JP3233205B2 - Circuit inspection method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a circuit inspection method and apparatus for inspecting a wiring pattern of a circuit device.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing a circuit device such as an IC (Integrated Circuit) or an LSI (Large Scale Integrated Circuit), a wiring pattern in which a bump portion and a wiring portion are continuous is formed on a surface of a circuit board by a thin film technique. ing. However, since such a wiring pattern may be disconnected or short-circuited, it is inspected in a manufacturing process to determine whether the wiring pattern is good or not.

As described above, various methods have been proposed for inspecting the wiring pattern of a circuit device. For example, JP-A-7-43126, JP-A-3-61839, JP-A-7-243984, JP-A-5-264
No. 240, JP-A-4-138344, JP-A-8-55218, JP-A-7-120405, JP-A-6-109446, JP-A-3-252
546, JP-A-5-187842, JP-A-5-180636, JP-A-3-61839, JP-A-7-43126, JP-A-4-2363
No. 14, JP-A-4-83107, JP-A5-
No. 108799, and the like.

A typical circuit inspection method is to image a well-manufactured circuit device, accumulate image data of an inspection standard, and pattern match the image data with image data imaged from a circuit device to be inspected. In some cases, a portion that does not match with this is detected as a defect such as disconnection or short circuit.

In the circuit inspection method disclosed in Japanese Patent Application Laid-Open No. 4-236314, a circular mask is sequentially scanned over the entire binarized image data, and a wiring pattern is present at both ends of the circular mask. On condition that no wiring pattern exists at both ends orthogonal to each other, it is detected that there is no disconnection or short circuit in the wiring pattern.

In a circuit inspection method disclosed in Japanese Patent Application Laid-Open No. 5-108799, the number and area of wiring patterns are detected by labeling processing from image data as inspection reference, and the inspection is performed in the same manner. Compare with the number and area of the target wiring patterns.

The wiring pattern detected from the image data is
When a disconnection occurs, the number increases and the area decreases, and when a short circuit occurs, the number decreases and the area increases. Therefore, if the number and the area of the wiring patterns are the same between the inspection standard and the inspection target, there is no defect such as a disconnection or a short circuit in the inspection target circuit device.

[0008]

As described above, in the circuit inspection method using the pattern matching and the circular mask,
A portion different from a non-defective product can be detected as a defect from the image data of the circuit device to be inspected.

However, since the above-mentioned method handles a large amount of image data, a large-capacity information storage medium is required in the apparatus, and the processing load is too large to improve the processing speed. In particular, in the circuit inspection method using pattern matching, it is necessary to accurately align the image data of the inspection reference with the image data of the inspection target, and this operation is also complicated and difficult.

In the circuit inspection method disclosed in Japanese Patent Application Laid-Open No. 5-108799, the presence or absence of a defect is determined from the matching between the inspection standard and the number and area of the wiring patterns between the inspection target and the inspection target. In the case where a disconnection and a short circuit having the same area exist in the inspection range, occurrence of a defect cannot be determined.

As a circuit inspection method which has solved the above-mentioned problems, a circuit inspection method disclosed in Japanese Patent Application Laid-Open No. 4-83107 or the like uses feature data such as labeling from image data of a wiring pattern to be inspected. By detecting and comparing only this feature data with the inspection standard, pattern matching of a large amount of image data is not required.

However, even in this method, it is necessary to accurately align the image data for detecting the feature data.
This operation is complicated and difficult. Further, when the feature to be compared is the area of the wiring pattern, it is not possible to determine the occurrence of a defect when one wiring pattern has a disconnection and a protrusion having the same area.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a circuit inspection method and apparatus which can easily and reliably inspect a wiring pattern of a circuit device for defects without requiring large-capacity data processing. The purpose is to provide.

