JP3232703B2 - Electroforming method for manufacturing nickel stamper for optical disk - Google Patents

Electroforming method for manufacturing nickel stamper for optical disk

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Publication number
JP3232703B2
JP3232703B2 JP28220192A JP28220192A JP3232703B2 JP 3232703 B2 JP3232703 B2 JP 3232703B2 JP 28220192 A JP28220192 A JP 28220192A JP 28220192 A JP28220192 A JP 28220192A JP 3232703 B2 JP3232703 B2 JP 3232703B2
Authority
JP
Japan
Prior art keywords
current density
electroforming
stamper
optical disk
electricity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP28220192A
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Japanese (ja)
Other versions
JPH06136588A (en
Inventor
和幸 千葉
美智雄 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
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Priority to JP28220192A priority Critical patent/JP3232703B2/en
Publication of JPH06136588A publication Critical patent/JPH06136588A/en
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Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、光ディスク用ニッケル
スタンパ製造のための電鋳方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming method for manufacturing a nickel stamper for an optical disk.

【0002】[0002]

【従来の技術】光ディスクは、フロッピーディスクやハ
ードディスクに比べ、その容量の大きさ及び記録密度の
高さなどに特徴があり、現在盛んに研究開発が行われて
いる。一般に、光ディスク用の基板は、上記の優れた特
徴を保持しながら、大量生産が可能なようにスタンパを
用いて射出成形によって生産されている。この際、スタ
ンパには、グル−ブやピットが形成されており、これら
が、光ディスクに転写されるようになっている。従っ
て、スタンパには、原盤としての高度な精度および射出
成形の際の耐久性が要求される。この耐久性は射出条件
にはもちろん、スタンパの信号面硬度にも大きく依存す
る。
2. Description of the Related Art Optical disks are characterized by their large capacity and high recording density, compared to floppy disks and hard disks, and are being actively researched and developed. In general, a substrate for an optical disc is produced by injection molding using a stamper so that mass production is possible while maintaining the above-mentioned excellent characteristics. At this time, grooves and pits are formed on the stamper, and these are transferred to the optical disk. Therefore, the stamper is required to have high precision as a master and durability during injection molding. This durability largely depends not only on the injection conditions but also on the signal surface hardness of the stamper.

【0003】これまでの光ディスク用スタンパの製造方
法は、例えば、以下に示すような方法で行われている。
すなわち、表面研磨したガラス基板にレジストを必要な
厚さにスピンコ−ト法で均一に塗布し、プリベ−ク後レ
−ザ−カッティングマシ−ンで所望のパターンに露光し
た後、レジストを現像してピット及び/又はグル−ブを
形成する。このピット及び/又はグル−ブを有するレジ
スト付きガラス基板表面上に銀あるいはニッケルなどを
無電解メッキ法、スパッタ法、あるいは真空蒸着法など
により被覆し、導電性を保持させた後、電鋳により任意
の厚みのニッケルを折出させる。その後、ニッケルをガ
ラス基板より剥離し、スタンパ信号面に残ったレジスト
を溶剤により除去し、洗浄する。そのあと裏面を研磨・
洗浄し次いで内・外径を加工してスタンパとして完成さ
せる。
[0003] A conventional method of manufacturing a stamper for an optical disc is performed by the following method, for example.
That is, a resist is uniformly coated on a glass substrate having a polished surface to a required thickness by a spin coating method, exposed to a desired pattern by a laser cutting machine after prebaking, and then developed. To form pits and / or groups. The surface of the resist-coated glass substrate having pits and / or grooves is coated with silver, nickel, or the like by electroless plating, sputtering, or vacuum evaporation to maintain conductivity, and then electroformed. Deposit nickel of any thickness. Thereafter, the nickel is peeled off from the glass substrate, and the resist remaining on the signal surface of the stamper is removed with a solvent and washed. Then polish the back side
After cleaning, the inner and outer diameters are processed to complete the stamper.

