JP3356618B2 - heatsink - Google Patents
heatsinkInfo
- Publication number
- JP3356618B2 JP3356618B2 JP08537696A JP8537696A JP3356618B2 JP 3356618 B2 JP3356618 B2 JP 3356618B2 JP 08537696 A JP08537696 A JP 08537696A JP 8537696 A JP8537696 A JP 8537696A JP 3356618 B2 JP3356618 B2 JP 3356618B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- transfer tube
- heat
- boiling
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体素子冷却用
にヒートパイプを使用した高性能のヒートシンクに係
り、特にそのヒートパイプの伝熱管の沸騰部及び凝縮部
に改良を加えて伝熱性能を向上させたヒートシンクに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-performance heat sink using a heat pipe for cooling a semiconductor device, and more particularly to improving the heat transfer performance by improving a boiling part and a condensing part of a heat transfer tube of the heat pipe. It relates to an improved heat sink.
【０００２】[0002]
【従来の技術】半導体素子用ヒートシンクにおいてはヒ
ートパイプが使用され、そのヒートパイプの作動液を収
容する伝熱管の内面は、従来ストレートグルーブウィッ
クタイプのものが使用されてきた。2. Description of the Related Art A heat pipe has been used as a heat sink for a semiconductor device, and a straight groove wick type heat transfer pipe has been used as an inner surface of a heat transfer pipe for containing a working fluid of the heat pipe.
【０００３】図４に示されるように、このストレートグ
ルーブウィックタイプの従来のヒートパイプは、沸騰部
の受熱ブロック（図示されず）に埋め込まれた伝熱管２
０の内面に軸方向に複数のグルーブ２１を形成したもの
である。伝熱管２０の沸騰部で沸騰された作動ガスは凝
縮部に移りそこで凝縮され、この凝縮された作動液が沸
騰部まで流下して循環することで沸騰部の熱が凝縮部に
移送され、沸騰部に取り付けられている半導体素子の冷
却が行われる。As shown in FIG. 4, a conventional heat pipe of this straight groove wick type has a heat transfer tube 2 embedded in a heat receiving block (not shown) of a boiling portion.
A plurality of grooves 21 are formed in the inner surface of the groove 0 in the axial direction. The working gas boiled in the boiling portion of the heat transfer tube 20 moves to the condensing portion and is condensed there, and the condensed working fluid flows down to the boiling portion and circulates, so that the heat of the boiling portion is transferred to the condensing portion, and The cooling of the semiconductor element attached to the part is performed.
【０００４】この伝熱管２０に封入する作動液として
は、沸点が約50℃のパーフロロカーボンが使用される。
また、封入する作動液の量については、これが沸騰部の
伝熱管２０の容量の約１／３を越えて封入されても性能
が向上しないため、その全体容量の約１／３程度のみが
封入される。As the working fluid sealed in the heat transfer tube 20, perfluorocarbon having a boiling point of about 50 ° C. is used.
In addition, as for the amount of the working fluid to be filled, even if the amount of the working fluid exceeds about 1/3 of the capacity of the heat transfer tube 20 in the boiling portion, the performance is not improved, and therefore, only about 1/3 of the total capacity is filled. Is done.
【０００５】[0005]
【発明が解決しようとする課題】従来のヒートパイプの
伝熱管の場合、その内面の伝熱面が軸方向のグルーブで
構成されるため、その構成上、比較的沸点の高い（50
℃）作動液を使用せざるを得ない。また作動液が沸騰部
伝熱管の全体容量の約１／３程度しか封入されない。つ
まり、従来のヒートパイプの伝熱管においては、作動液
の選択及び作動液の伝熱管への封入量に制限があり、ゆ
えにヒートパイプ１本当たりの熱輸送量に限界があっ
た。In the case of the conventional heat transfer tube of a heat pipe, the heat transfer surface on the inner surface thereof is constituted by grooves in the axial direction.
℃) Working fluid must be used. Further, only about 1/3 of the total volume of the boiling portion heat transfer tube is filled with the working fluid. That is, in the conventional heat transfer tube of the heat pipe, there is a limitation in the selection of the working fluid and the amount of the working fluid sealed in the heat transfer tube, and therefore, the amount of heat transport per heat pipe is limited.
