JP3279753B2 - Method for forming barrier of plasma display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a plasma display panel (hereinafter, referred to as PDP), and more particularly, to a method for forming a linear barrier in a PDP.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a barrier in a PDP, a glass paste is superposed in a pattern on a glass substrate by screen printing, and the glass paste is dried and fired to form a desired barrier. Although the method was general, since this method is complicated and it is difficult to obtain good line width accuracy, recently, a glass paste is applied to a glass substrate at a predetermined thickness and dried. A so-called subtractive processing method in which a glass paste layer is formed by this, a mask having subtractive resistance is formed on the glass paste layer in a pattern, and a barrier of a desired pattern is formed by sandblasting or liquid honing through the mask. Has been proposed.

[0003]

When a line-shaped barrier is formed by the above-described subtractive processing method, a glass paste for the barrier is usually applied on a glass substrate 11 as shown in FIG. The glass paste layer 12 is formed by drying with a mask 13 having a subtractive resistance in a line shape. However, when the subtractive processing is performed while scanning in the direction of the arrow through the line mask 13 through this line mask 13, the glass paste layer 12 is ground only from both sides except for the vicinity of the end of the line mask 13. compared,
Since the vicinity of the end of the line-shaped mask 13 is also ground from the end surface side, the vicinity of the end of the barrier 12a is ground in an inverted trapezoidal shape as shown in FIG.
As shown in (1), there is a problem that the grinding proceeds in a state where the mask 13 is peeled off, and this portion becomes a defect.

The present invention has been made in view of the above problems, and has as its object to form a barrier of a desired line pattern by subtractive processing without generating a defect near an end. PDP that can do
And a barrier forming method.

[0005]

In order to achieve the above object, the present invention provides a method of forming a glass paste layer by applying a glass paste for a barrier to a predetermined thickness on a glass substrate and drying the glass paste. A method of forming a barrier for a PDP, comprising the steps of: forming a linear mask having subtractive resistance at a predetermined pitch thereon; and removing unnecessary portions of the glass paste layer by subtractive processing through the linear mask. In the above-mentioned line-shaped mask, a subtractive process is performed in a state where a protective mask having subtractive resistance is provided at predetermined intervals outside a line end portion, and the subtractive process in this case is sandblasting. Or a liquid honing.

The above-described mask having subtractive resistance can be formed by a photolithography method using a photoresist.

[0007]

In the barrier forming method having the above-described structure, the protective mask plays the role of blocking the flow of airflow during the subtractive processing, thereby reducing the airflow flowing near the end of the linear mask, and The glass paste layer below the edge of the mask is prevented from being excessively ground.

[0008]

An embodiment of the present invention will be described below with reference to FIGS.

First, as shown in FIG. 2 (a), a glass paste for a barrier having a thickness of 150 μm is applied on a glass substrate 2 on which an electrode 1 is formed by a blade coater or screen printing, and dried to dry the glass. Paste layer 3
Is formed, and then a PVA containing a diazonium salt is applied thereon to a film thickness of 10 μm using a spinner, a roller coater, a blade coater or the like, and dried at room temperature to form a mask layer 4. Then, after exposure as shown in FIG. 2B through the mask pattern 5 shown in FIG. 3, the film was immersed in water for 1 to 2 minutes and then spray-developed. Exposure conditions are 365
when measured in nm, intensity 700 μW / cm ² , dose 4
00 mJ / cm ² . As a result, as shown in FIGS. 2C and 4, the linear mask 4a is formed on the glass paste layer 3 and the width W is set at a predetermined distance d outside the line end.
Was formed. In this embodiment, the line-shaped mask 4a is formed at a pitch of 120 μm (line width 50 μm,
The space width was 70 μm), the distance d between the end of the line and the protection mask 4b was 0.2 mm, and the width W of the protection mask 4b was 1 mm. FIG. 2C corresponds to the AA cross section in FIG.

Subsequently, after a drying step, FIG.
As shown in FIG. 5, unnecessary portions of the glass paste layer 3 are removed by performing sand blasting while scanning in the direction of the arrow in FIG. 4, and a barrier pattern 3a is formed below the linear mask 4a as shown in FIG. Formed. here,
Alumina # 1000 is used as abrasive, and injection pressure is 3k
Sandblasting was performed under the conditions of gf / cm ² , a distance between the nozzle and the substrate 1 of 185 mm, and a scan speed of 30 mm / sec. By this sandblasting, a favorable edge shape was obtained without excessively grinding the glass paste layer 3 below the vicinity of the end of the line-shaped mask 4a. Subsequently, the linear mask 4a and the protective mask 4b were removed with a release material, and a baking process was performed to form a barrier 3a in close contact with the glass substrate 1 as shown in FIG. Here, the glass paste layer 3 under the protective mask 4c remains as the bank 3b. Aside from the back plate formed as described above, a front plate provided with an electrode and a fluorescent layer was prepared, and a PDP was produced by combining them to obtain good results.

