JP3358499B2 - Ceramic electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component, and more particularly to a structure of a terminal portion of a ceramic electronic component having a chip-shaped ceramic electronic component body such as a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art For example, when a ceramic electronic component such as a multilayer ceramic capacitor is mounted on a substrate made of aluminum having excellent heat dissipation, the difference in thermal expansion between the aluminum substrate and the ceramic electronic component is large. In a temperature cycle in which the temperature rises and falls repeatedly, there is a problem that the ceramic electronic component is likely to be broken. In particular, in the case of a high-capacity Pb-based multilayer ceramic capacitor required in the power supply market, this problem is more likely to occur because its bending strength is relatively low.

A technique for solving the above problem is described in, for example, Japanese Patent Application Laid-Open No. 5-283280.
In Japanese Patent Application Laid-Open No. Hei 5-283280, a laminated ceramic capacitor is provided on an external electrode with a terminal member which is branched from the external electrode and bent so as to approach the external electrode, and this terminal member is soldered to a substrate. It states that a capacitor is mounted on a substrate. According to such a mounting state, even when the substrate expands or contracts due to a temperature change, the stress can be absorbed by the movement of the terminal member and can be prevented from being directly applied to the capacitor body. This publication also describes that the terminal member is plated with solder in order to improve the solderability of the terminal member.

[0004]

However, the terminal member having the above structure has the following problems. That is, since the terminal member is bent so as to approach the external electrode, for example, solder applied to mount the multilayer ceramic capacitor on the substrate enters the gap between the terminal member and the external electrode, and A bridge made of solder is likely to occur between them. The solder bridge hinders the movement of the terminal member. As a result, the effect of absorbing the stress of the substrate due to the temperature change as described above can no longer be expected from the terminal member, and despite the provision of the terminal member, the multilayer ceramic capacitor is broken by thermal shock. Sometimes.

An object of the present invention is to provide a ceramic electronic component which can solve the above-mentioned problems.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned technical problems, the present invention provides a chip-shaped ceramic electronic component body having terminal electrodes formed at both ends and a metal member bent in a U-shape. A terminal member, which is constituted by a plate and one side portion in the bending is attached to each terminal electrode while the surface facing outward in the bent state is opposed to the terminal electrode, and the other side portion in the bending is an attachment side to the substrate. In the bent state of the terminal member, a surface which faces inward in the bent state is formed with a solder non-affinity surface which does not adapt to solder, and a surface which faces outward in the bent state of the terminal member is formed with a solder affinity surface which adapts to solder. It is characterized by having.

In one embodiment of the present invention, the metal plate has a surface having good solderability, and the above-mentioned solder non-affinity surface is
It is formed by treating the surface of the metal plate so as not to be compatible with the solder, and the solder affinity surface is provided by the surface itself of the metal plate. The above-described process for preventing the solder from being blended preferably includes a process of applying a material containing a resin to the surface of the metal plate. The material containing this resin is, for example, a non-conductive resin, rubber, or a conductive resin.

Further, as described above, the metal plate having a surface having good solderability may be soldered on the surface forming the solder affinity surface. In another embodiment of the present invention, the metal plate has a surface having poor solderability, the above-mentioned solder non-affinity surface is provided by the surface itself of the metal plate, and the solder affinity surface is formed of the metal plate. It is formed by treating the surface to be compatible with solder.

The above-mentioned treatment for adjusting to the solder includes a process of applying a metal material compatible with the solder to the surface of the metal plate. The metal material compatible with the solder is, for example, solder, Ag, Au, Pd, or the like. In the present invention, the one side portion and the other side portion in the bending of the terminal member may be at least partially in contact with each other.

A ceramic electronic component according to the present invention has a structure in which a plurality of ceramic electronic component bodies are provided, and a terminal member is commonly attached to each terminal electrode of the plurality of ceramic electronic component bodies. You may.

