JP3331745B2 - Method of forming solder bumps - Google Patents
Method of forming solder bumpsInfo
- Publication number
- JP3331745B2 JP3331745B2 JP12651594A JP12651594A JP3331745B2 JP 3331745 B2 JP3331745 B2 JP 3331745B2 JP 12651594 A JP12651594 A JP 12651594A JP 12651594 A JP12651594 A JP 12651594A JP 3331745 B2 JP3331745 B2 JP 3331745B2
- Authority
- JP
- Japan
- Prior art keywords
- metal mask
- solder
- bump
- forming
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/11848—Thermal treatments, e.g. annealing, controlled cooling
- H01L2224/11849—Reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被バンプ形成体上に半
田バンプを形成するための半田バンプの形成方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming solder bumps for forming solder bumps on an object to be bumped.
【０００２】[0002]
【従来の技術】近年、回路基板上に電子部品を高密度に
実装するため、半田バンプを用いた実装方法が多く用い
られる。すなわち、回路基板あるいは電子部品の電極パ
ッド上にあらかじめ形成した半田の突起である半田バン
プを形成後、半田バンプを介して電子部品を回路基板の
電極パッドに固定し、その後半田バンプを溶融して電子
部品を接続する方法や、銀ペースト等の導電性接着剤を
用いて電極パッドに形成した半田バンプを回路基板ある
いは電子部品の電極パッドに接続する方法である。回路
基板は、プリント基板、セラミック基板、シリコン基板
等のいずれでも良く、また、電子部品は能動部品、受動
部品、機構部品のいずれでも良い。2. Description of the Related Art In recent years, in order to mount electronic components on a circuit board at high density, mounting methods using solder bumps are often used. That is, after forming solder bumps, which are solder protrusions formed in advance on the electrode pads of the circuit board or the electronic component, the electronic component is fixed to the electrode pads of the circuit board via the solder bumps, and then the solder bumps are melted. This is a method of connecting an electronic component or a method of connecting a solder bump formed on an electrode pad to a circuit board or an electrode pad of an electronic component using a conductive adhesive such as a silver paste. The circuit board may be any of a printed board, a ceramic board, a silicon board, and the like, and the electronic component may be any of an active component, a passive component, and a mechanical component.
【０００３】図１０を用いて、回路基板の電極パッド上
に半田バンプを形成する従来の方法を説明する。A conventional method for forming a solder bump on an electrode pad of a circuit board will be described with reference to FIG.
【０００４】図１０（ａ）のように、回路基板１の表面
には電極パッド２が形成されている。半田バンプ３を形
成するための電極パッド２を設けた回路基板１の表面
に、フラックスを塗布する（図示せず）。次に、図１０
（ｂ）のように、電極パッド２の位置に合わせて貫通孔
４を設けたメタルマスク５を重ね合わせる。メタルマス
ク５は、溶融半田と反応しない、ステンレス、モリブデ
ン等の金属板が使用される。貫通孔４の内径は、電極パ
ッド２の外径よりやや大きく設計される。各貫通孔４に
は、形成する半田バンプ３の大きさに合わせて、所定寸
法の半田ボール６を一つ置く。この状態でリフロー炉に
流すと（図示せず）、各貫通孔４の中で半田ボールが溶
融し、電極パッド２に図１０（ｃ）のような半球状の半
田バンプ３が形成される。As shown in FIG. 10A, an electrode pad 2 is formed on a surface of a circuit board 1. A flux is applied to the surface of the circuit board 1 provided with the electrode pads 2 for forming the solder bumps 3 (not shown). Next, FIG.
As shown in (b), a metal mask 5 provided with a through hole 4 is overlapped with the position of the electrode pad 2. As the metal mask 5, a metal plate made of stainless steel, molybdenum, or the like that does not react with the molten solder is used. The inner diameter of the through hole 4 is designed to be slightly larger than the outer diameter of the electrode pad 2. In each through hole 4, one solder ball 6 having a predetermined size is placed according to the size of the solder bump 3 to be formed. When flowing into a reflow furnace (not shown) in this state, the solder balls are melted in each through hole 4, and a hemispherical solder bump 3 as shown in FIG.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、半田ボ
ール６を溶融した後は、フラックスの残渣によってメタ
ルマスク５と回路基板１は強固に密着してしまい、剥離
が困難であった。However, after the solder balls 6 are melted, the flux residue leaves the metal mask 5 and the circuit board 1 firmly in close contact with each other, making it difficult to separate them.
