JP3240877B2 - Injection compression molding equipment - Google Patents

Injection compression molding equipment

Info

Publication number
JP3240877B2
JP3240877B2 JP09112795A JP9112795A JP3240877B2 JP 3240877 B2 JP3240877 B2 JP 3240877B2 JP 09112795 A JP09112795 A JP 09112795A JP 9112795 A JP9112795 A JP 9112795A JP 3240877 B2 JP3240877 B2 JP 3240877B2
Authority
JP
Japan
Prior art keywords
cooling water
sprue
resin
cavity
molded plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP09112795A
Other languages
Japanese (ja)
Other versions
JPH08281737A (en
Inventor
敏裕 茅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP09112795A priority Critical patent/JP3240877B2/en
Publication of JPH08281737A publication Critical patent/JPH08281737A/en
Application granted granted Critical
Publication of JP3240877B2 publication Critical patent/JP3240877B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2642Heating or cooling means therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、光磁気ディスク等の樹
脂成形板を成形する射出圧縮成形装置に係わり、特に、
樹脂成形板の製造の高サイクル化を図ることができる射
出圧縮成形装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection compression molding apparatus for molding a resin molded plate such as a magneto-optical disk.
The present invention relates to an injection compression molding apparatus capable of achieving a high cycle of production of a resin molded plate.

【0002】[0002]

【従来の技術】光磁気ディスク等の樹脂成形板は、高精
度、高精密化を要求されるため、キャビティ内に充填さ
れた樹脂を強制的に加圧して、硬化時の樹脂のひけを防
止する射出圧縮成形装置を用いて射出成形されるのが一
般的である。
2. Description of the Related Art Since high precision and high precision are required for resin molded plates such as magneto-optical disks, the resin filled in the cavity is forcibly pressurized to prevent sink of the resin at the time of curing. In general, injection molding is performed using an injection compression molding apparatus.

【0003】この種の射出圧縮成形装置は、図2に示す
ように、樹脂成形板1用のキャビティC11を形成する
固定金型3及び可動金型4と、キャビティC11に樹脂
通路R11を介して樹脂を射出する射出ノズル6等の射
出手段と、キャビティC11に樹脂が充填された後に可
動金型4をキャビティC11側に微小移動させてキャビ
ティC11内の樹脂を強制的に加圧する図示しない油圧
シリンダとを基本構成としている。
As shown in FIG. 2, this type of injection compression molding apparatus includes a fixed mold 3 and a movable mold 4 which form a cavity C11 for a resin molded plate 1, and a cavity C11 through a resin passage R11. Injection means such as an injection nozzle 6 for injecting the resin, and a hydraulic cylinder (not shown) for forcibly pressing the resin in the cavity C11 by minutely moving the movable mold 4 toward the cavity C11 after the cavity C11 is filled with the resin. And the basic configuration.

【0004】また、そのような射出圧縮成形装置の内に
は、樹脂成形板1の硬化を速めてその製造の高サイクル
化を図る目的で、キャビティC11に形成された樹脂成
形板1又は樹脂通路R11に形成されたスプルー7を冷
却する冷却水流通路R12を設けたものが提案されてい
る。
Further, in such an injection compression molding apparatus, the resin molding plate 1 formed in the cavity C11 or the resin passage is formed for the purpose of accelerating the curing of the resin molding plate 1 and increasing the cycle of the production. A cooling water passage R12 for cooling the sprue 7 formed in R11 has been proposed.

【0005】[0005]