[0014]

According to a circuit inspection method of the present invention, an image of a bump portion is obtained from a circuit device to be inspected in which a plurality of wiring patterns having continuous bump portions and wiring portions are formed on the surface of a circuit board. Image data, and perform labeling processing on the image data of the bump portion to generate labeling data in which individual position coordinates and characteristic data are added to an identification code in each of the plurality of bump portions, and the inspection target circuit device The image data of the wiring pattern is imaged from the above, labeling processing is performed on the image data of the wiring pattern to generate labeling data, and the labeling data of the wiring pattern of the circuit device serving as an inspection reference is prepared in advance, and the inspection is performed. The characteristic data of the labeling data of the reference wiring pattern and the characteristic data of the labeling data of the wiring pattern to be inspected. The presence or absence of matching was possible to determine through the identification code and position coordinates of the labeling data of the bump portion of the test object.

Accordingly, the correspondence between the inspection standard and the wiring pattern of the inspection target is specified through the bump portion, and the characteristic data of the wiring pattern of the inspection standard and the inspection target whose correspondence is specified is compared. You.

According to the circuit inspection apparatus of the present invention, a bump image picking up image data of the bump portion from a circuit device to be inspected in which a plurality of wiring patterns in which a bump portion and a wiring portion are continuous is formed on the surface of a circuit board. Means for performing labeling processing on image data of a bump portion imaged by the bump imaging means to generate labeling data in which individual position coordinates and characteristic data are added to identification codes in each of the plurality of bump portions. And, a pattern imaging unit that captures image data of the wiring pattern from the circuit device to be inspected, and a pattern labeling unit that generates labeling data by performing labeling processing on image data of the wiring pattern captured by the pattern imaging unit, The labeling data of the wiring pattern of the circuit device as the inspection reference is stored in advance. A quasi-storage means, and an identification code of the labeling data detected by the bump labeling means to determine whether or not the feature data of the labeling data stored in the reference storage means matches the characteristic data of the labeling data detected by the pattern labeling means. And a matching determining means for determining based on the position and the position coordinates.

Therefore, first, image data of the bump portion is picked up from the circuit device to be inspected by the bump image pickup means, and the image data of the bump portion is subjected to labeling processing by the bump labeling means, and the identification code is assigned to each of the plurality of bump portions. Is generated with labeling data to which individual position coordinates and characteristic data are added. Next, image data of the wiring pattern is captured from the circuit device to be inspected by the pattern imaging unit, and the image data of the wiring pattern is subjected to labeling processing by the pattern labeling unit to generate labeling data of the wiring pattern. Since the labeling data of the wiring pattern of the circuit device serving as the inspection reference is stored in advance in the reference storage means, the characteristic data of the labeling data of the wiring pattern of the inspection reference and the labeling data of the wiring pattern to be inspected as described above. The presence / absence of matching with the feature data is determined by the matching determining means based on the identification code and the position coordinates of the labeling data of the bump portion. That is, the correspondence between the inspection standard and the wiring pattern of the inspection target is specified via the bump portion, and the characteristic data of the wiring pattern of the inspection standard and the inspection target whose correspondence is specified in this way is compared.

The reference storage means referred to in the present invention only needs to store various data in advance.
OM (Read Only Memory) and RAM (Random Accece)
ssMemory) and other storage areas of the information storage medium. Also, other various means may be formed so as to realize their functions. For example, dedicated hardware, a computer provided with appropriate functions by a program, and a computer realized by an appropriate program are provided inside the computer. Functions, combinations thereof, etc. are allowed.

According to another aspect of the circuit inspection apparatus as described above, the position coordinates of the bump portion of the labeling data generated by the bump labeling means are the position of the bump portion of the labeling data stored in the reference storage means. An area generating means for generating an inspection area so as to match the coordinates is provided, and the pattern imaging means captures image data of a wiring pattern from the circuit device corresponding to the inspection area generated by the area generating means. I do.

Therefore, when the bump labeling means generates the labeling data, the area generating means generates an inspection area so that the position coordinates of the bump portion match the inspection standard, and the pattern imaging means responds to the inspection area. Since the image data of the wiring pattern is captured from the circuit device, the image data of the wiring pattern to be inspected is captured from a position that matches the labeling data of the inspection reference.

According to another aspect of the circuit inspection apparatus as described above, the position coordinates of the bump portion of the labeling data generated by the bump labeling means are the position of the bump portion of the labeling data stored in the reference storage means. There is also provided area generation means for generating an inspection area so as to match the coordinates, and the matching determination means determines whether or not there is matching of the feature data of the wiring pattern in accordance with the inspection area generated by the area generation means. judge.