【０００６】また、図１１（ａ）のように、メタルマス
ク５の位置が長さＬ１だけずれて電極パッド２の一部と
重なった場合、図１１（ｂ）のように、電極パッド２の
一部しか半田バンプ３が形成できず、また半田バンプ３
の形状は変形して均一な高さの半球状の半田バンプを得
ることができなかった。このため、半田バンプ３と電子
部品の電極との接続状態にばらつきが生じ、信頼性に欠
ける場合があった。When the position of the metal mask 5 is shifted by the length L1 and overlaps a part of the electrode pad 2 as shown in FIG. 11A, the position of the electrode pad 2 is reduced as shown in FIG. Only part of the solder bumps 3 can be formed.
Was deformed, and a hemispherical solder bump having a uniform height could not be obtained. For this reason, the connection state between the solder bumps 3 and the electrodes of the electronic component is varied, and the reliability may be lacking in some cases.
【０００７】そこで本発明は、半田ボール６の溶融後で
もメタルマスク５が剥がしやすく、またメタルマスク５
の位置が多少ずれても、電極パッド２に均一な半田バン
プ３を形成することができる半田バンプの形成方法を提
供することを目的とする。Accordingly, the present invention provides a metal mask 5 which can be easily peeled off even after the solder ball 6 is melted.
It is an object of the present invention to provide a method for forming a solder bump which can form a uniform solder bump 3 on the electrode pad 2 even if the position of the solder bump is slightly shifted.
【０００８】[0008]
【課題を解決するための手段】本発明は、上記目的を達
成するために、次のように構成される。すなわち、本発
明の半田バンプの形成方法は、第一に、半田バンプを形
成する被バンプ形成体の表面にフラックスを塗布する工
程と、メタルマスクを前記被バンプ形成体に重ね合わせ
てメタルマスクに形成した貫通孔を電極パッド上に設け
る工程と、貫通孔に半田ボールを置く工程と、リフロー
炉で半田ボールを溶融する工程とからなる半田バンプの
形成方法において、少なくとも電極パッドとメタルマス
クの間に間隙を設けるものであり、第二に、メタルマス
クを置く部分と、被バンプ形成体を置く部分とから一体
に形成される治具を用い、前記被バンプ形成体と前記メ
タルマスクの間に間隙を設けるものであり、第三に、被
バンプ形成体を回路基板として構成すると共に、回路基
板と重ね合わせるメタルマスク面に支持部を設け、前記
回路基板と前記メタルマスクの間に間隙を設けるもので
あり、第四に、被バンプ形成体を回路基板として構成す
ると共に、回路基板と重ね合わせるメタルマスク面に、
電極パッドの外径よりやや大きい内径を有する穴と、該
穴の内径よりも小さい内径を有する貫通孔とを同心円状
に一体に設け、前記電極パッドと前記メタルマスクの間
に間隙を設けるものである。The present invention is configured as follows to achieve the above object. That is, the method of forming a solder bump according to the present invention includes, first, a step of applying a flux to the surface of a bump-formed body on which a solder bump is to be formed, and overlaying a metal mask on the bump-formed body to form a metal mask. A method for forming a solder bump, comprising the steps of: providing a formed through hole on an electrode pad; placing a solder ball in the through hole; and melting the solder ball in a reflow furnace. Secondly, using a jig integrally formed from a portion where a metal mask is to be placed and a portion where a bump target is to be placed, between the bump target and the metal mask. Thirdly, a gap is provided. Thirdly, the object to be bumped is configured as a circuit board, and a supporting portion is provided on a metal mask surface to be overlapped with the circuit board. It is intended to provide a gap between the substrate and the metal mask, the fourth, as well as constituting an object to be bump-formed body as a circuit board, the metal mask surface overlaying a circuit board,
A hole having an inner diameter slightly larger than the outer diameter of the electrode pad, and a through hole having an inner diameter smaller than the inner diameter of the hole are integrally provided concentrically, and a gap is provided between the electrode pad and the metal mask. is there.
