JP3230632B2 - Manufacturing method of composite card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite card having the functions of an IC card and an optical card.

[0002]

2. Description of the Related Art Conventionally, various methods for manufacturing an IC card have been known. For example, as shown in FIG.
A method of making a hole 18 of the size of an IC module in two layers of the three-layer sheet 17 of VC) and embedding the IC module 9 in the hole, or making a hole of the size of the IC module as shown in FIG. After assembling the IC module 9 into the single-layer sheet 19 of PVC, the cover sheet 20 of PVC
Are known.

On the other hand, an optical card is manufactured by extruding a resin substrate having excellent transparency, such as an acrylic resin or a polycarbonate, by injection molding, casting or the like, and providing an optical recording layer on the resin substrate. In addition, a method of covering the surface with a protective layer and laminating the same is performed.

[0004]

On the other hand, as a conventional method for manufacturing a composite card, a method for forming a hole for mounting an IC module on a card substrate provided with an optical recording layer, a method for mounting the IC module in the hole, Alternatively, a general method is to form a hole for incorporating an IC module in a card substrate, provide an optical recording layer on the substrate, and then incorporate the IC module into the hole.

[0005] However, as in the above-described conventional method of manufacturing an IC card, when a hole is formed in a substrate, there is a problem in that the work is troublesome and the substrate is distorted due to the hole making.

[0006] Further, the card substrate that has been punched has a rough surface condition in terms of handling at the time of processing, and has a lot of dirt. .

[0007] Further, when an optical recording layer is formed on a card substrate in advance and laminated with a protective layer and then a hole for IC is formed, the same problem as described above occurs, and in some cases, peeling may occur. A way was sought.

The present invention has been made in order to improve such disadvantages of the prior art, and has a good surface condition of a substrate, good flatness without distortion of the substrate during processing, and good peeling. It is an object of the present invention to provide a method of manufacturing a composite card without any problem.

[0009]

That SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a composite card comprising an IC memory and an optical recording layer on a card substrate, Note formed shaped or pre-I by injection molding
Substrate provided with through-hole for incorporating C module
Forming an optical recording layer thereon, the substrate and the IC module
And an adhesive layer with holes to incorporate
A method for manufacturing a composite card, comprising stacking substrates and incorporating an IC module into the formed hole.

In the present invention, a transparent substrate is used for the card substrate on the side where light to be recorded / reproduced on the optical recording layer is incident.
A protection substrate is provided on the opposite card substrate, and the protection substrate may be transparent or opaque.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the embodiments shown in the drawings.

Embodiment 1 FIG. 1 is an explanatory view showing an embodiment of a method of manufacturing a composite card according to the present invention, and FIG. 2 is an explanatory view showing a manufactured composite card. In the figure, preformat pattern 2 and IC
The optical recording layer 4 was provided on the preformat pattern of the transparent substrate 1 (thickness: 400 μm) in which the module mounting holes 3 were provided in advance by a casting method.

Next, an adhesive layer 5 having a hole for incorporating an IC module (thickness: 50 μm), a protective substrate 6 having a similar hole for incorporating an IC module (thickness: 150 μm), and an adhesive layer 7 having no hole ( Another protective substrate 8 (thickness: 110 μm) having no hole and a hole was laminated. After laminating, IC
The composite card 10 was produced by incorporating the module 9.

Embodiment 2 FIG. 3 is an explanatory view showing another embodiment of the method for manufacturing a composite card according to the present invention, and FIG. 4 is an explanatory view showing the manufactured composite card. In the figure, a preformat pattern and I
The optical recording layer 4 was provided on a preformat pattern of a transparent substrate 11 (240 μm thick) in which holes for mounting a C module were previously provided by an injection molding method.

Next, an adhesive layer 12 (thickness: 50 μm) provided with a hole for incorporating an IC module, and a protective substrate 13 (thickness: 310 μm) provided with a hole for incorporating an IC module
m), an adhesive layer 15 having no hole (thickness: 50 μm), and another transparent substrate 14 having no hole (thickness: 110 μm) were laminated. After lamination, the IC module 9 was incorporated into the hole thus formed to produce a composite card 16.

[0016]

As described above, according to the present invention, it is not necessary to drill a hole in a substrate, (1) labor can be saved, cost can be reduced, and (2) distortion does not occur during processing. Since a card with good flatness could be manufactured and the surface condition of the substrate was good, there was obtained an effect of (3) having no adverse effect on the optical recording layer and (4) having no problem of peeling at the time of drilling.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a method of manufacturing a composite card according to the present invention.

FIG. 2 is an explanatory diagram showing a composite card manufactured by the method of FIG. 1;

FIG. 3 is an explanatory view showing another embodiment of the method for manufacturing a composite card according to the present invention.

FIG. 4 is an explanatory diagram showing a composite card manufactured by the method of FIG. 3;

FIG. 5 is a process chart showing a conventional method for manufacturing an IC card.

FIG. 6 is a process chart showing another example of a conventional method for manufacturing an IC card.

[Explanation of symbols]

 1,11,14 Transparent substrate 2 Preformat pattern 3 Hole 4 Optical recording layer 5,7,12,15 Adhesive layer 6,8,13 Protective substrate 9 IC module 10,16 Composite card 17 Three-layer sheet of PVC 18 Hole for IC module 19 Single-layer sheet of PVC 20 Cover sheet

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G06K 19/07-19/08 B42D 15/10

Claims (3)

(57) [Claims] In a method for manufacturing a composite card having an IC memory and an optical recording layer on a card substrate, a injection molding or injection molding method is used.
A pre-injection mold for mounting an IC module in advance
Forming an optical recording layer on a substrate provided with through holes;
And a connection provided with a hole for incorporating the IC module.
A method for manufacturing a composite card, comprising laminating a deposition layer and a flat substrate without holes, and incorporating an IC module into the formed holes. 2. The IC module according to claim 1, further comprising:
An adhesive layer provided with a hole for incorporating the
Board with holes for incorporating joules and no holes
Laminate a flat adhesive layer and a flat substrate without holes
2. The composite according to claim 1, wherein the IC module is incorporated in the hole.
Card manufacturing method. 3. The IC module on an optical recording layer side of the substrate.
An adhesive layer provided with a hole for incorporating the
Laminate boards with holes for incorporating joules
On the opposite side of the substrate from the optical recording layer, a flat adhesive layer without holes
And a flat substrate without holes are laminated, and the IC
2. The production of a composite card according to claim 1, which incorporates a module.
Method.