JP3341219B2 - Color filter and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color filter in which colored pixels are protected by a transparent protective film, and more particularly to a color filter in which a protective film is patterned.

[0002]

2. Description of the Related Art After forming colored pixels, a protective film of a color filter is formed by applying a transparent resin by spin coating, and photo-curing or heat-curing to form a transparent resin film. in this case,
As shown in Fig. 1 (d), 1-5mm from the end face
, A hardened back surface wraparound portion protection film 3c having a height of about 20 μm is formed. In addition, ~
Peripheral part protection film 3a having a peripheral bulge of about 50 μm
Occurs. This is one of the causes of dust generation due to contact with a transport roller, cracking of a substrate in a cell assembling process, and defective cell gap.

[0003] Also, in a multi-colored color filter,
After forming ITO film, apply cutting protection film and scribe cutting.
Dicing cutting is performed, and then the cutting protective film is removed.
Use a single color filter. At this time, or due to contact during subsequent transportation or subsequent transportation, chipping or peeling of the protective film 3 is observed from near the cut end surface of the substrate 1, and this adheres to the surface of the color filter. This is one of the causes of defects in the post-process.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to remove a raised portion of an outer peripheral portion of a substrate, a side portion of the substrate, and a protective film at a wraparound portion of the back surface of the substrate. It is an object of the present invention to obtain a large filter that does not cause peeling of the protective film from the vicinity of the cut end surface at the time of cutting the chip even when a protective film having a high thickness is used.

[0005]

According to the present invention, there is provided a method of manufacturing a color filter having a structure in which colored pixels of a plurality of colors are arranged on a transparent substrate, and a protective film made of a transparent resin is laminated on the colored pixels. In the method for producing a filter, a photocurable transparent resin for a protective film (3) or a solution thereof is applied to a substrate (1).
After applying to the entire surface of the substrate, when performing exposure for photo-curing, light is shielded by a mask (4), and the outer peripheral part protective film (3a), the side part protective film (3b), and the back side wraparound part protective film (3c) are formed. ) Is uncured and dissolved and removed at the time of development. The mask (4) has a structure in which a protective film forming portion is hollowed out, and a flange-shaped overhang base is provided at a lower portion inside the mask.
Is characterized in that the obtained those. Also,
The method for manufacturing a color filter of the present invention is a method of manufacturing a color filter having a structure in which colored pixels of a plurality of colors are arranged on a transparent substrate and a protective film made of a transparent resin is laminated on the colored pixels. A method for producing a multi-faced color filter, comprising applying a light-curable transparent resin for a protective film (3) or a solution thereof to the entire surface of a substrate (1), and then performing exposure for light curing. in conducting, and shielded by the mask (4), the outer peripheral portion protective layer (3a), in which the side surface portion protective layer (3b), and uncured backside curved portion protective layer (3c), is dissolved and removed during the development, the Mask (4) is the protective film forming part
With a hollow structure, a flange-like
An overhang base is provided, and the mask (4) further includes a mask portion on a chip cutting line (5) of a color filter unit of the substrate (1) and a portion near the chip cutting line (hereinafter referred to as a cutting line). And the protective film (3d) on the uncured cutting line corresponding to the mask portion is dissolved and removed simultaneously with the development.

[0006]

According to the present invention, the rise of the protection film on the outer periphery of the substrate is removed, and the cell gap defect and the substrate crack in the cell assembling process of the liquid crystal display device can be reduced. Further, by dissolving and removing the wraparound of the protective film on the back surface of the substrate at the same time as the development, it is possible to reduce the substrate cracking in the cell assembling process as well as the effects of dust generation in the subsequent process and removal of the outer periphery rising. Furthermore, in the method for manufacturing a multi-faced color filter, the corresponding uncured protective film is dissolved and removed at the same time as development on the chip cutting line of the color filter unit of the substrate and in the vicinity thereof, so that the chip is cut into the unit chip. , Peeling of protective film after cutting,
Chipping can be prevented and adhesion of fragments of the protective film to the color filter can be prevented.

