JP3232961B2 - Thin film forming equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film forming apparatus,
In particular, the present invention relates to an apparatus for ejecting a liquid substance from a fine nozzle to adhere to a substrate, drying and curing the attached liquid substance to form a thin film (having a film thickness of 100 μm or less in general and 10 μm or less in general). Things.

[0002]

2. Description of the Related Art In recent years, thin film forming techniques have been applied in various fields. Regarding the specific forming method, in addition to those requiring a vacuum apparatus such as sputtering or vapor deposition, spin coating, printing, die coating, and the like. Various studies have been made.

[0003] Of these, the spin coating method is often used for resist coating and formation of a protective film in a semiconductor process.

Hereinafter, a conventional spin coating apparatus (hereinafter, referred to as a spin coater) will be described.

FIG. 10 shows a configuration and an operation state of a conventional general spin coater. In FIG. 10, 101 is the rotation axis of the spin coater main body, 102 is the sample fixing substrate, 10
3 is a nozzle for discharging a liquid for application, 104 is a substrate for forming a thin film, 105 and 106 are liquids, 107 is a thin film, 10
8 is a flying droplet.

In such a configuration, first, FIG.
As shown in FIG.
, The liquid 105 is discharged to form a state of being placed on the substrate.

Next, as shown in FIG. 10B, the spin coater is rotated at a low speed ω ₁ to transfer the liquid 106 onto the substrate 1.
Adapt to 04.

[0008] Then, as shown in FIG.
Further, by rotating at a high speed ω ₂ , the thin film 107 is formed on the substrate 104.
Is formed.

[0009]

However, in the above-mentioned conventional configuration, as shown in FIG.
Scattered droplets 108 are scattered and wasted, and 80 to 90% of the liquid is discarded.

This is because if a large amount of the liquid 105 is not ejected, an unpainted portion will be formed in a portion that is not well compatible with the substrate 104.

As described above, the conventional spin coater has a problem that the use efficiency of the liquid is poor and most of the coating liquid is wasted.

When a film is formed by a spin coater, the liquid flows from the inside toward the outer periphery, so that the thickness of the outer periphery is inevitably increased, causing the disk itself to warp.

An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a thin film forming apparatus with high use efficiency of a coating liquid by introducing a novel liquid discharge head.

[0014]

In order to achieve the above object, according to the present invention, there is provided a thin film forming apparatus, comprising: an ink jet head having a plurality of fine nozzles for discharging a liquid; and a liquid discharged from the ink jet. Rotating means for rotating the substrate to be coated around a predetermined rotation axis; and a space between the inkjet head and the substrate to be coated in a region near the rotation axis with respect to the substrate to be coated and in a separation region separated from the rotation axis. Relative moving means for performing relative movement with the ink jet head, and the relative movement speed of the relative moving means corresponding to the relative position of the inkjet head and the substrate to be applied being relatively moved from the vicinity area toward the separation area is small. Relative movement control means for controlling the relative movement means so that the inkjet head faces the liquid ejection port. The air discharge port is provided, the air flow is discharged from the air discharge port, and the liquid pressure of the liquid discharge ports,
The state of balance with the air pressure in the vicinity of the liquid discharge port generated by the air flow is changed to the flow path of the air flow to the air discharge port.
Either of two flow paths that are connected and have different resistance to air flow
Select the air flow and switch the air flow path to create a pressure in the air flow.
It has a main configuration characterized in that a liquid is ejected by making a change by giving a change.

Alternatively, the relative movement control means reduces the angular velocity of rotation by the rotation means in response to the relative position of the ink jet head and the substrate to be applied moving relatively from the near area toward the separation area. The relative movement means may be controlled as described above, or the relative movement between the inkjet head and the substrate to be applied may be relatively moved from the near area toward the separated area. The speed of the relative movement by the means is reduced, and the angular velocity of the rotation by the rotating means is reduced in accordance with the relative position of the inkjet head and the substrate to be applied relatively moving from the vicinity area toward the separation area. The relative movement means may be controlled so as to be as follows.

In these cases, the relative position between the ink jet head and the substrate to be coated is reduced in inverse proportion to the moving distance of the relative movement from the neighboring area toward the separated area, or the angular velocity of rotation is reduced. It is preferable to decelerate.