[0011]

FIG. 1 is a front view showing a ceramic electronic component 1 according to a first embodiment of the present invention. FIG. 2 is an enlarged front view showing a section II of FIG. Referring to FIG. 1, ceramic electronic component 1 includes two chip-shaped ceramic electronic component main bodies 2 constituting, for example, a multilayer ceramic capacitor, and terminal electrodes 3 are provided at both ends of each ceramic electronic component main body 2. Is formed. The terminal electrode 3 may be formed by a thin film forming technique such as sputtering, vapor deposition, or plating, may be formed by a thick film forming technique of applying and baking a conductive paste, or may be formed by a thick film forming technique. It may be formed by plating the film. These ceramic electronic component bodies 2 are stacked one on top of the other while being similarly oriented, and are joined by an adhesive 4.

The above two ceramic electronic component bodies 2
A terminal member 5 is commonly attached to each of the terminal electrodes 3. More specifically, the terminal member 5 is constituted by a metal plate 6 bent in a U-shape, and one side portion 7 in the bending is formed by each terminal electrode 3 with the surface facing outward in the bent state facing the terminal electrode 3. Is attached via a conductive material 8 such as solder or a conductive adhesive. When mounting via solder, a method of solder immersion, a method of applying a solder paste and reflowing, or the like can be adopted.

The other side portion 9 of the terminal member 5 in bending is the side to be attached to the substrate 10 indicated by the broken line, and its end is further bent along the substrate 10 to form the connection terminal portion 11. Is composed. In FIG. 1, the connection terminal portion 11 may be formed by being bent inward as shown by a solid line, or may be formed by being bent outward as shown by a two-dot chain line.

As an example, a metal plate 6 having a thickness of 0.1 mm is used, and the distance between one side portion 7 and the other side portion 9 is 0.5
mm. The surface facing inward in the bent state of the terminal member 5 described above includes a solder non-affinity surface 1 that does not adapt to solder.
2 is formed, and a solder affinity surface 13 which is compatible with solder is formed on the surface facing outward. In this embodiment,
A metal plate 6 having a surface with good solderability is used, and the solder non-affinity surface 12 is formed by treating the surface of the metal plate 6 so as not to fit into the solder. Is given by the surface of the metal plate 6 itself. More specifically, the surface of the metal plate 6 where the solder non-affinity surface 12 is to be provided includes, for example, a non-conductive resin,
The solder non-affinity layer 14 made of a material containing rubber or a resin such as a conductive resin is formed. In order to provide the solder non-affinity surface 12, a chemical treatment such as oxidizing the surface of the metal plate 6 may be performed instead of forming the solder non-affinity layer 14 containing such a resin. On the other hand, metal plate 6
The surface on which the solder affinity surface 13 is to be formed may be soldered to further improve the solderability. In addition to soldering, solder, Ag, Au, Pd, or the like is formed by, for example, plating.

As described above, since the solder affinity surface 13 is formed on the surface of the terminal member 5 facing outward in the bent state, the surface is provided when the ceramic electronic component 1 is mounted on the substrate 10. Solder (not shown) wraps around to connect the solder affinity surface 13 to the substrate 10 to achieve the desired electrical connection and mechanical attachment.
On the other hand, since the solder incompatible surface 12 is formed on the surface of the terminal member 5 that faces inward in the bent state, the above-described solder is applied between the one side portion 7 and the other side portion 9 in the bending of the terminal member 5. Between the gaps between
No bridge is formed by this solder.

As shown in FIG. 1, one end 7 of the terminal member 5 is bent at its end so as to cover the terminal electrode 3 of the ceramic electronic component body 2.
This is also effective in preventing the solder from flowing into an undesired portion. FIG. 3 is a front view showing a ceramic electronic component 21 according to a second embodiment of the present invention. FIG. 4 is an enlarged front view showing a section IV of FIG. 3 in section. The ceramic electronic component 21 has many common configurations as compared with the ceramic electronic component 1 according to the above-described first embodiment. Therefore, in FIGS. 3 and 4, elements corresponding to the elements shown in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 3 and FIG.
Is constituted by a metal plate 23 bent in a U-shape, and the one side part 7 and the other side part 9 in the bending are in contact with each other in most parts thereof.
Similar to the embodiment described with reference to FIGS. 1 and 2, the surface facing inward in the bent state of the terminal member 22 is formed with a solder non-affinity surface 12 that does not adapt to solder,
Similarly, the surface facing outward has a solder affinity surface 13 that is compatible with solder.
Is formed. In this embodiment, a metal plate having a surface with poor solderability is used as the metal plate 23, the non-soldering surface 12 is given by the surface itself of the metal plate 23, and the solder affinity surface 13 is Is formed by treating the surface of the substrate so as to be compatible with the solder. More specifically, a plate made of stainless steel is used as the metal plate 23, and the surface of the metal plate 23 is used as the solder non-affinity surface 12 as it is, The solder affinity layer 24 is formed by pulling.

