JP3336455B2 - Lithography system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for automatically controlling various kinds of manufacturing apparatuses and managing various kinds of information in a lithography system using a plurality of exposure apparatuses.

[0002]

2. Description of the Related Art A process for manufacturing a semiconductor device or a liquid crystal device usually includes a process called lithography. In many cases, the lithography process means an optical process, and starts by applying a photosensitive (photoresist) on a semiconductor wafer or a glass plate with a thickness of about 1 μm, and then masking the resist layer with a mask. After the pattern is exposed, development is completed.

At present, at a device manufacturing site, a process of applying a resist to a substrate and a process of developing the exposed substrate are exclusively performed by an apparatus called a coater / developer. It is used to precisely align a mask pattern on a substrate and transfer it with a predetermined resolution. In a production line that handles mass-produced devices, a coater / developer and an exposure apparatus are inlined, and an operator simply sets a cassette containing multiple unprocessed substrates in the coater / developer, and the rest is all automatic. Is being processed.

Further, in order to improve mass productivity, a plurality of exposure apparatuses (and coater / developer) are used in parallel in a production line. In this case, since it is necessary to increase the operation rate for each exposure apparatus, a plurality of exposure apparatuses forming a line are controlled (grouped) by a host computer having a higher-level relationship with the computer on the exposure apparatus side. I have.

FIG. 1 is a block diagram schematically showing an example of conventional general control. Block EX shown in FIG.
P1, EXP2... EXPn represents an exposure apparatus, and CD1,
CD1... CDn represents a coater / developer. Naturally, a computer CMP · En for controlling the main body is provided in each exposure apparatus EXPn, and a computer CMP · Cn for controlling the main body is also provided in the coater / developer CDn.
Is provided. Further, reticle libraries RL1, RL2,... RLn for storing a plurality of reticles (masks) specified in advance are provided in each of the exposure apparatuses EXPn, and are automatically converted into necessary reticles according to a command from the computer CMP / En. Is done. Further, the coater / developer CDn has a library WC for storing a predetermined lot of wafers (usually 25 wafers) in cassette units.
L1, WCL2... WCLn are attached. This wafer cassette library WCLn is configured such that, in an unmanned manufacturing line, an automatic transfer robot automatically selects and loads a desired wafer cassette by selecting a coater / developer CDn that finishes processing the earliest. , Need not necessarily be inline with the coater / developer CDn.

The computer CMP En of each exposure apparatus EXPn and the computer CMP Cn of each coater / developer CDn both have a communication function like an RS232C line. PCn, PC2,... PCn. The personal computers PC1, PC2,..., PCn are connected to a host computer H.COM. The host computers H and COM are personal computers PC1, PC2 ...
The PCn is instructed to execute a predetermined wafer exposure process using a predetermined reticle, or receives information such as the end of processing from each personal computer to manage the entire lithography process (including wafer distribution management and reticle management). Perform

The personal computers PC1, PC2,.
In accordance with a command from the host computer H.COM, the processing operation of the coater / developer CDn and the exposure apparatus EXPn is managed so as to be optimized, and information such as whether predetermined processing is completed, whether there is no trouble, etc. To the host computer H.COM. The host computer H.COM calculates the supply management (distribution management) of wafers and reticles according to the type to be processed and the processing capacity (throughput) of each exposure apparatus EXPn in order to perform the total management of IC device production. And the like, and manage the overall operation so as to maximize the operation rate of each exposure apparatus constituting the line.

[0008]

At present, as an exposure apparatus used in the lithography process line shown in FIG. 1, a stepper for reducing and projecting a reticle pattern to about 1/5 (or 1/10) is mainly used. Has become. With the miniaturization of semiconductor devices, the processing accuracy required for these steppers is becoming stricter year by year, and the performance margin on the stepper side (the difference between the accuracy guaranteed on the specification and the accuracy of the ability to obtain a stable result) is also increasing. The fact is that it is getting smaller.

For this reason, detailed management as described below has been required. (A) In order to maintain the performance of the apparatus (EXPn, CDn) in the best state, the state of the apparatus is grasped in detail. (B) When deterioration of device performance is detected, it is promptly restored. (C) Optimize processing condition parameters for each apparatus or each processing lot.

