JP3228875U - Structure of deep UV LED module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of a deep ultraviolet LED module which reduces a package cost, shields a package substrate, and reduces a loss due to refraction of a plurality of optical paths. SOLUTION: The deep ultraviolet LED module structure is mainly composed of a base 2, a transparent material layer 3, a die deep ultraviolet LED chip 4, and a substrate 5. A base 2 having a substrate 5 inside and installing a cup body 21, a transparent material layer 3 installed at the upper end of the cup body 21, and a transparent material layer 3 installed in the cup body 21 of the base 2 are installed on the substrate 5. It is provided with a die LED chip 4 that is installed and directly adhered to the substrate 5 or adhered to the flat substrate and then adhered to the substrate 5, the substrate 5 is further connected to the drive circuit 6, and the drive circuit 6 is the LED of the die. The chip 4 is driven, and the base 2, the substrate 5, the cup body 21, and the transparent material layer 3 are overformed. [Selection diagram] Fig. 2

Description

The present invention relates to the field of semiconductor technology and the coupling of mechanisms, and more particularly to the structure of deep ultraviolet (DUV) LED modules.

Light emitting diodes (abbreviated as LED modules) are solid semiconductor light emitting equipment. With the development of the above-mentioned technology, the frequency band of the LED module is gradually developing from the initial monochromatic wavelengths such as red light and blue light to ultraviolet rays (UV) and further to DUV.

Deep Ultraviolet (DUV) LEDs (hereinafter referred to as DUV LEDs for short) are particularly applied to the purification and sterilization of air, water, food, or medical supplies.

The DUV LED package structure shown in FIG. 3 includes a substrate 11, at least one DUV LED chip 12, and quartz glass 13, and employs a sealed package made of an adhesive material. Conventional package structures, especially DUV LED package structures, generally employ an all-inorganic material package. After metallizing the bonded portion of the quartz glass 13 and the substrate 11 first, the quartz glass 13, the adhesive material, and the substrate 11 are crimped at a high temperature to prevent the LED chip 12 from getting wet or dirty. However, the yield and sealing cost of the inorganic packaging process are issues. After improving the package edge, surface mount crimping with an organic material that does not contain quartz glass 13, silicone, rubber, etc. will greatly improve the process complexity and yield, but the organic material will be irradiated with DUV LEDs. It gradually deteriorates and may lose the LED chip protection function, especially with the high power DUV LED chip. Further, in the conventional patent documents, for example, there is a description of "ultraviolet LED device" in Patent Document 1 and "package structure of ultraviolet LED lamp" in Patent Document 2, that is, by improving the organic package structure, it is organic. It alleviates the problem that the material deteriorates when exposed to DUV.

China Utility Model Registration No. CN205960022U Gazette China Utility Model Registration No. CN208904057U Gazette

However, as shown in FIG. 3, there are many restrictions on the selection and process of packaging materials. After the light beam is emitted from the DUV LED chip 12, it enters the cup body and then is transmitted to the outside world via the quartz glass 13. The angle of the substrate 11, the reflectance, and the transmittance of the quartz glass 13 have a significant effect on the light extraction efficiency.

The external quantum efficiency and photoelectric conversion efficiency of DUV LEDs are less than 3%, and related companies are actively trying to solve the problem of how to improve the material deletion of the conventional package structure and increase the DUV intensity. This is an issue.

Therefore, the present inventor considered that the above-mentioned drawbacks could be improved, and as a result of diligent studies, he came up with the proposal of the present invention to effectively improve the above-mentioned problems by rational design.

The present invention has been made in view of such conventional problems. In order to solve the above problems, the main object of the present invention is to provide a structure of a deep ultraviolet LED module. In other words, we embarked on the packaging, optical refraction method, electrical circuit layout, heat dissipation structure, cup body angle design, redefined the design of the DUV LED module structure, increased the radiant intensity of the DUV, and multiple optical paths. It provides a modular structure that reduces refraction loss and delays the deterioration of the base under DUV irradiation.

The main idea for achieving the above object is to provide a base for mounting a substrate, a cup body is internally provided in the base, and a transparent material layer is installed in the upper end of the cup body. A structure in which a deep ultraviolet LED chip of a die is internally provided in the base, the deep ultraviolet LED chip of the die is further adhered to the substrate, and the base, the substrate, and the deep ultraviolet LED chip of the die are overmolded. Has.