【０００６】また、従来の沸騰部伝熱管は沸騰部の金属
ブロックに直接埋め込まれるため、ある程度の温度ムラ
がどうしても発生するという問題もさらに有していた。Further, since the conventional heat transfer tube in the boiling portion is directly embedded in the metal block in the boiling portion, there is a further problem that a certain degree of temperature unevenness is inevitably generated.
【０００７】そこで、本発明の目的は、従来のヒートシ
ンクにみられる上記の欠点を解消し、熱輸送量が大きい
一方、温度ムラが小さいコンパクト型ヒートシンクを提
供することである。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned disadvantages of the conventional heat sink and to provide a compact heat sink having a large heat transport amount and a small temperature unevenness.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に請求項１の発明は、ヒートパイプを使用した半導体用
ヒートシンクにおいて、半導体素子を取り付ける金属製
の受熱ブロックに埋め込んだヒートパイプの沸騰部伝熱
管の内面に、円周方向に形成されかつ上向きに開いたト
ンネル状の溝を軸方向に沿って多段に設けて伝熱面を形
成して構成されている。In order to achieve the above object, a first aspect of the present invention relates to a heat sink for a semiconductor using a heat pipe, wherein the heat pipe includes a boiling portion of a heat pipe embedded in a metal heat receiving block for mounting a semiconductor element. On the inner surface of the heat transfer tube, a tunnel-like groove formed in the circumferential direction and opened upward is provided in multiple stages along the axial direction to form a heat transfer surface.
【０００９】請求項２の発明は、上記ヒートパイプの凝
縮部伝熱管の内面に円周方向に形成された刃物状の薄い
フィンを軸方向に沿って多段に設け、さらにこのフィン
の一部に軸方向の溝を設けて構成されている。According to a second aspect of the present invention, thin blade-like fins formed in the circumferential direction on the inner surface of the condensing portion heat transfer tube of the heat pipe are provided in multiple stages along the axial direction, and furthermore, a part of these fins is provided. It is configured with an axial groove.
【００１０】請求項３の発明は、上記沸騰部伝熱管が受
熱ブロックにハンダ等の金属で埋め込まれ、その沸騰部
伝熱管と上記凝縮部伝熱管とが絶縁セラミック継手で接
続されて構成されている。According to a third aspect of the present invention, the boiling portion heat transfer tube is embedded in a heat receiving block with a metal such as solder, and the boiling portion heat transfer tube and the condensing portion heat transfer tube are connected by an insulating ceramic joint. I have.
【００１１】請求項４の発明は、上記ヒートパイプに封
入する作動液が、上記沸騰部伝熱管のほぼ全体を満たす
程度に封入されて構成されている。According to a fourth aspect of the present invention, the working fluid filled in the heat pipe is filled so as to fill substantially the entirety of the heat transfer tube.
【００１２】請求項５の発明は、上記作動液に、沸点３
０℃程度の沸点の低いパーフロロカーボンを使用して構
成されている。According to a fifth aspect of the present invention, the working fluid has a boiling point of 3%.
It is configured using perfluorocarbon having a low boiling point of about 0 ° C.
【００１３】[0013]
【発明の実施の形態】以下本発明の好適実施の形態を添
付図面により説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
【００１４】図１は、本発明の半導体素子用ヒートシン
ク５０の全体図を示す。ヒートシンク５０は、半導体素
子としてのサイリスタ素子９から発生する熱を冷却すべ
く構成され、サイリスタ素子９に銅製の受熱ブロック１
が設けられ、受熱ブロック１内部には複数のヒートパイ
プ１０の沸騰部伝熱管２がハンダ等の金属を介して鉛直
に埋め込まれる。各沸騰部伝熱管２の上端には、受熱ブ
ロック１上部を貫通した後、セラミック製絶縁碍子（継
手）３を介して凝縮部伝熱管６の下端が接続される。す
なわち、沸騰部伝熱管２及び凝縮部伝熱管６、並びにこ
れらの伝熱管を接続する絶縁碍子３がヒートパイプ１０
を構成する。FIG. 1 is an overall view of a heat sink 50 for a semiconductor device according to the present invention. The heat sink 50 is configured to cool heat generated from the thyristor element 9 as a semiconductor element.
Are provided, and inside the heat receiving block 1, the boiling part heat transfer tubes 2 of the plurality of heat pipes 10 are vertically embedded via a metal such as solder. After penetrating the upper part of the heat receiving block 1, the lower end of the condenser heat transfer tube 6 is connected to the upper end of each boiling portion heat transfer tube 2 via a ceramic insulator (joint) 3. That is, the heat transfer tube 2 and the condenser heat transfer tube 6 and the insulator 3 connecting these heat transfer tubes are connected to the heat pipe 10.
