JP3226900B2 - IC sorting handler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC selection handler used in an IC characteristic selection step.

[0002]

2. Description of the Related Art As a conventional IC sorting handler, there is an IC chip appearance inspection apparatus described in Japanese Patent Application Laid-Open No. 5-152406. This apparatus has a tray moving system for moving a tray, an appearance inspection section for performing an appearance inspection while being stored in the tray, and a chip separation section for separating non-defective chips and defective chips into separate trays. There is no problem in sensory inspection such as oversight of good chips, and the time required for appearance inspection can be reduced.

Another conventional example is disclosed in Japanese Patent Application Laid-Open No. 2-12 / 1990.
The IC manufacturing tray described in Japanese Patent No. 2645 has a hole at a position corresponding to the IC lead, and performs a test operation without taking out the IC.

[0004]

In the above-mentioned conventional example,
The distance between the measuring unit for measuring the IC and the stage before transferring the IC to the measuring unit is large, and it takes time to move. Therefore, there is a problem that the handler index (the time from the completion of measurement of one IC to the start of measurement of the next IC) is long, which is disadvantageous for mass production.

Accordingly, an object of the present invention is to provide an IC sorting handler that can shorten the handler index and improve productivity in order to solve the above problem.

[0006]

In order to achieve the above object, an IC sorting handler apparatus according to the present invention comprises a plurality of ICs.
In an IC sorting handler for sorting non-defective products and defective products from trays on which C is loaded, a supply tray storage unit for supplying a plurality of trays on which a plurality of ICs are loaded, and a plurality of trays from the supply tray storage unit The first measurement in which
A fixed position and a second measurement position , a first measurement position and
It shows, for each tray that is moved to the second measurement position, first
The measurement means for alternately measuring the IC at the measurement position and the second measurement position, and the trays having completed the measurement of the IC sequentially move, and move to the first measurement position and the second measurement position . A distribution position for distributing non-defective products and non-defective products of a plurality of ICs placed on each tray according to the results measured respectively, and a non-defective product tray and a defective product tray for storing non-defective products and defective products distributed at the distribution positions. And the IC can be sorted while being placed on the tray.

[0007]

[0008] Further, the sheet is placed on the tray at the first measurement position .
A plurality of the IC 1 or not a One measure that, when the measurement of all of the IC ends, the tray of the first measurement position is moved to the sorting position, the tray of the first measurement position is moved to the sorting position It is preferable to start measuring the IC placed on the tray at the second measurement position in the meantime .

[0009] Further, the sheet is placed on each tray from the sorting position.
It is preferable to provide an IC / tray moving arm for transporting the individual ICs to the non- defective product tray and the defective product tray.

It is preferable that the IC / tray moving arm supplies an empty tray when the non-defective tray and the defective tray become full.

Further, the tray is preferably provided with holes corresponding to the leads of the IC.

As described above, the IC sorting handler apparatus of the present invention uses an IC from a tray on which a plurality of ICs are placed.
It has a means that can measure without emitting C. The tray is provided with holes corresponding to the leads of the ICs, and the tray is moved to the first measurement position and the second measurement position while a plurality of ICs are placed on the tray. ICs one by one at the first measurement position
After the measurement of all the ICs at the first measurement position is completed, the tray moves to the distribution position. The measurement at the second measurement position is started while the tray at the first measurement position moves to the distribution position.

[0013]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic plan view showing the configuration of an embodiment of an IC sorting handler according to the present invention. This IC
The sorting handler moves a plurality of trays on which a plurality of ICs are placed from the supply tray storage unit 1 of the handler to the first measurement position 2 and the second measurement position 3 one by one. The trays that have completed the measurement at the first and second measurement positions move to the distribution position 4 and are stored in the non-defective tray 5 and the defective tray 6 by the IC / tray moving arm 7. Thereafter, when the non-defective tray 5 and the defective tray 6 become full, an empty tray is supplied from the empty tray storage unit 8 by the IC / tray moving arm 7.

As described above, the IC selection handler of the present invention has a means for measuring without removing ICs from a tray on which a plurality of ICs are placed. The tray is provided with holes 9 corresponding to the leads of the IC. The tray 9 is moved to the first measurement position 2 and the second measurement position 3 with a plurality of ICs placed on the tray. At the first measurement position 2, ICs are measured one by one, and when measurement of all ICs at the first measurement position is completed,
The tray moves to the sorting position 4. The measurement at the second measurement position is started while the tray at the first measurement position moves to the distribution position 4.

