JP3329126B2 - Soldering equipment - Google Patents
Soldering equipmentInfo
- Publication number
- JP3329126B2 JP3329126B2 JP06404695A JP6404695A JP3329126B2 JP 3329126 B2 JP3329126 B2 JP 3329126B2 JP 06404695 A JP06404695 A JP 06404695A JP 6404695 A JP6404695 A JP 6404695A JP 3329126 B2 JP3329126 B2 JP 3329126B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- tank
- soldering apparatus
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気部品のリード端子等
の局部半田付けに適した半田付装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus suitable for local soldering of lead terminals of electric parts.
【０００２】[0002]
【従来の技術】近年、半田付装置はステンレス等の半田
が付着しない金属で形成した半田槽に半田を溶融させ、
電気部品のリード等を溶融した半田に浸漬することによ
り半田付けを行っている。2. Description of the Related Art In recent years, a soldering apparatus melts solder in a solder tank formed of a metal such as stainless steel to which solder does not adhere.
Soldering is performed by immersing electrical component leads and the like in molten solder.
【０００３】以下に従来の半田付装置について説明す
る。図２は従来の半田付装置の構成を示すものである。
図２において、１は半田を溶融させるための加熱機能を
備えた一次半田槽、２は半田が付着しない金属で形成し
た二次半田槽、３は溶融半田、４は二次半田槽２を上下
方向に移動するための昇降装置、５はプリント基板、６
はプリント基板５に形成された銅箔、７はプリント基板
５に載置された電気部品、８は電気部品７のリード端子
である。Hereinafter, a conventional soldering apparatus will be described. FIG. 2 shows a configuration of a conventional soldering apparatus.
In FIG. 2, 1 is a primary solder tank having a heating function for melting solder, 2 is a secondary solder tank formed of a metal to which solder does not adhere, 3 is molten solder, and 4 is a vertical solder tank. Lifting device for moving in the direction, 5 is a printed circuit board, 6
Is a copper foil formed on the printed circuit board 5, 7 is an electric component mounted on the printed circuit board 5, and 8 is a lead terminal of the electric component 7.
【０００４】以上のように構成された従来の半田付装置
を使用して電気部品７のリード端子８をプリント基板に
半田接続する動作について、以下説明する。The operation of soldering the lead terminals 8 of the electric component 7 to a printed circuit board using the conventional soldering apparatus configured as described above will be described below.
【０００５】まず、プリント基板５に電気部品７を挿入
した後、リード端子８と銅箔６の周辺にフラックスをデ
ィップあるいは刷毛塗り等の手段で塗布し、プリント基
板５を一次半田槽１の上部の所定の位置にセットする。
次に、一次半田槽１の中に浸漬された二次半田槽２を昇
降装置４により所定の位置まで上昇させ、リード端子８
と銅箔６を二次半田槽２の半田により半田付け接合す
る。First, after the electric component 7 is inserted into the printed circuit board 5, a flux is applied to the periphery of the lead terminal 8 and the copper foil 6 by means such as dip or brush coating, and the printed circuit board 5 is placed on the upper part of the primary solder tank 1. Set to a predetermined position.
Next, the secondary solder bath 2 immersed in the primary solder bath 1 is raised to a predetermined position by the lifting device 4, and the lead terminals 8.
And the copper foil 6 are joined by soldering in the secondary solder tank 2.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、二次半田槽２が半田を付着させない材質
であるため、二次半田槽２と溶融半田の界面にわずかな
隙間が発生し、この隙間からリード端子８と銅箔６に塗
布されたフラックスの樹脂成分が二次半田槽２内に侵入
する。その結果、二次半田槽２の内部に、炭化したフラ
ックスの樹脂成分９が堆積し、二次半田槽２と半田とが
断熱され半田温度が不安定になるため、半田付け品質が
安定せず、また、二次半田槽２に堆積した樹脂成分の定
期的除去が必要になる等の作業が煩雑になるという問題
点を有していた。However, in the above-described conventional configuration, since the secondary solder tank 2 is made of a material to which solder does not adhere, a slight gap is generated at the interface between the secondary solder tank 2 and the molten solder. From this gap, the resin component of the flux applied to the lead terminals 8 and the copper foil 6 enters the secondary solder tank 2. As a result, the resin component 9 of the carbonized flux is deposited inside the secondary solder tank 2, and the secondary solder tank 2 and the solder are insulated and the solder temperature becomes unstable, so that the soldering quality is not stable. In addition, there is a problem that the operation such as the necessity of periodically removing the resin component deposited on the secondary solder tank 2 becomes complicated.