[0007]

An embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a diagram for explaining a manufacturing process of a color filter of the present invention. 300 mm in size of FIG.
X 350 mm, 1.1 mm thick glass substrate 1 (Co
(ring # 7059) was sufficiently washed, and as shown in FIG. 1 (b), Cr was sputtered at 1000 ° and burned. Next, as shown in FIG. 1C, a black matrix and a chip cutting line 5 are formed on the Cr layer,
A red photosensitive resin is applied thereon to a thickness of 1.2 μm, then dried in an oven at 70 ° C. for 30 minutes, exposed using a mercury lamp, and spray-developed with water for 1 minute. To form a red colored pixel 2 (red relief image R) in a region where a red pixel is to be formed.
The composition was cured by heating at 150 ° C. for 30 minutes. The same process is repeated to form a green colored pixel 2 in a region where a green pixel is to be formed.
(Green relief image G) and blue colored pixels 2 (blue relief image B) in the area where blue pixels are to be formed
Was formed to complete a colored layer. Next, as shown in FIG. 1D, a protective film 3 was formed using a photocurable transparent resin. First, 70 parts by weight of phenol novolak epoxy acrylate as a photocurable acrylate oligomer, and 30 parts of dipentaerythritol hexaacrylate (DPHA, manufactured by Nippon Kayaku) as a polyfunctional polymerizable monomer.
The mixture was mixed with 3 parts by weight of Irgacure 651 (manufactured by Ciba Geigy) as a polymerization initiator, and dissolved in 250 parts by weight of ethyl cellosolve acetate. It was applied to a thickness of 1.5 μm on the colored layer by a coater. After the application, it was dried on a hot plate at a temperature of 80 ° C. for 90 seconds.

Next, as shown in FIG. 1E, masking exposure was performed. (In FIG. 1 (e) and subsequent drawings, the mask is used for the cutting line.
A 430 mm × 330 mm, 5 mm thick black alumite-treated aluminum plate was used as the mask 4 to remove the back circumference and the rise of the outer periphery (described in the second embodiment). The outer periphery of the mask 4 was masked at 10 mm, and the portion where the protective film was formed was cut out. This mask can be manufactured in the same exposure time as the solid exposure, and the manufacturing throughput can be maintained. Using this mask 4, ultraviolet light was irradiated for about 30 seconds by a 3.5 kW ultra-high pressure mercury lamp. In addition, as for the mask 4, the width of the protective film 3c around the back surface is 5 m.
In the case of about m, a (metal) mask having a masking portion having a width of 8 mm can be sufficiently removed. Also,
The cross-sectional shape of the mask 4 whose plane is shown in FIG. 3 (a) may be as shown in FIGS. 3 (b) and 3 (c) in order to reduce scattering of light during exposure due to the mask edge. For example, the lower inner edge of the mask 4 is 4a, and the outer edge of the mask 4 is 4a.
b, the line of the lower flange-shaped overhang base inside the mask 4 is
When the thickness of the mask 4 is 6 mm, the height of the flange portion may be 1 mm. Subsequently, as shown in FIG. 1 (f), both sides of the color filter are spray-developed with dichloromethane to form an uncured portion of the outer peripheral protective film 3a which is an outer peripheral portion of the coating film and an uncured portion of the side surface portion of the substrate 1. The side surface protection film 3b thus removed and the back surface wraparound portion protection film 3c on the back surface of the uncured substrate 1 were removed. Further, in order to obtain a completely cured state and to remove other impurities, post-baking was performed at 180 ° C. for 60 minutes. Next, an ITO film was formed at a predetermined position on the color filter by mask sputtering to obtain a color filter from which the outer peripheral portion protective film 3a, the side portion protective film 3b, and the back surface wraparound portion protective film 3c were removed.