The above (a), (b), and (c) are typical ones. When these are managed, a huge amount of data such as performance measurement data of the apparatus and status data during processing is collected. , Analysis, and feedback to the instrument. It is practically impossible to perform this operation manually, and incorporating the functions (a), (b), and (c) into the host computer H.COM shown in FIG. It becomes a problem. (1) The amount of data to be collected is large, and the capacity of the communication line of the host computer H.COM that performs production management and the like is insufficient. (2) In general, the host computer H.COM manages all processes, and it is often difficult to incorporate software such as detailed device-specific data management and analysis only for the lithography process, and the number of data items increases. ,
Improvement of analysis methods (algorithms, etc.) cannot be achieved quickly in relation to other management functions. (3) The load on the host computer H.COM increases,
Squeezing other management functions.

In view of the above-mentioned problems, the present invention performs detailed and unique management of at least an exposure apparatus while allowing a user to freely construct a conventional production management system using a host computer. The purpose is to realize the system.

[0012]

In order to achieve the above object,
In the present invention, lithography using a plurality of exposure apparatuses
System that is connected to the plurality of exposure apparatuses.
Networks and their respective networks
Exposure equipment error occurrence information is transmitted via the network
Information collection that collects and stores the history of the error occurrence information
Means.

[0013]

According to the present invention, error occurrence information of each exposure apparatus is provided.
Is collected over the network, and the error occurrence information is collected.
Information history, so if there are many errors,
Exposure related to the flow of the process item and the execution of the process item
Need to review the functions and accuracy of the equipment and to provide supplementary training
And keep lithography process stable
It becomes possible.

[0015]

[0016]

FIG. 2 shows a lithography information management system (Lithography Information Control System) according to an embodiment of the present invention.
ystem), and a plurality of exposure apparatuses, such as wafer steppers EXP1, EXP2,.
XPn shall be used. Host computer H
・ COM, Coater / Developer CD1, CD2 ... CD
n and the like are the same as the conventional ones.

As shown in FIG. 2, in this embodiment, an Ethernet LAN 50 is used for communication between devices. In the LAN (local area network) lithography process, the one laid for the host computer H.COM may be used, or a new one may be laid. Further, a dedicated machine controller (MC) 100 is provided between the host computer H.COM and the exposure unit (the pair of the stepper and the coater / developer). This machine controller 100 has basically the same functions as the conventional personal computers PC1, PC2,..., And PCn. ing.

Master Data Processor (MDP) 1
Reference numeral 10 performs information collection and management of the operation status report from the MC 100, transmission of various information to the MC 100, and the like. The centralized information server (CIS) 120 has a function of editing, distributing, and collecting information of the process program of the stepper, and particularly, based on the operation information collected by the MDP 110 and the like.
When the DP 110 collects and analyzes data related to the performance of the stepper, the history data necessary for correcting and correcting the operation parameters of the stepper may be used as necessary.
Send to The function for this correction and correction is MDP11
0 is executed. On the other hand, various measuring instruments 140 and 150 are connected to the LAN 50 via the LAN adapter 130. As the measuring devices 140 and 150, for example, an automatic line width measuring device such as LAMPAS and lightwave 3I sold by Nikon Corporation and a pattern coordinate measuring device are used. These measuring instruments measure the line width of a resist pattern on an exposed and developed wafer, the coordinate position of a specific resist pattern, and the like, and the measurement data is obtained through the LAN 50 or the MDP 110 (or via a recording medium). CIS12
0).

In the above hardware configuration,
The CIS 120 can be installed outside the clean room. In general, since the measuring instruments 140 and 150 are arranged in a clean room where a stepper is installed, MDP is used.
If the measuring instruments 140 and 150 are to be remotely controlled by the 110, it is convenient in terms of operation to install the MDP 110 in a clean room.

In the system shown in FIG. 2, the communication between the exposure unit and the LAN 50 is performed via the MC 100. However, the computer CMP.E1 in each stepper is used.
To En may have a communication function with the LAN. In this case, the computer CMP
Since En generally does not store much information about the wafer process, it is preferred that the exchange of data regarding the operating parameters of the stepper associated with the process progress be performed via the MC 100.

The main services (software) installed in the system described above are roughly classified into the following four items. Auto setup service for automatically setting the operation parameters of each stepper Centralized management of programs that set processing conditions for each stepper, and process program management service for appropriate distribution to each stepper Centralized management of the processing execution status (operating status) of each stepper Centralized monitoring service that maintains the operational stability of the stepper by displaying the status and storing the history, collects the unique performance data of each stepper, and identifies the stepper to be changed as necessary. Performance Analysis Service for Estimating Operation Parameters Of the above four service functions, the following three are targeted by the present invention, and the most important of these is the auto setup service.