【発明が解決しようとする課題】しかし、そのような射
出圧縮成形装置では、キャビティC11に樹脂が充填さ
れた後に可動金型4をキャビティC11側に微小移動さ
せてキャビティC11内の樹脂を強制的に加圧し、冷却
水流通路R12に冷却水を流通させてスプルー7と樹脂
成形板1の硬化を行うときには、図3に示すようにスプ
ルー7の樹脂成形板1側の根元部7aの温度が、樹脂成
形板1の温度に比して高くなっている。よって、樹脂成
形板1の硬化に比して、スプルー7の根元部7aの硬化
が遅い。このように、樹脂成形板1とスプルー7の根元
部7aでは硬化進行具合のバランスが崩れているため、
成形サイクルを短縮するためには、スプルー固化時間の
短縮が課題となっていた。スプルー固化を速めるために
は、スプルー冷却用の冷却水流通路R12の水温を下げ
ることが考えられる。ところが、水温を下げると、その
温度の影響がスプルー7周辺の入れ子部品に及び、キャ
ビティC11表面の内周部と外周部に温度差が生じてし
まう。その結果、樹脂成形板1に内部歪みが生ずる。こ
のため、更なる高サイクル化を図ることは難しかった。
However, in such an injection compression molding apparatus, after the cavity C11 is filled with the resin, the movable mold 4 is slightly moved to the cavity C11 side to forcibly remove the resin in the cavity C11. When hardening of the sprue 7 and the resin molding plate 1 is performed by flowing the cooling water through the cooling water flow passage R12, the temperature of the root 7a of the sprue 7 on the resin molding plate 1 side as shown in FIG. The temperature is higher than the temperature of the resin molded plate 1. Accordingly, the hardening of the root portion 7a of the sprue 7 is slower than the hardening of the resin molded plate 1. As described above, the balance of the progress of the curing is lost at the base 7a of the resin molded plate 1 and the sprue 7.
In order to shorten the molding cycle, it has been an issue to shorten the sprue solidification time. To speed up sprue solidification, it is conceivable to lower the water temperature of the cooling water flow passage R12 for sprue cooling. However, when the water temperature is lowered, the temperature affects the nested components around the sprue 7 and a temperature difference occurs between the inner peripheral portion and the outer peripheral portion of the cavity C11 surface. As a result, internal distortion occurs in the resin molded plate 1. For this reason, it was difficult to further increase the cycle.

【0006】本発明は、上記事情に鑑み、樹脂成形板の
製造の更なる高サイクル化を図ることができる射出圧縮
成形装置を提供することを目的としている。
SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide an injection compression molding apparatus capable of further increasing the cycle of manufacturing a resin molded plate.

【0007】[0007]

【課題を解決するための手段】請求項1記載の射出圧縮
成形装置は、樹脂成形板用のキャビティを形成する金型
と、キャビティに樹脂通路を介して樹脂を射出する射出
手段と、キャビティに形成された樹脂成形板又は樹脂通
路に形成されたスプルーを冷却する冷却水流通手段とを
備える射出圧縮成形装置であって、冷却水流通手段が、
樹脂成形板を冷却する樹脂成形板用冷却水流通手段と、
スプルーを包囲する帯状に形成されてスプルーを冷却す
るスプルー用冷却水流通手段とからなり、スプルー用冷
却水流通手段は、樹脂成形板用冷却水流通手段の冷却水
より低い温度の冷却水を流通させ、スプルー用冷却水流
通手段の周囲には、スプルー用冷却水流通手段と樹脂成
形板との間を断熱する断熱手段としての断熱スリーブ
設けられていることを特徴とする。
According to the present invention, there is provided an injection compression molding apparatus, comprising: a mold for forming a cavity for a resin molding plate; an injection means for injecting a resin into the cavity through a resin passage; A cooling water flowing means for cooling the formed resin molded plate or sprue formed in the resin passage, the cooling water flowing means,
Cooling water distribution means for the resin molded plate for cooling the resin molded plate,
The sprue cooling water circulation means is formed in a band shape surrounding the sprue and cools the sprue. The sprue cooling water circulation means distributes cooling water having a lower temperature than the cooling water of the resin molding plate cooling water circulation means. It is allowed, on the periphery of the cooling water circulation means for sprue, characterized in that the insulating sleeve is provided as insulating means for thermally insulating between the cooling water circulation means and a resin molded plate for sprue.

【0008】[0008]

【作用】請求項1記載の射出圧縮成形装置によれば、ス
プルー用冷却水流通手段の周囲に、樹脂成形板に対して
断熱する断熱手段を設けたので、スプルー用冷却水流通
手段の冷却水により、樹脂成形板が冷却されることを防
止することができる。その上で、スプルー用冷却水流通
手段は、樹脂成形板用冷却水流通手段の冷却水より低い
温度の冷却水を流通させているので、樹脂成形板より高
温のスプルーの冷却、即ち、硬化の進行を速めることが
できる。これにより、樹脂成形板とスプルーとの硬化進
行具合の差異を低減することができる。
According to the injection compression molding apparatus of the first aspect, since the heat insulating means for insulating the resin molding plate is provided around the sprue cooling water flowing means, the cooling water of the sprue cooling water flowing means is provided. Thereby, it is possible to prevent the resin molded plate from being cooled. In addition, since the cooling water flowing means for the sprue circulates cooling water at a lower temperature than the cooling water of the cooling water flowing means for the resin molded plate, cooling of the sprue having a higher temperature than the resin molded plate, that is, curing You can speed up the process. Thereby, the difference in the degree of progress of curing between the resin molded plate and the sprue can be reduced.

