JP3307980B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluid supply technique, and more particularly to a chemical manufacturing industry including a semiconductor manufacturing industry, a liquid crystal substrate manufacturing industry, a magnetic disk manufacturing industry, a multilayer wiring board manufacturing industry, an optical component manufacturing industry, and the like. It is effective to use for liquid supply technology in

[0002] The present invention is applied to a liquid supply apparatus for supplying a fixed amount of liquid in a highly pure state while controlling the speed precisely and stably.

[0003]

2. Description of the Related Art In manufacturing processes such as a semiconductor manufacturing industry, a liquid crystal substrate manufacturing industry, and a magnetic disk manufacturing industry, pure water,
Chemical processes using liquids such as acids, alkalis, organic solvents, liquid crystals, and photoresists are frequently used.

Looking at the semiconductor manufacturing process,
The required processing dimensions manufactured by these chemical liquid processing processes are reduced from 0.5 μm to 0.3 μm, and defective shapes due to the inclusion of impurities such as bubbles and foreign substances in the chemical liquid occur frequently. There is a demand for a technique for removing chemical impurities and supplying a chemical solution in a clean state.

Further, as in the example of a photoresist spin coating apparatus, when the operation of drawing the photoresist liquid into the drip nozzle (hereinafter referred to as "suck back") at the time of photoresist dripping fluctuates, the dripping of the photoresist liquid or the tip of the drip nozzle may occur. Deposits are formed. The deposits are mixed into the dropped photoresist liquid and cause foreign matters and coating unevenness. If the supply speed of the photoresist liquid fluctuates, bubbles may be generated in the photoresist liquid, or when the photoresist liquid is dropped on the semiconductor wafer, the bubbles may be entrained, resulting in a decrease in coating film thickness accuracy and the generation of foreign matter.

With the aim of solving these problems, various liquid supply devices have been proposed as prior art.

[0007] For example, as a means for avoiding air bubbles and foreign matter in a supply liquid, a method of integrating a filter, a pump, and a control valve to prevent liquid accumulation in a liquid supply system and remove foreign matter by a filter is disclosed in Japanese Patent Application Laid-Open Publication No. H10-163,873. It is known from Japanese Patent Application Laid-Open No. 64-500135.

Further, as means for preventing liquid dripping due to fluctuations in the suck-back amount in the dropping nozzle and for preventing fluctuations in the supply amount,
A method for optically measuring and controlling the suck-back amount in the dripping nozzle is disclosed in Japanese Patent Application Laid-Open No. 64-21924, and the operating speed of the suck-back valve is controlled by controlling the driving pressure value acting on the suck-back valve. . Japanese Patent Laid-Open Publication No. 2-81630 discloses a method of sucking back at a slow speed into a dropping nozzle to prevent dripping.

Further, as means for preventing the fluctuation of the liquid supply amount and the suck-back amount, the pressure applied to the liquid in the liquid container and the negative pressure are switched and controlled, and the opening / closing timing of the liquid supply valve is independently controlled. The method is disclosed in
76327.

[0010]

The above-mentioned prior art has a certain effect in the short term, but it is not perfect in the long term. The present inventor has clarified that it is not possible to accurately supply a fixed amount while precisely controlling the supply speed and suckback speed in a pure state, and to prevent liquid dripping from a dropping nozzle. In other words, Japanese Patent Publication No.
In the liquid supply means described in JP-A No. 00135, the liquid is suctioned at a negative pressure by a diaphragm film and is pressure-fed. During this negative pressure suction, bubbles are generated in the suction liquid and trapped in the filter membrane.

The air bubbles trapped in the filter membrane cannot be completely removed from the air vent portion, and the filter filtration area decreases according to the amount of air bubbles trapped in the filter membrane.
The inventors have found that the filter pressure loss is high.

As described above, when the filter pressure loss increases,
It has been clarified that the liquid pressure acting on the filter membrane is increased, the gel-like foreign matter permeates through the filter membrane, and the foreign matter removal efficiency by the filter membrane is deteriorated.

Further, it has been clarified that the liquid supply speed fluctuates even if the pump pressure is controlled at a constant pressure due to the fluctuation of the filter membrane pressure loss, thereby causing a problem that the liquid cannot be supplied at a constant constant speed. Further, as a result of the present inventor's microscopic analysis on the liquid supply speed, it has been found that the liquid supply speed fluctuates when the opening / closing speed of the liquid supply on / off valve provided in the liquid supply device fluctuates.

This problem is common to Japanese Patent Application Laid-Open No. 63-76327. Japanese Patent Application Laid-Open No. 63-76327
In the publication, as another problem, the liquid in the liquid storage container,
Since the gas is directly pressurized, the gas dissolves in the liquid, and the gas dissolved in the liquid supply process foams, which also causes air bubbles.

On the other hand, the present inventor analyzed the mechanism of dripping and fouling of a dripping nozzle which occurs at the time of suck back after dropping a liquid, using silicone oil.