【0004】従来、ニッケルを折出させる際の電鋳方法
としては、電鋳時間の増大と共に電流密度を徐々に増加
する電鋳前期過程と電鋳時間の増大に関わりなく一定の
電流密度を維持する電鋳後期過程からなっていた。電鋳
前期過程はニッケルの厚みを徐々に増大させることによ
って、電鋳の際の発熱によるレジストのガラス原盤から
の剥離を防止するために行われている。また、電鋳後期
過程は得られるスタンパの物理特性を一定にするため
に、一定の電流密度で電鋳を行っている。
Conventionally, as an electroforming method for depositing nickel, a current density is gradually increased with an increase in the electroforming time, and a constant current density is maintained irrespective of an increase in the electroforming time. It was a late stage of electroforming. The first stage of electroforming is performed to prevent the resist from peeling off from the glass master by heat generated during electroforming by gradually increasing the thickness of nickel. In the latter stage of electroforming, electroforming is performed at a constant current density in order to keep the physical properties of the obtained stamper constant.

【0005】しかしながら、このように2種類の過程で
電鋳を行うと、スタンパの信号面硬度を支配する電鋳初
期過程において、電流密度が一定でないためにスタンパ
硬度の再現性が低下するだけでなく、期待された信号面
硬度を有するスタンパの製造が困難になる。これは射出
成型条件の大きな変更をもたらすだけでなく、成型によ
り得られるプラスチック基板の枚数が大きく変わること
になるという問題点があった。
[0005] However, when electroforming is performed in the two kinds of processes as described above, the reproducibility of the stamper hardness only decreases because the current density is not constant in the initial process of electroforming that governs the signal surface hardness of the stamper. Therefore, it becomes difficult to manufacture a stamper having the expected signal surface hardness. This not only causes a large change in the injection molding conditions, but also causes a problem that the number of plastic substrates obtained by molding greatly changes.

【0006】[0006]

【発明が解決しようとする課題】本発明の目的は、上記
問題点を解決し、信号面硬度の支配的因子である電鋳初
期過程において、硬度制御のために電流密度が一定であ
る過程を電鋳初期過程に設けることにより、信号面硬度
の制御が比較的容易であり、再現性があり、しかも歩留
まりの高い光ディスク用スタンパ製造のための電鋳方法
を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to carry out a process in which the current density is constant in order to control the hardness in the initial process of electroforming which is a dominant factor of the signal surface hardness. An object of the present invention is to provide an electroforming method for manufacturing a stamper for an optical disk which is relatively easy to control the hardness of a signal surface, has high reproducibility, and has a high yield by being provided in an initial step of electroforming.

【0007】[0007]

【課題を解決するための手段】本発明者らは、上記問題
点を解決するために鋭意検討を行った結果、電鋳により
光ディスク用スタンパを製造する際の電流波形およびそ
の時の電気量をより細かく制御することにより期待され
た信号面硬度を有するスタンパを得られることを見出
し、本発明を完成するに至った。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, have found that the current waveform and the quantity of electricity at the time of manufacturing an optical disk stamper by electroforming are improved. It has been found that a stamper having an expected signal surface hardness can be obtained by fine control, and the present invention has been completed.

【0008】すなわち本発明は、電鋳時間の増大と共に
電流密度を増加させる過程1、続いて信号面硬度を制御
するための一定の電流密度を維持する過程2、再び時間
の増大と共に電流密度を増加させる過程3、および一定
の電流密度を維持する過程4からなる電流密度波形を用
いて電鋳を行うことを特徴とする光ディスク用ニッケル
スタンパ製造のための電鋳方法である。
That is, the present invention provides a process 1 for increasing the current density with an increase in the electroforming time, a process 2 for maintaining a constant current density for controlling the signal surface hardness, and again increasing the current density with an increase in time. An electroforming method for manufacturing a nickel stamper for an optical disc, characterized by performing electroforming using a current density waveform including a step 3 of increasing and a step 4 of maintaining a constant current density.

【0009】以下、本発明を図を用いて詳細に説明す
る。
Hereinafter, the present invention will be described in detail with reference to the drawings.