【０００７】本発明は上記従来の問題点を解決するもの
で、二次半田槽内部へのフラックスの樹脂成分の堆積を
防ぎ、半田温度を安定化させ、且つメンテナンスフリー
の半田付装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a maintenance-free soldering apparatus which prevents deposition of a resin component of a flux inside a secondary soldering tank, stabilizes a soldering temperature, and is maintenance-free. The purpose is to:
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明の半田付装置は、内周上部を除いた表面に形成
された半田メッキ層と、その内周上部に半田が付着しな
い性質の金属で形成された金属部とを有する半田槽を備
えたものである。In order to achieve this object, a soldering apparatus according to the present invention comprises a solder plating layer formed on a surface excluding an upper portion of an inner periphery, and a solder plating layer formed on the upper portion of the inner periphery. And a metal part formed of the above-mentioned metal.
【０００９】[0009]
【作用】以上の構成によって、半田槽の表面に半田メッ
キ層を施しているため、溶融した半田が半田メッキ層の
半田メッキと合金化し半田槽と密着するため、フラック
スの樹脂成分の半田槽内部への侵入経路が遮断され、フ
ラックス樹脂成分の堆積が無くなる。さらに、半田槽の
内周上面の半田液面部周辺に配置した半田が付着しない
金属部が溶融半田の表面張力作用を助長し、溶融半田の
液面が盛り上がるため、局所半田付けに最適な半田付装
置となる。According to the above construction, since the solder plating layer is formed on the surface of the solder bath, the molten solder is alloyed with the solder plating of the solder plating layer and adheres to the solder bath. The entry route to the air is blocked, and the accumulation of the flux resin component is eliminated. In addition, the metal part where the solder does not adhere and is placed around the solder liquid surface part on the inner peripheral upper surface of the solder tank promotes the surface tension action of the molten solder, and the liquid surface of the molten solder rises, so the most suitable solder for local soldering Attached device.
【００１０】[0010]
（実施例１）以下に本発明の一実施例について、図面を
参照しながら説明する。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.
【００１１】図１は本発明の一実施例である半田付装置
の概略構成を示す模式図である。図１において、図２に
示した従来の半田付装置と同一構成要素には同一番号を
付与して説明を省略する。FIG. 1 is a schematic diagram showing a schematic configuration of a soldering apparatus according to one embodiment of the present invention. 1, the same components as those of the conventional soldering apparatus shown in FIG.
【００１２】図１において、１２は鉄などの半田メッキ
可能な金属で形成した二次半田槽、１３は二次半田槽１
２の内周上部を除いた表面に形成された半田メッキ層、
１４はステンレス等の半田が付着しない金属で形成した
金属部で、金属部１４は二次半田槽１２の内周上部にリ
ング状に形成されている。In FIG. 1, reference numeral 12 denotes a secondary solder tank formed of a metal capable of being plated with solder such as iron, and 13 denotes a secondary solder tank 1
2, a solder plating layer formed on the surface excluding the upper part of the inner circumference,
Reference numeral 14 denotes a metal part formed of a metal to which solder does not adhere, such as stainless steel.
【００１３】以上のように構成された本実施例の半田付
装置を使用して電気部品７のリード端子８をプリント基
板に半田接続する動作について、以下説明する。The operation of soldering the lead terminals 8 of the electric component 7 to the printed circuit board using the soldering apparatus of the present embodiment configured as described above will be described below.
【００１４】まず、プリント基板５に電気部品７を挿入
した後、リード端子８と銅箔６の周辺にフラックスをデ
ィップあるいは刷毛塗り等の手段で塗布し、プリント基
板５を一次半田槽１の上部の所定の位置にセットする。
次に、一次半田槽１の中に浸漬された二次半田槽２を昇
降装置４により所定の位置まで上昇させ、リード端子８
と銅箔６を二次半田槽２の半田により半田付け接合す
る。First, after the electric component 7 is inserted into the printed circuit board 5, a flux is applied to the periphery of the lead terminals 8 and the copper foil 6 by means of dip or brush coating, and the printed circuit board 5 is placed on the upper part of the primary solder tank 1. Set to a predetermined position.
Next, the secondary solder bath 2 immersed in the primary solder bath 1 is raised to a predetermined position by the lifting device 4, and the lead terminals 8.
And the copper foil 6 are joined by soldering in the secondary solder tank 2.