According to this embodiment, the surface of the metal plate 23 made of stainless steel and having no affinity for solder is formed on the surface of the terminal member 22 facing inward in the bent state. Solder applied when component 21 is mounted on a board (not shown)
Does not sneak into the gap between the one side portion 7 and the other side portion 9 in the bending of the terminal member 22, so that not only the bridge by the solder is not formed but also the one side portion 7 Since the other side portion 9 is in contact with each other, the following effects can be expected.

That is, since the contact between the one side portion 7 and the other side portion 9 is a mutual contact between the surfaces of the metal plate 23 itself,
At this contact portion, electrical conduction is possible. Therefore, as compared with the length of the terminal member 22 itself,
2 can be shortened. This has the effect of preventing the occurrence of an undesirably large inductance component in the relatively long terminal member 22.

In order to achieve the above-described effects, the solder non-affinity surface 12 is used as in the first embodiment.
When forming the solder incompatible layer 14 to give
The solder non-affinity layer 14 may be formed of a conductive material such as a conductive resin. FIG. 5 is a front view showing a ceramic electronic component 31 according to a third embodiment of the present invention, which is partially cut away and shows a cross section.
The ceramic electronic component 31 also has many common configurations as compared with the ceramic electronic component 1 according to the above-described first embodiment. Therefore, in FIG. 5, elements corresponding to the elements shown in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 5, in ceramic electronic component 31, terminal electrode 33 for ceramic electronic component main body 32 also functions as a bonding material, and terminal member 5 is attached by terminal electrode 33. It is characterized by: More specifically, the ceramic electronic component body 32
Is configured as a multilayer ceramic capacitor, and the internal electrodes 34 formed therein are shown in FIG. The terminal electrode 33 formed at the end of the ceramic electronic component main body 32 is made of, for example, a conductive resin. The conductive resin is electrically connected to the internal electrode 34 so as to be electrically connected to the end of the ceramic electronic component main body 32. The terminal member 5 is joined to the ceramic electronic component main body 32 by the conductive resin.

The structure of the terminal member 5 shown in FIG.
This is substantially the same as the terminal member 5 in the first embodiment described above. Note that the configuration regarding the terminal member 5 may be replaced with a configuration in which the one-side portion 7 and the other-side portion 9 in bending are in contact with each other, similarly to the terminal member 22 in the second embodiment. Although the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

For example, in each of the illustrated embodiments, the ceramic electronic component 1, 21 or 31 has two ceramic electronic component bodies 2 or 32, but the number of ceramic electronic component bodies can be arbitrarily changed. There may be more than one or just one. Further, the ceramic electronic component body 2 or 32 constitutes a multilayer ceramic capacitor, but may constitute other ceramic electronic components. Further, although the ceramic electronic component main body 2 or 32 has the terminal electrodes 3 or 33 formed at both ends, as long as the terminal electrodes are formed at least at both ends, further terminal electrodes are formed at other portions. You may do it.

In addition, with respect to the mode of bending the terminal member 5 or 22, the illustrated embodiment shows only the most basic and typical mode of bending, and employs other various modes of bending. Can be.

[0025]

Example 1 A ceramic electronic component 1 as shown in FIG. 1 was manufactured in the following manner. When viewed in the front direction shown in FIG. 1, the Pb-based multilayer ceramic capacitor (capacity: 50 μF) has a length of 2.5 mm and a width of 5.0 mm, and a dimension of 5.5 mm in a direction perpendicular to the plane of FIG. ) Were prepared. The ceramic electronic component body 2 is mounted on a holder, and Ti is 0.1 μm and Ni 30% Cu is 0.5 μm by sputtering.
A terminal electrode 3 composed of a multilayer thin film having m and Ag having a thickness of 0.7 μm was formed. Next, the ceramic electronic component bodies 2 were overlapped and joined via an epoxy adhesive 4.