【０００９】[0009]
【作用】被バンプ形成体とメタルマスクとの間に間隙を
設けたので、半田ボールの溶融後であっても、フラック
スの残渣によってメタルマスクと被バンプ形成体は密着
しない。また、メタルマスクの位置が多少ずれても、溶
融半田がメタルマスクに規制されず、電極パッド上に均
一に広がり、均一な高さの半田バンプが形成できる。Since the gap is provided between the bump-formed body and the metal mask, the metal mask and the bump-formed body do not adhere to each other due to the flux residue even after the solder balls are melted. Further, even if the position of the metal mask is slightly shifted, the molten solder is not restricted by the metal mask, but spreads evenly on the electrode pad, and a solder bump having a uniform height can be formed.
【００１０】治具を使用する場合は、被バンプ形成体と
メタルマスクの位置ずれを防ぐことができる。[0010] When a jig is used, it is possible to prevent a displacement between the bump-formed body and the metal mask.
【００１１】支持部を設けたメタルマスク、あるいは穴
および貫通孔を同心円状に一体に設けたメタルマスクを
使用する場合は、簡便に回路基板とメタルマスクあるい
は電極パッドとの間に間隙を形成できる。When a metal mask provided with a support portion or a metal mask provided with holes and through holes concentrically and integrally is used, a gap can be easily formed between the circuit board and the metal mask or the electrode pad. .
【００１２】[0012]
（実施例１）図１乃至図３を用いて、本発明に係る被バ
ンプ形成体に半田バンプを形成する方法の実施例を示
す。なお、図１０と同じ構成部分は同じ番号を用いて説
明を省略する。(Embodiment 1) An embodiment of a method for forming a solder bump on a bump-formed body according to the present invention will be described with reference to FIGS. Note that the same components as those in FIG. 10 are denoted by the same reference numerals and description thereof is omitted.
【００１３】図１に示す治具７は、本発明の半田バンプ
の形成方法に用いられる。半田バンプ３を形成する際に
使用する治具７は、メタルマスク５を置く部分７Ａと、
被バンプ形成体、例えば回路基板を置く部分７Ｂとから
一体に形成される。メタルマスク設置部分７Ａは、メタ
ルマスク５の形状よりやや広く、中央部に回路基板を落
とし込むための四角形の開口部８を有する四角板９と、
四角板９の周縁部に連続して設けられた第一の立設部１
０とから形成される。回路基板設置部分７Ｂは、四角板
９の開口部８の周縁部に第一の立設部１０と反対向きに
立設して設けられた第二の立設部１１と、第二の立設部
１１の先端面と接続する底面１２とから一体に形成され
る。治具７は、溶融半田と反応しないアルミニウム等に
より形成する。The jig 7 shown in FIG. 1 is used in the method of forming a solder bump according to the present invention. A jig 7 used when forming the solder bumps 3 includes a portion 7A on which the metal mask 5 is placed,
It is integrally formed with a bump forming body, for example, a portion 7B on which a circuit board is placed. The metal mask installation portion 7A is slightly wider than the shape of the metal mask 5, and has a square plate 9 having a square opening 8 for dropping a circuit board in the center,
First standing portion 1 provided continuously on the peripheral portion of square plate 9
0. The circuit board installation portion 7B includes a second upright portion 11 provided on the periphery of the opening 8 of the square plate 9 in a direction opposite to the first upright portion 10, and a second upright portion. It is formed integrally with the bottom face 12 connected to the tip end face of the part 11. The jig 7 is formed of aluminum or the like that does not react with the molten solder.
【００１４】次に、治具７を用いて半田バンプ１を形成
する方法を説明する。Next, a method of forming the solder bump 1 using the jig 7 will be described.
【００１５】図２（ａ）のように、電極パッド２を上側
にした回路基板１を、治具７の底面１２に落とし込む。
電極パッド２にはフラックスが塗布されている。As shown in FIG. 2A, the circuit board 1 with the electrode pads 2 facing upward is dropped on the bottom surface 12 of the jig 7.
A flux is applied to the electrode pads 2.