In a preferred example of the present invention, the substrate is connected to a drive circuit, which is used to control the deep UV LED chip of the die.

In a preferred example of the present invention, the transparent material layer and the cup body exhibit a predetermined angle, and when the deep ultraviolet LED on the deep ultraviolet LED chip of the die emits light, it is dispersed in multiple directions or in a single direction. Increases the reflectance of the cup body to the LED to improve the efficiency of light extraction.

In a preferred example of the present invention, the substrate has a structure in which an inorganic material and a fluorine material are bonded to a high thermal conductive material such as a ceramic or aluminum substrate, and the substrate achieves high reflectance and anti-ultraviolet irradiation.

In a preferred example of the present invention, a heat sink is provided at the lower end of the substrate, and the heat sink conducts heat to the outside environment to extend the service life.

In a preferred example of the present invention, the transparent material layer is a flat type, thin film type, or angular type transparent material layer.

In a preferred example of the present invention, the cup body has an angle-adjustable structure and is adjusted to a required radiant intensity according to the user's demand.

Other features of the present invention will be clarified by the description in this specification and the accompanying drawings.

It is an inclination view which showed the structure of the deep ultraviolet LED module which concerns on one Embodiment of this invention. It is sectional drawing which showed the structure of the deep ultraviolet LED module which concerns on one Embodiment of this invention. It is a figure which shows the structure of the conventional LED module.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It goes without saying that the present invention is not limited to the following examples, and can be arbitrarily changed without departing from the gist of the present invention.

The ultraviolet LED module structure 1 of the embodiment of the present invention is mainly composed of a base 2, a transparent material layer 3, a die deep ultraviolet LED chip 4, and a substrate 5 (see FIGS. 1 and 2).

The base 2 is used to construct the substrate 5, the cup body 21 is installed on the base 2, and the base 2 is equipped with equipment that requires an ultraviolet light for sterilization such as a background germicidal lamp and an RO reverse osmosis germicidal lamp. Will be set up. In a preferred embodiment, the base 2 is provided with a male screw portion used for screwing, but the outer shape of the base 2 is not limited to this, and a high-speed engagement / disengagement type latch structure or a fixing screw tightening structure may be provided directly on the finished product. .. Alternatively, a tubular structure as shown in FIGS. 1 and 2 may be used, all of which are methods in which the present invention can be operated.

As shown in FIG. 2, the cup body 21 has a specific angle, and the cup body 21 adjusts the angle according to the demand and the radiation angle according to the user's need.

As shown in FIG. 2, the transparent material layer 3 is mounted on the upper end of the cup body 21, and the transparent material layer 3 is a flat lens or a thin film type or an angle type transparent material, and is made of a fluorine-based material or quartz glass. It may be manufactured. The above-mentioned fluorine-based material or quartz glass is an anti-ultraviolet material. Further, the transparent material layer 3 has different light angles, and the transparent material layer 3 and the base 2 are tightened so as to be connected by the seal gasket 7.

As shown in FIG. 2, the deep ultraviolet LED chip 4 of the die is mounted on the substrate 5, and the deep ultraviolet LED chip 4 of the die is mounted with the deep ultraviolet LED. Due to the reflection on the cup body 21, the generated deep ultraviolet (DUV) is completely refracted, and the loss of the optical path is reduced. The cup body 21 conducts deep ultraviolet rays (DUV) generated by the deep ultraviolet LED chip of the die to the outside world.

As shown in FIG. 2, at least one drive circuit 6 and a substrate 5 are connected, and the drive circuit 6 is used to drive the deep ultraviolet LED chip 4 of the die on and off. This design is known as the DUV LED Driver on Board (DL-DOB). Further, at least one seal gasket 7 is provided internally in the base 2 to prevent water and contaminated gas from entering and losing light.

As shown in FIG. 2, as the substrate 5, a ceramic substrate, an aluminum substrate, an inorganic material having high thermal conductivity such as a copper substrate, or an organic material of a substrate that blocks DUV irradiation may be selected and manufactured or configured. ..

As shown in FIG. 2, in the ultraviolet LED module structure 1, the drive circuit 6 selects a welding method and connects to the substrate 5. Further, by directly installing the heat sink 8 and the deep ultraviolet LED chip 4 of the die, heat is dissipated at a higher speed, the member is prevented from being damaged by heat, and the life of the product is extended.

