JP3236949B2 - Manufacturing method of chip-shaped electronic component substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-shaped electronic component substrate for producing an electronic component substrate such as an inductor, a resistor and a capacitor or an array thereof, and a filter.

[0002]

2. Description of the Related Art Heretofore, for example, there has been proposed a small chip-shaped electronic component in which a plurality of linear or coil-shaped conductive wires or resistance wires are built in a sintered body of magnetic, dielectric or insulating or low dielectric properties. ing.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an electronic component base which can mass-produce the above-mentioned conventional chip-shaped electronic component at low cost.

[0004]

The present invention SUMMARY OF], in order to solve the above problem, as described in claim 1, insulating or
An extruder for kneading the low-dielectric raw material powder and the binder to form a plurality of rod-shaped compacts having a rectangular cross section made of a kneaded material containing a linear or coiled resistance wire is formed by an extruder for delivering a kneaded material. Bonding the rod-shaped formed body to each other on its side surface, then firing, and cutting the fired shaped body along its length to produce a plurality of electronic component bases ;
As described in Item 2, kneading the dielectric raw material powder and the binder
Straight or coiled by an extruder that feeds the mixed material
Rods with a square cross section made of kneading material with a built-in conductor
A plurality of rod-shaped molded bodies are formed on a side surface thereof.
And joined together, then fired, and the fired compact is
Cuts along the length of a piece to produce multiple electronic component bodies
And binding with the magnetic raw material powder as described in claim 3.
The extruder that sends out the kneaded material obtained by kneading the mixture is directly
Cross section made of kneading material with a built-in linear or coiled conductor
Forming a plurality of rectangular rod-shaped compacts and dielectric raw material powder
To an extruder that sends out a kneaded material obtained by kneading powder and binder.
Made of kneading material with a more straight or coiled conductor
Forming a plurality of rod-shaped molded bodies having a rectangular cross section
Rod-shaped moldings in combination and
And then fired, and the fired compact in the length direction
Cut along to produce multiple electronic component substrates,
As described in claim 4, an insulating or low dielectric material powder
An extruder that delivers a kneaded material obtained by kneading the binder and the binder
Made of a kneading material with a built-in linear or coiled resistance wire.
Forming multiple rod-shaped compacts with rectangular cross sections
Extrusion forming to deliver a kneaded material obtained by kneading raw material powder and binder
A kneading material that incorporates a straight or coiled conductor depending on the shaper
And forming a plurality of rod-shaped molded bodies having a rectangular cross-section
Types of rod-shaped compacts are combined and
And then fired, and the fired compact is
Cutting a plurality of electronic component substrates along the direction . At the time of joining a plurality of rod-shaped moldings, a joining material is applied to the side surface, or a solvent for the binding material is applied. At the time of joining the plurality of rod-shaped molded bodies, the rod-shaped molded bodies can be subjected to at least one of heating, heating / pressurizing, or pressurizing / vibrating. A heat-softening binder may be used as the binder contained in the kneading material. It is preferable to perform at least one of the vibrations, and at this time, the solvent of the bonding material or the binding material does not have to be applied to the side surface of the rod-shaped molded body.

In the case of an inductor or an inductor array, each of the plurality of rod-shaped molded bodies is a rod-shaped molded body made of a kneaded material obtained by kneading a magnetic raw material powder and a binder and having a linear or coil-shaped conductive wire built therein. In the case of a resistor or a resistor array, each is a rod-shaped molded body made of a kneaded material obtained by kneading an insulating or low-dielectric raw material powder and a binder, and having a linear or coil-shaped resistance wire built therein. -In the case of an array, each is a rod-shaped molded body made of a kneaded material obtained by kneading a dielectric raw material powder and a binder, and has a built-in linear or coiled conductive wire. A rod-shaped molded body composed of a kneaded material obtained by kneading a magnetic raw material powder and a binder, and having a linear or coiled conductive wire, or a kneaded material obtained by kneading a dielectric raw material powder and a binder. A straight or a combination of the rod shaped molded body incorporating a coiled conductive wire made, if the resistance and a composite component comprising a capacitor is a combination of the rod shaped molded body of the rod shaped molded body and the capacitor resistor. In the case of an inductor array, a plurality of rod-shaped compacts of the inductor or the inductor array described above are kneaded with magnetic material powder or non-magnetic material powder having a lower magnetic permeability than the magnetic material powder of the compact on a side surface thereof and a binder. It is preferable to form a molded body by interposing a thin plate-shaped molded body made of the kneaded material and joining them together.