This auto setup service (hereinafter A)
SUS) is the wafer (and reticle) to be processed
The main functions of the stepper are set in advance so as to optimize the accuracy and function of the stepper according to the type of the stepper. In executing this ASUS, the measuring instruments 140 and 150 shown in FIG.
The measurement function using the alignment sensor in n will be used.

Here, a typical structure of the stepper EXPn and the coater / developer CDn will be described with reference to FIG. In FIG. 3, WCLn is a wafer cassette library as shown in FIG. 1, and wafers to be processed are supplied therefrom via each section (resist coating, pre-bake, etc.) in the coater / developer CDn. The wafer W is sent to the wafer stage WST of the stepper EXPn. Also,
The wafer that has been exposed by the stepper is the wafer loader WL
Through each section (wet development, drying, etc.) in the coater / developer CDn, and returns to the library WCLn again.

On the other hand, an illumination system ILS for illuminating a reticle R as a mask, a reticle stage RST, a projection lens PL, a wafer stage WS
T, a reticle alignment sensor RA, a TTL type wafer alignment sensor LA, an off-axis type wafer alignment sensor WA, and the like are typically provided, and these are controlled by a computer CMP / E.
n.

The system shown in FIG. 3 is merely an example and does not represent all lithography systems. Now, in order to execute ASUS using the system of FIG. 3, actual exposure processing is performed using the first wafer of a lot of 25 or 50 units as a pilot wafer, and the processing result of the pilot wafer is measured by a measuring instrument. 140
(Or 150).

The MDP 110 shown in FIG. 2 is also organically involved in the process using the pilot wafer. First, in the MDP 110, information on exposure processing of the wafer lot is accumulated from the host computer H.COM via the MC 100. So MDP110,
It is possible to recognize which exposure unit processes the wafer lot and set measurement conditions. Here, it is assumed that the measuring instruments 140 and 150 of FIG. 2 are used, and the MDP 110 stores measurement process programs related to measurement contents, measuring instrument control data, determination criteria of measurement results, and the like that can be determined for each product (wafer type) or process. Create and manage (save). That is, the MDP 110 stores and manages a file MPPF that defines the name of an exposure process program (created by H.COM) to which a wafer lot to be processed belongs and the contents of a measurement process program corresponding to the lot. . Here, the flow of the actual pilot wafer processing will be described with reference to FIG.
First, the pilot wafer after the development processing is
0 or sent to 150. At this time, the measuring instruments 140, 1
Reference numeral 50 denotes the registered name of the stepper (EXP1, EXP2... EXPn) that has exposed the pilot wafer by inputting from the keyboard KB or the barcode card BC, and MDP.
Inquiry 110 (information flow DA).

The MDP 110 is obtained from the registered name of the stepper.
MC1 of the exposure unit that processed the pilot wafer
00 is found from the file STPF and the corresponding 1
Inquire about the exposure process / program name to one MC 100 (information flow DB). In response, the selected MC 100 changes the exposure process program name to MDP11.
Return to 0 (information flow DC). Then, the MDP 110 searches the file MPPF, calls a measurement process program corresponding to the exposure process program name, and loads the program to the measuring devices 140 and 150 (information flow DD).

As a result, measuring instruments 140 and 150 automatically execute various measurements and evaluations necessary for the pilot wafer. The items of measurement by the measuring devices 140 and 150 are as follows.
Two examples are the degree of overlay (misalignment) and the accuracy of the pattern line width. Of these, misalignment measurement evaluates the center misalignment of shots transferred on the wafer in a step-and-repeat manner, the rotational misalignment of shots, and the like, and the alignment determined by the stepper during wafer global alignment (hereinafter referred to as EGA). Parameter having the same meaning as that of the parameter for use (a type of operation parameter) is calculated.

The alignment parameters and the calculation thereof are as described in detail in, for example, Japanese Patent Application Laid-Open No. 61-44429. By this parameter calculation, the accuracy of the EGA of the stepper that has exposed the pilot wafer is reviewed, and it is determined whether the parameter of the EGA calculated on the stepper is corrected (or corrected).