【0009】[0009]

【実施例】以下、本発明の一実施例を図面に基づき説明
する。図1は本発明の射出圧縮成形装置100の一実施
例の要部を示す断面図であり、この射出圧縮成形装置1
00は、樹脂成形板として光ディスク1Aを射出成形す
る場合の実施例である。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a main part of one embodiment of an injection compression molding apparatus 100 according to the present invention.
00 is an embodiment in the case where the optical disk 1A is injection-molded as a resin molded plate.

【0010】射出圧縮成形装置100は、概して、固定
型部51と可動型部52からなる金型機構50と、射出
ノズル61から金型機構50に樹脂を射出する射出機構
60と、金型機構50の固定型部51に対する可動型部
52の型締め及び型開きを行う図示しない型締め機構と
からなっている。
The injection compression molding apparatus 100 generally includes a mold mechanism 50 including a fixed mold section 51 and a movable mold section 52, an injection mechanism 60 for injecting resin from the injection nozzle 61 to the mold mechanism 50, and a mold mechanism. It comprises a mold clamping mechanism (not shown) that performs mold clamping and mold opening of the movable mold section 52 with respect to the 50 fixed mold sections 51.

【0011】金型機構50の固定型部51は、図1上部
に配置された固定盤10を有しており、固定盤10の中
央部には、図1上下に貫通した嵌合孔11が形成されて
いる。嵌合孔11には、スプルーブッシュ12が嵌着さ
れており、スプルーブッシュ12の図1下部は、固定盤
10の図1下面より下方に突出している。スプルーブッ
シュ12の内部には、図1上下に樹脂通路R1が形成さ
れており、樹脂通路R1の下端には、放射方向に伸びる
ディスクゲートGが形成されている。スプルーブッシュ
12の図1上部には、射出装置60の射出ノズル61
が、樹脂通路R1の図1上端に連通するように設けられ
ている。
The fixed mold part 51 of the mold mechanism 50 has a fixed platen 10 arranged at the upper part of FIG. 1, and a fitting hole 11 penetrating vertically in FIG. Is formed. A sprue bush 12 is fitted in the fitting hole 11, and the lower part of FIG. 1 of the sprue bush 12 protrudes below the lower surface of the fixed platen 10 in FIG. Inside the sprue bush 12, resin passages R1 are formed at the top and bottom in FIG. 1, and at the lower end of the resin passage R1, a disk gate G extending in the radial direction is formed. In the upper part of the sprue bush 12 in FIG.
Is provided so as to communicate with the upper end of the resin passage R1 in FIG.

【0012】また、スプルーブッシュ12には、樹脂通
路R1の図1下部を包囲する帯状の冷却水流通路R2
と、冷却水流通路R2に摂氏30度から摂氏80度程度
の冷却水を供給する冷却水供給路R3と、冷却水流通路
R3から冷却水を排出する冷却水排出路R4とからなる
スプルー用冷却水流通手段が設けられている。
The sprue bush 12 has a belt-like cooling water flow passage R2 surrounding the lower portion of the resin passage R1 in FIG.
A cooling water supply path R3 for supplying cooling water of about 30 to 80 degrees Celsius to the cooling water flow path R2, and a cooling water discharge path R4 for discharging cooling water from the cooling water flow path R3. Distribution means are provided.