According to the method for manufacturing a chip-shaped electronic component substrate according to any one of claims 1 to 4 , extrusion molding for feeding a kneaded material obtained by kneading a magnetic, dielectric or insulating or low-dielectric raw material powder and a binder. Forming a plurality of rod-shaped moldings having a rectangular cross section made of a kneading material containing a linear or coil-shaped conductive wire or resistance wire by a machine, joining the plurality of rod-shaped moldings to each other on their side surfaces, and then firing and firing. Since the plurality of electronic component bases are manufactured by cutting the formed body along the length direction, the plurality of electronic component bases can be mass-produced at low cost. When at least one of heating, heating / pressurizing, or pressurizing / vibration is performed at the time of joining the plurality of rod-shaped compacts, the joining force between the compacts increases. When a heat-softening binder is used as the bonding material, and at least one of heating, heating / pressing, and pressing / vibration is performed at the time of joining the plurality of rod-shaped molded bodies, a solvent for the joining material or the binding material is used. Since it is possible to perform the joining without using the material, the number of steps can be reduced and the material can be saved. The plurality of rod-shaped compacts are provided with a thin plate-shaped compact made of a kneaded material obtained by kneading a magnetic raw material powder or a non-magnetic raw material powder having a lower magnetic permeability than the magnetic raw material powder of the rod-shaped molded body and a binder on the side surfaces thereof. When a plurality of electronic component substrates manufactured by cutting the fired molded body along the length direction and then firing the formed body are used as an inductor array, the inductors interfere with each other. Since it is no longer necessary, it can be formed in a small size.

[0007]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of a chip inductor.

[0009] In the figure, 1 is a magnetic core made of ferrite having a rectangular parallelepiped shape, including, for example, four linear conductors 2 _1, 2 _2, 2 _3, 2 ₄ are arranged in parallel at predetermined intervals embedded Te, conductor lines 2 ₁ and 2 ₂ of the terminal by the connection electrodes 3 ₁ formed on the rear surface of the magnetic core 1, conductor 2 ₂ and 2 ₃ of the connection electrodes 3 the terminal is formed on the front surface of the magnetic core 1 the _2, terminal conductors 2 ₃ and 2 ₄ are these conductors _{21 to 24} are connected respectively by the connection electrodes 3 ₃ formed on the rear surface of the magnetic core 1 are connected in series, linear conductors 2 at both ends ₁ ,
2 ₄ terminals is connected to the external electrodes 4 ₁ and 4 ₂ formed on the left and right end surfaces of the magnetic core 1. According to this inductor configuration, the linear conductors 2 ₁ , 2 ₂ , 2 ₃ , and 2 ₄ are all embedded in the magnetic core 1, and the magnetic flux generated by the long conductor flows into the magnetic core 1 and leaks to the outside. Therefore, a small inductor having a large impedance can be obtained.

Next, a method of manufacturing an electronic component substrate according to the present invention applied to the inductor will be described.

As shown in FIG. 2, a long linear conducting wire 5 is inserted into a through hole 7 of an extruder 6, and a magnetic material powder B and a binder S composed of water or alcohol and glycerin / methyl cellulose are kneaded. When the kneaded material 9 uniformly kneaded by the machine 8 is fed into the extruder 6 under pressure, a rectangular cross-section jacket made of the kneaded material 9 surrounding the conducting wire 5 is formed from the die die having a square cross-section. The molded body 10 is sent out. After the molded body 10 is dried, it is cut along the length direction of the molded body 10 according to the size of the firing furnace or the shape of the setter to be laid below, to obtain a rod-shaped molded body 11. As shown in FIG. 3A, a plurality of, for example, four bar-shaped molded bodies 11 are formed,
A bonding material composed of water or alcohol and glycerin / methylcellulose is applied to the bonding surfaces 12 of the four rod-shaped molded bodies 11 in the form of a mist, applied by a brush or a brush, applied by a stencil printing method, and immersed by a dipping method. FIG. 3 (B)
As shown in the figure, the four rod-shaped molded bodies 11 are
In step 2, they are brought into contact with each other and joined by pressing. After that, baking is performed at 600 to 1000 ° C., for example, 900 ° C., and FIG.
As shown in FIG. 3C, cut with a cutter according to the size of each inductor. Each of the cut individual inductor bodies 13 is barrel-polished with barrel powder and water, and the corners are rounded. Then, as shown in FIG. 1, a silver paste composed of a silver powder and a solvent is applied to the front and rear surfaces and both left and right surfaces of the magnetic core 1 of the inductor base 13 and baked to form connection electrodes 3 ₁ , 3 ₂ , 3. ₃ and external electrodes 4 ₁ and 4 ₂ are formed. Thus, the linear conductors 2 ₁ 4 of the inductance matrix 13, ₂ 2, 2 _3, 2 ₄ are connected are connected in series to the external electrodes 4 _1, 4 _2. Nickel plating and solder plating are applied on the silver layers of the external electrodes 4 ₁ and 4 ₂ .