On the other hand, the measured pattern line width data is tabulated for a plurality of shot positions on the wafer or for a plurality of measurement points in each shot, and the amount of exposure at the time of pilot wafer exposure is insufficient. The flatness, the flatness within a shot, the offset with respect to the best focus, and the like are estimated. In general, it is known that the line width of a line pattern formed on a photoresist becomes thicker or thinner depending on a focus position and an exposure amount.

The measurement data as described above is sent from the measuring instruments 140 and 150 to the MDP 110 (information flow DE). The MDP 110 calculates the alignment parameters, calculates the necessity of correction, the necessity of the correction, the correction value at the time of correction, and the like based on the data obtained by the misalignment measurement and the line width measurement. Correction value of the exposure amount, correction value of the inclination amount of the leveling stage provided on the wafer stage WST of the stepper, offset amount with respect to the position setting of the wafer in the optical axis direction using the focus sensor, or projection magnification, error caused by distortion Is calculated.

When these parameters need to be corrected or corrected, the correction amounts or correction amounts are sent to the MC 100 (information flow DF). As a result, the MC 100 adds a correction amount or a correction amount to the value of a preset parameter, repairs a defect found in the processing of the pilot wafer, and stores a more optimized exposure process program in the corresponding MC 100. Generate.

When the processing result of the pilot wafer is received by the MC 100, if the processing result is a value sufficient for the accuracy set in the production management, the MC 100 performs the above-described parameter correction. Instead, the second and subsequent wafers in the lot to be processed are continuously processed under the same conditions. If the processing result of the pilot wafer is insufficient, the parameters in the exposure process program are corrected as described above, and the pilot wafer is transferred to the coater / developer CDn.
After the resist is completely removed, a pilot exposure process is performed again, and measurement and evaluation are performed. This pilot wafer processing is repeated until the evaluation result becomes good. However, since it cannot be repeated indefinitely, how many times is allowed is set in advance.

During the processing (exposure and measurement) of the pilot wafer, the status of each measuring instrument is displayed on the console of the MDP 110, and the latest pilot processing result is displayed. Of course, the MDP 110 stores and manages the pilot processing result in association with the file MPPF. Further, when each of the measuring instruments 140 and 150 can correspond to the communication control with the MDP 110, the operation of each measuring instrument can be remotely controlled from the console of the MDP 110.

FIG. 5 is a flowchart showing the above-mentioned ASUS function. In FIG. 5, the operating conditions shown in steps 50 and 56 include, for example, the above-described parameters for the alignment and the parameters defining the operation of each unit during the exposure operation. Other operating conditions include selection of multiple alignment sensors mounted on the stepper, selection of various signal processing algorithms using the alignment sensor, selection of the type of alignment mark on the wafer, and irradiation of the pattern area on the reticle. Various offset settings for the function (field lens fine movement, pressure control, etc.) of correcting the imaging characteristics (magnification, focus) of the projection lens PL of the stepper, and setting the exposure amount offset according to the resist film thickness Etc.

Step 52 of pilot wafer measurement
Are dedicated measuring instruments 140 and 150 as shown in FIG.
In addition to measuring with, steppers EXP1, EXP2 ... E
There is also a method of measuring by XPn itself.
Japanese Patent Application Laid-Open No. -30112, Japanese Patent Application Laid-Open No. 1-187817, and the like. By the way, ASUS described above
Features have one disadvantage. That is, the next lot processing (step 55) cannot be started until the processing result of the pilot wafer becomes good in step 54 of FIG. The disadvantage is that if the exposure process is stable and the pilot wafer is exposed almost once,
This becomes noticeable as a decrease in throughput. Therefore, it is conceivable to change the entire process as follows.

FIG. 6 shows a flowchart in which the entire process is modified based on the flowchart of FIG. FIG.
Steps 60 to 69 in FIG. 5 show a modified process, and steps 52 to 54 and 56 in FIG. 14 are the same as the steps in FIG. In this embodiment, in parallel with the pilot processing of the first wafer at the head of the lot, the second and subsequent wafers continue the normal lot processing, and only when the result of the pilot processing is defective, The continuation of the lot processing is stopped.

First, at step 60, it is determined whether or not the lot is to be returned. Lot return is an operation of returning a wafer from the first wafer of the lot to an exposed wafer only when the flag indicating the result of the pilot process is turned on and becomes defective. For the first wafer at the beginning of the lot, the processing proceeds to steps 60, 61, and 62, and proceeds to steps 52, 53, and 54 according to the determination in step 63. If step 52 is executed by another measuring device 140 or 150, the first wafer is taken out of the stepper. Therefore, the MDP 110 continuously performs steps 60 and 61 to expose the second wafer. , 62.