FIG. 8 shows the result. Even when the suck-back valve suction operation speed is appropriate, the opening operation speed of the liquid supply on-off valve fluctuates, causing a phenomenon in which the liquid jumps out of the drip nozzle and stops, or a phenomenon in which the liquid drops from the drip nozzle.

Specifically, (1) even if the suck-back valve suction speed is appropriate, if the closing operation speed of the on-off valve is too fast,
A phenomenon occurs in which the liquid drops out of the drip nozzle and stops.

(2) Even if the suction speed of the suck-back valve is proper, if the closing operation speed of the on-off valve is too slow, the liquid dripping phenomenon occurs.

As a result, it has been clarified that a problem arises in that the tip of the dropping nozzle becomes dirty, and that the suck-back amount and the supply amount fluctuate.

The inventor also analyzed the relationship between the opening / closing operation speed of the liquid supply on-off valve and the liquid supply amount. As a result, (1) when the opening operation speed of the on-off valve is high, the initial liquid supply speed is high and the supply amount is large.

(2) When the opening speed of the on-off valve is low, the initial liquid supply speed is low and the supply amount is small.

(3) If the closing speed of the on-off valve is high, the liquid supply cutoff speed is high and the supply amount is small.

(4) If the closing speed of the on-off valve is low, the liquid supply cutoff speed becomes low and the supply amount increases.

From these facts, Japanese Patent Application Laid-Open No. 64-1922
No. 4, JP-A-2-81630, it has become apparent that the suck-back fluctuation preventing means cannot solve the problem of the occurrence of the liquid dripping and the prevention of the contamination of the tip of the dropping nozzle.

An object of the present invention is to solve the above-mentioned problems by providing a fluid supply control element (fluid supply unit, fluid supply opening / closing valve, fluid dripping prevention suck-back valve) constituting a fluid supply device. An object of the present invention is to provide a fluid supply technique for controlling a combination of operations from both the operation timing and the operation speed to supply the fluid at a constant constant speed in a clean state without dripping.

Another object of the present invention is to provide a fluid supply technique capable of preventing generation of air bubbles in a fluid due to gas intrusion or fluid suction operation.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0028]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, typical ones will be outlined as follows.

That is, a method of manufacturing a semiconductor device according to the present invention includes a resist liquid supply function unit for supplying a stored resist solution, a resist liquid supply opening / closing valve function unit for supplying and shutting off the supplied resist solution, A method for manufacturing a semiconductor device using a resist liquid supply system having a liquid dripping prevention function section and a component operation control section for controlling each of these elements, wherein the viscosity, supply amount and suckback amount of the resist liquid are Setting in the component operation control unit the resist liquid supply control information including, the pressure loss of the supply system for supplying the resist liquid, and control correction value information including the operation time constant of each of the components; and Using the liquid supply control information and the control correction value information, control the operation timing of switching from the supply stop state to the supply state of the resist liquid supply function unit, And a step of dropping the photoresist solution on a conductor wafer.

More specifically, for example, a fluid pumping function pressure control section that can set a predetermined pressure is connected to a fluid pumping function section that is a fluid feeding function section, and a fluid pump that is a fluid supply opening / closing function section is connected. Connects an open / close valve operation control unit that can set the open / close operation timing and operation speed of the supply open / close valve to predetermined values, and further sets the pull-in operation and push-out operation timing and operation speed of the suck-back valve, which is a fluid dripping prevention function unit, to predetermined values. Connect a fluid dripping prevention operation control unit that can be set to

Further, the fluid pressure control unit, the fluid supply opening / closing valve operation control unit, and the fluid dripping prevention operation control unit are connected to the main control unit. The main controller sends the fluid under pressure according to the set fluid supply control conditions [viscosity of the fluid, supply speed (or supply time), supply amount, suckback speed (or suckback time), suckback amount, etc.]. The control unit controls the functional pressure control unit to control the pressurization timing, pressurizing force rise profile, and pressurizing force fall profile of the fluid supply function unit. At the same time, the fluid supply on-off valve operation control unit is controlled to control the opening operation timing and the opening operation speed and the closing operation timing and the closing operation speed of the fluid supply on-off valve. Further, the control unit controls the fluid dripping prevention operation unit to control the pushing operation timing, the pushing operation speed, the retraction operation timing, and the retraction operation speed of the fluid dripping prevention function unit. In particular, the main control unit integrally controls these, and maintains the fluid supply control conditions stably and accurately.

[0032]

[0033]

[0034]

According to the above-mentioned means, input information relating to constant-rate constant supply such as viscosity of the fluid, supply speed (or supply time), supply amount and the like, suckback speed (or suckback time), suckback amount, etc. When the input information on the constant-rate constant-speed suckback is input to the main control unit, the main control unit performs operations such as a fluid supply function unit, a fluid supply opening / closing valve function unit, and a fluid dripping prevention function unit included in the fluid supply device. Each fluid supply control element is optimally controlled in terms of both operation timing and operation speed.

