JP3290296B2 - Multilayer printed wiring board and method of manufacturing the same - Google Patents
Multilayer printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP3290296B2 JP3290296B2 JP12332594A JP12332594A JP3290296B2 JP 3290296 B2 JP3290296 B2 JP 3290296B2 JP 12332594 A JP12332594 A JP 12332594A JP 12332594 A JP12332594 A JP 12332594A JP 3290296 B2 JP3290296 B2 JP 3290296B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- insulating layer
- wiring board
- conductor layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導体回路層と絶縁層と
を交互にビルドアップした多層プリント配線板におい
て、導体層との密着性に優れると共に、耐熱性に優れた
絶縁層を形成できる熱硬化性樹脂組成物を用いた多層プ
リント配線板及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board in which conductive circuit layers and insulating layers are alternately built up, whereby an insulating layer having excellent adhesion to a conductive layer and excellent heat resistance can be formed. the thermosetting resin composition to a multilayer printed wiring board and its manufacturing method was used.
【０００２】[0002]
【従来の技術】多層プリント配線板の製造方法として、
従来から、回路形成された複数の回路板を、接着絶縁層
としてプリプレグを介して積層プレスし、スルーホール
によって各層回路間を接続する方法が知られている（積
層プレス法）。しかしながら、積層プレス法では、生産
設備が大掛りとなりコストが高くなるうえ、外層にスル
ーホールめっきが入るため銅厚が厚くなり、ファインパ
ターンの形成が困難となる。このような問題点を克服す
るため、近年、導体層上に有機絶縁膜を交互にビルドア
ップしていく多層プリント配線板の開発が活発に進めら
れている（ビルドアップ法）。このビルドアップ法にお
いて、絶縁層上に導体層を形成するための方法として
は、一般に蒸着やスパッタリングなどの方法が用いられ
るが、生産性が悪く、コストが高いという欠点を有して
いる。2. Description of the Related Art As a method of manufacturing a multilayer printed wiring board,
2. Description of the Related Art Conventionally, there has been known a method in which a plurality of circuit boards on which circuits are formed are laminated and pressed via a prepreg as an adhesive insulating layer, and circuits in each layer are connected by through holes (lamination pressing method). However, in the lamination press method, the production equipment becomes large and the cost increases, and the thickness of the copper becomes large because through-hole plating is formed in the outer layer, so that it is difficult to form a fine pattern. In order to overcome such problems, in recent years, the development of a multilayer printed wiring board in which an organic insulating film is alternately built up on a conductor layer has been actively promoted (build-up method). In this build-up method, as a method for forming a conductor layer on an insulating layer, a method such as vapor deposition or sputtering is generally used, but has the disadvantages of low productivity and high cost.
【０００３】また他の方法としては、フルアディティブ
法において、絶縁基板上に形成した接着剤層を介して無
電解銅めっきにより導体層を形成する方法もある（特公
平４−６１１６号）。この方法においては、接着剤層に
対するめっき膜の密着力を改善するために、ゴム、フィ
ラー及び熱硬化性樹脂を主成分とした接着剤を用い、こ
れを絶縁基板に塗布して硬化させた後、クロム酸塩−硫
酸等により処理し、その後、その表面を湯洗することに
よって、フィラーが除かれた凹部と、熱硬化性樹脂が除
かれて露出したゴム粒子の凸部とが均一に形成された表
面構造とするものである。しかしながら、接着剤層内部
にゴム成分が残留するため、耐熱性や電気絶縁性等の特
性を低下させる原因となるという問題がある。As another method, there is a method in which a conductor layer is formed by electroless copper plating via an adhesive layer formed on an insulating substrate in a full additive method (Japanese Patent Publication No. 4-6116). In this method, in order to improve the adhesion of the plating film to the adhesive layer, an adhesive containing rubber, filler and thermosetting resin as main components is applied to an insulating substrate and cured. , Chromate-sulfuric acid, etc., and then the surface is washed with hot water to form uniformly the concave portions from which the filler has been removed and the convex portions of the rubber particles which have been removed by removing the thermosetting resin. Surface structure. However, there is a problem that since the rubber component remains inside the adhesive layer, the properties such as heat resistance and electric insulation are deteriorated.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、前記従来技
術の問題に鑑みてなされたもので、所定の回路パターン
の導体層と樹脂絶縁層とが交互にビルドアップされた多
層プリント配線板において、上記樹脂絶縁層として、ゴ
ム成分を必須成分として用いることなく、耐熱性と電気
絶縁性に優れたエポキシ樹脂で良好な接合が達成され、
樹脂絶縁層と導体層とが充分な密着強度で交互にビルド
アップされ、しかも樹脂絶縁層がプリント配線板に要求
される耐熱性、電気絶縁性等の諸特性に優れた多層プリ
ント配線板、並びに該多層プリント配線板を生産性良く
かつ安価に製造できる方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is directed to a multilayer printed wiring board in which conductor layers and resin insulation layers of a predetermined circuit pattern are alternately built up. As the resin insulating layer, without using a rubber component as an essential component, good bonding is achieved with an epoxy resin having excellent heat resistance and electrical insulation ,
A multilayer printed wiring board with resin insulation layers and conductor layers that are alternately built up with sufficient adhesion strength, and in which the resin insulation layer has excellent properties such as heat resistance and electrical insulation required for printed wiring boards, and It is an object of the present invention to provide a method capable of manufacturing the multilayer printed wiring board with good productivity and at low cost.
【０００５】[0005]
【課題を解決するための手段】前記目的を達成するため
に、本発明によれば、回路形成された配線板の導体層上
に樹脂絶縁層及び所定の回路パターンの導体層を順次形
成する多層プリント配線板の製造において、樹脂絶縁層
及び導体層の形成が、 （ａ）（Ａ）エポキシ樹脂と（Ｂ）エポキシ樹脂硬化剤
と、（Ｃ）粗化剤により分解もしくは溶解するフィラー
と、（Ｄ）有機溶剤とを必須成分として含有してなり、
上記（Ａ）エポキシ樹脂成分１００重量部中に、一方の
エポキシ樹脂よりも反応性の遅いゴム変性エポキシ樹脂
を３０〜８０重量部含有する熱硬化性樹脂組成物からな
る樹脂絶縁層をコーティングし、半硬化状態に加熱処理
する工程、 （ｂ）上記樹脂絶縁層の表面を粗化剤により処理するこ
とにより、凹凸状の粗化面を形成する工程、 （ｃ）上記樹脂絶縁層の粗化された表面に導体層を形成
する工程、及び （ｄ）二度目の加熱処理を行い、上記樹脂絶縁層を硬化
させる工程を含むことを特徴とする多層プリント配線板
の製造方法が提供される。この多層プリント配線板の製
造方法は、１つの具体的な態様においては、最外層の樹
脂絶縁層を形成した後、所定のスルーホール部を穴明け
し、上記樹脂絶縁層の表面及びスルーホール部を粗化剤
により処理して粗化面を形成した後、最外層の導体層を
形成する工程を含む。また好適には、上記樹脂絶縁層上
への導体層のコーティングを無電解めっき及び／又は電
解めっきにより行い、また、上記粗化剤としては酸化
剤、アルカリ及び有機溶剤の中から選ばれた少なくとも
１種が用いられる。In order to achieve the above object, according to the present invention, there is provided a multilayer circuit in which a resin insulating layer and a conductor layer having a predetermined circuit pattern are sequentially formed on a conductor layer of a circuit-formed wiring board. In the production of a printed wiring board, the formation of the resin insulating layer and the conductor layer is performed by: (A) an epoxy resin and (B) an epoxy resin curing agent; (C) a filler that is decomposed or dissolved by a roughening agent; D) containing an organic solvent as an essential component,
A resin insulating layer comprising a thermosetting resin composition containing 30 to 80 parts by weight of a rubber-modified epoxy resin having lower reactivity than one epoxy resin is coated in 100 parts by weight of the epoxy resin component (A), A step of heat-treating to a semi-cured state, (b) a step of forming a roughened surface with irregularities by treating the surface of the resin insulating layer with a roughening agent, and (c) roughening of the resin insulating layer. And (d) performing a second heat treatment to cure the resin insulating layer, thereby providing a method for manufacturing a multilayer printed wiring board. In one specific aspect, the method for manufacturing a multilayer printed wiring board includes, after forming an outermost resin insulating layer, forming a predetermined through-hole portion, and forming a surface of the resin insulating layer and a through-hole portion. After forming a roughened surface by treating with a roughening agent, and then forming an outermost conductor layer. Also preferably, the conductor layer is coated on the resin insulating layer by electroless plating and / or electrolytic plating, and the roughening agent is at least one selected from oxidizing agents, alkalis and organic solvents. One type is used.
【０００６】なお、前記（ａ）工程において、回路形成
された配線板の導体層上へ前記樹脂絶縁層をコーティン
グするに際して、例えばスクリーン印刷法を用いた場
合、一回のコーティングで所望の膜厚を得ることは困難
である。そのような場合、前記本発明に係る熱硬化性樹
脂組成物で複数回コーティングすることもできるし、あ
るいは導体層に対する密着性を有する通常のソルダーレ
ジストによって予め樹脂絶縁層を形成し、次いで本発明
に係る前記熱硬化性樹脂組成物をコーティングし、その
後に形成される導体層に対する接着剤層として働くよう
に構成することもできる。In the step (a), when the resin insulating layer is coated on the conductor layer of the wiring board on which a circuit is formed, for example, when a screen printing method is used, a desired film thickness is obtained by one coating. It is difficult to get. In such a case, the resin composition may be coated a plurality of times with the thermosetting resin composition according to the present invention, or a resin insulating layer may be formed in advance using a normal solder resist having adhesiveness to a conductor layer, and then the present invention The thermosetting resin composition according to the above may be coated so as to function as an adhesive layer for a conductor layer formed thereafter.
