JP3342970B2 - How to imprint on the substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for marking a substrate on a surface-mounted product.

[0002]

2. Description of the Related Art Generally, a SIMM (Single in-line mem
The ory module) stamps the model name and lot number on the component mounting surplus space of each product in order to display the product name and manufacturing history. FIG. 4 is a plan view of a mounting surface of the SIMM, and FIG. 5 is a plan view of the SIMM. As shown in the figure, a substrate 3 on which the mounting component 1 is mounted on the other surface
On one side (for example, the surface) 5, the model name and lot No.
And the like 7 are stamped.

FIG. 6 shows an apparatus line for mounting SIMM components according to a conventional method, a printing machine for performing printing using a thermosetting printing ink (hereinafter referred to as “ink”), and a printing machine for curing the printing ink. It is a facility layout of the drying furnace of FIG. In the conventional method, a loader 9, a heat-soluble adhesive printing machine (hereinafter, referred to as “solder paste printing machine”) that forms a heat-soluble adhesive (hereinafter, referred to as “solder paste”) on the back surface of the substrate, A component mounting machine 13 for mounting components on the solder paste portion on the back surface, a heat treatment furnace (hereinafter, referred to as “solder reflow furnace”) 15 for heat-treating the substrate after printing the solder paste, and a component mounting line (S) up to an unloader 17.
MT line) and a stamping machine 1 for stamping ink on the substrate surface
9 and the drying furnace 21 are respectively installed at separate places,
After performing component mounting and solder reflow on the substrate 3,
The seal was applied in another step, and the ink was heated and cured using the drying furnace 21 in another step.

[0004] The ink imprinted on the substrate surface is in a paste form before the heat-curing treatment. When the ink is touched, the imprinted characters disappear, and the quality is degraded due to the adhesion of the ink to other parts and the work is inconvenient. Occurs. For this reason, the chance of handling the product before curing of the ink is reduced as much as possible, and great care has been taken when handling the product. For this reason, the conventional stamping machine 1
Reference numeral 9 designates a single tray (off-line) from the SMT line, and also uses a special tray or a storage container such as a magazine so that there is no contact between stamped products or touch during the process. Handling to the next process.

[0005]

However, in the conventional method, since the marking is performed off-line for the purpose of minimizing the handling before ink curing as described above, the marking and drying steps are performed separately from the SMT line. Is required, and as a result, there is a problem that extra steps of stamping and drying occur. In addition, a dedicated storage container is required to prevent contact between stamped products, and in the ink heat-curing process, products stored in the storage container from the previous process must be heated together with the storage container. There was waste that had to be done. Also, in order to improve the workability of the off-line processing, a large amount of processing must be performed at once, and a large-capacity expensive drying furnace (0.2 to 1.0 m ³ ) is required, which increases the initial cost. At the same time, it takes a long time (30 minutes to 1 hour) to raise the temperature to the designated temperature, resulting in a large running cost of 4 to 6 kWH. Further, in a large-volume drying furnace, products stored in large quantities together with the storage containers are likely to be unevenly heated, and often cause quality problems such as poor adhesion strength due to insufficient ink curing. The present invention has been made in view of the above circumstances, and does not need to provide a stamping process separately from the SMT line, and furthermore, a method and a system for stamping a substrate of a surface mount product which does not require a dedicated storage container and a drying furnace. It aims to reduce the number of stamping and drying steps, reduce the initial running cost, and improve the quality.

[0006]

According to the present invention, there is provided a method for imprinting a surface-mounted product on a substrate, the method comprising the steps of: applying a thermosetting ink to the substrate; And a step of performing a heat treatment for curing the marking ink and fixing the component to the substrate with the adhesive while curing the marking ink.

[0007]