FIG. 4 shows an example of an inductor array.

[0013] This is connected to the inductor to the front and rear surfaces of the magnetic core 1 of the matrix 13, each exposed linear conductors 2 _1, 2 _2, 2 _3, 2 ₄ of the terminal shown in FIG. 3 (C) External electrodes 4 ₁ , 4 ₂ , 4 ₃ , 4 ₄ are formed.

According to the structure of the inductor array,
The linear conductors 2 ₁ , 2 ₂ , 2 ₃ , 2 ₄ are all magnetic cores 1
The embedded, conductor lines 2 _1, 2 _2, 2 _3, magnetic flux generated by the two ₄ to flow into the magnetic core 1, since there is no leak to the outside, each conductor _{21 to 24} of the impedance is large, a small Is obtained.

The rod-shaped molded body 11 was produced by the extrusion molding machine 6 shown in FIG. 2, but was formed by using an extrusion molding machine having a plurality of die and a plurality of through holes through which a long conductive wire is inserted. The rod-shaped molded bodies 11 can be simultaneously formed.

FIG. 5 shows another example of the inductor array shown in FIG.

The magnetic core 1 of this inductor array is
Between the magnetic core portions of the inductors, for example, a magnetic permeability (μ: lower than that of the main component) lower than a magnetic permeability (μ: 800) of a Ni—Zn-based magnetic material whose main component is iron oxide, for example. 20) magnetic core layer or, for example, alumina (A
l ₂ O ₃ ) with an insulating layer 1a interposed therebetween,
According to this configuration, since the magnetic flux due to the respective linear conductors 2 _1, 2 _2, 2 _3, 2 ₄ to flow current, inductor comrades does not cause interference for each intercepted a magnetic core layer 1a, each inductor They can be arranged close to each other and can be made smaller.

This inductor array is compatible with the aforementioned 4
The four bar-shaped molded bodies 11 are joined to the joint surface in the same manner as in the above-described manufacturing method, with the thin-plate-shaped molded body forming the magnetic core layer or the insulating layer 1a interposed between the joining surfaces of the rod-shaped molded bodies 11. Material was bonded coated pressurized, and subsequently fired, then the aforementioned individual to the dimensions of the inductor inductor array matrix is obtained by cutting with the cutter, which in the external electrode 4 _{1-4 4} Thus, an inductor array can be obtained.

FIG. 6 shows another example of a chip-shaped inductor array.

In FIG. 1, reference numeral 1 denotes a magnetic core made of a rectangular parallelepiped ferrite, in which, for example, four coiled conductors 2a ₁ , 2a ₂ , 2a ₃ , 2a ₄ are arranged in parallel at predetermined intervals. And the coiled conductive wires 2a ₁ , 2a ₂ ,
Both terminals 2a ₃ and 2a ₄ are connected to external electrodes 4 ₁ , 4 ₂ , 4 ₃ , 4 ₄ formed on the front and rear surfaces of the magnetic core 1, respectively. The external electrodes 4 ₁ , 4 ₂ , 4 ₃ , 4 ₄ are desirably extended to the upper and lower surfaces, respectively, so that the external electrodes 4 ₁ , 4 ₂ , 4 ₃ , 4 ₄ can be easily connected to the conductive pads when mounted on the wiring board. According to the configuration of the inductor array, the coiled conductor 2
₁ , 2 ₂ , 2 ₃ , and 2 ₄ are all buried in the magnetic core 1, and the magnetic flux generated by the coiled conductors 2 ₁ , 2 ₂ , 2 ₃ , and 2 ₄ flows into the magnetic core 1 and leaks to the outside. Because there is no
As shown in FIG. 2, a small inductor array having a higher impedance than that shown in FIG.

