JP3350441B2 - Electronic component inspection apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inspection apparatus for measuring various characteristics of an electronic component, and more particularly, to stabilizing the measurement by managing a worn state of a nozzle which sucks the electronic component and transports it to a measuring section. The present invention relates to an electronic component inspection apparatus and method that can be implemented.

[0002]

2. Description of the Related Art Various electrical characteristics of electronic components (hereinafter abbreviated as devices) are measured by an electronic component inspection apparatus. This electronic component inspection apparatus generally includes a device supply unit, a measurement unit, a collection unit, a transport unit, and the like. The devices of the supply unit are taken out one by one by the transport unit and transported to the measurement unit. After the transfer, the measuring unit measures the electrical characteristics of the device. The devices after the measurement are conveyed to the collection unit by the conveyance unit, and are sorted and collected by the collection units provided in predetermined ranks according to the measurement results. This rank also has good and bad sorting.

The transfer unit is provided with a suction nozzle (hereinafter abbreviated as a nozzle) for sucking and holding the device at the end of the hand, and sucks and holds the device at the end of the hand based on the suction force of an air source. Transport. Further, at the time of measurement, the hand presses the measuring jig (test fixture: TF) of the measuring unit at a predetermined pressure while the nozzle holds the device. Thereby, the leads of the device come into contact with the contact terminals provided on the measurement jig, and the measurement signal from the processing unit is input / output to / from the device via a cable or the like, so that various measurements can be performed. Even after the measurement, the nozzle conveys the device to the collection unit while keeping the device in a sucked state.

[0004] In the above-described configuration, an apparatus having a configuration in which a hand moves from a supply section to a collection section has been described. Alternatively, as shown in FIG. 6, there is also an apparatus having a rotary table as a transport section. In this device, a plurality of hands 51 are provided on the peripheral surface of the turntable 50. Also, the rotary table 50
A supply unit 52 for transferring the device to the hand 51,
Collection unit 53 that receives a device after measurement from hand 51
Is provided. And also in the hand 51 of this device, the nozzle is provided at the end portion in the same manner as described above,
The device received from the collecting unit 53 is pressed from above onto the measuring jig 54a of the measuring unit 54 in the suction holding state, and various electric characteristics are measured by the measuring device 54b. Send out. Here, the receiving and sending out of the device is performed when the rotary table 50 is rotated in the direction A in the figure and the hand 51 is located at the supply unit 52 and the collection unit 53. In any of these apparatuses, the nozzle provided in the hand holds the device in a suction state, and moves up and down to press the lead of the device toward the measuring unit at a predetermined contact pressure (contact pressure). ing.

[0005]

However, the above-mentioned nozzle is formed of iron or the like, and as the number of times of measurement of the device increases, the suction surface wears due to aging. Causes of wear include the configuration in which a pressing force is applied to the measurement unit, the material of the suction surface on the device side, and the like. The device is prone to wear on the nozzle side, especially when the device is made of ceramic. In addition, this also occurs when the parallelism between the measurement surface of the measurement unit and the suction surface of the nozzle is not maintained.

The state of wear of the nozzle includes a state in which the whole is worn down, a state in which the nozzle is partially worn out, that is, a state in which the tip of the nozzle is inclined to one side and is worn out. If the nozzle is worn down in this way, the suction state of the device will not be stable, or the device will not be able to be stably pressed against the contact terminal of the measuring unit (a predetermined contact pressure will not be obtained). For example, if the entire nozzle surface is reduced, the contact pressure of the entire device is reduced. This makes it impossible to satisfactorily contact all the terminals of the device with the contact terminals of the measuring section, thus deteriorating the measurement conditions.

