JP3268739B2 - Disk board unloading mechanism - Google Patents

Disk board unloading mechanism

Info

Publication number
JP3268739B2
JP3268739B2 JP19791397A JP19791397A JP3268739B2 JP 3268739 B2 JP3268739 B2 JP 3268739B2 JP 19791397 A JP19791397 A JP 19791397A JP 19791397 A JP19791397 A JP 19791397A JP 3268739 B2 JP3268739 B2 JP 3268739B2
Authority
JP
Japan
Prior art keywords
disk substrate
sprue
ejector sleeve
rubber pad
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19791397A
Other languages
Japanese (ja)
Other versions
JPH1119983A (en
Inventor
郁夫 浅井
Original Assignee
株式会社名機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社名機製作所 filed Critical 株式会社名機製作所
Priority to JP19791397A priority Critical patent/JP3268739B2/en
Publication of JPH1119983A publication Critical patent/JPH1119983A/en
Application granted granted Critical
Publication of JP3268739B2 publication Critical patent/JP3268739B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/42Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B29C45/4225Take-off members or carriers for the moulded articles, e.g. grippers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/7207Heating or cooling of the moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/7207Heating or cooling of the moulded articles
    • B29C2045/7214Preform carriers for cooling preforms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】CDやDVD等のディスク基
板を成形した後、金型から該ディスク基板を反りが発生
しないように取出す際の取出し機構に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ejection mechanism for ejecting a disk substrate such as a CD or a DVD from a mold after molding the disk substrate so as not to warp.

【0002】[0002]

【従来の技術】従来、前記ディスク基板を金型キャビテ
ィから取出すときは、取出し機の保持部であるゴムパッ
トをディスク基板の内周部に真空圧により吸着・保持さ
せてから、金型に内設したエジェクタスリーブを突き出
し前進させてディスク基板を金型から離型させるととも
に、取出し機により次工程に搬送していた。
2. Description of the Related Art Conventionally, when removing the disk substrate from a mold cavity, a rubber pad, which is a holding portion of an unloader, is sucked and held by a vacuum pressure on an inner peripheral portion of the disk substrate, and then the disk substrate is installed in a mold. The ejector sleeve thus protruded and advanced to release the disk substrate from the mold, and was conveyed to the next step by the unloader.

【0003】[0003]

【発明が解決しようとする課題】前記従来技術において
は、ディスク基板上におけるゴムパットの吸着位置は、
吸着後のディスク基板を確実に保持するため極力ディス
ク基板の外周側にすべく、信号領域の内周側境界直近に
設けた。一方、エジェクタスリーブはスタンパホルダの
内側に設けられ、ディスク基板の最内周縁部にしか設け
ることが出来ない。そのため、エジェクタスリーブとゴ
ムパットの軸は一致せず、ディスク基板の突き出し時に
は図4に示す状況となり、ディスク基板を保持するゴム
パットの位置はエジェクタスリーブの外径より外周側に
あるので、エジェクタスリーブの突き出し前進によりデ
ィスク基板の内周部は偶力により外方に変形するのであ
る。この変形は、板厚が0.6mmの薄い基板を貼り合
わせるDVDディスク基板においては顕著であり、貼り
合わせる際の大きな障害となる。
In the above prior art, the position of the rubber pad on the disk substrate is
In order to securely hold the disk substrate after the suction, the disk substrate is provided as close as possible to the outer peripheral side of the disk substrate, near the inner peripheral side boundary of the signal area. On the other hand, the ejector sleeve is provided inside the stamper holder, and can be provided only at the innermost peripheral edge of the disk substrate. Therefore, the axis of the ejector sleeve does not coincide with the axis of the rubber pad, and the state shown in FIG. 4 is obtained when the disc substrate is projected. Since the position of the rubber pad holding the disk substrate is on the outer peripheral side of the outer diameter of the ejector sleeve, the ejector sleeve is projected. As the disk advances, the inner peripheral portion of the disk substrate is deformed outward by a couple. This deformation is remarkable in a DVD disk substrate to which a thin substrate having a thickness of 0.6 mm is bonded, and becomes a major obstacle in bonding.

