JP3223437U - Electric vehicle control device - Google Patents

Abstract

A compact control device for an electric vehicle that does not impair the cooling performance of a semiconductor device due to heat radiation from a cooling fin. A plurality of semiconductor elements (31) installed on a top surface (21a) facing the inside of a casing (2) with a casing (2) suspended below the floor of the electric vehicle (EC) and a bottom plate (21) located on the track side in the casing (2). The semiconductor device 3 containing the semiconductor device 3 and the heat generated by each semiconductor element 31 installed on the lower surface 21b of the bottom plate 21 facing the outside of the housing 2 of the portion where the semiconductor device 3 is installed are released to the outside of the housing 2. A plurality of cooling fins 4 for cooling the semiconductor device 3 are provided. The cooling fins 4 extend in the vehicle length direction of the electric vehicle EC and are spaced from each other in the vehicle width direction. The part where the apparatus 3 and all the cooling fins 4 are installed is recessed above the other part to provide a recess 21c, and all the cooling fins 4 are accommodated in the recess 21c. [Selection] Figure 1

Description

  The present invention relates to an electric vehicle control device equipped in an electric vehicle traveling on a track.

  Conventionally, as a control device for this type of electric vehicle, a plurality of semiconductors installed on a housing suspended under the floor of the electric vehicle and an upper surface facing the inside of the housing of the bottom plate located on the track side in this housing A plurality of semiconductor devices having a built-in element and a bottom plate of the bottom plate of the part where the semiconductor device is installed facing the outside of the housing. A cooling fin is provided, and each cooling fin is known to extend in the vehicle length direction of the electric vehicle and to be arranged at intervals in the vehicle width direction (see, for example, Patent Document 1).

  However, in this case, since the cooling fin protrudes from the bottom plate of the housing to the track side, the protrusion of the cooling fin to the track side contributes to an increase in the size of the electric vehicle control device.

JP 2017-52385 A

  In view of the above points, an object of the present invention is to provide a small electric vehicle control device that does not impair the cooling performance of a semiconductor device by heat radiation from a cooling fin.

  In order to solve the above-described problems, the present invention provides a control device for an electric vehicle equipped in an electric vehicle that travels on a track, and includes a housing suspended under the floor of the electric vehicle, Installed on the upper surface facing the inside of the casing of the bottom plate located in the semiconductor device containing a plurality of semiconductor elements, and installed on the lower surface facing the outside of the casing of the bottom plate of the portion where the semiconductor device is installed, And a plurality of cooling fins that cool the semiconductor device by releasing heat generated from the semiconductor element to the outside of the housing, and each cooling fin extends in the vehicle length direction of the electric vehicle and is arranged at intervals in the vehicle width direction. In this case, the bottom plate is provided with a recess in which a portion where the semiconductor device and all the cooling fins are installed is recessed above the other portion, and all the cooling fins are accommodated in the recess. It is characterized by being.

  According to the present invention, since all the cooling fins are stored in the recesses provided in the bottom plate of the portion where the semiconductor device is installed in the housing, all the cooling fins are on the track side in the portions other than the recesses of the bottom plate. Does not protrude. Therefore, since the lowermost part of the electric vehicle control device is the bottom surface of the bottom plate of the housing excluding the recess, the electric vehicle control device is small. In addition, even if all the cooling fins are housed in the recesses, a part of the traveling wind generated when the electric vehicle travels circulates inside and outside the recesses. The semiconductor device can be discharged to the outside, and the semiconductor device can be cooled as before.

The side view which shows one Embodiment of the control apparatus for electric vehicles of this invention. AA principal part sectional drawing of the control apparatus for electric vehicles shown in FIG.

  With reference to FIG.1 and FIG.2, the control apparatus 1 for electric vehicles of this embodiment is equipped with the electric vehicle EC which drive | works a track | orbit. The electric vehicle control device 1 includes a housing 2 suspended under the floor of the electric vehicle EC, a semiconductor device 3 incorporating a plurality of semiconductor elements 31, and a plurality of rectangular fin-shaped cooling fins 4. . The housing 2 is made of metal, and in the space inside the housing 2, various electric devices ED such as a transformer are stored in addition to the semiconductor device 3. The semiconductor device 3 is installed on an upper surface 21 a facing the inside of the housing 2 with a bottom plate 21 positioned on the track side in the housing 2. Examples of the semiconductor device 3 include a converter that converts AC power into DC power, an inverter that converts DC power into AC power for driving a motor, and the like. The semiconductor element 31 is configured by a switching element such as an IGBT, for example. The