Further, an air outflow head is provided adjacent to the ink jet head for causing an air flow to flow toward the substrate to be coated. Immediately after the liquid is discharged to the substrate to be coated, the air flow is supplied to the substrate to be coated. May be provided.

Further, a charging means for charging the liquid discharged from the ink jet head may be provided.

The ink jet head is provided with an air discharge port opposite to the liquid discharge port, allows an air flow to flow out from the air discharge port, and controls the liquid pressure in the liquid discharge port and the liquid discharge port generated by the air flow. a structure for discharging liquid by changing the balance condition of the air pressure in the vicinity of, in this case, further, the electrode member provided around the air discharge port, the liquid of the electrode member and the liquid discharge port It may have a potential difference applying means for applying a potential difference therebetween, and the liquid discharged from the inkjet head may be charged.

A UV curable resin solution can be used as the liquid to be discharged from the ink jet head, a substrate made of polycarbonate can be used as a substrate to be coated, and a personal computer having a control program incorporated therein as relative movement control means. Can be used.

[0021]

In the present invention, the substrate to be coated and the ink jet head are relatively rotated while controlling the angular velocity and the moving speed while relatively rotating between the area on the rotation axis side and the area farther from the area. Then, a liquid is ejected from a plurality of minute nozzles of the inkjet head to the substrate to be coated, and a coating film with good uniformity is formed on the substrate to be coated.

Further, when an air outflow head is provided, the air flow flows out to the substrate to be applied immediately after the liquid is discharged to the substrate to be applied.

Further, in the case where charging means for charging the liquid discharged from the ink jet head is provided, a portion where the liquid droplets first adhered to the substrate to be coated and a liquid droplet arriving next to the substrate to be coated are determined. Repel each other, and as a result, the liquid attached on the substrate to be applied moves in a direction in which the liquid spreads.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a schematic structural view of a spin coater according to a first embodiment of the present invention.

In FIG. 1, reference numeral 10 denotes a disk-shaped substrate to be coated, 11 denotes an ink jet head, 12 denotes a mounting table,
13 is a rotation axis.

Here, the ink jet head discharges a liquid from a fine nozzle (usually a nozzle diameter of 0.1 mm or less) and controls the discharge state of the liquid by an electric signal to adhere the liquid to a recording medium. Means something to let you do.

The ink jet head of this embodiment has a plurality of such fine nozzles. Specifically, 48 nozzles are arranged in the radial direction of the substrate 10 at an interval of 10 / mm. Are arranged.

Conventionally, a discharge nozzle used in a spin coater has an inner diameter of 0.5 to 1 mm, and it is difficult to control a minute discharge amount. However, as described in this embodiment, the discharge nozzle is defined as described above. By using the ink jet head described above, a fine pattern can be drawn and a uniform and very thin film can be formed as described below.

In this embodiment, first, as shown in FIG. 1, while rotating the substrate 10 at an angular velocity θ, the ink jet head 11 is relatively moved at a speed v in the radial direction of the substrate to be coated. The application liquid is ejected to adhere the application liquid onto the substrate 10 to be coated.

Then, when the substrate 10 to be coated makes one rotation,
The inkjet head 11 produces 48 applied lines at 100 μm intervals, resulting in a width of 4.
8 mm stripes will be drawn.

Further, in this case, if the width of each line is properly selected, adjacent lines are connected to each other, and a thin film having a predetermined thickness is formed.

Thus, such an appropriate condition is found, and the amount of movement of the inkjet head 11 by the relative movement speed v during one rotation of the substrate 10 to be coated is 4.8 m.
If it is set to m, a thin film can be formed by a so-called spiral single stroke.

Furthermore, a thin film can be formed by overwriting several times instead of such one-stroke writing.

That is, by setting the relative moving speed v of the ink jet head 11 and the angular speed θ of the substrate 10 to be coated, the ink jet head 11 is moved by a predetermined amount, for example, 4.8.
mm, the substrate 10 to be coated can be rotated several times, and a thin film can be formed by overwriting, so that a fine line finer than 10 lines / mm can be drawn. This is suitable for reliably forming a thinner thin film.

More specifically, in FIG. 1, if the center of rotation of the substrate 10 to be coated is the origin O and the distance in the radial direction is x, the substrate 10 is rotated at an angular velocity θ and while it is moving at a velocity v in the radial direction of the substrate to be coated (x-direction), and starts a discharge in the position x _s, completing the thin film formed by stopping the discharge at the outer position x _e of the substrate to be coated 10.