Subsequently, the features of the ultraviolet LED module structure 1, the base 2, the transparent material layer 3, the deep ultraviolet LED chip 4 of the die, the substrate 5, the drive circuit 6, the seal gasket 7, and the heat sink 8 are installed and then overformed. Will be described.

As shown in FIG. 2, a refraction light cup 9 having a specific reflection angle is further installed at the upper end of the transparent material layer 3, and the transparent material layer 3 is stably bonded.

As described above, the configuration of the ultraviolet LED module structure 1 of the present invention has the following advantages.

1. 1. In the infrared LED module structure 1, the LED chip 4 of the die is mounted on the substrate 5, and the cost of the inorganic or organic package is reduced.

2. The UV LED module structure uses an inorganic, anti-UV transparent material, and highly reflective material as the coating material to shield the base 2 irradiated with DUV, and the base is directly irradiated with the conventional inorganic package or organic package. To improve the problem.

3. 3. In the UV LED module structure, the DUV module, mechanism, and electric circuit are integrated into one, and the entire structure is modularized to provide high convenience of installation.

4. The infrared LED module structure 1 provides a DUV LED module structure designed from the angle of the package, optics, electric circuit, and structure, so that the complex package structure is costly, the reflectance of the package substrate is low, and the vertical substrate is used. It also solves the problem that the flat transparent material layer reflects most of it, and reduces the loss due to refraction of multiple optical paths.
5. The LED chip 4 of the die can be equipped with a deep ultraviolet LED, and can also be equipped with a white light LED, an infrared LED, or the like according to demand, and provides various types of light sources according to the needs of the user.

The infrared LED module structure 1 of the above-described embodiment is merely for explaining the technical idea and features of the present invention, and it is recommended that a person familiar with the technical field understand the contents of the present invention and implement the present invention. The purpose is not to limit the scope of claims for utility model registration of the present invention. Therefore, various improvements or modifications having similar effects made without departing from the spirit of the present invention shall be included in the claims described below.

1 UV LED module structure 2 Base 21 Cup body 3 Transparent material layer 4 Die deep UV LED chip 5 Board 6 Drive circuit 7 Seal gasket 8 Heat sink 9 Refractive light cup 11 Board 12 DUV LED chip 13 Transparent material

Claims (9)

It is a structure of a deep ultraviolet LED module that is provided with a base for installing a substrate, a cup body is internally installed in the base, and a transparent material layer is installed at the upper end of the cup body.
A structure in which a deep ultraviolet LED chip of a die is internally provided in the base, the deep ultraviolet LED chip of the die is further adhered to the substrate, and the base, the substrate, and the deep ultraviolet LED chip of the die are overmolded. The structure of the deep UV LED module characterized by having. The structure of the deep ultraviolet LED module according to claim 1, wherein the substrate is connected to a drive circuit, and the drive circuit is used for controlling the deep ultraviolet LED chip of the die. The transparent material layer and the cup body exhibit a predetermined angle, and when the deep ultraviolet LED on the deep ultraviolet LED chip of the die emits light, it is dispersed in multiple directions or the reflectance of the reflective cup in a single direction. The structure of the deep ultraviolet LED module according to claim 1, wherein the light is extracted efficiently. The first aspect of the present invention is characterized in that the substrate has a structure in which an inorganic material and a fluorine material are bonded to a high thermal conductive material such as a ceramic or aluminum substrate, and the substrate achieves high reflectance and anti-ultraviolet irradiation. The structure of the deep UV LED module described. The structure of the deep infrared LED module according to claim 1, wherein a heat sink is provided at the lower end of the substrate, and the heat sink conducts heat to the outside environment. The structure of the deep infrared LED module according to claim 1, wherein a flat transparent material, a thin film transparent material, or an angle transparent material is used as the transparent material layer. The structure of the deep ultraviolet LED module according to claim 1, wherein the cup body has a structure in which the angle can be adjusted, and the radiation intensity is adjusted to a required level according to the demand of the user. The structure of the deep infrared LED module according to claim 1, wherein a refraction light cup having a specific reflection angle is further installed at the upper end of the transparent material layer, and the transparent material layer is stably bonded. The first aspect of the invention is characterized in that the deep ultraviolet LED chip of the die is further equipped with a white light LED or an infrared LED, or the two types of light sources are integrated into the deep ultraviolet LED of the die. The structure of the deep UV LED module described.

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