(Embodiment 2) As an example of removing the protective film 3d on the cutting line, the substrate 1 is made of AX material glass manufactured by Asahi Glass Co., Ltd., and as in Embodiment 1, FIGS. 1 (a) to 1 (d) are used. The process was performed. Next, in the masking step of FIG.
Using a mask 4 having a mask portion for masking 300 μm each on the cutting line and on both sides as in Example 1, 3.5.
Ultraviolet light was irradiated for about 30 seconds by a kw ultrahigh pressure mercury lamp. Subsequently, as shown in FIG. 1 (f), both sides of the color filter are spray-developed with dichloromethane to form an uncured portion of the outer peripheral protective film 3a which is an outer peripheral portion of the coating film and an uncured portion of the side surface portion of the substrate 1. Side surface protective film 3b,
Backside wraparound portion protection film 3 on backside of substrate 1 in uncured state
c and the protective film 3d on the cutting line were removed. Furthermore, post-baking was performed at 180 ° C. for 60 minutes to obtain a completely cured state. Next, as a protective film for cutting the color filter, an ethyl cellosolve acetate solution of vinyl acetate acrylic resin is applied to a thickness of 10 μm,
C. and dried for 60 minutes. Subsequently, a 2 μm protective film for cutting is similarly formed on the back surface, dicing is cut from the back surface, cut into a predetermined chip size, and cut into dichloromethane.
After immersion for a minute, the protective film for cutting was removed, and a color filter of a chip was manufactured as shown in FIG. FIG.
Fig. 2 shows an example of the dimensions of the cut portion in a partially enlarged plan view. The color filter from which the protective film 3d was not removed on the cutting line was 12.5% (20/160 chips), whereas the color filter from which the protective film 3d was removed on the cutting line was 3.1% (5/50). 160 chips) and the generation of foreign matter adhesion was suppressed.

[0010]

According to the present invention, the outer peripheral portion of the photo-curable resin protective film is lifted up, the back surface is removed, and the protective film on the chip cutting line is removed. It is possible to prevent dust from adhering due to chipping of the protective film from the gap failure and the vicinity of the cutting line.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a process for manufacturing a color filter of the present invention.

FIG. 2 is a partially enlarged plan view illustrating an example of dimensions of a cut portion of the color filter of the present invention.

FIG. 3 is a diagram illustrating an example of the shape of a mask used in the method for manufacturing a color filter of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Colored pixel 3 Protective film 3a Peripheral protective film 3b Side protective film 3c Backside protective film 3d Protective film on cutting line 4 Mask 5 Chip cutting line

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-3-129302 (JP, A) JP-A-4-278902 (JP, A) JP-A-57-42009 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) G02B 5/20 101

Claims (2)

(57) [Claims] A method for manufacturing a color filter having a structure in which colored pixels of a plurality of colors are arranged on a transparent substrate and a protective film made of a transparent resin is laminated on the colored pixels.
After applying a photocurable transparent resin or a solution thereof to the entire surface of the substrate (1), when performing exposure for photocuring, light is shielded by a mask (4) and the outer peripheral portion protective film (3) is exposed.
a), the side surface protective film (3b) and the back side wraparound portion protective film (3c) are uncured and are dissolved and removed at the time of development.
The mask (4) has a structure in which a protective film forming portion is hollowed out.
At the bottom inside the mask, a flange-shaped overhang base is provided.
A method for manufacturing a color filter, characterized in that the color filter is manufactured. 2. A multi-colored color filter manufactured by arranging a plurality of color filters having a structure in which colored pixels of a plurality of colors are arranged on a transparent substrate and a protective film made of a transparent resin is laminated on the colored pixels. The method according to (1), wherein after the photocurable transparent resin for the protective film (3) or a solution thereof is applied to the entire surface of the substrate (1), the light-curing exposure is performed.
The outer peripheral portion protective film (3a) is shielded from light by the mask (4),
Side surface protection film (3b), back surface wraparound portion protection film (3c)
In which was uncured, to dissolve and remove at the time of development, the mass
The mask (4) has a structure in which the protective film forming part is hollowed out, and a mask is formed.
With a flange-shaped overhang base at the bottom of the inside
The mask (4) further has a mask portion on the chip cutting line (5) of the color filter unit of the substrate (1) and the vicinity thereof (hereinafter referred to as a cutting line), and corresponds to the mask portion. A method of manufacturing a color filter, comprising simultaneously dissolving and removing the protective film (3d) on the uncured cutting line during development.