【００１６】次に、治具７のメタルマスク設置部分７Ａ
の四角板９に貫通孔４を有するメタルマスク５を載せ
る。この場合、貫通孔４は、電極パッド２の位置に合わ
せて形成されている。第二の立設部１１の高さＨ１は、
メタルマスク５と回路基板１の上面との間に間隙Ｇを形
成するように決められている。Next, the metal mask installation portion 7A of the jig 7
The metal mask 5 having the through holes 4 is placed on the square plate 9 of FIG. In this case, the through holes 4 are formed in accordance with the positions of the electrode pads 2. The height H1 of the second standing portion 11 is
It is determined that a gap G is formed between the metal mask 5 and the upper surface of the circuit board 1.
【００１７】次に、図２（ｂ）のように、各貫通孔４に
半田ボール６を一つ置き、この状態でリフロー炉に流
す。この工程で半田ボール６は溶融し、図２（ｃ）のよ
うに、電極パッド２の上に半球状の半田バンプ３が形成
される。ここで半球状とは、半田バンプの３の断面形状
が球に近いものから、扁平に近いものまで幅広い形状を
いう。Next, as shown in FIG. 2B, one solder ball 6 is placed in each through-hole 4, and in this state, the solder ball 6 flows into a reflow furnace. In this step, the solder balls 6 are melted, and hemispherical solder bumps 3 are formed on the electrode pads 2 as shown in FIG. Here, the term “hemispherical” refers to a wide range of shapes of the solder bump 3 from a shape close to a sphere to a shape close to flat.
【００１８】メタルマスク５と電極パッド２の間に間隙
Ｇを設けているため、図３（ａ）のように、メタルマス
ク５の位置が長さＬ２だけずれて、電極パッド２と一部
重なったとしても、溶融した半田はメタルマスク５によ
って遮られないため、図３（ｂ）のように、電極パッド
２の上全体に広がり、均一な高さの半球状の半田バンプ
３が形成される。Since the gap G is provided between the metal mask 5 and the electrode pad 2, the position of the metal mask 5 is shifted by the length L2 and partially overlaps the electrode pad 2 as shown in FIG. Even if the molten solder is not blocked by the metal mask 5, it spreads over the entire electrode pad 2 and the hemispherical solder bump 3 having a uniform height is formed as shown in FIG. .
【００１９】間隙Ｇは、形成する半田バンプ３の大きさ
によって決まり、半田ボール６が貫通孔４から転がり出
てしまうのを防ぐため、少なくとも半田ボール６の直径
よりは狭く設けられる。The gap G is determined by the size of the solder bump 3 to be formed, and is provided at least smaller than the diameter of the solder ball 6 in order to prevent the solder ball 6 from rolling out of the through hole 4.
【００２０】（実施例２）図４および図５は、被バンプ
形成体として電子部品を用いた実施例を示す。(Embodiment 2) FIGS. 4 and 5 show an embodiment in which an electronic component is used as a body to be bumped.
【００２１】図４のように、電子部品に半田バンプを形
成する際は、図１に示す治具７と、電子部品を配置する
区画１３を設けるための仕切り板１４を使用する。図１
に示す治具７の構成部分は同じ番号を用いて説明を省略
する。As shown in FIG. 4, when forming solder bumps on an electronic component, a jig 7 shown in FIG. 1 and a partition plate 14 for providing a section 13 for disposing the electronic component are used. FIG.
The components of the jig 7 shown in FIG.
【００２２】仕切り板１４は、治具７の回路基板設置部
分７Ｂの内寸法に合わせて縦横に板を井桁状に組み合わ
せて形成され、治具７の底面１２に落とし込まれて使用
される。仕切り板１４の厚みＨ２は、メタルマスク５を
四角板９に載せたときに当たらないように、四角板９の
上面より低くなるように決める。The partition plate 14 is formed by combining plates vertically and horizontally in a cross-girder shape in accordance with the inner dimensions of the circuit board installation portion 7B of the jig 7, and is used by being dropped on the bottom surface 12 of the jig 7. The thickness H2 of the partition plate 14 is determined so as to be lower than the upper surface of the square plate 9 so that the metal mask 5 is not hit when the metal mask 5 is placed on the square plate 9.
【００２３】次に、電子部品に半田バンプ１を形成する
方法を説明する。Next, a method of forming the solder bump 1 on the electronic component will be described.
【００２４】図５（ａ）のように、電極パッド１５を上
側にした電子部品１６を、各区画１３に配置する。電極
パッド１５にはフラックスが塗布されている。As shown in FIG. 5A, the electronic component 16 with the electrode pad 15 facing upward is arranged in each section 13. A flux is applied to the electrode pads 15.