【０００７】上記のような方法により、回路形成された
配線板の導体層上に樹脂絶縁層及び所定の回路パターン
の導体層が順次形成されてなる多層プリント配線板にお
いて、上記樹脂絶縁層が、粗化剤により分解もしくは溶
解するフィラーが分散されており、かつゴム変性エポキ
シ樹脂を含有するエポキシ樹脂の硬化塗膜から成り、か
つその表面の導体層との界面が粗面化処理によって凹凸
状の粗化面に形成されており、上記導体層は該粗化面を
介して樹脂絶縁層と接合されてなる多層プリント配線板
を生産性良く製造することができる。According to the above method, in a multilayer printed wiring board in which a resin insulating layer and a conductor layer of a predetermined circuit pattern are sequentially formed on a conductor layer of a circuit board on which a circuit is formed, the resin insulating layer is The filler which is decomposed or dissolved by the roughening agent is dispersed, and consists of a cured coating of epoxy resin containing rubber-modified epoxy resin, and its surface and the interface with the conductor layer are roughened by roughening treatment. The multilayer printed wiring board formed on the roughened surface and bonded to the resin insulating layer via the roughened surface through the roughened surface can be manufactured with high productivity.
【０００８】[0008]
【発明の作用及び態様】本発明は、多層プリント配線板
の製造において、回路形成された配線板の導体層上に樹
脂絶縁層及び所定の回路パターンの導体層を交互にビル
ドアップするに当って、上記樹脂絶縁層として、（Ａ）
エポキシ樹脂と（Ｂ）エポキシ樹脂硬化剤と、（Ｃ）粗
化剤により分解もしくは溶解するフィラーと、（Ｄ）有
機溶剤とを必須成分とし、かつ、上記（Ａ）エポキシ樹
脂成分１００重量部中に、一方のエポキシ樹脂よりも反
応性の遅いゴム変性エポキシ樹脂を３０〜８０重量部含
有する熱硬化性樹脂組成物を用いることを最大の特徴と
している。すなわち、樹脂絶縁層の形成に用いられる熱
硬化性樹脂組成物が、反応性の遅いゴム変性エポキシ樹
脂を含有しているため、加熱硬化処理条件によって熱硬
化性樹脂組成物の硬化状態をコントロールし易くなり、
熱硬化性樹脂組成物のコーティング後の一度目の加熱処
理によって半硬化状態とした後、粗化剤、即ち酸化剤、
アルカリ水溶液、有機溶剤等により粗面化処理を行うこ
とにより、樹脂絶縁層表面の未硬化状態のエポキシ樹脂
が除去され、樹脂絶縁層表面に凹凸状の表面構造を形成
できる。特に、反応性の遅いゴム変性エポキシ樹脂と、
これよりも反応性の速いエポキシ樹脂を併用した場合に
は、さらに硬化状態のコントロールがし易くなり、ま
た、架橋密度の高い部分と低い部分を作り易いため、樹
脂絶縁層表面の粗面化状態がさらに良好になる。さら
に、本発明の樹脂絶縁層の形成に用いられる熱硬化性樹
脂組成物は、上記ゴム変性エポキシ樹脂に加えて、粗化
剤により分解もしくは溶解するフィラーを含有している
ため、樹脂絶縁層表面は、粗化剤による粗面化処理によ
って架橋密度の低い部分でのエポキシ樹脂の溶出によ
り、その部分に存在する無機フィラーもさらに粗化剤に
溶出もしくは分解し易くなり、樹脂絶縁層表面の凹凸形
状をより深くかつ大きくすることができる。The present invention relates to a method of manufacturing a multilayer printed wiring board by alternately building up a resin insulating layer and a conductor layer of a predetermined circuit pattern on a conductor layer of a circuit-formed wiring board. (A)
An epoxy resin, (B) an epoxy resin curing agent, (C) a filler that is decomposed or dissolved by a roughening agent, and (D) an organic solvent as essential components, and in the above (A) 100 parts by weight of the epoxy resin component The greatest feature is that a thermosetting resin composition containing 30 to 80 parts by weight of a rubber-modified epoxy resin having lower reactivity than one epoxy resin is used. That is, since the thermosetting resin composition used for forming the resin insulating layer contains a rubber-modified epoxy resin having a low reactivity, the cured state of the thermosetting resin composition is controlled by the heat-curing conditions. Easier,
After a semi-cured state by the first heat treatment after coating of the thermosetting resin composition, a roughening agent, that is, an oxidizing agent,
By performing the surface roughening treatment with an alkaline aqueous solution, an organic solvent, or the like, the uncured epoxy resin on the surface of the resin insulating layer is removed, and an uneven surface structure can be formed on the surface of the resin insulating layer. In particular, rubber-modified epoxy resin with slow reactivity,
When an epoxy resin with higher reactivity than this is used together, it becomes easier to control the cured state, and it is easy to create high and low crosslink density parts, so the resin insulating layer surface roughened state Is further improved. Furthermore, since the thermosetting resin composition used for forming the resin insulating layer of the present invention contains a filler that is decomposed or dissolved by a roughening agent in addition to the rubber-modified epoxy resin, the resin insulating layer surface As a result of the elution of the epoxy resin at the low cross-linking density due to the surface roughening treatment with the roughening agent, the inorganic filler present at that portion is further easily eluted or decomposed into the roughening agent, and the unevenness of the resin insulating layer surface The shape can be deeper and larger.
【０００９】このように、本発明による多層プリント配
線板の製造においては、樹脂絶縁層の形成に用いられる
熱硬化性樹脂組成物に反応性の遅いゴム変性エポキシ樹
脂と粗化剤により分解もしくは溶解するフィラーを組み
合わせて含有せしめたことにより、粗化剤による粗面化
処理によって樹脂絶縁層表面に凹凸のある良好な粗化面
を容易に形成することができる。この樹脂絶縁層の凹凸
状粗化面は、その上に形成される導体層のアンカーとし
て働く。従って、この上に無電解めっきや電解めっき等
により導体層を形成した場合、樹脂絶縁層と導体層との
密着強度が向上し、密着性に優れた多層プリント配線板
を製造できる。さらに、無電解めっき等による導体層形
成後、樹脂絶縁層のガラス転移温度Ｔｇよりも高い温度
で加熱処理を行なうことにより、残留の未反応エポキシ
樹脂が硬化するため、また、応力緩和されるため、樹脂
絶縁層と導体層の密着強度は更に向上する。また、上記
樹脂絶縁層はフィラーが分散されたエポキシ樹脂の硬化
塗膜から形成されるため、耐熱性や電気絶縁性等に優れ
た多層プリント配線板が得られる。As described above, in the production of the multilayer printed wiring board according to the present invention, the thermosetting resin composition used for forming the resin insulating layer is decomposed or dissolved by the rubber-modified epoxy resin having low reactivity and the roughening agent. By incorporating the fillers in combination, it is possible to easily form a good roughened surface having irregularities on the surface of the resin insulating layer by the surface roughening treatment with the roughening agent. The roughened uneven surface of the resin insulating layer functions as an anchor for the conductor layer formed thereon. Therefore, when a conductor layer is formed thereon by electroless plating or electrolytic plating, the adhesion strength between the resin insulation layer and the conductor layer is improved, and a multilayer printed wiring board having excellent adhesion can be manufactured. Furthermore, after the conductor layer is formed by electroless plating or the like, by performing a heat treatment at a temperature higher than the glass transition temperature Tg of the resin insulating layer, the remaining unreacted epoxy resin is cured, and the stress is relaxed. In addition, the adhesion strength between the resin insulating layer and the conductor layer is further improved. Further, since the resin insulating layer is formed from a cured coating film of an epoxy resin in which a filler is dispersed, a multilayer printed wiring board excellent in heat resistance, electrical insulation, and the like can be obtained.
【００１０】上記ゴム変性エポキシ樹脂の具体例として
は、大日本インキ化学工業社製のエピクロンＴＳＲ−９
３０、ＴＳＲ−６０１、東都化成社製のエポトートＹＲ
−２０７、ＹＲ−４５０、ＹＲ−１０２等（何れも商品
名）のゴム変性エポキシ化合物が挙げられる。[0010] Specific examples of the rubber-modified epoxy resin include Epicron TSR-9 manufactured by Dainippon Ink and Chemicals, Inc.
30, TSR-601, Epototo YR manufactured by Toto Kasei Co., Ltd.
-207, YR-450, YR- 102 etc. rubber-modified epoxy compound (all trade names) are exemplified.