【0004】[0004]

【課題を解決するための手段】そこで本発明のディスク
基板の取出し機構は、成形後のディスク基板を金型から
離型させるエジェクタスリーブの端面による作用力と保
持部の反作用の少なくとも一部が軸方向に対向するよう
に構成され蛇腹状の伸縮部を有するゴムパットを備え偶
力の発生を防止する保持部と、スプルチャックとから取
出し機が構成され、前記取出し機の保持部によりディス
ク基板の内周縁部近傍を吸着するとともにスプルチャッ
クがスプルを挟持し、可動金型に設けられたオスカッタ
の同軸内孔に摺動自在に嵌挿した突き出しピンによりス
プルを離型させるとともに、突き出しピンの前進途中か
らエジェクタスリーブを前進させディスク基板を離型さ
せることを特徴とする。
SUMMARY OF THE INVENTION Accordingly, the disk substrate unloading mechanism according to the present invention is characterized in that at least a part of the reaction force of the end face of the ejector sleeve for releasing the molded disk substrate from the mold and the reaction of the holding portion are axial. A take-out machine is constituted by a holding portion that is provided so as to face in the direction and includes a rubber pad having a bellows-shaped expansion / contraction portion and that prevents the occurrence of couples, and a sprue chuck. The sprue chuck clamps the sprue while adsorbing the vicinity of the peripheral edge, and releases the sprue with the protruding pin slidably inserted into the coaxial inner hole of the male cutter provided in the movable mold, and while the protruding pin is moving forward. The ejector sleeve is advanced from above to release the disk substrate.

【0005】[0005]

【発明の実施の形態】図面に基づいて本発明の実施の形
態を詳細に説明する。該図面はディスク基板成形用金型
における可動金型14の中心部分を示す概略図である。
図1は、オスカッタ4が前進してディスク基板7の中心
開口12を形成後、図示しない固定金型から離隔した可
動金型14の中心要部を示す。図2は、図1における可
動金型に取出し機13が近接し、その複数のアーム10
の先端に設けた伸縮自在のゴムパット9がディスク基板
7の内周縁部近傍に真空圧によって吸着した状況を示
す。取出し機13にはスプルチャック11も備え、スプ
ル8を挟持してディスク7とともに可動金型14から搬
出する。
Embodiments of the present invention will be described in detail with reference to the drawings. The drawing is a schematic view showing a central portion of a movable mold 14 in a disk substrate molding mold.
FIG. 1 shows a central portion of a movable mold 14 separated from a fixed mold (not shown) after the male cutter 4 advances to form a center opening 12 of the disk substrate 7. FIG. 2 shows that the unloader 13 is close to the movable mold shown in FIG.
This shows a state in which the elastic rubber pad 9 provided at the tip of the disk substrate 7 is attracted to the vicinity of the inner peripheral edge of the disk substrate 7 by vacuum pressure. The unloader 13 also has a sprue chuck 11, which holds the sprue 8 and unloads it together with the disk 7 from the movable mold 14.

【0006】該可動金型14は、スタンパ6を載置する
鏡面板1と、該鏡面板1の中心開口に嵌挿してスタンパ
6の内周端部を保持するスタンパホルダ2と、該スタン
パホルダ2の同軸内孔に摺動可能に嵌挿したエジェクタ
スリーブ3と、該エジェクタスリーブ3の同軸内孔に摺
動可能に嵌挿したオスカッタ4と、該オスカッタ4の同
軸内孔に摺動可能に嵌挿した突き出しピン5からなり、
前記スタンパ6の外周縁部は図示しない押さえリングに
より保持されている。エジェクタスリーブ3、オスカッ
タ4および突き出しピン5はそれぞれ油圧シリンダ等の
駆動部により前後動する。
The movable mold 14 includes a mirror plate 1 on which the stamper 6 is placed, a stamper holder 2 which is inserted into a center opening of the mirror plate 1 to hold an inner peripheral end of the stamper 6, and a stamper holder 2. An ejector sleeve 3 slidably fitted into the coaxial inner hole 2, a male cutter 4 slidably fitted into the coaxial inner hole of the ejector sleeve 3, and a slidable member into the coaxial inner hole of the male cutter 4. It consists of a protruding pin 5 fitted and
The outer peripheral edge of the stamper 6 is held by a pressing ring (not shown). The ejector sleeve 3, the male cutter 4, and the protruding pin 5 are respectively moved back and forth by a drive unit such as a hydraulic cylinder.

【0007】取出し機13は、空圧シリンダや電動機等
で駆動され、可動金型14が固定金型から離隔したと
き、その間隙に侵入してディスク基板7とスプル8を保
持し搬送するアーム10とスプルチャック11からな
る。アーム10は、同一円周上に複数等間隔に立設して
おり、それらの先端には蛇腹状の伸縮部を有するゴムパ
ット9を備え、真空圧によってディスク基板7を吸着す
る保持部を構成する。該ゴムパット9が、前記アーム1
0の内部空間管路あるいは別途設けたホース等によって
真空源に、電磁弁(図示せず)を介して連通することに
よって所定の時期に真空圧が得られる。スプルチャック
11は空圧や電磁力により作動する鋏状の部材であり、
所定の時期にスプル8を挟持し開放する。
The unloader 13 is driven by a pneumatic cylinder, an electric motor, or the like. When the movable mold 14 is separated from the fixed mold, the unloader 13 enters the gap to hold and transport the disk substrate 7 and the sprue 8. And the sprue chuck 11. The arms 10 are erected at a plurality of equal intervals on the same circumference, are provided with rubber pads 9 having bellows-like elastic portions at their ends, and constitute a holding portion for sucking the disk substrate 7 by vacuum pressure. . The rubber pad 9 is attached to the arm 1
A vacuum pressure can be obtained at a predetermined time by communicating with a vacuum source via an electromagnetic valve (not shown) through an internal space conduit of 0 or a separately provided hose or the like. The sprue chuck 11 is a scissor-shaped member that operates by pneumatic or electromagnetic force.
The sprue 8 is pinched and opened at a predetermined time.

