JP3335962B2 - Cutting die for long tape with multiple IC chips mounted - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of separating a long tape on which a plurality of IC chips are mounted side by side in one direction into tape pieces on which individual IC chips are mounted.
The present invention relates to a long tape cutting die (hereinafter simply referred to as a cutting die) on which a plurality of IC chips for cutting a long tape between C chips are mounted.

[0002]

2. Description of the Related Art Usually, a driving IC mounted on a liquid crystal panel is a Tape Carrier Package.
A single IC is mounted on a tape on which a plurality of wiring terminals are formed, which is called a metal foil such as a copper foil.

At the time of obtaining this TCP, many IC chips are in a state of being arranged at regular intervals and attached to a long tape. Therefore, when mounting on a liquid crystal panel, the tape between adjacent semiconductor chips is cut and separated into individual TCPs, and the separated TCPs are mounted on the liquid crystal panel.

In order to cut this long tape, a cutting die having a punch, a die and a tape feed mechanism has been used. Also, if there is foreign matter on the lead which is the wiring terminal,
Since the wiring connection from the liquid crystal panel has a problem, the wiring terminals are wiped with a brush or the like and blown with air to remove foreign matter.

[0005]

In the above-described method for removing foreign matter from wiring terminals, it is difficult to remove foreign matter between narrow wiring terminals. In particular, if the foreign matter is a conductive foreign matter, there is a problem that the wiring terminals are short-circuited, resulting in an assembly failure of the liquid crystal panel.

Further, the surface of the wiring terminal formed of copper foil is easily scratched, and there is a problem that the wiring terminal is disconnected due to excessive brushing. In addition, foreign matter on the wiring terminals must be removed separately from the step of cutting the tape, which leads to a longer step and lower productivity. In addition, there is the disadvantage that a great deal of man-hours are wasted in separating the individual TCPs and removing foreign matter.

Therefore, an object of the present invention is to cut and separate a TCP into individual IC chips,
An object of the present invention is to provide a cutting die capable of removing foreign matter from P wiring terminals.

[0008]

A feature of the present invention is to separate a long tape on which a plurality of IC chips are mounted in one direction into tape pieces on which the IC chips are mounted. In a long die cutting die on which a plurality of IC chips for cutting the long tape between the IC chips are mounted, the die is lowered toward a lower die and the long tape is attached to the die. A stripper plate which presses and holds the tape, and a punch which cuts the long tape held by sliding down the hole of the stripper plate and lowering it and inserting it into the hole of the die. A tape feeding mechanism for feeding the cut long tape in one direction by a predetermined distance, and a width direction of the end of the cut long tape fed to the tape feeding mechanism. A portion having a plurality of wiring terminals arranged in a row is pressed against a tape-shaped foreign matter removing member. Long te plurality of IC chips and a pressure means is mounted - a cutting die of the flop.

Further, the pressing means is arranged at a position away from the die in the one direction and the adhesive tape is provided.
A forming die having a mounting surface on which a tape is placed, and a pressing punch which descends in synchronization with the stripper plate and presses a portion of the wiring terminal placed on the tape-shaped foreign matter removing member. Is desirable. It is desirable that the molding die is made of rubber. Further, it is preferable that a tape supply mechanism for feeding the tape-shaped foreign matter removing member into the forming die is provided.

On the other hand, it is preferable that the tape-shaped foreign matter removing member is an adhesive tape or a magnetized steel tape. When the tape-shaped foreign matter removing member is an adhesive tape, the shape of the pressing surface of the pressing punch is curved downward with respect to the width direction of the long tape. Is desirable. In addition, a magnetized steel table
When it is a tape, it is desirable to provide a scraper for removing foreign matter transferred to the steel tape.

[0011]

Next, the present invention will be described with reference to the drawings.

FIGS. 1 (a) and 1 (b) are partially cutaway side views and an AA sectional view showing a cutting die according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are views of FIG. T of cutting die
It is the partially broken side view which shows the state at the time of CP cutting, and BB sectional arrow view.

The cutting die shown in FIG. 1 is attached to the upper die 4 and is inserted into the hole 13 of the die 7 of the lower die 3 by cutting the upper die to cut the TCP tape 20.
And guide the lowering of punch 5 and TCP tape 2
0, a stripper plate 6 for pressing the die 7 against the die 7, a guide post 8 for guiding the upper die 4 up and down, and a TCP.
And a sprocket 9 for intermittently feeding the tape.

The punch 2 attached to the extension of the stripper plate 6 is lowered by the lowering of the stripper plate 6, cut and separated, fed by the sprocket 9 and adhered to the forming die 1 by the adhesive tape 12. , And press the wiring terminal portion of the cut portion of the loaded TCP tape 20. As described later, the foreign matter adhering to the wiring terminal 20a is transferred to and removed from the adhesive tape by the foreign matter removing mechanism.

Further, the adhesive tape 12 on the forming die 1
Is fed from a supply reel 10 and taken up by a take-up reel 11. Each time the punch 2 is pressed, the adhesive tape 12 on the forming die 1 is updated. It is desirable that the upper surface of the forming die 1 is formed as a round surface so that the adhesive tape 12 can easily travel.

Next, the operation of the cutting mold will be described with reference to FIGS. First, as shown in FIG. 1, a TCP tape 20 is fed by a sprocket 9 and
A portion having no lead (wiring terminal) of 0 is aligned with the hole 13. As a result, the rear end of the previously cut TCP 21 and the front end of the TCP tape 20 to be cut this time are placed on the adhesive tape 12 of the molding die 1.

Next, as shown in FIG. 2, the upper die 4 is lowered and the stripper plate 6 presses the TCP tape 20, and at the same time, the punch 2 is connected to the wiring terminal portion which is the rear end of the TCP 21 and the TCP tape. The punch 5 comes into contact with the wiring terminal portion, which is the tip of the
The CP tape 20 is cut, while the punch 2 is shown in FIG.
As shown in (b), the forming die 1 made of an elastic material is recessed. As a result, the adhesive of the adhesive tape 12 also enters between the wiring terminals 20a pushed and spread by the punch 2, and transfers foreign matter on the wiring terminals 20a and foreign matter between the wiring terminals 20a.

Next, when the upper die 4 rises, the adhesive tape 12 on the forming die 1 is wound up by the winding reel 11, and is peeled off with the foreign matter from the TCP tape 20 by the winding force. It is. Then, the sprocket 9 adjacent to the molding die 1 rotates, and the TCP 21 is sent to the next stage (not shown), and the wiring terminal portion at the rear end of the TCP tape which is cut and newly formed as TCP is sprocketed. It is fed at 9 and located on the forming die 1. On the other hand, the sprocket 9 on the right side rotates with respect to the paper surface to feed the TCP tape 20 and align the position of the TCP tape to be cut at the position of the hole 13. This state is the same as the state shown in FIG.

Here, the punch 2 is desirably integrated with a stripper plate 6 made of tool steel so as to be linked with the stripper plate 6. The shape of the punch 2 in the width direction of the TCP tape 20 is desirably curved so as to expand downward. The forming die 1 is desirably made of an elastic material such as neoprene rubber or butyl rubber.

On the other hand, the pressure-sensitive adhesive tape 12 may be a commercially available pressure-sensitive tape in which a pressure-sensitive adhesive (which cures when liquefied and removed when stress is applied) is applied to one side of the tape. And
The adhesive strength of the adhesive is such that the wiring terminals 20a made of copper
It is desirable that the tape is not peeled off from the tape 20.

FIGS. 3A and 3B are sectional views showing a modification of the foreign matter removing mechanism in the cutting die shown in FIG. The foreign matter removing mechanism in this cutting die is that a magnetic tape is used instead of the adhesive tape shown in FIG. This means
In recent years, the distance between TCP leads (wiring terminals) has become increasingly smaller,
Even if the TCP is pressed by the curved punch 2 shown in FIG. 1, it is difficult for the adhesive of the adhesive tape to enter between the wiring terminals, so that foreign substances cannot be adhered. Therefore, even if the degree of curvature of the punch 2 is changed to increase the distance between the wiring terminals, a lateral force is exerted on the wiring terminals, and the wiring terminals made of copper foil are replaced with TCP.
A new problem of peeling off from the tape occurred.

Therefore, attention has been paid to picking up foreign matter using a magnet, and a magnet tape is provided so as to be applicable to the foreign matter removing mechanism shown in FIG. Therefore, this cutting die has the same punch, die and stripper plate as those in FIG. 1 for holding and cutting the TCP tape. As shown in FIG. 3, other foreign matter removing mechanisms include a punch 14 having a flat pressing surface integrated with the stripper plate, a forming die 15 provided on the lower mold 3 and having a flat surface. It has.

The cutting operation of the TCP tape 20 and the feeding operation of the TCP tape by the sprocket in the operation of the cutting die are the same as those of the above-mentioned cutting die, and therefore, the description is omitted. Hereinafter, only the operation of removing foreign matter from the wiring terminals will be described.

First, as shown in FIG. 3A, a molding die 15 made of an elastic material such as rubber as described above is used.
The magnetic tape 16 and the TCP tape 20 are stacked on top of each other. Next, as shown in FIG. 3 (b), the punch 14 descends as the stripper plate descends, and presses the TCP tape 20 against the magnet tape 16. The surface of the forming die 15 is slightly recessed and makes uniform contact with the TCP tape 20 and the magnet tape. Then, foreign matter (metal powder) on the wiring terminals and between the wiring terminals is adhered to the magnet tape 16.