For example, the main control unit obtains and sets the pressure value acting on the fluid supply function unit from the viscosity parameter and the pressure loss parameter of the fluid supply system, which are experimentally obtained by the following equations.

P = f (q, η, α) P; pressure value acting on the fluid supply function q: supply speed of the fluid (= supply amount / supply time) η: viscosity of the fluid α; flow Pressure loss (filter pressure loss, supply pipe pressure loss) of the fluid supply system On the other hand, in the main control unit, the opening / closing operation timing of the fluid supply opening / closing valve function unit and the opening / closing operation speed are determined by the fluid viscosity parameter and the fluid supply system pressure. It is automatically controlled by a value experimentally obtained from the loss parameter and the relationship between the operation timing and the operation speed of the fluid dripping prevention function unit.

Similarly, the main control unit also controls the retraction operation timing and operation speed,
The extrusion operation timing and operation speed are also automatically controlled by values obtained experimentally from the relationship between the fluid viscosity parameter, the pressure loss parameter of the fluid supply system, and the operation timing and operation speed of the fluid supply on-off valve function unit. . As described above, according to the present invention, the fluid supply control condition information (fluid viscosity, fluid supply speed, fluid supply amount, fluid suck-back speed, fluid suck By inputting the back amount, the main control unit performs control of each of the fluid supply control elements such as the fluid supply function unit, the fluid supply opening / closing valve function unit, and the fluid dripping prevention function unit provided in the fluid supply device. Since the operation timing and the operation speed are optimally controlled, it is possible to supply the fluid at a constant constant speed in a clean state without dripping and to perform the constant constant speed suckback.

[0038]

Embodiment 1 FIG. 1 is a block diagram showing an example of a system configuration of a fluid supply device according to an embodiment of the present invention.

In the configuration of this embodiment, a fluid supply function unit 2 for supplying the stored fluid 1, a fluid supply opening / closing valve function unit 3 for supplying and shutting off the supplied fluid 1, and a fluid supply function The part 2 and the fluid supply opening / closing valve function part 3 realize a constant-rate constant drop 5 of the fluid 1 from the drop nozzle 4.

In the passage of the fluid 1 from the fluid supply opening / closing valve function section 3 to the drip nozzle 4, a fluid dripping prevention function section 7 is provided.
And performs a constant-rate constant suckback 6 of the fluid 1 into the dropping nozzle 4.

Further, the fluid supply function unit 2, the fluid supply opening / closing valve function unit 3, and the fluid dripping prevention function unit 7 are collectively controlled under the control of the component operation control unit 8.

The component operation control section 8 includes the viscosity of the fluid 1, the supply speed of the fluid 1, the supply amount of the fluid 1, the fluid 1
Supply control condition information 9 such as the suckback speed of the fluid 1 and the amount of suckback of the fluid 1 and the pressure loss of the fluid supply system, which is determined when a piping route (not shown) in the fluid supply device system is determined. Control correction value information 10 such as the operation time constant of each fluid supply control element is set.

The operation function of the fluid supply system shown in FIG. 1 will be described with reference to the operation chart of the fluid supply device controller shown in FIG. The component operation control unit 8 uses the fluid supply control condition information 9 and the control correction value information 10 to control the fluid supply control unit 2, the fluid supply opening / closing valve function unit 3, and the fluid dripping. The prevention function unit 7 is controlled.

The component operation control unit 8, the fluid supply functional unit operation control signal 11, as shown in FIG. 2, the fluid supply function portion 2 from the supply stop state, the operation timing T ₁ for switching to the supply state to control the operation speed S _1.

Similarly, the operation timing T ₁₁ and the operation speed S ₆ for switching the fluid supply function unit 2 from the supply state to the supply stop state are controlled.

Further, the component operation control section 8 fetches the operation state of the fluid supply function section 2 as the fluid supply function section operation state information 12. Similarly, the component operation control unit 8
As shown in FIG. 2, the fluid supply on-off valve function unit 3 is changed from the closed state by the fluid supply on-off valve operation control signal 13
Controls the operation timing T ₃ and the open operation speed S ₂ to switch to an open state, also, the fluid supply off valve function portion 3 from the open state, and controls the closing operation speed S ₅ and the operation timing T ₈ for switching to the closed state .

At the same time, the component operation control section 8 fetches the operation state of the fluid supply on-off valve function section 3 as the fluid supply on-off valve operation state information 14.

The component operation control unit 8 switches the fluid dripping prevention function unit 7 from the retracted state to the pushed state by the fluid dripping prevention function unit operation control signal 15 as shown in FIG. ₅ and pushout speed S ₃ controls, controls the operation timing T ₇ and pull-in operation speed S ₄ to switch to the retracted state from the extrusion state.

At the same time, the component operation control section 8 fetches the operating state of the fluid dripping prevention function section 7 as the fluid dripping prevention function section operating state information 16.