【0013】固定盤10の図1下面には、概略ドーナツ
円板状の固定金型20が、スプルーブッシュ12を挿通
嵌合させて取り付けられており、固定金型20のスプル
ーブッシュ12との嵌合部は、嵌合スリーブ21からな
っている。嵌合スリーブ21は、その内周面を形成する
断熱スリーブ21aを有しており、断熱スリーブ21a
は、例えば、主にポリイミド樹脂を成形して形成された
デュポン社製のベスペル等の耐熱性及び断熱効果の高い
材料からなっている。
On the lower surface of the fixed platen 10 in FIG. 1, a substantially donut disk-shaped fixed mold 20 is attached by inserting and fitting the sprue bush 12, and the fixed mold 20 is fitted to the sprue bush 12. The joint portion is formed of a fitting sleeve 21. The fitting sleeve 21 has a heat insulating sleeve 21a forming the inner peripheral surface thereof.
Is made of a material having high heat resistance and heat insulating effect, such as Vespel manufactured by DuPont, which is mainly formed by molding a polyimide resin.

【0014】固定金型20の図1下面側は、ドーナツ円
盤状の光ディスク1Aを形成するキャビティC1の図1
上面及び内周面を形成しており、固定金型20の図1上
部には、樹脂成形板用冷却水供給手段としての冷却水流
通路R6がキャビティC1に沿って多数配設されてお
り、この冷却水流通路R6には、摂氏100度から摂氏
120度程度の冷却水が流通される。
The lower surface of FIG. 1 of the fixed mold 20 is a cavity C1 forming a donut disk-shaped optical disk 1A.
An upper surface and an inner peripheral surface are formed, and a large number of cooling water flow passages R6 as cooling water supply means for a resin molded plate are provided along the cavity C1 in the upper portion of FIG. Cooling water of about 100 degrees Celsius to about 120 degrees Celsius flows through the cooling water flow passage R6.

【0015】固定金型20の周縁部には、図1下方に突
出した環状の嵌合凸部22が形成されており、嵌合凸部
22の外周面22aは、図1下方に向けてテーパーして
いる。
An annular fitting protrusion 22 protruding downward in FIG. 1 is formed on the periphery of the fixed mold 20. The outer peripheral surface 22a of the fitting protrusion 22 is tapered downward in FIG. are doing.

【0016】金型機構50の可動型部52は、図1下部
に配置された可動盤30を有しており、可動盤30に
は、概略筒状のハウジング31がその開口部31aを図
1上方に向けて設けられている。開口部31aの内周面
は、可動金型嵌合面31bと、その更に図1上端側で拡
径形成された固定金型嵌合面31cと、可動金型嵌合面
31bと固定金型嵌合面31cとの間をつなぐ段面31
dとを有している。固定金型嵌合面31cは、図1上方
に向けて末広がりに形成されており、固定金型嵌合面3
1cには、固定金型20の嵌合凸部22の外周面22a
が、そのテーパーにより固定金型20を調芯するように
嵌合している。また、固定金型20の嵌合凸部22の端
面22bは、ハウジング31の段面31dに底突きされ
ている。
The movable mold part 52 of the mold mechanism 50 has a movable plate 30 arranged at the lower part of FIG. 1, and the movable plate 30 has a substantially cylindrical housing 31 with an opening 31a in FIG. It is provided facing upward. The inner peripheral surface of the opening 31a has a movable mold fitting surface 31b, a fixed mold fitting surface 31c whose diameter is further increased at the upper end side in FIG. 1, a movable mold fitting surface 31b, and a fixed mold. Step surface 31 connecting between fitting surface 31c
d. The fixed mold fitting surface 31c is formed so as to expand toward the upper side in FIG.
1c has an outer peripheral surface 22a of the fitting projection 22 of the fixed mold 20.
However, the fixed die 20 is fitted so as to be centered by the taper. The end surface 22 b of the fitting projection 22 of the fixed mold 20 is projected downward from the step surface 31 d of the housing 31.

【0017】ハウジング31の開口端部31aの可動金
型嵌合面31bには、ドーナツ円板状の可動金型40の
外周面41の図1下端が、ハウジング31及び可動盤3
0に対して図1上下方向に微小移動自在に嵌合されてい
る。この可動金型40の外周面41とハウジング31の
固定金型嵌合面31bと段面31dとにより嵌合凹部5
2aが形成されている。
The lower end of FIG. 1 of the outer peripheral surface 41 of the movable mold 40 having a donut disk shape is provided on the movable mold fitting surface 31b of the open end 31a of the housing 31 with the housing 31 and the movable platen 3.
1 is fitted so as to be slightly movable vertically in FIG. The outer peripheral surface 41 of the movable mold 40, the fixed mold fitting surface 31 b of the housing 31, and the step surface 31 d form the fitting recess 5.
2a is formed.