Therefore, when the bump labeling means generates the labeling data, the area generating means generates an inspection area so that the position coordinates of the bump portion match the inspection standard, and the matching determining means corresponds to the inspection area. Since the presence / absence of matching of the feature data of the wiring pattern between the inspection target and the inspection reference is determined, the feature data of the inspection target and the inspection reference are compared between those having corresponding positions.

According to another aspect of the circuit inspection apparatus as described above, the matching determining means is characterized in that the labeling data detected by the pattern labeling means corresponds to the position coordinates of the labeling data detected by the bump labeling means. Selecting the data, selecting the characteristic data of the labeling data stored in the reference storage means corresponding to the identification code of the labeling data detected by the bump labeling means, and determining whether or not the selected pair of characteristic data is matched. Is determined.

Therefore, the characteristic data of the wiring pattern to be inspected is selected corresponding to the position coordinates of a certain bump portion,
Since the feature data of the inspection reference wiring pattern is selected according to the identification code of the same bump portion, the feature data of the inspection target and the inspection reference wiring pattern are compared in correspondence with the bump portion labeling data. .

In another aspect of the circuit inspection apparatus as described above, the bump imaging means and the pattern imaging means share one image imaging device for imaging image data. A bump illuminating means for illuminating the circuit device so that only the bump portion is imaged; and a pattern illuminating means for illuminating the circuit device so that the wiring pattern is entirely imaged.

Therefore, when the bump illuminating device illuminates the circuit device, image data of the bump portion is captured by the image capturing device, and when the pattern illuminating device illuminates the circuit device, the image data of the wiring pattern is captured by the image capturing device. Since the image is captured, the image data of the bump portion and the wiring pattern is captured by one image capturing device.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a circuit inspection apparatus of the present embodiment, FIG. 2 shows image data captured from a circuit apparatus to be inspected, (a) shows image data of a bump portion, (b) Is image data of the wiring pattern. 3A and 3B show image data in a circuit inspection device of a modified example, in which FIG. 3A shows image data of an inspection standard, and FIG. 3B shows image data of an inspection object.

The circuit inspection apparatus 1 according to the present embodiment is an apparatus for inspecting the circuit device 100,
As shown in FIG. 2B, a plurality of wiring patterns 103 in which a wiring portion 102 is continuous with a bump portion 101 are formed on a surface of a circuit board 104 by a thin film technique.

As shown in FIG. 1, the circuit inspection apparatus 1 of the present embodiment includes a holding table 2 for holding the above-described circuit device 100 to be inspected, and opposes the holding table 2 from above. At the position, a CCD (Charge Coupled Device) camera 3 which is one image capturing device
And a variable illumination device 4 whose illumination state can be switched.

An illumination switching circuit 5 is connected to the variable illumination device 4, and the variable illumination device 4 is controlled by the illumination switching circuit 5 so that only the bump portion 101 of the circuit device 100 is imaged by the CCD camera 3. And the wiring pattern 10
The illumination state is switched to a state where 3 is entirely imaged.

More specifically, a general circuit device 100
Then, the wiring portion 102 is flat but the bump portion 101
Projecting in a hemispherical shape, it is possible to image only the bump portion 101 by irradiating the surface of the circuit board 104 with a parallel light beam from obliquely above, and to irradiate the circuit board 104 with a parallel light beam from directly above to cover the entire wiring pattern 103. It is possible to take an image.

For this reason, the circuit inspection apparatus 1 of the present embodiment
In the first embodiment, the CCD camera 3, the variable illumination device 4, and the illumination switching circuit 5 form a bump imaging unit and a pattern imaging unit. The variable illumination device 4 and the illumination switching circuit 5 form a bump illumination unit and a pattern illumination unit. Are formed.

The CCD camera 3 has an image memory unit 6
The image memory unit 6 is connected to the above-described illumination switching circuit 5 and the binarization circuit 7, and the binarization circuit 7 includes a bump labeling unit, a pattern labeling unit, Is connected.