In the present invention, as a photoresist for forming a line mask and a protective mask having subtractive resistance, in addition to those mentioned in the above embodiment,
Various photosensitive resins described below, including a negative type liquid resist called OSBR, can be used.

For example, a photosensitive resin containing a water-soluble resin matrix and a photopolymerizable polyfunctional monomer as main components can be used. As the water-soluble resin matrix, polyvinyl alcohol-polyvinyl acetate-
Partially saponified crotonic acid copolymers, polyvinyl alcohol-polyvinyl acetate-methacrylic acid, and alcohol-soluble nylon can be used. On the other hand, pentaerythritol triacrylate, tetraacrylate, methacrylate Acrylates can be used. When this kind of photosensitive resin is used, the mask is removed with an aqueous solution of sodium periodate after the subtractive processing.

Also, a photosensitive resin containing polyvinyl alcohol, polyvinyl acetate emulsion and diazo resin as main components, or a photosensitive resin containing photosensitive polyvinyl alcohol, polyvinyl alcohol and polyvinyl acetate emulsion as main components. Resins can be used. In the former case, for example, 10 parts by weight of polyvinyl alcohol, 20 to 60 parts by weight of a polyvinyl acetate emulsion at a solid content of 50%, and 0.5 to 50 parts by weight of a diazo resin are used.
It is advisable to use a mixture of 1.5 parts by weight. In the latter case, a photosensitive polyvinyl alcohol having a formylstyrylpyridinium group (stilvarizolium group) in a part of the hydroxyl group of the polyalcohol can be used. When these photosensitive resins are used, the mask is removed with a sodium hypochlorite solution and a perhalic acid aqueous solution after the subtractive processing.

Further, a photosensitive resin containing gelatin, an acrylamide derivative and a redox photopolymerization initiator as main components can be used. As the acrylamide polymer, acrylamide or N, N'-methylenebisacrylamide can be used. As the redox photopolymerization initiator, iron (III) ammonium citrate or ammonium (III) ammonium oxalate can be used. it can. When this photosensitive resin is used, the mask is peeled off with a protease after the subtractive processing.

[0015]

As described above, the method of forming a barrier of a PDP according to the present invention provides a method of forming a PDP with a protective mask having a subtractive resistance at predetermined intervals outside the line end of the line mask. Since the subtractive processing is performed, the protective mask plays a role of blocking the flow of airflow during the subtractive processing, and as a result, the airflow flowing below the end of the linear mask is reduced, and this part is provided. By preventing excessive grinding of the glass paste layer, it is possible to form a barrier of a desired line pattern without generating a defect near the end of the line during subtractive processing.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a conventional barrier forming method by subtractive processing.

FIG. 2 is a diagram showing the first half of the steps of the barrier forming method according to the present invention.

FIG. 3 is a plan view showing a mask pattern.

FIG. 4 is a plan view showing a state in which a linear mask and a protective mask are formed on a glass paste layer.

FIG. 5 is a diagram showing a latter half of the process following FIG. 2;

[Explanation of symbols]

 2 Glass substrate 3 Glass paste layer 3a Barrier 4a Linear mask 4b Protective mask

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01J 9/02 H01J 11/02

Claims (4)

(57) [Claims] 1. A glass paste layer is formed on a glass substrate by applying a glass paste for barrier at a predetermined thickness and drying the glass paste layer, and a line mask having a subtractive resistance is formed on the glass paste layer at a predetermined pitch. After forming, the method for forming a barrier of a plasma display panel includes a step of removing an unnecessary portion of the glass paste layer by subtractive processing through the linear mask. A method of forming a barrier of a plasma display panel, wherein a subtractive process is performed with a protective mask having subtractive resistance placed thereon. 2. The method according to claim 1, wherein sandblasting is used for the subtractive processing. 3. The method according to claim 1, wherein liquid honing is used for the subtractive processing. 4. The method for forming a barrier of a plasma display panel according to claim 1, wherein a photoresist is used as a material for forming a mask having subtractive resistance.