【0018】可動金型40の上面は、ドーナツ円盤状の
光ディスク1Aを形成する前記キャビティC1の下面を
形成しており、可動金型40の上面には情報を転写する
図示しないスタンパが装着されている。可動金型40の
図1下部には、樹脂成形板用冷却水供給手段としての冷
却水流通路R7がキャビティC1に沿って多数配設され
ている。この冷却水流通路R7には、摂氏100度から
摂氏120度程度の冷却水が流通される。
The upper surface of the movable mold 40 forms the lower surface of the cavity C1 forming the donut disk-shaped optical disk 1A. A stamper (not shown) for transferring information is mounted on the upper surface of the movable mold 40. I have. In the lower part of FIG. 1 of the movable mold 40, a number of cooling water flow paths R7 as cooling water supply means for the resin molded plate are provided along the cavity C1. Cooling water of about 100 degrees Celsius to about 120 degrees Celsius flows through the cooling water flow passage R7.

【0019】可動金型40の内周部は、キャビティC1
で成形された光ディスク1Aを突き出す筒状のエジェク
タ42からなり、エジェクタ42の内部には、固定金型
20の嵌合スリーブ21内部に向けて移動駆動され、デ
ィスクゲートGを突き押して切断するゲートカット43
が内蔵されている。
The inner periphery of the movable mold 40 is provided with a cavity C1.
The ejector 42 includes a cylindrical ejector 42 for projecting the optical disc 1A. The ejector 42 has a gate cut that is driven toward the inside of the fitting sleeve 21 of the fixed mold 20 and pushes and cuts the disc gate G. 43
Is built-in.

【0020】射出圧縮成形装置100は以上のような構
成を有するので、まず、射出機構60の射出ノズル61
から樹脂通路R1及びディスクゲートGを介してキャビ
ティC1に樹脂を射出充填した後に、可動金型40を固
定金型20側に微小移動させ、充填された樹脂を強制的
に加圧することにより、硬化時の樹脂のひけを防止する
と共に密度分布の均一化を図ることができる。これによ
り、光ディスク1Aの低歪み化、スタンパからの転写性
の向上、複屈折を含む光学特性の向上等を図ることがで
きる。即ち、高精度、高精密の光ディスク1Aを成形す
ることができる。
Since the injection compression molding apparatus 100 has the above configuration, first, the injection nozzle 61 of the injection mechanism 60
After the resin is injected and filled into the cavity C1 through the resin passage R1 and the disk gate G, the movable mold 40 is minutely moved to the fixed mold 20 side, and the filled resin is forcibly pressed to cure. In this case, it is possible to prevent sinking of the resin at the time and to make the density distribution uniform. Thereby, the distortion of the optical disk 1A can be reduced, the transferability from the stamper can be improved, and the optical characteristics including birefringence can be improved. That is, the optical disc 1A with high precision and high precision can be formed.

【0021】次に、キャビティC1内の光ディスク1A
及び樹脂通路R1のスプルー7Aの硬化過程において
は、スプルー7Aの周囲に設けられた冷却水流通路R2
に摂氏30度から摂氏80度程度の冷却水を流通させ
て、樹脂の射出圧縮直後ではキャビティC1内の光ディ
スク1Aより高温且つ厚肉のスプルー7Aの、特に根元
部を急速に冷却し、固定金型20及び可動金型40に設
けられた冷却水流通路R6、R7に摂氏100度から摂
氏120度程度の冷却水を流通させて、スプルー7Aに
比して高い温度でキャビティC1内の光ディスク1Aを
冷却する。この際、スプルー7Aが形成されたスプルー
ブッシュ12に嵌合した嵌合スリーブ21の内周面に断
熱スリーブ21aを設けたので、冷却水流通路R2に流
通される低温の冷却水により、キャビティC1内の光デ
ィスク1A内周側の急速冷却は防止される。
Next, the optical disk 1A in the cavity C1
During the curing process of the sprue 7A of the resin passage R1, the cooling water flow passage R2 provided around the sprue 7A
Cooling water of about 30 ° C. to about 80 ° C. is flowed through the sprue 7A, which is higher in temperature and thicker than the optical disc 1A in the cavity C1, especially at the root portion, immediately after the resin is injected and compressed. Cooling water of about 100 degrees Celsius to about 120 degrees Celsius flows through cooling water flow paths R6 and R7 provided in the mold 20 and the movable mold 40, and the optical disc 1A in the cavity C1 is heated at a higher temperature than the sprue 7A. Cooling. At this time, since the heat insulating sleeve 21a is provided on the inner peripheral surface of the fitting sleeve 21 fitted to the sprue bush 12 in which the sprue 7A is formed, the low-temperature cooling water flowing through the cooling water flow passage R2 allows the inside of the cavity C1 to be cooled. Rapid cooling of the inner circumference of the optical disc 1A is prevented.