Is configured.
【００１５】ヒートパイプ１０の内部には、沸点約３０
℃の作動液（パーフロロカーボン）が、沸騰部伝熱管２
全体を満たすように封入される。なお、サイリスタ素子
９は、供電端子７を有する。The heat pipe 10 has a boiling point of about 30
℃ working fluid (perfluorocarbon)
Enclosed to fill the whole. Note that the thyristor element 9 has the power supply terminal 7.
【００１６】絶縁碍子３を介して沸騰部伝熱管２に接続
される各凝縮部伝熱管６は、上方に垂直に延びると共に
その頂部にヒートパイプのシール部を保護する保護キャ
ップ８を有する。凝縮部伝熱管６に接続して複数の冷却
フィン５が多層状に設けられる。冷却フィン５の最下部
には、外気側と内側の電装部を遮断する水切り板４が設
けられる。Each condenser heat transfer tube 6 connected to the boiling portion heat transfer tube 2 via the insulator 3 has a protection cap 8 extending vertically upward and protecting a seal portion of the heat pipe at the top. A plurality of cooling fins 5 are connected to the condenser heat transfer tube 6 and are provided in a multilayer shape. At the lowermost part of the cooling fins 5, a drain plate 4 for shutting off the outside air side and the inside electrical unit is provided.
【００１７】次に、沸騰部伝熱管２及び凝縮部伝熱管６
の詳細を各々説明する。Next, the boiling part heat transfer tube 2 and the condensing part heat transfer tube 6
Will be described in detail.
【００１８】図２は、沸騰部伝熱管２の詳細を示す。沸
騰部伝熱管２の内面には、図に示されるように、円周方
向に形成されかつ上向きに円弧状に延びたトンネル部材
１１が軸方向に沿って多段に設けられ、この結果、円周
方向に形成されかつ上方向に若干開放されたトンネル状
の溝１２が軸方向に沿って多段に形成される。このトン
ネル状の溝１２は、多くの場合、管軸に対して直角に近
い傾きをもって連続的に形成される。これらトンネル部
材１１及び溝１２により、沸騰部伝熱面１３が形成され
る。FIG. 2 shows the details of the boiling part heat transfer tube 2. As shown in the drawing, tunnel members 11 formed in the circumferential direction and extending upward in an arc shape are provided in multiple stages along the axial direction on the inner surface of the heat transfer tube 2 as a result. A tunnel-like groove 12 formed in the direction and slightly opened upward is formed in multiple stages along the axial direction. In many cases, the tunnel-shaped groove 12 is formed continuously with an inclination close to a right angle to the tube axis. The boiling part heat transfer surface 13 is formed by the tunnel member 11 and the groove 12.
【００１９】図３(a) 及び(b) は、凝縮部伝熱管６の詳
細を示す。凝縮部伝熱管６の内面には、図３(b) に示さ
れるように、円周方向に形成された複数の薄い突起状の
フィン１５ａ，１５ｂが軸方向に沿って多数設けられ
る。フィン１５ａが伝熱管６の内壁から垂直に張り出す
一方、フィン１５ｂは図３(b) の二点鎖線で示すように
円周方向に複数箇所が部分的に下方に曲げられて軸方向
の溝１４を形成する。このフィン１５ａ，１５ｂは、多
くの場合、沸騰部伝熱管２のトンネル状の溝１２と同
様、管軸に対して直角に近い傾きをもって連続的に形成
される。FIGS. 3 (a) and 3 (b) show details of the condenser heat transfer tube 6. FIG. As shown in FIG. 3B, a plurality of circumferentially formed thin projecting fins 15a and 15b are provided on the inner surface of the condenser heat transfer tube 6 along the axial direction. The fins 15a project vertically from the inner wall of the heat transfer tube 6, while the fins 15b are partially bent downward in the circumferential direction as shown by the two-dot chain line in FIG. 14 is formed. In many cases, the fins 15a and 15b are continuously formed with an inclination close to a right angle to the tube axis, similarly to the tunnel-shaped groove 12 of the boiling portion heat transfer tube 2.
【００２０】次に、本実施の形態の作用を説明する。Next, the operation of the present embodiment will be described.