【００１１】また、上記ゴム変性エポキシ樹脂よりも反
応性の速いエポキシ樹脂の具体例としては、油化シェル
社製のエピコート８０７、８２８、大日本インキ化学工
業社製のエピクロン８４０、東都化成社製のエポトート
ＹＤ−１２８、ダウケミカル社製のＤ．Ｅ．Ｒ．３３
１、チバガイギー社製のアラルダイトＧＹ２６０、旭化
成工業社製のＡＥＲ３３１、住友化学工業社製のスミ−
エポキシＥＬＡ−１２８等（何れも商品名）のビスフェ
ノールＡ型エポキシ化合物や、油化シェル社製のエピコ
ート１５４、１８１、大日本インキ化学工業社製のエピ
クロンＮ−７４０、Ｎ−８６５、Ｎ−６６５、Ｎ−６９
５、東都化成社製のエポトートＹＤＰＮ−６３８、ＹＤ
ＣＮ−７０４、ダウケミカル社製のＤ．Ｅ．Ｎ．４３
１、Ｄ．Ｅ．Ｎ．４３８、チバガイギー社製のアラルダ
イトＥＰＮ１１３８、ＥＣＮ１２３５、ＥＣＮ１２９
９、日本化薬社製のＲＥ−３０６、ＥＰＰＮ−２０１、
ＥＯＣＮ−１０２０、ＥＯＣＮ−１０４Ｓ、旭化成工業
社製のＡＥＲ ＥＣＮ−２３５、ＥＣＮ−２９９、住友
化学工業社製のスミ−エポキシＥＳＣＮ−１９５Ｘ、Ｅ
ＳＣＮ−２２０等（何れも商品名）のノボラック型エポ
キシ化合物、あるいは大日本インキ化学工業社製のエピ
クロン８３０、東都化成社製のエポトートＹＤＦ−１７
０、チバガイギー社製のアラルダイトＸＰＹ３０６等
（何れも商品名）のビスフェノールＦ型エポキシ化合
物、油化シェル社製のＹＬ−９３３、ダウケミカル社製
のＴ．Ｅ．Ｎ．等（何れも商品名）のトリヒドロキシフ
ェニルメタン型エポキシ化合物、または油化シェル社製
のＹＸ−４０００、ＹＬ−６１２１等（何れも商品名）
のビフェニル型又はビキシレノール型のエポキシ化合
物、大日本インキ化学工業社製のＥＸＡ−１５１４（商
品名）のビスフェノールＳ型エポキシ化合物、東都化成
社製のエポトートＳＴ−３０００（商品名）等の水添ビ
スフェノールＡ型エポキシ化合物、油化シェル社製のエ
ピコートＥ１５７Ｓ（商品名）等のビスＡノボラック型
エポキシ化合物、油化シェル社製のエピコート６０４、
東都化成社製のエポトートＹＨ−４３４、チバガイギー
社製のアラルダイトＭＹ７２０、住友化学工業社製のス
ミ−エポキシＥＬＭ−１２０等（何れも商品名）のグリ
シジルアミン型エポキシ化合物や、油化シェル社製のエ
ピコートＹＬ−９３１、チバガイギー社製のアラルダイ
ト１６３等（何れも商品名）のテトラフェニロールエタ
ン型エポキシ化合物、あるいはチバガイギー社製のアラ
ルダイトＰＴ８１０、日産化学社製のＴＥＰＩＣ等（何
れも商品名）の複素環式エポキシ化合物、チバガイギー
社製のアラルダイトＣＹ３５０（商品名）等のヒダント
イン型エポキシ化合物、ダイセル化学工業社製のセロキ
サイド２０２１、チバガイギー社製のアラルダイトＣＹ
１７５、ＣＹ１７９等（何れも商品名）の脂環式エポキ
シ化合物等が挙げられる。Specific examples of the epoxy resin having a higher reactivity than the above rubber-modified epoxy resin include Epicoat 807 and 828 manufactured by Yuka Shell Co., Ltd., Epicron 840 manufactured by Dainippon Ink and Chemicals, and Toto Kasei Co., Ltd. Epotote YD-128 manufactured by Dow Chemical Company. E. FIG. R. 33
1. Araldite GY260 manufactured by Ciba-Geigy, AER331 manufactured by Asahi Kasei, Sumitomo Chemical Co., Ltd.
Bisphenol A type epoxy compounds such as epoxy ELA-128 (all of which are trade names), Epicoats 154 and 181 manufactured by Yuka Shell Co., and Epicron N-740, N-865 and N-665 manufactured by Dainippon Ink and Chemicals, Inc. , N-69
5. Epototo YDPN-638, YD manufactured by Toto Kasei Co., Ltd.
CN-704, D.C. E. FIG. N. 43
1, D. E. FIG. N. 438, Araldite EPN1138, ECN1235, ECN129 manufactured by Ciba-Geigy
9, Nippon Kayaku's RE-306, EPPN-201,
EOCN-1020, EOCN-104S, AER ECN-235 and ECN-299 manufactured by Asahi Kasei Corporation, Sumi-Epoxy ESCN-195X manufactured by Sumitomo Chemical Co., Ltd., E
Novolak type epoxy compounds such as SCN-220 (all trade names), Epicron 830 manufactured by Dainippon Ink and Chemicals, Epototo YDF-17 manufactured by Toto Kasei
Bisphenol F epoxy compound such as Araldite XPY306 manufactured by Ciba-Geigy (all trade names); YL-933 manufactured by Yuka Shell Co .; E. FIG. N. (All trade names), YX-4000, YL-6121 manufactured by Yuka Shell Co., Ltd. (all trade names)
Hydrogenation, such as a biphenyl type or bixylenol type epoxy compound, a bisphenol S type epoxy compound of EXA-1514 (trade name) manufactured by Dainippon Ink and Chemicals, an Epototo ST-3000 (trade name) manufactured by Toto Kasei Co., Ltd. Bisphenol A type epoxy compounds, Bis A novolak type epoxy compounds such as Epicoat E157S (trade name) manufactured by Yuka Shell, Epicoat 604 manufactured by Yuka Shell,
Glycidylamine-type epoxy compounds such as Epototo YH-434 manufactured by Toto Kasei, Araldite MY720 manufactured by Ciba-Geigy, Sumi-Epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. Tetraphenylolethane-type epoxy compounds such as Epicoat YL-931, Araldite 163 manufactured by Ciba-Geigy (all trade names), or complex of Araldite PT810 manufactured by Ciba-Geigy, TEPIC manufactured by Nissan Chemical Co. (all trade names) Cyclic epoxy compound, hydantoin type epoxy compound such as Araldite CY350 (trade name) manufactured by Ciba-Geigy, celloxide 2021 manufactured by Daicel Chemical Industries, Araldite CY manufactured by Ciba-Geigy
And alicyclic epoxy compounds such as 175 and CY179 (both are trade names).
【００１２】本発明の熱硬化性樹脂組成物においては、
エポキシ樹脂成分として前記反応性の遅いゴム変性エポ
キシ樹脂を単独で用いてもよいが、前記反応性の速いエ
ポキシ樹脂と併用してもよい。いずれにしても、ゴム変
性エポキシ樹脂は、使用するエポキシ樹脂成分１００重
量部中、３０重量部以上、好ましくは５０〜８０重量部
含有されることが必要である。ゴム変性エポキシ樹脂
が、使用するエポキシ樹脂成分１００重量部中に３０重
量部未満の割合で含有される場合、一度目の加熱処理の
後の未硬化状態のエポキシ樹脂の量が少なく、粗化剤に
より粗面化処理を行っても、除去される表層部の未硬化
状態のエポキシ樹脂が少なく、樹脂絶縁層の表面に、そ
の上に形成される導体層のアンカーとして充分に働く凹
凸状の表面構造を形成し難くなるので好ましくない。な
お、上記の未硬化状態とは、一部硬化した状態のものも
含む。In the thermosetting resin composition of the present invention,
As the epoxy resin component, the slow-reactive rubber-modified epoxy resin may be used alone, or may be used in combination with the fast-reactive epoxy resin. In any case, the rubber-modified epoxy resin must be contained in an amount of 30 parts by weight or more, preferably 50 to 80 parts by weight, per 100 parts by weight of the epoxy resin component used. When the rubber-modified epoxy resin is contained in a proportion of less than 30 parts by weight in 100 parts by weight of the epoxy resin component used, the amount of the uncured epoxy resin after the first heat treatment is small, and the roughening agent is used. Even if the surface is roughened, the uncured epoxy resin in the surface layer removed is small, and the surface of the resin insulation layer has a rough surface that acts as an anchor for the conductor layer formed on it. It is not preferable because it is difficult to form a structure. The uncured state includes a partially cured state.
【００１３】本発明の熱硬化性樹脂組成物中に前記エポ
キシ樹脂と共に必須成分として用いられるエポキシ樹脂
硬化剤としては、アミン類、酸無水物、アミノポリアミ
ド樹脂、ポリスルフィド樹脂、三弗化ホウ素アミンコン
プレックス、ノボラック樹脂、ジシアンジアミド、酸ヒ
ドラジド、カルボキシル基含有化合物などを挙げること
ができる。The epoxy resin curing agent used as an essential component together with the epoxy resin in the thermosetting resin composition of the present invention includes amines, acid anhydrides, aminopolyamide resins, polysulfide resins, and boron trifluoride amine complex. , Novolak resins, dicyandiamide, acid hydrazide, carboxyl group-containing compounds, and the like.
【００１４】上記エポキシ樹脂硬化剤の具体例として
は、ジエチレントリアミン、トリエチレンテトラミン、
イソホロンジアミン、メタキシリレンジアミン、メタフ
ェニレンジアミン、パラフェニレンジアミン、４，４′
−ジアミノジフェニルメタン、４，４′−ジアミノジフ
ェニルスルホン、４，４′−ジアミノジフェニエーテ
ル、アニリン−ホルマリン樹脂などのアミン類、無水フ
タル酸、無水ヘキサヒドロフタル酸、ナジック酸無水
物、メチルナジック酸無水物、トリメリット酸無水物、
ピロメリット酸無水物、ベンゾフェノンテトラカルボン
酸無水物などの酸無水物、ダイマー酸とジエチレントリ
アミン、トリエチレンテトラミン等との縮合物であるア
ミノポリアミド樹脂、メルカプタン基を末端に持つポリ
スルフィド樹脂、三弗化ホウ素とアニリン、ベンジルア
ミン、エチルアミンなどとの三弗化ホウ素アミンコンプ
レックス、フェノール、クレゾール、キシレノール、レ
ゾルシンなどとホルマリンの縮合反応により得られるノ
ボラック樹脂、ジシアンジアミド、アジピン酸ジヒドラ
ジド、セバシン酸ヒドラジド等の潜在性硬化剤を含む。
その他、カルボキシル基含有化合物、例えばジョンソン
ポリマー社製のジョンクリル−６８などの（メタ）アク
リル酸共重合物等も用いることができる。Specific examples of the epoxy resin curing agent include diethylene triamine, triethylene tetramine,
Isophoronediamine, metaxylylenediamine, metaphenylenediamine, paraphenylenediamine, 4,4 '
Amines such as diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylether, aniline-formalin resin, phthalic anhydride, hexahydrophthalic anhydride, nadic anhydride, methylnadic acid Anhydride, trimellitic anhydride,
Acid anhydrides such as pyromellitic anhydride and benzophenonetetracarboxylic anhydride, aminopolyamide resins which are condensates of dimer acid with diethylenetriamine, triethylenetetramine, etc., polysulfide resins having mercaptan groups at the ends, boron trifluoride Curing of boron trifluoride amine with aniline, benzylamine, ethylamine, etc., novolak resin obtained by condensation reaction of phenol, cresol, xylenol, resorcin, etc. with formalin, dicyandiamide, adipic dihydrazide, sebacic hydrazide, etc. Agent.
