JPH04290478A - Matrix circuit board, its manufacture and display board - Google Patents

Matrix circuit board, its manufacture and display board

Info

Publication number
JPH04290478A
JPH04290478A JP3078344A JP7834491A JPH04290478A JP H04290478 A JPH04290478 A JP H04290478A JP 3078344 A JP3078344 A JP 3078344A JP 7834491 A JP7834491 A JP 7834491A JP H04290478 A JPH04290478 A JP H04290478A
Authority
JP
Japan
Prior art keywords
wire
exposed
adhered
conductor lines
metallic conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3078344A
Inventor
Kazuo Kato
Hiroaki Sawa
Yoshihiro Yokoyama
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Priority to JP3078344A priority Critical patent/JPH04290478A/en
Publication of JPH04290478A publication Critical patent/JPH04290478A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PURPOSE:To form a circuit of at least one of planes by solid-wiring in various meshes with metallic conductor lines insulated in advance and to quickly emit generated heat by adhering a metallic plate as a supporting plate. CONSTITUTION:Slits in plainly woven mesh-like solid wires 14 are impregnated with an insulating material and also adhered with a hold plate 2 to provide a circuit board. An insulated part with electric parts such as a cathode wire 11 and an anode wire 12 mounted which is exposed on the surface is ground to have metallic conductor lines exposed, and a monochromatic light emission diode chip 4 is adhered to the cathode wire and the anode wire via solder. The insulated part which is similarly exposed which is used for mounting the cathode wire 11 and the anode wire 12 and to be a bonding pad is ground to have metallic conductor lines exposed, so that a light emission diode bear chip 6 is adhered to the cathode wire 11 via solder and connected to the bonding pad 5 with a wire 7.
JP3078344A 1991-03-19 1991-03-19 Matrix circuit board, its manufacture and display board Pending JPH04290478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3078344A JPH04290478A (en) 1991-03-19 1991-03-19 Matrix circuit board, its manufacture and display board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3078344A JPH04290478A (en) 1991-03-19 1991-03-19 Matrix circuit board, its manufacture and display board

Publications (1)

Publication Number Publication Date
JPH04290478A true JPH04290478A (en) 1992-10-15

Family

ID=13659372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3078344A Pending JPH04290478A (en) 1991-03-19 1991-03-19 Matrix circuit board, its manufacture and display board

Country Status (1)

Country Link
JP (1) JPH04290478A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105858B2 (en) * 2002-08-26 2006-09-12 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7138659B2 (en) 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7144748B2 (en) * 2002-08-26 2006-12-05 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7219715B2 (en) 2004-12-23 2007-05-22 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
JP2007266405A (en) * 2006-03-29 2007-10-11 Mitsubishi Materials Corp Method for joining substrate, and element using au-sn alloy solder paste
JP2007266404A (en) * 2006-03-29 2007-10-11 Mitsubishi Materials Corp Method for joining substrate, and element using au-sn alloy solder paste
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
FR2962593A1 (en) * 2010-07-06 2012-01-13 Commissariat Energie Atomique method of assembling a chip in a flexible substrate.

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105858B2 (en) * 2002-08-26 2006-09-12 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7144748B2 (en) * 2002-08-26 2006-12-05 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7138659B2 (en) 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7315049B2 (en) 2004-05-18 2008-01-01 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7219715B2 (en) 2004-12-23 2007-05-22 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
US7599626B2 (en) 2004-12-23 2009-10-06 Waytronx, Inc. Communication systems incorporating control meshes
US7694722B2 (en) 2004-12-23 2010-04-13 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
JP2007266404A (en) * 2006-03-29 2007-10-11 Mitsubishi Materials Corp Method for joining substrate, and element using au-sn alloy solder paste
JP2007266405A (en) * 2006-03-29 2007-10-11 Mitsubishi Materials Corp Method for joining substrate, and element using au-sn alloy solder paste
FR2962593A1 (en) * 2010-07-06 2012-01-13 Commissariat Energie Atomique method of assembling a chip in a flexible substrate.
WO2012007655A1 (en) * 2010-07-06 2012-01-19 Commissariat à l'Energie Atomique et aux Energies Alternatives Method for assembling a chip in a flexible substrate
US9179586B2 (en) 2010-07-06 2015-11-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for assembling a chip in a flexible substrate

Similar Documents

Publication Publication Date Title
US3612855A (en) Illuminated bus
US7745835B2 (en) Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
CA1182889A (en) Light emitting diode matrix
US4241277A (en) LED Display panel having bus conductors on flexible support
EP1965128B1 (en) Lighting apparatus with leds
JP4176979B2 (en) Flat panel display device
KR101124510B1 (en) Light-emitting diode
US6431728B1 (en) Multi-array LED warning lights
US20030072153A1 (en) Lighting apparatus with enhanced capability of heat dissipation
EP0434471B1 (en) Surface mounted led package
JP4688594B2 (en) Emitting light source, an illumination device and a display device
US7000999B2 (en) Light emitting module
US5942770A (en) Light-emitting diode chip component and a light-emitting device
US8596820B2 (en) LED unit and LED lighting lamp using the LED unit
US20040052077A1 (en) Light emitting diode with integrated heat dissipater
US4682269A (en) Heat dissipation for electronic components on a ceramic substrate
US20080067526A1 (en) Flexible circuits having improved reliability and thermal dissipation
JP3613041B2 (en) Emitting device and manufacturing method thereof
US7128442B2 (en) Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
TW408454B (en) Semiconductor device, semiconductor device board, manufacture of them, and electronic equipment
US20060197101A1 (en) Light source module of light emitting diode
KR20000047504A (en) Flat display device
SE355260B (en)
GB2424124A (en) LED mounting assembly
TW436997B (en) Ball grid array semiconductor package and method for making the same