【0022】従って、キャビティC1内の光ディスク1
Aに比して、この光ディスク1Aより高温且つ厚肉のス
プルー7Aの冷却、即ち、硬化の進行を速めることがで
きるので、光ディスク1Aとスプルー7Aとの硬化進行
具合の差異を低減することができる。これにより、光デ
ィスク1Aの冷却を、従来に比して急速に行っても、内
部歪みは低く抑えられるため、急速な硬化が可能とな
る。よって、光ディスク1Aの製造の更なる高サイクル
化を図ることができる。
Therefore, the optical disk 1 in the cavity C1
As compared with A, the cooling of the sprue 7A, which is higher in temperature and thicker than the optical disc 1A, that is, the progress of curing can be accelerated, so that the difference in the degree of curing progress between the optical disc 1A and the sprue 7A can be reduced. . Thus, even if the optical disk 1A is cooled more rapidly than in the past, the internal distortion can be kept low, and rapid hardening becomes possible. Therefore, it is possible to further increase the cycle of manufacturing the optical disc 1A.

【0023】尚、上記実施例においては、断熱手段とし
、断熱スリーブ21aを、例えば、主にポリイミド樹
脂を成形して形成されたデュポン社製のベスペル等の耐
熱性及び断熱効果の高い材料から形成したが、スリーブ
状の空気層を設ける構成としてもよい。
In the above embodiment, as the heat insulating means , the heat insulating sleeve 21a is mainly made of, for example, a polyimide resin.
Of DuPont Vespel etc.
Made of high heat and heat insulating material, but with sleeve
It is good also as a structure which provides an air layer of a shape .

【0024】また、上記実施例では、光ディスク1Aを
製造する射出圧縮成形装置100の場合について説明し
たが、他の光磁気ディスクやプラスチックレンズ等を製
造する射出圧縮成形装置であってもよいことは勿論であ
る。
In the above embodiment, the injection compression molding apparatus 100 for producing the optical disk 1A has been described. However, the injection compression molding apparatus for producing other magneto-optical disks, plastic lenses and the like may be used. Of course.

【0025】[0025]

【発明の効果】請求項1記載の射出圧縮成形装置によれ
ば、樹脂成形板とスプルーとの硬化進行具合の差異を低
減することができ、樹脂成形板は全面均一な冷却が可能
となるので、従来に比して、急速な冷却を行っても、樹
脂成形板の内部歪みの発生を防止することができる。よ
って、樹脂成形板の製造の更なる高サイクル化を図るこ
とができる。
According to the injection compression molding apparatus of the first aspect, it is possible to reduce the difference in the degree of curing progress between the resin molded plate and the sprue, and the resin molded plate can be uniformly cooled over the entire surface. Further, even when cooling is performed more rapidly than in the conventional case, it is possible to prevent internal distortion of the resin molded plate. Therefore, it is possible to further increase the cycle of manufacturing the resin molded plate.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の射出圧縮成形装置の要部を示す断面
図である。
FIG. 1 is a sectional view showing a main part of an injection compression molding apparatus according to the present invention.

【図2】 従来の射出圧縮成形装置の一例を示す図であ
る。
FIG. 2 is a view showing an example of a conventional injection compression molding apparatus.

【図3】 硬化時の樹脂成形板とスプルーの温度分布を
示す図である。
FIG. 3 is a diagram showing a temperature distribution of a resin molded plate and a sprue during curing.