[0007] In the conventional apparatus, the wear of the nozzle is measured after a predetermined period of time (for example, 300,000 measurements or once a month),
Performed by visual inspection of the frictional state or at the time of device transport error (at the time of reduced yield). I was often there. As a result, nozzle replacement is frequently performed after the occurrence of an abnormality in the apparatus, and there has been a problem that the operation efficiency of the automatic inspection apparatus is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can routinely manage the frictional state of a nozzle for sucking and holding a device, thereby preventing abnormalities in measurement and inspection due to nozzle wear. It is an object of the present invention to provide an electronic component inspection apparatus and method capable of always performing stable measurement inspection.

[0009]

In order to achieve the above object, an electronic component inspection apparatus according to the present invention comprises a nozzle (N) for sucking and holding an electronic component and a lead for the electronic component. A measuring unit including a measuring jig (54a) having a contact terminal for inputting and outputting a measuring signal, and a nozzle for sucking and holding the electronic component in an electronic component inspection apparatus for measuring characteristics of the electronic component. A sensor (3) for detecting the surface state of the suction surface (Na) of (N) and a predetermined amount of the nozzle so that the lead of the electronic component is brought into contact with the contact terminal of the measuring jig at a predetermined contact pressure. A nozzle elevating means (2) which is made movable and a nozzle wear state is determined based on a detection state of the sensor, and when it is determined that the wear exceeds a predetermined range, an abnormal state is externally output; Within a predetermined range During that determination is Worn is characterized by comprising a control processing unit (4) constant the contact pressure by varying the amount of movement of the nozzle elevating means so as to correspond to the amount of wear.

The processing means (4) calculates and calculates a correction value (ΔY) corresponding to the wear amount of the nozzle (N), and calculates the correction value (ΔY) of the nozzle (N).
May be configured to variably control the amount of movement of the drive source provided in the controller with the correction value.

The processing means (4) receives the detection signal output from the sensor (3) and receives one end (Nb) and the other end (Nc) of the nozzle (N). Based on the respective detection signals, the amount of tilt of the nozzle and the total amount of wear are calculated and obtained, and it is determined whether the amount of tilt and the total amount of wear are within the predetermined range, and each of the above determinations is performed. The processing may be performed.

According to a fourth aspect of the present invention, there is provided an electronic component inspecting apparatus for sucking and holding an electronic component, transporting the electronic component to a measuring section, and measuring characteristics, and supplying the electronic component. A measuring unit (54) for measuring characteristics of the electronic component; and a collecting unit (53) for collecting the electronic component after the measurement.
Are respectively arranged on the circumferential position, and are rotatable to pass through the supply unit, the measurement unit, and the collection unit arranged on the circumference position, and the electronic component is transferred from the supply unit to the collection unit via the measurement unit. A rotary table (50) for sequentially transporting the rotary table, and a plurality of rotary tables are arranged on the peripheral surface of the rotary table. A hand (51), a nozzle (N) provided at an end of each of the hands, for sucking and holding the electronic component at the collecting unit, and continuously holding the sucked state up to the collecting unit; A sensor (3) fixedly disposed on a part of the periphery of the rotary table facing the nozzle and detecting a surface state of a suction surface (Na) of the nozzle; A contact that contacts the lead of the electronic component when descending A measuring jig (54a) having terminals and inputting / outputting a measurement signal to / from an electronic component, and a descending amount of the hand so that a lead of the electronic component comes into contact with a contact terminal of the measuring jig at a predetermined contact pressure. A nozzle elevating means (2) for variably driving the nozzle, and judging the abrasion state of the nozzle based on the detection state of the sensor, and outputting an abnormal state to the outside when it is judged that the abrasion exceeds a predetermined range. When it is determined that the wear is within a predetermined range, when the electronic component is brought into contact with the measuring jig, the contact pressure is made constant by changing the descending amount of the nozzle elevating means in accordance with the wear amount of the nozzle. And a processing means (4) for controlling.

According to a fifth aspect of the present invention, the sensor (3) is provided from the collection section to the supply section in which the electronic component is in a non-adsorbed state in a rotation direction of the rotary table (50). And detecting the surface condition of the suction surface (Na) of each of the plurality of nozzles (N) during a period when the rotary table (50) rotates during the continuous inspection of the electronic component, and (4) The configuration may be such that the determination process is controlled and executed for each nozzle based on the detection signal of the sensor.

According to a sixth aspect of the present invention, the sensor (3) is provided between the collecting section and the supplying section in which the electronic component is in a non-adsorbed state with respect to a rotation direction of the rotary table (50). And the surface state of the suction surface (Na) of each of the plurality of nozzles (N) is detected by the rotation of the rotary table (50).
The wear state of each nozzle is determined based on the detection signal of the sensor, and when it is determined that the wear exceeds a predetermined range, an abnormal state is output to the outside, and when it is determined that the wear is within the predetermined range, it is determined. The storage unit (15) accumulates and stores the descent amount of the nozzle elevating means corresponding to the wear amount of each nozzle, and determines the descent amount from the storage unit when the corresponding nozzle contacts the electronic component with the measuring jig. It is also possible to adopt a configuration in which control is performed to read and make the contact pressure constant.

According to the electronic component inspection method of the present invention, the electronic component is sucked and held by the nozzle (N), transported to the measuring section (54), and the nozzle is moved at the position of the measuring section. In the electronic component inspection method for measuring characteristics by moving the electronic component to a measuring unit, the suction surface (Na) of the nozzle is
Detecting the surface condition of the electronic component with a sensor (3); moving the nozzle by a predetermined amount to bring the electronic component into contact with the measurement unit at a predetermined contact pressure when measuring the electronic component; The wear state of the nozzle is determined based on the detection state, and if the wear exceeds a predetermined range, an abnormal state is output to the outside.If the wear is within a predetermined range, the wear of the electronic component is measured. Variably controlling the amount of movement of the nozzle based on the correction value (ΔY) calculated from the amount of wear to control the contact pressure to be constant.

According to the above configuration, the electronic component is sucked and held on the suction surface Na of the nozzle N and moves to the measuring section 54.
Thereafter, the nozzle elevating means 2 moves the nozzle N to the measuring jig 54
The contact terminal a is moved by a predetermined amount so as to have a predetermined contact pressure. The surface state of the suction surface Na of the nozzle N is detected by the sensor 3 and output to the processing means 4. The processing unit 4 determines the wear state of the nozzle N based on the detection state of the sensor 3.
When it is determined that the wear exceeds a predetermined range, an abnormal state is output to the outside. When it is determined that the wear is within a predetermined range, the movement amount of the nozzle elevating means 2 is varied using the correction value ΔY calculated in accordance with the wear amount. Accordingly, it is possible to easily know the replacement time when the wear of the nozzle N has progressed, and it is possible to always keep the contact pressure of the electronic component against the measuring jig 54a during operation of the apparatus.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an electronic component inspection apparatus according to the present invention will be described. The electronic component inspection device according to the present invention includes a supply unit, a conveyance unit, a collection unit,
It has a measuring unit, and a detailed description is omitted. In addition, an example in which the transport unit has a rotary table will be described.

FIG. 1 is a block diagram showing nozzle control means provided in the apparatus. The nozzle control means includes a nozzle elevating means 2 for controlling movement (elevation) of a hand (nozzle) provided in the transport section in a direction of a measuring jig, a sensor 3 for detecting a state of a suction surface of the nozzle, A processing unit 4 that determines various types of processing such as judging the frictional state of the nozzle based on the detection output and controlling the elevation of the nozzle elevating unit 2 in accordance with the frictional state.

The nozzle raising / lowering means 2 is configured to raise / lower the entire hand with respect to the rotary table 50 which rotates at a fixed height position, and slides a bearing provided between the rotary table 50 and the hand, and drives the hand up and down. It is composed of a drive source (for example, a servo motor or a pulse motor). This driving source is controlled by the processing means 4 to vary the amount of hand elevation (the contact pressure).

