JP3228785B2 - Measuring method and measuring device for high frequency element - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for measuring a high-frequency device for measuring electrical characteristics of a high-frequency device of a surface mount type.

[0002]

2. Description of the Related Art As a conventional measuring apparatus of this type, for example, there is one as shown in FIGS. 3 and 4
Are two lead terminals 2 from the two sides of the flat package type package body 1, for a total of four lead terminals 2.
Is a measuring device for measuring the electrical characteristics of the high-frequency element 3 from which the above-mentioned is derived.

[0005] The measuring table 10 of these measuring devices is constituted by a microstrip structure. That is,
On a dielectric substrate 13 in which a dielectric 12 is laminated on a grounded conductor 11, two lead terminals 2 for input / output of the high-frequency element 3, an input connector 14 for inspection, and an output connector 15 are provided. Two strip conductors 16 for electrical connection are provided, respectively, and two ground pads 17 for connecting the other two lead terminals 2 to the ground.
Are also provided on the dielectric substrate 13. Each ground pad 17 is electrically connected to the conductor 11 via a through hole 18 formed in the dielectric 12. The conductor 11
The strip conductor 16 is made of, for example, solder-plated copper (Cu), and the dielectric 12 is made of fluorine resin, alumina (Al ₂ O ₃ ), or the like.

In order to place the high-frequency element 3 on the measuring table 10 and to fix each lead terminal 2 of the high-frequency element 3 to the strip conductor 16 or the ground pad 17 of the measuring table 10 during measurement. 3 uses a holding jig 20 for holding each lead terminal 2 from above, and the measuring apparatus of FIG. 4 uses a holding jig 30 for holding the package body 1 from above.

A holding jig 20 shown in FIG. 3 is a member 2 for holding each lead terminal 2 under a metal upper lid 21.
2 is attached. Also, the member 22
Is made of a dielectric material so that no current flows from the lead terminal 2. On the other hand, the holding jig 30 shown in FIG. 4 is also configured such that a member 32 made of a dielectric material for holding the package body 1 is attached to the lower portion of the metal upper lid 31.

[0006]

By the way, in order to measure the characteristics of the high-frequency element 3 correctly, the measuring table 10 having the above-mentioned microstrip structure is designed so that the impedance of the measuring table 10 becomes a predetermined value. Is designed in advance. However, the holding jig 20 of the measuring device as shown in FIG. 3 includes a member 22 made of a dielectric between the lead terminal 2 which is a conductor and the upper lid 21 of the holding jig 20.
, And a capacitor is formed, thereby generating a parasitic capacitance. Since the parasitic capacitance is included in the measured value, the high-frequency element 3 cannot be measured accurately.

Further, in a measuring device as shown in FIG.
Although the problem of the parasitic capacitance as described above does not occur so much, since each lead terminal 2 is not directly pressed, each lead terminal 2
There is a problem that the connection between the strip conductor 16 and the grounding pad 17 becomes unstable.

[0008] The present invention has been made in view of such circumstances, and stably connects a lead terminal to a strip conductor, eliminates the influence of parasitic capacitance, and performs high-accuracy measurement of a high-frequency element. An object of the present invention is to provide a method and an apparatus for measuring a high-frequency element which can be performed well.

[0009]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a method for measuring an electrical characteristic of a surface-mount type high-frequency element, comprising: a detachable measuring table and a holding jig which act on each other to form a shielded strip structure. A high-frequency element is mounted on a strip conductor formed on the measuring table using a tool, and the holding jig is covered so that the strip conductor and a lead terminal of the high-frequency element are in press contact with each other. And measuring the electrical characteristics of the high-frequency element in a state where the high-frequency element is included by the holding jig.