[0016]

Next, the operation of the embodiment of the present invention will be described in detail with reference to the drawings.

First, referring to FIG. 1, a description will be given of a method of measuring the characteristics of an IC according to the present invention. According to the method for measuring characteristics of ICs according to the present invention, a plurality of trays on which a plurality of ICs are placed are set in a supply tray storage unit 1 of a handler, and a first measurement position 2 is set one by one from the supply tray storage unit 1. , Second
To the measurement position 3. At the first measurement position 2, measurement is performed without taking out the IC from the tray. When the measurement of all the ICs at the first measurement position 2 is completed, the IC at the second measurement position 3 is measured. The measurement results at the first and second measurement positions 2 and 3 are stored for each position in each tray. During the measurement at the second measurement position 3, the tray that has completed the measurement at the first measurement position moves to the distribution position 4, and the individual ICs are moved by the IC / tray moving arm 7 based on the stored measurement results. It is stored in the non-defective product tray 5 and the defective product tray 6. The first and second measurement positions 2 and 3 are alternately measured, and the non-measured side moves to the distribution position 4, and the tray is supplied from the supply tray storage unit 1. When the non-defective tray 5 and the defective tray 6 become full, an empty tray is supplied from the empty tray storage unit 8 by the IC / tray moving arm 7.

FIGS. 2 and 3 are a plan view and a sectional view, respectively, showing a tray according to an embodiment of the present invention. FIG. 3 is a sectional view taken along line AA of FIG. As shown in this figure, the tray according to the present invention is different from a tray on which a plurality of ICs are
It has a means that can measure without emitting C. As this means, a hole is provided in the tray in accordance with the leads of the IC, and the tray is moved to the first measurement position 2 and the second measurement position 3 with a plurality of ICs placed on the tray.

[0019]

As described above, in the IC sorting handler of the present invention, ICs are sorted in the tray without being taken out of the tray, so that the moving distance of the measuring terminal can be shortened.

Therefore, the handler index can be shortened, and thereby the effect of improving the productivity in the sorting step can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an IC sorting handler according to the present invention.

FIG. 2 is a plan view showing a tray according to the present invention.

FIG. 3 is a cross-sectional view when FIG. 2 is cut along a line AA.

[Explanation of symbols]

 Reference Signs List 1 supply tray storage section 2 first measurement position 3 second measurement position 4 distribution position 5 good tray 6 defective tray 7 IC / tray moving arm 8 empty tray storage section 9 hole

Claims (5)

(57) [Claims] An IC sorting handler for sorting non-defective products and non-defective products from a tray on which a plurality of ICs are mounted, a supply tray storage unit for supplying the plurality of trays on which the plurality of ICs are mounted, and A first measurement position and a second measurement position in which the plurality of trays are moved one by one from a supply tray storage unit; and a target for each of the trays moved to the first measurement position and the second measurement position. As the first measurement position and the second measurement position.
A measuring means for alternately measuring the IC at the measurement position of 2, and the trays after the measurement of the IC are sequentially moved;
Wherein a distribution position for distributing the molded product is good or defective of the plurality of IC placed on the respective trays by the results they were respectively measured at the first measurement position and the second measurement position, good distributed by the said distribution location A non-defective product tray for storing defective products, and a defective product tray, wherein the IC can be selected while being placed on the tray. 2. A plurality of ICs placed on the tray at the first measurement position are measured one by one, and when measurement of all ICs is completed, the tray at the first measurement position is moved to the distribution position. Go to, characterized in that the first tray of the measurement position to start the measurement of the IC placed on the said tray second measurement position while moving to the distributing position, according to claim 1 IC sorting handler. 3. The individual IC placed on the said trays from the sorting position, characterized by comprising the non-defective tray, IC · tray moving arm for conveying to the defective tray, according to claim 1 or 2 The handler for IC selection described in 1. 4. The IC sorting handler according to claim 3 , wherein said IC / tray moving arm supplies an empty tray when said non-defective tray and defective tray become full. Wherein said tray is characterized in that the holes to match the leads of IC provided, IC sorting handler of any of claims 1-4.