JP3250400B2 - Manufacturing method of ceramic electronic components - Google Patents

Manufacturing method of ceramic electronic components

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Publication number
JP3250400B2
JP3250400B2 JP33987794A JP33987794A JP3250400B2 JP 3250400 B2 JP3250400 B2 JP 3250400B2 JP 33987794 A JP33987794 A JP 33987794A JP 33987794 A JP33987794 A JP 33987794A JP 3250400 B2 JP3250400 B2 JP 3250400B2
Authority
JP
Japan
Prior art keywords
ceramic element
water
supplying
reducing atmosphere
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33987794A
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Japanese (ja)
Other versions
JPH08186053A (en
Inventor
徳太郎 木村
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Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
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Priority to JP33987794A priority Critical patent/JP3250400B2/en
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Application granted granted Critical
Publication of JP3250400B2 publication Critical patent/JP3250400B2/en
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は電子部品の製造方法に関
し、詳しくは、セラミック素子を熱処理して、セラミッ
ク素子中に含まれるバインダーなどを分解、除去する脱
脂工程の終了後に、セラミック素子を湿潤還元雰囲気中
で熱処理して焼結させる焼成工程を含むセラミック電子
部品の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component, and more particularly, to a method of heat-treating a ceramic element to wet a ceramic element after a degreasing step of decomposing and removing a binder and the like contained in the ceramic element. The present invention relates to a method for manufacturing a ceramic electronic component including a firing step of performing heat treatment and sintering in a reducing atmosphere.

【0002】[0002]

【従来の技術】例えば、卑金属材料を用いて内部電極を
形成した積層セラミックコンデンサ素子などのセラミッ
ク素子を焼成する方法の一つとして、窒素を主成分とす
る雰囲気中に水素や水を添加した湿潤還元雰囲気中で焼
成を行う方法がある。そして、この方法においては、雰
囲気中の酸素分圧を検出、管理することにより湿潤還元
雰囲気のコントロールを行っている。
2. Description of the Related Art For example, as one method of firing a ceramic element such as a multilayer ceramic capacitor element in which internal electrodes are formed using a base metal material, a wet method in which hydrogen or water is added to an atmosphere mainly containing nitrogen is used. There is a method of performing firing in a reducing atmosphere. In this method, the wet reducing atmosphere is controlled by detecting and managing the oxygen partial pressure in the atmosphere.

【0003】[0003]

【発明が解決しようとする課題】しかし、酸素分圧のみ
を管理する方法には次のような問題点がある。
However, the method for managing only the oxygen partial pressure has the following problems.

【0004】脱脂後のセラミック素子中の残留炭素を
除去する際には、 C+O → CO (1) C+O2 → CO2 (2) CO+1/2O2 → CO2 (3) などの反応以外にも、 C+H2O → CO+H2 (4) C+2H2O → CO2+2H2 (5) などのいわゆる水性ガス反応が生じる。しかし、式
(4),(5)のような水性ガス反応は、残留炭素と水(水蒸
気)の直接反応であるため、酸素分圧を検出、管理する
方法によっては、式(4),(5)のような水性ガス反応を検
出、管理することができず、脱脂工程での残留炭素を、
セラミック素子の焼結などに悪影響を与えることなく効
率よく除去することが困難であるのが実情である。
[0004] When removing the residual carbon in the ceramic element after degreasing, besides the reaction of C + O → CO (1) C + O 2 → CO 2 (2) CO + 1 / 2O 2 → CO 2 (3), A so-called water gas reaction such as C + H 2 O → CO + H 2 (4) C + 2H 2 O → CO 2 + 2H 2 (5) occurs. But the expression
Since the water gas reaction such as (4) and (5) is a direct reaction between residual carbon and water (steam), depending on the method of detecting and controlling the oxygen partial pressure, the equations (4) and (5) Such a water gas reaction cannot be detected and controlled, and residual carbon in the degreasing process is
In reality, it is difficult to efficiently remove ceramic elements without adversely affecting sintering or the like.

【0005】また、焼成炉内に挿入するタイプの酸素
センサーは、通常、残留炭素が主に除去される800℃
以下の温度では、センサー出力値の信頼性が乏しく精度
が低いため、酸素分圧を正確に検出すること自体が容易
ではないという問題点もある。
[0005] Further, an oxygen sensor of a type inserted into a firing furnace usually has a temperature of 800 ° C. at which residual carbon is mainly removed.
At the following temperatures, there is a problem that it is not easy to accurately detect the oxygen partial pressure because the reliability of the sensor output value is poor and the accuracy is low.

【0006】さらに、従来の湿潤還元雰囲気中で焼成
した場合、水性ガス反応の速度が遅く、焼成に長時間を
要するため生産効率が低いという問題点がある。
Further, when firing is carried out in a conventional wet reducing atmosphere, there is a problem that the rate of the water gas reaction is low and the firing requires a long time, resulting in low production efficiency.

【0007】本発明は、上記問題点を解決するものであ
り、焼成工程において、セラミック素子の焼結に悪影響
を与えたりすることなく、脱脂後のセラミック素子中の
残留炭素を速やかに減少させることが可能で、生産効率
の高いセラミック電子部品の製造方法を提供することを
目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to quickly reduce the residual carbon in a degreased ceramic element without adversely affecting sintering of the ceramic element in a firing step. It is an object of the present invention to provide a method of manufacturing a ceramic electronic component which is possible and has high production efficiency.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、発明者は種々の実験、検討を行い、湿潤還元雰囲気
を保持するための水分とは別に、所定の割合で水分を供
給しつつ焼成を行った場合に、脱脂後のセラミック素子
中の残留炭素が速やかに減少することを知り、さらに実
験、検討を重ねて本発明を完成した。
In order to achieve the above-mentioned object, the inventor has conducted various experiments and studies, and while supplying water at a predetermined ratio separately from the water for maintaining the moist reducing atmosphere. When firing was performed, it was found that the residual carbon in the ceramic element after degreasing was rapidly reduced, and the present invention was completed through further experiments and studies.

【0009】すなわち、本発明のセラミック電子部品の
製造方法は、セラミック素子を所定の条件で熱処理して
セラミック素子中に含まれるバインダーなどの有機物質
を分解、除去する脱脂工程と、前記脱脂工程の終了後
に、セラミック素子を湿潤還元雰囲気中で熱処理して焼
結させる焼成工程であって、湿潤還元雰囲気を保持する
ための水分とは別に、脱脂工程終了時のセラミック素子
中の残留炭素1モルに対して、1分間に3モル以上の割
合で水分を供給しつつ所定の温度に達するまで焼成を行
った後、湿潤還元雰囲気保持用の水分のみを供給しつつ
所定の温度プロファイルで焼成を行う焼成工程とを含む
ことを特徴としている。
That is, in the method for manufacturing a ceramic electronic component of the present invention, a degreasing step of heat-treating a ceramic element under predetermined conditions to decompose and remove an organic substance such as a binder contained in the ceramic element; After the completion, a firing step of heat-treating and sintering the ceramic element in a humid reducing atmosphere. In addition to water for maintaining the humid reducing atmosphere, the residual carbon in the ceramic element at the end of the degreasing step is reduced to 1 mol. On the other hand, baking is performed until a predetermined temperature is reached while supplying water at a rate of 3 mol or more per minute, and then baking is performed with a predetermined temperature profile while supplying only water for maintaining a wet reducing atmosphere. And a process.

【0010】また、脱脂工程終了時のセラミック素子中
の残留炭素量1モルに対して、1分間に3モル以上の割
合で水分を供給しつつ焼成を行う際における雰囲気中の
水分濃度が10〜25vol%であることを特徴としてい
る。
In addition, when the baking is performed while supplying water at a rate of 3 moles or more per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step, the atmosphere has a water concentration of 10 to 10 moles. It is characterized by being 25 vol%.

【0011】さらに、前記脱脂工程の終了後に、脱脂工
程終了時のセラミック素子中の残留炭素量1モルに対し
て、1分間に3モル以上の割合で水分を供給しながら少
なくとも800℃に達するまで焼成を行い、その後、湿
潤還元雰囲気保持用の水分のみを供給しつつ所定の温度
プロファイルで焼成を行うことを特徴としている。
Further, after completion of the degreasing step, water is supplied at a rate of at least 3 moles per minute to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step until the temperature reaches at least 800 ° C. The calcination is performed, and thereafter, the calcination is performed with a predetermined temperature profile while supplying only moisture for maintaining a wet reducing atmosphere.

【0012】[0012]

【作用】脱脂工程の終了後の焼成工程において、湿潤還
元雰囲気を保持するための水分とは別に、脱脂工程終了
時のセラミック素子中の残留炭素1モルに対して、1分
間に3モル以上の割合で水分を供給しつつ所定の温度に
達するまで焼成を行うことにより、セラミック素子の焼
結に悪影響を与えたりするようなことなく、前述の式
(4),(5)の水性ガス反応 C+H2O → CO+H2 (4) C+2H2O → CO2+2H2 (5) を速やかに進行させ、セラミック素子中に残留した炭素
を効率よく減少させることが可能になるとともに、その
後、湿潤還元雰囲気保持用の水分のみを供給しつつ所定
の温度プロファイルで焼成を行うことにより、セラミッ
ク素子の焼結を確実に行わせることができるようにな
り、全体として、焼成の効率を向上させることができる
ようになる。
In the firing step after the completion of the degreasing step, apart from the moisture for maintaining the moist reducing atmosphere, 3 mols or more per minute per 1 mol of the residual carbon in the ceramic element at the end of the degreasing step. By performing sintering until a predetermined temperature is reached while supplying moisture at a ratio, the above-described formula can be obtained without adversely affecting the sintering of the ceramic element.
(4) The water gas reaction of (5) C + H 2 O → CO + H 2 (4) C + 2H 2 O → CO 2 + 2H 2 (5) Promptly proceed to efficiently reduce the carbon remaining in the ceramic element. Then, by performing sintering at a predetermined temperature profile while supplying only moisture for maintaining a wet reducing atmosphere, the sintering of the ceramic element can be reliably performed, and as a whole, As a result, the efficiency of firing can be improved.

【0013】また、脱脂工程終了時のセラミック素子中
の残留炭素量1モルに対して、1分間に3モル以上の割
合で水分を供給しつつ焼成を行う際の雰囲気中の水分濃
度を10〜25vol%とすることにより、所定の湿潤還
元雰囲気を保ちつつ、セラミック素子中に残留した炭素
を効率よく減少させることが可能になり、本発明をより
実効あらしめることができる。
Further, when the baking is performed while supplying water at a rate of 3 moles or more per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step, the moisture concentration in the atmosphere is 10 to 10 moles. By setting the volume to 25 vol%, it is possible to efficiently reduce the carbon remaining in the ceramic element while maintaining a predetermined wet reducing atmosphere, and the present invention can be made more effective.

【0014】さらに、脱脂工程の終了後に、脱脂工程終
了時のセラミック素子中の残留炭素量1モルに対して、
1分間に3モル以上の割合で水分を供給しながら少なく
とも800℃に達するまで焼成を行い、その後、湿潤還
元雰囲気保持用の水分のみを供給しつつ所定の温度プロ
ファイルで焼成を行うようにした場合には、前述の式
(4),(5)の水性ガス反応を速やかに進行させ、セラミッ
ク素子中に残留した炭素をより確実に、しかも効率よく
減少させることが可能になるとともに、その後の湿潤還
元雰囲気保持用の水分のみを供給しつつ焼成する工程
で、セラミック素子の焼結を確実に行わせることが可能
になり、本発明をさらに実効あらしめることができるよ
うになる。
Further, after the completion of the degreasing step, the amount of carbon remaining in the ceramic element at the end of the degreasing step is 1 mol, and
In the case where baking is performed at a temperature of at least 800 ° C. while supplying water at a rate of 3 mol or more per minute, and then baking is performed with a predetermined temperature profile while supplying only water for maintaining a wet reducing atmosphere. Has the above formula
The water gas reaction of (4) and (5) proceeds promptly, and the carbon remaining in the ceramic element can be more reliably and efficiently reduced. In the step of baking while supplying only, it is possible to reliably perform sintering of the ceramic element, and the present invention can be further made effective.

【0015】[0015]

【実施例】以下、本発明の実施例を示してその特徴とす
るところをさらに詳しく説明する。なお、この実施例で
は、積層セラミックコンデンサを製造する場合を例にと
って説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail. In this embodiment, a case where a multilayer ceramic capacitor is manufactured will be described as an example.

【0016】BaTiO3を主成分とする誘電体材料
(セラミック原料粉末)、バインダーであるPVB(ポ
リビニルブチラール)、トルエン/エタノ−ル混合溶
剤、及び各種添加材をボールミルを用いて攪拌、混合す
ることによりスラリーを作成した。
A dielectric material (ceramic raw material powder) mainly composed of BaTiO 3 , PVB (polyvinyl butyral) as a binder, a mixed solvent of toluene / ethanol, and various additives are stirred and mixed using a ball mill. To prepare a slurry.

【0017】そして、このスラリーを焼成後の厚みが1
2μmとなるようなシートに成形し、乾燥させた後、パ
ターン印刷によりニッケル電極(ペースト)を塗布し
た。
The slurry after firing has a thickness of 1
After forming into a sheet having a thickness of 2 μm and drying, a nickel electrode (paste) was applied by pattern printing.

【0018】それから、このシートを80〜90層積層
するとともに、その上下両面側にニッケル電極を塗布し
ていないダミーシートを積層し、圧着した後、カットし
て、焼成後の寸法が2.6mm(幅)×2.0mm(長さ)
×1.25mm(厚み)の個々のセラミック素子(グリー
ンチップ)を得た。
Then, while 80 to 90 layers of this sheet are laminated, a dummy sheet on which nickel electrodes are not applied is laminated on the upper and lower surfaces of the sheet, pressed, cut, and fired to have a dimension of 2.6 mm. (Width) x 2.0mm (length)
× 1.25 mm (thickness) of each ceramic element (green chip) was obtained.

【0019】そして、このセラミック素子を、空気中、
240℃で熱処理し、セラミック素子中のバインダーな
どの有機物を分解、除去(脱脂)した。なお、この脱脂
工程後のセラミック素子中の残留炭素は、約1.0重量
%であった。
Then, this ceramic element is placed in air,
Heat treatment was performed at 240 ° C. to decompose and remove (degrease) organic substances such as a binder in the ceramic element. The residual carbon in the ceramic element after the degreasing step was about 1.0% by weight.

【0020】このセラミック素子100g(含有炭素量
=1g)を、小型バッチ炉を用い、昇温速度100℃/
hで800℃まで昇温した後、昇温速度200℃/hで
800℃から1250℃まで範囲昇温し、その後125
0℃で2h保持してセラミック素子を焼結させた後、自
然冷却した。
Using a small batch furnace, 100 g of this ceramic element (carbon content = 1 g) was heated at a rate of 100 ° C. /
h, the temperature is raised from 800 ° C. to 1250 ° C. at a rate of 200 ° C./h.
After holding at 0 ° C. for 2 hours to sinter the ceramic element, it was naturally cooled.

【0021】なお、この焼成工程においては、窒素ガ
ス、水素ガス及び水蒸気を所定の割合で供給することに
より基本的な湿潤還元雰囲気を保持し、さらに、800
℃に達するまでは、湿潤還元雰囲気を保持するための水
(具体的には3.6g/min)とは別に、セラミック素
子中の残留炭素1モルに対して、1分間に3モル(具体
的には4.5g/min)の割合で水を供給しつつ昇温し
た。なお、このときの雰囲気中の水蒸気濃度は、約10
vol%であった。
In this firing step, a basic wet reducing atmosphere is maintained by supplying nitrogen gas, hydrogen gas and water vapor at a predetermined ratio.
Until the temperature reaches 0 ° C., apart from water (specifically, 3.6 g / min) for maintaining a moist reducing atmosphere, 3 moles per minute (specifically, 1 mole of residual carbon in the ceramic element) The temperature was raised while supplying water at a rate of 4.5 g / min. At this time, the concentration of water vapor in the atmosphere is about 10
vol%.

【0022】また、焼成工程の最高温度(1250℃)
での酸素分圧は10-12〜10-11MPaとした。
The maximum temperature of the firing step (1250 ° C.)
The oxygen partial pressure was 10 −12 to 10 −11 MPa.

【0023】なお、比較のため、焼成工程の全工程(8
00℃に達するまでの範囲も含む)で、湿潤還元雰囲気
を保持するための水(具体的には3.6g/min)のみ
を供給して焼成を行った。
For comparison, all of the firing steps (8
(Including the range up to 00 ° C.), and calcination was performed by supplying only water (specifically, 3.6 g / min) for maintaining the wet reducing atmosphere.

【0024】上記実施例及び比較例の各条件で焼成を行
った場合の、焼成温度が800℃に達するまでの、焼成
温度と雰囲気中のCO及びCO2濃度の関係を図1(実
施例)及び図2(比較例)に示す。
FIG. 1 (Example) shows the relationship between the firing temperature and the CO and CO 2 concentrations in the atmosphere until the firing temperature reaches 800 ° C. when firing was performed under the conditions of the above-described example and comparative example. And FIG. 2 (comparative example).

【0025】図2より、湿潤還元雰囲気を保持するため
の水のみを供給して焼成を行った比較例の場合には、8
00℃に達した時点でまだ雰囲気中のCO及びCO2
度が高く、残留炭素が十分に除去されていないことがわ
かる。
FIG. 2 shows that in the case of the comparative example in which the sintering was performed by supplying only water for maintaining the moist reducing atmosphere, 8
When the temperature reaches 00 ° C., the CO and CO 2 concentrations in the atmosphere are still high, indicating that the residual carbon has not been sufficiently removed.

【0026】これに対して、湿潤還元雰囲気を保持する
ための水とは別に、セラミック素子中の残留炭素1モル
に対して、1分間に3モルの割合で水を供給しつつ焼成
を行った実施例の場合、図1に示すように、800℃に
達した時点で、雰囲気中にCO及びCO2がほとんど認
められなくなっており(CO及びCO2はいずれも10p
pm以下)、残留炭素が十分に除去されていることがわか
る。
On the other hand, sintering was carried out while supplying water at a rate of 3 moles per minute to 1 mole of residual carbon in the ceramic element, separately from water for maintaining the wet reducing atmosphere. In the case of the embodiment, as shown in FIG. 1, when the temperature reached 800 ° C., almost no CO and CO 2 were recognized in the atmosphere (both CO and CO 2 were 10 p).
pm or less), it can be seen that the residual carbon has been sufficiently removed.

【0027】また、焼成後のセラミック素子(積層セラ
ミックコンデンサ素子)に端子電極を形成することによ
り得られた積層セラミックコンデンサについて、容量の
ばらつき、容量低下・容量不形成の発生の有無、絶縁抵
抗(logIR)、等価直列抵抗などの諸特性を測定し
た。その結果を表1に示す。
Further, with respect to the multilayer ceramic capacitor obtained by forming the terminal electrodes on the fired ceramic element (multilayer ceramic capacitor element), the variation in capacitance, the presence or absence of capacitance reduction / capacity formation, the insulation resistance ( Various characteristics such as logIR) and equivalent series resistance were measured. Table 1 shows the results.

【0028】[0028]

【表1】 [Table 1]

【0029】表1に示すように、実施例にかかる積層セ
ラミックコンデンサは、比較例のそれに比べて、容量の
ばらつきが小さく、高い絶縁性を有し、かつ等価直列抵
抗が小さいという良好な結果が得られており、また、容
量低下・容量不形成の発生も認められなかった。
As shown in Table 1, the multilayer ceramic capacitor according to the example has a good result that the variation in capacitance is small, the insulating property is high, and the equivalent series resistance is small as compared with the comparative example. In addition, no decrease in capacity or no capacity formation was observed.

【0030】このように、上記実施例で示したような条
件で焼成を行うことにより、内部電極切れによる容量低
下・容量不形成などが発生せず、しかも等価直列抵抗が
低く、高絶縁抵抗を有する被焼成物を得ることが可能に
なる。
As described above, by firing under the conditions shown in the above-described embodiment, a decrease in capacity and a lack of capacity due to cut-off of the internal electrode do not occur, and the equivalent series resistance is low and the high insulation resistance is low. It becomes possible to obtain the object to be fired.

【0031】なお、上記実施例では、湿潤還元雰囲気を
保持するための水分とは別に、脱脂工程終了時のセラミ
ック素子中の残留炭素量1モルに対して、1分間に3モ
ルの割合で水分を供給しながら800℃に達するまで焼
成を行った場合について説明したが、湿潤還元雰囲気を
保持するための水分とは別に供給する水分の割合は脱脂
工程終了時のセラミック素子中の残留炭素量1モルに対
して、1分間に3モル以上という条件を範囲において種
々に変化させることが可能である。但し、水分の供給割
合は、通常、脱脂工程終了時のセラミック素子中の残留
炭素量1モルに対して、1分間に3モル〜15モルの範
囲が好ましい。
In the above embodiment, apart from the water for maintaining the moist reducing atmosphere, the water was removed at a rate of 3 moles per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step. The case where baking was performed until the temperature reached 800 ° C. while supplying water was described. However, the ratio of water supplied separately from the water for maintaining the moist reducing atmosphere was determined by determining the amount of residual carbon in the ceramic element at the end of the degreasing step by 1 It is possible to variously change the condition of 3 moles or more per minute with respect to the mole within the range. However, the supply ratio of water is usually preferably in the range of 3 mol to 15 mol per minute with respect to 1 mol of residual carbon in the ceramic element at the end of the degreasing step.

【0032】ただし、湿潤還元雰囲気を保持するための
水分とは別に供給する水分の量は、雰囲気中の水蒸気濃
度とも関係することから、通常は、雰囲気中の水蒸気の
濃度を10〜25vol%の範囲に保持することが望まし
い。これは、水蒸気濃度が上記範囲を逸脱すると、場合
によっては、水性ガス反応の進行速度が低くなったり、
セラミック素子の焼結に悪影響を与えたりするためであ
る。
However, since the amount of water to be supplied separately from the water for maintaining the wet reducing atmosphere is also related to the water vapor concentration in the atmosphere, the water vapor concentration in the atmosphere is usually 10 to 25 vol%. It is desirable to keep within the range. This is because, if the water vapor concentration deviates from the above range, in some cases, the progress rate of the water gas reaction decreases,
This is because the sintering of the ceramic element is adversely affected.

【0033】また、上記実施例では、湿潤還元雰囲気を
保持するための水分とは別に、脱脂工程終了時のセラミ
ック素子中の残留炭素量1モルに対して、1分間に3モ
ルの割合で水分を供給しながら800℃に達するまで焼
成を行った場合について説明したが、湿潤還元雰囲気を
保持するための水分とは別に、本発明の所定の割合で水
分を供給しながら1000℃付近まで焼成し、その後湿
潤還元雰囲気を保持するための水分のみを供給しつつ焼
成することにより、さらに確実に残留炭素を除去し、良
好な焼成を行うことが可能になる場合もある。
Further, in the above embodiment, apart from the water for maintaining the moist reducing atmosphere, the water is retained at a rate of 3 moles per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step. Although the case where the baking was performed until the temperature reached 800 ° C. while supplying the water was described, separately from the water for maintaining the moist reducing atmosphere, the baking was performed to around 1000 ° C. while supplying the water at a predetermined ratio according to the present invention. After that, by performing calcination while supplying only moisture for maintaining a wet reducing atmosphere, residual carbon may be removed more reliably, and good calcination may be performed in some cases.

【0034】また、上記実施例では、BaTiO3系の
セラミックを用いたセラミック素子を焼成する場合を例
にとって説明したが、他の種類のセラミックを用いたセ
ラミック素子を焼成する場合(すなわち、他の種類のセ
ラミックを用いたセラミック電子部品を製造する場合)
にも本発明を適用することが可能であり、その場合にも
同様の効果を得ることが可能である。
Further, in the above embodiment, the case where the ceramic element using the BaTiO 3 ceramic is fired has been described as an example. However, the case where the ceramic element using another type of ceramic is fired (that is, other types of ceramic elements) is fired. When manufacturing ceramic electronic components using various types of ceramics)
The present invention can be applied to any of them, and in that case, the same effect can be obtained.

【0035】また、上記実施例では、積層セラミックコ
ンデンサを製造する場合を例にとって説明したが、本発
明は、積層セラミックコンデンサの製造方法に限定され
るものではなく、セラミックフィルタやセラミック多層
基板などの種々のセラミック電子部品を製造する場合に
適用することが可能である。
Further, in the above embodiment, the case of manufacturing a multilayer ceramic capacitor has been described as an example. However, the present invention is not limited to the method of manufacturing a multilayer ceramic capacitor. It can be applied to the case of manufacturing various ceramic electronic components.

【0036】本発明は、さらにその他の点においても上
記実施例に限定されるものではなく、セラミック素子の
具体的な構造、内部電極のパターン、脱脂工程の温度条
件、焼成工程の温度プロファイルなどに関し、発明の要
旨の範囲内において種々の応用、変形を加えることが可
能である。
The present invention is not limited to the above embodiment in other respects, but relates to the specific structure of the ceramic element, the pattern of the internal electrodes, the temperature conditions of the degreasing step, the temperature profile of the firing step, and the like. Various applications and modifications can be made within the scope of the invention.

【0037】[0037]

【発明の効果】上述のように、本発明のセラミック電子
部品の製造方法は、脱脂工程が終了した後の焼成工程に
おいて、湿潤還元雰囲気を保持するための水分とは別
に、脱脂工程終了時のセラミック素子中の残留炭素1モ
ルに対して、1分間に3モル以上の割合で水分を供給し
つつ所定の温度に達するまで焼成を行った後、湿潤還元
雰囲気保持用の水分のみを供給しつつ所定の温度プロフ
ァイルで焼成を行うようにしているので、セラミック素
子の焼結に悪影響を与えたりするようなことなく、セラ
ミック素子中に残留した炭素を効率よく減少させること
が可能になるとともに、セラミック素子の焼結を確実に
行わせることができるようになり、全体として、焼成の
効率を大幅に向上させることができるようになる。
As described above, in the method for manufacturing a ceramic electronic component of the present invention, in the firing step after the completion of the degreasing step, apart from the moisture for maintaining the wet reducing atmosphere, After sintering until a predetermined temperature is reached while supplying water at a rate of 3 mol or more per minute with respect to 1 mol of residual carbon in the ceramic element, while supplying only water for maintaining a wet reducing atmosphere, Since firing is performed at a predetermined temperature profile, it is possible to efficiently reduce carbon remaining in the ceramic element without adversely affecting the sintering of the ceramic element, The sintering of the element can be surely performed, and as a whole, the efficiency of firing can be greatly improved.

【0038】また、脱脂工程終了時のセラミック素子中
の残留炭素量1モルに対して、1分間に3モル以上の割
合で水分を供給しつつ焼成を行う際の雰囲気中の水分濃
度を10〜25vol%とすることにより、所定の湿潤還
元雰囲気を保ちつつ、セラミック素子中に残留した炭素
を効率よく減少させることが可能になり、本発明をより
実効あらしめることができる。
When the baking is performed while supplying water at a rate of 3 moles or more per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step, the atmosphere has a water concentration of 10 to 10 moles. By setting the volume to 25 vol%, it is possible to efficiently reduce the carbon remaining in the ceramic element while maintaining a predetermined wet reducing atmosphere, and the present invention can be made more effective.

【0039】さらに、脱脂工程の終了後に、脱脂工程終
了時のセラミック素子中の残留炭素量1モルに対して、
1分間に3モル以上の割合で水分を供給しながら少なく
とも800℃に達するまで焼成を行い、その後、湿潤還
元雰囲気保持用の水分のみを供給しつつ所定の温度プロ
ファイルで焼成を行うことにより、セラミック素子中に
残留した炭素をより確実に、しかも効率よく減少させる
ことが可能になるとともに、その後の湿潤還元雰囲気保
持用の水分のみを供給しつつ焼成する工程で、セラミッ
ク素子の焼結を確実に行わせることが可能になり、本発
明をさらに実効あらしめることができる。
Further, after the completion of the degreasing step, the amount of residual carbon in the ceramic element at the end of the degreasing step is 1 mol,
By sintering at a temperature of at least 800 ° C. while supplying water at a rate of 3 mol or more per minute, and then sintering with a predetermined temperature profile while supplying only water for maintaining a wet reducing atmosphere, ceramic The carbon remaining in the element can be reduced more reliably and efficiently, and the sintering of the ceramic element is ensured in the subsequent firing step while supplying only water for maintaining a wet reducing atmosphere. And the present invention can be made more effective.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例にかかるセラミック電子部品
の製造方法の焼成工程における、焼成温度と雰囲気中の
CO及びCO2濃度の関係を示す線図である。
FIG. 1 is a diagram showing the relationship between the firing temperature and the concentrations of CO and CO 2 in an atmosphere in a firing step of a method for manufacturing a ceramic electronic component according to one embodiment of the present invention.

【図2】比較例の焼成工程における、焼成温度と雰囲気
中のCO及びCO2濃度の関係を示す線図である。
FIG. 2 is a diagram showing a relationship between a firing temperature and concentrations of CO and CO 2 in an atmosphere in a firing step of a comparative example.

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セラミック素子を所定の条件で熱処理し
てセラミック素子中に含まれるバインダーなどの有機物
質を分解、除去する脱脂工程と、 前記脱脂工程の終了後に、セラミック素子を湿潤還元雰
囲気中で熱処理して焼結させる焼成工程であって、湿潤
還元雰囲気を保持するための水分とは別に、脱脂工程終
了時のセラミック素子中の残留炭素1モルに対して、1
分間に3モル以上の割合で水分を供給しつつ所定の温度
に達するまで焼成を行った後、湿潤還元雰囲気保持用の
水分のみを供給しつつ所定の温度プロファイルで焼成を
行う焼成工程とを含むことを特徴とするセラミック電子
部品の製造方法。
A degreasing step of heat-treating the ceramic element under predetermined conditions to decompose and remove an organic substance such as a binder contained in the ceramic element; and after the degreasing step, the ceramic element is placed in a moist reducing atmosphere. A sintering step of performing heat treatment and sintering, in addition to water for maintaining a moist reducing atmosphere, one mole of carbon remaining in the ceramic element at the end of the degreasing step;
Baking until a predetermined temperature is reached while supplying moisture at a rate of 3 moles or more per minute, and baking with a predetermined temperature profile while supplying only moisture for maintaining a wet reducing atmosphere. A method for manufacturing a ceramic electronic component, comprising:
【請求項2】 脱脂工程終了時のセラミック素子中の残
留炭素量1モルに対して、1分間に3モル以上の割合で
水分を供給しつつ焼成を行う際における雰囲気中の水分
濃度が10〜25vol%であることを特徴とする請求項
1記載のセラミック電子部品の製造方法。
2. The method according to claim 1, wherein the baking is performed while supplying water at a rate of 3 moles or more per minute with respect to 1 mole of the residual carbon in the ceramic element at the end of the degreasing step. 2. The method for producing a ceramic electronic component according to claim 1, wherein the content is 25 vol%.
【請求項3】 前記脱脂工程の終了後に、脱脂工程終了
時のセラミック素子中の残留炭素量1モルに対して、1
分間に3モル以上の割合で水分を供給しながら少なくと
も800℃に達するまで焼成を行い、その後、湿潤還元
雰囲気保持用の水分のみを供給しつつ所定の温度プロフ
ァイルで焼成を行うことを特徴とする請求項1又は2記
載のセラミック電子部品の製造方法。
3. After the completion of the degreasing step, the amount of residual carbon in the ceramic element at the end of the degreasing step is 1 mol.
Baking is performed until water reaches at least 800 ° C. while supplying water at a rate of 3 mols or more per minute, and then baking is performed with a predetermined temperature profile while supplying only water for maintaining a wet reducing atmosphere. A method for manufacturing a ceramic electronic component according to claim 1.
JP33987794A 1994-12-30 1994-12-30 Manufacturing method of ceramic electronic components Expired - Lifetime JP3250400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33987794A JP3250400B2 (en) 1994-12-30 1994-12-30 Manufacturing method of ceramic electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33987794A JP3250400B2 (en) 1994-12-30 1994-12-30 Manufacturing method of ceramic electronic components

Publications (2)

Publication Number Publication Date
JPH08186053A JPH08186053A (en) 1996-07-16
JP3250400B2 true JP3250400B2 (en) 2002-01-28

Family

ID=18331670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33987794A Expired - Lifetime JP3250400B2 (en) 1994-12-30 1994-12-30 Manufacturing method of ceramic electronic components

Country Status (1)

Country Link
JP (1) JP3250400B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7276130B2 (en) 2001-04-12 2007-10-02 Tdk Corporation Production method of multilayer ceramic electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7276130B2 (en) 2001-04-12 2007-10-02 Tdk Corporation Production method of multilayer ceramic electronic device

Also Published As

Publication number Publication date
JPH08186053A (en) 1996-07-16

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