The coordinated control operation of the fluid supply device having the above configuration is as follows as an example.

In the initial state, the fluid supply function unit 2 is in a supply stopped state, the fluid supply on / off valve function unit 3 is in a closed state, and the fluid dripping prevention function unit 7 is in a retracted state.

The component operation control section 8 includes the viscosity of the fluid 1, the supply speed of the fluid 1, the supply amount of the fluid 1, the suck-back speed of the fluid 1, the suck-back amount of the fluid 1, and the like. Of the fluid supply control condition information 9 and control correction value information 10 such as the pressure loss of the fluid supply system, the operation time constant of each configured fluid supply control element, and the like.

Starting from this state, the operation timing T ₁
Then, the fluid supply function unit 2 switches from the supply stop state to the supply state.

The switching operation speed S ₁ at this time is determined by the component operation control unit 8 based on the fluid supply control condition information 9, and is controlled as a fluid supply function unit operation control signal 11 by obtaining an optimal solution.

At the operation timing T ₂ , the fluid supply function unit 2 enters the supply state. From this state, by operation timing T ₃ after the delay time t _1, the fluid supply off valve operation control signal 13, the fluid supply off valve function unit 3 switches from a closed state to an open state. Based on the fluid supply control condition information 9 and the control correction value information 10, the component operation control unit 8 determines an optimal control value for the delay time t ₁ and the opening operation speed S ₂ at this time. The fluid supply on-off valve function part 3 opens at determined opening operation speed S _2, in the open state at the operation timing T _4.

After the operation timing T ₄ , the delay time t ₂
Operation timing T ₅ in fluid dripping prevention section 7 of the later,
The fluid dripping prevention function section operation control signal 15, is extruded operating in the extrusion operation speed S _3. In operation timing T _6, the fluid dripping prevention function section 7 is the extrusion conditions.

Thereafter, at the operation timing T ₇ , the fluid dripping prevention function unit 7 is retracted at the retracting operation speed S ₄ by the optimal fluid dripping prevention function unit operation control signal 15 determined by the component operation control unit 8. Operate.

From the operation timing T ₇ to the delay time t ₃
The operation timing T ₈ after, the fluid supply off valve function portion 3
Close by closing speed S _5. Pull-in operation speed S ₄ between the delay time t ₃ fluid dripping prevention function unit 7, the closing operation speed S ₅ of the fluid supply off valve function portion 3 is, as described in FIG. 8 described above, the fluid 1 The component operation control unit 8 determines an optimal solution for preventing a phenomenon in which a liquid jumps out of a dropping nozzle or a liquid dripping phenomenon, which is determined by flow characteristics such as viscosity.

[0059] In operation timing T _10, becomes the retracted state fluid dripping prevention function unit 7, in operation timing T ₁₁ of the delay time t _4, from the fluid supply functional unit 2 supply state, switches the supply stop state. This switching operation speed S ₆
Can be switched with. Fluid supply function portion 2 in operation timing T ₁₂ is the supply stop state.

In the operation state shown in FIG. 2, the operation states of the fluid supply function section 2, the fluid supply opening / closing valve function section 3, and the fluid dripping prevention function section 7 are respectively the operation state of the fluid supply function section. Information 12, fluid supply on-off valve operating state information 14,
It is taken in as the fluid dripping prevention function section operation state information 16 and is externally output from the component operation control section 8 as fluid supply control state information.

According to the fluid supply device of the present embodiment shown in FIGS. 1 and 2, the fluid 1 is prevented from dripping from the dripping nozzle 4 and contaminating the dripping nozzle 4 due to the fluid jumping out. In addition, it is possible to supply the fluid 1 at a constant constant speed in a clean state and to perform a constant constant speed suckback.

[0062]

[Embodiment 2] As a more specific example of the fluid supply apparatus of the present invention, as shown in FIG. 3, a case where the present invention is applied to a photoresist supply apparatus used in a photoresist coating apparatus which is a semiconductor wafer processing apparatus will be described. I do.

To explain the constitution, the photoresist liquid 50 to be supplied is compressed by the pressing force and is stored in the internal volume variable type photoresist container 51 whose internal volume changes. The internal volume variable type photoresist container 51 includes a pressurized container 52.
Set inside. Specifically, it is screwed into a lower part of a filter storage container 54 storing the filter 53 via a photoresist container seal O-ring 55.

The pressurized container 52 and the filter container 54
Are assembled with a detachable clamp holder 57 via a pressurized container seal O-ring 56. This pressurized container 5
2 is connected to an electropneumatic conversion regulator 58 that controls the inside of the pressurized container 52 to a predetermined pressure value.

On the other hand, a filter 53 is incorporated in the filter container 54. The filter 53 is fixed by a cap 62 via a filter seal O-ring 59 and a filter seal O-ring 60 by a detachable clamp holder 61.