【００２５】次に、四角板９に貫通孔４を有するメタル
マスク５を載せる。この場合、貫通孔４は、電極パッド
１５の位置に合わせて形成されている。第二の立設部１
１の高さＨ１は、メタルマスク５と電子部品１６の上面
との間に間隙Ｇを形成するように決められている。Next, the metal mask 5 having the through holes 4 is placed on the square plate 9. In this case, the through holes 4 are formed in accordance with the positions of the electrode pads 15. Second standing part 1
The height H1 of 1 is determined so as to form a gap G between the metal mask 5 and the upper surface of the electronic component 16.
【００２６】次に、図５（ｂ）のように、各貫通孔４に
半田ボール６を一つ置き、この状態でリフロー炉に流
す。この工程で半田ボール６は溶融し、図５（ｃ）のよ
うに、電極パッド１５の上に半球状の半田バンプ３が形
成される。Next, as shown in FIG. 5 (b), one solder ball 6 is placed in each through hole 4, and in this state, it flows into a reflow furnace. In this step, the solder balls 6 are melted, and the hemispherical solder bumps 3 are formed on the electrode pads 15 as shown in FIG.
【００２７】メタルマスク５と電極パッド１５の間に間
隙Ｇを設けているため、図３と同様に、メタルマスク５
の位置がずれて、電極パッド１５と一部重なったとして
も、溶融した半田はメタルマスク５によって遮られない
ため、電極パッド１５の上全体に広がり、均一な高さの
半球状の半田バンプ３が形成される。Since the gap G is provided between the metal mask 5 and the electrode pad 15, as in FIG.
Even if the position is shifted and partially overlaps with the electrode pad 15, the molten solder is not blocked by the metal mask 5, so it spreads over the entire electrode pad 15 and has a uniform spherical hemispherical solder bump 3. Is formed.
【００２８】間隙Ｇは、形成する半田バンプ３の大きさ
によって決まり、半田ボール６が貫通孔４から転がり出
てしまうのを防ぐため、少なくとも半田ボール６の直径
よりは狭く設けられる。The gap G is determined by the size of the solder bump 3 to be formed, and is provided at least smaller than the diameter of the solder ball 6 in order to prevent the solder ball 6 from rolling out of the through hole 4.
【００２９】[0029]
【００３０】[0030]
【００３１】[0031]
【００３２】[0032]
【００３３】[0033]
【００３４】[0034]
【００３５】[0035]
【発明の効果】半田ボールを溶融する際のフラックスの
残渣によって、メタルマスクと被バンプ形成体は密着し
ないので、両者を剥がす工数がなくなる。このため、半
田バンプを形成する時間が短縮でき、コスト削減ができ
る。The metal mask and the object to be bumped do not come into close contact with each other due to the residual flux when the solder ball is melted. Therefore, the time for forming the solder bumps can be reduced, and the cost can be reduced.
【００３６】 電極パッド上に均一な高さの半球状の半田
バンプを形成することができるので、電子部品と半田バ
ンプの接続状態が一定し、信頼性が向上する。 Since a hemispherical solder bump having a uniform height can be formed on the electrode pad, the connection state between the electronic component and the solder bump is constant, and the reliability is improved.
【図１】本発明に係る被バンプ形成体の回路基板に半田
バンプを形成する方法に使用する治具の斜視図である。FIG. 1 is a perspective view of a jig used in a method of forming a solder bump on a circuit board of a bump-formed body according to the present invention.
【図２】本発明に係る被バンプ形成体の回路基板に半田
バンプを形成する方法の概略図である。FIG. 2 is a schematic view of a method for forming a solder bump on a circuit board of a bump-formed body according to the present invention.
【図３】本発明に係る被バンプ形成体の回路基板に半田
バンプを形成する方法において、図３（ａ）はメタルマ
スクの位置ずれを示す図で、図３（ｂ）は半田バンプの
形成状態を示す図である。FIGS. 3A and 3B are diagrams showing a displacement of a metal mask in a method of forming a solder bump on a circuit board of a bump-formed body according to the present invention, and FIG. It is a figure showing a state.