The image memory unit 6 includes the CCD camera 3
Temporarily stores the image data of the bump portion 101 and the wiring pattern 103 taken by the camera, and notifies the illumination switching circuit 5 of the completion of the data storage. The binarizing circuit 7 binarizes the image data of the bump portion 101 and the wiring pattern 103 temporarily stored in the image memory unit 6, and the labeling circuit 8 performs a labeling process on the binarized image data.

This labeling process detects a closed region from the binarized image data, and a serial number is assigned to the detected closed region as an identification code.
At the same time, the occupied area, the coordinates of a circumscribed rectangle, and the like are detected as feature data from the detected closed region, and the feature data is added to an identification code to generate labeling data.

The labeling circuit 8 and the illumination switching circuit 5 are connected to a data switching circuit 9, to which a label detection circuit 11 is connected via a path through the position detection circuit 10 and a path not through the position detection circuit 10. Have been. The position detection circuit 10 includes an area correction circuit 12 corresponding to an area generation unit.
The area correction circuit 12 is connected to the CCD camera 3.

The data switching circuit 9 converts the labeling data of the bump portion 101 and the wiring pattern 103 output by the labeling circuit 8 into a position detection circuit 10 and a label detection circuit 11 in accordance with a switching control completion signal of the illumination switching circuit 5. And transfer to one of them. The position detection circuit 10 includes a bump portion 10
The label detecting circuit 11 detects the position coordinates of the bump portions 101 from the labeling data of the first and second wiring patterns 102 based on the detected position coordinates.
Identify the labeling data for

The area correction circuit 12 generates the inspection area so that the coordinate position of the bump portion of the circuit device of the inspection reference is registered in advance, and the position coordinate of the bump portion of the labeling data matches the inspection reference. The position of the CCD camera 3 and the holding table 2 is controlled so that the image data of the wiring pattern 102 is captured from the circuit device 100 to be inspected corresponding to the inspection area.

The label detection circuit 11 and the labeling circuit 8 are connected to a feature comparison circuit 13 corresponding to reference storage means and matching judgment means, and this feature comparison circuit 13 is connected to a result output terminal 14. . Feature comparison circuit 13
In this example, labeling data of a circuit device as an inspection reference is registered in advance, and the characteristic data is compared with the characteristic data of the wiring pattern 102 to be inspected input from the labeling circuit 8.

At this time, the position coordinates of the bump portion of the labeling data of the inspection reference correspond to the position coordinates of the bump portion 101 to be inspected outputted from the label detection circuit 11, and correspond to the bump portion 101 to be inspected. The characteristic data of the wiring pattern 102 to be inspected is compared with the characteristic data of the inspection reference labeling data.

The data comparison by the feature comparison circuit 13 is performed on all the bump portions existing in the inspection area. When the matching of the feature data of the wiring pattern is confirmed on all the bump portions, the data is compared with the circuit device 100 to be inspected. Is output to the result output terminal 14 as a result of the inspection.

With the above-described configuration, the circuit inspection device 1 of the present embodiment can inspect the quality of the wiring pattern 103 of the circuit device 100 during the manufacturing process. In this case, the feature data of the wiring portion 102 is extracted from the image data captured from the circuit device 100 to be inspected, corresponding to the bump portion 101, and is compared with the feature data of the inspection reference corresponding to the bump portion 101. The circuit device 10 can be satisfactorily realized by simple data processing without requiring large-capacity data processing.
0 can be checked.

The circuit inspection method of the circuit inspection apparatus 1 will be described below. First, the circuit inspection apparatus 1 according to the present embodiment
In the above, the labeling data of the bump portion of the circuit device which is properly manufactured as the inspection reference is registered in the area correction circuit 12, and the labeling data of the wiring pattern of the circuit device as the inspection reference is registered in the feature comparison circuit 13. ing.

In this state, the circuit device 1 to be inspected is
00 is held on the holding table 2, and first, the illumination switching circuit 5 switches the variable illumination device 4 to the illumination state of the bump portion 101, and in this state, the circuit device 100 is imaged by the CCD camera 3. As shown in FIG. 2A, the image data thus captured is in a state where only the bump portion 101 protruding in a hemispherical shape is extracted, and this image data is temporarily stored in the image memory 6.