【００２１】サイリスタ素子９（図１参照）で発生した
熱は、サイリスタ素子９に隣接した受熱ブロック１に伝
わり、沸騰部伝熱管２の伝熱面１３を介して作動液を加
熱する。図２で示されるように、伝熱面１３は、沸騰部
伝熱管２内面に円周方向に設けられ且つ上方向に開いた
複数のトンネル状の溝１２から形成されているので、沸
騰部伝熱管２内を満たしている作動液（パーフロロカー
ボン）はここで核状沸騰して効率よく気化される。The heat generated by the thyristor element 9 (see FIG. 1) is transmitted to the heat receiving block 1 adjacent to the thyristor element 9 and heats the working fluid via the heat transfer surface 13 of the boiling portion heat transfer tube 2. As shown in FIG. 2, the heat transfer surface 13 is formed from a plurality of tunnel-shaped grooves 12 that are provided on the inner surface of the heat transfer tube 2 in the circumferential direction and open upward, so that the heat transfer surface Here, the working fluid (perfluorocarbon) filling the inside of the heat pipe 2 is nucleated and boiled efficiently.
【００２２】気化された作動ガスは凝縮部伝熱管６に移
動し、そこで冷却されて液化する。この際、作動ガスは
伝熱管６内部のフィン１５ａ，１５ｂ及び伝熱管６外部
の冷却フィン５によって効率よく冷却され、液化した作
動液はフィン１５ｂにより形成された縦（軸）方向の溝
１４を通って再び沸騰部伝熱管２に戻り、加熱されて再
循環することになる。The vaporized working gas moves to the condenser heat transfer tube 6, where it is cooled and liquefied. At this time, the working gas is efficiently cooled by the fins 15a and 15b inside the heat transfer tube 6 and the cooling fins 5 outside the heat transfer tube 6, and the liquefied working fluid flows through the vertical (axial) grooves 14 formed by the fins 15b. Then, it returns to the boiling portion heat transfer tube 2 again, and is heated and recirculated.
【００２３】以上要するに本発明においては、円周方向
に形成されかつ上向きに若干開いたトンネル状の溝１２
を沸騰部伝熱管２内面に軸方向に沿って複数設け、これ
により作動液の核状沸騰を可能にして沸騰部伝熱面１３
の伝熱及び沸騰性能を高めている。In short, in the present invention, the tunnel-shaped groove 12 formed in the circumferential direction and slightly opened upward is used.
Are provided along the axial direction on the inner surface of the boiling portion heat transfer tube 2, thereby enabling nucleate boiling of the working fluid to make the boiling portion heat transfer surface 13.
Heat transfer and boiling performance.
【００２４】また、この改良によって比較的沸点の低い
（約３０℃）作動液を用いることができ、沸騰部伝熱管
２にこの作動液を満たしてプール状の沸騰を行えるよう
になったので、性能がさらに高まる。In addition, this improvement makes it possible to use a hydraulic fluid having a relatively low boiling point (about 30 ° C.), and to fill the boiling portion heat transfer tube 2 with the hydraulic fluid to perform pool-like boiling. Performance is further enhanced.
【００２５】また、本発明の沸騰部伝熱管２は、半導体
素子を取り付ける受熱ブロック１に伝熱性の高いハンダ
等の金属を介して埋め込まれるので伝熱の障害となる熱
抵抗を小さくできる。一方、沸騰部伝熱管２と凝縮部伝
熱管６とは絶縁性の高いセラミック碍子（継手）３で接
続されるので、絶縁性能を高めることができる。なお、
作動液のパーフロロカーボンも、絶縁性を有する液体で
ある。Further, since the boiling portion heat transfer tube 2 of the present invention is embedded in the heat receiving block 1 on which the semiconductor element is mounted via a metal such as solder having high heat conductivity, it is possible to reduce the thermal resistance which is an obstacle to heat transfer. On the other hand, the boiling part heat transfer tube 2 and the condensing part heat transfer tube 6 are connected by the ceramic insulator (joint) 3 having high insulation properties, so that the insulation performance can be improved. In addition,
The working fluid perfluorocarbon is also a liquid having an insulating property.
【００２６】また、凝縮部伝熱管６の内面に、円周方向
に突起状に形成された薄いフィン１５ａ，１５ｂを軸方
向に複数設け、かつこのフィンの一部１５ｂを下方に屈
曲させて軸方向の溝を設けることにより、作動液の凝縮
性能がさらに高まると共に作動液がスムーズに沸騰部に
戻る。A plurality of circumferentially projecting thin fins 15a and 15b are provided on the inner surface of the condenser heat transfer tube 6 in the axial direction, and a part 15b of the fins is bent downward to form the shaft. By providing the grooves in the directions, the condensation performance of the working fluid is further enhanced, and the working fluid smoothly returns to the boiling portion.