According to a second aspect of the present invention, there is provided a high frequency device measuring apparatus for measuring electrical characteristics of a surface mount type high frequency device, wherein a first dielectric is laminated on a grounded first conductor, A measurement table having a strip conductor on which a lead terminal of the high-frequency element is mounted on a first dielectric, and a concave portion including a package body of the high-frequency element mounted on the measurement table. , A second grounded hole is formed on the lower surface of the second dielectric, and a second grounded ground is formed on the upper surface of the second dielectric.
And a holding jig formed by laminating conductors.

[0011]

The operation of the first aspect of the invention is as follows. That is, the measuring table on which the high-frequency element is mounted and the holding jig which presses the lead terminal of the high-frequency element against the strip conductor formed on the measuring table act on each other in the measurement state including the high-frequency element. Together, they form a shielded strip structure. Therefore, if the impedance of a measuring device having such a shielded strip structure is set in advance, when measuring a high-frequency element,
The impedance of the measuring device is reproduced as designed, and the measurement of the high-frequency element can be performed with high accuracy.

The operation of the invention described in claim 2 is as follows. That is, when measuring the high-frequency element, the holding jig is placed on the high-frequency element in a state where the strip conductor of the measuring table and the lead terminal of the high-frequency element are in opposing contact. The package body of the high-frequency element is included in a recess formed on the lower surface of the second dielectric of the holding jig, and the lead terminal of the high-frequency element is pressed by the strip conductor of the measuring table on the lower surface of the second dielectric. Therefore, the lead terminal and the strip conductor are reliably electrically connected. Further, since the configuration in which the strip conductor connected to the lead terminal is sandwiched between the first and second dielectrics and the dielectric is sandwiched between the grounded conductors is a so-called shielded strip structure, If the impedance of the measuring device is designed based on this structure, the impedance of the measuring device is reproduced as designed at the time of measuring the high-frequency element, and the characteristics of the high-frequency element are measured with high accuracy.

[0013]

An embodiment of the present invention will be described below with reference to the drawings. First, a configuration of a measuring device for a high-frequency device according to one embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing the configuration of the apparatus of the embodiment, and FIG. 2 is a view taken along the line AA of FIG. In this embodiment, a case where the electrical characteristics of the flat package type high frequency element 3 are measured will be described.

The apparatus of this embodiment is roughly divided into a measuring table 10 and a holding jig 40 similar to those of the prior art. As described above, the measurement table 10 includes a dielectric 12 laminated on a grounded conductor 11, a strip conductor 16 connected to input / output connectors 14, 15 and a ground pad 17 on the dielectric 12. Are provided. The ground pad 17 is electrically connected to the conductor 11 via a through hole 18 formed in the dielectric 12.

The holding jig 40 has a structure similar to that of the dielectric 12 of the measuring table 10 described above, that is, a lower surface of a dielectric 41 having the same material, the same dimensions, etc.
2, a conductor 43 grounded in the same manner as the conductor 11 of the measuring table 10 is laminated on the upper surface thereof.

The concave portion 42 on the lower surface of the dielectric 41 is provided so as to enclose the package body 1 of the high-frequency element 3 in a state where the high-frequency element 3 is placed at a predetermined position on the measuring table 10 as shown in the figure. It has a unique shape. As shown by the imaginary line in FIG. 1, when the holding jig 40 is put on the high-frequency element 3, the surface X (see FIG. 2) on the measurement table 10 where the dielectric 12 is exposed, and the holding jig. The lower surface of the dielectric 41 of 40 contacts,
The lower surface of the dielectric 41 is processed corresponding to the lead terminal 2 and the strip conductor 16 so that the lead terminal 2 is pressed against the strip conductor 16 or the ground pad 17.