The cap 62 is provided with an air trap 63 for trapping air bubbles trapped in the filter 53. An air outlet 64 is provided at the highest position of the air trap section 63, and an air operated air vent opening / closing valve 65 is connected. Further, the cap 62 is provided with a photoresist take-out port 66 for taking out the photoresist liquid 50 filtered by the filter 53. The air-operated non-sliding on-off valve 67, the air-operated non-sliding suck-back valve 68,
A photoresist dripping nozzle 69 is connected.

The non-sliding on-off valve 67 is connected to an electro-pneumatic conversion regulator 70 for controlling a pressure for driving the non-sliding on-off valve 67 by air operation. An electro-pneumatic conversion regulator 71 for controlling the pressure for driving the back valve 68 by air operation is connected.

An electro-pneumatic conversion regulator 58 for controlling the pressing force in the pressurized container 52 and an electro-pneumatic conversion regulator 7 for controlling the pressing force for driving the non-sliding on-off valve 67 by air operation.
0, an electropneumatic conversion regulator 71 for controlling the pressing force for driving the non-sliding suck back valve 68 to operate by air, and an air vent opening / closing valve 65 for exhausting the air trapped in the air trap section 63 are connected to the pneumatic control section 72. Have been. Further, the pneumatic controller 72 is connected to a high-pressure air source 73 and a photoresist supply controller 74.

FIG. 4 shows an example of a non-sliding suck-back valve 68 using both a spring and a pneumatic drive, and FIG. 5 shows an example of a non-sliding on-off valve 67 using a spring.

The structure of the non-sliding suck back valve 68 shown in FIG. 4 will be described. I have.

The photoresist liquid inlet 100 includes an inlet 106 for supplying the photoresist liquid 50, an outlet 107 for discharging, and a photoresist liquid inlet area 10.
8.

The working piece 103 is provided on the diaphragm film 102.
a, a conical coil spring 103 for applying an urging force to the center of the diaphragm film 102 through the center of the diaphragm film 102 is provided.
The urging force is always applied in the direction in which the volume of the photoresist liquid 8 increases, that is, in the direction in which the photoresist liquid 50 is drawn into the photoresist dripping nozzle 69. Diaphragm film 10
2 is a photoresist seal O-ring 104 and an air seal O
With the ring 105, the photoresist liquid drawing unit 100,
A seal is fixed to the diaphragm film drive control chamber 101.

The diaphragm film drive control chamber 101 is provided with a drive pressure control air port 109 for pneumatically controlling the diaphragm film 102.

The non-sliding suck-back valve is not limited to the configuration illustrated in FIG. 4, but may be a direct diaphragm film-driven non-sliding suck-back valve 68A as shown in FIG. Good, that is, the non-sliding suck-back valve 68A has the same basic structure as the non-sliding suck-back valve 68 combined with a spring shown in FIG. 4, but uses a diaphragm film 150 from which the coil spring 103 for returning the diaphragm film 102 is removed. The difference is that only the pressure acting on the diaphragm film drive control chamber 151 is controlled.

In each of the non-sliding suck back valves 68 and 68A, the diaphragm film drive control room is controlled by a high pressure air source 73 via an electropneumatic conversion regulator 71 and a vacuum source via a vacuum force control unit (not shown). 101, controls the pressurization and negative pressure suction of the diaphragm film drive control chamber 151;

On the other hand, the structure of the non-sliding on-off valve 67 shown in FIG. 5 will be described. The non-sliding on-off valve 67 combined with a spring includes a photoresist supply cut-off section 110, a valved diaphragm film drive control chamber 111, a valved diaphragm film. 112.

The diaphragm membrane with valve 112 is formed by a photoresist seal O-ring 113 and an air seal O-ring 114.
, Is fixed to the photoresist supply cutoff unit 110 and the diaphragm membrane drive control chamber 111 with a valve.

The photoresist supply shut-off section 110 comprises an inlet 115 for supplying the photoresist liquid 50, an outlet 116, and a valve seat 117. A driving pressure control air port 1 for air-driving the diaphragm membrane 112 with a valve is provided in the diaphragm membrane drive control chamber 111 with a valve.
18 and a coil spring 119 that applies an urging force in a direction to separate the valved diaphragm membrane 112 from the valve seat 117 via the action piece 119a.

The structure of the non-sliding on-off valve 67 is as follows.
The non-sliding on / off valve 6 of the direct diaphragm film drive type is not limited to the one illustrated in FIG.
7A may be used. This non-sliding on-off valve 67A of the direct diaphragm film driving type is constituted by only the diaphragm film 160 with the valve removed by removing the coil spring 103 of the non-sliding on-off valve 67 used together with the spring shown in FIG. The pressure acting on the chamber 161 is controlled by the pressing force and the vacuum force (negative pressure), and the diaphragm membrane 160 with a valve is controlled.
In that the opening and closing operation of the photoresist liquid supply is controlled.

