JP3216471U - Light emitting diode package structure with at least two cup parts and high heat dissipation performance to emit light from the side - Google Patents
Light emitting diode package structure with at least two cup parts and high heat dissipation performance to emit light from the side Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 230000004308 accommodation Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 230000000191 radiation effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
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- 150000002739 metals Chemical class 0.000 description 1
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Abstract
【課題】高輝度で複数波長光源の出力を実現するために、少なくとも２つのカップ部を備え、側面から出光する放熱性能が高い発光ダイオードのパッケージ構造を提案する。【解決手段】少なくとも２つのカップ部１０と、複合材料ホルダ２０とを含み、複合材料ホルダは、第１の表面２１と、第１の表面と隣り合う第２の表面２２及び第３の表面２３と、第１の表面に対向する第４の表面２４とを備え、少なくとも２つのカップ部が第１の表面に設置され、第２の表面には、カップ部と同じ数量の極性が異なる第１の金属板３０と第２の金属板３１が設置され、第１の金属板と第２の金属板との一端は、それぞれ複合材料ホルダを通ってカップ部内まで延在して２つの電極接点３２を形成し、第１の金属板の他端は、それぞれ第４の表面まで延在して、露出する放熱構造を形成する。側面から出光し、且つ第１の金属板が熱を直接且つ効率よく発光ダイオード素子４０の外側まで伝達して放熱效果を高める。【選択図】図１In order to realize the output of a multi-wavelength light source with high luminance, a package structure of a light emitting diode having at least two cup portions and having high heat dissipation performance for emitting light from a side surface is proposed. A composite material holder includes at least two cup portions and a composite material holder. The composite material holder includes a first surface, a second surface and a third surface adjacent to the first surface. And a fourth surface 24 facing the first surface, wherein at least two cup portions are installed on the first surface, and the second surface has first and different polarities of the same number as the cup portion. The metal plate 30 and the second metal plate 31 are installed, and one end of each of the first metal plate and the second metal plate extends through the composite material holder to the inside of the cup portion, and two electrode contacts 32 are provided. The other end of the first metal plate extends to the fourth surface to form an exposed heat dissipation structure. The light is emitted from the side surface, and the first metal plate directly and efficiently transfers heat to the outside of the light emitting diode element 40 to enhance the heat radiation effect. [Selection] Figure 1
Description
本考案は、発光ダイオードのパッケージ構造に関し、詳しく言えば、少なくとも２つのカップ部を備え、側面から出光する発光ダイオードのパッケージ構造に関するものである。 The present invention relates to a light emitting diode package structure, and more particularly, to a light emitting diode package structure having at least two cup portions and emitting light from a side surface.
発光ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ、ＬＥＤ）は、冷光源発光素子であり、その発光原理は、ＩＩＩ−Ｖ族化合物の半導体材料に順方向バイアス（電流）を印加してダイオード内の電子と正孔を互いに結合させることで、エネルギーを光の形式に変換し、これに伴ってエネルギーが放出されて発光することである。発光ダイオードには、体積が小さく、耐用年数が長く、駆動電圧が低く、応答が速く、耐震性能に優れており、各種デバイスにおける軽量、薄型及び小型化の要件に対応可能であるという利点があるため、日常生活の中で幅広く利用されている。 A light emitting diode (LED) is a cold light source light emitting element, and its light emission principle is that a forward bias (current) is applied to a semiconductor material of a III-V compound to generate electrons and holes in the diode. By being coupled to each other, energy is converted into a light form, and energy is emitted along with this to emit light. Light-emitting diodes have the advantages of small volume, long service life, low drive voltage, fast response, excellent seismic performance, and can meet the requirements of light weight, thinness and miniaturization in various devices. Therefore, it is widely used in daily life.
屋外の看板、ブレーキランプ、交通信号機などが長時間にわたって高輝度で作動すると、高温の環境となり、そしてこの高温の環境に置かれる発光ダイオード素子の材料寿命が顕著に短縮されてしまうという問題点があり、そのため、発光ダイオード素子をパッケージする際は、発光ダイオード素子の耐用年数を延ばすために、どのようにすれば熱を速く引き出せるのかは考えなくてはならないことである。 When outdoor signs, brake lamps, traffic lights, etc. operate with high brightness for a long time, it becomes a high temperature environment, and the material life of the light emitting diode element placed in this high temperature environment is remarkably shortened. Therefore, when packaging a light emitting diode element, it is necessary to consider how heat can be extracted quickly in order to extend the service life of the light emitting diode element.