Here, in order to form a thin film having the same thickness over the entire area of the substrate 10 to be coated, when the discharge amount from the ink jet head is a constant value Q, the following (Equation 1) is satisfied. There is a need.

[0038]

(Equation 1)

In order for a line to be drawn with the same resolution over the entire area of the substrate 10 to be coated, the following (Equation 2) must be satisfied.

[0040]

(Equation 2)

That is, in the case of a disk-shaped substrate, the coating area increases outside the center, so that v needs to be decelerated outward from the center, and if the rotation speed is constant, Since the peripheral speed becomes higher outside the center than the center, in order for the peripheral speed at the recording position of the inkjet head to be constant, the rotational speed also needs to be reduced as x increases.

For example, if v and θ are constant values,
Because the peripheral speed is slow in the central part, even if the density of the application line is the same, the line in the central part becomes thick, the film becomes thick in the central part, and a thin film occurs in the outer peripheral part, and in some cases,
Lines in the outer peripheral portion may remain as lines without overlapping.

When θ is a constant value in a state where the expression 1 is satisfied, the coating amount is constant over the entire area of the substrate to be coated, but the peripheral speed is slow and thick at the central portion. Coating is performed by low-density lines, and coating is performed by thin, high-density lines at the outer periphery.Therefore, coating lines overlap well at the outer periphery, forming a uniform film, but lines overlap at the center. Bad, uneven coating may occur.

In order to form a uniform thin film having a uniform thickness over the entire area of the substrate to be coated, as in these examples,
And (Equation 2) is preferably satisfied, and more preferably both are satisfied.

Next, FIG. 2 is a schematic diagram showing a typical configuration of the ink jet in this embodiment.

In FIG. 2, 11 is an ink jet head, 21 is an air supply source, 22 is a liquid reservoir, 23 is a pressure adjusting mechanism, 24 is a liquid inlet, 25 is an air inlet, 26 is an air outlet, and 27 is a liquid outlet. It is a discharge port.

Here, the liquid discharge port 27 and the air discharge port 26
Are provided concentrically on the inkjet head 11.

An air flow from the air supply source 21 flows into the ink jet head 11 from the air supply source 21 through the air inlet 25 through the pressure adjusting mechanism 23, and the air having a constant flow rate flows from the air discharge port 26. The current is flowing.

On the other hand, a coating liquid is supplied from the liquid reservoir 22 through a liquid inlet 24. Air supply source 2
Numeral 1 is also connected to the liquid reservoir 22 to apply pressure to the liquid in the ink jet head 11 and balance the air pressure in the vicinity of the liquid discharge port 27 generated by the air flow, so that the coating liquid is 27.

FIG. 3 is an enlarged view of the nozzle portion shown in FIG. As shown in FIG. 3A, the air discharge port 26 and the liquid discharge port 27 are arranged concentrically, and an air flow having a constant flow rate flows out from the air discharge port 26. with the outflow, the outlet of the liquid ejection port 27, the pressure P _a which is generated by the air flow is occurring.

Meanwhile, the reservoir 22, since the air pressure is applied, the pressure P _i is generated in the liquid in the liquid discharge port 27. By P _a and P _i is taken is approximately equal balanced, the coating liquid will be retained in the liquid discharge port 27.

Meanwhile, as shown in FIG. 3 (b), the pressure regulating mechanism 23, if the air flow delivered to the ink jet head 20 is reduced, the pressure generated in the exit of the liquid discharge port 27, is less than P _{a Pb} , and the pressure difference (P _i −
_Pb ) causes the application liquid to be discharged.

Next, FIG. 4 shows a typical configuration example of the pressure adjusting mechanism 23. In FIG. 4, the air flow from the air supply source flows into the inlet A of the solenoid valve 41,
It flows out through the outlet B or C.

Here, the solenoid valve 41 switches the outlet to B or C by an electric signal.

When the inflow port A communicates with the outflow port C, the pressure Pi of the liquid reservoir and the pressure Pa due to the air flow are substantially equal in the state of FIG.

When a discharge signal is input to the solenoid valve 41, the flow path is switched from C to B.

[0057] As shown in FIG. 4, the outlet B are flow path resistor 42 is connected, the pressure loss caused by passing this, the pressure due to the air flow in an ink-jet head, P _a From Pb to _Pb , and the state shown in FIG. 3B is reached, and the application liquid is discharged.