Next, the operation of the photoresist supply device will be described with reference to FIG. Photoresist liquid supply condition information 75 such as the viscosity, supply amount, supply time (supply speed = supply amount / supply time), suck back amount, suck back time (suck back speed = suck back amount / suck back time) of the photoresist liquid; The configuration control element correction information 76 such as the filter pressure loss, the pressure loss of the supply system, and the operation time constant of the constructed non-sliding on-off valve 67 and the non-sliding suck-back valve 68 is set in the photoresist supply control unit 74 and started. Then, the photoresist liquid supply condition information 75 and the configuration control element correction information 7
6, the photoresist supply control unit 74 controls the operation timing and operation speed of each component control element, similarly to the embodiment shown in FIGS. The pressure value and the pressurization timing acting on the pressurized container 52 containing the internal volume variable type photoresist container 51 are optimally controlled through the pneumatic pressure control unit 72 and the electropneumatic conversion regulator 58, and the non-slidable on-off valve 67 is controlled. The pressurization value and pressurization timing for air-operated driving are optimally controlled via the pneumatic control unit 72 and the electropneumatic conversion regulator 70, and the pressurizing value and pressurization (negative) for air-operating the non-sliding suck back valve 68 Pressure) timing to pneumatic control unit 7
2. Optimum control is performed via the electropneumatic conversion regulator 71.

These integrated controls are performed by the photoresist supply control unit 74, and a constant-rate constant discharge 77 and a constant-rate suck-back 78 are performed from the photoresist drop nozzle 69.

As described above, in the case of this embodiment, the photoresist liquid 50 is indirectly pressurized in the interior volume variable type photoresist container 51 without directly contacting the pressurized fluid such as compressed air. As a result, both the non-sliding on-off valve 67 and the non-sliding suck-back valve 68 interposed in the middle are directly brought into contact with the control fluid such as compressed air. There is no. For this reason, inconveniences such as gas infiltration into the photoresist liquid 50 and mixing of bubbles are reliably prevented.

Further, since the non-sliding on-off valve 67 and the non-sliding suck-back valve 68 have a structure which operates by deformation of the diaphragm film, as is apparent from the above description, there is no sliding portion. Responsiveness to the application of fluid pressure or negative pressure is quicker and more reliable than a structure having a normal cylinder-piston type operation principle, and the supply / cutoff operation of the photoresist liquid 50 by the photoresist supply control unit 74 and In addition, the suck-back operation can be performed quickly and precisely.

In the above description, the invention made mainly by the present inventor has been described with respect to a semiconductor wafer processing apparatus, which is a field of application as the background, but the invention is not limited to this. -48160, a resin coating device described in JP-A-57-177365, a frit glass coating device for a color blank tube described in JP-A-57-177365,
-177,570 multi-potting apparatus described,
In addition to dispensers for bonding electronic components described in Japanese Patent Application Laid-Open No. 60-95977, high-purity, high-precision, constant-rate, constant-rate fluids are supplied in chemical, chemical, biotechnology-related, and optical industries. It is effective when applied to a processing device.

[0085]

The effects obtained by typical ones of the inventions disclosed in the present application will be described below.

(1) In the present invention, input information on constant-rate constant supply such as viscosity of a fluid, supply speed (or supply time), supply amount, etc. and suck back speed (or suck back time), suck back amount, etc. By inputting the input information on the constant-speed constant-speed suckback to the main control unit, the main control unit executes the fluid supply function unit, which is configured in the fluid supply device,
Since the operation timing and operation speed of each fluid supply control element such as the fluid supply opening / closing valve function unit and the fluid dripping prevention function unit are optimally controlled, the fluid can be sucked back at a constant and constant speed.

(2) Since the operation timing and operation speed of the fluid supply opening / closing valve function unit and the fluid dripping prevention function unit can be optimally controlled, the phenomenon that the fluid jumps out of the dripping nozzle and stops, and the fluid dripping from the dripping nozzle. Phenomenon can be prevented. As a result, there is no problem that the tip of the dropping nozzle becomes dirty.

(3) Since the opening / closing speed of the fluid supply opening / closing valve function section can be optimally controlled, the fluid supply speed can be controlled with high accuracy, and the supply amount can also be controlled with high accuracy.

(4) Since the opening / closing speed of the fluid supply opening / closing valve function section can be optimally controlled, a predetermined speed change profile of the fluid supply initial speed and the fluid supply cutoff speed can be controlled.

(5) As the fluid supply means, the fluid storage container has a structure capable of being deformed by compression, and is pressurized from the outside of the fluid storage container. Since the fluid is pressurized and fed, it is possible to prevent bubbles from being generated when the fluid is sucked and sucked at a negative pressure.

Further, since the gas is not directly pressurized into the fluid, it is possible to prevent the gas from being dissolved into the fluid.

[0092] By these synergistic effects, it is possible to prevent bubbles from being generated in the fluid when the fluid is supplied.