In the case of the second wafer, the process proceeds to step 64 after step 63, and the wafer is transferred to the library WCLn.
In the second slot in the cassette. Then, in step 65, it is determined whether or not there is a remaining wafer. When there is a remaining wafer, the same processing is repeated from step 60. On the other hand, if the wafers subjected to the pilot processing in steps 52 and 53 are determined to be good in step 54, all the wafers in the lot are processed without any operation, and the first wafer is also stored in the first stage in the cassette. Stored in the eye. If it is determined in step 54 that the defect has occurred, step 69
Immediately turns on the flag for lot return. If the flag is ON when the lot processing timing is step 60, the MDP 110, in cooperation with the MC 100, returns everything from the first lot of the lot to the exposed wafer to the coater / developer to register the entire resist. Is removed, and the resist is applied again. This is called wafer reclamation and is executed in step 66.

Next, the reclaimed wafer is returned to the unexposed wafer cassette of the library WCLn in step 67, the flag is turned off in step 68, and the operating conditions are corrected and corrected in step 56, and the operation is performed again. Step 60
Return to In such a process, once a defect occurs, the time spent becomes longer, but if the probability of occurrence of the defect is sufficiently low, the throughput of the entire process is improved. When the flag is turned on in step 69, the operation of the stepper is stopped even during the stepper is exposing several wafers.
Needless to say, if the process moves to No. 6, the lot reprocessing start time is earlier.

Next, a method according to a second embodiment using the present system (FIG. 2) will be described. The second embodiment is combined with the pilot exposure. When the pilot exposure is started, the host computer
Instead of directly following the contents of the exposure process program set in C100, the optimum operating conditions are estimated in advance by referring to the operating conditions monitored in the past, and pilot exposure is performed based on the estimated operating conditions. To start. For this reason, the CIS 120 shown in FIG. 2 stores the information on the operating conditions obtained in the pilot process executed in the past,
Edit, organize, and store intensively for each type of wafer to be processed or for each stepper. Then, when executing a process for a certain wafer lot, the MDP 110 (or MC 100) sends the CIS 120 the optimum estimated operating condition based on the type (working layer and the like) information of the wafer in the lot and the name of the stepper that processes the wafer. After inquiring and correcting operating conditions based on this, pilot exposure is started.

Such an estimation is effective when the operator has set a parameter or the like greatly deviated from the appropriate value in the host computer H.COM, or when performing a lot processing for the product for the first time. Taking the case of an alignment parameter as an example of one of the optimal estimation operating conditions, for example, when slicing a signal waveform obtained by an alignment sensor at a certain slice level to determine a mark center position, the slice level is determined. Depending on the layer structure of the wafer to be processed and the characteristics of the alignment sensor, some trial and error is required. However, about the mark of the wafer surface which has gone through the layer and the substantially same process of the substantially same structure,
From the empirical judgment, the optimum slice level can be almost uniquely determined. Therefore, the MDP 110 rearranges past wafers that have been processed under the same exposure process program and that have the same type, and creates a histogram (frequency distribution) of the slice level adopted when the wafers are aligned. Then, the slice level most frequently used is determined as the optimum estimated operation condition.

The condition determined as the optimum value is MC1
If the condition is different from the condition loaded in 00, the optimum value is selected and corrected. By doing so, it becomes possible to reduce the probability that the evaluation result after performing the pilot exposure processing becomes defective. Next, the AS according to the third embodiment
An example of the US function will be described. In the third embodiment, a method for evaluating an exposed wafer is used. Normally, in the lithography process, when the exposure process for each lot is completed, all the wafers in the lot are inspected or sampled before being sent to the next process. This inspection is actually the same as steps 52 and 53 in FIGS. 5 and 6. If the evaluation result indicates that the lot is defective, the entire lot is regenerated in the same manner as in step 66. You. Also, when the failure does not occur, an error or tendency within an allowable range is detected, and the measurement data is sent from the measuring devices 140 and 150 to the MDP 110.
Is centrally managed by the CIS 120 via the.