In addition, a carboxyl group-containing compound, for example, a (meth) acrylic acid copolymer such as Johnsonacryl-68 manufactured by Johnson Polymer, or the like can be used.
【００１５】本発明の熱硬化性樹脂組成物に用いられる
これらエポキシ樹脂硬化剤の使用量は、アミン類、ポリ
アミド樹脂、ポリスルフィド樹脂、三弗化ホウ素アミン
コンプレックス、ノボラック樹脂等の場合においては、
当該エポキシ樹脂成分中のエポキシ基量に対して、これ
ら硬化剤中の活性水素量が０．５〜１．５当量、好まし
くは０．８〜１．２当量になるように、酸無水物の場合
においては当該エポキシ樹脂成分中のエポキシ基量に対
して０．５〜１．０無水酸当量、好ましくは０．７〜
０．９当量になるように、また、ジシアンジアミドの場
合においては活性水素量が０．３〜０．７当量が好まし
い。The amount of the epoxy resin curing agent used in the thermosetting resin composition of the present invention may be, for example, amines, polyamide resins, polysulfide resins, boron trifluoride amine complexes, and novolak resins.
The amount of the acid anhydride is such that the amount of active hydrogen in these curing agents is 0.5 to 1.5 equivalents, preferably 0.8 to 1.2 equivalents, based on the amount of epoxy groups in the epoxy resin component. In some cases, 0.5 to 1.0 acid equivalent, preferably 0.7 to 1.0 with respect to the amount of epoxy groups in the epoxy resin component.
The amount of active hydrogen is preferably from 0.3 to 0.7 equivalent so as to be 0.9 equivalent, and in the case of dicyandiamide.
【００１６】本発明の熱硬化性樹脂組成物においては、
必要に応じて硬化促進剤を用いることができる。硬化促
進剤の具体例としては、トリエチルアミン、トリブチル
アミン、ジメチルベンジルアミン、ジエチルベンジルア
ミン、４−（ジメチルアミノ）−Ｎ，Ｎ−ジメチルベン
ジルアミン、４−メトキシ−Ｎ，Ｎ−ジメチルベンジル
アミン、４−メチル−Ｎ，Ｎ−ジメチルベンジルアミン
などの第３級アミン、ベンジルトリメチルアンモニウム
クロライド、ベンジルトリエチルアンモニウムクロライ
ドなどの４級アンモニウム塩、トリエチルホスフィン、
トリフェニルホスフィンなどのホスフィン類、ｎ−ブチ
ルトリフェニルホスホニウムブロマイドなどのホスホニ
ウム塩、イミダゾール、２−メチルイミダゾール、２−
エチルイミダゾール、２−エチル−４−メチルイミダゾ
ール、２−フェニルイミダゾール、１−（２−シアノエ
チル）−２−エチル−４−メチルイミダゾールなどのイ
ミダゾール類又はこれらの有機酸塩類、アセトグアナミ
ン、ベンゾグアナミン等のグアナミン類を挙げることが
できる。これらの中で好ましい硬化促進剤はイミダゾー
ル類、ホスフィン類である。In the thermosetting resin composition of the present invention,
If necessary, a curing accelerator can be used. Specific examples of the curing accelerator include triethylamine, tributylamine, dimethylbenzylamine, diethylbenzylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine, Tertiary amines such as -methyl-N, N-dimethylbenzylamine, quaternary ammonium salts such as benzyltrimethylammonium chloride and benzyltriethylammonium chloride, triethylphosphine,
Phosphines such as triphenylphosphine; phosphonium salts such as n-butyltriphenylphosphonium bromide; imidazole; 2-methylimidazole;
Imidazoles such as ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole or organic acid salts thereof, acetoguanamine, benzoguanamine, etc. Guanamines can be mentioned. Among these, preferred curing accelerators are imidazoles and phosphines.
【００１７】また、本発明の熱硬化性樹脂組成物には必
要に応じてゴム成分を含有させることができ、それによ
って、粗面化処理後の塗膜の応力緩和剤として密着強度
を向上させることができる。ゴム成分の例としては、ポ
リブタジエンゴム（例えば出光興産社製Ｒ−４５ＨＴ
等）、ウレタン変性、マレイン化、エポキシ変性、（メ
タ）アクリロイル変性等の各種ポリブタジエンゴム誘導
体（例えばエポキシ変性の出光興産社製Ｒ−４５ＥＰＩ
等）、ニトリルゴム（例えばＪＳＲ社製のＮ２８０、Ｎ
２３０Ｓ等）、ＣＴＢＮ（例えば宇部興産社製の１３０
０−３１等）が挙げられる。Further, the thermosetting resin composition of the present invention can contain a rubber component, if necessary, thereby improving the adhesion strength as a stress relaxing agent for the coating film after the surface roughening treatment. be able to. Examples of the rubber component include polybutadiene rubber (for example, R-45HT manufactured by Idemitsu Kosan Co., Ltd.).
Polybutadiene rubber derivatives such as urethane-modified, maleated, epoxy-modified and (meth) acryloyl-modified (for example, epoxy-modified R-45EPI manufactured by Idemitsu Kosan Co., Ltd.)
Etc.), nitrile rubber (for example, N280, N
230S etc.), CTBN (for example, Ube Industries' 130
0-31).
【００１８】本発明の熱硬化性樹脂組成物においては、
前記した各成分と共に、粗化剤により分解もしくは溶解
するフィラーを組み合わせて用いる。それによって、前
記したように、粗面化処理による樹脂絶縁層表面の粗面
化が容易となり、かつその凹凸形状を深くすることがで
き、導体層との密着強度をさらに上げることができる。
ただし、エポキシ樹脂１００重量部に対し７０重量部以
上含有させると、内部にボイドとして残ったり、電気絶
縁性が悪くなるため、含有量としては７０重量部未満、
好ましくは５０重量部以下とする必要がある。上記フィ
ラーとしては、有機フィラー及び無機フィラーがあり、
有機フィラーとしては、粉体エポキシ樹脂（例えばＴＥ
ＰＩＣ等）、メラミン樹脂、ベンゾグアナミン樹脂（例
えば日本触媒社製Ｍ−３０、Ｓ、ＭＳ等）、尿素樹脂、
架橋アクリルポリマー（例えば綜研化学社製ＭＲ−２
Ｇ、ＭＲ−７Ｇ等、積水化成品社製テクポリマー）など
が挙げられ、一方、無機フィラーとしては、酸化マグネ
シウム、炭酸カルシウム、珪酸ジルコニウム、酸化ジル
コニウム、珪酸カルシウム、水酸化カルシウム、シリカ
などが挙げられるが、特に炭酸カルシウムが好ましい。In the thermosetting resin composition of the present invention,
A filler that is decomposed or dissolved by a roughening agent is used in combination with the above-described components. Thereby, as described above, the surface of the resin insulating layer can be easily roughened by the surface roughening treatment, the unevenness can be made deeper, and the adhesion strength to the conductor layer can be further increased.
However, if it is contained in an amount of 70 parts by weight or more with respect to 100 parts by weight of the epoxy resin, it remains as a void in the inside or the electric insulation property deteriorates.
Preferably, it is required to be 50 parts by weight or less. As the filler, there are organic fillers and inorganic fillers,
As the organic filler, powder epoxy resin (for example, TE
PIC), melamine resin, benzoguanamine resin (for example, M-30, S, MS, etc., manufactured by Nippon Shokubai Co., Ltd.), urea resin,
Crosslinked acrylic polymer (for example, MR-2 manufactured by Soken Chemical Co., Ltd.)
G, MR-7G, etc., Techpolymer manufactured by Sekisui Plastics Co., Ltd., etc., while the inorganic fillers include magnesium oxide, calcium carbonate, zirconium silicate, zirconium oxide, calcium silicate, calcium hydroxide, silica and the like. However, calcium carbonate is particularly preferred.
【００１９】本発明の熱硬化性樹脂組成物は、有機溶剤
を用いてコーティング方法に適した粘度に調整する。代
表的な有機溶剤としては、メチルエチルケトン、シクロ
ヘキサン等のケトン類、トルエン、キシレン等の芳香族
炭化水素、セロソルブ、ブチルセロソルブ等のセロソル
ブ類、カルビトール、ブチルカルビトール等のカルビト
ール類、酢酸エチル、酢酸ブチル、セロソルブアセテー
ト、ブチルセロソルブアセテート、カルビトールアセテ
ート、ブチルカルビトールアセテート等の酢酸エステル
類などがあり、これらは一種または二種以上の混合物と
して用いることができる。The viscosity of the thermosetting resin composition of the present invention is adjusted to a level suitable for a coating method using an organic solvent. Representative organic solvents include ketones such as methyl ethyl ketone and cyclohexane, aromatic hydrocarbons such as toluene and xylene, cellosolves such as cellosolve and butyl cellosolve, carbitols such as carbitol and butyl carbitol, ethyl acetate, and acetic acid. There are acetates such as butyl, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate and the like, and these can be used alone or as a mixture of two or more.
【００２０】さらに本発明の熱硬化性樹脂組成物には、
所望の物性に応じて硫酸バリウム、硫化珪素、タルク、
クレー、ベントナイト、カオリン、ガラス繊維、炭素繊
維、雲母、石綿、金属粉等の公知・慣用の充填剤、フタ
ロシアニンブルー、フタロシアニングリーン、酸化チタ
ン、カーボンブラック等の公知・慣用の着色用顔料、消
泡剤、密着性付与剤またはレベリング剤などの各種添加
剤を添加してもよい。Further, the thermosetting resin composition of the present invention includes:
Barium sulfate, silicon sulfide, talc, depending on the desired physical properties
Known and common fillers such as clay, bentonite, kaolin, glass fiber, carbon fiber, mica, asbestos, metal powder, and known and common coloring pigments such as phthalocyanine blue, phthalocyanine green, titanium oxide, and carbon black, defoaming Various additives such as an agent, an adhesion promoter or a leveling agent may be added.