【0008】作動について説明する。図示しない固定金
型と可動金型14とで形成されたキャビティに充填され
た溶融樹脂が冷却固化しつつある適宜な時期に、オスカ
ッタ4を突き出しピン5とともに前進させて、ディスク
基板7の中心開口12を形成させる。その後可動金型1
4を型開きさせ、固定金型から所定距離離隔して停止さ
せる(図1)。取出し機13が可動金型14のディスク
基板7面に近接し、ゴムパット9がディスク基板7の内
周縁部近傍に吸着するとともにスプルチャック11がス
プル8を挟持する。次に突き出しピン5がさらに前進し
てスプル8を離型せしめる。そして、突き出しピン5の
前進途中からエジェクタスリーブ3も同期して前進開始
する(図2、図3)。このとき、エジェクタスリーブ3
の前進移動距離はゴムパット9の蛇腹状の伸縮部が吸収
する。
The operation will be described. At an appropriate time during which the molten resin filled in the cavity formed by the fixed mold and the movable mold 14 (not shown) is being cooled and solidified, the male cutter 4 is advanced together with the ejecting pin 5 and the center opening of the disk substrate 7 is opened. 12 is formed. Then movable mold 1
4 is opened, stopped at a predetermined distance from the fixed mold (FIG. 1). The unloader 13 approaches the surface of the disk substrate 7 of the movable mold 14, the rubber pad 9 is attracted to the vicinity of the inner peripheral edge of the disk substrate 7, and the sprue chuck 11 holds the sprue 8. Next, the protruding pin 5 further advances to release the sprue 8. Then, the ejector sleeve 3 also starts to move forward in synchronization with the push-out pin 5 during the forward movement (FIGS. 2 and 3). At this time, the ejector sleeve 3
Of the rubber pad 9 is absorbed by the bellows-like expansion and contraction portion of the rubber pad 9.

【0009】前記のようにディスク基板7の突き出し時
には、エジェクタスリーブ3の端面はディスク基板7の
内周縁周辺を押すので、図4に示すようにエジェクタス
リーブ3の端面とゴムパット9の軸が一致しない従来の
取出し機構の場合はその偶力によりディスク基板7のゴ
ムパット9部分より内側が外方に反る。本発明の取出し
機構は、図3に示すようにエジェクタスリーブ3の端面
による作用力とゴムパット9の反作用力の少なくとも一
部が軸方向に対抗するように構成したのであり、別の表
現をすれば、ディスク基板7が存在しないときには、エ
ジェクタスリーブ3の端面とゴムパット9が当接するよ
うにしたのである。
As described above, when the disk substrate 7 protrudes, the end surface of the ejector sleeve 3 pushes around the inner peripheral edge of the disk substrate 7, so that the end surface of the ejector sleeve 3 does not coincide with the axis of the rubber pad 9 as shown in FIG. In the case of a conventional take-out mechanism, the inner side of the rubber pad 9 of the disk substrate 7 warps outward due to the couple. As shown in FIG. 3, the take-out mechanism of the present invention is configured such that at least a part of the acting force by the end face of the ejector sleeve 3 and the reaction force of the rubber pad 9 are opposed to each other in the axial direction. When the disk substrate 7 does not exist, the end face of the ejector sleeve 3 is brought into contact with the rubber pad 9.

【0010】以上、図示し説明したのは、スタンパ6が
可動金型14に設けられた実施例についてであったが、
スタンパは固定金型に設けられることもある。その場合
であっても、ディスク基板7の突き出し・取出しは可動
金型で行われるので、本発明は同様に適用出来る。
The embodiment shown and described above relates to the embodiment in which the stamper 6 is provided on the movable mold 14.
The stamper may be provided in a fixed mold. Even in that case, the present invention can be similarly applied since the protrusion and removal of the disk substrate 7 are performed by the movable mold.