【００２７】なお、本発明の変形例として、凝縮部伝熱
管が垂直に位置されず傾けて使用される場合には、上記
の好適実施の形態で説明されたフィン部１５ａ，１５ｂ
を有する凝縮部伝熱管６（図３参照）に代えて、図４に
示されたストレートグルーブ２１を有する従来の伝熱管
２０を凝縮部伝熱管として使用することも可能である。As a modified example of the present invention, when the condenser heat transfer tube is used not vertically but inclined, the fin portions 15a and 15b described in the preferred embodiment are used.
Instead of the condensing part heat transfer tube 6 (see FIG. 3), the conventional heat transfer tube 20 having the straight groove 21 shown in FIG. 4 can be used as the condensing part heat transfer tube.
【００２８】[0028]
【発明の効果】以上要するに本発明に係るヒートシンク
によれば、以下の優れた効果がもたらされる。In summary, the heat sink according to the present invention has the following excellent effects.
【００２９】(1) 円周方向に形成されかつ上向きに若干
開いたトンネル状の溝を沸騰部伝熱管内面に軸方向に複
数設けることにより、作動液の核状沸騰が行われて沸騰
部伝熱面の伝熱性能が高まる。(1) A plurality of tunnel-shaped grooves formed in the circumferential direction and slightly opened upward are provided in the inner surface of the heat transfer tube in the boiling portion in the axial direction, so that nucleate boiling of the working fluid is performed and the transfer in the boiling portion is performed. The heat transfer performance of the hot surface increases.
【００３０】(2) 上記(1) の改良の結果、比較的沸点の
低い（約３０℃）作動液を沸騰部伝熱管の全体に満たし
て沸騰を行えるので、性能がさらに高まる。(2) As a result of the improvement in the above (1), the working fluid having a relatively low boiling point (about 30 ° C.) is filled in the entire heat transfer tube of the boiling portion to perform boiling, so that the performance is further improved.
【００３１】(3) 沸騰部伝熱管が半導体素子を取り付け
る金属ブロックにハンダ等の金属を介して埋め込まれる
ので、伝熱の障害となる熱抵抗を小さくできる。(3) Since the boiling portion heat transfer tube is embedded in the metal block on which the semiconductor element is mounted via a metal such as solder, it is possible to reduce the thermal resistance which is an obstacle to heat transfer.
【００３２】(4) 凝縮部伝熱管内面に、円周方向に突起
状に形成された薄いフィンを軸方向に複数設けることに
より、作動液の凝縮性能がさらに高まる。またこのフィ
ンの一部に軸方向の溝を付けることにより、作動液をス
ムーズに沸騰部へ戻すことができる。(4) By providing a plurality of circumferentially projecting thin fins in the axial direction on the inner surface of the condenser heat transfer tube, the hydraulic fluid condensation performance is further enhanced. By providing an axial groove in a part of the fin, the working fluid can be smoothly returned to the boiling portion.
【図１】本発明のサイリスタ用ヒートシンクの一実施の
形態を示す側面図である。FIG. 1 is a side view showing an embodiment of a thyristor heat sink of the present invention.
【図２】本発明の円周方向にトンネル状の溝を有する沸
騰部伝熱管の伝熱面を示す側断面図である。FIG. 2 is a side sectional view showing a heat transfer surface of a boiling portion heat transfer tube having a circumferentially-shaped tunnel-shaped groove according to the present invention.
【図３】本発明の円周方向に薄い刃物状のフィンを有す
ると共に軸方向に溝のある凝縮部伝熱管の伝熱面を示す
側断面図である。FIG. 3 is a side sectional view showing a heat transfer surface of a condenser heat transfer tube having circumferentially thin blade-shaped fins and a groove in an axial direction according to the present invention.
【図４】従来のストレートグルーブウィックタイプの伝
熱管を示す図である。FIG. 4 is a view showing a conventional straight groove wick type heat transfer tube.