The sensor 3 comprises a non-contact laser displacement meter. As shown in FIG. 6, the sensor 3 is fixedly installed on the apparatus side so as to face a suction surface of a nozzle provided at an end (lower end) of the hand. The sensor 3 irradiates laser light (measurement light) to the suction surface of the nozzle, and receives reflected light from the position detection element. This sensor 3
The focal position of the reflected light on the light receiving surface of the position detecting element moves according to the distance between the nozzle and the sensor 3, and outputs a detection signal corresponding to the distance. That is, the unevenness of the suction surface of the nozzle is output to the processing means 4 as a change in the detection signal. In addition, the turntable 50 rotates with respect to the fixed sensor 3, and each nozzle receives the measurement light of the sensor 3 and measures.

The processing means 4 includes a CPU, ROM, RAM,
It is composed of an I / F or the like, and can be composed of a general-purpose microcomputer.
Here, the internal block configuration of the processing means 4 shown in FIG. 1 merely separates and describes the function of each processing program executed by the CPU for convenience, and requires a hardware configuration as shown in the figure. However, each function shown in the drawing is similarly changed in response to a change in the execution procedure of the processing program. Further, the processing means 4 functions by executing a processing program described later using the hardware of the measuring device 54b described in the related art, and can be incorporated as a part of the function of the measuring device 54b.

Hereinafter, each function (configuration) inside the processing means 4 will be described. The wear amount calculation unit 10 captures a detection signal output from the sensor 3 for a predetermined period for each detection of each nozzle, and calculates the wear state. FIG. 2 shows the nozzle N by the sensor 3.
It is a side view which shows the detection state of. The nozzle N is moved in the direction A in the figure by the rotary table 50. Therefore, as shown in FIG. 2A, the sensor 3 starts detecting the displacement of the one end Nb of the nozzle at time t1, and thereafter, reaches the other end Nc as shown in FIG. 2B (until time t2). ), The amount of displacement of the suction surface Na of the nozzle N is detected and a detection signal is output.

FIG. 3 is a schematic diagram showing measured values on the contact surface of the nozzle N. In this drawing, the nozzle N in a partially reduced state is shown. The friction amount calculation unit 10 temporarily stores the displacement amount Ya detected at the time t1 and the displacement amount Yb detected at the time t2, respectively.
Based on b, the inclination amount Y1 of the suction surface is calculated by the following equation (1). Y1 = | Ya-Yb | Equation (1)

Further, the suction surface position (average position) Y2 is calculated by the following equation (2). Y2 = (Ya + Yb) / 2 Expression (2) The tilt amount Y1 and the suction surface position Y2 are output to the comparison unit 11.

The comparing section 11 compares the amount of inclination Y1 with a predetermined judgment value X1 (see the following equation (3)). Inclination amount Y1 <judgment value X1 Expression (3) The judgment value X1 corresponds to an inclination angle allowed on the contact surface of the nozzle N. According to this determination, when the inclination amount Y1 is larger than the determination value X1, it is determined that the inclination is too large, and an abnormal signal indicating that the inclination amount is abnormal is output to the outside.

The comparing section 11 compares the suction surface position Y2 with a predetermined judgment value X2 (Equation (4) below).
reference). Suction surface position Y2 <judgment value X2 Expression (4) The judgment value X2 is allowed from the origin position (corresponding to the surface position of the contact terminal provided on the measuring jig) to the position of the contact surface of the nozzle N. Equivalent to height (distance). As a result of this determination, when the suction surface position Y2 is greater than the determination value X2, an abnormal signal indicating that the suction surface position has exceeded the limit is output to the outside. Further, a signal indicating the suction surface position Y2 is output to the correction value calculation unit 13.