In this way, the processing data of the evaluated lot is organized and stored for each product type and each stepper,
The database of the optimum estimated operating conditions described in the second embodiment is constructed. Hereinafter, the operation method is the same as that of the second embodiment. Next, a fourth embodiment using the system of FIG. 2 of the present invention will be described. In this embodiment, events generated in each stepper (EXPn) are intensively monitored, and the operation state of each stepper is indicated by an event. By checking in units and analyzing especially error-prone situations, corrections in the sequence of the exposure process program,
This is to determine the necessity of correction.

In this embodiment, the following information is handled as events occurring in the exposure process. (A) Start and end of reticle reservation processing (b) Start and end of foreign substance inspection of reticle (c) Start and end of reticle exchange processing (d) Start and end of lot processing (e) Start and end of pilot exposure ( f) Start and end of main exposure (g) Start and end of single development (h) Start of waiting state (i) Error occurrence alarm These event information (a) to (i) are sent from MC 100 to MDP 110 via LAN 50. Sent and tabulated. The MDP 110 analyzes the aggregated event information based on the history of the operation status of each stepper.

First, the MDP 110 creates a history of operating conditions for each stepper and displays the history on a console in real time. In this embodiment, the following five are handled as operating states. (B) List display of current operation status of each stepper (b) Information display of current operation status of designated stepper (c) List display of lot processing results of each stepper today (d) Lot processing of specified stepper today Display of the results (e) Latest error occurrence information of the designated stepper These five history data (a) to (e) are MDP11
0 is sequentially stored in a storage medium (hard disk, optical disk, or the like).

Therefore, the MDP 110 analyzes the event occurrence status for each stepper using the five stored history data (a) to (e). The history data is processed on a daily basis, and the MDP 110 has the following three analysis functions as software. (1) An event / trace information generation function for summarizing all events (a) to (i) generated during operation of the stepper for each stepper and displaying the event in a time series. (2) An event total information generation function that regroups generated events into processing units based on the event trace information.

Here, the processing unit and the event are set as follows. (2-1) Reticle exchange processing-Start and end times-End state (normal or error)-Generated error statistics (2-2) Lot processing-Start and end times-End state (normal or error)・ Lot name ・ Product name, process name ・ Number of processed wafers ・ Generation error statistics (2-3) Standby state ・ Generation error statistics (3) Operations for each unit that generates total operation information based on event total information Information generation function.

Here, information such as the number of processed lots, the number of processed wafers, the number of reticle exchanges, the number of reticle foreign matter inspections NG, the number of errors on the stepper side, and the number of errors on the coater / developer side are generated. By using the above three functions (1), (2), and (3), the operation status of each stepper on that day can be grasped, and a more efficient process program for the lot to be processed the next day Can be assembled. Especially when an error occurs,
If the same error occurs frequently in a specific stepper or specific processing item, it can be a serious problem in device production, and the flow of that processing item and the function of the stepper involved in the execution of that processing item It is immediately understood that the accuracy and the like need to be reviewed and repaired.

Although the embodiments of the present invention have been described above, the performance of a stepper using a test reticle (or a device reticle in some cases) can be evaluated using the system shown in FIG. The performance evaluation items mainly relate to overlay accuracy and alignment accuracy, but also include illuminance distribution of illumination light, control accuracy of correction means for heat accumulation of the projection lens, distortion of the projection lens, field curvature, wafer Flatness of holder, stepping accuracy of wafer stage, orthogonality, bending of movable mirror for laser interferometer, time required for exposure and alignment, wafer exchange, reticle exchange, etc., baseline (interval between exposure center point and alignment sensor) Items related to the temporal and thermal stability of the distance, the focus accuracy, and the like are also included.

These items are also evaluated periodically, and the evaluation results are successively stored in the MDP 110. The evaluation results of these items are mainly arranged for each stepper, and are accumulated as basic data for management of matching between steppers, maintenance of each stepper, maintenance of accuracy, and the like. The detailed data unique to this stepper was conventionally stored by the computer CMP / En on the main body of the stepper. However, by managing and managing the unique data of all the steppers constituting the line by the MDP 110, the exposure process program can be used. The most suitable stepper can be selected, or the entire line can be viewed and more efficient stepper operation can be organized.

Also, the change of the intrinsic constant on the stepper side is
During the main exposure (during the lot processing), monitor continuously to judge whether the value has been deviated from the value set by the operator or the value prescribed in advance in the device design. Can also correct the operating parameters of the stepper to correct the inconvenience caused thereby.