【００２１】本発明の多層プリント配線板の製造におい
ては、まず、前記した成分を含有する熱硬化性樹脂組成
物を、回路形成された配線板の導体層の上にスクリーン
印刷法やスプレーコーティング法、カーテンコーティン
グ法等公知の方法を用いてコーティングする。コーティ
ング方法によっては一回のコーティングで所望の膜厚の
塗膜が得られない場合があるが、その場合は複数回コー
ティングを行う。複数回コーティングを行う場合は、本
発明の熱硬化性樹脂組成物のみを用いて行ってもよく、
あるいは下塗りに銅との密着性の良好な他の熱硬化性樹
脂組成物をコーティングし、その後、最上層のコーティ
ングに本発明の熱硬化性樹脂組成物を用いるようにして
もよい。このようにして所望の膜厚の樹脂絶縁層をコー
ティングした後、一度目の加熱処理を行い、半硬化状態
とする。その後、必要に応じて所定のスルーホール部等
の穴明けを行った後、酸化剤、アルカリ水溶液、有機溶
剤等の粗化剤により粗面化処理を行い、樹脂絶縁層の表
面及びスルーホール部に凹凸状の良好な粗化面を形成す
る。次いで、このように粗面化された樹脂絶縁層表面に
無電解めっき、電解めっき等により導体層を被覆した
後、二度目の加熱処理を行い、上記樹脂絶縁層の架橋密
度を上げると共に応力緩和を行う。その後、常法に従っ
て、樹脂絶縁層表面の導体層に所定の回路パターンを形
成し、回路形成された導体層を形成する。また、このよ
うな操作を所望に応じて順次繰り返し、樹脂絶縁層及び
所定の回路パターンの導体層を交互にビルドアップして
形成することもできる。但し、スルーホール部の穴明け
は、最外層の樹脂絶縁層の形成後に行う。In the production of the multilayer printed wiring board of the present invention, first, a thermosetting resin composition containing the above-mentioned components is screen-printed or spray-coated on a conductor layer of a circuit-formed wiring board. Coating is performed using a known method such as a curtain coating method. Depending on the coating method, a coating film having a desired film thickness may not be obtained by a single coating. In such a case, the coating is performed a plurality of times. When performing coating a plurality of times, it may be performed using only the thermosetting resin composition of the present invention,
Alternatively, the undercoat may be coated with another thermosetting resin composition having good adhesion to copper, and then the thermosetting resin composition of the present invention may be used for coating the uppermost layer. After the resin insulating layer having a desired film thickness is coated in this manner, the first heat treatment is performed to obtain a semi-cured state. Thereafter, if necessary, a predetermined through-hole portion or the like is drilled, and then a surface roughening treatment is performed with a roughening agent such as an oxidizing agent, an aqueous alkali solution, or an organic solvent, and the surface of the resin insulating layer and the through-hole portion are formed. A good roughened surface with irregularities is formed. Next, after the conductor layer is coated on the surface of the resin insulating layer thus roughened by electroless plating, electrolytic plating, or the like, a second heat treatment is performed to increase the cross-linking density of the resin insulating layer and relax the stress. I do. Thereafter, a predetermined circuit pattern is formed on the conductor layer on the surface of the resin insulating layer according to a conventional method to form a conductor layer on which a circuit is formed. In addition, such an operation can be sequentially repeated as desired, and the resin insulating layer and the conductor layer having a predetermined circuit pattern can be alternately built up to form a layer. However, drilling of the through-hole portion is performed after forming the outermost resin insulating layer.
【００２２】上記のような多層プリント配線板の製造方
法において、樹脂絶縁層形成から粗面化までの間の一度
目の加熱処理の温度Ｔ1は、硬化性樹脂組成物の処方に
よっても影響を受けるが、一般に１１０〜１７０℃の範
囲であり、また導体層めっき後の二度目の加熱処理の温
度Ｔ2は一度目の加熱処理の温度Ｔ1よりも高くし、好ま
しくは樹脂絶縁層のガラス転移温度Ｔｇよりも高くす
る。なお、一度目の加熱処理条件は、温度Ｔ1が１２０
℃の時３０〜９０分、１７０℃の時５〜２０分程度が適
当であり、好ましくは１３０℃〜１６０℃で１５〜６０
分である。温度Ｔ1が１１０℃未満では樹脂絶縁層の硬
化が不十分となり、例えばスルーホールを形成しようと
した場合に、ドリリング性（スミア、キズ）または金型
を用いたパンチング孔開時のキズ等の問題が生じるので
好ましくない。また、温度Ｔ1が１７０℃よりも高くな
ると、エポキシ樹脂の硬化反応が短時間で進むため硬化
状態を制御できず、未硬化状態のエポキシ樹脂を残留さ
せ、樹脂絶縁層を半硬化状態とすることが困難となるの
で好ましくない。なお、プリント配線板に使用する基板
の材料の種類にもよるが、基板の収縮、反りを考慮する
と温度Ｔ1の上限は１７０℃である。In the method for manufacturing a multilayer printed wiring board as described above, the temperature T 1 of the first heat treatment from the formation of the resin insulating layer to the roughening is affected by the formulation of the curable resin composition. However, the temperature is generally in the range of 110 to 170 ° C., and the temperature T 2 of the second heat treatment after the plating of the conductor layer is higher than the temperature T 1 of the first heat treatment, and the glass of the resin insulation layer is preferably used. It is made higher than the transition temperature Tg. Note that the first heat treatment condition is that the temperature T 1 is 120
30 to 90 minutes at 170 ° C and 5 to 20 minutes at 170 ° C, preferably 15 to 60 minutes at 130 to 160 ° C.
Minutes. At a temperature T 1 is lower than 110 ° C. becomes insufficient curing of the resin insulating layer, for example, when forming a through-hole, drilling resistance (smear, scratch) or mold scratches etc. during punching holes opened using It is not preferable because it causes a problem. If the temperature T 1 is higher than 170 ° C., the curing reaction of the epoxy resin proceeds in a short time, so that the curing state cannot be controlled, the uncured epoxy resin remains, and the resin insulating layer is brought into a semi-cured state. It is not preferable because it becomes difficult. Incidentally, depending on the kind of material of the substrate used for a printed wiring board, the contraction of the substrate, the upper limit of the consideration warping and temperatures T 1 is 170 ° C..
【００２３】[0023]
【実施例】以下、本発明を適用した実施例について図面
を参照しながら詳細に説明する。まず、本発明の多層プ
リント配線板の製造方法により製造される多層プリント
配線板の構造の一例について説明する。多層プリント配
線板は、図１に示すように、積層基板Ａの上面に第１の
樹脂絶縁層２を介して所定の回路パターンを有する第１
の導体層１が形成され、積層基板Ａの下面に第２の樹脂
絶縁層１０を介して所定の回路パターンを有する第６の
導体層１１が形成されたものである。上記積層基板Ａ
は、３枚の基板４、６、８が順次積層されて接合された
ものであり、基板４の基板６との接合面と反対側の面に
は所定の回路パターンを有する第２の導体層３が、基板
４と基板６との間には所定の回路パターンを有する第３
の導体層５が、基板６と基板８との間には所定の回路パ
ターンを有する第４の導体層７が、そして基板８の基板
６との接合面と反対側の面には所定の回路パターンを有
する第５の導体層９がそれぞれ形成されており、上記積
層基板Ａは、合計４層の導体層を有する積層基板とされ
ている。Embodiments of the present invention will be described below in detail with reference to the drawings. First, an example of the structure of a multilayer printed wiring board manufactured by the method for manufacturing a multilayer printed wiring board of the present invention will be described. As shown in FIG. 1, the multilayer printed wiring board has a first circuit pattern having a predetermined circuit pattern on a top surface of a laminated substrate A via a first resin insulating layer 2.
And a sixth conductive layer 11 having a predetermined circuit pattern is formed on the lower surface of the laminated substrate A via a second resin insulating layer 10. The above laminated substrate A
Is a second conductor layer having a predetermined circuit pattern on a surface of the substrate 4 opposite to a surface where the substrate 4 is bonded to the substrate 6. 3 has a third circuit pattern between the substrate 4 and the substrate 6 having a predetermined circuit pattern.
A conductive layer 5 having a predetermined circuit pattern between the substrate 6 and the substrate 8, and a predetermined circuit pattern on the surface of the substrate 8 opposite to the bonding surface with the substrate 6. A fifth conductor layer 9 having a pattern is formed, and the laminated substrate A is a laminated substrate having a total of four conductor layers.
【００２４】また、上記多層プリント配線板には、第１
の導体層１のコネクション部１ａと第４の導体層７のコ
ネクション部７ａと第６の導体層１１のコネクション部
１１ａとを電気的に接続するスルーホール２０が設けら
れている。上記スルーホール２０は、第１の樹脂絶縁層
２、積層基板Ａ及び第２の樹脂絶縁層１０を貫通し、ま
た第１の導体層１のコネクション部１ａから第６の導体
層１１のコネクション部１１ａまで各コネクション部１
ａ、７ａ、１１ａの中央部を貫通するように設けられた
孔部であり、孔部の周壁にも導電材料が配され、各コネ
クション部１ａ、７ａ、１１ａを電気的に接続してい
る。なお、上記多層プリント配線板には、第１の導体層
１と第２の導体層３のコネクション部間、第６の導体層
１１と第５の導体層９のコネクション部間を電気的に接
続するブラインドバイアホールが設けられており、これ
らブラインドバイアホールも上記スルーホール２０と略
同様の構造で各コネクション部間の電気的接続を図るも
のであるが、その図示は省略する。このようなブライン
ドバイアホールは、レーザー光、サンドブラストなど従
来公知の通常の方法で開けることができ、特定の方法に
限定されるものではない。The multilayer printed wiring board has a first
There is provided a through hole 20 for electrically connecting the connection part 1a of the conductor layer 1 to the connection part 7a of the fourth conductor layer 7 and the connection part 11a of the sixth conductor layer 11. The through hole 20 penetrates through the first resin insulation layer 2, the laminated substrate A and the second resin insulation layer 10, and extends from the connection part 1 a of the first conductor layer 1 to the connection part of the sixth conductor layer 11. Each connection part 1 to 11a
The holes are provided so as to penetrate the central portions of the holes a, 7a, and 11a, and a conductive material is also disposed on the peripheral wall of the holes to electrically connect the connection portions 1a, 7a, and 11a. Note that the multilayer printed wiring board is electrically connected between connection portions between the first conductor layer 1 and the second conductor layer 3 and between connection portions between the sixth conductor layer 11 and the fifth conductor layer 9. Blind via holes are provided. These blind via holes have the same structure as that of the through hole 20 to achieve electrical connection between the connection portions, but are not shown. Such a blind via hole can be opened by a conventionally known ordinary method such as laser light or sand blast, and is not limited to a specific method.