１ 受熱ブロック ２ 沸騰部伝熱管 ９ サイリスタ（半導体）素子 １０ ヒートパイプ １２ 溝 １３ 沸騰部伝熱面 ５０ ヒートシンク DESCRIPTION OF SYMBOLS 1 Heat receiving block 2 Boiling part heat transfer tube 9 Thyristor (semiconductor) element 10 Heat pipe 12 Groove 13 Boiling part heat transfer surface 50 Heat sink
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 信男 茨城県土浦市木田余町3550番地 日立電 線株式会社土浦工場内 (72)発明者 井坂 功一 茨城県土浦市木田余町3550番地 日立電 線株式会社土浦工場内 (72)発明者 小川原 博之 茨城県土浦市木田余町3550番地 日立電 線株式会社土浦工場内 (56)参考文献 特開 昭50−44543（ＪＰ，Ａ) 特開 平１−203894（ＪＰ，Ａ) 特開 平２−203196（ＪＰ，Ａ) 特開 平５−87475（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) F25D 15/02 H01L 23/427 H05K 7/20 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Nobuo Suzuki 3550 Kida Yomachi, Tsuchiura City, Ibaraki Prefecture Within the Tsuchiura Plant of Hitachi Cable Co., Ltd. (72) Koichi Isaka 3550 Kida Yomachi, Tsuchiura City, Ibaraki Prefecture Hitachi Electric (72) Inventor Hiroyuki Ogawara 3550 Kida Yomachi, Tsuchiura City, Ibaraki Pref. Hitachi Cable Co., Ltd. Tsuchiura Plant (56) References JP-A-50-44543 (JP, A) JP-A-1 -203894 (JP, A) JP-A-2-203196 (JP, A) JP-A-5-87475 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) F25D 15/02 H01L 23/427 H05K 7/20
Claims (5)
シンクにおいて、半導体素子を取り付ける金属製の受熱
ブロックに埋め込んだヒートパイプの沸騰部伝熱管の内
面に、円周方向に形成されかつ上向きに開いたトンネル
状の溝を軸方向に沿って多段に設けて伝熱面を形成した
ことを特徴とするヒートシンク。1. A heat sink for a semiconductor using a heat pipe, wherein a tunnel formed in a circumferential direction and opened upward on an inner surface of a boiling portion heat transfer tube of the heat pipe embedded in a metal heat receiving block for mounting a semiconductor element. A heat sink characterized in that a heat transfer surface is formed by providing a plurality of grooves in multiple stages along the axial direction.
に円周方向に形成された刃物状の薄いフィンを軸方向に
沿って多段に設け、さらにこのフィンの一部に軸方向の
溝を設けた請求項１記載のヒートシンク。2. A blade-shaped thin fin formed in a circumferential direction on an inner surface of a condenser heat transfer tube of the heat pipe is provided in multiple stages along an axial direction, and an axial groove is formed in a part of the fin. The heat sink according to claim 1 provided.
ンダ等の金属で埋め込まれ、その沸騰部伝熱管と上記凝
縮部伝熱管とが絶縁セラミック継手で接続される請求項
１または２記載のヒートシンク。3. The heat transfer tube according to claim 1, wherein the heat transfer tube is embedded in a heat receiving block with a metal such as solder, and the heat transfer tube and the heat transfer tube are connected by an insulating ceramic joint. heatsink.
上記沸騰部伝熱管のほぼ全体を満たす程度に封入される
請求項１記載のヒートシンク。4. The working fluid sealed in the heat pipe,
2. The heat sink according to claim 1, wherein the heat sink is sealed so as to fill substantially the entire heat transfer tube.
低いパーフロロカーボンを使用する請求項１または２記
載のヒートシンク。5. The heat sink according to claim 1, wherein a perfluorocarbon having a low boiling point of about 30 ° C. is used as the working fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08537696A JP3356618B2 (en) | 1996-04-08 | 1996-04-08 | heatsink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08537696A JP3356618B2 (en) | 1996-04-08 | 1996-04-08 | heatsink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09283676A JPH09283676A (en) | 1997-10-31 |
| JP3356618B2 true JP3356618B2 (en) | 2002-12-16 |
Family
ID=13857015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08537696A Expired - Fee Related JP3356618B2 (en) | 1996-04-08 | 1996-04-08 | heatsink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3356618B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5224328B2 (en) * | 2008-01-16 | 2013-07-03 | 古河電気工業株式会社 | Fine metal wire, wick structure and heat pipe using the same |
-
1996
- 1996-04-08 JP JP08537696A patent/JP3356618B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09283676A (en) | 1997-10-31 |
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