The correction value calculating section 13 executes the following equation (5) based on the signal indicating the suction surface position Y2 and the initial value Y0 set in the initial value setting section 12 to calculate the reduction amount ΔY of the nozzle N. I do. ΔY = (Y2-Y0) (5)

Initial value Y0 set in initial value setting section 12
Is equivalent to the height (distance) from the origin position when the reference (unreduced) nozzle Na is used to the nozzle Na. The initial value Y0 is obtained by measuring the nozzle N0 with the sensor 3 when the reference nozzle Nx is mounted in advance. Then, the value at the time of this measurement is set to the initial value Y.
It is stored and set in the initial value setting unit 12 as 0. When the type of device to be inspected by the apparatus changes, the nozzle N0
Is changed to another type, the nozzle N0 is actually measured, and the initial value Y0 is set in the initial value setting unit 12.

The elevation control drive section 14 variably controls a drive signal (a descending amount of the nozzle N) output to the motor of the nozzle elevating means 2 based on the correction value ΔY by an amount corresponding to the correction value ΔY. That is, the amount of downward movement when the device is pressed against the measuring jig 54a is varied by the correction value ΔY. Here, when the motor is a serve motor, the servo amount is variably controlled. On the other hand, when the motor is a pulse motor, the drive pulse is variably controlled. This variable control is
This is performed during the period when the device is actually operating and the device is being measured, and is performed using a correction value ΔY prepared for each nozzle (details will be described later). The sensor 3 is arranged at a position (within the range B) where the hand 51 (nozzle N) does not hold a device as shown in FIG.

The rotary table 50 is provided with a plurality of hands 51 (nozzles N).
The state of the contact surface Na is detected for each nozzle N (N1, N2,..., Nn), and the descending amount is variably controlled for each nozzle N based on the correction value ΔY.

Here, the elevation control drive section 14 may be configured to store the correction value ΔY for each nozzle N in the storage section 15. FIG. 4 is a data structure diagram of the storage unit 15, in which correction values ΔY (ΔY1, ΔY2,..., ΔYn) are stored in a table format for each nozzle N (N1, N2,..., Nn). Then, when each nozzle N presses the device against the measuring jig 54a, the correction value ΔY of the corresponding nozzle N is read from the storage unit 15, and the drive signal of the descent amount is changed by the correction value ΔY to the nozzle elevating means 2. And output it.

The operation of the apparatus having the above configuration will be described below. As described above, this electronic component inspection apparatus is configured to determine the wear of the nozzle N during measurement of the device. In the following description, the measurement operation of the device is omitted,
The process of determining the wear of the nozzle N as the gist of the present invention will be described. Further, an example will be described in which the sensor 3 is installed at a position between the moving positions of the hands 51, that is, at a position where the nozzle N continuously moves without stopping on the sensor 3, as shown in FIG.

FIG. 5 is a flowchart showing a process for determining the wear of the nozzle N. When the rotary table 50 provided with the nozzle N for device transport rotates (SP1) and the nozzle N passes through the sensor 3, the sensor 3
Is detected (SP2). At this time (time t
The displacement Ya of the one end Na of the nozzle N in 1) is taken into the friction amount calculation unit 10 of the processing means 4 (SP3).

When the turntable 50 continues to rotate, the sensor 3 detects the other end Nc of the nozzle N (SP4). At this time (time t2), the displacement amount Yb of the other end Nb of the nozzle N is taken into the friction amount calculation unit 10 of the processing means 4 (SP5).

The displacement amounts Ya,
The timing for taking in Yb can be obtained as a time when a large change in the displacement output of the sensor 3 is detected. When the rotary table 50 is stopped, the displacement amount Ya of the one end Na can be detected at the time when the one end Na of each nozzle N is positioned above the detection position of the sensor 3. The other end Nb of the nozzle N is detected when a period corresponding to the passage of the other end Nb over the detection position of the sensor 3 after the start of the movement of the rotary table 50 (timing t2).
May be performed. This period can be performed by using a timer such as a software timer.

Next, the wear amount calculating section 10 calculates the displacement amount Ya,
Based on Yb, the inclination amount Y1 of the suction surface is calculated by the above equation (1). Further, the suction surface position (average position) is calculated by the above equation (2).
Calculate Y2. The inclination amount Y1 and the suction surface position Y2 are output to the comparison unit 11 (SP6).