【0010】本発明の電流密度波形の模式的な一例を図
1に示す。比較のために、図2にこれまで用いられてい
た電流密度波形を示す。
FIG. 1 shows a schematic example of the current density waveform of the present invention. For comparison, FIG. 2 shows a current density waveform used so far.

【0011】過程1の電流密度の増大の割合は、レジス
ト表面に被覆された導電性膜の種類、厚み、そして電気
抵抗値などにもよるが、2ないし100A/dm2/h
rが望ましい。2A/dm2/hr未満であると、電解
液が弱酸性であるために導電膜の溶解が起きたり、ニッ
ケル析出の競争反応である水素ガスの発生が優先して起
こりスタンパの厚みに再現性が失われてしまったり、ま
た、100A/dm2/hrを越えると、上記したよう
に電気抵抗による発熱のためにレジストのガラス原盤か
らの剥離が生じるおそれがある。さらに、この過程の電
気量は全電気量に対して0.1%ないし3%であること
が望ましく、0.1%未満であると徐々に電流密度を増
大させることの目的が達成されず、3%を越えるとスタ
ンパの信号面硬度の制御の再現性が乏しくなる場合があ
る。この過程1においては、上述のように電流密度を時
間と共に増大させてゆくが、過程1における最終的電流
密度としては、過程2で所望する値と等しくすることが
望ましい。
The rate of increase in the current density in step 1 depends on the type, thickness and electric resistance of the conductive film coated on the resist surface, but it is 2 to 100 A / dm 2 / h.
r is desirable. If it is less than 2 A / dm 2 / hr, the electrolyte is weakly acidic, so that the conductive film is dissolved, or the generation of hydrogen gas, which is a competitive reaction of nickel deposition, takes precedence, and the thickness of the stamper is reproducible. Is lost, or if it exceeds 100 A / dm 2 / hr, the resist may peel off from the glass master due to heat generation due to electrical resistance as described above. Further, the amount of electricity in this process is desirably 0.1% to 3% with respect to the total amount of electricity. If the amount is less than 0.1%, the purpose of gradually increasing the current density is not achieved. If it exceeds 3%, the reproducibility of controlling the signal surface hardness of the stamper may be poor. In the process 1, the current density is increased with time as described above, but it is desirable that the final current density in the process 1 is equal to a value desired in the process 2.

【0012】過程2における一定の電流密度の値は、す
なわちこの値によりスタンパの信号面硬度が支配される
のであるが、電鋳液の組成、目的とするスタンパの信号
面硬度などにより異なるが、2ないし10A/dm2
望ましい。2A/dm2未満であると副電解反応が優先
して起きたり、内部応力が大きくなったりするため硬度
の再現性が低下したり、スタンパが変形する場合があ
る。10A/dm2を越えると、従来の電流密度波形と
大差なくなってしまう。
The value of the constant current density in the process 2, that is, the signal surface hardness of the stamper is governed by this value. The value varies depending on the composition of the electroforming solution, the target signal surface hardness of the stamper, and the like. 2 to 10 A / dm 2 is desirable. If it is less than 2 A / dm 2 , the secondary electrolytic reaction occurs preferentially, or the internal stress increases, so that the reproducibility of the hardness may decrease or the stamper may be deformed. If it exceeds 10 A / dm 2 , there will be no significant difference from the conventional current density waveform.

【0013】この時の電気量は全電気量に対して3%な
いし20%であることが望ましい。3%未満であると信
号面硬度は過程3および4の条件により優先的に支配さ
れ期待された信号面硬度が得られにくくなるだけでな
く、その再現性も乏しくなる。また、20%以上として
も何等差支えないが、信号面硬度の増大はほとんど見ら
れず、しかもこの過程における電流密度が小さいために
スタンパの製造時間が長くなるだけである。
The amount of electricity at this time is preferably 3% to 20% of the total amount of electricity. If it is less than 3%, the signal surface hardness is preferentially controlled by the conditions of the steps 3 and 4, and not only is it difficult to obtain the expected signal surface hardness, but also its reproducibility is poor. There is no problem even if it is 20% or more, but the signal surface hardness is hardly increased, and the current density in this process is small, so that only the stamper manufacturing time is lengthened.