Next, the temporarily stored bump portion 1
Since the image data 01 is binarized by the binarization circuit 7 and then subjected to labeling processing by the labeling circuit 8, labeling data of the bump portion 101 to which position coordinates and characteristic data are assigned for each identification code is generated. Is done.

Since the labeling data of the bump portion 101 is transferred to the position detecting circuit 10 via the data switching circuit 9, the position detecting circuit 10 checks the position coordinates of the bump portion 101 of the circuit device 100 to be inspected. The inspection area W for the image data W1,.
1 ′,...

The position of the holding table 2 and the CCD camera 3 are controlled so that image data is picked up in the inspection area W1 '. It can be switched to the lighting state. Since the circuit device 100 is imaged by the CCD camera 3 in this state, the image data thus imaged is in a state where the wiring pattern 102 is entirely imaged as shown in FIG. Image data is temporarily stored in the image memory 6.

Next, the temporarily stored image data of the wiring pattern 102 is also binarized by the binarization circuit 7 and then subjected to labeling processing by the labeling circuit 8, so that the position coordinates and the characteristics for each identification code are obtained. Labeling data of the wiring pattern 102 to which the data is added is generated.

Therefore, the labeling data of the wiring pattern 102 is transferred from the labeling circuit 8 to the label detecting circuit 11 via the data switching circuit 9, and the label detecting circuit 11 receives the position coordinates of the bump portion 101 from the position detecting circuit 10. Is output, the labeling data of the wiring pattern 102 is specified corresponding to the position coordinates of the bump portion 101.

At this time, in the illumination state of the wiring pattern 102, the dust 105 and the like are also imaged.
In the labeling data 02, the labeling data of the dust 105 is also included as noise. However, since the dust 105 and the like are not imaged in the illumination state of the bump portion 101, if the labeling data of the wiring pattern 102 is selected according to the position coordinates of the labeling data of the bump portion 101, the labeling data of the dust 105 is excluded. .

In the circuit inspection apparatus 1 according to the present embodiment, the image pickup positions of the image data are different between the bump portion 101 and the wiring pattern 102. However, since the coordinate change of the position correction is held, the bump position is changed. It is easy to specify the labeling data of the corresponding wiring pattern 102 from the labeling data of the portion 101.

When the labeling data of the wiring pattern 102 is specified for each bump 101 by the label detecting circuit 11 as described above, this is used as a combination of the identification data of the bump 101 and the characteristic data of the wiring pattern 102. 13 is output.

Therefore, the feature comparing circuit 13 reads out the feature data of the wiring pattern of the inspection reference registered in advance by the identification code of the bump portion, and reads this into the feature data of the wiring pattern 102 to be inspected. And the presence or absence of the matching is determined.

As described above, all the bump portions 1 in the inspection area
01 and the characteristic data of the wiring pattern 102 match,
As a determination result, data indicating that the circuit device 100 is good is output as data, and if even one piece of feature data does not match, data indicating that the circuit device 100 is defective is output as a determination result.

For example, as shown in FIG. 2B, even if dust 105 is present on the surface of the circuit board 104, if the dust 105 is not connected to the wiring pattern 103, noise is generated at the time of data matching as described above. Therefore, the inspection result does not become defective due to dust 105 not related to the operation of the circuit device 100.

As shown in FIG. 5, when a certain pair of wiring patterns 102 is short-circuited, the pair of wiring patterns 102 becomes one in the labeling data. For this reason, the occupied area and the position coordinates of the circumscribed rectangle, which are the feature data, do not match the inspection reference, and it is easily determined that a defect exists in that portion.

Note that, as described above, the plurality of wiring patterns 1
In the case where 02 is short-circuited, the labeling data of one wiring pattern 102 corresponds to the labeling data of the plurality of bump portions 101, so that the defect in this case can be detected without comparing with the inspection reference. It is.

Since the circuit inspection apparatus 1 of the present embodiment compares the characteristic data of the wiring pattern 103 between the inspection reference and the inspection target as described above, there is no need for pattern matching of large-capacity image data. The pass / fail of the circuit device 100 can be determined by appropriate data processing.