The comparison unit 11 calculates the inclination amount Y1 according to the above equation (3).
Is compared with a preset determination value X1 (SP
7). When the inclination amount Y1 is larger than the determination value X1 (SP7-NO), the inclination is determined to be too large, and an abnormality signal indicating that the inclination amount is abnormal is output to the outside. Further, the suction surface position Y2 is compared with a predetermined determination value X2 in the above equation (4) (SP8). If the suction surface position Y2 is larger than the determination value X2 (SP8-NO), an abnormal signal indicating that the suction surface position has exceeded the limit is output to the outside. Then, the suction surface position Y
2 is output to the correction value calculation unit 13.

Next, the correction value calculation unit 13 calculates the above equation (5).
And the signal indicating the suction surface position Y2 and the initial value setting unit 1
The reduction amount Δ of the nozzle N based on the initial value Y0 set to 2
Y is calculated (SP9). Then, the elevation control drive unit 14
Controls the drive signal output to the nozzle elevating means 2 based on the correction value ΔY by an amount corresponding to the correction value ΔY (SP10).

Thus, when the device is measured by the measuring jig 54a of the measuring section 54, the nozzle elevating means 2 variably presses the downward amount of the nozzle N (the moving amount of the motor) by the correction value ΔY. For example, when the suction surface position Y2 is increased due to wear of the nozzle N, the nozzle elevating means 2
The lowering amount of the nozzle N (hand 51) is further lowered by the correction value ΔY. Thereby, even if the nozzle N is worn, the lead of the device that comes into contact with the contact terminal of the measuring jig 54a can be brought into a constant contact pressure, and the input and output of the measurement signal can be stably maintained without affecting the measurement.

According to the above process, even if the suction surface Na of the nozzle N is worn, if the suction surface Na is inclined within a predetermined angle range and the total wear amount is within a predetermined value, The continuous use of the nozzle N is permitted, and the wear state of the nozzle N can be managed. In addition, the nozzle N permitted to be used can stably adsorb the device and prevent the conveyance failure, and also variably controls the descending amount of the nozzle N at the time of device measurement according to the worn state of the nozzle N. Thus, the leads of the device can be brought into contact with the contact terminals of the measuring jig with a constant contact pressure. Thereby, the measurement of the device can be always performed stably.

The above-described series of nozzle wear determination processing is processing for a certain nozzle N1. A plurality of hands 51 are provided on the turntable 50, and each hand 51 is provided with a nozzle N1 to Nn. Therefore, each time the rotary table 50 rotates, each nozzle N1
To Nn, the above-described nozzle wear determination process is repeatedly executed.

By the way, in this repetitive execution, the elevation control drive section 14 has a data structure shown in FIG.
The storage unit 15 stores the correction value ΔY for each nozzle N in a table format.
May be executed (SP11). That is,
This process is executed when the wear detection of the sensor 3 for each nozzle N is not performed continuously during the operation of the apparatus. For example, it is executed only at the start of activation of the apparatus, or when the operation is performed intermittently every predetermined time during operation.

When executing this processing of SP11,
Until the turntable 50 makes one rotation, the elevation control drive section 14 causes the storage section 15 to store the correction value ΔY for each nozzle N. Thereafter, after the detection of the sensor 3 is stopped, each of the nozzles N1 to Nn connects the device to the measuring jig 54a.
At the time of mounting, the correction values .DELTA.Y1 and .DELTA.Yn of the respective nozzles N1 to Nn are read out with reference to the table of the storage unit 15, and the lowering amount of the drive signal is varied by the nozzle raising / lowering means 2 by this correction value .DELTA.Y. Output.