【0014】過程3の電流密度の増大の割合は、すでに
ニッケルがある程度の厚さまで電析しているために過程
1よりも大きくすることができ、その値は特に限定され
るものではないが、10ないし200A/dm2/hr
が望ましい。10A/dm2/hr未満であってもよい
が時間がかかるだけである。また、200A/dm2
hrを越えると、電解反応によるジュール熱の発生のた
めに電鋳液温が局所的に急激に変化するため、再現性が
乏しくなる。また、ガラス原盤の割れが生じるおそれが
ある。この過程の電気量はスタンパの信号面硬度に再現
性が得られる限り特に限定されないが、全電気量に対し
て0.5%ないし10%であることが望ましく、0.5
%未満であると電鋳時の発熱、10%を越えると電鋳時
間の増大を引き起こす可能性がある。この過程3におい
ては、上述のように電流密度を時間と共に増大させてゆ
くが、過程3における最終的電流密度としては、過程4
で所望する値と等しくすることが望ましい。
The rate of increase in the current density in step 3 can be made larger than in step 1 because nickel has already been deposited to a certain thickness, and the value thereof is not particularly limited. 10 to 200 A / dm 2 / hr
Is desirable. It may be less than 10 A / dm 2 / hr, but it only takes time. Also, 200 A / dm 2 /
If the heating time exceeds hr, the temperature of the electroforming solution rapidly changes locally due to the generation of Joule heat due to the electrolytic reaction, so that the reproducibility becomes poor. In addition, there is a possibility that the glass master is cracked. The amount of electricity in this process is not particularly limited as long as reproducibility is obtained in the signal surface hardness of the stamper, but is preferably 0.5% to 10% with respect to the total amount of electricity.
If it is less than 10%, heat generation during electroforming may occur, and if it exceeds 10%, the electroforming time may be increased. In this step 3, the current density is increased with time as described above, but the final current density in step 3 is as follows.
Is desirably equal to the desired value.

【0015】過程4の電流密度は、電鋳液組成、電鋳上
がりの裏面粗さなどにより任意に決定することができる
が、8ないし30A/dm2とすることが望ましい。8
A/dm2未満であると本発明の効果がほとんどなく、
30A/dm2より大きいと電鋳終了のわずかなタイミ
ングのズレや電気量計の測定誤差などにより、スタンパ
の厚みが所望したものと異なってしまう恐れがある。
The current density in step 4 can be arbitrarily determined according to the composition of the electroforming solution, the roughness of the electroformed back surface, and the like, but is preferably 8 to 30 A / dm 2 . 8
When it is less than A / dm 2 , the effect of the present invention is hardly obtained,
If it is larger than 30 A / dm 2 , the thickness of the stamper may be different from the desired thickness due to a slight timing deviation of the end of the electroforming or a measurement error of the electric meter.

【0016】レジスト表面の導電性の付与の方法は、特
に限定されるものではないが、スパッタ法、真空蒸着
法、および無電解メッキ法などの通常の方法を例示する
ことができる。また、その際に用いられる金属も特に限
定されるものではなく、銀、ニッケル、あるいはそれら
を主成分とする合金などを例示することができる。
The method for imparting conductivity to the resist surface is not particularly limited, and examples thereof include ordinary methods such as a sputtering method, a vacuum deposition method, and an electroless plating method. In addition, the metal used at that time is not particularly limited, and examples thereof include silver, nickel, and alloys containing these as a main component.

【0017】[0017]

【発明の効果】以上の説明から明らかなように、本発明
によれば、スタンパの信号面硬度を制御することがで
き、スタンパの耐久性の向上、射出成型条件の安定化、
およびそれによる基板特性の改善、基板生産コストの低
減などの効果がある。
As is clear from the above description, according to the present invention, the signal surface hardness of the stamper can be controlled, the durability of the stamper can be improved, the injection molding conditions can be stabilized, and the like.
Further, there are effects such as improvement of substrate characteristics and reduction of substrate production cost.

