JP3246048B2 - Chip component taping apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to testing the electrical characteristics and external appearance of the chip parts, taping the good only chips
TECHNICAL FIELD The present invention relates to an apparatus and a method for taping tape parts .

[0002]

2. Description of the Related Art A conventional chip component inspection and taping apparatus will be described with reference to FIG.

FIG. 6 is a perspective view showing the structure of a conventional chip component inspection and taping apparatus. In FIG. 6, 14 is a chip component, 15 is a parts feeder for supplying the chip component 14, 16 is a turntable, and 17 is a turntable. A plurality of chucks attached to the lower surface of the turntable 16 in a suspended state, 18 is an inspection unit for inspecting the electrical characteristics and appearance of the chip component 14, and 19 is a taping for taping the inspected chip component 14. Tape.

The conventional chip component inspection and taping apparatus configured as described above separates the chip components 14 sequentially supplied from the parts feeder 15 into chucks 17.
And then transported by rotation of the turntable 16 and inspected by the inspection unit 18.
Is rotated to insert the chip component 14 into the accommodating portion 19a formed on the taping tape 19 to which the bottom tape is stuck, thereby performing taping.

[0005]

However, in the above-mentioned conventional configuration, the chip components 14 sequentially supplied from the parts feeder 15 are inspected by tapping again with another component such as the chuck 17 before taping. ,
When the chip component 14 is miniaturized, the holding state by the chuck 17 becomes unstable, which hinders the inspection, and the apparatus becomes complicated and expensive.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a taping device for chip parts according to the present invention and a device therefor are provided.
The method comprises the steps of supplying a carrier tape for individually storing chip components, an insertion portion for storing chip components in a storage portion of the carrier tape supplied from the supply portion, and a chip component stored in the carrier tape. an inspection unit for inspecting, and retrieval unit for discharging the determined chip component to be defective in the inspection unit, a first conveying section which guides the portion removed carrier tape supplied from the supply unit, Arakajimeko
Slack the start end of the carrier tape
Approximately the same position as before the lap, just before the sag
At the same position as the buffer section that circulates back to
The first transporting is performed on the carrier tape after the return rotation.
A sorting unit for transferring <br/> the inspected chip parts conveyed carrier tape section and a second conveying unit that conveys the key <br/> Yariatepu the completion of this sorting, the carrier is obtained by a taping unit provided in the middle of the second transport unit in order to perform the sealing of the chip components stored in a tape, the arrangement comprising a winder for winding the key Yariatepu finishing the taping .

[0007]

With this configuration, a carrier tape is used to carry the chip parts, the chip parts are inspected in a state where the carrier parts are stored in the storage part of the carrier tape. It becomes possible to transfer to another storage part of the carrier tape.

As a result, it is possible to use the carrier tape, which is a taping material, for transporting chip components, and to tap only non-defective chip components without holding them on a separate component such as a chuck or a disk, and without missing teeth. As a result, stable inspection and taping of chip components can be performed with a simple configuration that does not waste work handling.

[0009]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the entire structure of a chip component inspection and taping apparatus according to the present invention, and FIG. 2 is a simplified front view of the main part of the apparatus. 1 and 2, reference numeral 1 denotes a supply reel for supplying a carrier tape 2, reference numeral 2 denotes a carrier tape wound around the supply reel 1, reference numeral 3 denotes an insertion portion for storing chip components in a storage portion of the carrier tape 2, and reference numeral 4 denotes A parts feeder for supplying chip parts to the insertion part 3, an electric inspection part for inspecting electric characteristics of the chip parts, an appearance inspection part for inspecting the same appearance, a take-out part for discharging defective products by the inspection, 8 is a take-out unit for taking out the carrier tape 2 supplied from the supply reel 1
A transfer section 9 for transferring non-defective chip components to the same carrier tape 2; and 9a, while applying a twist to make the carrier tape 2 provided in the transfer section 9 circulate. A buffer section for slackening, a second transport section for transporting the carrier tape 2 after transfer, and a supply section 11 for supplying a bottom seal tape for sealing the chip components stored in the carrier tape 2. Reel, 12 is a supply reel for supplying the top seal tape, 13a and 13b are taping sections for taping the carrier tape 2 using a bottom seal tape and a top seal tape, and 14 is a chip component.