Next, a method of manufacturing an electronic component substrate according to the present invention applied to this chip-shaped inductor array will be described with reference to FIG.
This will be described below.

As shown in FIG. 7, when a kneading material 9 obtained by uniformly kneading the magnetic raw material powder B and the binder S with a kneading machine 8 is fed under pressure to a primary extruder 6a, the kneading material is passed through the die. Is wound out, and after drying, a conductor 15 is wound around this core 14 in a coil shape by a winding machine 16. When the core 14 around which the conductive wire 15 is wound is inserted into the secondary extruder 6b to which the kneaded material is fed under pressure and sent out, the core 14 around which the conductive wire 15 is wound is surrounded by the kneaded material. The envelope having a rectangular cross section is covered, and the molded body 17 is formed. After being dried, the molded body 17 is cut along the length direction of the molded body 17 according to the size of the firing furnace or the shape of the setter to be laid below, to obtain a plurality of rod-shaped molded bodies 18. Thereafter, through the same steps as in the manufacturing method shown in FIG.
Is manufactured. According to this manufacturing method, when the contraction rate of the magnetic body of the core 14 during firing is greater than or equal to the contraction rate of the magnetic body of the jacket, the stress due to the contraction of the magnetic body of the jacket during firing is reduced. The impedance characteristics are not degraded because it does not add to the magnetic material. Also in this inductor array, a magnetic core layer or an insulating layer lower than the magnetic permeability of the magnetic core portion can be interposed between the magnetic core portions of the inductors as in the inductor array shown in FIG.

The inductor body shown in FIG. 6 is formed using the molded body 18 shown in FIG. 7 through the same steps as in the embodiment shown in FIG. 3, and connection electrodes and external electrodes are formed thereon as shown in FIG. By forming, a chip-shaped inductor can be manufactured.

Cr—Ni instead of the above-mentioned conductive wire and kneading material;
FIG. 2 or FIG. 7 and FIG. 3 show a resistance wire made of Cu—Ni; Cu—Mn or the like and a kneading material obtained by kneading a binder with a dielectric raw material powder or an insulating raw material powder having a low dielectric constant such as alumina. Through the same steps as the above-described manufacturing method, it is possible to manufacture the resistor having the structure shown in FIG. 1 or the resistor having the coiled resistance wire built therein and the resistor array having the structure shown in FIGS. FIG. 8 shows a capacitor array.

In FIG. 1, a capacitor base 19 includes a plurality of linear conductors 2 inside a rectangular parallelepiped dielectric core 20.
_{21 to 24} in which is incorporated, the capacitor array, forms a capacitance respectively between conductor lines 2 ₁ to 2 _4, respectively oppose the conductor lines 2 ₁ to 2 ₄ to the outer surface of the dielectric core 20 constituted the external electrode ₄₁ to ₄ connected to both ends of the ground electrodes 21 and each conductor 2 ₁ to 2 ₄ is formed by deposition.

The capacitor body 19 is formed by using a conductive wire and a kneading material obtained by kneading a dielectric material powder having a high dielectric constant such as barium titanate and a binder, in the same process as in the above-described embodiment shown in FIGS. It is manufactured by going through.
In the case of a capacitor body incorporating a coil-shaped conductive wire, it is manufactured through the same steps as in the above-described embodiment shown in FIGS.

FIG. 9 shows an LC filter.

In FIG. 1, an LC filter substrate 22 as an electronic component substrate is integrated with an inductor substrate 2 integrally connected thereto.
3 and a capacitor substrate 24. The LC filter base 22 is an inductor having a linear (or coil-shaped) conductor 2 built therein in a process as shown in FIG. 2 (or FIG. 7) using a conductor and a kneading material obtained by kneading a magnetic raw material powder and a binder. A rod-shaped molded body for the base body 23 is prepared, and a linear (or coil-shaped) conductive wire is formed in a process as shown in FIG. 2 (or FIG. 7) using a conductive wire and a kneading material obtained by kneading a dielectric raw material powder and a binder. A rod-shaped molded body for the capacitor body 24 incorporating the capacitor 2 is prepared.
By applying a bonding material to the joint surfaces on the side surfaces of the pieces in the same manner as in the above-described manufacturing method, joining the rod-shaped molded bodies by pressing, then firing, and cutting the fired molded bodies along the length direction. Manufactured. In the LC filter, an external electrode 4a is formed on one side of the LC filter base 22 and commonly connected to the conductor 2 of the inductor base 23 and the conductor 2 of the capacitor base 24, and the external electrode 4b is formed on the other side of the inductor base 23. And a ground electrode 4c on the peripheral surface of the intermediate portion.
Are manufactured. In FIG. 9, when the external electrode 4b is on the input side, a low-pass filter circuit is formed.