【0018】[0018]

【実施例】本発明をさらに詳細に説明するために以下に
実施例をあげるが、本発明はこれらに限定されるもので
はない. 実施例1 450g/lのスルファミン酸ニッケル4水和物、35
g/lのほう酸、5g/lの塩化ニッケル6水和物およ
びピット防止剤を主成分とする50℃の電鋳液におい
て、過程1の電流密度の増大の割合を50A/dm2
hr、過程2の一定電流密度を3A/dm2、過程3の
電流密度の増大の割合を100A/dm2/hr、過程
4の一定電流密度を10A/dm2とし、またそれぞれ
の電気量の割合は1%、10%、5%および84%とし
て、信号面硬度が約260である光ディスク用ニッケル
スタンパを製造した。
EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto. Example 1 450 g / l nickel sulfamate tetrahydrate, 35
g / l of boric acid, 5 g / l of nickel chloride hexahydrate and an anti-pitting agent at 50 ° C. in an electroforming solution at 50 ° C., the rate of increase in current density in step 1 was 50 A / dm 2 /
hr, the constant current density in step 2 is 3 A / dm 2 , the rate of increase in current density in step 3 is 100 A / dm 2 / hr, the constant current density in step 4 is 10 A / dm 2 , The nickel stamper for an optical disk having a signal surface hardness of about 260 was manufactured with the proportions of 1%, 10%, 5% and 84%.

【0019】実施例2 過程2の一定電流密度を4A/dm2とした以外は、実
施例1と同様の方法で信号面硬度が約250である光デ
ィスク用ニッケルスタンパを製造した。
Example 2 A nickel stamper for an optical disk having a signal surface hardness of about 250 was manufactured in the same manner as in Example 1 except that the constant current density in Step 2 was changed to 4 A / dm 2 .

【0020】実施例3 過程2の一定電流密度を8A/dm2とした以外は、実
施例1と同様の方法で信号面硬度が約220である光デ
ィスク用ニッケルスタンパを製造した。
Example 3 A nickel stamper for an optical disk having a signal surface hardness of about 220 was manufactured in the same manner as in Example 1 except that the constant current density in Step 2 was changed to 8 A / dm 2 .

【0021】実施例4 過程2の電気量の割合を20%、過程4の電気量の割合
を74%とした以外は、実施例1と同様の方法で信号面
硬度が約265である光ディスク用ニッケルスタンパを
製造した。
Example 4 For an optical disk having a signal surface hardness of about 265 in the same manner as in Example 1, except that the ratio of the amount of electricity in Step 2 was 20% and the ratio of the amount of electricity in Step 4 was 74%. A nickel stamper was manufactured.

【0022】実施例5 過程2の電気量の割合を3%、過程4の電気量の割合を
82%とした以外は、実施例1と同様の方法で信号面硬
度が約240である光ディスク用ニッケルスタンパを製
造した。
Example 5 For an optical disk having a signal surface hardness of about 240 in the same manner as in Example 1, except that the ratio of the amount of electricity in Step 2 was 3% and the ratio of the amount of electricity in Step 4 was 82%. A nickel stamper was manufactured.

【0023】実施例6 過程1の電流密度の増大の割合を10A/dm2/hr
とした以外は、実施例1と同様の方法で信号面硬度が約
265である光ディスク用ニッケルスタンパを製造し
た。
Example 6 The rate of increase in current density in step 1 was 10 A / dm 2 / hr
A nickel stamper for an optical disk having a signal surface hardness of about 265 was manufactured in the same manner as in Example 1 except that the above conditions were satisfied.

【0024】実施例7 過程1の電流密度の増大の割合を100A/dm2/h
rとした以外は、実施例1と同様の方法で信号面硬度が
約255である光ディスク用ニッケルスタンパを製造し
た。
Example 7 The rate of increase in current density in step 1 was 100 A / dm 2 / h
A nickel stamper for an optical disk having a signal surface hardness of about 255 was manufactured in the same manner as in Example 1 except that r was changed to r.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明による電流密度波形の一例を示す図で
ある。
FIG. 1 is a diagram showing an example of a current density waveform according to the present invention.