例えば、台湾特許登録第Ｉ４３８９４８号明細書は、発光ダイオードのパッケージ構造を開示しており、詳しくは、発光ダイオードの正極及び負極が、それぞれワイヤボンディングにより電気接続部と電気的に接続され、前記電気接続部が基板に溶接されており、さらに、放熱要件を満たすために前記２つの電気接続部にそれぞれ放熱部（放熱フィン）を設置し、放熱フィンの高速熱伝導により放熱效果を高めるものである。 For example, Taiwan Patent Registration No. I438948 discloses a package structure of a light emitting diode. Specifically, a positive electrode and a negative electrode of a light emitting diode are electrically connected to an electrical connection part by wire bonding, respectively. The connection part is welded to the board, and in order to satisfy the heat dissipation requirement, a heat dissipation part (radiation fin) is installed in each of the two electrical connection parts, and the heat dissipation effect is enhanced by the high-speed heat conduction of the heat dissipation fin. .
しかしながら、このような従来技術において、放熱要件を満たすためには、かなりのスペースを占める放熱フィンを使用しなくてはならず、これによって放熱の目的は達成されたものの、放熱フィンを設置することで、発光ダイオードを緊密に並べることができなくなり、単位面積あたりのルーメンが、車両のライト、プロジェクタなど高い輝度が求められるデバイスに対応できなくなり、また、複数波長光源の出力を実現するために、出力波長が異なる複数の発光ダイオードを単一の発光ダイオード素子に集約することも難しくなる。 However, in such a conventional technology, in order to satisfy the heat dissipation requirement, it is necessary to use a heat dissipation fin that occupies a considerable space, and although the purpose of heat dissipation has been achieved by this, it is necessary to install the heat dissipation fin. In order to realize the output of multiple wavelength light sources, the light emitting diodes cannot be arranged closely, the lumen per unit area can not be compatible with devices that require high brightness such as vehicle lights, projectors, etc. It is also difficult to combine a plurality of light emitting diodes having different output wavelengths into a single light emitting diode element.
これに鑑み、本考案は、高輝度で複数波長光源の出力を実現するために、少なくとも２つのカップ部を備え、側面から出光する放熱性能が高い発光ダイオードのパッケージ構造を提案することを主な目的とする。 In view of this, the present invention mainly proposes a package structure of a light-emitting diode that has at least two cup portions and has high heat dissipation performance that emits light from a side surface in order to realize output of a multi-wavelength light source with high luminance. Objective.
本考案は、少なくとも２つのカップ部を備え、側面から出光する放熱性能が高い発光ダイオードのパッケージ構造であり、少なくとも２つのカップ部と、複合材料ホルダとを含む。前記複合材料ホルダは、第１の表面と、前記第１の表面と隣り合う第２の表面と、前記第１の表面と隣り合う第３の表面と、前記第１の表面に対向する第４の表面とを備え、前記少なくとも２つのカップ部は共に上方から縮径する収容空間を備え、且つ前記少なくとも２つのカップ部は前記第１の表面に設置されており、前記第２の表面は、前記カップ部と同じ数量の極性が異なる少なくとも２つの第１の金属板と、少なくとも２つの第２の金属板とを備え、前記少なくとも２つの第１の金属板と前記少なくとも２つの第２の金属板との一端は、それぞれ前記複合材料ホルダを通って対応する前記カップ部の前記収容空間内まで延在して２つの電極接点を形成し、前記少なくとも２つの第１の金属板の他端は、それぞれ前記第４の表面まで延在して、露出する放熱構造を形成する。 The present invention is a light emitting diode package structure that includes at least two cup portions and emits light from a side surface and has high heat dissipation performance, and includes at least two cup portions and a composite material holder. The composite material holder includes a first surface, a second surface adjacent to the first surface, a third surface adjacent to the first surface, and a fourth surface facing the first surface. The at least two cup portions each have an accommodation space whose diameter is reduced from above, and the at least two cup portions are installed on the first surface, and the second surface is The at least two first metal plates and the at least two second metal plates having the same number of polarities as the cup portion are different, the at least two first metal plates and the at least two second metals. One end of each of the plates extends through the composite material holder into the corresponding accommodating space of the cup portion to form two electrode contacts, and the other ends of the at least two first metal plates are Each extending to the fourth surface And to form a heat dissipation structure exposed.