For example, to control the amount of light during the exposure operation of the stepper, an integrator control mode in which the total exposure amount of one shot applied to the wafer is monitored by integrating the amount of light using a photoelectric sensor and the shutter is closed when the target value is reached. And a timer control mode in which the light intensity of the light source is measured in advance, and the opening time of the shutter corresponding to the required exposure amount is calculated. The integrator mode automatically adjusts the shutter open time so that the exposure amount per shot always reaches the set target value even when the light intensity of the light source changes. At the beginning and end of the processing, the exposure time (shutter opening time) for each shot may change due to the change in the light intensity of the light source, and it takes time to manage the productivity (throughput).

On the other hand, in the timer mode, since the exposure time per shot is determined, there is no trouble in managing the throughput, but the intensity change of the light source is within the allowable range (1).
During the lot processing, for example, it needs to be less than ± several%).
Therefore, the output value of the photoelectric sensor that monitors the light intensity of the light source as a unique constant on the stepper side is checked not only at the time of pilot exposure but also at the time of lot processing. A function (a circuit or a program) for determining whether or not the data is maintained within an allowable range during processing is provided. When a change in the light intensity of the light source is detected during the lot processing by this function, the MDP 110 uses the ASUS function so as to correct the exposure time for the wafer entering the exposure operation by the stepper even during the lot processing. The exposure time value set in the MC 100 is corrected. Alternatively, the power supplied to the light source may be finely adjusted so that the light intensity itself of the light source is maintained within an allowable range.

As described above, according to the present invention, the operating conditions can be dynamically corrected not only during the pilot process at the head of the lot but also during the main exposure process. Can be increased. According to each of the above-described embodiments, the function of optimizing various processing parameters for each exposure apparatus in a lithography process can be flexibly performed while minimizing interference with a conventional process management apparatus using a host computer. It can be realized.

[0056]

As described above, according to the present invention, the lithography process including the exposure process can be stably maintained.

[0057]

As described above, according to the present invention, various processing parameters for each exposure apparatus in a lithography process are optimized while minimizing interference with a conventional process management apparatus using a host computer. Functions can be realized flexibly. Thus, the lithography process including the exposure process can be stably maintained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a conventional process management system used in a semiconductor device manufacturing line;

FIG. 2 is a diagram showing a configuration of a lithography information management system according to an embodiment of the present invention;

FIG. 3 is a perspective view showing the relationship between a stepper and a coater / developer;

FIG. 4 is a block diagram illustrating a flow of various information when executing an auto setup service function;

FIG. 5 is a flowchart for explaining the operation of the first embodiment of the auto setup service function.

FIG. 6 is a flowchart illustrating a modification of the operation of the first embodiment of the auto setup service function.

[Explanation of symbols]

H.COM Host computer EXP1, EXP2, EXPn Exposure devices CD1, CD2, CDn Coater / developers RL1, RL2, RLn Reticle library WCL1, WCL2, WCLn Wafer cassette library CMP / E1, CMP / E2 Exposure system CMP / E2 Side computer 50 Ethernet LAN 100 Machine controller (MC) 110 Master data processor (MDP) 120 Centralized information server (CIS) 140, 150 Measuring instrument

Continuation of the front page (56) References JP-A-4-305913 (JP, A) JP-A-63-286907 (JP, A) JP-A-63-66933 (JP, A) JP-A-63-166211 (JP, A) JP-A-63-138732 (JP, A) JP-A-3-64195 (JP, A) JP-A-2-308151 (JP, A) JP-A-63-3985 (JP, A) 1-119838 (JP, A)

Claims (6)

(57) [Claims] 1. A lithography system using a plurality of exposure apparatuses, comprising: a network connected to the plurality of exposure apparatuses; and error collection information of each of the exposure apparatuses connected to the network, collected through the network. A lithography system comprising: an information collection unit configured to store a history of the error occurrence information. 2. The lithography system according to claim 1, wherein the information collection unit creates history data of the error occurrence information for each of the exposure apparatuses. 3. The lithography system according to claim 1, wherein the information collecting unit analyzes a history of the stored error occurrence information. Wherein said information collecting means, lithography system according to any one of claims 1 to 3, characterized in that a display unit for displaying an error occurred the collected information. Wherein said network is a lithography system according to any one of claims 1 to 4, characterized in that a local area network. 6. The lithographic system according to claim 5 , wherein the local area network is Ethernet.