[Function] In the method of marking a surface-mounted product on a substrate, a heat treatment for curing the marking ink on the substrate and a heat treatment with a heat-soluble adhesive for fixing the parts are simultaneously performed. The heat is also used for the heat curing treatment of the printing ink, and an off-line drying oven is not required. Further, since the curing heat treatment of the printing ink is performed in the component mounting line, it is not necessary to particularly protect the substrate by the storage container, and it is possible to heat the substrates one by one.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method for marking a surface-mounted product on a substrate according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic diagram of a line configuration of a substrate marking system according to the present invention. It is to be noted that the same reference numerals are given to the same devices as those shown in FIG. The SMM line for SIMM of the substrate stamping system according to the present embodiment includes a loader 9, a stamping machine 20, a solder paste printing machine (hot-melt adhesive printing machine) 12, a component mounting machine 13, The reflow furnace (heat treatment furnace) 16 and the unloader 17 are sequentially arranged. That is,
A stamping machine 20 is incorporated between the loader 9 and the solder paste printing machine 11 in the conventional SMT line (see FIG. 6), and the stamping machine 20 is operated in conjunction with the constituent devices in the same line. The above-mentioned substrate can be stamped. In the substrate marking system according to the present embodiment,
It does not have the drying furnace 21 (see FIG. 6). Therefore, the off-line, which has conventionally been installed alone, for performing the sealing in a separate process, has been deleted.

The stamping machine 20 is provided on one side of the substrate (for example,
A seal is formed on the (surface) using ink. The solder paste printer 12 forms a solder paste at a component fixing position on the back surface of the substrate. The component mounting machine 13 mounts components on the solder paste forming part. The solder reflow furnace 16 is capable of simultaneously performing thermosetting of the printing ink and heat treatment for fixing components with solder paste.

The reason why the stamping machine 20 is arranged at the above-mentioned line configuration position is that after printing the solder paste and after mounting the components, during the process until the solder reflow is completed, in order to maintain the accuracy of the mounted component positions and to prevent the missing portions, This is because it is necessary to avoid taking out and reversing the substrate. Therefore, the stamping machine 20 is arranged before the solder paste printing machine 12 before these steps.

The operation of the thus configured substrate marking system will be described. FIG. 2 is an explanatory diagram showing an outline of a stamping stage in the SMT line. The substrate 3 is set on the loader 9 with the marking surface (for example, the front surface) 5 facing upward in advance, and is automatically conveyed to the marking machine 20 and is marked with the marking rubber stamp 31 on the marking stage in FIG. The stamped substrate 3 is held by two pairs of transport belts 33 facing up and down in the non-seal area. Conveyor belt 33
Has a mechanism for turning the substrate 3 upside down while holding the substrate 3. The stamped substrate 3 is transported by the conveyor belt 33.
, And is automatically conveyed to the solder paste printing machine 12 in the next step with the marking surface 5 facing downward.

According to the above-described configuration of the substrate stamping system, the off-line stamping operation can be deleted.
It is possible to eliminate the occurrence of independent stamping steps. Further, by eliminating the off-line handling of the stamped substrate 3, it is possible to eliminate the occurrence of stamp damage due to the handling. Furthermore, since the stamping process is incorporated in the SMT line, there is no danger of contact between the stamped substrates 3 or touch, and the storage container for protecting the stamped substrate can be eliminated from the process. .

Next, a description will be given of an example in which a heating and curing treatment of the printing ink is performed using the SMT line of the substrate printing system. In this embodiment, the substrate 3 which has been stamped by the stamping machine 20 in the above-mentioned SMT line is not stored in a storage container, and the solder paste printing machine 12, the solder reflow furnace 16 Then, the heat-setting treatment of the printing ink is performed within the time required for the conventional solder reflow while also using the heat for dissolving the solder paste. FIG. 3 is an explanatory diagram showing an outline of the screen printing stage in the SMT line. As shown in the figure,
In the screen printing stage of the solder paste printing machine 12, an escape groove is formed on the print receiving table 35 facing the surface 5, which is the printing surface of the substrate 3, in accordance with the position of the stamped character so as not to touch the stamped character. 37 are provided.

The operation of the printing ink heating and curing process using the SMT line in the substrate printing system configured as described above will be described. In the conventional off-line stamping operation, the stamped substrate 3 is placed in a drying oven 21 together with the storage container (see FIG. 6).
And the whole container was subjected to a heat curing treatment. On the other hand, in the present embodiment, the substrate 3 stamped by the stamping machine 20 is not stored in the storage container, and the solder paste printing machine 12 and the component mounting machine 13 are used one by one in the order of completion of the stamping by the conveyor belt 33 of the SMT line. Is automatically transferred to the solder reflow furnace 16.