【００２５】次に、本発明を上記積層基板Ａに適用する
場合の方法について説明する。積層基板Ａの両面に銅箔
によって形成した所定の回路パターンを有する第２及び
第５の導体層３、９の上に、スクリーン印刷法やスプレ
ーコーティング法、カーテンコーティング法等の適当な
方法により本発明の硬化性樹脂組成物を塗布し、樹脂絶
縁層２、１０を形成する。続いて、一度目の加熱処理を
行い、このときの温度、時間条件を制御することにより
樹脂絶縁層２、１０を半硬化状態とする。ここでいう半
硬化状態とは、樹脂絶縁層２、１０を後工程においてド
リリングできる程度の硬化状態から後工程の粗面化によ
って十分な凹凸が得られる範囲の硬化状態を指す。な
お、この際の加熱温度、時間の条件は前述の通りであ
る。本実施例においては、樹脂絶縁層２、１０を構成す
る熱硬化性樹脂組成物として、上記のように少なくとも
反応性の遅いゴム変性エポキシ樹脂を含有するものを使
用していることから、一度目の加熱処理後、樹脂絶縁層
２、１０の中に未硬化状態の反応性の遅いエポキシ樹脂
が残るために、上記樹脂絶縁層２、１０は半硬化状態と
なる。さらに、熱硬化性樹脂組成物にゴム変性エポキシ
樹脂よりも反応性の速いエポキシ樹脂を含有する場合に
は、エポキシ樹脂の反応性の差から硬化の比較的進んだ
部分と硬化の進んでいない部分を短時間で作り出すこと
ができ、半硬化状態が短時間で得られる。次いで、樹脂
絶縁層２、１０及び積層基板Ａを貫通するようなスルー
ホール孔２１を形成する。スルーホール孔２１はドリ
ル、金型パンチ、レーザー光など適当な手段によって形
成できる。Next, a method for applying the present invention to the laminated substrate A will be described. On the second and fifth conductor layers 3 and 9 having a predetermined circuit pattern formed of copper foil on both surfaces of the laminated substrate A, the present invention is applied by a suitable method such as a screen printing method, a spray coating method, and a curtain coating method. The curable resin composition of the present invention is applied to form the resin insulating layers 2 and 10. Subsequently, the first heat treatment is performed, and the temperature and time conditions at this time are controlled to bring the resin insulating layers 2 and 10 into a semi-cured state. Here, the semi-cured state refers to a cured state in a range from a cured state in which the resin insulating layers 2 and 10 can be drilled in a later step to a sufficient unevenness obtained by roughening in a later step. The conditions of the heating temperature and time at this time are as described above. In the present embodiment, since the thermosetting resin composition constituting the resin insulating layers 2 and 10 contains at least the rubber-modified epoxy resin having a low reactivity as described above, After the heat treatment, the uncured epoxy resin having a low reactivity remains in the resin insulating layers 2 and 10, so that the resin insulating layers 2 and 10 are in a semi-cured state. Further, when the thermosetting resin composition contains an epoxy resin having a higher reactivity than the rubber-modified epoxy resin, a relatively hardened portion and a less hardened portion due to a difference in reactivity of the epoxy resin. Can be produced in a short time, and a semi-cured state can be obtained in a short time. Next, through-hole holes 21 penetrating the resin insulating layers 2 and 10 and the laminated substrate A are formed. The through-hole 21 can be formed by a suitable means such as a drill, a mold punch, or a laser beam.
【００２６】その後、粗化剤を用いて各樹脂絶縁層２、
１０の粗面化を行う。上記粗化剤としては、過マンガン
酸カリウム、重クロム酸カリウム、オゾン、塩酸、硫
酸、硝酸、フッ化水素酸等の酸化剤、Ｎ−メチル−２−
ピロリドン、Ｎ，Ｎ−ジメチルホルムアミド、ジメチル
スルオキシド、メトキシプロパノール、ジメチルホルム
アミド（ＤＭＦ）等の有機溶剤、水酸化ナトリウム、水
酸化カリウム等のアルカリなどを用いることができる。
例えば、粗化剤として酸化剤を用いた場合、樹脂絶縁層
２、１０を上記のような有機溶剤で膨潤させた後、酸化
剤によって粗面化処理を行う。この粗面化処理によっ
て、樹脂絶縁層２、１０の表面及びスルーホール孔２１
に凹凸状の表面構造を容易に形成できる。After that, each of the resin insulating layers 2,
10 is roughened. Examples of the roughening agent include oxidizing agents such as potassium permanganate, potassium dichromate, ozone, hydrochloric acid, sulfuric acid, nitric acid, and hydrofluoric acid; N-methyl-2-
Organic solvents such as pyrrolidone, N, N-dimethylformamide, dimethylsulfoxide, methoxypropanol and dimethylformamide (DMF), and alkalis such as sodium hydroxide and potassium hydroxide can be used.
For example, when an oxidizing agent is used as a roughening agent, the resin insulating layers 2 and 10 are swelled with the organic solvent as described above, and then subjected to a surface roughening treatment with the oxidizing agent. By this surface roughening treatment, the surfaces of the resin insulating layers 2 and 10 and the through-hole holes 21 are formed.
An uneven surface structure can be easily formed.
【００２７】次に、樹脂絶縁層２、１０の表面に無電解
めっきや電解めっき、無電解めっきと電解めっきの組合
せ等により導体層を形成する。このとき導体層は、樹脂
絶縁層２、１０の表面だけでなく、スルーホール孔２１
やブラインド孔内の全面に被覆される。この後、樹脂絶
縁層２、１０を完全に硬化させて該樹脂絶縁層２、１０
と導体層１、１１との間の密着を更に強固なものとし、
実用に耐え得るものとする。すなわち、樹脂絶縁層２、
１０に残っている未硬化状態のエポキシ樹脂を二度目の
加熱処理により完全に硬化させ、樹脂絶縁層２、１０を
導体層１、１１との間の接着剤として機能させ、密着強
度を向上させる。上記加熱処理の温度Ｔ2としては、１
４０℃以上が好ましく、一度目の加熱処理の温度Ｔ1よ
りも高い温度であることがより好ましい。次いで、常法
に従って、樹脂絶縁層２、１０の表面の導体層１、１１
に所定の回路パターンを形成し、図１に示すように、所
定の回路パターンを有する第１の導体層１及び第６の導
体層１１を形成する。この時、上記のようにスルーホー
ル孔２１にもめっき層が形成されており、その結果、上
記多層プリント配線板の第１の導体層１のコネクション
部１ａと第４の導体層７のコネクション部７ａと第６の
導体層１１のコネクション部１１ａとの間は電気的に接
続されることになり、スルーホール２０が形成される。
なお、上記実施例においては、積層基板上に樹脂絶縁層
及び導体層を形成する例について説明したが、積層基板
の代わりに片面基板、あるいは両面基板を用いても同様
に本発明を適用できることは言うまでもない。Next, a conductor layer is formed on the surfaces of the resin insulating layers 2 and 10 by electroless plating, electrolytic plating, a combination of electroless plating and electrolytic plating, or the like. At this time, the conductor layer is formed not only on the surfaces of the resin insulating layers 2 and 10 but also on the through-hole holes 21.
And the entire surface inside the blind hole. Thereafter, the resin insulating layers 2 and 10 are completely cured, and the resin insulating layers 2 and 10 are completely cured.
And the contact between the conductor layers 1 and 11 is further strengthened.
It shall be able to withstand practical use. That is, the resin insulating layer 2,
The uncured epoxy resin remaining in 10 is completely cured by the second heat treatment, and the resin insulating layers 2 and 10 function as an adhesive between the conductor layers 1 and 11 to improve the adhesion strength. . The temperature T 2 of the heat treatment is 1
The temperature is preferably 40 ° C. or higher, more preferably a temperature higher than the temperature T 1 of the first heat treatment. Next, the conductor layers 1 and 11 on the surfaces of the resin insulation layers 2 and 10 are formed in a conventional manner.
Then, a first circuit layer 1 and a sixth conductor layer 11 having a predetermined circuit pattern are formed as shown in FIG. At this time, the plating layer is also formed in the through-hole 21 as described above. As a result, the connection portion 1a of the first conductor layer 1 and the connection portion of the fourth conductor layer 7 of the multilayer printed wiring board are formed. 7a and the connection portion 11a of the sixth conductor layer 11 are electrically connected, and a through hole 20 is formed.
In the above embodiment, the example in which the resin insulating layer and the conductor layer are formed on the laminated substrate has been described. However, the present invention can be similarly applied even when a single-sided substrate or a double-sided substrate is used instead of the laminated substrate. Needless to say.