  The plurality of cooling fins 4 cools the semiconductor device 3 by discharging heat generated from the semiconductor element 31 to the outside of the housing 2 when the electric vehicle EC travels. The semiconductor device 3 is installed in the housing 2. The bottom plate 21 of the part is installed on the lower surface 21 b facing the outside of the housing 2. The cooling fins 4 extend in the vehicle length direction of the electric vehicle EC and are arranged at intervals in the vehicle width direction. Each cooling fin 4 is made of a metal having a high thermal conductivity. All the cooling fins 4 are accommodated in the recesses 21 c provided on the bottom plate 21 of the housing 2.

  The recess 21 c is provided in the housing 2 such that the portion of the bottom plate 21 where the semiconductor device 3 and all the cooling fins 4 are installed is recessed above the other portions. A plurality of hanging tools 22 are fixed to the upper end portion of the housing 2. The housing 2 is suspended under the floor of the electric vehicle EC by fastening the top of the suspension 22 to the lower surface F facing the track side of the floor of the electric vehicle EC.

  When the electric vehicle EC travels, all the semiconductor elements 31 that operate in the semiconductor device 3 generate heat. The heat is conducted from the semiconductor device 3 to the cooling fin 4 through the bottom plate 21 of the housing 2. At the same time, the traveling wind generated as the electric vehicle EC travels flows from the front end toward the rear end in the traveling direction of the electric vehicle EC. In the electric vehicle control device 1, part of the traveling wind flows along the lower surface 21 b of the bottom plate 21 of the housing 2. Another part of the traveling wind flowing as described above flows into the recess 21c and then flows out of the recess 21c. When the traveling wind that has flowed into the recess 21c flows between the cooling fins 4 and the like, it takes heat from the cooling fins 4 and flows out of the recess 21c. Therefore, when the traveling wind flows inside and outside the recess 21c, the heat generated by each semiconductor element 31 of the semiconductor device 3 can be released to the outside of the housing 2, and as a result, the semiconductor device 3 is cooled. For this reason, the control apparatus 1 for electric vehicles has the same cooling performance of the semiconductor device 3 as before.

  In the electric vehicle control device 1, as described above, since all the cooling fins 4 are housed in the recesses 21 c provided in the bottom plate 21 of the portion of the housing 2 where the semiconductor device 3 is installed, The cooling fins 4 of the bottom plate 21 do not protrude to the track side at portions other than the recesses 21c. Therefore, the lowermost part of the electric vehicle control device 1 is the lower surface 21b of the bottom plate 21 of the housing 2 excluding the recess 21c, and thus the electric vehicle control device 1 is small.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, a heat receiving plate that conducts heat generated by the semiconductor element 31 to the cooling fins 4 as much as possible can be provided on the upper surface 21 a of the bottom plate 21 of the housing 2 where the semiconductor device 3 is installed. Further, the shape of the housing 2 and the recess 21c, the material constituting the housing 2, the size and shape of the semiconductor device 3, the type of the semiconductor element 31, the shape and material of the cooling fin 4, etc. are not particularly limited.

  DESCRIPTION OF SYMBOLS 1 ... Electric vehicle control apparatus, 2 ... Housing | casing, 21 ... Bottom plate, 21a ... Upper surface, 21b ... Lower surface, 21c ... Recessed part, 3 ... Semiconductor device, 31 ... Semiconductor element, 4 ... Cooling fin, EC ... Electric vehicle.

Claims (1)

An electric vehicle control device installed in an electric vehicle traveling on a track,
A housing suspended under the floor of an electric vehicle, a semiconductor device having a plurality of semiconductor elements installed on the upper surface facing the inside of the housing of the bottom plate located on the track side in the housing, and the semiconductor device A plurality of cooling fins installed on the bottom surface of the bottom plate of the installed part facing the outside of the housing to discharge the heat generated by each semiconductor element to the outside of the housing and cool the semiconductor device. In what is arranged in the vehicle length direction of the vehicle and spaced in the vehicle width direction,
The bottom plate is characterized in that a portion where the semiconductor device and all the cooling fins are installed is recessed above the other portion to provide a recess, and all the cooling fins are accommodated in the recess. A control device for an electric vehicle.

Images