(6) As a synergistic effect of the above items (1) and (2), the fluid can be supplied at a constant constant speed and sucked back at a constant constant speed in a clean state free of foreign matter and air bubbles. Becomes

(7) Automatically controlled by inputting input information relating to quantitative supply such as viscosity of the fluid, supply speed (or supply time), supply amount, etc.
Since the fluid can be supplied for a predetermined time, when switching and supplying various fluids having different viscosities of the fluid, the fluid can be supplied at a constant constant rate without adjusting each fluid supply control element. .

(8) As a photosensitive photoresist supply device used in a semiconductor wafer manufacturing apparatus, a liquid crystal manufacturing apparatus, or the like,
By applying the present invention, a photoresist can be supplied in a clean state without contaminants and air bubbles, so that a semiconductor element pattern or a liquid crystal pattern having no shape defect can be obtained. As a result, high quality semiconductor products and liquid crystal products can be manufactured.

(9) According to the present invention, a fluid such as a photoresist can be supplied at a required speed with high accuracy, and a required amount of a fluid can be sucked back at a required speed. , And a highly accurate film thickness can be obtained.

(10) By applying the present invention to a photoresist spin coating apparatus, the suck-back speed and the amount of suck-back can be accurately controlled at the time of photoresist dropping. Can be prevented.

As a result, in the photoresist solution dropped,
The foreign matter is not generated in the photoresist coating film without the adhering matter at the tip of the dropping nozzle being mixed, and the occurrence of coating unevenness is eliminated.

(11) Similarly, by applying the present invention to a photoresist spin coating apparatus, it is possible to supply a photoresist liquid at a required speed with high accuracy and high accuracy. Is eliminated, and the photoresist solution supply speed can be controlled with high precision, so that uneven coating due to entangled bubbles and a decrease in the accuracy of the applied film thickness can be eliminated.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating an example of a system configuration of a fluid supply device according to an embodiment of the present invention.

FIG. 2 is a diagram showing an example of the operation.

FIG. 3 is a schematic sectional view showing an example of the configuration of a photoresist coating apparatus according to another embodiment of the present invention.

FIG. 4 is a schematic sectional view showing an example of a non-sliding suck-back valve constituting a photoresist coating apparatus according to another embodiment of the present invention.

FIG. 5 is a schematic sectional view showing an example of a non-sliding on / off valve constituting a photoresist coating apparatus according to another embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view showing an example of a non-sliding suck back valve constituting a photoresist coating apparatus according to another embodiment of the present invention.

FIG. 7 is a schematic sectional view showing an example of a non-sliding on-off valve constituting a photoresist coating apparatus according to another embodiment of the present invention.

FIG. 8 is a conceptual diagram illustrating a problem of the related art.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Fluid 2 Fluid supply function part (fluid supply function control element) 3 Fluid supply opening / closing valve function part (fluid supply opening / closing valve control element) 4 Dropping nozzle (fluid supply nozzle) 5 Fixed amount constant speed drop 6 Fixed amount Constant speed suck back 7 Fluid dripping prevention function unit (fluid dripping prevention control element) 8 Component operation control unit (main control unit) 9 Fluid supply control condition information 10 Control correction value information 11 Fluid supply function unit operation control Signal 12 Fluid supply function unit operation state information 13 Fluid supply on-off valve operation control signal 14 Fluid supply on-off valve operation state information 15 Fluid dripping prevention function unit operation control signal 16 Fluid dripping prevention function unit operation state information 50 Photoresist Liquid (fluid) 51 Variable-volume type photoresist container (fluid storage container) 52 Pressurized container (pressurizing mechanism) 53 Filter 54 Filter storage container 55 Photore Dist container seal O-ring 56 Pressurized container seal O-ring 57 Clamp holder 58 Electro-pneumatic conversion regulator 59 Filter seal O-ring 60 Filter seal O-ring 61 Clamp holder 62 Cap 63 Air trap part 64 Air outlet 65 Air vent opening / closing valve 66 Photoresist outlet 67 Non-sliding on-off valve (fluid supply on-off valve control element) 67A Non-sliding on-off valve (fluid supply on-off valve control element) 68 Non-sliding suck-back valve (fluid dripping prevention control element) 68A No Sliding suck back valve (fluid dripping prevention control element) 69 Photoresist dripping nozzle 70 Electro-pneumatic conversion regulator 71 Electro-pneumatic conversion regulator 72 Pneumatic control unit 73 High-pressure air source 74 Photoresist supply control unit (main control unit) 75 Photoresist liquid supply Condition information 76 Configuration control element correction Information 77 Constant-quantity constant-rate discharge 78 Constant-quantity constant-speed suckback 100 Photoresist liquid draw-in unit 101 Diaphragm film drive control chamber 102 Diaphragm film (second diaphragm film) 103 Coil spring 103a Working piece 104 Photoresist seal O-ring 105 Air seal O-ring 106 Inlet 107 Outlet 108 Photoresist liquid draw-in area 109 Driving pressure control air port 110 Photoresist supply cutoff section 111 Valved diaphragm film drive control chamber 112 Valved diaphragm film (first diaphragm film) 113 Photoresist seal O-ring 114 Air seal O-ring 115 Inlet 116 Outlet 117 Valve seat 118 Drive pressure control air port 119 Coil spring 119a Working piece 150 Diaphragm film (second diaphragm) Ramumaku) 151 diaphragm membrane drive control chamber 160 valve with diaphragm membrane (first diaphragm membrane) with 161 valve diaphragm membrane drive control chamber