On the other hand, it is coated with an fluorinated ethylene resin to form a solder non-affinity layer 14 for providing a solder non-affinity surface 12, and solder (Sn / Pb = 9)
/ 1) A drawn 0.1 mm thick brass metal plate 6 was prepared. The metal plate 6 was bent in a U-shape, and the distance between the one side portion 7 and the other side portion 9 in this bending was set to 0.3 mm.

Next, with the terminal member 5 in contact with the terminal electrode 3, the terminal member 5 was attached to the terminal electrode 3 by high-temperature solder (Sn / Pb = 8/92). In order to evaluate the thermal shock cycle reliability of the ceramic electronic component 1 according to Example 1 obtained in this way, in a state where the ceramic electronic component 1 is positioned at a predetermined position on the substrate 10,
The ceramic electronic component 1 was mounted on the substrate 10 by reflow using eutectic solder (Sn / Pb = 60/40). Thermal shock cycle reliability is -50 ° C (30 minutes) to 25 ° C
The capacity was measured before and after 500 cycles of (3 minutes) to 125 ° C. (30 minutes), and the rate of change in capacity was evaluated from the results.

A capacitor having a capacitance change rate of 10% or more was regarded as defective. In the ceramic electronic component 1 according to the first embodiment,
None of the 36 samples were defective.
When the terminal members 5 of the ceramic electronic component 1 were observed, no solder bridges were formed at all, and it can be considered that this was the cause of no defect.
On the other hand, as a comparative example, the solder non-affinity layer 14 was not formed,
Except that both surfaces were soldered (Sn / Pb = 9/1), a sample was prepared by the same method using the same terminal member as in Example 1. In the thermal shock cycle reliability test, Nine out of the 36 samples were defective. When the terminal members of the ceramic electronic components according to these comparative examples were observed, some solder bridges were formed at the terminal members, and it can be considered that this caused the failure.

[0029]

Embodiment 2 A ceramic electronic component 21 as shown in FIG. 3 was manufactured in the following manner. Two ceramic electronic component bodies 2 to be Pb-based multilayer ceramic capacitors similar to those in Example 1 were prepared. A paste containing a silver / palladium powder was applied to both ends of the ceramic electronic component body 2 and baked at a temperature of 600 ° C. or more to form a thick-film terminal electrode 3. Next, the ceramic electronic component bodies 2 were overlapped and joined via an epoxy adhesive 4.

On the other hand, as a metal plate 23 for the terminal member 22, the solder (Sn / Pb = 9
/ 1) A metal plate 23 made of stainless steel having a thickness of 0.1 mm and having a solder affinity layer 24 formed by pulling was prepared. The metal plate 23 was bent into a U-shape, and the one side portion 7 and the other side portion 9 in the bending were brought into contact with each other.

Next, high-temperature solder (Sn / Pb = 8/92)
In a state where the terminal member 22 and the terminal electrode 3 were positioned via the paste, the solder paste was melted by reflow, and the terminal member 22 was attached to the terminal electrode 3. Then
The thermal shock cycle reliability was evaluated in the same manner as in Example 1. As a result, in the ceramic electronic component 21 according to Example 2, none of the 36 samples had any defect. Also in the terminal member 22 of the ceramic electronic component 21, no solder bridge was generated.

The resonance frequency of the ceramic electronic component 21 according to Example 2 was measured.
5 kHz was indicated. On the other hand, for comparison, when the resonance frequency of the ceramic electronic component 1 according to Example 1 described above was measured, it showed only 300 kHz. For this reason, in the first embodiment, the length of the terminal member 5 itself directly contributes to the formation of the inductance component. In the second embodiment, however, the one side portion 7 and the other side portion 9 of the terminal member 22 are formed.
Are in contact with each other and electrical conduction is possible at this contact portion, so that the actual electrical conduction path passing through the terminal member 22 can be made shorter than the length of the terminal member 22 itself. Therefore, it can be seen that there is an effect of reducing the inductance component.

[0033]

Example 3 A ceramic electronic component 1 as shown in FIG. 1 was manufactured in the following manner. Two ceramic electronic component bodies 2 to be Pb-based multilayer ceramic capacitors similar to those in Example 1 were prepared. A paste containing silver powder is applied to both ends of the ceramic electronic component body 2,
Baking at a temperature of 600 ° C. or higher, Ni
The terminal electrode 3 was formed by performing wet plating of Sn and Pb. Next, the ceramic electronic component bodies 2 were overlapped and joined via an epoxy adhesive 4.

On the other hand, a 0.1 mm thick phosphor bronze metal plate 6 drawn by soldering (Sn / Pb = 4/6) was prepared.
Heat resistant rubber was applied to form a solder non-affinity layer 14 for providing a solder non-affinity surface 12 on one surface of the metal plate 6. This metal plate 6 is bent into a U-shape, and the distance between one side portion 7 and the other side portion 9 in this bending is set to 0.3 mm.
Set to.

Next, the terminal member 5 was attached to the terminal electrode 3 with a conductive resin. Next, the thermal shock cycle reliability was evaluated in the same manner as in Example 1. as a result,
In the ceramic electronic component 1 according to Example 3, none of the 36 samples was defective. Also in these terminal members 5 of the ceramic electronic component 1, no solder bridge was generated.

[0036]

Embodiment 4 A ceramic electronic component 31 as shown in FIG. 5 was manufactured in the following manner. Two ceramic electronic component bodies 32 to be Pb-based multilayer ceramic capacitors similar to those in Example 1 were prepared. The ceramic electronic component body 32 was barrel-polished to sufficiently expose the ends of the internal electrodes 34 inside the body. Next, the ceramic electronic component bodies 32 were overlapped and joined via the epoxy adhesive 4.

On the other hand, a metal plate 6 made of brass having a thickness of 0.1 mm and having a thickness of 0.1 mm drawn by soldering (Sn / Pb = 4/6) is prepared, and one surface of the metal plate 6 is provided with a solder non-affinity surface 12. Conductive resin was applied to form a solder non-affinity layer 14 for use. The metal plate 6 was bent into a U-shape, and the one side portion 7 and the other side portion 9 in this bending were brought into contact with each other. Next, a conductive resin is applied to both ends of the ceramic electronic component main body 32 so as to be connected to the associated internal electrodes 34,
As a result, the terminal electrode 33 was formed, and the terminal member 5 was joined to each end of the ceramic electronic component body 32 with the same conductive resin.

Next, the thermal shock cycle reliability was evaluated in the same manner as in Example 1. As a result, even in the ceramic electronic component 31 according to Example 4, none of the 36 samples was defective. Also in the terminal members 5 of these ceramic electronic components 31, no solder bridge was generated. The resonance frequency of the ceramic electronic component 31 according to Example 4 was measured and found to be 360 kHz.

[0039]

As described above, according to the present invention, the terminal electrodes formed on both ends of the chip-shaped ceramic electronic component main body have the terminal members formed of the metal plates bent in a U-shape. In the bent state of the terminal member, a surface facing inward is formed with a solder non-affinity surface that does not adapt to solder, and a surface facing solder is formed on a surface facing outward similarly. . Therefore, the solder applied for mounting the chip-shaped electronic component on the substrate may enter the gap between the one side portion and the other side portion in the bending of the terminal member due to the action of the solder incompatible surface facing inward. While being prevented, appropriate soldering between the terminal member and the substrate is achieved while conforming to the outwardly solder-friendly surface.

Therefore, it is possible to reliably prevent the formation of a bridge made of solder between the one side portion and the other side portion in the bending of the terminal member, and it is also possible to prevent the movement of the terminal member by the solder bridge. Absent. Therefore, in the mounted state, the expansion and contraction stress of the substrate due to the temperature change can be advantageously absorbed by the movement of the terminal member, so that the ceramic electronic component can be prevented from being damaged by the thermal shock.

Further, as described above, the action of the solder non-affinity surface can reliably prevent the solder from entering the gap between the one side portion and the other side portion in the bending of the terminal member. Therefore, it is not necessary to intentionally widen the interval between the one side portion and the other side portion in the bending of the terminal member. Therefore, it is not necessary to increase the size of the chip-shaped electronic component due to the terminal member or to make the terminal member easily deformable.

Further, according to the present invention, the solder is prevented from entering between the one side portion and the other side portion in the bending of the terminal member. Part and the other side part,
At least some of them can be in contact with each other. As described above, when the one side portion and the other side portion are in contact with each other, by making the solder non-affinity surface conductive, electrical conduction at the contact portion can be enabled. Therefore, the actual electrical conduction path passing through the terminal member can be shortened as compared with the length of the terminal member itself, and unnecessary inductance components that can occur in the terminal member can be reduced.

Further, when the ceramic electronic component according to the present invention includes a plurality of ceramic electronic component bodies and a terminal member is commonly attached to each terminal electrode of the plurality of ceramic electronic component bodies, These ceramic electronic component bodies can also function to be electrically connected to each other and mechanically fixed.

[Brief description of the drawings]

FIG. 1 is a front view showing an appearance of a ceramic electronic component 1 according to a first embodiment of the present invention.

FIG. 2 is an enlarged front view showing a section II of FIG. 1 in section.

FIG. 3 is a front view showing an appearance of a ceramic electronic component 21 according to a second embodiment of the present invention.

FIG. 4 is an enlarged front view showing a section IV of FIG. 3 in section;

FIG. 5 is a front view showing a ceramic electronic component 31 according to a third embodiment of the present invention, which is partially cut away and shows a cross section.

[Explanation of symbols]

 1,21,31 Ceramic electronic component 2,32 Ceramic electronic component main body 3,33 Terminal electrode 5,22 Terminal member 6,23 Metal plate 7 One side portion 8 Conductive material 9 Other side portion 10 Substrate 11 Connection terminal portion 12 No solder Affinity surface 13 Solder affinity surface 14 Solder non-affinity layer 24 Solder affinity layer

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Hideki Nakayama 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (56) References JP-A-11-74147 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01G 4/00-4/40

Claims (10)

(57) [Claims] 1. A chip-shaped ceramic electronic component main body having terminal electrodes formed at both ends, and a metal plate bent in a U-shape, and a surface facing outward in the bent state faces the terminal electrodes. A terminal member, one side portion of the bending being attached to each of the terminal electrodes, and the other side portion of the bending being a side to be attached to the substrate, and a surface facing inward in the bent state of the terminal member is provided. A ceramic electronic component, wherein a non-solder compatible surface that is not compatible with solder is formed, and a solder-compatible surface compatible with solder is formed on a surface of the terminal member facing outward in a bent state. 2. The metal plate has a surface having good solderability, and the non-solder compatible surface is formed by treating the surface of the metal plate so as not to be compatible with solder, and The ceramic electronic component according to claim 1, wherein a surface is provided by a surface of the metal plate itself. 3. The ceramic electronic component according to claim 2, wherein the treatment for preventing the solder from being mixed with the solder includes a treatment for applying a material containing a resin to the surface of the metal plate. 4. The method according to claim 1, wherein the material containing the resin is a non-conductive resin,
The ceramic electronic component according to claim 3, wherein the ceramic electronic component is one selected from the group consisting of rubber and a conductive resin. 5. The metal plate is soldered on a surface forming the solder affinity surface.
A ceramic electronic component according to any one of the above. 6. The metal plate has a surface with poor solderability, the non-solder compatible surface is provided by the surface of the metal plate itself, and the solder compatible surface is formed by soldering the surface of the metal plate. Formed by processing to conform to
The ceramic electronic component according to claim 1. 7. The ceramic electronic component according to claim 6, wherein the treatment for adjusting to the solder includes applying a metal material adapted to solder to the surface of the metal plate. 8. The metal material compatible with the solder is solder, A
The ceramic electronic component according to claim 7, which is any one of g, Au, and Pd. 9. The ceramic electronic component according to claim 1, wherein the one side portion and the other side portion in the bending of the terminal member are at least partially in contact with each other. 10. A plurality of ceramic electronic component bodies, wherein the terminal members are commonly attached to the terminal electrodes of each of the plurality of ceramic electronic component bodies.
The ceramic electronic component according to claim 1.