【００１５】ここで、本実施例の半田付装置は、二次半
田槽１２内の溶融半田３が二次半田槽１２内面の半田メ
ッキ層１３の半田メッキと合金化し、フラックス樹脂分
の二次半田槽１２内への侵入経路が遮断されるため、フ
ラックス樹脂分の二次半田槽１２内部への堆積が起こら
ない。従って、常に安定した温度での半田付けが可能と
なり、半田付け品質が向上するばかりでなく従来のよう
な半田槽内面の堆積物の除去、清掃が不要となり作業が
簡素化される。さらに、二次半田槽１２の内周上部に形
成された金属部１４が溶融半田３をはじくため結果的に
溶融半田３の表面張力作用を助長し、溶融半田３の液面
が盛り上がり、リード端子８と銅箔６を半田により半田
付け接合するという局所半田付けに最適な半田付装置と
なる。Here, in the soldering apparatus of this embodiment, the molten solder 3 in the secondary solder tank 12 is alloyed with the solder plating of the solder plating layer 13 on the inner surface of the secondary solder tank 12, and the secondary solder component is formed. Since the path of entry into the solder bath 12 is blocked, the flux resin does not accumulate inside the secondary solder bath 12. Therefore, soldering can be always performed at a stable temperature, so that not only the soldering quality is improved but also the removal and cleaning of deposits on the inner surface of the solder tank as in the related art become unnecessary, and the operation is simplified. Further, the metal portion 14 formed at the upper part of the inner periphery of the secondary solder tank 12 repels the molten solder 3, and consequently promotes the surface tension action of the molten solder 3. 8 and the copper foil 6 are joined by soldering, which is an optimal soldering apparatus for local soldering.
【００１６】[0016]
【発明の効果】以上のように本発明は、表面に半田メッ
キ層を形成し、さらに内周上面に半田が付着しない性質
の金属で形成した金属部を配置することにより、フラッ
クス樹脂分の半田槽内部への侵入経路が遮断されるため
半田槽内部のフラックス樹脂分の堆積が発生せず、常に
安定した温度での半田付けが可能となり、半田付け品質
が向上するばかりでなく従来のような半田槽内面の堆積
物の除去、清掃が不要となり作業が簡素化される。さら
に半田槽の内周上部の金属部により溶融半田の表面張力
作用が助長され溶融半田液面が盛り上がるため、局所半
田付けに最適な半田付装置を実現できるものである。As described above, according to the present invention, a solder plating layer is formed on the surface, and a metal portion formed of a metal to which solder does not adhere is disposed on the inner peripheral upper surface. Since the path of intrusion into the bath is cut off, the flux resin inside the bath does not accumulate, so soldering can be performed at a stable temperature at all times. Removal of the deposit on the inner surface of the solder tank and cleaning are not required, and the operation is simplified. Further, since the surface tension action of the molten solder is promoted by the metal portion on the inner peripheral upper portion of the solder bath and the liquid level of the molten solder rises, it is possible to realize an optimum soldering apparatus for local soldering.
【図１】本発明の半田付装置における一実施例を示す模
式図FIG. 1 is a schematic view showing one embodiment of a soldering apparatus of the present invention.
【図２】従来の半田付装置を示す模式図FIG. 2 is a schematic view showing a conventional soldering apparatus.
１ 一次半田槽 １２ 二次半田槽 １３ 半田メッキ層 １４ 金属部 DESCRIPTION OF SYMBOLS 1 Primary solder tank 12 Secondary solder tank 13 Solder plating layer 14 Metal part
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−200863（ＪＰ，Ａ) 実開 平３−85162（ＪＰ，Ｕ) 実開 昭53−138632（ＪＰ，Ｕ) 実開 平６−41965（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 1/08 B23K 3/06 H05K 3/34 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-200863 (JP, A) JP-A-3-85162 (JP, U) JP-A-53-138632 (JP, U) JP-A-6-85 41965 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) B23K 1/08 B23K 3/06 H05K 3/34
Claims (1)
おこなう半田付装置であって、内周上部を除いた表面に
形成された半田メッキ層と、その内周上部に半田が付着
しない性質の金属で形成された金属部とを有する半田槽
を備えたことを特徴とする半田付装置。1. A soldering apparatus for performing soldering by immersing in a molten solder, wherein a solder plating layer formed on a surface excluding an upper portion of an inner periphery and a property that solder does not adhere to an upper portion of the inner periphery. A soldering apparatus comprising: a solder tank having a metal part formed of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06404695A JP3329126B2 (en) | 1995-03-23 | 1995-03-23 | Soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06404695A JP3329126B2 (en) | 1995-03-23 | 1995-03-23 | Soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08257742A JPH08257742A (en) | 1996-10-08 |
| JP3329126B2 true JP3329126B2 (en) | 2002-09-30 |
Family
ID=13246776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06404695A Expired - Fee Related JP3329126B2 (en) | 1995-03-23 | 1995-03-23 | Soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3329126B2 (en) |
-
1995
- 1995-03-23 JP JP06404695A patent/JP3329126B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08257742A (en) | 1996-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |