JP3246929B2 - Matrix circuit board and display board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board for mounting electric components (hereinafter referred to as electric components) such as diodes, lamps and resistance elements on a matrix circuit board, for example, a diode driver for a dot matrix light emitting display. The present invention relates to a matrix circuit board and a display panel used when manufacturing the.

[0002]

2. Description of the Related Art In a matrix circuit board of this kind, as shown in FIG. 4, an anode or cathode wiring (hereinafter referred to as wiring) 12 and a cathode or anode wiring (hereinafter referred to as wiring) are provided on both the front and back surfaces of an insulating substrate 13. (Hereinafter referred to as wiring) 11
Is formed on the front surface of the insulating substrate 13 through the through-holes 8, and the wiring 12 formed on the back surface of the insulating substrate 13 is formed as a wiring 11 on the front surface of the insulating substrate 13. A circuit is formed by connecting to the separately formed surface conductive portion 10 and connecting electrical components to the surface electrode 9 and the surface conductive portion 10 thus formed.

[0003]

However, according to this type of matrix circuit configuration method, through-holes are used or three-dimensional wiring using a jumper chip or a printed conductor is used because wirings serving as conductive parts cross on a plane. Since it is necessary to perform the process, not only the process becomes complicated but also there is a problem in connection reliability and the like. The conductor used as a circuit usually has a thickness of 18 μm or 35 μm, so that the conductor resistance is large. If the circuit as the conductor is long, a voltage drop occurs due to a voltage drop, and as a result, for example, a light emitting diode (hereinafter referred to as an LED) has a luminance. Problems tend to occur.

Further, as a circuit board for through holes,
Since the glass fiber-containing epoxy resin substrate with poor thermal conductivity is mainly used as the insulating material, there is a problem that heat generated from the conductor circuit and the mounted electric components easily accumulates and malfunctions on the circuit occur. .

[0005]

According to the present invention, as a method for solving these problems, various studies have been made. As a result, at least three-dimensional wiring of metal conductor wires in various meshes in a state of being insulated in advance is achieved. A circuit can be formed on one plane, and by attaching a metal plate as a support plate, the heat generated from the electric components and the metal conductor wire circuit is quickly released, and at least the mesh-shaped three-dimensional wiring By removing the insulating portion of the metal conductor wire extending in two directions more than the pitch in advance and using it as a connection pin, there is an advantage that connection with the drive circuit becomes possible without using a through hole. The present invention has been completed.

That is, the present invention relates to a matrix circuit board having a metal conductor line exposed by removing a desired insulating portion when viewed in a plane of at least an insulated metal conductor line three-dimensionally wired in an alternating mesh pattern. A functional component having a matrix circuit in which electrical components are mounted on a matrix circuit board or a display board having LEDs mounted on a matrix circuit board, wherein the metal conductor wires in at least two directions of the mesh-like three-dimensional wiring are arranged at a mesh pitch or more. And a connection pin formed by removing an insulating portion of the metal conductor wire.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 (1) is a perspective view of a plain weave mesh-shaped three-dimensional wiring 14 in which the insulated metal conductor wires 1 covered with the insulating material of the present invention are alternately woven as warp and weft, and (2) is
The wiring 11 and the wiring 12 made of the insulated metal conductor wire 1 exposed when the plain woven mesh-shaped three-dimensional wiring 14 impregnated with the insulating agent 3 is viewed in a plane, and the wiring 11 and the wiring 12 are extended to form an insulating portion. FIG. 5 is a plan view showing a removed cathode or anode side connection pin (hereinafter referred to as a connection pin) 17 and an anode or cathode side connection pin (hereinafter referred to as a connection pin) 18.

Next, FIG. 2 (1) is a perspective view of a twill weave mesh-shaped three-dimensional wiring 15 obtained by changing the weaving of the insulated conductor wire 1 covered with the insulating material of the present invention as warp and weft. (2) Wirings 11 and 12, each composed of an insulated metal conductor wire 1 that is exposed when the twill weave mesh-shaped three-dimensional wiring 15 impregnated with the insulating agent 3 is viewed in a plane, the wiring 11 and the wiring 1
FIG. 4 is a plan view showing connection pins 17 and connection pins 18 obtained by extending insulating layers 2 and removing insulating portions.

FIG. 3 (1) shows a circuit board in which the gap between the plain weave mesh-shaped three-dimensional wirings 14 is impregnated with the insulating material 3 and simultaneously adhered to the support plate 2 to form a circuit board. When viewed in the plane of the wire 1, the insulating portions for mounting the electric components and the like of the wires 11 and 12 exposed on the surface are removed to expose the metal conductor wires, and the single-color LE is connected via solder.
FIG. 4 is a cross-sectional view of a display plate in which a D chip 4 is bonded to wirings 11 and 12.

[0010] Then, (2) shows the wiring 11 similarly exposed.
And removing the insulating portion which becomes the mounting of the electric component and the bonding pad of the wiring 12 and the bonding pad to expose the metal conductor wire.
The LED bare chip 6 is adhered to the wiring 1 via solder and the wiring 1
2 is a cross-sectional view of the semiconductor device connected to a bonding pad 5 provided on a wire 2 by a wire 7.

As the metal conductor wire used for the insulation-coated metal conductor wire 1 of the present invention, there is no particular limitation on the material as long as it has a small electric resistance, but a copper wire is suitable in terms of electric resistance and price. And the diameter of the metal conductor wire is not particularly limited, but it is better to make it thick to reduce the electric resistance, but if it is too thick it will be difficult to weave and the whole circuit will be large, so the thickness is 0.01mm to 5m in diameter
The range of m is good. Further, it may be a rectangular wire of 5 mm or less coated with insulation.

The insulating coating material may be any material having flexibility that can be woven at least alternately in a mesh form, and resins such as polyurethane, polyethylene, polypropylene, formal, and tetrafluoroethylene can be used. .

The weaving method of the mesh-shaped three-dimensional wiring of the present invention can be changed to a plain weave, a twill weave, or other weaving methods depending on the mounting position of the electric component on the circuit to form the mesh-shaped three-dimensional wiring. The metal conductor wires used as the warp and the weft may have the same or different wire diameters, and when weaving, one is a metal conductor wire and the other is an insulated metal conductor wire, or both are insulated metal conductor wires. It does not matter whether it is a conductor wire or not.

Next, the three-dimensional mesh wiring such as the plain weave mesh three-dimensional wiring 14 and the twill weave mesh three-dimensional wiring 15 used in the present invention is flexible, and is used as reinforcement. In this case, a resin filled with a filler having good thermal conductivity as an insulating agent 3 is poured into the gaps of the mesh-shaped three-dimensional wiring to be solidified, and heat is efficiently released from the electric components and the metal conductor circuit by the resin already filled. be able to.

As the resin used as the insulating agent 3, liquid thermosetting resins such as epoxy and phenol, and engineering plastics thermoplastic resins such as imide resin and silicone resin are used. As the filler, good heat conductivity is used. There is no particular limitation on the material, and fine powders of aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, silicon oxide, cordierite and the like are used.

In the exposed metal conductor wire of the present invention,
For example, the electrical components can be mounted in a simple process of applying a solder paste, mounting the electrical components, and performing solder reflow. At this time, treatments such as nickel plating and gold plating may be performed to increase the solder adhesion or to prevent corrosion of the metal conductor wires. Further, as the bonding pad 5 provided on the wiring 12, for example, gold plating, copper plating, and nickel plating are used.

Further, according to the present invention, the support plate 2
Is used, for example, aluminum, silicon steel, carbon steel, SUS, Invar, etc. are used to increase the heat transfer efficiency, and phenol resin, imide resin and A resin plate such as an epoxy resin may be used.

The matrix circuit board according to the present invention comprises a non-insulated metal conductor wire and an insulated metal at a desired position on one or both sides, which are exposed when viewed in the plane of, for example, a plain weave or twill weave mesh-like three-dimensional wiring. Polishing or grinding with a milling machine etc. to expose the metal conductor wires can be made by exposing the insulation material of the conductor wires, and when both metal conductor wires are covered with the insulation material, It can be manufactured by polishing or grinding an insulating material with a milling machine or the like to expose the metal conductor wires.

The circuit board can be reinforced by impregnating resin-like material into the gaps of the mesh-like three-dimensional wiring if necessary. At this time, a circuit board that can be used for various purposes can be produced by attaching a support plate. can do.

Next, the present invention provides a connecting pin 17 and a connecting pin 18 by providing a metal conductor wire from which an insulating layer is removed in at least two directions when a three-dimensional mesh wiring is provided. The pins 18 can be used for connecting a motherboard or a matrix circuit board for driving when electric components are mounted on the matrix circuit board.

As described above, according to the present invention, it is possible to easily manufacture a matrix circuit board by using various mesh-shaped three-dimensional wirings, to stabilize the supply voltage to metal conductor wires and electric components, The gap is impregnated with an insulating agent with good thermal conductivity to provide good heat dissipation from electrical components and metal conductor wire circuits, and to connect metal conductor wires that extend in at least two directions over the mesh pitch in alternate mesh three-dimensional wiring. By using them as pins for the matrix, it is possible to connect the matrix circuit boards with each other while keeping the motherboard for driving the LED and the LED dot interval constant.
An extremely reliable matrix circuit board can be easily manufactured. Further, when this matrix circuit board is used as an LED display, a housing or the like may be attached as needed.

As a method of using the matrix circuit board of the present invention utilizing these features, a target portion of a mounted functional component can be driven statically or dynamically. It can be used as a display board, and can be used as a board circuit for printing on thermal paper if a resistance element is mounted.

Further, the present invention will be specifically described with reference to examples. Example 1 A copper wire having a diameter of 0.5 mm is coated with a polyurethane resin to form an insulated metal conductor wire 1, and the conductor wire 1 is woven in a mesh at an interval of 2 mm to form a plain woven mesh three-dimensional wiring 14. Insulated metal conductor wire 1 on two sides adjacent to three-dimensional wiring 14
In a state where they do not intersect with each other.
The connecting pin 17 and the connecting pin 18 are extended from the 1.5 mm thick aluminum plate as the support plate 2 by 10 mm.
It was put in a state where it protruded. Next, a liquid epoxy resin filled with 50% by volume of alumina fine powder as an insulating agent 3 (Yukaka Shell Co., Ltd., Epicoat 807) is exposed to the extent that the surface of the three-dimensional wiring intersection of the insulated metal conductor wire 1 is exposed. The insulated metal conductor wire 1 exposed on the surface was polished with an abrasive until the copper wire was exposed to produce a matrix circuit board shown in FIG. 1 (2). Further, a monochromatic LED chip 4 for surface mounting (BR1101W manufactured by Stanley) is soldered to a necessary portion of the exposed copper wire of the matrix circuit board, and (1) in FIG.
The LED display panel shown in (1) was prepared, and the extended portion of the metal conductor wire was immersed in a solder bath (360 ° C., 2 minutes) to remove the insulating coating, and used as the connection pins 17 and 18. Connected to drive circuit.

Example 2 An LED display panel was manufactured in the same manner as in Example 1, except that one of the copper wires of the plain woven mesh-shaped three-dimensional wiring 14 was not covered.

EXAMPLE 3 A copper wire having a diameter of 0.3 mm was covered with a polyurethane resin to form an insulated metal conductor wire 1.
Plain weave mesh-like three-dimensional wiring 14 woven in a mesh at intervals,
The connecting pin 17 and the connecting pin 18 are extended by 10 mm without intersecting the two insulated metal conductor wires 1 on two adjacent sides of the mesh-shaped three-dimensional wiring 14.
A circuit board was manufactured by the same operation as in Example 1 below, with the connection pins 17 and the connection pins 18 protruding from the 5 mm thick aluminum plate. Next, the insulating coated metal conductor wire 1 exposed on the surface of the matrix circuit board is polished with an abrasive until the copper wire is exposed, and the exposed copper wire is nickel-plated, and further gold plated thereon. Then, a 300 μm square LED bare chip 6 was soldered to the wiring 11 on the plated portion, and a bonding pad 5 provided on the wiring 12 was wire-bonded to the bonding pad 5 as a wire 7 by a 50 μm gold wire, thereby forming (2) in FIG. 2) An LED display panel shown in FIG.

Example 4 A copper wire having a diameter of 0.5 mm is covered with a polyurethane resin to form an insulated metal conductor wire 1, and the conductor wire 1 is woven in a mesh pattern at 2 mm intervals to form a twill weave mesh-shaped three-dimensional wiring 15. Thereafter, a matrix circuit board shown in (2) of FIG. 2 was manufactured in the same manner as in Example 1. Further, a two-color LED chip 16 for surface mounting (BRPY1201W manufactured by Stanley Co.) was soldered to a necessary portion of the exposed copper wire of the matrix circuit board to produce an LED display panel.

Example 5 A liquid epoxy resin not filled with a filler was used as the insulating agent 3, and a 2.0 mm-thick phenol resin was used as the support plate 2.
An LED display plate was produced by the same operation as in Example 1 and Example 2 except that a metal plate was used.

EXAMPLE 6 A copper wire having a diameter of 0.5 mm is covered with a polyurethane resin to form an insulated metal conductor wire 1, and the conductor wire 1 is woven in a mesh at intervals of 2 mm to form a plain woven mesh three-dimensional wiring 14. Insulated metal conductor wire 1 on two sides adjacent to the mesh-shaped three-dimensional wiring 14
In a state where they do not intersect with each other.
And extended by 10 mm. Next, the connection pins 17 and the connection pins 18 of the plain weave mesh-shaped three-dimensional wiring 14 are turned upright, and a liquid epoxy resin filled with 50% by volume of alumina fine powder as an insulating agent 3 (Yuka Shell Co., Ltd .: product Name,
Epicoat 807) has connection pin 17 and connection pin 1
8 so that the surface of the three-dimensional wiring intersection portion is exposed and hardened so that the surface does not adhere to the portion of 8; the insulating-coated metal conductor wire 1 exposed on the surface is exposed with a polishing agent until the copper wire is exposed. The matrix circuit board shown in FIG. 1 (2) was manufactured by polishing. In addition, this matrix circuit board is a monochromatic LED for surface mounting
The chip 4 (BR1101W manufactured by Stanley) is soldered to produce an LED display panel shown in FIG. 3A, and the extended portion of the metal conductor wire is immersed in a solder bath (360 ° C., 2 minutes) in advance. The insulating coating was peeled off and used as connection pins 17 and connection pins 18 and connected to a drive circuit.

Example 7 A matrix circuit board shown in FIG. 1 (2) was prepared in the same manner as in Example 1, and a diode and a resistance element were mounted thereon to produce a functional component having a matrix circuit. Preliminary solder bath (360 ° C, 2 minutes)
And used as connection pins 17 and connection pins 18 and connected to a drive circuit.

Example 8 A copper wire having a diameter of 0.5 mm is covered with a polyurethane resin to form an insulated metal conductor wire 1, and the conductor wire 1 is woven in a mesh at intervals of 2 mm to form a twill weave mesh three-dimensional wiring 15. Thereafter, a matrix circuit board shown in (2) of FIG. 2 was manufactured in the same manner as in Example 1. Further, a diode or a resistance element is mounted on a necessary portion of the exposed copper wire of the circuit board to produce a functional component having a matrix circuit, and an extended portion of the metal conductor wire is previously connected to a solder bus (360 ° C., 2 ° C.). ), The insulating coating was peeled off, and used as connection pins 17 and connection pins 18 and connected to a drive circuit.

[0031]

As described above, according to the present invention, a matrix circuit board can be easily formed without a through-hole or the like, and the circuit board is impregnated with a filler to improve heat dissipation. Also, by increasing the diameter of the copper wire, which is a metal conductor wire, the electrical resistance can be made smaller than that of a commonly used copper foil circuit, so that, for example, as a matrix circuit for LED display, it is inexpensive, has a small variation in luminance, and has heat dissipation. A display panel having good printing properties and a printing board
It can also be used as a load circuit. Further, since the matrix circuit board of the present invention can be used as a connection pin by removing the insulating coating of a part extended without intersecting the metal conductor wire of the three-dimensional wiring, it can be used as a connection pin, without using a special connection part. In addition, there is an advantage that connection with a circuit board of another driving circuit or the like can be easily performed.

[Detailed description of drawings]

FIG. 1 (1) is a perspective view of a plain weave mesh-shaped three-dimensional wiring in which insulating-coated metal conductor wires are alternately woven, and FIG.
FIG. 4 is a plan view showing a wiring composed of each of the insulating-coated metal conductor wires and a connecting pin composed of an extended metal conductor wire, which are exposed when the plain weave mesh-shaped three-dimensional wiring is viewed in a plane.

FIG. 2 (1) is a perspective view of a twill weave mesh-shaped three-dimensional wiring woven by changing the weaving method of an insulated metal conductor wire;
(2) is a plan view showing a wiring composed of each of the insulated metal conductor wires and a connecting pin composed of an extended metal conductor wire that are exposed when the twill weave mesh-shaped three-dimensional wiring is viewed in a plane.

FIG. 3 (1) is a cross-sectional view when a surface mounting monochromatic LED chip is mounted on the surface of a matrix circuit board with a support plate, and FIG. 3 (2) is an LED bear chip on a similar circuit board. It is sectional drawing at the time of mounting.

FIG. 4 is a cross-sectional view illustrating a conventional display panel.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulated metal conductor wire 2 Support plate 3 Insulating agent 4 Monochromatic light emitting diode chip 5 Bonding pad 6 Light emitting diode bare chip 7 Wire 8 Through hole 9 Surface electrode 10 Surface conductive part 11 Cathode or anode side wiring 12 Anode Or cathode side wiring 13 insulating substrate 14 plain weave mesh three-dimensional wiring 15 twill weave mesh three-dimensional wiring 16 two-color light emitting diode chip 17 cathode or anode side connection pin 18 anode or cathode side connection pin

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-50-110295 (JP, A) JP-A-62-7189 (JP, A) JP-A-63-174216 (JP, A) JP-A 63-174216 318010 (JP, A) JP-A-58-132273 (JP, A) JP-A-53-57467 (JP, A) JP-A-1-319209 (JP, A) JP-A-2-278282 (JP, A) JP-A-63-286887 (JP, A) JP-A-2-115286 (JP, U) JP-A-64-12381 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G09F 9/00-9/40

Claims (7)

(57) [Claims] A matrix circuit formed by removing at least an insulating portion of a three-dimensional wiring intersection exposed on the surface of an insulated metal conductor wire three-dimensionally wired in an alternating mesh pattern to expose a metal conductor line. A matrix circuit board, wherein a metal conductor wire from which an insulating portion is removed is exposed as a connection pin in at least two directions on a side surface. 2. A matrix circuit board according to claim 1, wherein gaps between the mesh-shaped three-dimensional wirings of the matrix circuit board are impregnated with an insulating agent. 3. An insulating material filled with a filler having good thermal conductivity.
The matrix circuit board according to claim 2, wherein 4. A matrix circuit board obtained by sticking the matrix circuit board according to claim 1 to a support plate via an insulating material. 5. The support plate is made of aluminum, silicon steel, carbon steel,
The matrix according to claim 4, which is one of SUS and Invar.
Circuit board. 6. claimed in any one of claims 1 to 5
A matrix circuit board comprising electric components such as diodes, lamps or resistance elements mounted on the matrix circuit board. 7. The method according to claim 1, wherein
A display board having a light emitting diode mounted on a matrix circuit board.