a pressing board for pressing and fixing the optical fiber supporting member from above, and the element mounting board member. Is provided with the step portion for directly bonding and fixing the optical fiber supporting member. 12. The optical semiconductor module according to claim 1 or 2 , wherein an optical connector is provided with a facing end face arranged to face a connecting direction end face of the optical fiber and a connecting optical fiber extending from the facing end face in an extension direction. , Further comprising guide means for guiding so as to have a predetermined positional relationship, and connection fixing means for performing connection and fixing, and all of the optical fiber supporting member, and the connection direction end face of the optical fiber. The removed part is covered with the first resin and packaged. 13. The optical semiconductor module according to claim 1 or 2, wherein said optical fiber supporting member fixing connecting member and the device mounting board member, silicon, glass, alumina ceramics, zirconia ceramics, and of aluminum nitride An optical semiconductor module comprising at least one material. 14. The optical semiconductor module according to claim 1 or 2, wherein said optical fiber support member, the light, wherein the glass, zirconia ceramics, plastics, and that it is constituted by at least one material of the resin Semiconductor module.