The substrate 3 transferred to the solder reflow furnace 16
Does not undergo a separate substrate heat treatment for drying the printing ink, but receives the heat already prepared for dissolving the solder paste to cure the printing ink. That is, the heat treatment for curing the printing ink on the printed substrate and the heat treatment for fixing the component with the solder paste are performed simultaneously. Accordingly, the use of the storage container becomes unnecessary, and the substrate 3 is uniformly heated by heating the substrates one by one, so that the adhesion strength of the printing ink becomes stable. According to the experiment conducted by the inventor, the solder reflow furnace 1
The adhesion strength of the printing ink heated and cured in the substrate 6 to the substrate 3 has no problem in the cellophane tape peeling test and the IPA (iso-propyl alcohol) solvent test, and the quality is the same as that of the conventional offline heat-cured product. It has been confirmed that it is not inferior.

As shown in FIG. 3, at the screen printing stage, a squeegee 41 is
Pressing the substrate mounting surface 43 with the solder paste 4
5 is applied. At this time, the substrate 3 is bent to the opposite side of the squeegee 41, but the seal escape groove 37 is
, The substrate marking surface 3 does not touch any place. In other words, the solder paste is formed on the stamped substrate while disposing and protecting the stamped portion in the escape groove 37.

As described above, according to the printing ink heating and curing process using the SMT line, the printed substrate 3 is passed through the solder reflow furnace 16 so that the heat for melting the solder paste is also used and the required time for the solder reflow is obtained. Since the curing and curing of the printing ink can be performed at the same time, there is no need for an off-line drying oven, and the initial cost and running cost can be significantly reduced. The time required for completion can be greatly reduced. Further, since the use of the storage container is not required, and the heating of each substrate can be performed, the adhesion strength of the printing ink can be stabilized, and the quality can be stabilized. Furthermore, since a seal escape groove 37 is provided in the screen printing stage to protect the substrate seal surface,
Blurring and blurring of the stamped characters can be reliably prevented, and the quality can also be improved.

[0018]

As described in detail above, according to the method of stamping a surface-mounted product on a substrate according to the present invention, a component is fixed with a marking ink curing heat treatment of a stamped substrate and a heat-soluble adhesive. Since the heat treatment is performed at the same time, heat for curing the stamping ink can be performed by also using the heat for fixing the parts, and an off-line drying furnace is not required, and the initial cost and the running cost can be largely eliminated. Further, since the stamping and drying man-hours in a separate process are eliminated, the time required for the completion of assembly can be greatly reduced. Furthermore, since the heating of each substrate can be performed without protection by the storage container, the adhesion strength of the marking ink is stable,
Quality can be stabilized.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a line configuration of a substrate marking system according to the present invention.

FIG. 2 is an explanatory diagram showing an outline of a stamping stage in an SMT line.

FIG. 3 is an explanatory diagram showing an outline of a screen printing stage in an SMT line.

FIG. 4 is a plan view of a mounting surface of a SIMM.

FIG. 5 shows a plan view of the surface of the SIMM.

FIG. 6 is an arrangement diagram of an apparatus line for mounting a SIMM component according to a conventional method, and a stamping machine and a drying furnace for curing a marking ink.

[Explanation of symbols]

3 Substrate 12 Solder paste printing machine (Heat-soluble adhesive printing machine) 13 Component mounting machine 16 Solder reflow furnace (Heat treatment furnace) 20 Printing machine 35 Printing tray 37 Printing relief groove

Continuation of front page (56) References JP-A-59-110189 (JP, A) JP-A-2-94653 (JP, A) JP-A-2-251196 (JP, A) JP-A-4-214696 (JP) JP-A-6-99569 (JP, A) JP-A-60-187556 (JP, A) JP-A-59-104561 (JP, U) JP-A-6-4776 (JP, U) JP-A-6-4776 (JP, U) 60-52655 (JP, U) Fully open 1983-66843 (JP, U) Fully open 1986-70970 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/00

Claims (4)

(57) [Claims] 1. a step of stamping a substrate with a thermosetting stamping ink, a step of mounting components on the substrate via a heat-soluble adhesive, and a step of curing the stamping ink and bonding Performing a heat treatment for fixing the component to the substrate with an agent. 2. The method according to claim 1, wherein the stamped substrate is automatically conveyed by a conveyor belt. 3. The substrate has one surface and the other surface, the seal is performed on one surface of the substrate, and the component is mounted on the other surface of the substrate. The method for imprinting on a substrate according to claim 1. 4. The method according to claim 3, wherein the component is mounted on the other surface of the substrate after the stamped substrate is inverted.