【図４】本発明に係る被バンプ形成体の電子部品に半田
バンプを形成する方法に使用する治具の斜視図である。FIG. 4 is a perspective view of a jig used in a method for forming a solder bump on an electronic component of a bump-formed body according to the present invention.
【図５】本発明に係る被バンプ形成体の電子部品に半田
バンプを形成する方法の概略図である。FIG. 5 is a schematic view of a method for forming a solder bump on an electronic component of a bump-formed body according to the present invention.
【図６】従来の回路基板に半田バンプを形成する方法の
概略図である。FIG. 6 is a schematic view of a conventional method for forming solder bumps on a circuit board.
【図７】従来の回路基板に半田バンプを形成する方法に
おいて、図７（ａ）はメタルマスクの位置ずれを示す図
で、図７（ｂ）は半田バンプの形成状態を示す図であ
る。FIGS. 7A and 7B are views showing a positional shift of a metal mask and FIGS. 7B and 7B are views showing a state of forming a solder bump in a conventional method of forming a solder bump on a circuit board.
１ 回路基板 ２ 電極パッド ３ 半田バンプ ４ 貫通孔 ５ メタルマスク ６ 半田ボール ７ 治具 １３ 区画 １４ 仕切り板 １５ 電極パッド １６ 電子部品 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Electrode pad 3 Solder bump 4 Through hole 5 Metal mask 6 Solder ball 7 Jig 13 Section 14 Partition board 15 Electrode pad 16 Electronic component
フロントページの続き (56)参考文献 特開 昭64−22049（ＪＰ，Ａ) 特開 昭63−104397（ＪＰ，Ａ) 特開 昭50−126550（ＪＰ，Ａ) 特開 昭50−56348（ＪＰ，Ａ) 特開 平２−238693（ＪＰ，Ａ) 特開 平７−122841（ＪＰ，Ａ) 特開 平７−212021（ＪＰ，Ａ) 実開 平４−4742（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 H05K 3/34 Continuation of the front page (56) References JP-A-64-2249 (JP, A) JP-A-63-104397 (JP, A) JP-A-50-126550 (JP, A) JP-A-50-56348 (JP, A) JP-A-2-23893 (JP, A) JP-A-7-122841 (JP, A) JP-A-7-212021 (JP, A) JP-A-4-4742 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60 H05K 3/34
Claims (1)
の表面にフラックスを塗布する工程と、メタルマスクを
前記被バンプ形成体に重ね合わせてメタルマスクに形成
した貫通孔を電極パッド上に設ける工程と、貫通孔に半
田ボールを置く工程と、リフロー炉で半田ボールを溶融
する工程とからなる半田バンプの形成方法において、メ
タルマスクを置く部分と、被バンプ形成体を置く部分と
から一体に形成される治具を用い、前記被バンプ形成体
と前記メタルマスクの間に間隙を設けることを特徴とす
る半田バンプの形成方法。1. A step of applying a flux to a surface of a bump-formed body on which a solder bump is formed, and a step of overlaying a metal mask on the bump-formed body and providing a through hole formed in the metal mask on an electrode pad. When a step of placing solder balls in the through hole, the method of forming solder bumps comprising the step of melting the solder balls in a reflow furnace, main
The part where the metal mask is placed and the part where the body to be bumped is placed
Using a jig integrally formed from
And forming a gap between the metal mask and the metal mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12651594A JP3331745B2 (en) | 1994-06-08 | 1994-06-08 | Method of forming solder bumps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12651594A JP3331745B2 (en) | 1994-06-08 | 1994-06-08 | Method of forming solder bumps |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07335651A JPH07335651A (en) | 1995-12-22 |
| JP3331745B2 true JP3331745B2 (en) | 2002-10-07 |
Family
ID=14937124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12651594A Expired - Fee Related JP3331745B2 (en) | 1994-06-08 | 1994-06-08 | Method of forming solder bumps |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3331745B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4947408B2 (en) * | 2006-06-01 | 2012-06-06 | 澁谷工業株式会社 | Array mask support device |
| TW201818521A (en) * | 2016-11-04 | 2018-05-16 | 唐虞企業股份有限公司 | Circuit pin positioning structure and welding circuit module manufacturing method thereof |
-
1994
- 1994-06-08 JP JP12651594A patent/JP3331745B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07335651A (en) | 1995-12-22 |
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