At this time, the labeling data of the wiring pattern 103 includes the labeling data of the dust 105 as noise, etc.
Since the labeling data of the wiring pattern 103 between the inspection reference and the inspection target is made to correspond using the labeling data of No. 01, the quality of the inspection target can be reliably determined by simple data processing.

Further, in the circuit inspection apparatus 1 of the present embodiment, when the labeling data of the bump portion 101 to be inspected is generated, the position coordinates thereof are matched with the inspection reference, and the wiring pattern 103 to be inspected is imaged. . For this reason, the labeling data of the wiring pattern 103 to be inspected can be generated in a state where the positions are aligned with the inspection reference, and there is no need to perform complicated image data alignment.

The bump portion 101 and the wiring pattern 1
Since the image data 03 is picked up by one CCD camera 3 by the switching control of the lighting state of the variable lighting device 4, the image data of the bump portion 101 and the wiring pattern 103 can be picked up with a simple structure. .

In the circuit inspection apparatus 1 according to the present embodiment, as described above, the labeling data of the bump portion and the wiring pattern of the circuit device serving as the inspection reference is converted to the area correction circuit 12.
It is necessary to register such information in the feature comparison circuit 13, but such labeling data can be generated by imaging from actually manufactured circuit devices of good or bad, or can be generated by data processing from design data, for example. It is.

The present invention is not limited to the above-described embodiment, but allows various modifications without departing from the gist of the present invention. For example, in the above embodiment, the occupied area and the position coordinates of the circumscribed rectangle are set as the characteristic data of the wiring pattern 103. However, the continuous direction of the wiring part 102 with respect to the bump part 101 is set as such characteristic data. It is also possible.

In this case, as shown in FIG. 3, in the wiring pattern 102 of B4, it is set that the wiring portion 102 is continuous below the bump portion 101. In this state, when the inspection area W1 is set so as to include the plurality of wiring patterns 102, as shown in FIG.
4 is a bump pattern 10 in a non-defective product.
From 1 the wiring portion 102 continues only to the lower frame of the inspection area. However, as shown in FIG. 3B, when the wiring portion 102 is short-circuited to another wiring pattern 102 such as B2 ', the wiring portion 102 is connected not only to the lower frame but also to the upper frame of the inspection area, and the failure is determined. Is done.

In the above embodiment, since the position of the labeling data of the wiring pattern 103 to be inspected is matched with the inspection reference, the imaging position of the wiring pattern 103 is determined corresponding to the position coordinates of the labeling data of the bump portion 101 to be inspected. Correction has been exemplified. However, the labeling data of the wiring pattern 103 is generated without executing the above-described correction of the imaging position, and the feature comparison circuit 13 generates the labeling data of the wiring pattern 103 and outputs the labeling data to the feature comparison circuit 13. It is also possible to compare feature data.

Further, in the above embodiment, the various means of the circuit inspection apparatus 1 have been exemplified as being formed as dedicated hardware. However, for example, the circuit inspection may be performed by installing appropriate software on a computer and operating it. It is also possible to realize various means of the device 1, and it is also possible to realize part of the device 1 by software and form part of it as hardware.

[0067]

Since the present invention is configured as described above, it has the following effects.

According to a first aspect of the present invention, there is provided a circuit inspection method, wherein image data of the bump portion is obtained from a circuit device to be inspected in which a plurality of wiring patterns in which a bump portion and a wiring portion are continuous are formed on the surface of a circuit board. The image data of the bump portion is imaged, and labeling processing is performed on the image data of the bump portion to generate labeling data in which individual position coordinates and characteristic data are added to the identification code in each of the plurality of bump portions. The image data of the wiring pattern is imaged, the image data of the wiring pattern is subjected to labeling processing to generate labeling data, and the labeling data of the wiring pattern of the circuit device serving as the inspection reference is prepared in advance, and the inspection reference Alignment of the characteristic data of the wiring pattern labeling data with the characteristic data of the labeling data of the wiring pattern to be inspected. The presence / absence of the inspection target is determined based on the identification code and the position coordinates of the labeling data of the bump portion to be inspected, so that the inspection reference and the characteristic data of the wiring pattern of the inspection target are compared. Since the quality of the circuit device can be easily determined without the need for processing, and the labeling data of the bump portion, which can be reliably detected, is used to associate the inspection standard with the labeling data of the wiring pattern of the inspection target. The quality of the inspection target can be reliably determined by data processing.