【符号の説明】[Explanation of symbols]

1A…光ディスク(樹脂成形板) 7A…スプルー 20…固定金型(金型) 21a…断熱スリーブ(断熱手段) 40…可動金型(金型) 60…射出機構(射出手段) C1…キャビティ R1…樹脂通路 R2…冷却水流通路(冷却水流通手段、スプルー用冷却
水流通手段) R3…冷却水供給路(冷却水流通手段、スプルー用冷却
水流通手段) R4…冷却水排出路(冷却水流通手段、スプルー用冷却
水流通手段) R6…冷却水流通路(冷却水流通手段、樹脂成形板用冷
却水流通手段) R7…冷却水流通路(冷却水流通手段、樹脂成形板用冷
却水流通手段)
1A ... Optical disk (resin molded plate) 7A ... Sprue 20 ... Fixed die (die) 21a ... Heat insulation sleeve (heat insulation means) 40 ... Movable die (die) 60 ... Injection mechanism (injection means) C1 ... Cavity R1 ... Resin passage R2: cooling water flow passage (cooling water distribution means, cooling water distribution means for sprue) R3: cooling water supply path (cooling water distribution means, cooling water distribution means for sprue) R4: cooling water discharge path (cooling water distribution means) R6: Cooling water flow path (cooling water flow means, cooling water flow means for resin molding plate) R7: Cooling water flow path (cooling water flow means, cooling water flow means for resin forming plate)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 樹脂成形板用のキャビティを形成する金
型と、前記キャビティに樹脂通路を介して樹脂を射出す
る射出手段と、前記キャビティに形成された樹脂成形板
又は前記樹脂通路に形成されたスプルーを冷却する冷却
水流通手段とを備える射出圧縮成形装置であって、 前記冷却水流通手段が、前記樹脂成形板を冷却する樹脂
成形板用冷却水流通手段と、前記スプルーを包囲する帯
状に形成されて前記スプルーを冷却するスプルー用冷却
水流通手段とからなり、 前記スプルー用冷却水流通手段は、前記樹脂成形板用冷
却水流通手段の冷却水より低い温度の冷却水を流通さ
せ、 前記スプルー用冷却水流通手段の周囲には、該スプルー
用冷却水流通手段と前記樹脂成形板との間を断熱する断
熱手段としての断熱スリーブが設けられていることを特
徴とする射出圧縮成形装置。
1. A mold for forming a cavity for a resin molded plate, an injection means for injecting a resin into the cavity via a resin passage, and a resin molded plate formed in the cavity or formed in the resin passage. A cooling water flowing means for cooling the sprue, wherein the cooling water flowing means is a resin-molded plate cooling water flowing means for cooling the resin molded plate, and a belt-like shape surrounding the sprue. The sprue cooling water circulation means is formed to cool the sprue, the sprue cooling water circulation means, the cooling water of the resin molding plate cooling water circulation means lower temperature of the cooling water flow, Around the sprue cooling water flow means, the sprue
An injection compression molding apparatus , wherein a heat insulating sleeve is provided as a heat insulating means for insulating between a cooling water flowing means for use and the resin molding plate.
JP09112795A 1995-04-17 1995-04-17 Injection compression molding equipment Expired - Fee Related JP3240877B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09112795A JP3240877B2 (en) 1995-04-17 1995-04-17 Injection compression molding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09112795A JP3240877B2 (en) 1995-04-17 1995-04-17 Injection compression molding equipment

Publications (2)

Publication Number Publication Date
JPH08281737A JPH08281737A (en) 1996-10-29
JP3240877B2 true JP3240877B2 (en) 2001-12-25

Family

ID=14017874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09112795A Expired - Fee Related JP3240877B2 (en) 1995-04-17 1995-04-17 Injection compression molding equipment

Country Status (1)

Country Link
JP (1) JP3240877B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103836A (en) * 2021-01-15 2022-07-25 주식회사 세코닉스 Lens-molding structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001269966A (en) * 2000-03-24 2001-10-02 Pioneer Electronic Corp Mold for injection molding of disk substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220103836A (en) * 2021-01-15 2022-07-25 주식회사 세코닉스 Lens-molding structure
KR102458513B1 (en) * 2021-01-15 2022-10-26 주식회사 세코닉스 Lens-molding structure

Also Published As

Publication number Publication date
JPH08281737A (en) 1996-10-29

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