【0011】[0011]

【発明の効果】ディスク基板の取出し機構を上記のよう
に構成したので、エジェクタスリーブを前進してディス
ク基板を離型させたときに発生する反りを防止すること
が出来、特にDVDディスク基板における厳しい要求基
準を満足する優れたディスク基板を得ることが出来る。
Since the mechanism for taking out the disk substrate is constructed as described above, it is possible to prevent the warpage that occurs when the disk substrate is released by advancing the ejector sleeve. An excellent disk substrate satisfying the required standard can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】オスカッタ4が前進してディスク基板7の中心
開口12を形成後、図示しない固定金型から離隔した可
動金型14を示す部分断面図である。
FIG. 1 is a partial cross-sectional view showing a movable mold 14 separated from a fixed mold (not shown) after a male cutter 4 advances to form a center opening 12 of a disk substrate 7;

【図2】図1における可動金型に取出し機13が近接
し、ゴムパット9がディスク基板7を吸着するとともに
スプルチャック11がスプル8を挟持した状況を示す部
分断面図である。
FIG. 2 is a partial cross-sectional view showing a state in which an unloader 13 is in proximity to a movable mold in FIG. 1, a rubber pad 9 sucks a disk substrate 7, and a sprue chuck 11 holds a sprue 8.

【図3】図2において、突き出しピン5とエジェクタス
リーブ3を前進させて、スプル8とディスク基板7を離
型させた状況を示す部分断面図である。
FIG. 3 is a partial cross-sectional view showing a state in which a protrusion pin 5 and an ejector sleeve 3 are advanced to separate a sprue 8 and a disk substrate 7 in FIG.

【図4】従来の取出し機構における、図3に相当する状
況を示す部分断面図である。
FIG. 4 is a partial cross-sectional view showing a situation corresponding to FIG. 3 in a conventional take-out mechanism.

【符号の説明】 1 鏡面板 2 スタンパホルダ 3 エジェクタスリーブ 4 オスカッタ 5 突き出しピン 6 スタンパ 7 ディスク基板 8 スプル 9 ゴムパット 10 アーム 11 スプルチャック 12 中心開口 13 取出し機 14 可動金型[Explanation of Symbols] 1 mirror surface plate 2 stamper holder 3 ejector sleeve 4 oscutter 5 protruding pin 6 stamper 7 disk substrate 8 sprue 9 rubber pad 10 arm 11 sprue chuck 12 center opening 13 take-out machine 14 movable mold

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】成形後のディスク基板を金型から離型させ
るエジェクタスリーブの端面による作用力と保持部の反
作用の少なくとも一部が軸方向に対向するように構成さ
れ蛇腹状の伸縮部を有するゴムパットを備えた保持部
と、スプルチャックとから取出し機が構成され、前記保
持部によりディスク基板の内周縁部近傍を吸着するとと
もにスプルチャックがスプルを挟持し、可動金型に設け
られたオスカッタの同軸内孔に摺動自在に嵌挿した突き
出しピンを前進させることによりスプルを離型させ、突
き出しピンの前進途中からエジェクタスリーブを前進さ
せるとともにエジェクタスリーブの前進移動距離はゴム
パットの蛇腹状の伸縮部で吸収しディスク基板を離型さ
せることを特徴とするディスク基板の取出し機構。
The present invention is characterized in that at least a part of a reaction force of an end surface of an ejector sleeve for releasing a molded disk substrate from a mold and a reaction of a holding portion are axially opposed to each other, and have a bellows-like expansion / contraction portion. A holding unit provided with a rubber pad and a sprue chuck constitute an unloader, and the holding unit sucks the vicinity of the inner peripheral edge of the disk substrate and the sprue chuck clamps the sprue. The sprue is released by advancing the protruding pin slidably inserted into the coaxial inner hole, and the ejector sleeve is advanced while the protruding pin is advancing, and the advance movement distance of the ejector sleeve is a bellows-like elastic portion of a rubber pad. A disk substrate unloading mechanism, characterized in that the disk substrate is released by absorbing the substrate.
JP19791397A 1997-07-07 1997-07-07 Disk board unloading mechanism Expired - Fee Related JP3268739B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19791397A JP3268739B2 (en) 1997-07-07 1997-07-07 Disk board unloading mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19791397A JP3268739B2 (en) 1997-07-07 1997-07-07 Disk board unloading mechanism

Publications (2)

Publication Number Publication Date
JPH1119983A JPH1119983A (en) 1999-01-26
JP3268739B2 true JP3268739B2 (en) 2002-03-25

Family

ID=16382363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19791397A Expired - Fee Related JP3268739B2 (en) 1997-07-07 1997-07-07 Disk board unloading mechanism

Country Status (1)

Country Link
JP (1) JP3268739B2 (en)

Also Published As

Publication number Publication date
JPH1119983A (en) 1999-01-26

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