Using a resistance wire, a kneading material obtained by kneading an insulating or low dielectric material powder and a binder, in a process as shown in FIG. 2 or FIG. A rod-shaped molded body was prepared, and this was bonded to the rod-shaped molded body for a capacitor body shown in FIG. 9 prepared as described above, and a joining material was applied and pressurized on the joint surface as in the above-described manufacturing method. Then, firing is performed, and the fired molded body is cut along its length direction to manufacture an electronic component base for an RC composite component. An external electrode commonly connected to the two linear conductors is formed on one side surface of the electronic component base for the RC composite component, covered with an insulator, and the other side surface of the electronic component base and the peripheral surface of the intermediate portion. By forming external electrodes as shown in FIG. 9, a snubber circuit in which a resistor and a capacitor are connected in series is formed. This circuit is
It is inserted and connected in parallel with a switch element, a rectifier element or a transformer.

FIG. 10 shows another filter.

In the figure, the filter substrate 22a is composed of two capacitor substrates 24, 24 which are integrally connected. This filter base 22a is made of a capacitor base 24 containing a coil-shaped conductive wire 2a in a process as shown in FIG. 7 using a conductive wire and a kneading material obtained by kneading a dielectric raw material powder and a binder.
Two rod-shaped moldings are prepared, and the two rod-shaped moldings are applied to the joint surface on the side surface thereof by applying a bonding material in the same manner as in the above-mentioned production method, pressurized and joined, and then baked, and the baked molded body Is cut along its length. In the filter, external electrodes 4a, 4a connected to the coiled conductors 2a, 2a of the capacitor bodies 24, 24 are formed on one side surface of the filter body 22a.
It is manufactured by forming a ground electrode 4c on almost the entire peripheral surface of a, and forming a connection electrode (not shown) for connecting the coiled conductive wires 2a, 2a to each other on the other side surface of the filter substrate 22a. In the illustrated example, two filter bodies 24 are used to form a filter body. However, it is a matter of course that two or more capacitor bodies 24 may form a filter body.

In the above-described method for manufacturing an electronic component substrate according to the present invention, the same material is used as the bonding material included in the kneading material and the bonding material for bonding the plurality of rod-shaped molded bodies. In addition, although a plurality of rod-shaped molded bodies are simply applied with pressure and bonded by a bonding material, the pressure may be applied and further, for example, ultrasonic vibration having a frequency of 40 kHz may be applied and bonded together. The integration of the rod-shaped molded body and the joining material is promoted, and the joining force is increased.

Further, as the binder contained in the kneading material, a heat-softening material such as polyvinyl butyral is used.
A plurality of rod-shaped molded bodies are brought into contact with each other by applying a pressure of, for example, 100 kg / cm ² while being heated at, for example, 100 ° C. without applying a bonding material to the bonding surface, and exposing the softened bonding material to the bonding surface. A plurality of rod-shaped moldings may be joined with the binder. In this case, a plurality of rod-shaped molded bodies may be brought into contact with each other without heating, for example, by heating to 100 ° C. to join them together, or by applying a predetermined pressure to the joining surface and applying ultrasonic vibration to join them together. Good. Further, even when a heat-softening bonding material is used, it is a matter of course that a plurality of rod-shaped moldings may be bonded through a similar process by applying a heat-softening bonding material to a bonding surface.

[0034]

According to the present invention, there is provided a chip having a plurality of linear or coiled conductive wires or resistance wires in a fired magnetic, dielectric or insulating or low-dielectric molded body when the above configuration is employed. This has the effect that the electronic component can be mass-produced at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip inductor using a linear conductor.