The operation of the chip component inspection and taping apparatus of the present invention configured as described above will be described below.

In FIG. 2, first, a chip component 14 is inserted into the accommodating portion of the carrier tape 2 supplied from the supply reel 1 by the insertion section 3, and then the chip component 14 is inspected by the electrical inspection section 5 for electrical characteristics. The appearance inspection unit 6 inspects the appearance shape. Next, after the inspection of the electrical characteristics and the external shape has been completed, the chip component 14 determined to be defective is taken out by the take-out unit 7. As a result, only the non-defective chip components 14 are supplied to the transfer unit 9 which is the next step in a state where the chip parts are missing.

Next, the transfer unit 9 takes out and discharges the defective product, and transfers the carrier tape 2, which is stored and sent in a non-defective chip component 14, to the chip component 1.
In order for 4 to be housed in an aligned state without tooth loss,
After a predetermined amount of the empty carrier tape 2 containing no chip parts 14 is fed in advance, slacked and circulated around the buffer unit 9a, and guided to the lower side of the carrier tape 2 transported by the first transport unit 8. The carrier tape 2 after this rotation is transported by the second transport unit 10.

Accordingly, the state in which the carrier tape 2 after being circulated overlaps the carrier tape 2 conveyed by the first conveyance section 8 is as shown in FIGS. 3A and 3B, and the upper carrier tape 2 2, when the non-defective chip component 14 is sent, the chip component 14 is dropped and transferred to the lower carrier tape 2 after circling, and the upper carrier tape 2 is sent with a toothless state. At this time, the operation of the second transport unit 10 is stopped, and the upper carrier tape 2
Wait until a good chip component 14 is sent to the lower carrier tape 2
Is trying not to lose teeth.

The lower carrier tape 2 to which the non-defective chip component 14 has been transferred without missing the teeth is provided with a bottom seal tape taping section 13a provided in the second transport section 10 and a top seal tape taping section. Part 13b
As shown in FIG. 5 (a), the carrier tape 2 is taped from both upper and lower directions to perform taping, and then wound around a take-up reel (not shown).

The carrier tape 2 transported from the first transport section 8 to the second transport section 10 via the transfer section 9 is in a state in which the bottom seal tape is not attached, Since a guide (not shown) for guiding the carrier tape 2 is provided, the chip components 14 stored in the carrier tape 2 are conveyed in a stored state without falling. Further, a shutter (not shown) that opens and closes as necessary is provided in a place where the chip parts 14 need to be stored or transferred in the carrier tape 2.

At this time, the buffer section 9a is in a state in which the chip component 14 is not stored. In order to increase the buffer amount by the number of defects, a space considering the length of the buffer part 9a is secured. The rewinding or advancement is performed during the terminal processing of the completed taping take-up reel (not shown).

In the above embodiment, the carrier tape 2 for transporting and storing the chip parts 14 is described as a paper tape type. However, the present invention can be applied even if the carrier tape 2 is an emboss type. Hereinafter, the case where the embossed type carrier tape 2a is used will be described.

FIG. 4 shows the state of the embossed type carrier tape 2a in the transfer section 9 of the apparatus of the present invention. In FIG. 4, the arrow A indicates the direction of conveyance by the first conveyance section 8, and The carrier tape 2a conveyed as described above is transferred to the buffer section 9a as indicated by the arrow B in FIG.
(Not shown), and is guided to a position parallel to the carrier tape 2a before the rotation.
Is sent to a take-up reel (not shown) in the second transport section 10 as shown by.