Now, a specific example in which the application liquid is actually discharged and applied onto the substrate to be applied using the ink jet head having the above configuration will be described.

In this embodiment, a phase-change optical disk made of polycarbonate was used as a substrate to be coated, and a UV curing liquid was used as a coating liquid in order to form a protective film on a metal deposition surface.

The disk diameter is 130 mm.
The application range of the V-curing liquid was a portion having a radius of about 20 mm or more.

That is, in FIG. 1, x _s = 20 m
m, x _e = 65 mm. The UV curing liquid is a resin solution that is cured by irradiation with ultraviolet rays and solidifies. Specifically, an acrylic ester composition is used, and its physical properties are a viscosity of 23 cp, a specific gravity of 1.07, and a surface. The tension was 29 dyne / cm and the curing shrinkage was 9.8%.

Under such conditions, the amount of liquid required to form a protective film having a thickness of 5 μm was estimated to be about 70 mg.

Accordingly, since the liquid ejection amount of the ink jet head is about 300 mg / min, if the application is completed in about 20 seconds, a protective film of about 7 μm will be formed.

In this case, (Equation 1) is expressed as the following (Equation 3).

[0065]

(Equation 3)

On the other hand, since (Equation 2) relates to the line thickness and the number of times of coating (or line density) at the time of coating, k2 = 32,000, 36000 and 40000 (θ: rpm, x: mm) The following three cases were examined.

Specifically, using a personal computer, the velocity v and the angular velocity θ in the x-axis direction were controlled by software so as to satisfy (Equation 2) and (Equation 3), respectively.

Specifically, in order to control v according to (Equation 3), it is convenient to express v as a function of time.

That is, since v = dx / dt, (Equation 3) is converted into the following relational expression (Equation 4).

[0070]

(Equation 4)

Then, by solving the differential equation shown by (Equation 4) and inserting the condition of t = 0 and x = 20 mm, since x is expressed by the following (Equation 5), v is expressed by the following (Equation 6) ).

[0072]

(Equation 5)

[0073]

(Equation 6)

Therefore, the actual application is performed by controlling v by a personal computer so as to satisfy (Equation 6).

FIG. 5 is a configuration diagram of a coating apparatus using a personal computer in this embodiment. In FIG. 5, the same components as those in FIG.
2 is a motor driver, 53 is a personal computer, and 54 is a moving table.

Here, the substrate 10 to be coated is rotated by being driven by the motor 50,
The relative movement between the substrate 10 and the substrate 10 is performed by a motor 51.

The motors 50 and 51 are controlled by the motor driver 52.
Is connected to the personal computer 53, and its driving is controlled by software installed in the personal computer.

FIG. 6 shows an example in which v, θ and the ejection signal are controlled. In FIG. 6, the horizontal axis indicates the position x from the center in the radial direction of the optical disk, and the vertical axis indicates the speed v of the inkjet head in the x direction and the rotational speed θ of the disk.

First, in the initial state, the ink jet head is at the position of x = 10 mm and θ is 1800
It is rotating at rpm.

Next, when the ink jet head is set to v = 29
When relative movement is started at 0 mm / s and the position reaches x = 20, a discharge signal is input and the coating liquid is discharged, and at the same time, v and θ are inversely proportional to x as shown in FIG. ,
Move and rotate.

When the position of x = 65 is reached, a discharge stop signal is input, and the speed and angular speed of v and θ are reduced to zero.

Under the above conditions, k2 = 32000, 36
000 and 40000 (θ: rpm, x: mm) are described.

First, under the condition of k2 = 32,000, the number of rotations was low and the density of the coating lines was rough, so that there was a tendency that a little stripe-shaped irregularities remained.

Next, under the condition of k2 = 36000, a smooth thin film having a thickness of 6 to 8 μm was formed.

On the other hand, under the condition of k2 = 40000, the number of revolutions is too high, so that the centrifugal force is excessively generated, and the coating liquid that has adhered before the coating flows during the coating to flow outward.
Radial stripes tended to form.

Therefore, in this case, k2 = 36
Although the condition of 000 is more preferable, depending on the type of the thin film to be formed, a film formed under other conditions can be used.

Preferably, in order to form a thin film having a uniform and uniform thickness over the entire substrate to be coated, it is preferable that both (Equation 1) and (Equation 2) are satisfied. Depending on the type of the thin film, at least one of the conditions may be satisfied.