FIG. 2 is an explanatory view of one step of a method for manufacturing an electronic component substrate according to the present invention applied to the chip inductor shown in FIG. 1;

FIGS. 3A, 3B, and 3C are explanatory views of steps performed after the step shown in FIG. 2;

FIG. 4 is a perspective view of a chip-shaped inductor array using linear conductors.

FIG. 5 is a perspective view of an improved example of the chip-shaped inductor array shown in FIG.

FIG. 6 is a perspective view of an inductor array using a coiled conductive wire.

FIG. 7 is an explanatory view of one step of a method for manufacturing an electronic component substrate according to the present invention applied to the inductor array shown in FIG. 6;

FIG. 8 is a perspective view of a capacitor array using linear conductors.

FIG. 9 is a perspective view of an LC filter using a straight conducting wire.

FIG. 10 is a perspective view of another example of a filter using a coiled conductive wire.

[Explanation of symbols]

1 magnetic cores 21 _{to 24} linear conductors 2a ₁ to 2A region ₄ coiled conductor 4 _{1-4 2}
External electrode 6, 6a, 6b Extruder 9
Kneading material 11 Rod shaped body 12 Joining surface 13 Inductor base 18 Rod shaped body 19 Capacitor base 22 LC filter base 22a Filter base

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01F 17/00-17/08 H01F 41/00-41/10 H01G 13/00-13/06

Claims (9)

(57) [Claims] 1. An extruder for feeding a kneaded material obtained by kneading an insulating or low-dielectric raw material powder and a binder, and forming a plurality of rod-shaped rods having a square cross section made of a kneaded material incorporating a linear or coiled resistance wire. Forming a body, bonding the plurality of rod-shaped molded bodies to each other on the side surfaces thereof, and then firing, and cutting the fired molded body along its length to produce a plurality of electronic component base bodies. Of producing chip-shaped electronic component substrates. 2. A kneading method in which a dielectric raw material powder and a binder are kneaded.
Straight or coiled by an extruder
Plural rod-shaped forming of kneading material with built-in wire
And forming a plurality of rod-shaped compacts on the sides thereof.
And then fired.
Cutting a plurality of electronic component bases
A method for producing a chip-shaped electronic component substrate , characterized in that : 3. A kneaded material obtained by kneading a magnetic raw material powder and a binder.
Linear or coiled by an extruder
Plural rod-shaped forming of kneading material with built-in wire
And kneading dielectric raw material powder and binder
Linear or coiled by an extruder that delivers the kneading material
Rods with a rectangular cross section made of kneading material with built-in conductors
To form a bar-shaped compact and combine these two types of rod-shaped compacts.
And joined to each other on their sides, then fired,
The fired compact is cut along its length
A method for producing a chip-shaped electronic component substrate, comprising producing an electronic component substrate. 4. An insulating or low dielectric material powder and a binder
Extruder that feeds the kneaded material
Or the cross-section of a kneading material incorporating a coiled resistance wire
Raw material powder having a plurality of rod-shaped compacts
An extruder that delivers a kneaded material obtained by kneading the binder and the binder
Of kneading material containing linear or coiled conductors
Forming a plurality of bar-shaped compacts in the shape of a square, these two types of bars
Combine shaped bodies and join them together on their sides
And then fired, and the fired compact is stretched along its length.
To manufacture multiple electronic component bases
A method for producing a chip-shaped electronic component substrate. 5. A thin plate made of a kneaded material obtained by kneading a magnetic material powder or a non-magnetic material powder having a lower magnetic permeability than the magnetic material powder of the rod-shaped molded material and a binder on the side surfaces of the plurality of rod-shaped molded products. 4. The method for producing a chip-shaped electronic component body according to claim 3 , wherein the molded bodies are bonded to each other with a molded body interposed therebetween. 6. The method for manufacturing a chip-shaped electronic component base according to claim 1 , wherein a bonding material is applied to side surfaces of the plurality of rod-shaped formed bodies. 7. The method for manufacturing a chip-shaped electronic component base according to claim 1 , wherein a solvent of the binder is applied to side surfaces of the plurality of rod-shaped formed bodies. 8. at the time of bonding of the plurality of rod-shaped bodies, heating, heating and pressing or according to any one of claims 1 to 7, characterized in that at least one of a pressure and vibration A method for producing a chip-shaped electronic component substrate. 9. The chip-like method of manufacturing an electronic component matrix of claim 8 which comprises using the thermal softening of the bonding material as the bonding material.