【図2】 従来用いられている電流密度波形の一例を示
す図である。
FIG. 2 is a diagram showing an example of a current density waveform conventionally used.

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 光ディスク用ニッケルスタンパ製造のた
めの電鋳方法において、電鋳時間の増大と共に電流密度
を増加させる過程1、続いて一定の電流密度を維持する
過程2、再び時間の増大と共に電流密度を増加させる過
程3、および一定の電流密度を維持する過程4からなる
電流密度波形を用いるとともに、前記過程1における電
流密度の増大の割合を2A/dm 2 /hr〜100A/
dm 2 /hr、その電気量を電鋳に要する全電気量に対
して0.1%〜3%、前記過程2における電流密度の値
を2A/dm 2 〜10A/dm 2 、その電気量を電鋳に要
する全電気量に対して3%〜20%として電鋳を行うこ
とを特徴とする光ディスク用ニッケルスタンパ製造のた
めの電鋳方法。
1. An electroforming method for manufacturing a nickel stamper for an optical disk, comprising: a step 1 for increasing the current density as the electroforming time increases, a step 2 for maintaining a constant current density, and a current again as the time increases. electrostatic Rutotomoni, in the process 1 using a current density waveform consisting of process 4 to maintain the process increasing the density 3, and a constant current density
The rate of increase of the flow density is 2 A / dm 2 / hr to 100 A /
dm 2 / hr, the amount of electricity corresponds to the total amount of electricity required for electroforming.
0.1% to 3%, the value of the current density in the step 2
2 A / dm 2 to 10 A / dm 2 , and the amount of electricity required for electroforming
3% to 20% and to electroforming electroforming process for the nickel stamper manufacturing optical disc and performs the total amount of electricity.
【請求項2】 時間の増大と共に電流密度を増加させる
過程3における電流密度の増大の割合が、10A/dm
2/hr〜200A/dm2/hrである請求項1に記載
の光ディスク用ニッケルスタンパ製造のための電鋳方
法。
2. The method according to claim 2, wherein the rate of increase in current density in step 3 of increasing current density with increasing time is 10 A / dm.
The electroforming method for manufacturing a nickel stamper for an optical disk according to claim 1, wherein the pressure is in the range of 2 / hr to 200A / dm2 / hr.
【請求項3】 時間の増大と共に電流密度を増加させる
過程3における電気量が、電鋳に要する全電気量に対し
て0.5%〜10%である請求項1又は2に記載の光デ
ィスク用ニッケルスタンパ製造のための電鋳方法。
3. The optical disk according to claim 1, wherein the amount of electricity in step 3 of increasing the current density with increasing time is 0.5% to 10% of the total amount of electricity required for electroforming. Electroforming method for nickel stamper production.
【請求項4】 一定の電流密度を維持する過程4におけ
る電流密度の値が、8A/dm2〜30A/dm2である
請求項1〜のいずれか1項に記載の光ディスク用ニッ
ケルスタンパ製造のための電鋳方法。
4. A value of the current density in the process 4 to maintain a constant current density, the nickel stamper for manufacturing the optical disc according to any one of claims 1 to 3 which is 8A / dm 2 ~30A / dm 2 Method for electroforming.
JP28220192A 1992-09-29 1992-09-29 Electroforming method for manufacturing nickel stamper for optical disk Expired - Fee Related JP3232703B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28220192A JP3232703B2 (en) 1992-09-29 1992-09-29 Electroforming method for manufacturing nickel stamper for optical disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28220192A JP3232703B2 (en) 1992-09-29 1992-09-29 Electroforming method for manufacturing nickel stamper for optical disk

Publications (2)

Publication Number Publication Date
JPH06136588A JPH06136588A (en) 1994-05-17
JP3232703B2 true JP3232703B2 (en) 2001-11-26

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Family Applications (1)

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Country Link
JP (1) JP3232703B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100197145B1 (en) * 1989-12-19 1999-06-15 후지이 히로시 Method for phosphating metal surface with zinc phosphate

Also Published As

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