According to a second aspect of the present invention, there is provided a circuit inspection apparatus, wherein image data of the bump portion is obtained from a circuit device to be inspected in which a plurality of wiring patterns having continuous bump portions and wiring portions are formed on the surface of a circuit board. Bump imaging means for imaging and labeling processing of image data of the bump portion imaged by the bump imaging means to generate labeling data in which individual position coordinates and characteristic data are added to identification codes in each of the plurality of bump portions A bump labeling unit, a pattern imaging unit that captures image data of the wiring pattern from the circuit device to be inspected, and a pattern that generates labeling data by performing a labeling process on the image data of the wiring pattern captured by the pattern imaging unit. Labeling means and labeling data of the wiring pattern of the circuit device as the inspection reference in advance And a labeling means for detecting whether or not the feature data of the labeling data stored in the reference storing means matches the feature data of the labeling data detected by the pattern labeling means. A matching judgment means for judging based on data identification codes and position coordinates, so that the feature data of the wiring pattern between the inspection standard and the inspection target is compared, so that a large amount of data processing is required. Can easily determine the quality of the circuit device without
Since the inspection reference and the labeling data of the wiring pattern of the inspection target are associated with each other by using the labeling data of the bump portion that can be reliably detected, the quality of the inspection target can be reliably determined by simple data processing.

The invention according to claim 3 is the circuit inspection apparatus according to claim 2, wherein the position coordinates of the bump portion of the labeling data generated by the bump labeling means are stored in the reference storage means. There is also provided an area generating means for generating an inspection area so as to match the position coordinates of the bump portion of the data, and the pattern imaging means is provided with a wiring from the circuit device corresponding to the inspection area generated by the area generating means. By capturing the image data of the pattern, it is possible to compare the characteristic data between the inspection target and the inspection reference without requiring complicated alignment of the image data.

The invention according to claim 4 is the circuit inspection apparatus according to claim 2, wherein the position coordinates of the bump portion of the labeling data generated by the bump labeling means are stored in the reference storage means. There is also provided an area generating means for generating an inspection area so as to match the position coordinates of the bump portion of the data, and the matching determining means corresponds to the inspection area generated by the area generating means. By judging the presence / absence of data matching, it is possible to compare characteristic data between an inspection target and an inspection standard without requiring complicated image data alignment.

The invention according to claim 5 provides the invention according to claims 2 to 4
In the circuit inspection device according to any one of the above, the matching determination unit, the characteristic data of the labeling data detected by the pattern labeling unit corresponding to the position coordinates of the labeling data detected by the bump labeling unit And selecting the characteristic data of the labeling data stored in the reference storage means corresponding to the identification code of the labeling data detected by the bump labeling means, and determining whether or not there is a match between the selected pair of characteristic data. By doing so, it is possible to easily and reliably compare the characteristic data of the wiring pattern between the inspection target and the inspection reference.

The invention according to claim 6 provides the invention according to claims 2 to 5
The circuit inspection apparatus according to any one of the above , wherein the bump imaging means and the pattern imaging means share one image imaging device for imaging image data, the bump imaging means, Bump illuminating means for illuminating the circuit device in a state where only the bump portion is imaged, and pattern illuminating means for illuminating the circuit device in a state where the wiring pattern is entirely imaged,
Image data of the bump portion and the wiring pattern can be captured with a simple structure.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a circuit inspection device according to an embodiment of the present invention.

2A and 2B show image data picked up from a circuit device to be inspected, wherein FIG. 2A shows image data of a bump portion, and FIG. 2B shows image data of a wiring pattern.