As described above, in the present embodiment, when at least one or both of the conditions of (Equation 1) and (Equation 2) are satisfied, that is, the relative velocity v goes outward from the center. Therefore, by reducing the speed and / or the speed of rotation θ as x increases, a thin film having a uniform thickness and a uniform thickness can be formed over the entire area of the substrate to be coated.

(Embodiment 2) Next, a second embodiment of the present invention will be described in detail.

As described in the first embodiment, k1 and k2 are appropriately set according to the conditions of (Equation 1) and (Equation 2) according to the type and thickness of the thin film to be formed by coating. Can be formed, but further investigation may be required depending on the process of the thin film to be formed.

For example, the coating is completed in about 10 seconds, and a film thickness of about 3.5 μm will be formed.
In the case of = 191.2, k2 of (Equation 2) is set to a maximum of 600
The experiment was performed with the value changed to 00, but a smooth thin film could not be obtained, and a circumferential striped pattern remained.

It is considered that such a phenomenon occurs when there is a limit to the miniaturization of the droplets of the coating liquid or when the rotation speed of the rotating shaft is too low.

The present embodiment provides a configuration in which unevenness is smoothly leveled in consideration of a case where a thin film is not sufficiently uniform only by coating with an ink jet head.

FIG. 7 is a schematic configuration diagram of a spin coater according to the second embodiment of the present invention. In FIG. 7, the application liquid ejection head 70, which is an ink jet head, is relatively moved while rotating the application substrate 10 made of polycarbonate to form a thin film using a UV curing liquid application liquid as in the first embodiment.

Further, in this embodiment, an air outflow head 71 is provided adjacent to the coating liquid ejection head, and the coating liquid is blown by blowing an air flow immediately after the coating liquid adheres to the substrate 10 to be coated. It has a configuration to make the coating film smooth by flowing.

Specifically, in this embodiment, the first embodiment
Using the same ink jet head and coating liquid as in (1), k1 = 191.2 in (Equation 1) and k2 in (Equation 2)
= 60,000 was set and examined.

First, when the air outflow head 71 was not used, a stripe pattern remained, and a smooth coating layer could not be obtained.

On the other hand, when an air outflow head was added as shown in FIG. 7, a uniform thin film of 3 to 4 μm was formed.

Specifically, the air flow ejection head has a hole diameter of 1
Arrange 24 nozzles of 00μm, about 0.15kg / cm
^The air flow is caused to flow out at a pressure of ³ , and the flow speed of the air is about 100 to 200 m / s, and the flow state is considered to be a flow in a laminar flow region with less air turbulence.

FIG. 8 shows how the coating film is made uniform by the air flow. In FIG. 8, first, immediately after the discharged liquid adheres to the substrate to be coated, adjacent lines are separated from each other and are in a state indicated by a certain region A.

After that, the coating liquid spreads over time and spreads into a state as shown in a region B. However, if the coating liquid is left as it is, the coating liquid is dried and hardened without eliminating the unevenness.

Then, if an air stream is blown before the drying and curing, the coating film in the region B flows further in an uneven state, causing micro vibration, and as a result, a uniform thin film like the region C is obtained.

As described above, in this embodiment, the air outflow head is provided adjacent to the application liquid discharge head, and the air flow is blown immediately after the application liquid adheres to the substrate to be applied and before drying and curing. As a result, the coating liquid was caused to flow and vibrate, and a uniform coating film could be formed.

(Embodiment 3) Next, a third embodiment of the present invention will be described in detail.

This embodiment is to improve the uniformity of the thin film formed in the same manner as in the second embodiment, but is to uniform the coating by charging the discharge liquid.

More specifically, an electrode 93 is provided on the surface of the air discharge port 92 of the ink jet head having basically the same configuration as that of the first embodiment, and the discharge held in the electrode 93 and the liquid discharge port 91 is performed. A configuration in which a potential difference is provided between the liquid and the liquid 94 by a power supply 90 to charge the discharged droplets 95;
The substrate 10 to be coated and the discharge liquid 94 used were the same as those in Example 1.

FIG. 9 is an enlarged view of the nozzle portion of the ink jet head of this embodiment. In FIG. 9, a liquid discharge port 91 and an air discharge port 92 are made of an insulating material, and an electrode 93 is provided on an outlet side surface of the air discharge port 92.