【００２８】以下、本発明の効果を具体的に確認した実
施例及び比較例について述べる。 実施例１〜３及び比較例１〜３ 表１に示す配合（重量部）で硬化性樹脂組成物を調製し
た。各処方の硬化性樹脂組成物の調製に当たっては、
Ｄ．Ｅ．Ｎ．４３８、ジョンクリル６８については予め
カルビトールアセテートにて室温にて液状になるように
調製した樹脂溶液を使用した。各樹脂溶液に消泡剤とし
てＫＳ−６６を０．５重量部、印刷性を考えてアエロジ
ル＃２００を３重量部それぞれ添加し、分散した後、三
本ロール混練機で混練した。また、スクリーン印刷がで
きる範囲まで、カルビトールアセテートを用いて希釈し
た。処方Ｎｏ．１、２は、反応性の遅いゴム変性エポキ
シ樹脂（ＴＳＲ−６０１）の配合比を変えたものであ
り、処方Ｎｏ．３は粗化剤に溶解もしくは分解するフィ
ラー（炭酸カルシウム）を含有していないもの、処方Ｎ
ｏ．４は反応性の遅いゴム変性エポキシ樹脂（ＴＳＲ−
６０１）を含有していないものである。Hereinafter, Examples and Comparative Examples in which the effects of the present invention have been specifically confirmed will be described. Examples 1 to 3 and Comparative Examples 1 to 3 Curable resin compositions were prepared according to the formulations (parts by weight) shown in Table 1. In preparing the curable resin composition of each formulation,
D. E. FIG. N. For 438 and Joncryl 68, a resin solution prepared in advance with carbitol acetate so as to be liquid at room temperature was used. 0.5 parts by weight of KS-66 as an antifoaming agent and 3 parts by weight of Aerosil # 200 were added to each resin solution in consideration of printability and dispersed, and then kneaded with a three-roll kneader. Further, the solution was diluted with carbitol acetate to the extent that screen printing was possible. Formulation No. Nos. 1 and 2 were obtained by changing the compounding ratio of rubber-modified epoxy resin (TSR-601) having a low reactivity. No. 3 contains no filler (calcium carbonate) that dissolves or decomposes in the roughening agent, formulation N
o. No. 4 is a rubber-modified epoxy resin (TSR-
601) is not contained.
【表１】 [Table 1]
【００２９】これらの硬化性樹脂組成物を、予め回路の
形成された基板にスクリーン印刷にて塗布し、表２に示
す条件で加熱硬化したあと、粗化剤（酸化剤、溶剤、ア
ルカリ）を用いて粗面化処理を行った。ここでは粗面化
処理を行うに際し、溶剤もしくは溶剤＋アルカリで膨潤
させた後、酸化剤を用いて粗面化をする方法とした。そ
の粗面化した面に、無電解銅めっき・電解銅めっきを行
った後に銅張積層板としての評価を行った。結果を表２
に示す。These curable resin compositions are applied to a substrate on which circuits have been formed in advance by screen printing, and cured by heating under the conditions shown in Table 2, and then a roughening agent (oxidizing agent, solvent, alkali) is added. To perform a roughening treatment. Here, in performing the surface roughening treatment, a method of swelling with a solvent or a solvent + alkaline and then performing surface roughening using an oxidizing agent was adopted. The roughened surface was subjected to electroless copper plating / electrolytic copper plating, and then evaluated as a copper-clad laminate. Table 2 shows the results
Shown in
【表２】 表２に示す結果から明らかなように、反応性の遅いゴム
変性エポキシ樹脂（ＴＳＲ−６０１）及び粗化剤に溶解
もしくは分解するフィラー（炭酸カルシウム）を配合し
た処方Ｎｏ．１、２の硬化性樹脂組成物を用い、スクリ
ーン印刷後の一度目の加熱処理を１２０℃×３０分行
い、めっき後の加熱処理を１４０℃×３０分行った実施
例１及び３では安定したピール強度を示したが、同じ加
熱処理条件でも、反応性の遅いゴム変性エポキシ樹脂
（ＴＳＲ−６０１）を配合しなかった処方Ｎｏ．４の硬
化性樹脂組成物を用いた比較例３ではピール強度は低い
値を示し、また、ゴム変性エポキシ樹脂（ＴＳＲ−６０
１）を配合しても、粗化剤に溶解もしくは分解するフィ
ラー（炭酸カルシウム）を配合しなかった処方Ｎｏ．３
の硬化性樹脂組成物を用いた比較例２では脹れを生じ
た。また、ゴム変性エポキシ樹脂（ＴＳＲ−６０１）と
粗化剤に溶解もしくは分解するフィラー（炭酸カルシウ
ム）の両方を配合した処方Ｎｏ．１の硬化性樹脂組成物
を用いた場合でも、一度目の加熱処理を１７０℃×３０
分の条件で行った場合、低いピール強度を示した。これ
は、スクリーン印刷後の一度目の加熱処理で塗膜の硬化
が進み、その後の粗面化処理によって充分な粗化面が得
られなかったためである。また、実施例１と２を比較す
れば明らかなように、めっき後の加熱処理をより高い温
度で行うことにより、ピール強度もより高い値を示し
た。これは、塗膜の架橋密度を上げると共に応力緩和が
なされたために、密着強度がさらに増したためと考えら
れる。[Table 2] As is evident from the results shown in Table 2, Formulation No. 1 containing a rubber-modified epoxy resin (TSR-601) having a low reactivity and a filler (calcium carbonate) that dissolves or decomposes in a roughening agent is blended. Using the curable resin compositions of Examples 1 and 2, the first heat treatment after screen printing was performed at 120 ° C. for 30 minutes, and the heat treatment after plating was performed at 140 ° C. for 30 minutes. Although the peel strength was shown, even under the same heat treatment conditions, Formulation No. 1 did not contain a rubber-modified epoxy resin (TSR-601) having a low reactivity. In Comparative Example 3 using the curable resin composition of No. 4, the peel strength showed a low value, and the rubber-modified epoxy resin (TSR-60)
Formulation No. 1 in which a filler (calcium carbonate) that dissolves or decomposes in a roughening agent was not added even when compounding No. 1). 3
In Comparative Example 2 using the curable resin composition of Example 1, swelling occurred. Formulation No. 1 in which both a rubber-modified epoxy resin (TSR-601) and a filler (calcium carbonate) that dissolves or decomposes in a roughening agent are blended. Even when the curable resin composition of No. 1 was used, the first heat treatment was performed at 170 ° C. × 30.
When the test was carried out under the conditions of minutes, a low peel strength was exhibited. This is because the curing of the coating film progressed in the first heat treatment after screen printing, and a sufficient roughened surface could not be obtained by the subsequent roughening treatment. Further, as is apparent from a comparison between Examples 1 and 2, when the heat treatment after plating was performed at a higher temperature, the peel strength also showed a higher value. This is presumably because the cross-linking density of the coating film was increased and the stress was relaxed, so that the adhesion strength was further increased.
【００３０】[0030]
【発明の効果】以上のように、本発明の多層プリント配
線板の製造においては、樹脂絶縁層の形成に用いられる
熱硬化性樹脂組成物に反応性の遅いゴム変性エポキシ樹
脂と粗化剤により分解もしくは溶解するフィラーを組み
合わせて含有せしめたことにより、粗化剤による粗面化
処理によって樹脂絶縁層表面に凹凸のある良好な粗化面
を容易に形成することができる。この樹脂絶縁層の凹凸
状粗化面は、その上に形成される導体層のアンカーとし
て働き、従って、この上に無電解めっきや電解めっき等
により導体層を形成した場合、樹脂絶縁層と導体層との
密着強度が向上し、さらに、導体層形成後に二度目の加
熱処理を行うことにより、残留していた未硬化エポキシ
樹脂が充分に硬化され、絶縁層と導体層の密着強度が更
に向上され、パターン欠損や部品の剥離が解消された多
層プリント配線板を製造できる。また、上記樹脂絶縁層
はフィラーが分散されたエポキシ樹脂の硬化塗膜から形
成されるため、耐熱性や電気絶縁性等に優れた多層プリ
ント配線板が得られる。また、本発明の方法により得ら
れたビルドアップ法基板を用いると、極めて良好なピー
ル強度、はんだ耐熱性を有する多層プリント配線板を得
ることができる。本発明の熱硬化性樹脂組成物を用いて
得られた多層プリント配線板は、従来の多層プリント配
線板では困難であった細線パターンの製造に極めて好適
であると考えられる。As described above, in the production of the multilayer printed wiring board of the present invention, a rubber-modified epoxy resin having a low reactivity to the thermosetting resin composition used for forming the resin insulating layer and the roughening agent are used. By including a filler that decomposes or dissolves in combination, a good roughened surface with irregularities can be easily formed on the surface of the resin insulating layer by a roughening treatment with a roughening agent. The roughened surface of the resin insulation layer serves as an anchor for the conductor layer formed thereon. Therefore, when the conductor layer is formed thereon by electroless plating or electrolytic plating, the resin insulation layer and the conductor The adhesion strength with the layer is improved, and the second heat treatment after the formation of the conductor layer further cures the remaining uncured epoxy resin, further improving the adhesion strength between the insulation layer and the conductor layer Thus, it is possible to manufacture a multilayer printed wiring board in which pattern defects and component peeling are eliminated. Further, since the resin insulating layer is formed from a cured coating film of an epoxy resin in which a filler is dispersed, a multilayer printed wiring board excellent in heat resistance, electrical insulation, and the like can be obtained. In addition, when a build-up substrate obtained by the method of the present invention is used, a multilayer printed wiring board having extremely good peel strength and solder heat resistance can be obtained. The multilayer printed wiring board obtained by using the thermosetting resin composition of the present invention is considered to be extremely suitable for the production of a fine line pattern, which has been difficult with a conventional multilayer printed wiring board.
【図１】本発明の方法を積層基板に適用して得られた多
層プリント配線板の概略構成を示す部分断面図である。FIG. 1 is a partial sectional view showing a schematic configuration of a multilayer printed wiring board obtained by applying a method of the present invention to a laminated substrate.