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/30-21/30 531 H01L 21/30 561-579 H01L 21/46 B01J 4/00-4 / 04 B05C 5/00-5/04 B05C 11/00-11/115

Claims (10)

(57) [Claims] 1. A resist liquid supply function section for supplying a stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. Is used to control the operation timing of switching from the supply stop state to the supply state of the resist liquid supply function unit to drop the photoresist liquid on the semiconductor wafer. The method of manufacturing a semiconductor device characterized by having a degree. 2. A resist liquid supply function section for supplying a stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and shutting off the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. Controlling the operation timing of switching the resist liquid supply on-off valve function unit from the closed state to the open state by using the method of dropping the photoresist liquid on the semiconductor wafer. The method of manufacturing a semiconductor device characterized by having and. 3. A resist liquid supply function section for supplying the stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. To control the operation timing of switching the resist liquid dripping prevention function part from the retracted state to the extruded state, so that the photoresist liquid is dropped on the semiconductor wafer. The method of manufacturing a semiconductor device characterized by a step of. 4. A resist liquid supply function unit for supplying a stored resist liquid, a resist liquid supply opening / closing valve function unit for supplying and shutting off the supplied resist liquid, a resist liquid dripping prevention function unit, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. The operation timing of switching from the supply stop state to the supply state of the resist liquid supply function section using the resist liquid supply opening / closing valve function section from the closed state to the open state Operation timing and controlling the operation timing of switching from the resist solution draws sagging prevention function unit status to the extrusion state, a method of manufacturing a semiconductor device characterized by a step of dropping a photoresist solution on the semiconductor wafer switches. 5. An operation timing for switching the resist liquid supply function unit from a supply stop state to a supply state, an operation timing for switching the resist liquid supply on / off valve function unit from a closed state to an open state, and the resist liquid dripping prevention function unit. operation timing of switching from the retracted state to the extrusion state, claim 4, wherein the sequential slow in this order
The manufacturing method of the semiconductor device described in the above. 6. A resist liquid supply function section for supplying a stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. The operation timing for switching the supply state from the supply stop state to the supply state and the operation type for switching from the supply state to the supply stop state using the Controls ring, a method of manufacturing a semiconductor device characterized by a step of dropping a photoresist solution on the semiconductor wafer. 7. A resist liquid supply function section for supplying a stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. The operation timing for switching the resist liquid supply on / off valve function unit from the closed state to the open state and the operation timing for switching from the open state to the closed state are controlled using And, a method of manufacturing a semiconductor device characterized by a step of dropping a photoresist solution on the semiconductor wafer. 8. A resist liquid supply function unit for supplying the stored resist liquid, a resist liquid supply opening / closing valve function unit for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function unit, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. The operation timing of switching the resist liquid dripping prevention function section from the retracted state to the pushed state and switching from the pushed state to the retracted state by using Controls work timing, a method of manufacturing a semiconductor device characterized by a step of dropping a photoresist solution on the semiconductor wafer. 9. A resist liquid supply function section for supplying a stored resist liquid, a resist liquid supply opening / closing valve function section for supplying and blocking the supplied resist liquid, a resist liquid dripping prevention function section, and each of these elements. A method for manufacturing a semiconductor device using a resist solution supply system having a component operation control unit for controlling the resist solution supply control information including a viscosity of the resist solution, a supply amount and a suck-back amount; Setting a pressure loss of a supply system for supplying a liquid and control correction value information including an operation time constant of each of the components in the component operation control unit; and the resist liquid supply control information and the control correction value information. The operation timing for switching the supply state from the supply stop state to the supply state and the operation type for switching from the supply state to the supply stop state using the Operating timing for switching the resist liquid supply on-off valve function unit from a closed state to an open state, operation timing for switching from an open state to a closed state, operation timing for switching the resist liquid dripping prevention function unit from a retracted state to an extruded state, and extrusion. Controlling the operation timing of switching from the state to the retracted state and dropping a photoresist liquid on the semiconductor wafer. 10. An operation timing for switching the resist liquid dripping prevention function section from an extruded state to a retracted state,
The operation timing for switching the resist liquid supply on / off valve function unit from the open state to the closed state and the operation timing for switching the resist liquid supply function unit from the supply state to the supply stop state are sequentially later in this order.
10. The method for manufacturing a semiconductor device according to item 9 .