以上から分かるように、本考案では前記少なくとも２つの第１の金属板が一体的に成形されており、すなわち、前記電極接点と前記露出する放熱構造とが一体的となるため、前記少なくとも２つの第１の金属板は、電極及び放熱構造の両方として使用することができ、そのため、発光ダイオード素子の内部の熱が、前記少なくとも２つの第１の金属板を介して、直接且つ効率よく発光ダイオード素子の外側まで伝達されることが可能となり、そして空気の対流により放熱を行うことで、放熱效果を高めることができる。また、本考案の構造がコンパクトで、スペースをあまり使用しないため、前記少なくとも２つのカップ部を並列して配置することができ、且つ側面から出光することが可能であるため、過度の高温になるおそれがなく、高輝度で複数波長光源の出力というニーズを満たすことができる。 As can be seen from the above, in the present invention, the at least two first metal plates are integrally formed, that is, the electrode contact and the exposed heat dissipating structure are integrated. The first metal plate can be used as both an electrode and a heat dissipation structure, so that the heat inside the light emitting diode element is directly and efficiently transmitted through the at least two first metal plates. The heat can be transmitted to the outside of the element, and the heat radiation effect can be enhanced by performing heat radiation by air convection. In addition, since the structure of the present invention is compact and does not use much space, the at least two cup portions can be arranged in parallel and can emit light from the side surface, resulting in an excessively high temperature. There is no fear, and it is possible to meet the needs of high-luminance and output of a multi-wavelength light source.
１、第１の金属板は、電極及び放熱構造の両方として使用することができるため、発光ダイオード素子の内部の熱が、直接且つ効率よく発光ダイオード素子の外側まで伝達されることが可能となり、そして空気の対流により放熱を行うことで、放熱效果を高めることができる。
２、本考案の構造がコンパクトで、スペースをあまり使用しないため、少なくとも２つのカップ部を並列して配置することができ、且つ側面から出光することが可能であるため、過度の高温になるおそれがなく、高輝度で複数波長光源の出力というニーズを満たすことができる。
３、第１の金属板をさらに第３の表面まで延在させることで、露出する放熱構造の面積を増加して、放熱效果をさらに高めることができ、発光ダイオードの比較的温度が高い電極と接続される場合、外側に設置された放熱構造により、空気の対流を利用して放熱を行うことで、放熱效率をさらに高めることができる。
1. Since the first metal plate can be used as both an electrode and a heat dissipation structure, the heat inside the light emitting diode element can be directly and efficiently transferred to the outside of the light emitting diode element. The heat dissipation effect can be enhanced by performing heat dissipation by air convection.
2. Since the structure of the present invention is compact and does not use much space, at least two cup parts can be arranged in parallel, and light can be emitted from the side surface, which may result in excessively high temperatures. Therefore, it is possible to satisfy the need for high-intensity, multi-wavelength light source output.
3. By extending the first metal plate further to the third surface, the area of the exposed heat dissipating structure can be increased, and the heat dissipating effect can be further enhanced. In the case of connection, the heat dissipation efficiency can be further enhanced by performing heat dissipation using air convection by the heat dissipation structure installed on the outside.
本考案の特徴、目的及び機能に対する理解を深めるために、以下では、図面を参照しながら好ましい実施例を示して説明する。 In order to better understand the features, objects, and functions of the present invention, a preferred embodiment will be described below with reference to the drawings.
図１＝本考案の構造図、図２＝別の角度からみた本考案の部分構造図、図３＝本考案の使用状態概略図に示すように、本考案は、少なくとも２つのカップ部を備え、側面から出光する発光ダイオードのパッケージ構造であり、ボンディングパッド６１により回路基板６０に電気的に接合されており、当該パッケージ構造は、少なくとも２つのカップ部１０と、複合材料ホルダ２０とを含み、このうち、少なくとも２つのカップ部１０は、共に上方から縮径する収容空間１１を備える。 FIG. 1 = structure diagram of the present invention, FIG. 2 = partial structure diagram of the present invention viewed from another angle, and FIG. 3 = use state schematic diagram of the present invention, the present invention comprises at least two cup parts. A package structure of a light emitting diode that emits light from a side surface, and is electrically bonded to the circuit board 60 by a bonding pad 61, and the package structure includes at least two cup portions 10 and a composite material holder 20. Among these, at least two cup portions 10 are each provided with an accommodation space 11 whose diameter is reduced from above.
また、図４に示すように、少なくとも２つのカップ部１０を、横方向に並列して配置することができ、少なくとも２つのカップ部１０の数量は、ニーズに応じて設定することができるが、２つ設置するのが最も好ましく（図３参照）、３つでもよい（図４参照）。なお、より多くの数量で実施してもよく、これらに限定されるものではない。 Also, as shown in FIG. 4, at least two cup portions 10 can be arranged in parallel in the lateral direction, and the quantity of at least two cup portions 10 can be set according to needs, It is most preferable to install two (see FIG. 3), or three (see FIG. 4). In addition, you may implement by a larger quantity, It is not limited to these.