Then, the power supply 9 is set so as to apply a potential difference between the electrode 93 and the ejection liquid 94 held in the liquid ejection port 91.
0 is connected.

In such a configuration, when a potential difference is applied by the power supply 90, the discharge liquid 94 is charged according to the capacitance between the electrode 93 and the discharge liquid 94.

The liquid droplets 95 discharged outward are charged and fly, arrive at the substrate 10 to be coated, and adhere thereto.

When the thus-charged droplets 95 adhere to an insulating substrate such as polycarbonate, for example, they remain charged.

Then, the portion of the droplet 95 that has first adhered to the substrate to be coated 10 and the droplet 95 that has arrived at the substrate 10 to be coated next repel each other because they are charged with the same sign. As a result, an action occurs in a direction in which the attached liquid spreads on the substrate 10 to be coated.

Specifically, in this embodiment, an optical disk made of polycarbonate and a UV curing liquid were used, and
K1 = 191.2 in (2) and k2 = 6 in (Equation 2)
0000 and about 600 V between the electrode 93 and the discharge liquid 94.
And the application was completed in 10 seconds.

When the liquid was not charged, the striped pattern remained and a smooth thin film was not formed. However, when the discharge liquid was charged by providing a potential difference between the electrode 93 and the discharge liquid 94, A smooth thin film of 3 to 4 μm could be formed.

As described above, in this embodiment, a uniform coating film can be formed by providing a potential difference between the electrode provided around the air discharge port and the discharge liquid to charge the discharge liquid. did it.

Note that, in addition to the configuration for charging the discharged liquid of the present embodiment, the air outlet head described in the second embodiment is further provided, so that immediately after the coating liquid adheres to the substrate to be coated and before drying and curing, It is a matter of course that a more uniform coating film can be formed even more reliably by combining a configuration for blowing an air flow.

In all of the above embodiments, the type of the substrate to be coated and the type of the coating solution are not limited to those described above, and the resist may be applied to a silicon substrate, or may be applied to a glass substrate, a ceramic substrate, a metal substrate, or the like. It is also applicable to the formation of a functional thin film having an electrical or optical function.

[0118]

With the above arrangement, in the present invention,
With a very simple configuration, it is possible to provide a thin film forming apparatus capable of forming a uniform thin film on the entire surface of a substrate to be coated without wasting a coating liquid and without increasing the thickness of an outer peripheral portion. .

Further, the conditions are variously changed according to the purpose,
Provided is a thin film forming apparatus having a high degree of freedom that enables a thin film having a predetermined thickness to be freely formed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a thin film forming apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an ink jet head of the thin film forming apparatus.

FIG. 3 is a sectional view of a nozzle of an inkjet head of the thin film forming apparatus.

FIG. 4 is a configuration diagram of a pressure adjusting mechanism of an inkjet head of the thin film forming apparatus.

FIG. 5 is an overall configuration diagram of the thin film forming apparatus.

FIG. 6 is an operation diagram of the thin film forming apparatus.

FIG. 7 is a configuration diagram of a thin film forming apparatus according to a second embodiment of the present invention.

FIG. 8 is an explanatory view of the thin film forming apparatus.

FIG. 9 is an explanatory view of a thin film forming apparatus according to a third embodiment of the present invention.

FIG. 10 is an explanatory view of a conventional thin film forming apparatus.

[Explanation of symbols]

10 the substrate to be coated 11 inkjet head 12 mount 13 rotates shaft 21 an air supply source 22 reservoir 23 pressure adjustment mechanism 24 fluid inlet 25 air inlet 26 air discharge port 27 fluid discharge port 41 solenoid valve 42 passage resistor 50 motor Reference Signs List 51 motor 52 motor driver 53 personal computer 54 moving table 70 coating liquid discharge head 71 air outflow head 90 power supply 91 liquid discharge port 92 air discharge port 93 electrode 94 discharge liquid 95 droplet

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-188611 (JP, A) JP-A-5-21306 (JP, A) JP-A-1-216533 (JP, A) JP-A-56- 130366 (JP, A) JP-A-60-122159 (JP, A) JP-A-1-64439 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B05C 11/08 B41J 2 / 045 H01L 21/027 H01L 21/31 H01L 21/312

Claims (9)