As described above, the measurement by the apparatus of this embodiment is performed by placing the high-frequency element 3 at a predetermined position on the measuring table 10 and placing the holding jig 40 thereon. At this time, the measuring device includes the measuring table 10 and the holding jig 4.
In this state, the high-frequency element 3 and the strip conductor 16 are included in 0. That is, the grounded conductors 11, 43,
The high-frequency element 3 is placed between the integrated dielectrics 12 and 41.
Thus, a shielded strip structure sandwiching the lead terminal 2 and the conductor such as the strip conductor 16 is formed. Therefore, if the measuring table 10 and the holding jig 40 are designed so that the impedance of the measuring device becomes a predetermined value based on the characteristic formula of the well-known shielding strip structure, when the high-frequency element 3 is measured, The impedance of the measuring device is reproduced as designed, and the electrical characteristics of the high-frequency element 3 can be accurately measured.

In the above-described embodiment, an apparatus for measuring a flat package type high-frequency device has been described as an example. However, the present invention may be incorporated into another package as long as it is a surface mount type high-frequency device. The present invention can also be applied to a measurement device for a high-frequency element.

[0019]

As is apparent from the above description, according to the first aspect of the present invention, the high frequency element is interposed between the measuring table and the holding jig which act on each other to form the shielding strip structure. Since the electrical characteristics of the high-frequency element are measured while being included, if the impedance of a measuring device having a shielded strip structure is set in advance, the impedance according to the design value is reproduced at the time of measurement, and the high-frequency element is measured. Can be accurately measured.

According to the second aspect of the present invention, there is provided a holding jig in which a high-frequency element is placed at a predetermined position on a measuring table, and a concave portion for enclosing a package body of the high-frequency element is provided. Since the lead terminal of the high-frequency element is pressed against the strip conductor of the measuring table by the lower surface of the holding jig, so that the lead terminal and the strip conductor are stably electrically connected. A measurement can be made. Also, during the measurement, a so-called shielded strip structure is formed in which a lead terminal or a strip conductor is sandwiched between the first and second dielectrics, and these dielectrics are sandwiched between the grounded first and second conductors. So, if you design the impedance of the measuring device based on this structure,
When measuring a high-frequency element, the impedance of the measuring device can be reproduced as designed. That is, since the impedance of the measuring device does not fluctuate due to the holding jig unlike the conventional device, it is possible to accurately measure the electrical characteristics of the high-frequency element. Furthermore, since the high-frequency element is shielded from the outside during the measurement, the influence of external noise can be avoided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a high-frequency device measuring apparatus according to an embodiment of the present invention.

FIG. 2 is a view taken in the direction of arrows AA in FIG. 1;

FIG. 3 is a cross-sectional view showing a configuration of a conventional high-frequency element measuring device.

FIG. 4 is a cross-sectional view showing a configuration of a conventional measuring device for a high-frequency element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Package main body part 2 ... Lead terminal 3 ... High frequency element 10 ... Measuring stand 11, 43 ... Conductor (1st conductor, 2nd conductor) 12, 41 ... Dielectric (1st dielectric, 2nd dielectric) 14 ... Input connector 15… Output connector 16… Strip conductor 17… Grounding pad 40… Holding jig 42… Recess

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 G01R 1/06-1/073 H01L 21/66

Claims (2)

(57) [Claims] 1. A method for measuring an electrical characteristic of a high frequency device of a surface mount type, comprising: a detachable measuring table and a holding jig which interact with each other to form a shielded strip structure; A high-frequency element is placed on a strip conductor formed on the measuring table, and the holding jig is covered so that the strip conductor and a lead terminal of the high-frequency element are in press contact with each other. The measuring table and the holding jig And measuring the electrical characteristics of the high-frequency element with the high-frequency element included therein. 2. A high frequency device measuring apparatus for measuring electrical characteristics of a surface mount type high frequency device, comprising: a first dielectric layered on a grounded first conductor;
A measurement table having a strip conductor on which a lead terminal of the high-frequency element is mounted on a dielectric, and a concave portion including a package body of the high-frequency element mounted on the measurement table, (2) A high-frequency element measuring device, comprising: a holding jig formed by laminating a grounded second conductor on an upper surface of the second dielectric, while being provided on a lower surface of the second dielectric.