In the above-described embodiment, a configuration in which a plurality of hands 51 having nozzles N are provided on the turntable 50 is described as an example. , And a single nozzle N provided on an arm movable in the Y-axis direction. Also in this configuration, the descending amount of the nozzle N can be variably controlled by correcting the descending amount of the nozzle N with the correction value ΔY according to the worn state of the nozzle N.

Although the configuration using a non-contact laser displacement meter as the sensor 3 has been described, similar effects can be obtained by using a magnetic sensor or a contact sensor that comes into contact with the suction surface Na of the nozzle N. Obtainable.

[0046]

According to the present invention, when the state of wear of the suction surface of the nozzle is advanced, it is possible to easily know the time for replacing the nozzle, and the wear state can be easily managed. In addition, when the device is operated using a nozzle that has been licensed for use, the amount of movement of the nozzle with respect to the measurement jig is variably controlled according to the amount of nozzle wear, so electronic components can be measured even if the nozzle wear state changes. The contact terminal of the jig can always be brought into contact with a constant contact pressure. This allows
The device can always be measured stably. At the same time, since the abrasion state of the nozzle is managed, the device can be stably sucked during the operation of the apparatus, so that a conveyance failure can be prevented. Thus, according to the electronic component inspection apparatus of the present invention, the measurement of the electronic component can always be stably performed.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a main part configuration of an electronic component inspection apparatus of the present invention.

FIG. 2 is a side view for explaining a nozzle wear detection state.

FIG. 3 is a diagram showing measured values of respective parts for determining wear of a nozzle.

FIG. 4 is a data structure diagram showing a storage state of a storage unit.

FIG. 5 is a flowchart showing a wear determination process of the apparatus.

FIG. 6 is a plan view showing the overall configuration of the electronic component inspection device.

[Explanation of symbols]

2 ... Nozzle elevating means, 3 ... Sensor, 4 ... Processing means, 10
... wear amount calculation unit, 11 ... comparison unit, 12 ... initial value setting unit,
13: correction value calculation unit, 14: elevation control drive unit, 15: storage unit, 50: rotary table, 51: hand, 54: measurement unit, 54a: measurement jig, N: nozzle, Na: suction surface.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-101343 (JP, A) JP-A-9-45738 (JP, A) JP-A-6-201770 (JP, A) JP-A-5-201770 251524 (JP, A) JP-A-3-156946 (JP, A) JP-A-5-87877 (JP, A) JP-A-8-54442 (JP, A) (58) Fields investigated (Int. Cl. ^7, DB name) G01R 31/00 G01R 31/26 G01R 31/28 H05K 13/00

Claims (7)