(57) [Claims] An inkjet head having a plurality of fine nozzles for ejecting a liquid; a rotating unit for rotating a substrate to be coated with the liquid ejected from the inkjet around a predetermined rotation axis; and the inkjet head. Relative movement means for relatively moving the substrate to be coated and the substrate to be coated between a region near the rotation axis with respect to the substrate to be coated and a region separated from the rotation axis, and a relative movement between the inkjet head and the substrate to be coated. Relative movement control means for controlling the relative movement means so that the speed of the relative movement by the relative movement means is reduced in accordance with the relative movement of the position from the vicinity area toward the separation area, An ink jet head is provided with an air discharge port facing the liquid discharge port, and an air flow is caused to flow out from the air discharge port, and the liquid discharge is performed. The balance between the liquid pressure in the mouth and the air pressure in the vicinity of the liquid discharge port generated by the air flow is determined by connecting the air flow path to the air discharge port to an empty state.
Select one of the two channels with different airflow resistance
Switching the air flow path to give pressure changes to the air flow
Thin film forming apparatus characterized by discharging liquid by changing at the. 2. An ink jet head having a plurality of fine nozzles for discharging a liquid, rotating means for rotating a substrate to be coated with the liquid discharged from the ink jet about a predetermined rotation axis, and the ink jet head. Relative movement means for relatively moving the substrate to be applied and the substrate to be applied between a region near the rotation axis with respect to the substrate and a separation region separated from the rotation axis, and a relative movement between the inkjet head and the substrate to be coated. Relative movement control means for controlling the relative movement means such that the angular velocity of rotation by the rotation means is reduced in accordance with the relative movement of the position from the vicinity area toward the separation area, the inkjet head comprising: However, an air discharge port is provided facing the liquid discharge port, and an air flow is caused to flow out from the air discharge port,
The liquid pressure of the liquid discharge ports, a balance state between the air pressure of the liquid discharge opening neighborhood caused by the air flow, before
Connected to the air flow path to the air outlet and to the air flow
Air flow by selecting one of two flow paths with different resistance
A thin film forming apparatus characterized in that the liquid flow is discharged by changing the flow path and applying a pressure change to the air flow . 3. An inkjet head having a plurality of fine nozzles for discharging a liquid, rotating means for rotating a substrate to be coated with the liquid discharged from the inkjet about a predetermined rotation axis, and the inkjet head Relative movement means for relatively moving the substrate to be applied and the substrate to be applied between a region near the rotation axis with respect to the substrate and a separation region separated from the rotation axis, and a relative movement between the inkjet head and the substrate to be coated. The position of the relative movement by the relative movement means decreases in accordance with the relative movement of the position from the vicinity area toward the separation area, and the relative position between the inkjet head and the substrate to be applied is changed from the vicinity area. The angular velocity of the rotation by the rotating means is reduced in accordance with the relative movement toward the separated area. Relative movement control means for controlling relative movement means, wherein the ink jet head is provided with an air discharge port opposite to the liquid discharge port, and allows an air flow to flow out from the air discharge port, and the liquid in the liquid discharge port is provided. The balance between the pressure and the air pressure in the vicinity of the liquid discharge port generated by the air flow is connected to the flow path of the air flow to the air discharge port.
One of two flow paths that are connected and have different resistance to air flow
Switch the air flow path to change the pressure to the air flow.
Thin film forming apparatus characterized by discharging liquid by changing by giving reduction. 4. The relative movement control means reduces the speed of the relative movement in inverse proportion to the movement distance in which the relative position between the ink jet head and the substrate to be applied moves relatively from the neighboring area toward the separated area. 4. The thin film forming apparatus according to 3. 5. The relative movement control means reduces the angular velocity of rotation in inverse proportion to the movement distance in which the relative position between the inkjet head and the substrate to be applied moves relatively from the neighboring area toward the separated area. The thin film forming apparatus as described in the above. 6. An air outflow head for discharging an air flow toward a substrate to be coated is provided adjacent to the ink jet head, and the air flow is applied to the substrate immediately after the liquid is discharged to the substrate to be coated. The thin film forming apparatus according to any one of claims 1 to 5, wherein the thin film flows to a coating substrate. 7. The thin film forming apparatus according to claim 1, wherein the liquid discharged from the inkjet head is a UV curable resin solution. 8. The thin film forming apparatus according to claim 1, wherein the substrate to be coated is made of polycarbonate. 9. The thin film forming apparatus according to claim 1, wherein the relative movement control means is a personal computer having a control program incorporated therein.