Ａ 積層基板、 １ 第１の導体層、 ２ 第１の樹脂
絶縁層、 ３ 第２の導体層、 ４，６，８ 基板、
５ 第３の導体層、 ７ 第４の導体層、 ９第５の導
体層、 １０ 第２の樹脂絶縁層、 １ａ，７ａ，１１
ａ コネクション部、 ２０ スルーホール、 ２１
スルーホール孔A laminated substrate, 1 first conductive layer, 2 first resin insulating layer, 3 second conductive layer, 4, 6, 8 substrate,
5 third conductor layer, 7 fourth conductor layer, 9 fifth conductor layer, 10 second resin insulation layer, 1a, 7a, 11
a connection part, 20 through hole, 21
Through-hole hole
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 63/00 - 63/10 H05K 3/46 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C08L 63/00-63/10 H05K 3/46
Claims (10)
絶縁層及び所定の回路パターンの導体層を順次形成する
多層プリント配線板の製造において、樹脂絶縁層及び導
体層の形成が、 （ａ）（Ａ）エポキシ樹脂と、（Ｂ）エポキシ樹脂硬化
剤と、（Ｃ）粗化剤により分解もしくは溶解するフィラ
ーと、（Ｄ）有機溶剤とを必須成分として含有してな
り、上記（Ａ）エポキシ樹脂成分１００重量部中に、一
方のエポキシ樹脂よりも反応性の遅いゴム変性エポキシ
樹脂を３０〜８０重量部含有する熱硬化性樹脂組成物か
らなる樹脂絶縁層をコーティングし、半硬化状態に加熱
処理する工程、 （ｂ）上記樹脂絶縁層の表面を粗化剤により処理するこ
とにより、凹凸状の粗化面を形成する工程、 （ｃ）上記樹脂絶縁層の粗化された表面に導体層を形成
する工程、及び （ｄ）二度目の加熱処理を行い、上記樹脂絶縁層を硬化
させる工程を含むことを特徴とする多層プリント配線板
の製造方法。In the manufacture of a multilayer printed wiring board in which a resin insulation layer and a conductor layer having a predetermined circuit pattern are sequentially formed on a conductor layer of a circuit board on which a circuit is formed, the formation of the resin insulation layer and the conductor layer is as follows: a) an epoxy resin , (B) an epoxy resin curing agent, (C) a filler decomposed or dissolved by a roughening agent, and (D) an organic solvent as essential components. ) 100 parts by weight of an epoxy resin component is coated with a resin insulating layer made of a thermosetting resin composition containing 30 to 80 parts by weight of a rubber-modified epoxy resin having a lower reactivity than one of the epoxy resins; (B) a step of forming a roughened surface with irregularities by treating the surface of the resin insulating layer with a roughening agent; and (c) forming a roughened surface of the resin insulating layer on the roughened surface of the resin insulating layer. Form conductor layer Perform step, and (d) is the second time of heat treatment is, the method for manufacturing a multilayer printed wiring board which comprises a step of curing the resin insulating layer.
のスルーホール部を穴明けし、上記樹脂絶縁層の表面及
びスルーホール部を粗化剤により処理して粗化面を形成
した後、最外層の導体層を形成する工程を含む請求項１
に記載の多層プリント配線板の製造方法。2. After forming the outermost resin insulating layer, a predetermined through-hole is formed, and the surface of the resin insulating layer and the through-hole are treated with a roughening agent to form a roughened surface. after claim 1 including the step of forming a conductive layer of the outermost layer
3. The method for producing a multilayer printed wiring board according to item 1.
た配線板の導体層上に予めエポキシ樹脂とエポキシ樹脂
硬化剤を主成分とする熱硬化性樹脂組成物で樹脂絶縁層
を形成した後、（Ａ）エポキシ樹脂と、（Ｂ）エポキシ
樹脂硬化剤と、（Ｃ）粗化剤により分解もしくは溶解す
るフィラーと、（Ｄ）有機溶剤とを必須成分とし、か
つ、上記（Ａ）エポキシ樹脂成分１００重量部中に、一
方のエポキシ樹脂よりも反応性の遅いゴム変性エポキシ
樹脂を３０〜８０重量部含有する熱硬化性樹脂組成物に
より樹脂絶縁層を形成する請求項１又は２に記載の多層
プリント配線板の製造方法。3. In the step (a), after forming a resin insulating layer with a thermosetting resin composition containing an epoxy resin and an epoxy resin curing agent as main components on a conductor layer of a wiring board on which a circuit is formed in advance. , (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a filler that is decomposed or dissolved by a roughening agent, and (D) an organic solvent as essential components. The resin insulating layer according to claim 1 or 2 , wherein the resin insulating layer is formed of a thermosetting resin composition containing 30 to 80 parts by weight of a rubber-modified epoxy resin having lower reactivity than one epoxy resin in 100 parts by weight of the component. A method for manufacturing a multilayer printed wiring board.
１１０〜１７０℃であり、前記（ｄ）工程における二度
目の加熱処理温度が前記（ａ）工程における加熱処理温
度より高い温度である請求項１乃至３のいずれか一項に
記載の多層プリント配線板の製造方法。4. The heat treatment temperature in the step (a) is 110 to 170 ° C., and the second heat treatment temperature in the step (d) is higher than the heat treatment temperature in the step (a). Item 4. The method for manufacturing a multilayer printed wiring board according to any one of Items 1 to 3 .
を無電解めっき及び／又は電解めっきにより行う請求項
１乃至４のいずれか一項に記載の多層プリント配線板の
製造方法。5. The coating of a conductor layer on a resin insulating layer is performed by electroless plating and / or electrolytic plating.
The method for producing a multilayer printed wiring board according to any one of claims 1 to 4 .
の中から選ばれた少なくとも１種である請求項１乃至５
のいずれか一項に記載の多層プリント配線板の製造方
法。6. The roughening agent is an oxidizing agent, according to claim 1 to 5 is at least one selected from alkali and organic solvents
The method for producing a multilayer printed wiring board according to any one of the above.
てその下の導体層が露出するような孔をあけ、前記
（ｃ）工程によって樹脂絶縁層の下の導体層とその上の
導体層とを電気的に接続するブラインドバイアホールを
設けるようにした請求項１乃至６のいずれか一項に記載
の多層プリント配線板の製造方法。7. A hole is formed in the formed resin insulating layer so that a conductor layer thereunder is exposed by laser light, and the conductor layer below the resin insulation layer and the conductor layer thereover are formed by the step (c). method for manufacturing a multilayer printed wiring board according to any one of claims 1 to 6 so as to provide a blind via hole for electrically connecting.
絶縁層及び所定の回路パターンの導体層が順次形成され
てなる多層プリント配線板において、上記樹脂絶縁層
が、（ａ）（Ａ）エポキシ樹脂と、（Ｂ）エポキシ樹脂
硬化剤と、（Ｃ）粗化剤により分解もしくは溶解するフ
ィラーと、（Ｄ）有機溶剤とを必須成分として含有して
なり、上記（Ａ）エポキシ樹脂成分１００重量部中に、
一方のエポキシ樹脂よりも反応性の遅いゴム変性エポキ
シ樹脂を３０〜８０重量部含有する熱硬化性樹脂組成物
の硬化塗膜から成り、かつその表面の導体層との界面が
粗面化処理によって凹凸状の粗化面に形成されており、
上記導体層は該粗化面を介して樹脂絶縁層と接合されて
なることを特徴とする多層プリント配線板。8. A multilayer printed wiring board in which a resin insulating layer and a conductor layer of a predetermined circuit pattern are sequentially formed on a conductor layer of a circuit board on which a circuit is formed, wherein the resin insulating layer comprises: (a) (A) ) Epoxy resin and (B) epoxy resin
A curing agent and (C) a filler which is decomposed or dissolved by a roughening agent.
And (D) an organic solvent as essential components.
In the above (A) 100 parts by weight of the epoxy resin component,
Rubber modified epoxy with lower reactivity than one epoxy resin
It consists of a cured coating of a thermosetting resin composition containing 30 to 80 parts by weight of a resin , and its surface and the interface with the conductor layer are formed into a roughened surface with a rough surface by a roughening treatment. Has been
The multilayer printed wiring board, wherein the conductor layer is bonded to the resin insulating layer via the roughened surface.
前記請求項８に記載の熱硬化性樹脂組成物の硬化塗膜か
ら成り、かつその表面の導体層との界面が粗面化処理に
よって凹凸状の粗化面に形成された外側樹脂絶縁層の少
なくとも２層からなることを特徴とする請求項８に記載
の多層プリント配線板。9. The method according to claim 9, wherein the resin insulating layer comprises: an inner resin insulating layer;
An outer resin insulation layer comprising a cured coating film of the thermosetting resin composition according to claim 8 , and an interface between the outer resin insulation layer and the conductor layer on the surface formed on the roughened surface with irregularities by a roughening treatment. 9. The multilayer printed wiring board according to claim 8 , comprising at least two layers.
の導体層とを電気的に接続するブラインドバイアホール
が形成されていることを特徴とする請求項８又は９に記
載の多層プリント配線板。10. A multilayer printed according to claim 8 or 9, characterized in that the blind via hole for electrically connecting the conductor layer with the conductor layer thereon under the resin insulating layer is formed Wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12332594A JP3290296B2 (en) | 1994-05-13 | 1994-05-13 | Multilayer printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12332594A JP3290296B2 (en) | 1994-05-13 | 1994-05-13 | Multilayer printed wiring board and method of manufacturing the same |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001142277A Division JP3654851B2 (en) | 2001-05-11 | 2001-05-11 | Thermosetting resin composition, multilayer printed wiring board using the composition, and method for producing the same |
| JP2002011260A Division JP3711337B2 (en) | 2002-01-21 | 2002-01-21 | Thermosetting resin composition for wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07304931A JPH07304931A (en) | 1995-11-21 |
| JP3290296B2 true JP3290296B2 (en) | 2002-06-10 |
Family
ID=14857769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12332594A Expired - Lifetime JP3290296B2 (en) | 1994-05-13 | 1994-05-13 | Multilayer printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3290296B2 (en) |
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-
1994
- 1994-05-13 JP JP12332594A patent/JP3290296B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012165439A1 (en) | 2011-05-31 | 2012-12-06 | 日立化成工業株式会社 | Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same |
| KR20190037251A (en) | 2016-08-12 | 2019-04-05 | 히타치가세이가부시끼가이샤 | Interlayer insulating film and manufacturing method thereof |
| US11432400B2 (en) | 2016-08-12 | 2022-08-30 | Showa Denko Materials Co., Ltd. | Interlayer insulating film and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07304931A (en) | 1995-11-21 |
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