(57) [Claims] A nozzle (N) for sucking and holding an electronic component
And a measuring unit including a measuring jig (54a) having a contact terminal for inputting / outputting a measuring signal to / from a lead of the electronic component, wherein the electronic component inspection apparatus measures characteristics of the electronic component. The suction surface (N) of the nozzle (N) that holds the electronic components by suction
a sensor (3) for detecting the surface condition of a), and a nozzle elevating and lowering the nozzle by a predetermined amount so that the lead of the electronic component is brought into contact with a contact terminal of the measuring jig at a predetermined contact pressure. Means (2), a wear state of the nozzle is determined based on a detection state of the sensor, and when it is determined that the wear exceeds a predetermined range, an abnormal state is output to the outside, and the wear is within the predetermined range. An electronic component inspection apparatus comprising: processing means (4) for controlling the contact pressure to be constant by varying the amount of movement of the nozzle elevating means in accordance with the amount of wear when judging the effect. 2. The processing means (4) calculates and calculates a correction value (ΔY) corresponding to the wear amount of the nozzle (N), and moves a driving source provided in the nozzle elevating means (2). 2. The electronic component inspection apparatus according to claim 1, wherein the amount is variably controlled by the correction value. 3. The processing means (4) receives a detection signal output from the sensor (3), and based on the detection signals of one end (Nb) and the other end (Nc) of the nozzle (N), 2. The tilt amount and the total wear amount are calculated and calculated, and it is determined whether each of the tilt amount and the total wear amount is within the predetermined range, and each of the determination processes is performed. Electronic component inspection equipment. 4. An electronic component inspection apparatus for sucking and holding an electronic component, transporting the electronic component to a measuring unit, and measuring characteristics, a supply unit (52) for supplying the electronic component, and a measuring unit (54) for measuring characteristics of the electronic component. ), A collecting section (53) for collecting the electronic component after the measurement is arranged at a circumferential position, and is rotatable to pass through a supply section, a measuring section, and a collecting section arranged at the circumferential position. A rotary table (50) for sequentially transporting the electronic components from a supply unit to a collection unit via a measuring unit; and a plurality of rotary tables arranged on a peripheral surface of the rotary table, wherein the rotary table rotates to rotate the supply unit. A hand (51) which can be moved up and down respectively at the rotating positions of the measuring unit and the collecting unit; and a hand provided at an end of each hand to suck and hold the electronic component by the collecting unit and reach the collecting unit. Nozzle that continuously holds the suction state N), a sensor (3) fixedly arranged on a part of the periphery of the rotary table facing the nozzle and detecting a surface state of a suction surface (Na) of the nozzle; A measuring jig (54a) having a contact terminal for contacting a lead of the electronic component when the electronic component is lowered and inputting and outputting a measurement signal to and from the electronic component; A nozzle elevating / lowering means (2) for variably driving the amount of descent of the hand so as to contact the contact terminal with a predetermined contact pressure; and determining a worn state of the nozzle based on a detection state of the sensor. When it is determined that the wear exceeds a predetermined range, an abnormal state is externally output, and when it is determined that the wear is within a predetermined range, the electronic component is brought into contact with a measuring jig in accordance with the amount of wear of the nozzle. The nozzle elevating means Electronic component testing apparatus lowering amount variable to be characterized by comprising a processing means (4) for controlling the contact pressure constant. 5. The sensor (3) is disposed between the collection unit and the supply unit where the electronic component is in a non-adsorbed state with respect to the rotation direction of the rotation table (50), and During the continuous inspection of parts, the surface state of the suction surface (Na) of each of the plurality of nozzles (N) is detected during the rotation of the rotary table (50). The electronic component inspection device according to claim 4, wherein the determination process is controlled and executed for each nozzle based on a detection signal. 6. The sensor (3) is disposed between the collection unit and the supply unit where the electronic component is in a non-adsorbed state with respect to the rotation direction of the rotation table (50). The rotation of the table (50) detects the surface condition of the suction surface (Na) of each of the plurality of nozzles (N). The processing means (4) wears each nozzle based on the detection signal of the sensor. The state is determined, and when it is determined that the wear exceeds a predetermined range, an abnormal state is output to the outside, and when it is determined that the wear is within the predetermined range, the nozzle elevating and lowering corresponding to the wear amount of each nozzle is performed. The descending amount of the means is accumulated and stored in the storage unit (15), and when the corresponding nozzle contacts the electronic component with the measuring jig, the descending amount is read out from the storage unit and control is performed to make the contact pressure constant. The electronic component according to claim 4,査 apparatus. 7. The electronic component is sucked and held by a nozzle (N) and transported to a measuring section (54), and the nozzle is moved at the position of the measuring section to bring the electronic component into contact with the measuring section to measure characteristics. In the electronic component inspection method, a surface state of a suction surface (Na) of the nozzle is detected by a sensor (3).
Detecting; and moving the nozzle by a predetermined amount in order to bring the electronic component into contact with the measuring unit with a predetermined contact pressure when measuring the electronic component; and a worn state of the nozzle based on a detection state of the sensor. If the wear exceeds a predetermined range, an abnormal state is output to the outside, and if the wear is within the predetermined range, a correction value calculated from the wear amount at the time of measurement of the electronic component. Variably controlling the amount of movement of the nozzle based on (ΔY) to control the contact pressure at a constant level.