Next, as the upper die rises, the stripper press
3A, the cut TCP and the foreign matter removed are sent to the next stage (not shown), and the take-up reel 17 is moved to the magnet table as shown in FIG. -Take up the loop 16. At this time, the foreign matter transferred to the magnet tape 16 is
It is scraped off by the scraper 19 and sucked into the suction port 19a.

The clean magnetic tape 16 removed from the supply reel 18 is positioned on the forming die 15. Then, the cut TCP tape 20 is sent and placed on the magnet tape 16. By repeating such an operation, the long TCP tape 20 is cut and separated into individual TCPs, and the wiring terminals of the separated TCPs and foreign substances between the wiring terminals are removed.

The magnet tape 16 used here is:
For example, a tape of nickel chrome steel having a thickness of about 0.2 mm is magnetized. Also, the forming die 1
No. 5 used neoprene rubber. Further, the pressing force on the TCP tape 20 may be such that the TCP tape 20 and the magnetic tape 16 are in uniform contact, for example, 500 grams per square centimeter.

[0028]

As described above, according to the present invention, the wiring terminal portion of the separated TCP is pressed into the wiring terminal portion of the separated TCP in a cutting die for cutting and separating the TCP tape into individual TCPs. By providing an adhesive tape or magnet tape pressing mechanism for removing foreign matter, foreign matter can be removed simultaneously with cutting and separating, and there is an effect that productivity is improved.

In addition, since the cutting and peeling of the wiring terminals, which are caused by the removal of the foreign matter by the brush as in the prior art, are eliminated and the foreign matter between the wiring terminals can be removed, the effect of reducing the defective assembly of the liquid crystal panel is obtained. .

[Brief description of the drawings]

FIG. 1 is a partially cutaway side view and a cross-sectional view taken along the line AA showing a cutting die according to an embodiment of the present invention.

FIGS. 2A and 2B are a partially broken side view and a cross-sectional view taken along a line BB, respectively, showing a state of the cutting die shown in FIG.

FIG. 3 is a sectional view showing a modification of the foreign matter removing mechanism in the cutting die shown in FIG. 1;

[Explanation of symbols]

 1,15 Forming die 2,5,14 Punch 3 Lower die 4 Upper die 6 Stripper plate 7 Die 8 Guide post 9 Sprocket 10,18 Supply reel 11,17 Winding reel 12 Adhesive tape 13 Hole 16 Magnetic tape 19 Scraper 20 TCP tape 21 TCP

Claims (8)

(57) [Claims] An elongated tape having a plurality of IC chips mounted thereon arranged in one direction is separated between the IC chips so as to be separated into individual tape pieces on which the IC chips are mounted. In a cutting die for a long tape on which a plurality of IC chips for cutting the tape are mounted, a stripper plate which descends toward a lower die and presses and holds the long tape against the die. A punch for cutting the long tape held by sliding down the hole of the stripper plate and inserting it into the hole of the die; and the cut long tape. And a portion having a plurality of wiring terminals arranged in the width direction of the end of the long tape which is fed into the tape feeding mechanism and cut. Pressing means for pressing against a tape-shaped foreign matter removing member. A long tape cutting die on which a plurality of IC chips are mounted. 2. The forming die of an elastic member, which is disposed at a position away from the die in the one direction in the one direction and has a mounting surface on which the tape-shaped foreign matter removing member is mounted, and the stripper. 2. A pressing punch which is integrated with a plate and lowers with said stripper plate to press a portion of said wiring terminal placed on said tape-shaped foreign matter removing member. A long tape cutting die on which a plurality of IC chips are mounted. 3. The cutting die for a long tape on which a plurality of IC chips are mounted according to claim 2, wherein said forming die is made of rubber. 4. A length having a plurality of IC chips mounted thereon according to claim 1, further comprising a tape supply mechanism for feeding said tape-shaped foreign matter removing member to said forming die. Cutting mold for shaping tape. 5. The tape-shaped foreign matter removing member is an adhesive tape.
A cutting die for a long tape on which a plurality of the described IC chips are mounted. 6. The tape-shaped foreign matter removing member is a magnetized steel tape.
A cutting die for a long tape on which a plurality of IC chips according to 2, 3, or 4 are mounted. 7. A plurality of IC chips according to claim 5, wherein a shape of a pressing surface of said pressing punch is curved downward with respect to a width direction of said long tape. Mold for cutting long tapes. 8. A cutting tape for a long tape on which a plurality of ICs are mounted according to claim 6, further comprising a scraper for removing foreign matter transferred to said magnetic tape. Type.