Here, the transfer section 9 performs an operation of once picking up the chip components 14 stored in the carrier tape 2a sent by the first transport section 8, and transferring the chip parts 14 to the carrier tape 2a after the circulation. The carrier tape 2a in which the transfer is completed by the transfer unit 9 and the non-defective chip component 14 is in a state without missing teeth.
As shown in FIG. 5B, a tape is applied from above to the carrier tape 2a by a taping section 13b of a top seal tape provided in the second transport section 10 to perform taping. (Not shown).

The operation of the buffer section 9a when the embossed carrier tape 2a is used is the same as that when the paper tape type carrier tape 2 is used.

[0022]

As described above, the chip component according to the present invention is
In a taping apparatus and method , a buffer portion is provided on a carrier tape which is a material for taping a chip component.
Therefore, it is possible to use this carrier tape for transporting chip components and perform inspections within this carrier tape, which not only eliminates the need to re-hold chip components with chucks and disks as in the past, but also makes it easier. A taping device for arranging inexpensive chip components with a simple mechanism can be realized, and stable inspection and transport of chip components can be achieved.

When a paper tape type carrier tape is used as the carrier tape, the chip components can be transferred by operating the laminated carrier tape in the thickness direction, so that the moving stroke can be reduced and the production efficiency can be improved. It becomes possible.

The same effect can be obtained even when an emboss type carrier tape is used.

[Brief description of the drawings]

FIG. 1 is a view illustrating a tape component of a chip component according to an embodiment of the present invention ;
Perspective view showing an overall configuration of a grayed device

FIG. 2 is a front view of a main part of the apparatus according to the embodiment.

FIG. 3A is a perspective view of a main part showing a transfer operation of a paper tape type carrier tape, and FIG.

FIG. 4 is an essential part perspective view showing the transfer operation of an embossed type carrier tape.

5A is a perspective view of a main part showing a taping operation of a paper tape type carrier tape. FIG. 5B is a perspective view of a main part showing a taping operation of an emboss type carrier tape.

FIG. 6 is a perspective view showing a configuration of a conventional chip component taping apparatus .

[Description of Signs] 1 supply reel 2 carrier tape 3 insertion unit 4 parts feeder 5 electrical inspection unit 6 appearance inspection unit 7 take-out unit 8 first transport unit 9 transfer unit 9a buffer unit 10 second transport unit 11, 12 Supply reel 13a, 13b Taping unit 14 Chip component

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-16909 (JP, A) JP-A-6-278711 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B65B 15/04

Claims (2)

(57) [Claims] 1. A supply unit for supplying a carrier tape for individually storing chip components, an insertion unit for storing chip components in a storage unit for the carrier tape supplied from the supply unit,
An inspection unit for inspecting the chip components housed in the carrier tape, a removal unit for discharging the chip components determined to be defective by the inspection unit, and a first unit for guiding the carrier tape supplied from the supply unit to the removal unit and a transport unit, beforehand
Lag the start end side of the carrier tape empty.
And almost the same position as before the lap, just before the sagging part
Almost the same position as the buffer section that rotates back to the position
The first transport is carried on the carrier tape after the return to the
Inspection of the chip parts of the carrier tape transported by the sending unit
And a sorting unit for transferring, in order to perform a second conveying unit that conveys the <br/> carrier tape having been subjected to the sorting, the sealing of the chip components stored in the carry <br/> Atepu the a taping unit provided in the middle of the second transport unit, the chip component taping apparatus comprising a winding unit for winding the carrier tape after the taping. 2. A plurality of chip parts are stored in a toothless state.
Transporting the carrier tape, and removing the chip components
Beginning of the above carrier tape with empty status not stored
Sag the end and place it just before the slack
Around the starting end side of the carrier tape, a plurality of the
The above carrier table in which chip components are stored in a toothless state
A buffer section that is parallel to the
On the above carrier tape where parts are stored in a toothless state
The above-mentioned chip component is applied to the above-mentioned carrier tape having an empty state.
Transfer and tap so that they are aligned sequentially
And a taping method for a chip component.