また、図１及び図２に示すように、複合材料ホルダ２０は、第１の表面２１と、第１の表面２１と隣り合う第２の表面２２と、第１の表面２１と隣り合う第３の表面２３と、第１の表面２１に対向する第４の表面２４とを備え、少なくとも２つのカップ部１０は、第１の表面２１に設置されており、第２の表面２２は、カップ部１０と同じ数量の極性が異なる少なくとも２つの第１の金属板３０と、少なくとも２つの第２の金属板３１とを備え、第２の表面２２の少なくとも２つの第１の金属板３０と少なくとも２つの第２の金属板３１とがそれぞれ回路基板６０に溶接されている（図３参照）。 As shown in FIGS. 1 and 2, the composite material holder 20 includes a first surface 21, a second surface 22 adjacent to the first surface 21, and a third surface adjacent to the first surface 21. The surface 23 and the fourth surface 24 opposite to the first surface 21, at least two cup parts 10 are installed on the first surface 21, and the second surface 22 is a cup part 10 and at least two first metal plates 30 having at least two different polarities and at least two second metal plates 31, and at least two first metal plates 30 and at least two on the second surface 22. Two second metal plates 31 are welded to the circuit board 60, respectively (see FIG. 3).
少なくとも２つの第１の金属板３０と少なくとも２つの第２の金属板３１との一端はそれぞれ複合材料ホルダ２０を通って対応するカップ部１０の収容空間１１内まで延在して２つの電極接点３２を形成し、収容空間１１には、２つの電極接点３２と電気的に接続される発光ダイオード４０が設置されるとともに、発光ダイオード４０を密封するパッケージ材料５０が充填されており、実際に実施する際に、発光ダイオード４０の１つの電極を、第１の金属板３０の電極接点３２に直接設置し、他の電極をワイヤボンディングにより（不図示）第２の金属板３１の電極接点３２と電気的に接続するようにしてもよく、すなわち、第１の金属板３０の電極接点３２と第２の金属板３１の電極接点３２とを、それぞれ発光ダイオード４０の２つの電極として使用する。 One end of each of the at least two first metal plates 30 and the at least two second metal plates 31 extends into the accommodating space 11 of the corresponding cup portion 10 through the composite material holder 20 and has two electrode contacts. 32, and the accommodation space 11 is provided with a light emitting diode 40 electrically connected to the two electrode contacts 32 and filled with a package material 50 for sealing the light emitting diode 40, and is actually implemented. In this case, one electrode of the light emitting diode 40 is directly installed on the electrode contact 32 of the first metal plate 30, and the other electrode is connected to the electrode contact 32 of the second metal plate 31 by wire bonding (not shown). The electrode contacts 32 of the first metal plate 30 and the electrode contacts 32 of the second metal plate 31 may be connected to the two light emitting diodes 40 respectively. To use as poles.
また、図５に示すように、収容空間１１は、開口１１１を備え、開口１１１の形状が、多角形、円形、楕円形及びこれらの組み合わせからなる群から選択されているが、無端の幾何学的形状であればよい。図５では、その他可能な形状も示しているが、これらに限定されるものではなく、実際に実施する際は、光学構造に基づき設計してもよい。 Further, as shown in FIG. 5, the accommodation space 11 includes an opening 111, and the shape of the opening 111 is selected from the group consisting of a polygon, a circle, an ellipse, and a combination thereof. Any shape can be used. Although other possible shapes are shown in FIG. 5, the present invention is not limited to these shapes, and may be designed based on the optical structure when actually implemented.
また、図１及び図２に示すように、少なくとも２つの第１の金属板３０の他端はそれぞれ第４の表面２４まで延在して、露出する放熱構造３３を形成する。なお、少なくとも２つの第１の金属板３０が第３の表面２３まで延在して、露出する放熱構造３３を形成してもよいため、第１の金属板３０には、より大きな面積の露出する放熱構造３３を備えることが可能となり、これによって、発光ダイオード４０の放熱效率を高めることができる。 As shown in FIGS. 1 and 2, the other ends of the at least two first metal plates 30 each extend to the fourth surface 24 to form an exposed heat dissipation structure 33. Since at least two first metal plates 30 may extend to the third surface 23 to form an exposed heat dissipation structure 33, the first metal plate 30 has a larger area exposed. Therefore, it is possible to provide a heat dissipation structure 33 that increases the heat dissipation efficiency of the light emitting diode 40.