FIGS. 3A and 3B show image data in a circuit inspection apparatus of a modified example, wherein FIG. 3A shows image data of an inspection reference, and FIG. 3B shows image data of an inspection target.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 circuit inspection device 3 CCD camera 4 variable illumination device 5 illumination switching circuit 8 labeling circuit 10 position detection circuit 11 label detection circuit 12 area correction circuit 13 feature comparison circuit 100 circuit device 101 bump portion 102 wiring portion 103 wiring pattern

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-9-196625 (JP, A) JP-A-5-108799 (JP, A) JP-A-59-21037 (JP, A) JP-A 8- 203972 (JP, A) JP-A-5-82618 (JP, A) JP-A-5-232031 (JP, A) JP-A-6-342472 (JP, A) JP-A-7-260697 (JP, A) JP-A-4-83107 (JP, A) JP-A-4-236314 (JP, A) JP-A-9-223231 (JP, A) JP-A-3-183148 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/66

Claims (6)

(57) [Claims] An image data of the bump portion is taken from a circuit device to be inspected in which a plurality of wiring patterns in which a bump portion and a wiring portion are continuous are formed on a surface of a circuit board, and the image data of the bump portion is taken. Performing labeling processing to generate labeling data in which individual position coordinates and characteristic data are added to an identification code at each of the plurality of bump portions, and image the image data of the wiring pattern from the circuit device to be inspected; Labeling processing is performed on the image data of the wiring pattern to generate labeling data, labeling data of the wiring pattern of the circuit device serving as an inspection reference is prepared in advance, and the characteristic data of the labeling data of the wiring pattern of the inspection reference and the The presence or absence of matching with the characteristic data of the labeling data of the wiring pattern to be inspected is determined by the bump portion to be inspected. Circuit inspection method so as to determine through the identification code and position coordinates of labeling data. 2. A bump image pickup means for picking up image data of the bump portion from a circuit device to be inspected in which a plurality of wiring patterns in which a bump portion and a wiring portion are continuous are formed on a surface of a circuit board; A bump labeling unit that performs labeling processing on image data of a bump portion captured by the unit and generates labeling data in which individual position coordinates and characteristic data are added to an identification code in each of the plurality of bump portions; Pattern imaging means for capturing image data of the wiring pattern from a circuit device; pattern labeling means for generating labeling data by labeling image data of the wiring pattern captured by the pattern imaging means; and a circuit device serving as an inspection reference A reference storage means for storing in advance labeling data of the wiring pattern; The presence or absence of a match between the characteristic data of the labeling data stored in the storage means and the characteristic data of the labeling data detected by the pattern labeling means is determined based on the identification code and the position coordinates of the labeling data detected by the bump labeling means. A circuit inspection device comprising: 3. An area for generating an inspection area such that the position coordinates of the bump portion of the labeling data generated by the bump labeling means match the position coordinates of the bump portion of the labeling data stored in the reference storage means. 3. The circuit inspection device according to claim 2, further comprising a generation unit, wherein the pattern imaging unit captures image data of a wiring pattern from the circuit device corresponding to the inspection region generated by the region generation unit. 4. An area for generating an inspection area such that the position coordinates of the bump portion of the labeling data generated by the bump labeling means match the position coordinates of the bump portion of the labeling data stored in the reference storage means. 3. The circuit inspection apparatus according to claim 2, further comprising a generation unit, wherein the matching determination unit determines whether or not there is matching of the characteristic data of the wiring pattern corresponding to the inspection region generated by the region generation unit. 5. The matching determining means selects characteristic data of the labeling data detected by the pattern labeling means in accordance with the position coordinates of the labeling data detected by the bump labeling means, and the feature data detected by the bump labeling means is selected. in response to the identification code labeling data to select feature data of the labeling data to which the reference storing means stores, any one of from claims 2 determines the presence or absence of matching of a pair of characteristic data selected 4 The circuit inspection device according to the paragraph . 6. The bump image pickup means and the pattern image pickup means share one image pickup device for picking up image data, and the bump image pickup means sets the circuit so that only the bump portion is picked up. The circuit according to any one of claims 2 to 5, comprising: a bump illuminating means for illuminating the device; and a pattern illuminating means for illuminating the circuit device in a state where the wiring pattern is entirely imaged. Inspection equipment.