本考案では、第１の金属板３０を発光ダイオード４０の発熱する電極と電気的に接続することで、第１の金属板３０の露出する放熱構造３３により放熱效率を高めることができる。 In the present invention, the first metal plate 30 is electrically connected to the heat-generating electrode of the light emitting diode 40, so that the heat dissipation efficiency can be enhanced by the heat dissipation structure 33 exposed from the first metal plate 30.
なお、図６に示すように、本考案の少なくとも２つのカップ部１０における収容空間１１は、それらの形状が同一でも異なってもよいため、様々な組み合わせが可能であり、例えば、直線の形態、円弧の形態、または直線と円弧との組み合わせの形態である。また、異なる高さ、幅、勾配（直線）と曲率（円弧）などを備えて組み合わせることで、様々な反射效果を実現することができるため、使用時の要件に応じて設計することも可能である。図６では、可能な組み合わせとして複数挙げているが、実際に実施する際はこれらに限定されない。 In addition, as shown in FIG. 6, since the accommodation space 11 in the at least two cup portions 10 of the present invention may have the same shape or different shapes, various combinations are possible. It is a form of an arc or a combination of a straight line and an arc. In addition, various reflection effects can be realized by combining different heights, widths, gradients (straight lines) and curvatures (arcs), etc., so it can be designed according to the requirements during use. is there. In FIG. 6, a plurality of possible combinations are listed, but the actual implementation is not limited to these.
１０：カップ部
１１：収容空間
１１１：開口
２０：複合材料ホルダ
２１：第１の表面
２２：第２の表面
２３：第３の表面
２４：第４の表面
３０：第１の金属板
３１：第２の金属板
３２：電極接点
３３：露出する放熱構造
４０：発光ダイオード
５０：パッケージ材料
６０：回路基板
６１：ボンディングパッド
10: cup part 11: accommodation space 111: opening 20: composite material holder 21: first surface 22: second surface 23: third surface 24: fourth surface 30: first metal plate 31: first 2 metal plate 32: electrode contact 33: exposed heat dissipation structure 40: light emitting diode 50: package material 60: circuit board 61: bonding pad
Claims (8)
上方から縮径する収容空間を備える少なくとも２つのカップ部と、
第１の表面と、前記第１の表面と隣り合う第２の表面と、前記第１の表面と隣り合う第３の表面と、前記第１の表面に対向する第４の表面とを備える複合材料ホルダとを含み、
前記少なくとも２つのカップ部が前記第１の表面に設置されており、前記第２の表面は、前記カップ部と同じ数量の極性が異なる少なくとも２つの第１の金属板と少なくとも２つの第２の金属板とを備え、前記少なくとも２つの第１の金属板と前記少なくとも２つの第２の金属板との一端は、それぞれ前記複合材料ホルダを通って前記収容空間内まで延在して２つの電極接点を形成し、前記少なくとも２つの第１の金属板の他端は、それぞれ前記第４の表面まで延在して、露出する放熱構造を形成する、ことを特徴とする少なくとも２つのカップ部を備え、側面から出光する放熱性能が高い発光ダイオードのパッケージ構造。 A package structure of a light emitting diode having at least two cup portions and having high heat dissipation performance of emitting light from a side surface,
At least two cup portions each having an accommodation space whose diameter is reduced from above;
A composite comprising a first surface, a second surface adjacent to the first surface, a third surface adjacent to the first surface, and a fourth surface facing the first surface. A material holder,
The at least two cup portions are disposed on the first surface, and the second surface has at least two first metal plates and at least two second second plates having the same number of polarities as the cup portion. One end of each of the at least two first metal plates and the at least two second metal plates extending through the composite material holder into the accommodating space, and two electrodes. Forming at least one cup portion, wherein the other end of each of the at least two first metal plates extends to the fourth surface to form an exposed heat dissipating structure. Equipped with a light emitting diode package structure that emits light from the side and has high heat dissipation performance.
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| JP2018001012U JP3216471U (en) | 2018-03-20 | 2018-03-20 | Light emitting diode package structure with at least two cup parts and high heat dissipation performance to emit light from the side |
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| JP2018001012U JP3216471U (en) | 2018-03-20 | 2018-03-20 | Light emitting diode package structure with at least two cup parts and high heat dissipation performance to emit light from the side |
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| JP3216471U true JP3216471U (en) | 2018-05-31 |
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